Heat dissipation substrate with composite enhanced heat transfer structure and application of heat dissipation substrate in electronic device heat dissipation device

Abstract

The invention relates to a heat dissipation substrate with a composite enhanced heat transfer structure and application of the heat dissipation substrate in a heat dissipation device of an electronic device, a bottom plate and micro-rib structures are of an integrated structure, and a porous framework is filled among the micro-rib structures; the electronic device heat dissipation device comprises a cold plate type heat dissipation device and a cover plate type heat dissipation device. The cold plate type heat dissipation device is basically composed of a radiator connector, a heat dissipation cover plate, a splitter plate, a heat dissipation substrate and a main board. The basic structure of the cover plate type heat dissipation device is as follows: a radiator joint, a chip cover plate, a splitter plate, a heat dissipation substrate and a core mainboard. Compared with the prior art, the multi-hole framework and the micro-rib structure are designed to be compounded, the heat exchange area can be increased cooperatively, fluid flowing is optimized to improve the heat exchange efficiency, meanwhile, local hot spots and flowing dead zones are avoided, different heat dissipation requirements can be flexibly met, and it is ensured that the chip dissipates heat continuously and efficiently under high power.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology, and in particular to a heat dissipation substrate with a composite enhanced heat transfer structure and its application in heat dissipation devices for electronic devices. Background Technology

[0002] With the rapid development of the electronic information industry, chip integration is constantly increasing, and computing power is continuously rising. Consequently, the heat flux density per unit area is significantly increasing, making heat dissipation a key factor affecting chip performance and long-term stable operation. While traditional heat dissipation structures can improve thermal conductivity to some extent by increasing the heat exchange area, their inherent structural design limits the flow dead zones of the cooling medium within the micro-fin gaps. This leads to localized hotspot accumulation, and uneven fluid distribution further exacerbates fluctuations in heat exchange efficiency, making it difficult to meet the rapid heat transfer requirements of high-power chips.

[0003] In many application scenarios with high requirements for chip heat dissipation, the above-mentioned defects can easily cause the chip to frequently trigger the overheat protection mechanism, which will not only reduce the chip's computing performance, but also shorten the chip's lifespan. Therefore, developing a composite enhanced heat exchange technology that can simultaneously take into account heat conduction efficiency and heat flow uniformity to meet the heat dissipation needs of high-power chips has become an urgent problem to be solved in the relevant fields. Summary of the Invention

[0004] To address the deficiencies or problems existing in the prior art, the present invention provides a heat dissipation substrate with a composite enhanced heat transfer structure and its application in heat dissipation devices for electronic devices. It can simultaneously improve heat conduction efficiency and heat flow uniformity, effectively avoid local hot spot accumulation or heat exchange dead zones, and ensure that the chip can continuously and efficiently dissipate heat under high power.

[0005] The objective of this invention can be achieved through the following technical solutions:

[0006] The first objective of this invention is to provide a heat dissipation substrate with a composite enhanced heat transfer structure, the heat dissipation substrate comprising a base plate with an integral structure and a micro-rib structure, the micro-rib structure being located on the upper surface of the base plate, the upper surface of the base plate being provided with a porous skeleton, the porous skeleton being filled between the micro-rib structures.

[0007] Furthermore, the base plate, micro-rib structure, and porous skeleton together form a heat dissipation substrate.

[0008] Furthermore, the structure of the heat dissipation substrate can be adapted to suit the size and mounting position of different electronic devices. These electronic devices include CPUs, GPUs, TPUs, FPGAs, ASICs, laser chips, network communication chips, radio frequency chips, image sensor chips, and other high heat flux electronic chips.

[0009] Furthermore, the microrib structure is specifically one or more of a rib plate or rib column structure.

[0010] Furthermore, the ribs are classified by shape into one or more types of straight ribs and wavy ribs. The straight ribs are ribs that extend in a straight line perpendicular to the wall along the length of the channel. The wavy ribs are ribs that extend in a corrugated shape along the length of the channel. The shape of the wavy ribs includes square waves, trapezoidal waves, triangular waves, and sine waves. The organization of the wavy ribs includes arrays and adjacent symmetrical arrangements. The amplitude and the width of the crests and troughs of the wavy ribs are designed and adjusted according to the local heat flux density.

[0011] Furthermore, the ribs are arranged in a straight line or an alternating pattern. In the straight line pattern, the ribs are arranged in a straight line along a set reference direction, with the center lines of adjacent columns and rows aligned, forming a regular rectangular array. In the alternating pattern, the ribs are arranged in rows at equal intervals, with the gaps between the ribs in the next row aligned with those in the previous row, and the ribs are staggered. The shape of the ribs is selected from one or more of the following: rectangle, trapezoid, parallelogram, triangle, circle, or ellipse. The shape of the ribs is selected from one or more of the following: column, cone, frustum, hemisphere, or umbrella.

[0012] It should be noted that the shape of the microrib structure is not limited to the types listed above, and can be adapted to meet the heat dissipation requirements of the chip and the processing conditions.

[0013] Furthermore, the porous skeleton is selected from one or more of the following: particulate porous skeleton structures, wire mesh porous skeleton structures, foam porous skeleton structures, and periodic geometric porous skeleton structures prepared by sintering, melt foaming and / or additive manufacturing.

[0014] Furthermore, the porous skeleton material is selected from one or more of metallic materials, carbon materials, ceramic materials, and other highly thermally conductive materials.

[0015] Furthermore, the granular porous framework structure is a porous medium entity formed by stacking several particles of the same or different sizes. The particles form interconnected pores as fluid flow paths. The particle shape is irregular or regular geometric shape. The particle size and porosity of different horizontal regions or vertical heights need to be matched with the local heat density and fluid flow state to adapt to the cooling working fluid flow and heat exchange requirements.

