High-frequency power distribution circuit and antenna module

Abstract

The invention provides a high-frequency power distribution circuit capable of improving the degree of freedom of the number of objects for equally dividing a high-frequency signal input to one node. A high-frequency signal is input to the first node. A high-frequency signal is output from each of the plurality of second nodes. The first branch transmission path connects the first node with each of the plurality of second nodes. The first branch transmission path includes a plurality of distributors connected in cascade, each of the plurality of distributors has one input node and two output nodes, some of the plurality of distributors are equal distributors, and the remaining distributors are unequal distributors having a distribution ratio of 2 or less. The first branch transmission path is configured such that high-frequency power input to the first node is equally allocated to the plurality of second nodes.

Description

Technical Field

[0001] This invention relates to high-frequency power distribution circuits and antenna modules. Background Technology

[0002] A known antenna module uses a power divider to distribute high-frequency signals from a mixer to multiple high-frequency integrated circuits (RFICs) to power multiple antenna elements connected to the multiple RFICs (Patent Document 1). A power divider distributes the input high-frequency signal to two transmission paths, ensuring equal power distribution. By cascading multiple power dividers, power can be distributed to two antenna elements connected to the multiple RFICs. n Each (n is a natural number) RFIC supplies a high-frequency signal with equal power.

[0003] Patent Document 1: Japanese Patent No. 6881675 Summary of the Invention

[0004] In previous power dividers, it was possible to divide 2 n While a single RFIC can distribute high-frequency signals, it's impossible to equally distribute these signals to a number of other RFICs. The object of this invention is to provide a high-frequency power distribution circuit that increases the degree of freedom in determining the number of objects into which a high-frequency signal input to a node can be equally distributed. Another object of this invention is to provide an antenna module using this high-frequency power distribution circuit.

[0005] According to one aspect of the present invention, a high-frequency power distribution circuit is provided, wherein:

[0006] The first node is for high-frequency signal input;

[0007] Multiple second nodes output high-frequency signals; and

[0008] The first branch transmission path connects the first node to each of the multiple second nodes.

[0009] The aforementioned first branch transmission path includes multiple cascaded distributors, each of which has one input node and two output nodes. Some of these distributors are equal distributors, while the remaining distributors are unequal distributors with a distribution ratio of less than 2.

[0010] The aforementioned first branch transmission path is configured such that the high-frequency power input to the aforementioned first node is equally distributed to multiple of the aforementioned second nodes.

[0011] According to another aspect of the present invention, an antenna module is provided, wherein it comprises:

[0012] The aforementioned high-frequency power distribution circuit;

[0013] The first mixer has the function of up-converting a baseband signal or an intermediate frequency signal and inputting it to the first node, and the function of down-converting a high-frequency signal output from the first node.

[0014] Multiple high-frequency circuits, each connected to one of the aforementioned second nodes, have the function of amplifying and outputting high-frequency signals from the multiple aforementioned second nodes; and

[0015] Multiple antenna elements are connected to multiple of the aforementioned high-frequency circuits, and are supplied with amplified high-frequency signals.

[0016] The aforementioned high-frequency circuits also have the function of amplifying the high-frequency signals received by the aforementioned antenna elements and inputting them to the aforementioned second nodes.

[0017] By using equal dividers and unequal dividers with a division ratio of 2 or less to construct multiple dividers, the degree of freedom in determining the number of objects to be equally divided in a high-frequency signal can be increased. Furthermore, by setting the division ratio of the unequal dividers to 2 or less, the reduction in isolation can be suppressed. Attached Figure Description

[0018] Figure 1 This is a schematic equivalent circuit diagram of the high-frequency power distribution circuit in the first embodiment.

[0019] Figure 2 This is an equivalent circuit diagram of the high-frequency signal distribution circuit of the first variation of the first embodiment.

[0020] Figure 3A as well as Figure 3B This is a schematic diagram showing the power normalization value of the input node, the allocation ratio, and the power normalization value of the output node of the distributor 26. Figure 3C This is a schematic diagram showing the power normalization value, distribution ratio, and output power normalization value of the input nodes of the first-stage and second-stage distributors 26A and 26B.

[0021] Figure 4 This is a schematic top view showing an example of the wiring pattern of distributor 26.

[0022] Figure 5 This is an equivalent circuit diagram of the high-frequency power distribution circuit of the second variation of the first embodiment.

[0023] Figure 6 This is an equivalent circuit diagram of the high-frequency power distribution circuit of the third variation of the first embodiment.

[0024] Figure 7 This is a block diagram of the antenna module in the second embodiment.

[0025] Figure 8This is a schematic cross-sectional view of a portion of the antenna module in the second embodiment.

[0026] Figure 9 This is a block diagram of the antenna module in the third embodiment.

[0027] Figure 10 This is a schematic diagram showing the positional relationship of multiple structural elements of the antenna module in the plane of the multilayer substrate 60 in the third embodiment.

[0028] Figure 11 This is a schematic cross-sectional view of the antenna module of the third embodiment.

[0029] Figure 12 This is a schematic diagram showing the planar positional relationship of the structural elements of the antenna module in a modified example of the third embodiment.

[0030] Figure 13 This is a schematic diagram showing the positional relationship of multiple structural elements of the antenna module of the second variation of the third embodiment in the plane of the multilayer substrate 60.

[0031] Figure 14 This is a schematic diagram showing the positional relationship of multiple structural elements of the high-frequency power distribution circuit of the fourth embodiment within the plane of the multilayer substrate 60.

[0032] Figure 15 This is a schematic diagram showing the positional relationship of multiple structural elements of the comparative example high-frequency power distribution circuit in the plane of the multilayer substrate 60. Detailed Implementation

[0033] [First Embodiment]

[0034] Reference Figures 1 to 4 The accompanying drawings illustrate the high-frequency power distribution circuit of the first embodiment.

[0035] Figure 1 This is a schematic equivalent circuit diagram of the high-frequency power distribution circuit of the first embodiment. The high-frequency power distribution circuit of the first embodiment includes a first node 11, a plurality of second nodes 12, and a first branch transmission path 21. A high-frequency signal is input to the first node 11, and high-frequency signals are output from the plurality of second nodes 12 respectively. The first branch transmission path 21 connects the first node 11 to each of the plurality of second nodes 12, and distributes the high-frequency signal input to the first node to the plurality of second nodes 12.

