Miniaturized compact-layout multiband phased-array antenna

Abstract

The invention, which belongs to the technical field of the antenna, discloses a miniaturized compact-layout multiband phased-array antenna comprising an array surface assembly, a TR assembly, an antenna interface unit, a beam control module and a power supply module which are connected in sequence. The array surface assembly comprises a multi-band array surface and is used for receiving and transmitting multi-band electromagnetic waves; the TR assembly comprises multi-band TRs which are in one-to-one correspondence with the multi-band array planes. Fuzz buttons KK are arranged between the multiband TR and the multiband array plane to realize electrical intercommunication; the antenna interface unit is used for processing and outputting a radio frequency signal; the beam control module is used for controlling radio waves; and the power supply module is used for realizing switching of external power supply and distribution and control of internal power resources. According to the miniaturized multi-band phased-array antenna with the compact layout, the anti-interference capability and the adaptability to various severe environments of the antenna can be effectively improved, and meanwhile, the miniaturization and the light weight of the phased-array antenna are ensured.

Description

Technical Field

[0001] This invention belongs to the field of antenna technology. Specifically, it relates to a miniaturized, compact multi-band phased array antenna. Background Technology

[0002] As user demands continue to increase, radar antennas are evolving towards high power, miniaturization, multi-band operation, and multi-polarization. Miniaturized, multi-band radar antennas offer numerous advantages. In wireless communication and electronic warfare, there is often a need for multi-band collaborative operation. High and low frequency bands can work separately, with high-frequency bands offering high detection accuracy and facilitating sophisticated image processing, while low-frequency signals have longer wavelengths, propagate further, have stronger penetration, and better diffraction capabilities, making them more suitable for long-range search and detection. Combining high- and low-frequency phased array antennas can leverage their respective strengths and compensate for their weaknesses, further enhancing the antenna's anti-interference capabilities and adaptability to various harsh environments.

[0003] Existing antennas can only transmit and receive one type of electromagnetic wave, and cannot transmit and receive high and low frequency bands simultaneously. They have weak anti-interference capabilities and are not adaptable to various harsh environments. Summary of the Invention

[0004] The purpose of this invention is to address the aforementioned shortcomings by providing a miniaturized and compact multi-band phased array antenna that effectively improves the antenna's anti-interference capability and adaptability to various harsh environments, while ensuring the miniaturization and lightweight design of the phased array antenna. To achieve the above objective, this invention provides the following technical solution: A miniaturized, compact multi-band phased array antenna includes an array surface assembly, a TR assembly, an antenna interface unit, a beam control module, and a power supply module connected in sequence. The array surface assembly includes a multi-band array for receiving and transmitting multi-band electromagnetic waves. The TR assembly includes multi-band TRs, each corresponding to one of the multi-band array surfaces. Electrical interconnection is achieved between the multi-band TRs and the multi-band array surfaces via a button. The antenna interface unit is used for processing and outputting radio frequency signals. The beam control module is used for controlling radio waves. The power supply module is used for switching to external power supply and distributing and controlling internal power resources.

[0005] Furthermore, the multi-band array includes a C-band array, a K-band array, a Ku-band array, and a metal substrate; the C-band array, the K-band array, and the Ku-band array are all multi-layered printed circuit board microstrip antennas with radiating metal patterns on their surfaces, and are soldered into the metal substrate.

[0006] Furthermore, the multi-band TR includes a C-band TR, a Ku-band TR, a K-band TR, and a pressure plate; the C-band TR is electrically interconnected with the C-band array via the button KK and the pressure plate; the Ku-band TR is electrically interconnected with the Ku-band array via the button KK and the pressure plate; and the K-band TR is electrically interconnected with the K-band array via the button KK and the pressure plate.

[0007] Furthermore, both ends of the bobby button KK are provided with bobby button contact pins; the bobby button contact pins are elastic contact pins.