[0016] Furthermore, the wire mesh type porous skeleton structure is a porous medium entity formed by stacking several layers of wires or wire meshes with the same or different wire diameters. Interconnected pores are formed between the wires or wire meshes as fluid flow paths. The wire diameters, number of layers, and porosity at different horizontal regions or vertical heights need to match the local heat density and fluid flow state, so as to adjust the flow characteristics and heat transfer efficiency of the fluid within the skeleton.

[0017] Furthermore, the foam type porous skeleton structure is a porous medium entity composed of randomly distributed and three-dimensionally connected foam-like frameworks. The pores formed between the foam-like frameworks serve as fluid flow paths. The porosity at different horizontal regions or vertical heights needs to match the local heat density and fluid flow state.

[0018] Furthermore, the periodic geometric type porous skeleton structure specifically includes one or more of the following: frame type periodic skeleton structure, plate frame type periodic skeleton structure, and minimal surface type periodic skeleton structure.

[0019] Furthermore, the frame type periodic skeleton structure includes one or more of the following: cube frame, face diagonal cube, truncated cube, cube truss, star truss, octahedron truss, octahedron, truncated octahedron, cube wireframe.

[0020] Furthermore, the plate frame type periodic skeleton structure includes one or more of the following: star tetrahedron, concave regular icosahedron, cube cross plate frame, concave octahedron, icositetrahedron.

[0021] Furthermore, the internal fluid channels of the minimal surface type periodic skeleton structure are composed of three-dimensional periodic surfaces, and the surfaces satisfy the parametric equations (the parametric equations are as follows surface equations):

[0022]

[0023] where

[0024] X n 、Y n 、Z n , (n = 1, 2, 3) are functions of the x coordinate, y coordinate, and z coordinate, p i 、q i 、r i , (i = 1, 2, 3) are the powers of the parametric equations respectively, A, B, C are the weight coefficients of each term, D ∈ [k1, k2], where -3 < k1 < k2 < 3. When D takes values within the range of [k1, k2], the set of all solutions of the parametric equations constitutes the solid part of the minimal surface type periodic skeleton structure, and the remaining part forms interconnected pores as fluid flow paths;

[0025] α, β, and γ are the size-related constants of the minimal surface periodic skeleton structure in the x, y, and z directions, respectively; The phase of the parametric equation is used to determine the specific shape of the surface, the reference position, and the initial distribution of the periodic structure;

[0026] When A, B, and C are equal, the minimal curved surface periodic skeleton structure is isotropic and suitable for uniform heat dissipation conditions; when A, B, and C are not all equal, the minimal curved surface periodic skeleton structure is anisotropic and enhances heat dissipation in specific directions.

[0027] Furthermore, based on the physical meaning of each parameter in the parametric equations, and with the goals of optimizing the fluid heat transfer path, reducing the thermal resistance of the heat transfer interface, and enhancing turbulent heat transfer, the constructed minimal curved surface periodic skeleton structure includes one or more of the following: stepped curved surface structure, porous spherical curved surface structure, spiral curved surface structure, grid curved surface structure, "S" shaped curved surface structure, porous interlaced curved surface structure, cylindrical array curved surface structure, vase-shaped curved surface structure, pupil-like curved surface structure, spiral curved surface structure, candy-shaped curved surface structure, wave cave-shaped curved surface structure, porous layered curved surface structure, rhombus-grid arranged curved surface structure, multi-vortex curved surface structure, heterogeneous interconnected curved surface structure, circular hole array curved surface structure, ravine curved surface structure, crater-shaped curved surface structure, and rhombus grid curved surface structure.

[0028] Furthermore, the parametric equations are used to generate a three-dimensional channel network with a periodic minimal surface skeleton. The topological continuity and node curvature distribution of this network control the fluid heat transfer path and reduce thermal resistance.

[0029] Furthermore, it can be understood that the selection of parameters in the parametric equations enables the minimal surface periodic skeleton structure to form a continuous and interconnected fluid network on any cross section, thereby reducing the thermal resistance of the heat transfer interface and enhancing turbulent heat transfer.

[0030] For example, when When the parametric equations are optimized, they can be:

[0031] sin(2πx)·cos(2πy)·cos(2πz)+sin(2πy)·cos(2πx)·cos(2πz)+sin(2πz)·cos(2πx)·cos(2πy)=D, at this time the minimal surface periodic skeleton structure is a stepped surface structure;

[0032] when When the parametric equations are optimized, they can be:

[0033] cos(2πz)+cos(2πx)+cos(2πy)=D, at this time the minimal surface periodic skeleton structure is a porous spherical surface structure;

[0034] when When the parametric equations are optimized, they can be:

[0035] sin(2πx)·cos(2πy)+sin(2πz)·cos(2πx)+sin(2πy)·cos(2πz)=D, at this time the minimal surface periodic skeleton structure is a spiral surface structure;

[0036] when When the parametric equation can be optimized to: cos(2πx)·cos(2πy)·cos(2πz)+sin(2πx)·sin(2πy)·sin(2πz)=D, the minimal surface periodic skeleton structure is a grid-shaped surface structure.