[0036] The first branch transmission path 21 includes multiple distributors 26 cascaded together. Each distributor 26 distributes the high-frequency signal input to an input node and outputs it to two output nodes. Furthermore, each distributor 26 can also function as a synthesizer, combining the high-frequency signals input to the two output nodes and outputting them from the input nodes. The distributor 26 can also be called a "two-way distributor synthesizer," and in this specification, it is referred to as a "distributor." The node that receives the high-frequency signal before distribution and outputs the synthesized high-frequency signal is called the input node, and the node that outputs the distributed high-frequency signal and receives the high-frequency signal before synthesis is called the output node.

[0037] Each of the multiple distributors 26 has a distribution ratio of 2 or less. Here, "distribution ratio" is defined as the value obtained by dividing the larger of the power values ​​of the high-frequency signals output to the two output nodes by the smaller of the power values. That is, the distribution ratio of a distributor 26 that distributes the power of the input high-frequency signal in an m:n ratio (m≥n) is m / n. Therefore, the distribution ratio must be 1 or greater. For example, the distribution ratio of a distributor 26 that equally divides the power of the input high-frequency signal is 1, and the distribution ratio of a distributor 26 that distributes the power in a 2:1 ratio is 2.

[0038] exist Figure 1 In the example shown, there are six second nodes 12. The first branch transmission path 21 distributes the high-frequency signal input to the first node 11 equally among the six second nodes 12. That is, the power of the high-frequency signal output from the six second nodes 12 is equal. The value obtained by normalizing the power of the high-frequency signal using the power of the high-frequency signal output from each of the second nodes 12 is called the power normalization value. That is, the power normalization value of each second node 12 is 1. Figure 1 In the text, the power normalization value is represented by a value enclosed in parentheses.

[0039] The first branch transmission path 21 includes five distributors 26, which can be cascaded up to three levels. More specifically, the first branch transmission path 21 is formed by one first-level distributor 26A, two second-level distributors 26B, and two third-level distributors 26C.

[0040] The power normalization value of the high-frequency signal input to the first node 11 is 6. The first-stage distributor 26A is an equal distributor, meaning the distribution ratio is 1. Therefore, high-frequency signals with a power normalization value of 3 are output from the two output nodes of distributor 26A. High-frequency signals with a power normalization value of 3 are input to the respective input nodes of the two second-stage distributors 26B. Hereinafter, the power normalization value of the high-frequency signal at the input or output node will be simply referred to as the power normalization value of each node.

[0041] Each of the second-stage distributors 26B has a distribution ratio of 2. Therefore, the power normalization values ​​of the two output nodes of the second-stage distributor 26B are 2 and 1, respectively. The output node with a power normalization value of 1 is directly connected to the second node 12. The output node with a power normalization value of 2 is connected to the input node of the third-stage distributor 26C.

[0042] The third-stage distributors 26C are equal distributors. Therefore, the power normalization value of the two output nodes of each of the third-stage distributors 26C is 1. The output nodes with a power normalization value of 1 are directly connected to the second node 12. Thus, Figure 1 The first branch transmission path 21 shown distributes the high-frequency signal input to the first node 11 equally to the six second nodes 12. The five distributors 26 include equal distributors and unequal distributors with a distribution ratio of less than 2.

[0043] Figure 2 This is an equivalent circuit diagram of the high-frequency signal distribution circuit of the first variation of the first embodiment. Figure 2 In the first variant shown, there are ten second nodes 12. Additionally, the first branch transmission path 21 consists of nine distributors 26, which are cascaded up to four levels. The power normalization value of the first node 11 is 10.

[0044] The first-stage distributor 26A is an equal distributor. Therefore, the power normalization value of each of the two output nodes of the first-stage distributor 26A is 5. The two distributors 26B in the second stage each have a distribution ratio of 3 / 2. Therefore, the power normalization values ​​of the two output nodes of each of the second-stage distributors 26B are 3 and 2, respectively.

[0045] The output node with a power normalization value of 3 is connected to the input node of the third-stage distributor 26C with a distribution ratio of 2, and the output node with a power normalization value of 2 is connected to the input node of the third-stage distributor 26C with a distribution ratio of 1.

[0046] The power normalization values ​​of the two output nodes of distributor 26C with a distribution ratio of 2 are 2 and 1, respectively. The power normalization value of the two output nodes of distributor 26C with a distribution ratio of 1 is 1. The output node with a power normalization value of 2 is connected to the input node of the fourth-stage distributor 26D with a distribution ratio of 1. The power normalization value of the two output nodes of the fourth-stage distributor 26D is 1. The output node with a power normalization value of 1 is directly connected to the second node 12.

[0047] exist Figure 2In the first variation shown, the allocation ratio of the two distributors 26B in the second stage is 3 / 2, and the allocation ratio of two of the four distributors 26C in the third stage is 2. The other distributors 26 are equal distributors. Thus, the allocation ratio of each of the nine distributors 26 is less than 2, including four distributors 26 with an allocation ratio other than 1 (unequal distributors).

[0048] Next, refer to Figure 3A , Figure 3B ,as well as Figure 3C The function of distributor 26 will be explained. Figure 3A as well as Figure 3B This is a schematic diagram showing the power normalization value of the input node, the allocation ratio, and the power normalization value of the output node of the distributor 26.

[0049] like Figure 3A As shown, distributor 26, whose input node power normalization value is an even number (2m), sets the allocation ratio to 1. Here, parameter m is a natural number, meaning that distributor 26 uses an equal distributor. In this case, the power normalization value of each of the two output nodes of distributor 26 is m. Figure 3B As shown, for distributor 26 whose input node power normalization value is an odd number (2m+1), the allocation ratio is set to (m+1) / m. That is, distributor 26 uses an unequal distributor with an allocation ratio of less than 2. More specifically, this unequal distributor allocates power so that the difference between the allocated power normalization values ​​is 1. At this time, the power normalization values ​​of the two output nodes of distributor 26 are (m+1) and m, respectively. If the power normalization value of an output node is 1, then that output node is directly connected to the second node 12.

[0050] Figure 3C This diagram illustrates the normalized power values, allocation ratios, and normalized power values ​​of the input nodes and output nodes of the first-stage and second-stage distributors 26A and 26B. An example is given where the normalized power value of the first node 11 is 2 × (2n + 1). Here, the parameter n is a natural number. When n = 1, the first branch transmission path 21 is... Figure 1 The structure shown has the following path 21 for the first branch when n=2: Figure 2 The structure shown.