[0008] Furthermore, the C-band TR, the Ku-band TR, and the K-band TR each include a TR printed circuit board, a TR module, a low-frequency connector, and a radio frequency connector; the TR module is soldered onto the TR printed circuit board; the low-frequency connector is connected to the TR printed circuit board for power supply and control; and the radio frequency connector is connected to the TR printed circuit board for conducting radio frequency signals.

[0009] Furthermore, a liquid cooling frame is connected below the TR printed circuit board; the liquid cooling frame has a first S-shaped flow channel inside for circulating coolant; the antenna interface unit and the beam control module are sequentially installed inside the liquid cooling frame; one side of the liquid cooling frame contacts the TR printed circuit board for heat dissipation, and the other side contacts the antenna interface unit for heat dissipation.

[0010] Furthermore, the antenna interface unit is provided with a low-frequency connector and a radio frequency connector, which are connected to the low-frequency connector and radio frequency connector on the TR printed circuit board.

[0011] Furthermore, the beam control module is equipped with a low-frequency connector and a radio frequency connector, which are connected to the low-frequency connector and radio frequency connector on the antenna interface unit.

[0012] Furthermore, the power module is provided with two unidirectional second S-shaped flow channels; one end of each of the two second S-shaped flow channels is provided with a radial liquid cooling connector, which is connected to both ends of the first S-shaped flow channel respectively; the other end of the two second S-shaped flow channels is an external liquid cooling connector to realize the input and output of coolant; the power module is provided with a plug-in low-frequency connector, which is plugged into and interconnected with the low-frequency connector on the beam control module; the power module is provided with an external connector.

[0013] Furthermore, the power module, the beam control module, the antenna interface unit, and the liquid cooling frame are fixed to the array assembly by a number of long rod screws.

[0014] The beneficial effects of this invention are: By integrating multiple radiating arrays of different frequency bands onto a single antenna, common-plane transmission and reception can be achieved, increasing the antenna's ability to adapt to complex environments.

[0015] By using the KK button, direct contact with the feed points of the array and TR components is achieved, reducing the use of SMP, shortening the interconnect height, and reducing the weight of structural components.

[0016] By using radial liquid cooling connectors, the two second S-shaped flow channels inside the power module are connected to the first S-shaped flow channel inside the liquid cooling frame to form a complete closed double-layer flow channel. The staggered layout of the main heat-generating components can achieve the discharge of high heat flow inside the antenna. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the phased array antenna of the present invention; Figure 2 This is a schematic diagram of the phased array antenna of the present invention being exploded; Figure 3 This is a schematic diagram of the KK button structure of the present invention; Figure 4 This is a schematic diagram of the C-band TR structure of the present invention; Figure 5 This is a schematic diagram showing the contact between the KK button and the TR component and the array component of the present invention; Figure 6 This is a schematic diagram of the liquid cooling frame structure of the present invention; Figure 7 This is a schematic diagram of the power module of the present invention; Figure 8 This is a schematic diagram of the double-layer flow channel formed by connecting the first S-shaped flow channel and the second S-shaped flow channel of the present invention. In the attached diagram: 1. C-band array; 2. Ku-band array; 3. K-band array; 4. Metal substrate; 5. KK (knot-shaped) antenna; 6. Pressure plate; 7. C-band TR; 8. Ku-band TR; 9. K-band TR; 10. Liquid cooling frame; 11. Antenna interface unit; 12. Beam control module; 13. Power module; 14. Long rod screw; 5.1. Knot-shaped contact pin; 7.1. TR printed circuit board; 7.2. TR module; 7.3. Low-frequency connector; 7.4. RF connector; 10.2. First S-shaped flow channel; 13.1. Radial liquid cooling connector; 13.2. Second S-shaped flow channel; 13.3. External liquid cooling connector; 13.4. Mating low-frequency connector; 13.5. External connector. Detailed Implementation

[0018] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments, but the present invention is not limited to the following embodiments.

[0019] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0020] In the description of this invention, "first feature" and "second feature" may include one or more of the features.

[0021] In the description of this invention, "a plurality of" means two or more.