[0037] when When the parametric equations are optimized, they can be:

[0038] cos(2πz)·sin(πx)·cos(πy)+cos(2πx)·sin(πy)·cos(πz)+cos(2πy)·sin(πz)·cos(πx)=D, at this time the minimal surface periodic skeleton structure is an “S” shaped surface structure;

[0039] when When the parametric equations are optimized, they can be:

[0040] sin(2πx)+sin(2πy)+sin(2πz)=D, at this time the minimal surface periodic skeleton structure is a porous interlaced surface structure;

[0041] when When the parametric equations are optimized, they can be:

[0042] cos(2πy)·cos(2πz)+cos(2πx)·cos(2πz)-cos(2πx)·cos(2πy)=D, at this time the minimal surface periodic skeleton structure is a cylindrical array surface structure;

[0043] when When the parametric equations are optimized, they can be: At this point, the minimal curved surface periodic skeleton structure is a vase-shaped curved surface structure.

[0044] when When the parametric equations are optimized, they can be:

[0045] cos(2πx)·cos(πy)·cos(2πz)-cos(2πy)·cos(πz)+cos(πx)·cos(πz)=D, at this time the minimal surface periodic skeleton structure is a pupil-shaped surface structure;

[0046] when When the parametric equations are optimized, they can be:

[0047] cos(πx)·cos(πy)·cos(πz)-cos(2πy)·cos(2πz)+cos(2πx)·cos(2πz)=D, at this time the minimal surface periodic skeleton structure is a spiral surface structure;

[0048] when When the parametric equations are optimized, they can be:

[0049] -cos(πy)·cos(πz)+cos(πx)·cos(2πz)+cos(2πx)·cos(πy)·cos(2πz)=D, at this time the minimal surface periodic skeleton structure is a candy-shaped surface structure;

[0050] when When the parametric equations are optimized, they can be:

[0051] cos(2πy)·sin(2πz)+cos(πx)·cos(πy)+cos(3πx)·sin(3πz)=D, at this time the minimal curved surface periodic skeleton structure is a wave cave type curved surface structure;

[0052] when When the parametric equations are optimized, they can be:

[0053] sin(3πy)+sin(2πy)·sin(2πz)-sin(4πx)=0.5, at this time the minimal curved surface periodic skeleton structure is a porous layered curved surface structure;

[0054] when When the parametric equations are optimized, they can be:

[0055] sin(2πx)·sin(πy)+sin(2πy)·sin(πz)+2·cos(πx)·cos(πy)·cos(πz)=D, at this time the minimal surface periodic skeleton structure is a rhombus-square arrangement surface structure;

[0056] when When the parametric equations are optimized, they can be:

[0057]

[0058] At this time, the minimal curved surface periodic skeleton structure is a multi-vortex type curved surface structure.

[0059] when When the parametric equations are optimized, they can be:

[0060] cos(2πz)+3cos(πx)+4cos(πx)·cos(πy)·cos(πz)=D, at this time the minimal surface periodic skeleton structure is a non-porous interconnected surface structure;

[0061] when When the parametric equations are optimized, they can be:

[0062] sin(2πx)·sin(2πy)+sin(2πy)·sin(2πz)+sin(2πx)·sin(2πz)=D, at this time the minimal curved surface periodic skeleton structure is a circular hole array type curved surface structure;

[0063] when When the parametric equations are optimized, they can be:

[0064] At this point, the minimal curved surface periodic skeleton structure is a gully-type curved surface structure;

[0065] when When the parametric equations are optimized, they can be: At this point, the minimal curved surface periodic skeleton structure is a crater-shaped curved surface structure;

[0066] when When the parametric equation can be optimized to: cos(3πy)·cos(4πz)+cos(2πy)+2cos(πx)·cos(2πy)=D, the minimal surface periodic skeleton structure is a wave-shaped surface structure.

[0067] Furthermore, the minimal curved surface periodic skeleton structure is not limited to the specific examples mentioned above, and its parameters can be adjusted and optimized according to the heat flux density distribution and fluid flow characteristics.

[0068] Furthermore, it can be understood that the parametric equations of the minimal surface-type periodic skeleton structure can be constructed by linearly superimposing at least two basic parametric equations to form a minimal surface-type periodic skeleton structure that possesses the surface characteristics of each basic parametric equation; the parametric equations of the minimal surface-type periodic skeleton structure are constructed by linearly superimposing α, β, γ and By adjusting and controlling the scaling size and phase offset of the periodic skeleton structure in the x, y, and z directions, a minimal curved surface periodic skeleton structure that matches the heat transfer space size and heat distribution characteristics can be formed.

[0069] Furthermore, the minimal surface-type periodic skeleton structure constructed by linear superposition of the basic parametric equations specifically includes one or more of the following: "X"-shaped porous surface structure, interlocking porous surface structure, petal-shaped surface structure, rounded rectangular porous surface structure, rhomboid porous surface structure, elliptical interconnected surface knot, peanut-shaped porous surface structure, twisted corrugated surface structure, and clover-shaped surface structure.

[0070] The second objective of this invention is to provide an application of a heat dissipation substrate with a composite enhanced heat transfer structure in a heat dissipation device for electronic devices. The heat dissipation device specifically includes: a heat dissipation substrate, a flow divider, a cover plate, and a radiator connector; the cover plate is equipped with radiator connectors for the inflow and outflow of cooling fluid, and a cavity is formed on the side of the cover plate facing the flow divider to support the heat dissipation substrate and the flow divider. The flow divider is located above the heat dissipation substrate, and a heat exchange cavity is formed on the side of the flow divider facing the heat dissipation substrate. A heat exchange chamber is formed between the bottom plate of the heat dissipation substrate and the heat exchange cavity.