[0051] The power normalization value of the input node of the first-stage distributor 26A is even, therefore the allocation ratio is 1. The power normalization value of each of the two output nodes of the first-stage distributor 26A is (2n+1). The power normalization value of the input node of the second-stage distributor 26B is odd, therefore its allocation ratio is (n+1) / n. Therefore, the power normalization values ​​of the two output nodes of the second-stage distributor 26B are (n+1) and n. Distributors 26A and beyond use... Figure 3A or Figure 3B Distributor 26.

[0052] Figure 4 This is a schematic top view showing an example of the wiring pattern of the power divider 26. The wiring pattern is formed on a dielectric substrate. Branch transmission lines 31A and 31B branch off from the branch source transmission line 30. Branch transmission lines 32A and 32B are connected to the output terminals of the two branch transmission lines 31A and 31B, respectively. A resistor 33 is connected between the midpoint of one branch transmission line 31A and the midpoint of the other branch transmission line 31B. For example, a surface-mount resistor is used as the resistor 33. Such a power divider 26 is called a Wilkinson power divider.

[0053] The distribution ratio of distributor 26 can be adjusted by changing the ratio of the characteristic impedances of branch transmission lines 31A and 31B. The characteristic impedances of branch transmission lines 31A and 31B can be adjusted by changing the linewidth of the stripline or microstrip line. For example, when the ratio of the characteristic impedances of the two branch transmission lines 31A and 31B is approximately 2.5, the distribution ratio is approximately 2. To make the distribution ratio of distributor 26 less than 2, the ratio of the characteristic impedances of the two branch transmission lines 31A and 31B can be made less than 2.5.

[0054] If the ratio of the line widths of the two branch transmission lines 31A and 31B is changed, the ratio of their characteristic impedances will change. Furthermore, if... Figure 4 As shown, the line widths of the two branch transmission lines 31A and 31B can also be varied midway. In this case, the line width of the thickest part of the relatively thicker branch transmission line 31B is defined as the ratio of the line widths of the two branch transmission lines 31A and 31B to the line width of the thinnest part of the relatively thinner branch transmission line 31A.

[0055] The characteristic impedance of the branch source transmission line 30 is equal to the characteristic impedance of each of the two branch transmission lines 32A and 32B. That is, the line width of the branch source transmission line 30 is equal to the line width of each of the two branch transmission lines 32A and 32B.

[0056] Next, refer to Figure 5 The high-frequency power distribution circuit of the second variation of the first embodiment will be described. Figure 5 This is an equivalent circuit diagram of the high-frequency power distribution circuit of the second variation of the first embodiment.

[0057] In the first embodiment ( Figure 1 ) and the first variation of the first embodiment ( Figure 2In the first stage, the number of nodes 12 is 2 × (2n + 1). Here, the parameter n is a natural number. That is, the power normalization value of the first node 11 is 2 × (2n + 1). The power normalization value of the input nodes of the first-stage distributor 26A is even, therefore, the first-stage distributor 26A uses a distributor 26 with a distribution ratio of 1. Figure 3A Since the power normalization value of the input node of the second-stage distributor 26B is odd, the distributor 26B, as the second-stage distributor, uses a distribution ratio of (m+1) / m. Figure 3B ).

[0058] In contrast, Figure 5 In the second variation shown, the number of second nodes 12 is a multiple of 4, for example, twelve. In this case, the power normalization value of each of the two output nodes of the first-stage distributor 26 with a distribution ratio of 1 is also an even number. For example, the power normalization value of the output node of the first-stage distributor 26 is 12, and the power normalization value of each of the two output nodes is 6.

[0059] Therefore, the second-stage distributor 26B also uses distributor 26 with a distribution ratio of 1 ( Figure 3A The connection structure of distributors 26 from the individual distributors in the two second-level distributors 26B to the fourth-level distributor 26D is similar to... Figure 1 The connection structure of the distributor 26 in the first branch transmission path 21 shown is the same.

[0060] Next, refer to Figure 6 The high-frequency power distribution circuit of the third variation of the first embodiment will be described. Figure 6 This is an equivalent circuit diagram of the high-frequency power distribution circuit of the third variation of the first embodiment. In the first embodiment ( Figure 1 ), and the first variation of the first embodiment ( Figure 2 ), and a second variation of the first embodiment ( Figure 5 In the first embodiment, the number of second nodes 12 is even. Conversely, in the third variation of the first embodiment, the number of second nodes 12 is odd. Figure 6 The example shown is where the number of second nodes 12 is seven.

[0061] Since the number of second nodes 12 is odd, the power normalization value of the input nodes of the first-stage distributor 26A is also odd, for example, 7. One of the two output nodes of the first-stage distributor 26A has an even power normalization value, for example, 4, and the other output node has an odd power normalization value, for example, 3. As long as a distributor 26A with a distribution ratio of 1 is connected to the output node with an even power normalization value... Figure 3A), at the output node with an odd power normalization value, a distributor 26 with a distribution ratio of (m+1) / m is connected. Figure 3B That's all.

[0062] After the third level, by using allocator 26 with an allocation ratio of 1 ( Figure 3A ) and a distributor 26 with a distribution ratio of (m+1) / m Figure 3B This combination allows the power of all output nodes of distributor 26 to be normalized to 1. Furthermore, in... Figure 6 The example shown uses allocator 26, which is the third level and beyond, and only uses allocator 26 with an allocation ratio of 1. Figure 3A ).

[0063] Next, the superior effects of the first embodiment and its variations will be explained.

[0064] In the first embodiment, by using not only equally distributed power distributors, but also at least one distributor 26 that is not an equally distributed distributor (unequal distributor), even when the number of second nodes 12 is 2, n Even with a number other than n (where n is a natural number), high-frequency signals can still be distributed to multiple second nodes 12, etc. Distributors with large distribution ratios are difficult to mount on multilayer substrates. In the first embodiment, since the power distribution ratio of the multiple distributors 26 is 2 or less, they can be easily mounted on multilayer substrates. Furthermore, by making the distribution ratio 2 or less, it is easy to construct distributors 26 with high isolation.