[0022] In the description of this invention, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or it may include the first and second features not being in direct contact but being in contact through another feature between them.

[0023] In the description of this invention, the terms "above," "over," and "on top" for the first feature and the second feature include the first feature being directly above or diagonally above the second feature, or simply indicating that the first feature is at a higher horizontal level than the second feature.

[0024] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," and "some examples" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0025] Example See attached Figures 1-8This embodiment discloses a miniaturized and compact multi-band phased array antenna, comprising an array assembly, a TR assembly, an antenna interface unit 11, a beam control module 12, and a power supply module 13 connected in sequence. The array assembly, responsible for transmitting and receiving multi-band electromagnetic waves, consists of a C-band array 1, a K-band array 3, a Ku-band array 2, and a metal substrate 4. The C-band, K-band, and Ku-band arrays 1, 3, and 2 all employ a multilayer laminated printed circuit board microstrip antenna structure with radiating metal patterns etched on their surfaces. Compared to traditional dipole antennas, this structure is smaller and thinner while maintaining radiation efficiency. The three arrays are fixed to pre-set mounting slots in the metal substrate 4 using a welding process. The dimensions of the mounting slots precisely match the outline of each array, ensuring a tight fit between the array and the metal substrate 4. The three arrays form a common aperture distribution on the metal substrate 4, enabling independent radiation and reception of multi-band electromagnetic waves. The metal substrate 4 adopts an integrated molding structure, with a ring of evenly distributed mounting holes around its edge, serving as the mounting interface for the entire antenna. The array assembly achieves the common aperture integration of three arrays of different bands, which significantly reduces the space occupied by the antenna compared to the discrete layout design of traditional multi-band antennas. At the same time, the application of multilayer laminated printed circuit board microstrip antenna lays the foundation for the overall miniaturization of the antenna.

[0026] In this embodiment, the TR module and the array module are interconnected via a button KK5 with button pins 5.1 at both ends. Electrical communication between the TR module and the array module is achieved in conjunction with the pressure plate 6. The button pins 5.1 are elastic pins with good conductivity and elastic deformation capability, adapting to minor deviations during assembly. During assembly, one end of the button KK5 is first vertically inserted into the feed point mounting hole of the corresponding array module. The elastic pin undergoes slight deformation during insertion, forming a tight elastic contact with the array feed point, ensuring the continuity of RF signal transmission. Then, the other end of the button KK5 is inserted into a pre-set positioning hole in the pressure plate 6. The pressure plate 6 is fixed to the metal substrate 4 with screws, encapsulating the button KK5 in a closed cavity, with only the elastic pin end in contact with the TR module exposed. The TR module includes C-band TR7, Ku-band TR8, and K-band TR9 corresponding to three bands. Each TR module is fixed to a pre-set mounting position on the pressure plate 6 with screws. During assembly, the feed point of the TR component is precisely aligned with the exposed elastic pin of the KK5 button. As the screws are tightened, the elastic pin undergoes further elastic deformation, forming a reliable electrical connection with the TR component feed point. This achieves a one-to-one RF interconnection between each band TR component and its corresponding array. Compared to the traditional SMP-KK-SMP architecture used for RF interconnection—where the SMP connectors at both ends contact the printed circuit board feed point via buttons, and interconnection is achieved through interlocking with the SMP connectors via KK connectors—this embodiment integrates elastic pins directly at both ends of the KK5 button, eliminating the need for two SMP connectors, reducing the number of components, and lowering assembly complexity. Direct contact interconnection shortens the RF signal transmission path, reduces the interlocking height, and lightens the overall weight of the mounting structure, enabling antenna weight reduction.