[0071] Furthermore, the heat dissipation device is divided into a cold plate type heat dissipation device and a cover plate type heat dissipation device; the cold plate type heat dissipation device is applied to packaged chips or bare die chips. In the cold plate type heat dissipation device, the cover plate is set as a heat dissipation cover plate. The cold plate type heat dissipation device includes a heat sink connector, a heat dissipation cover plate, a distribution plate, a heat dissipation substrate, and a motherboard. The motherboard is provided with chip carrier mounting holes. The motherboard is used to carry the chip. The heat dissipation cover plate is provided with fixing mounting holes corresponding to the chip carrier mounting holes. The bottom surface of the heat dissipation substrate is tightly attached to the chip through the fastening connection between the fixing mounting holes of the chip carrier mounting holes.

[0072] Furthermore, the cover-type heat dissipation device is applied to a die chip. The cover is configured as a die chip cover. The cover-type heat dissipation device includes a heat sink connector, a die chip cover, a distribution plate, a heat dissipation substrate, and a core motherboard. The core motherboard is used to support the die chip. The cover-type heat dissipation device is directly installed on top of the die chip. By applying a fastening connection between the bottom surface of the heat dissipation substrate and the die chip and / or between the die chip cover and the core motherboard, the bottom surface of the heat dissipation substrate and the die chip are tightly attached.

[0073] Furthermore, the heat exchange cavity is provided with several baffles arranged in parallel and spaced apart and connected end to end in sequence. The connection between two adjacent baffles is connected to the side wall of the heat exchange cavity, so that a flow channel is formed between two adjacent baffles. The flow channel includes a branch flow channel and a collection flow channel. The opening of the branch flow channel faces the branch flow cavity, and the opening of the collection flow channel faces the collection flow cavity.

[0074] Furthermore, the diversion channel and the collection channel are arranged adjacent to each other. After the cooling working fluid flows into the diversion cavity, it flows from the diversion channel into the heat exchange chamber to exchange heat, and then flows into the collection cavity through the collection channel and out.

[0075] Furthermore, the baffle is specifically a combination of one or more of the following structures: multi-segment structure, tangent structure, cotangent structure, sine structure, and cosine structure.

[0076] Furthermore, in application scenarios with high integration requirements, it is preferable not to install a heat dissipation plate to improve the compactness of the heat dissipation device.

[0077] Furthermore, the lower surface of the baffle inside the heat dissipation device's distribution plate is the upper base surface; in applications with compact space or high requirements for structural integration, the distribution plate is omitted, and the side of the cover plate cavity facing the heat dissipation substrate is the upper base surface; the distances between the top surface of the micro-rib structure and the top surface of the porous skeleton and the upper base surface are H1 and H2, respectively, and there are several possible settings:

[0078] When H1 = H2 > 0, the microrib structure is flush with the porous skeleton and has a certain gap with the upper base surface; when H1 > H2 > 0, the microrib structure is lower than the porous skeleton and has a certain gap with the upper base surface; when H1 > H2 = 0, the microrib structure has a certain gap with the upper base surface, and the upper surface of the porous skeleton is flush with the upper base surface; when H2 > H1 > 0, the microrib structure is higher than the porous skeleton and has a certain gap with the upper base surface; when H2 > H1 = 0, the upper surface of the microrib structure is flush with the upper base surface, and the porous skeleton has a certain gap with the upper base surface; when H1 = H2 = 0, the upper surfaces of both the microrib structure and the porous skeleton are flush with the upper base surface.

[0079] Furthermore, the radiator connector for the inflow of the cooling medium is the first radiator connector, and the radiator connector for the outflow of the cooling medium is the second radiator connector.

[0080] Furthermore, the working principle of the heat dissipation device is as follows: the low-temperature cooling medium (cooling fluid) enters the heat exchange chamber composed of the heat dissipation substrate, the flow divider and the cover plate through the first heat sink joint to exchange heat, and takes away the heat conducted by the high-temperature chip to the composite enhanced heat transfer structure, and then discharges to the external circulation pipeline through the second heat sink joint.

[0081] This invention relates to a heat dissipation substrate with a composite enhanced heat transfer structure and its application in heat dissipation devices for electronic devices. The substrate and micro-rib structure are integrated, with a porous framework filling the spaces between the micro-rib structures. The heat dissipation devices for electronic devices include cold plate type heat dissipation devices and cover plate type heat dissipation devices. The basic structure of the cold plate type heat dissipation device consists of: a heat sink connector, a heat dissipation cover plate, a flow distribution plate, a heat dissipation substrate, and a main board. The basic structure of the cover plate type heat dissipation device consists of: a heat sink connector, a chip cover plate, a flow distribution plate, a heat dissipation substrate, and a core main board. Compared with the prior art, this invention designs a composite porous framework and micro-rib structure, which can synergistically increase the heat exchange area, optimize fluid flow to improve heat exchange efficiency, avoid local hot spots and flow dead zones, and flexibly adapt to different heat dissipation requirements, ensuring continuous and efficient heat dissipation of the chip under high power.

[0082] Compared with the prior art, the beneficial effects of the present invention are:

[0083] 1) This invention provides a heat dissipation substrate with a composite enhanced heat transfer structure and its application in heat dissipation devices for electronic devices. The porous skeleton maximizes the heat transfer area, and the porous structure significantly increases the contact area between the heat sink and the coolant, greatly enhancing the convective heat transfer effect and quickly removing the high-density heat generated by chips, power modules, etc. Furthermore, it optimizes the fluid flow state; when the coolant flows through the porous skeleton, it forms a complex turbulent flow state, breaking the laminar boundary layer on the surface of the traditional heat sink, reducing thermal resistance, and further improving the heat transfer rate.