[0065] In the first embodiment, a distributor 26 with a distribution ratio of 1 is used. Figure 3A ) and a distributor 26 with a distribution ratio of (m+1) / m ( Figure 3B However, when the high-frequency signal distribution circuit is used to power antenna elements, the distribution ratio may deviate from the target value within the allowable range for the operation of multiple antenna elements. For example, even if the distribution ratio of distributor 26 is not strictly 1, within the allowable error range of the specifications of distributor 26, even if the distribution ratio deviates from the target value, distributor 26 can be processed as an equal distributor. In this case, distributor 26 with a distribution ratio greater than 1.1 and less than 2 can be processed as a "distributor 26 that is not an equal distributor (unequal distributor)" included in the first branch transmission path 21.

[0066] [Second Embodiment]

[0067] Next, refer to Figure 7 as well as Figure 8 The antenna module of the second embodiment will be described below. Hereinafter, regarding the reference... Figures 1 to 6 The structure shared by the first embodiment and its modifications, as illustrated in the accompanying drawings, is omitted from the description.

[0068] Figure 7 This is a block diagram of the antenna module of the second embodiment. The antenna module of the second embodiment includes a high-frequency power distribution circuit consisting of a first node 11, a plurality of second nodes 12, and a first branch transmission path 21. As this high-frequency power distribution circuit, the high-frequency power distribution circuit of the first embodiment and its various modifications are used.

[0069] A first mixer 51 is connected to the first node 11. The first mixer 51 up-converts the baseband signal or intermediate frequency signal and inputs it to the first node 11. Furthermore, the first mixer 51 has the function of down-converting the high-frequency signal output from the first node 11 back to a baseband signal or an intermediate frequency signal. Multiple second nodes 12 are each connected to a high-frequency circuit 55 (RFIC). Each high-frequency circuit 55 has multiple antenna terminals and has the function of amplifying the high-frequency signal output from the second nodes 12 and outputting it from each of the multiple antenna terminals. The power of the high-frequency signals output from the multiple antenna terminals is equal.

[0070] Multiple antenna elements 56 are connected to the antenna terminals of multiple high-frequency circuits 55. The high-frequency signal amplified by the high-frequency circuits 55 is supplied to each of the multiple antenna elements 56. Furthermore, the high-frequency signals received by each of the multiple antenna elements 56 are input to the antenna terminals of the high-frequency circuits 55. Each high-frequency circuit 55 has the function of combining and amplifying the high-frequency signals input to the multiple antenna terminals before inputting them to the second node 12. The high-frequency circuits 55 adjust the phase of the high-frequency signals supplied to the multiple antenna elements 56, causing the multiple antenna elements 56 to operate as phased array antennas. High-frequency circuits 55 with this function are sometimes also referred to as beamforming ICs (BFICs).

[0071] Figure 8 This is a schematic cross-sectional view of a portion of the antenna module of the second embodiment. A first mixer 51 and a plurality of high-frequency circuits 55 are mounted on one side of the multilayer substrate 60. A plurality of antenna elements 56 are formed on the other side of the multilayer substrate 60. Each of the plurality of antenna elements 56 is, for example, a patch antenna.

[0072] The first mixer 51 is connected to a plurality of high-frequency circuits 55 via a first branch transmission path 21 composed of strip lines or microstrip lines disposed within the multilayer substrate 60. Each of the plurality of high-frequency circuits 55 is connected to an antenna element 56 via a power supply line 57 disposed on the multilayer substrate 60.

[0073] Next, the superior effects of the second embodiment will be explained.

[0074] In the second embodiment, since the first branch transmission path 21 uses the first branch transmission path 21 of the first embodiment or its variations, the high-frequency signal output from the first mixer 51 is equally distributed to a plurality of high-frequency circuits 55. This suppresses deviations of the directional pattern from a symmetrical shape. Furthermore, the number of high-frequency circuits 55 is 2. n Even with a number other than n (where n is a natural number), high-frequency signals can be distributed to multiple high-frequency circuits 55, etc. Furthermore, similar to the first embodiment, the antenna module can be easily mounted on a multilayer substrate, and high isolation can be easily ensured.

[0075] [Third Embodiment]

[0076] Next, refer to Figure 9 , Figure 10 , Figure 11 The antenna module of the third embodiment will be described below. Hereinafter, descriptions of structures shared with the antenna module of the second embodiment will be omitted.

[0077] Figure 9 This is a block diagram of the antenna module of the third embodiment. In the third embodiment, in addition to the structural elements of the antenna module of the second embodiment, it also includes a third node 13, a second branch transmission path 22, multiple fourth nodes 14, and a second mixer 52. The structures of the third node 13, the second branch transmission path 22, the multiple fourth nodes 14, and the second mixer 52 are similar to those of the antenna module of the second embodiment. Figure 7 The first node 11, the first branch transmission path 21, the multiple second nodes 12, and the first mixer 51 have the same structure.

[0078] That is, a high-frequency signal is input to the third node 13 from the second mixer 52. The high-frequency signal input to the third node 13 is divided equally and output from multiple fourth nodes 14. The number of fourth nodes 14 is the same as the number of second nodes 12. Each of the multiple second nodes 12 and the multiple fourth nodes 14 constitutes a node pair 15. The second branch transmission path 22 is formed on the multilayer substrate 60 on which the first branch transmission path 21 is formed. Figure 8 The second mixer 52 is mounted on the multilayer substrate 60 shared with the multilayer substrate 60 on which the first mixer 51 is mounted.

[0079] The first mixer 51 is connected to a first transmitting terminal 53Tx and a first receiving terminal 53Rx for connection to an external circuit. If a transmitting signal is input to the first transmitting terminal 53Tx from an external circuit, the transmitting signal is up-converted by the first mixer 51, and the up-converted high-frequency signal is distributed to multiple second nodes 12 via a first branch transmission path 21, etc. The high-frequency signals distributed to the multiple second nodes 12 are radiated from multiple antenna elements 56 via a high-frequency circuit 55.

[0080] The high-frequency signals received by multiple antenna elements 56 are input to multiple second nodes 12 via high-frequency circuit 55. The high-frequency signals input to the multiple second nodes 12 are synthesized by the first branch transmission path 21. The synthesized high-frequency signals are down-converted by the first mixer 51. The down-converted baseband signal or intermediate frequency signal is output from the first receiving terminal 53Rx.

[0081] Similarly, the second mixer 52 is connected to a second transmitting terminal 54Tx and a second receiving terminal 54Rx for connection to external circuitry. If a transmitting signal is input to the second transmitting terminal 54Tx in the same manner as the operation of the first branch transmission path 21, the up-converted high-frequency signal is equally distributed to the multiple fourth nodes 14. If the high-frequency signals received by the multiple antenna elements 56 are input to the multiple fourth nodes 14, the multiple high-frequency signals are combined, down-converted, and output from the second receiving terminal 54Rx.