[0027] In this embodiment, the TR assembly adopts a modular integrated design. Each band's TR assembly (C-band TR7, Ku-band TR8, K-band TR9) consists of a TR printed circuit board 7.1, a TR module 7.2, a low-frequency connector 7.3, and an RF connector 7.4. Compared to brick-type and tile-type TR assemblies, the TR module 7.2 in this embodiment integrates and packages the core components, becoming a separate chip-level device. After the TR module 7.2 is soldered onto the TR printed circuit board 7.1, a separate sealing structure is no longer needed, reducing the size and weight of the TR assembly. During assembly, the TR module 7.2 is directly soldered onto the TR printed circuit board 7.1, forming a stable mechanical connection and electrical conduction between the soldered TR module 7.2 and the TR printed circuit board 7.1. The low-frequency connector 7.3 and the RF connector 7.4 are both fixed to the edge of the TR printed circuit board 7.1 using surface mount or through-hole technology. Their layouts are independent to avoid signal interference. Among them, the low-frequency connector 7.3 is mainly responsible for the transmission of power supply and control signals; the radio frequency connector 7.4 is used for the conduction of radio frequency signals.

[0028] In this embodiment, a liquid cooling frame 10 is connected below the TR printed circuit board 7.1. The liquid cooling frame 10 is the main heat dissipation component and is made of aluminum alloy through a welding process. Aluminum alloy has both good thermal conductivity and structural strength, enabling rapid heat conduction and providing stable support. The liquid cooling frame 10 has a hollow first S-shaped flow channel 10.2 inside. Compared with a straight flow channel, the S-shaped structure of the flow channel can significantly increase the flow path length of the coolant, prolong the heat exchange time, and improve heat dissipation efficiency. The liquid cooling frame 10 is fixed below the TR assembly, and its top surface is in close contact with the bottom surface of the TR printed circuit board 7.1, ensuring that the heat generated by the TR module 7.2 during operation can be quickly conducted to the liquid cooling frame 10 through the TR printed circuit board 7.1.

[0029] In this embodiment, the antenna interface unit 11 and the beam control module 12 are installed in the internal cavity of the liquid-cooled frame 10 in a layered embedding manner, with the bottom surface of the liquid-cooled frame 10 in close contact with the top surface of the antenna interface unit 11. The liquid-cooled frame 10 forms a "two-sided heat dissipation" structure: one side dissipates the heat generated by the TR module 7.2 through contact with the TR component; the other side dissipates the heat generated by the antenna interface unit 11 and the beam control module 12 during operation through contact with the antenna interface unit 11. The coolant circulates within the first S-shaped flow channel 10.2, quickly carrying away the absorbed heat and achieving synchronous heat dissipation of multiple components. Radial liquid-cooled connectors 13.1 are also provided at both ends of the first S-shaped flow channel 10.2. These connectors adopt a sealed structure, providing an interface for subsequent flow channel interconnection with the power module 13, ensuring no leakage during coolant circulation and guaranteeing the reliability of the heat dissipation system.

[0030] In this embodiment, the antenna interface unit 11 and the beam control module 12 serve as the core of signal processing and control. They work collaboratively with the upper and lower modules through a plug-in interconnection method. The upper and lower surfaces of the antenna interface unit 11 are respectively provided with low-frequency connectors 7.3 and RF connectors 7.4 that match the TR component and the beam control module 12. After the antenna interface unit 11 is embedded in the internal cavity of the liquid cooling frame 10, the low-frequency connectors 7.3 and RF connectors 7.4 on its top surface are tightly plugged into the low-frequency connectors 7.3 and RF connectors 7.4 on the bottom surface of the TR printed circuit board 7.1. Similarly, the upper and lower surfaces of the beam control module 12 are also provided with low-frequency connectors 7.3 and RF connectors 7.4. The low-frequency connectors 7.3 and RF connectors 7.4 on its top surface are precisely plugged into the low-frequency connectors 7.3 and RF connectors 7.4 on the bottom surface of the antenna interface unit 11, achieving seamless signal transmission. The plug-in interconnection design of the two modules makes the signal transmission path inside the antenna compact and short, greatly improving space utilization.

