A polishing pad and its preparation method and application

By using a multi-layered polishing pad, covalent bonding of polyurethane prepolymer and composite nanospheres, and thermal management of composite phase change materials, the problems of easy abrasive shedding and difficult thermal management are solved, achieving high stability and efficient thermal management to meet the polishing requirements of advanced processes.

CN121870630BActive Publication Date: 2026-05-29SHENZHEN XINDEPU TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHENZHEN XINDEPU TECH CO LTD
Filing Date
2026-03-19
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

Existing polishing pads have several drawbacks in advanced processes, including easy abrasive shedding leading to wafer scratches, inability to meet the requirements of low-pressure, low-damage polishing, rapid attenuation of polishing rate, difficulty in controlling the synergistic effect of abrasive and polishing fluid, and serious environmental pollution.

Method used

The polishing pad employs a multi-layer structure, including a base layer and a polishing layer. The polishing layer is composed of polyurethane prepolymer, curing agent, and composite nanospheres, which are covalently bonded. The second polishing layer contains a composite phase change material, forming a three-dimensional cross-linked network to enhance interfacial bonding and achieve efficient thermal management through the phase change material.

Benefits of technology

It significantly improves the structural stability and durability of polishing pads, enhances polishing consistency and thermal management capabilities, reduces environmental pollution, and meets the high cleanliness and high reliability requirements of advanced processes.

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Abstract

The application discloses a polishing pad and a preparation method and application thereof, and relates to the technical field of polishing. The polishing pad comprises a substrate layer and a polishing layer arranged in sequence from bottom to top, the polishing layer comprises a first polishing layer adjacent to the substrate layer and a second polishing layer stacked on the first polishing layer, the material of the first polishing layer comprises polyurethane prepolymer, a curing agent and composite nanospheres, the composite nanospheres are formed by covalent bonding of porous coordination polymers and multifunctional hybrid molecules; the material of the second polishing layer comprises polyurethane prepolymer, a curing agent and a composite phase change material, the composite phase change material comprises a core and a shell layer covering the core, the material of the core comprises a phase change material, and the material of the shell layer comprises inorganic nonmetal. The layered structure realizes chemical bonding between two regions, has no interface peeling risk, and meets the stability requirement of a high-reliability polishing pad.
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