[0082] The first transmitting terminal 53Tx and the first receiving terminal 53Rx can also be collectively referred to as a first terminal for transmitting and receiving. Similarly, the second transmitting terminal 54Tx and the second receiving terminal 54Rx can be collectively referred to as a second terminal for transmitting and receiving. In this case, for example, a structure can be adopted where the transmitting and receiving operations are switched via a switch within the high-frequency circuit 55.

[0083] High-frequency circuits 55 are connected one-to-one with multiple node pairs 15. For example, a common high-frequency circuit 55 is connected to the second node 12 and the fourth node 14 of each of the multiple node pairs 15. Multiple antenna elements 56 are connected to the multiple high-frequency circuits 55 respectively. The multiple high-frequency circuits 55 amplify the high-frequency signals input from the second node 12 and the high-frequency signals input from the fourth node 14 respectively and output them from their respective output terminals to supply the multiple antenna elements 56. For example, the number of antenna elements 56 connected to the multiple high-frequency circuits 55 is equal among the multiple high-frequency circuits 55.

[0084] The plurality of antenna elements 56 each have: a first power supply point 56A, which receives and amplifies a high-frequency signal input from the second node 12; and a second power supply point 56B, which receives and amplifies a high-frequency signal input from the fourth node 14. When the first power supply point 56A is powered, and when the second power supply point 56B is powered, the plurality of antenna elements 56 radiate mutually orthogonal polarized waves, such as vertically polarized waves and horizontally polarized waves. Furthermore, the polarized waves are the same when the first power supply point 56A is powered, and the polarized waves are also the same when the second power supply point 56B is powered.

[0085] The high-frequency signal output from the first mixer 51 is supplied to the first power supply point 56A of each of the plurality of antenna elements 56, thereby enabling the radiation of radio waves with the same polarization from the plurality of antenna elements 56. In addition, the high-frequency signal output from the second mixer 52 is supplied to the second power supply point 56B of each of the plurality of antenna elements 56, thereby enabling the radiation of radio waves with polarization orthogonal to the polarization radiated when the first mixer 51 is operated.

[0086] Furthermore, two radio waves with mutually orthogonal polarizations can be received using the first mixer 51 and the second mixer 52, respectively. By controlling the phase of the high-frequency signals supplied to the multiple antenna elements 56, the multiple antenna elements 56 can be made to operate as a phased array antenna.

[0087] Figure 10 This is a schematic diagram illustrating the positional relationship of multiple structural elements of the antenna module in the third embodiment within the plane of the multilayer substrate 60. A first direction D1 parallel to the surface of the multilayer substrate 60 and a second direction D2 intersecting the first direction are defined. For example, the first direction D1 and the second direction D2 are orthogonal to each other. Figure 10 In the example, node 15 has an even number of nodes, for example, six. That is, the second node 12 and the fourth node 14 also each have an even number of nodes, for example, six.

[0088] Multiple node pairs 15 are arranged in two columns along a first direction D1 on a multilayer substrate 60. For example, six node pairs 15 are arranged in a row and column configuration of three rows and two columns. The multiple node pairs 15 arranged along the first direction D1 are referred to as node pair columns. In each of the multiple node pairs 15, the second node 12 and the fourth node 14 are arranged along a second direction D2 and are configured with the same positional relationship about the second direction D2. That is, the interval between the second node 12 and the fourth node 14 is equal among the multiple node pairs 15.

[0089] The first branch transmission path 21 includes two first parts 21I and 21J, and a first connecting part 21K. The first parts 21I and 21J are configured along the node pair columns in the second direction D2 on the first side of each of the two node pair columns (in...). Figure 10 (The middle is the right side). The first connecting part 21K connects the two first parts 21I and 21J in the first direction D1 at a location where the nodes of the two columns do not overlap. Thus, the first branch transmission path 21 is configured in a U-shape when viewed from above (in Figure 10 The area is U-shaped and opens downwards. Furthermore, the first connecting portion 21K is connected to the first node 11.

[0090] The first connection part 21K includes a first-level distributor 26A, and the two first parts 21I and 21J each include a second-level distributor 26B and a third-level distributor 26C.

[0091] The second branch transmission path 22, like the first branch transmission path 21, includes two second parts 22I and 22J, and a second connecting part 22K. The second parts 22I and 22J are arranged along the node pair columns in the second direction D2 on the second side opposite to the first side of each of the two node pair columns (in...). Figure 10 (The middle part is on the left). The second connecting part 22K connects the two second parts 22I and 22J in the first direction D1 at a location where they do not overlap with the nodes of the two columns. Furthermore, the second connecting part 22K is connected to the third node 13.

[0092] Similarly, in the second branch transmission path 22, the second connection part 22K contains a first-level distributor 26A, and the two second parts 22I and 22J contain a second-level distributor 26B and a third-level distributor 26C, respectively.

[0093] The first connecting portion 21K and the second connecting portion 22K are configured as a pair of nodes sandwiched between two columns in the first direction D1. For example, the second branch transmission path 22 is configured in a U-shape when viewed from above (in... Figure 10 The U-shaped region (opening upwards) has an interlocking position with the U-shaped region containing the first branch transmission path 21 and the U-shaped region containing the second branch transmission path 22. When viewed from above, the conductor patterns constituting the first branch transmission path 21 and the conductor patterns constituting the second branch transmission path 22 are quadratically rotationally symmetric. That is, the first node 11 of the first branch transmission path 21 and the third node 13 of the second branch transmission path 22 are located on opposite sides when viewed from the center of rotation of the quadratically rotationally symmetric structure.

[0094] In a top-down view, high-frequency circuits 55 are arranged overlapping multiple node pairs 15, a first mixer 51 is arranged overlapping the first node 11, and a second mixer 52 is arranged overlapping the third node 13. Therefore, the six high-frequency circuits 55 are also arranged in two columns in the first direction D1, just like the six node pairs 15.

[0095] Figure 11 This is a schematic cross-sectional view of the antenna module of the third embodiment. Figure 11 This is not a diagram showing a specific cross-section of the antenna module, but rather a diagram showing the positional relationships of multiple structural elements of the antenna module in the thickness direction.