[0031] In this embodiment, the power module 13 not only performs power transfer and distribution functions, but also forms a closed-loop heat dissipation system with the liquid cooling frame 10 through the flow channels. The power module 13 is fixed to the bottom of the beam control module 12 by long screws 14. It is equipped with a mating low-frequency connector 13.4, which precisely mates with the low-frequency connector 7.3 on the bottom surface of the beam control module 12 to realize the transmission of power and control signals. An external connector 13.5 is provided on the side of the power module 13 for connecting to an external power supply. The power module 13 has two parallel unidirectional second S-shaped flow channels 13.2 inside, each with a radial liquid cooling connector 13.1 at one end. The radial liquid cooling connector 13.1 is sealed to the radial liquid cooling connectors 13.1 at both ends of the first S-shaped flow channel 10.2 through mating, realizing the connection between the first S-shaped flow channel 10.2 and the second S-shaped flow channel 13.2. The other ends of the two second S-shaped flow channels 13.2 are equipped with external liquid cooling connectors 13.3, which serve as the inlet and outlet of the coolant, respectively, and connect to the external coolant circulation system. The first S-shaped flow channel 10.2 of the liquid cooling frame 10 and the second S-shaped flow channel 13.2 of the power module 13 are connected by radial liquid cooling connectors 13.1 to form a completely closed double-layer flow channel structure. This flow channel structure is staggered for the positions of the main heat-generating components such as the TR module 7.2, the antenna interface unit 11, and the beam control module 12, so that the coolant can flow precisely through the heat dissipation area corresponding to each heat-generating component, maximizing heat absorption. The coolant enters from one set of external liquid cooling connectors 13.3, flows through a second S-shaped flow channel 13.2, a radial liquid cooling connector 13.1, and a first S-shaped flow channel 10.2, and then flows out from the external liquid cooling connector 13.3 through another set of radial liquid cooling connectors 13.1 and a second S-shaped flow channel 13.2, forming a closed loop circulation. This achieves efficient heat dissipation from inside the antenna and ensures that all components always operate within a safe temperature range.

[0032] In this embodiment, to achieve a compact layout and structural stability of the antenna, the power module 13, beam control module 12, antenna interface unit 11, and liquid cooling frame 10 are sequentially fixed to the metal substrate 4 of the array assembly from bottom to top by a number of evenly distributed long screws 14. The number of long screws 14 is reasonably configured according to the size and weight of the antenna, and they are located at the corresponding positions of the mounting holes on the edge of the metal substrate 4. After the screws are tightened, the modules fit tightly together to form an integrated structure without any loose gaps.

[0033] In this embodiment, the C, K, and Ku band arrays are integrated on a metal substrate 4 with a common aperture. The TR module and the array module are interconnected one-to-one, enabling independent transmission and reception of multi-band electromagnetic waves. High and low frequency bands work together, with the high frequency band ensuring detection accuracy and the low frequency band ensuring long-range search capability, significantly improving the antenna's anti-interference capability and adaptability to complex environments. The button-like KK5 interconnect structure eliminates the need for traditional SMP connectors, and the 7.2 chip-level packaging of the TR module eliminates the need for separate sealing structures. The inter-module plug-in interconnection replaces cable connections, and the long rod screw 14 provides integrated fixation, greatly reducing the size and weight of the antenna and meeting the integration requirements of miniaturized platforms. The closed double-layer S-shaped flow channel design, combined with the two-sided heat dissipation structure of the aluminum alloy liquid cooling frame 10, precisely positions the main heat-generating components, enabling rapid heat dissipation and ensuring stable temperature of each component during antenna operation, thus extending service life.

[0034] The above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the present invention, and all such modifications and substitutions should be covered within the scope of the claims of the present invention. Technical aspects, shapes, and structures not described in detail in this invention are all well-known technologies.