[0084] 2) This invention provides a heat dissipation substrate with a composite enhanced heat transfer structure and its application in heat dissipation devices for electronic devices. By combining the porous skeleton with the micro-rib structure, the synergistic effect of efficient heat conduction of the micro-rib structure and optimized fluid flow of the porous skeleton is achieved. This increases the heat exchange area and avoids the flow dead zone of the cooling medium in the gap between the micro-ribs, significantly improving the overall heat exchange efficiency and heat flow uniformity.

[0085] 3) This invention provides a heat dissipation substrate with a composite enhanced heat transfer structure and its application in heat dissipation devices for electronic devices. The porous skeleton can adopt various structural forms such as granular, wire mesh, foam or periodic geometry. The micro-rib structure can also be flexibly designed into different shapes and arrangements according to heat flux density and process requirements, which has good customizability and adaptability and can meet the heat dissipation requirements of chips with different power.

[0086] 4) This invention provides a heat dissipation substrate with a composite enhanced heat transfer structure and its application in heat dissipation devices for electronic devices. By combining a shunt plate and a cover plate structure, two types of high-efficiency heat dissipation devices, namely cold plate type and cover plate type, are formed, which improves the uniformity of fluid distribution, ensures that the chip can continuously and efficiently dissipate heat under high power operation, and effectively prevents the accumulation of local hot spots. Attached Figure Description

[0087] Figure 1 A schematic diagram of a periodic geometric porous skeleton heat dissipation substrate structure;

[0088] Figure 2 This is a schematic diagram of a granular porous skeleton heat dissipation substrate structure.

[0089] Figure 3 This is a schematic diagram of a wire mesh porous skeleton heat dissipation substrate structure.

[0090] Figure 4 A schematic diagram of a foam-type porous skeleton heat dissipation substrate structure;

[0091] Figure 5 This is a schematic diagram of the surface microrib structure in the present invention, wherein a is a rib and b is a rib column;

[0092] Figure 6 This is a schematic diagram of the shape of the frame-type periodic skeleton structure in this invention;

[0093] Figure 7 This is a schematic diagram of the shape of the plate frame periodic skeleton structure in this invention;

[0094] Figure 8 This is a schematic diagram of the shape of the minimal curved surface periodic skeleton structure in this invention;

[0095] Figure 9 This is a schematic diagram of the superimposed minimal curved surface periodic skeleton structure in this invention;

[0096] Figure 10 This is a schematic diagram of the cold plate type and the cover plate type in this invention, where a is the cold plate type and b is the cover plate type;

[0097] Figure 11 This is a schematic diagram of the flow divider structure in this invention, where a is the side of the flow divider facing the current collecting cavity, and b is the side of the flow divider facing the heat dissipation substrate.

[0098] Figure 12 This is a schematic diagram of the cold plate heat dissipation structure in this invention;

[0099] Figure 13 This is a schematic diagram of the heat dissipation cover plate structure in a cold plate heat dissipation structure, where a is the side of the heat dissipation cover plate away from the heat dissipation substrate, and b is the side of the heat dissipation cover plate facing the heat dissipation substrate.

[0100] Figure 14 This is a schematic diagram of the motherboard structure in a cold plate heat dissipation structure.

[0101] Figure 15 This is a schematic diagram of the cover plate heat dissipation structure in this invention;

[0102] Figure 16 This is a schematic diagram of the chip cover structure in a cover-type heat dissipation structure, where a is a schematic diagram of the upper surface of the chip cover and b is a schematic diagram of the lower surface of the chip cover.

[0103] Figure 17 This is a schematic diagram of the core motherboard structure in a cover-type heat dissipation structure.

[0104] Figure 18 This is a schematic diagram of the radiator connector structure in this invention, where a is the first radiator connector and b is the second radiator connector.

[0105] Figure 19 This is a schematic diagram showing the distance between the microrib structure, porous skeleton, and the upper base surface in this invention;

[0106] Figure 20 This is a schematic diagram of the heat dissipation principle of the heat dissipation structure in this invention;

[0107] Figure label:

[0108] 1. Heat dissipation substrate; 101. Base plate; 102. Micro-rib structure; 103. Porous skeleton; 2. Flow divider plate; 201. Heat exchange cavity; 202. Baffle; 203. Flow divider channel; 204. Flow collector channel; 205. Flow divider cavity; 206. Flow collector cavity; 207. Lower surface of baffle; 3. Cover plate; 31. Heat dissipation cover plate; 311. First working fluid flow port; 3111. First working fluid inlet; 3112. First working fluid flow port. 312. Fixed mounting hole; 32. Chip cover plate; 321. Second working fluid flow port; 3211. Second working fluid inlet; 3212. Second working fluid outlet; 4. Heat sink connector; 41. First heat sink connector; 42. Second heat sink connector; 411. Connector structure; 412. Bottom surface structure; 51. Main board; 511. Chip; 512. Chip carrier board mounting hole; 52. Core main board; 521. Chip die. Detailed Implementation

[0109] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. The accompanying drawings provided are for illustrating the principles and structural relationships of the present invention. The content shown in the drawings is illustrative and does not necessarily correspond completely to actual products. The shapes, proportions, positions, dimensions, and other parameters of the components in the drawings are only used to help understand the technical solutions of the present invention. In actual applications, they can be flexibly adjusted and optimized according to different installation spaces, process conditions, and performance requirements. Those skilled in the art, after reading this specification, can make corresponding modifications to the structural form, proportional parameters, material selection, or manufacturing process, and these modifications do not affect the essence of the present invention.