[0096] A first mixer 51, a second mixer 52, and a plurality of high-frequency circuits 55 are mounted on one side of the multilayer substrate 60 (hereinafter referred to as the first side 60A). A plurality of antenna elements 56 are disposed on the second side 60B of the multilayer substrate 60 opposite to the first side 60A. The multilayer substrate 60 has a multilayer wiring structure, and a first branch transmission path 21, a second branch transmission path 22, a plurality of power supply lines 57, and a plurality of ground conductors 61 are disposed in the inner layers of the multilayer substrate 60.

[0097] The first mixer 51 is connected to a plurality of high-frequency circuits 55 via the first branch transmission path 21, and the second mixer 52 is connected to a plurality of high-frequency circuits 55 via the second branch transmission path 22.

[0098] The first branch transmission path 21 and the second branch transmission path 22 include conductor patterns disposed on the inner layer of the multilayer substrate 60. These conductor patterns and the ground conductor 61 form a stripline. The conductor patterns included in the first branch transmission path 21 and the conductor patterns included in the second branch transmission path 22 are disposed on the same single layer. The conductor patterns included in the first branch transmission path 21 and the conductor patterns included in the second branch transmission path 22 are rotationally symmetrical about each other when viewed from top, thus allowing them to be disposed on the same single layer. Figure 11 In the example shown, the conductor pattern contained in the first branch transmission path 21 and the conductor pattern contained in the second branch transmission path 22 are arranged in the wiring layer of the second layer between the ground conductor 61 of the first layer and the ground conductor 61 of the third layer, starting from the first surface 60A.

[0099] Next, refer to Figure 12 The antenna module of the first variation of the third embodiment will be described. Figure 12 This is a schematic diagram showing the planar positional relationship of the structural elements of the antenna module in the first variation of the third embodiment. In the third embodiment ( Figure 10 In the original example, there are six high-frequency circuits 55, but in the first variant, there are ten high-frequency circuits 55. The ten high-frequency circuits 55 are arranged in two columns in the first direction D1. Each column contains five high-frequency circuits 55.

[0100] Compared with the third embodiment ( Figure 10 The structures are identical, with the first branch transmission path 21 comprising two first parts 21I and 21J, and a first connecting part 21K connecting the two. The second branch transmission path 22 comprises two second parts 22I and 22J, and a second connecting part 22K connecting the two. The U-shaped region configured with the first branch transmission path 21 and the U-shaped region configured with the second branch transmission path 22 are configured to mesh with each other. Figure 12In the image, the U-shaped area with the first branch transmission path 21 and the U-shaped area with the second branch transmission path 22 are shaded.

[0101] Next, the superior effects of the third embodiment will be explained.

[0102] In the third embodiment, the high-frequency signals output from the first mixer 51 and the second mixer 52 are equally distributed to a plurality of high-frequency circuits 55. Furthermore, the number of high-frequency circuits 55 is 2. n Even with a number other than n (where n is a natural number), high-frequency signals can be distributed to multiple high-frequency circuits 55, etc. Furthermore, similar to the first embodiment, the antenna module can be easily mounted on a multilayer substrate, and high isolation can be easily ensured. Moreover, it can handle two mutually orthogonal polarized waves.

[0103] Furthermore, by arranging the first branch transmission path 21 and the second branch transmission path 22 in a U-shaped region that meshes with each other, the excellent effect of shortening the wiring length is achieved. As a result, the increase in transmission loss can be suppressed.

[0104] In the third embodiment, a first transmitting terminal 53Tx and a second transmitting terminal 54Tx are respectively connected to the first mixer 51 and the second mixer 52. Therefore, two transmitting signals encoded with different information can be input to the first mixer 51 and the second mixer 52, and transmitted from multiple antenna elements 56. The transmitting signals input to the first mixer 51 and the transmitting signals input to the second mixer 52 are radiated from the multiple antenna elements 56 with mutually orthogonal polarized waves. Therefore, the excellent effect of doubling the amount of information transmitted is achieved.

[0105] Furthermore, in the case of receiving mutually orthogonal polarized waves, a received signal based on one polarized wave is output from the first receiving terminal 53Rx connected to the first mixer 51, and a received signal based on another polarized wave is output from the second receiving terminal 54Rx connected to the second mixer 52. Therefore, an excellent effect is achieved where the amount of information that can be received is twice that of the original signal.

[0106] Next, refer to Figure 13 The antenna module of the second variation of the third embodiment will be described. Figure 13 This is a schematic diagram showing the positional relationship of multiple structural elements of the antenna module in the second variation of the third embodiment within the plane of the multilayer substrate 60. In the third embodiment ( Figure 10 In the antenna module, the line lengths of the two transmission paths from the two output nodes of the first-stage distributor 26A to the two input nodes of the second-stage distributor 26B are different.

[0107] In contrast, Figure 13 In the antenna module of the second variant shown, the line lengths of the two transmission paths from the two output nodes of the first-stage distributor 26A to the input nodes of the two second-stage distributors 26B are equal.

[0108] The first-stage distributor 26A is an equal distributor. Therefore, the high-frequency signals output from the two output nodes of the first-stage distributor 26A have equal power. In the third embodiment ( Figure 10 In the first embodiment, due to differences in line length leading to transmission losses, the power of the high-frequency signals input to the two distributors 26B in the second stage will differ. In the second variation of the third embodiment, the line lengths of the two transmission paths from the two output nodes of the first-stage distributor 26A to the input nodes of the two distributors 26B in the second stage are equal. Therefore, transmission losses are less likely to differ. As a result, the power of the high-frequency signals input to the two distributors 26B in the second stage is less likely to differ.

[0109] Next, the antenna module of other variations of the third embodiment will be described.

[0110] In the third embodiment ( Figure 10 In the first branch transmission path 21 and the second branch transmission path 22, the first mixer 51 and the second mixer 52 are respectively configured in different parts, but the first mixer 51 and the second mixer 52 can also be constructed by a single chip and configured in one part.

[0111] [Fourth Embodiment]

[0112] Next, refer to Figure 14 as well as Figure 15 The high-frequency power distribution circuit of the fourth embodiment will be described below. Hereinafter, regarding the reference... Figures 9 to 11 The structure shared by the high-frequency power distribution circuit used in the antenna module of the third embodiment, as illustrated in the accompanying drawings, is omitted from the description.