Claims

1. A miniaturized, compact multi-band phased array antenna, characterized in that: The system includes an array assembly, a TR assembly, an antenna interface unit (11), a beam control module (12), and a power supply module (13) connected in sequence. The array assembly includes a multi-band array for receiving and transmitting multi-band electromagnetic waves. The TR assembly includes a multi-band TR, which corresponds one-to-one with the multi-band array. The multi-band TR and the multi-band array are connected by a button KK (5) to achieve electrical interconnection. The antenna interface unit (11) is used to process and output radio frequency signals. The beam control module (12) is used to control radio waves. The power supply module (13) is used to transfer external power supply and allocate and control internal power resources.

2. The compact multi-band phased array antenna of claim 1, wherein: The multi-band array includes a C-band array (1), a K-band array (3), a Ku-band array (2), and a metal substrate (4); the C-band array (1), the K-band array (3), and the Ku-band array (2) are all multi-layer printed circuit board microstrip antennas with radiating metal patterns on their surfaces, which are welded into the metal substrate (4).

3. The compact multi-band phased array antenna of claim 2, wherein: The multi-band TR includes a C-band TR (7), a Ku-band TR (8), a K-band TR (9), and a pressure plate (6); the C-band TR (7) is electrically connected to the C-band array (1) through the button KK (5) and the pressure plate (6); the Ku-band TR (8) is electrically connected to the Ku-band array (2) through the button KK (5) and the pressure plate (6); the K-band TR (9) is electrically connected to the K-band array (3) through the button KK (5) and the pressure plate (6).

4. The compact multi-band phased array antenna of claim 1, wherein: Both ends of the button KK (5) are provided with button contact pins (5.1); the button contact pins (5.1) are elastic contact pins.

5. The compact multi-band phased array antenna of claim 3, wherein: The C-band TR (7), the Ku-band TR (8), and the K-band TR (9) each include a TR printed circuit board (7.1), a TR module (7.2), a low-frequency connector (7.3), and a radio frequency connector (7.4); the TR module (7.2) is soldered onto the TR printed circuit board (7.1); the low-frequency connector (7.3) is connected to the TR printed circuit board (7.1) for power supply and control; and the radio frequency connector (7.4) is connected to the TR printed circuit board (7.1) for conducting radio frequency signals.

6. The compact multi-band phased array antenna of claim 5, wherein: A liquid cooling frame (10) is connected below the TR printed circuit board (7.1); the liquid cooling frame (10) has a first S-shaped flow channel (10.2) inside for circulating coolant; the antenna interface unit (11) and the beam control module (12) are installed in the liquid cooling frame (10) in sequence; one side of the liquid cooling frame (10) contacts the TR printed circuit board (7.1) for heat dissipation, and the other side contacts the antenna interface unit (11) for heat dissipation.

7. The compact multi-band phased array antenna of claim 6, wherein: The antenna interface unit (11) is provided with a low-frequency connector (7.3) and a radio frequency connector (7.4), which are connected to the low-frequency connector (7.3) and radio frequency connector (7.4) on the TR printed circuit board (7.1).

8. A miniaturized, compact multi-band phased array antenna according to claim 7, characterized in that: The beam control module (12) is provided with a low-frequency connector (7.3) and a radio frequency connector (7.4), which are connected to the low-frequency connector (7.3) and radio frequency connector (7.4) on the antenna interface unit (11).

9. A miniaturized, compact multi-band phased array antenna according to claim 8, characterized in that: The power module (13) is provided with two unidirectional second S-shaped flow channels (13.2); one end of each of the two second S-shaped flow channels (13.2) is provided with a radial liquid cooling connector (13.1), which is connected to both ends of the first S-shaped flow channel (10.2); the other end of the two second S-shaped flow channels (13.2) is an external liquid cooling connector (13.1). 13.3), to realize the input and output of coolant; the power module (13) is provided with a plug-in low frequency connector (13.4), which is plugged into and interconnected with the low frequency connector (7.3) on the beam control module (12); the power module (13) is provided with an external connector (13.5).

10. The compact multi-band phased array antenna of claim 6, wherein: The power module (13), the beam control module (12), the antenna interface unit (11), and the liquid cooling frame (10) are fixed to the array assembly by a number of long rod screws.

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