[0110] For clarity, the spatial orientations, positions, and quantitative relationships mentioned in this invention should be understood as relative relationships, rather than limitations on absolute positions or quantities. Regarding terminology, unless otherwise specified, terms such as "installation," "connection," "linking," "connection," and "setting" used in this invention should be interpreted broadly; they can indicate direct relationships or relationships indirectly achieved through intermediate components or media; they can be permanent fixed connections or detachable assemblies; they can be integral structures or combinations of multiple components; they can indicate the transmission relationship of fluids, gases, electrical signals, or information, not limited to the connection of physical channels; they can indicate the formation, arrangement, configuration, or functional arrangement of components, not limited to the existence of independent components. Furthermore, in the description of this invention, terms such as "first" and "second" are used only to distinguish different technical features or elements, and do not represent limitations on their order or quantity. Similarly, the term "comprising" indicates non-exclusive inclusion, meaning that the technical solution includes not only the listed elements but also other elements not explicitly listed, or elements inherent to the solution.

[0111] It should be noted that, unless otherwise specified, several parameters, performance indicators, or process conditions of this invention can be selected according to actual needs and application environment. For example, the type, strength grade, and surface treatment method of the materials used can be replaced according to manufacturing costs, environmental requirements, or service life; the shape, size, quantity, or arrangement of the components can also be flexibly adjusted according to different installation conditions or heat dissipation requirements.

[0112] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0113] Example

[0114] like Figures 1-5As shown, a heat dissipation substrate with a composite enhanced heat transfer structure includes an integrally designed base plate 101 and a micro-rib structure 102. The micro-rib structure 102 is located on the upper surface of the base plate 101, and the porous skeleton 103 is filled between the micro-rib structures 102. The base plate 101, the micro-rib structure 102 and the porous skeleton 103 together constitute the heat dissipation substrate 1.

[0115] The micro-rib structure 102 of the heat dissipation substrate 1 is specifically one or more of the structure of rib 1021 or rib post 1022.

[0116] The structure of the heat dissipation substrate 1 can be adapted to suit the size and installation position of different electronic devices. These electronic devices include one or more of the following: CPU, GPU, TPU, FPGA, ASIC, laser chip, network communication chip, RF chip, image sensor chip, and other high heat flux electronic chips.

[0117] The ribs 1021 are classified by shape into one or more types, namely straight ribs and wavy ribs. The straight ribs are ribs that extend in a straight line perpendicular to the wall along the length of the channel. The wavy ribs are ribs that extend in a wavy, curved shape along the length of the channel. The shape of the wavy ribs includes square waves, trapezoidal waves, triangular waves, and sine waves. The organization of the wavy ribs includes arrays and adjacent symmetrical arrangements. The amplitude and the width of the crests and troughs of the wavy ribs are designed and adjusted according to the local heat flux density.

[0118] The ribs 1022 are arranged in a straight line or staggered pattern. In the straight line pattern, the ribs are arranged in a straight line along a set reference direction, with the center lines of adjacent columns and rows aligned, forming a regular rectangular array. In the staggered pattern, the ribs are arranged in rows at equal intervals, with the gaps between the ribs in the next row aligned with those in the previous row, and the overall distribution is staggered. The shape of the ribs is selected from one or more of the following: rectangle, trapezoid, parallelogram, triangle, circle, or ellipse. The shape of the ribs is selected from one or more of the following: column, cone, frustum, hemisphere, or umbrella shape.

[0119] The porous skeleton 103 is selected from one or more of the following: particulate skeleton structure, wire mesh skeleton structure, foam skeleton structure and periodic geometric skeleton structure prepared by sintering, melt foaming and / or additive manufacturing.

[0120] The porous skeleton 103 is made of one or more of the following materials: metal, carbon, ceramic, and other high thermal conductivity materials.

[0121] The granular porous framework structure is a porous medium entity formed by stacking several particles of the same or different sizes. The particles form interconnected pores as fluid flow paths. The particle shape is irregular or regular geometric shape. The particle size and porosity of particles in different horizontal regions or vertical heights need to be matched with local heat density and fluid flow state.

[0122] The wire mesh porous skeleton structure is a porous medium entity formed by stacking several layers of wires or wire meshes with the same or different wire diameters. The wires or wire meshes form interconnected pores as fluid flow paths. The wire diameter, number of layers and porosity of different horizontal regions or vertical heights need to be matched with the local heat density and fluid flow state.

[0123] The foam-type porous skeleton structure is a porous medium entity composed of randomly distributed and three-dimensionally connected foam-like ribs. The pores formed between the foam-like ribs serve as fluid flow paths. The porosity of different horizontal regions or vertical heights needs to match the local heat density and fluid flow state.

[0124] The periodic geometric porous skeleton structure specifically includes one or more of the following: frame-type periodic skeleton structure, plate-frame-type periodic skeleton structure, and minimal curved surface-type periodic skeleton structure.

[0125] like Figure 6 As shown, the frame-type periodic skeleton structure includes one or more of the following: a cube frame, a face-diagonal cube, a truncated cube, a cube truss, a star truss, an octagonal truss, an octahedron, a truncated octahedron, and a cube wireframe;

[0126] like Figure 7 As shown, the plate-frame periodic skeleton structure includes one or more of the following: star-shaped tetrahedron, concave regular icosahedron, cubic cross plate frame, concave octahedron, and icosahedron;

[0127] like Figure 8 As shown, the internal fluid channels of the minimal curved periodic skeleton structure are composed of three-dimensional periodic surfaces, which satisfy parametric equations:

[0128]

[0129] in

[0130] X n Y n Z n , (n = 1, 2, 3) are functions of the x, y, and z coordinates, p i q i r i, (i = 1, 2, 3) are the powers of the parametric equations respectively, A, B, and C are the weight coefficients of each term, D ∈ [k1, k2], where -3 < k1 < k2 < 3. When D takes values within the range of [k1, k2], the set of all solutions of the parametric equation constitutes the solid part of the minimal surface type periodic skeleton structure, and the rest forms interconnected pores as fluid flow paths;