[0113] Figure 14 This is a schematic diagram showing the positional relationship of multiple structural elements of the high-frequency power distribution circuit in the plane of the multilayer substrate 60 in the fourth embodiment. In the third embodiment ( Figure 10In the first branch transmission path 21, the number of second nodes 12 and the number of fourth nodes 24 in the second branch transmission path 22 are both six. That is, the number of second nodes 12 and the number of fourth nodes 14 are not powers of 2. In contrast, in the high-frequency power distribution circuit of the fourth embodiment, the number of second nodes 12 in the first branch transmission path 21 and the number of fourth nodes 14 in the second branch transmission path 22 are both four. That is, the number of second nodes 12 and the number of fourth nodes 14 are both powers of 2.

[0114] The two output nodes of the second-level distributor 26B are each connected to the second node 12. Distributor 26B with its two output nodes connected to the second node 12 is called the final-level distributor. When there are four second nodes 12 in the first branch transmission path 21, there are two final-level distributors 26B. Similarly, the final-level distributor 26B in the second branch transmission path 22 also has two components.

[0115] The first branch transmission path 21, for each final stage distributor 26B, includes two transmission paths of different lengths connecting the two output nodes to the two second nodes 12 respectively. Similarly, the second branch transmission path 22, for each final stage distributor 26B, includes two transmission paths of different lengths connecting the two output nodes to the two fourth nodes 14 respectively.

[0116] Generally, transmission losses differ if the transmission path lengths are different. Even considering the losses of the two transmission paths connected to the two output nodes, the final-stage distributor 26B maintains a distribution ratio where the power of the high-frequency signals at the two second nodes 12 is equal. For example, the final-stage distributor 26B distributes power such that the output node connected to the longer transmission path receives more power than the other output node. To compensate for the difference in transmission losses caused by the difference in transmission path lengths, it is sufficient to set the distribution ratio of the final-stage distributor 26B to a range of 2 or less.

[0117] The transmission paths from the first-stage distributor 26A to each of the two second-stage distributors 26B have equal lengths. Therefore, even considering transmission losses based on the transmission paths, the power of the high-frequency signals input to the two second-stage distributors 26B is equal. Thus, the first branch transmission path 21 can equally distribute power to the four second nodes 12. Similarly, the second branch transmission path 22 can also equally distribute power to the four fourth nodes 14.

[0118] Next, with Figure 15 The superior performance of the fourth embodiment will be explained by comparing the high-frequency power distribution circuits of the comparative examples shown.

[0119] Figure 15 This is a schematic diagram showing the positional relationship of multiple structural elements of the comparative example high-frequency power distribution circuit within the plane of the multilayer substrate 60. Figure 15 In the comparative example shown, the distributor 26B, which serves as the second stage, uses an equal distributor. To ensure that the power of the high-frequency signals supplied to the two second nodes 12, which are respectively connected to the two output nodes of the second-stage distributor 26B, is equal, the line lengths of the two transmission paths connected to the two output nodes are made the same.

[0120] In the comparative example, distributor 26B must be configured such that the line lengths of the two transmission paths from the two output nodes of distributor 26B to the two second nodes 12 are equal. Therefore, the freedom of configuration for distributor 26 is limited. Consequently, it is difficult to shorten the line lengths of the transmission paths from the first-stage distributor 26A to the two second-stage distributors 26.

[0121] In contrast, in the fourth embodiment, it is not necessary to make the line lengths of the two transmission paths from the two output nodes of distributor 26B to the two second nodes 12 equal, thus increasing the degree of freedom in configuring distributor 26B. As a result, the positions of the two distributors 26B in the second stage can be determined such that the line lengths of the transmission paths from the first-stage distributor 26A to the two second-stage distributors 26B are shortened.

[0122] As described above, in the fourth embodiment, the second-level distributor 26B can be configured to shorten the total line length of the transmission path. As a result, transmission losses can be suppressed as a whole. Thus, the structure of the first branch transmission path 21 and the second branch transmission path 22, which includes unequal distributors with a distribution ratio of 2 or less, has excellent effects not only when the number of second nodes 12 is not expressed as a power of 2, but also when it is expressed as a power of 2.

[0123] Next, the high-frequency power distribution circuit of the modified example of the fourth embodiment will be described.

[0124] In the high-frequency power distribution circuit of the fourth embodiment, the first branch transmission path 21 and the second branch transmission path 22 are both two-level distribution circuits. Furthermore, even if the first branch transmission path 21 and the second branch transmission path 22 are three-level or higher structures, the same structure can be used. For example, if the first branch transmission path 21 is a three-level structure, the number of second nodes 12 is eight, and the four distributors of the third level become the final-level distributors.

[0125] In the fourth embodiment, the allocation ratio of the final-stage distributor 26B is set such that the power of the high-frequency signals output from the two second nodes 12, which are respectively connected to the two output nodes of the final-stage distributor 26B, is equal. However, the power of the high-frequency signals output from the two second nodes 12 does not need to be strictly equal. For example, it is preferable to set the allocation ratio of the final-stage distributor 26B such that the power difference of the high-frequency signals at the two second nodes 12, which are respectively connected to the final-stage distributor 26B, is smaller than the power difference of the high-frequency signals when the final-stage distributor 26B uses an equal distributor.

[0126] The above embodiments are illustrative, and of course, the structures shown in different embodiments can be partially replaced or combined. The same effects of the same structures in multiple embodiments are not mentioned sequentially in each embodiment. Furthermore, the present invention is not limited to the above embodiments. For example, it will be obvious to those skilled in the art that various changes, improvements, and combinations can be made.

[0127] Explanation of reference numerals in the attached figures

[0128] 11…First node; 12…Second node; 13…Third node; 14…Fourth node; 15…Node pair; 21…First branch transmission path; 21I, 21J…First part; 21K…First connection part; 22…Second branch transmission path; 22I, 22J…Second part; 22K…Second connection part; 26…Distributor; 26A…First-level distributor; 26B…Second-level distributor; 26C…Third-level distributor; 26D…Fourth-level distributor; 30…Branch source transmission line; 31A… 31B…Branch transmission line; 32A, 32B post-branch transmission lines; 33…Resistor; 51…First mixer; 52…Second mixer; 53Rx…First receiving terminal; 53Tx…First transmitting terminal; 54Rx…Second receiving terminal; 54Tx…Second transmitting terminal; 55…High-frequency circuit (beamforming IC); 56…Antenna element; 56A…First power supply point; 56B…Second power supply point; 57…Power supply line; 60…Multilayer substrate; 60A…First surface; 60B…Second surface; 61…Ground conductor.