[0131] α, β, and γ are the constants related to the dimensions of the minimal surface type periodic skeleton structure in the x, y, and z directions respectively; is the phase of the parametric equation, which is used to determine the specific shape of the surface, the reference position, and the starting distribution of the periodic structure;

[0132] When A, B, and C are equal, the minimal surface type periodic skeleton structure is isotropic and applicable to uniform heat dissipation conditions; when A, B, and C are not all equal, the minimal surface type periodic skeleton structure is anisotropic and conducts heat dissipation enhancement in a specific direction;

[0133] For the above parametric equation, according to the physical meanings of each parameter, with the goal of optimizing the fluid heat transfer path, reducing the thermal resistance of the heat transfer interface, and enhancing turbulent heat transfer, the constructed minimal surface type periodic skeleton structure includes: one or more of a stepped surface structure, a porous spherical surface structure, a spiral surface structure, a grid surface structure, an "S" - shaped surface structure, a porous staggered surface structure, a cylindrical array surface structure, a vase - shaped surface structure, a pupil - like surface structure, a spiral - like surface structure, a candy - shaped surface structure, a wave - like cave surface structure, a porous laminated surface structure, a rhombus - grid arranged surface structure, a multi - vortex hole surface structure, a different - hole interconnected surface structure, a circular - hole array surface structure, a gully - shaped surface structure, a crater - shaped surface structure, and a rhombic grid surface structure;

[0134] The above parametric equation is used to generate a three - dimensional channel network with a periodic minimal surface skeleton, and the topological continuity and node curvature distribution of this network control the fluid heat transfer path and reduce the thermal resistance;

[0135] The selection of the above parameters makes the minimal surface type periodic skeleton structure form a continuously interconnected fluid network on any cross - section, so as to reduce the thermal resistance of the heat transfer interface and enhance turbulent heat transfer;

[0136] For example, when is, the parametric equation can be optimized as:

[0137] sin(2πx)·cos(2πy)·cos(2πz)+sin(2πy)·cos(2πx)·cos(2πz)+sin(2πz)·cos(2πx)·cos(2πy) = D. At this time, the minimal surface type periodic skeleton structure is a stepped surface structure;

[0138] when When the parametric equations are optimized, they can be:

[0139] cos(2πz)+cos(2πx)+cos(2πy)=D, at this time the minimal surface periodic skeleton structure is a porous spherical surface structure;

[0140] when When the parametric equations are optimized, they can be:

[0141] sin(2πx)·cos(2πy)+sin(2πz)·cos(2πx)+sin(2πy)·cos(2πz)=D, at this time the minimal surface periodic skeleton structure is a spiral surface structure;

[0142] when When the parametric equation can be optimized to: cos(2πx)·cos(2πy)·cos(2πz)+sin(2πx)·sin(2πy)·sin(2πz)=D, the minimal surface periodic skeleton structure is a grid-shaped surface structure.

[0143] when When the parametric equations are optimized, they can be:

[0144] cos(2πz)·sin(πx)·cos(πy)+cos(2πx)·sin(πy)·cos(πz)+cos(2πy)·sin(πz)·cos(πx)=D, at this time the minimal surface periodic skeleton structure is an “S” shaped surface structure;

[0145] when When the parametric equations are optimized, they can be:

[0146] sin(2πx)+sin(2πy)+sin(2πz)=D, at this time the minimal surface periodic skeleton structure is a porous interlaced surface structure;

[0147] when When the parametric equations are optimized, they can be:

[0148] cos(2πy)·cos(2πz)+cos(2πx)·cos(2πz)-cos(2πx)·cos(2πy)=D, at this time the minimal surface periodic skeleton structure is a cylindrical array surface structure;

[0149] when When the parametric equation is optimized, it can be expressed as: cos(2πz) + cos(2πx) + 2· At this point, the minimal curved surface periodic skeleton structure is a vase-shaped curved surface structure.

[0150] when When the parametric equations are optimized, they can be:

[0151] cos(2πx)·cos(πy)·cos(2πz)-cos(2πy)·cos(πz)+cos(πx)·cos(πz)=D, at this time the minimal surface periodic skeleton structure is a pupil-shaped surface structure;

[0152] when When the parametric equations are optimized, they can be:

[0153] cos(πx)·cos(πy)·cos(πz)-cos(2πy)·cos(2πz)+cos(2πx)·cos(2πz)=D, at this time the minimal surface periodic skeleton structure is a spiral surface structure;

[0154] when When the parametric equations are optimized, they can be:

[0155] -cos(πy)·cos(πz)+cos(πx)·cos(2πz)+cos(2πx)·cos(πy)·cos(2πz)=D, at this time the minimal surface periodic skeleton structure is a candy-shaped surface structure;

[0156] when When the parametric equations are optimized, they can be:

[0157] cos(2πy)·sin(2πz)+cos(πx)·cos(πy)+cos(3πx)·sin(3πz)=D, at this time the minimal curved surface periodic skeleton structure is a wave cave type curved surface structure;

[0158] when When the parametric equations are optimized, they can be:

[0159] sin(3πy)+sin(2πy)·sin(2πz)-sin(4πx)=0.5, at this time the minimal curved surface periodic skeleton structure is a porous layered curved surface structure;

[0160] when When the parametric equations are optimized, they can be:

[0161] sin(2πx)·sin(πy)+sin(2πy)·sin(πz)+2·cos(πx)·cos(πy)·cos(πz)=D, at this time the minimal surface periodic skeleton structure is a rhombus-square arrangement surface structure;

[0162] when When the parametric equations are optimized, they can be:

[0163]

[0164] At this time, the minimal curved surface periodic skeleton structure is a multi-vortex type curved surface structure.