Claims

1. A high-frequency power distribution circuit, wherein, have: The first node receives a high-frequency signal. Multiple second nodes output high-frequency signals; as well as The first branch transmission path connects the first node to each of the multiple second nodes. The aforementioned first branch transmission path includes multiple cascaded distributors, each having one input node and two output nodes. Some of these distributors are equal distributors, while the remaining distributors are unequal distributors with a distribution ratio of less than 2. The aforementioned first branch transmission path is configured such that the high-frequency power input to the aforementioned first node is equally distributed to multiple of the aforementioned second nodes.

2. The high-frequency power distribution circuit according to claim 1, wherein, When normalizing the power of a high-frequency signal using the high-frequency power values ​​that appear at multiple of the aforementioned second nodes, For the multiple distributors mentioned above, the distributor with an even number of power normalization values ​​of the input high-frequency signals has a distribution ratio of 1, while the distributor with an odd number of power normalization values ​​distributes power such that the difference between the distributed power normalization values ​​is 1. The power distribution ends after the distributed power normalization value becomes 1.

3. The high-frequency power distribution circuit according to claim 1 or 2, wherein, If we take the parameter n as a natural number, the number of multiple second nodes mentioned above is 2×(2n+1). The first-stage power distributor directly connected to the first node is divided equally so that the normalized value of the distributed power is 2n+1. The second-stage distributor performs the allocation so that the allocated power is normalized to n+1 and n.

4. The high-frequency power distribution circuit according to any one of claims 1 to 3, wherein, It also has: The third node receives a high-frequency signal. The fourth node outputs a high-frequency signal, the same number as the multiple second nodes mentioned above; The second branch transmission path connects the aforementioned third node to each of the aforementioned fourth nodes, distributing high-frequency signals input to the aforementioned third node to the aforementioned fourth nodes; and The substrate has the aforementioned first branch transport path and the aforementioned second branch transport path formed thereon. Multiple second nodes and one of the multiple fourth nodes constitute a node pair.

5. The high-frequency power distribution circuit according to claim 4, wherein, The number of each of the aforementioned second nodes and the aforementioned fourth nodes is even. Multiple such node pairs are arranged in two columns in a first direction parallel to the surface of the substrate to form a node pair column. In each of the aforementioned node pairs, the second node and the fourth node are arranged in a second direction that intersects the first direction, and are configured with the same positional relationship in the second direction. The first branch transmission path mentioned above includes: The first part comprises the first side of each of the two node pairs arranged along the second direction described above; and The first connecting portion connects the two first portions in the first direction where they do not overlap with the nodes of the two columns, and connects them to the first node. The second branch transmission path mentioned above includes: The second part comprises, along the second direction, the second side of each of the two columns of the node pairs arranged opposite to the first side; and The second connection portion connects the two second portions in the first direction where they do not overlap with the nodes of the two columns, and also connects to the third node.

6. An antenna module, wherein, have: The high-frequency power distribution circuit according to any one of claims 1 to 3; The first mixer has the function of up-converting a baseband signal or an intermediate frequency signal and inputting it to the first node, and the function of down-converting a high-frequency signal output from the first node. Multiple high-frequency circuits, each connected to one of the aforementioned second nodes, have the function of amplifying and outputting high-frequency signals from the aforementioned second nodes; and Multiple antenna elements are connected to multiple of the aforementioned high-frequency circuits, and are supplied with amplified high-frequency signals. The aforementioned high-frequency circuits also have the function of amplifying the high-frequency signals received by the aforementioned antenna elements and inputting them to the aforementioned second nodes.

7. An antenna module, wherein, have: The high-frequency power distribution circuit as described in claim 4 or 5; The first mixer has the function of up-converting a baseband signal or an intermediate frequency signal and inputting it to the first node, and the function of down-converting a high-frequency signal output from the first node. The second mixer has the function of up-converting the baseband signal or intermediate frequency signal and inputting it to the third node, and the function of down-converting the high frequency signal output from the third node. Multiple high-frequency circuits are connected to the aforementioned nodes, respectively, the aforementioned second node and the aforementioned fourth node; and Multiple antenna elements are connected to multiple of the aforementioned high-frequency circuits, respectively. The aforementioned high-frequency circuits amplify the high-frequency signals input from the second node and the fourth node respectively, output them from their respective output terminals, and supply power to the aforementioned antenna elements. Each of the aforementioned antenna elements has: a first power supply point, which receives a high-frequency signal amplified from the second node; and a second power supply point, which receives a high-frequency signal amplified from the fourth node. When the first power supply point is powered and the second power supply point is powered, the antenna elements radiate mutually orthogonal polarized waves.

8. The antenna module according to claim 7, wherein, The number of antenna elements connected to the plurality of the aforementioned high-frequency circuits is equal among the plurality of the aforementioned high-frequency circuits.

9. The antenna module according to claim 7 or 8, wherein, The first mixer, the second mixer, and the plurality of high-frequency circuits are mounted on one side of the substrate, namely the first side, and the plurality of antenna elements are disposed on a second side of the substrate opposite to the first side. The first branch transmission path and the second branch transmission path mentioned above include conductor patterns disposed on the inner layer of the substrate. The aforementioned substrate includes a plurality of grounding conductors disposed in the inner layer.

10. The antenna module according to claim 9, wherein, The conductor pattern contained in the first branch transmission path and the conductor pattern contained in the second branch transmission path are rotationally symmetrical about each other when viewed from above, and are disposed in the same single layer of the inner layer of the substrate.

11. The antenna module according to any one of claims 7 to 10, wherein, It also has: The first terminal for transmitting and receiving is configured to be connected to the aforementioned first mixer and to an external circuit; and The second terminal for transmitting and receiving is configured to be connected to the aforementioned second mixer and to an external circuit.

12. The high-frequency power distribution circuit according to claim 1, wherein, The aforementioned allocators include at least one final-stage allocator with two output nodes respectively connected to the two aforementioned second nodes. The first branch transmission path mentioned above includes two transmission paths of different lengths that connect the two output nodes of the final stage distributor to the two second nodes respectively. The aforementioned final-stage distributor is an unequal distributor with a distribution ratio of 2 or less. The distribution ratio of the aforementioned final-stage distributor is set such that the power difference of the high-frequency signals at the two aforementioned second nodes connected to the aforementioned final-stage distributor is smaller than the power difference of the high-frequency signals when the aforementioned final-stage distributor uses an equal distributor.

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