[0165] when When the parametric equations are optimized, they can be:

[0166] cos(2πz)+3cos(πx)+4cos(πx)·cos(πy)·cos(πz)=D, at this time the minimal surface periodic skeleton structure is a non-porous interconnected surface structure;

[0167] when When the parametric equations are optimized, they can be:

[0168] sin(2πx)·sin(2πy)+sin(2πy)·sin(2πz)+sin(2πx)·sin(2πz)=D, at this time the minimal curved surface periodic skeleton structure is a circular hole array type curved surface structure;

[0169] when When the parametric equations are optimized, they can be:

[0170] At this point, the minimal curved surface periodic skeleton structure is a gully-type curved surface structure;

[0171] when When the parametric equations are optimized, they can be: At this point, the minimal curved surface periodic skeleton structure is a crater-shaped curved surface structure;

[0172] when When the parametric equation can be optimized to: cos(3πy)·cos(4πz)+cos(2πy)+2cos(πx)·cos(2πy)=D, the minimal surface periodic skeleton structure is a wave-shaped surface structure.

[0173] The extremely small curved periodic skeleton structure is not limited to the specific examples mentioned above, and its parameters can be adjusted and optimized according to the heat flux density distribution and fluid flow characteristics.

[0174] It is understood that the parametric equations of the minimal surface periodic skeleton structure can be constructed by linearly superimposing at least two basic parametric equations, thus forming a minimal surface periodic skeleton structure that possesses the surface characteristics of each basic parametric equation; the parametric equations of the minimal surface periodic skeleton structure are constructed by linearly superimposing α, β, γ and By adjusting and controlling the scaling size and phase offset of the periodic skeleton structure in the x, y, and z directions, a minimal curved surface periodic skeleton structure that matches the heat transfer space size and heat distribution characteristics can be formed.

[0175] like Figure 9 As shown, the minimal surface-type periodic skeleton structure constructed by linear superposition of the basic parameter equations specifically includes one or more of the following: "X"-shaped porous surface structure, interlocking porous surface structure, petal-shaped surface structure, rounded rectangular porous surface structure, rhombic porous surface structure, elliptical interconnected surface knot, peanut-shaped porous surface structure, twisted corrugated surface structure, and clover-shaped surface structure.

[0176] Based on the above-mentioned composite enhanced heat transfer structure, this embodiment proposes an application of a heat dissipation substrate with a composite enhanced heat transfer structure in heat dissipation devices for electronic devices, such as... Figures 10-18 As shown, the heat dissipation device specifically includes: a heat dissipation base plate 1, a flow divider plate 2, a cover plate 3, and a radiator connector 4; the cover plate 3 is equipped with a radiator connector 4 for separately flowing in and out of the cooling working fluid, and a cavity is opened on the side of the cover plate 3 facing the flow divider plate 2 to support the heat dissipation base plate 1 and the flow divider plate 2. The flow divider plate 2 is located above the heat dissipation base plate 1, and a heat exchange cavity 201 is provided on the side of the flow divider plate 2 facing the heat dissipation base plate 1. A heat exchange chamber is formed between the bottom plate 101 of the heat dissipation base plate 1 and the heat exchange cavity 201.

[0177] The heat dissipation device is divided into a cold plate type heat dissipation device and a cover plate type heat dissipation device. The cold plate type heat dissipation device is applied to packaged chips 511 or bare die chips 521. In the cold plate type heat dissipation device, the cover plate 3 is set as a heat dissipation cover plate 31. The cold plate type heat dissipation device includes a heat sink connector 4, a heat dissipation cover plate 31, a flow distribution plate 2, a heat dissipation substrate 1, and a main board 51. The main board 51 is provided with chip carrier mounting holes 512. The main board 51 is used to support the chip 511. The heat dissipation cover plate 31 is provided with fixing mounting holes 312 corresponding to the chip carrier mounting holes 512. The fixing mounting holes 312 of the chip carrier mounting holes 512 are connected by... A fastening connection ensures that the bottom surface of the heat dissipation substrate 1 is tightly attached to the chip 511. The cover-type heat dissipation device is applied to the chip die 521. The cover-type heat dissipation device includes a heat sink connector 4, a chip cover plate 32, a distribution plate 2, a heat dissipation substrate 1, and a core motherboard 52. The core motherboard 52 is used to support the chip die 521. The cover plate 3 is set in the form of a chip cover plate 32. The cover-type heat dissipation device is directly installed above the chip die 521. A fastening connection is applied between the bottom surface of the heat dissipation substrate 1 and the chip die 521 and / or between the chip cover plate 32 and the core motherboard 52 to ensure that the bottom surface of the heat dissipation substrate 1 is tightly attached to the chip die 521.

[0178] The heat exchange cavity 201 of the flow divider 2 is provided with a plurality of baffles 202 arranged in parallel and connected end to end in sequence. The connection between two adjacent baffles 202 is connected to the side wall of the heat exchange cavity 201, so that a flow channel is formed between two adjacent baffles 202. The flow channel includes a flow divider 203 and a flow collector 204. The opening of the flow divider 203 faces the flow divider cavity 205, and the opening of the flow collector 204 faces the flow collector cavity 206.

[0179] The diversion channel 203 and the collection channel 204 are arranged adjacent to each other. After the cooling working fluid flows into the diversion cavity 205, it flows into the heat exchange chamber through the diversion channel 203 to exchange heat, and then flows into the collection cavity 206 through the collection channel 204 before flowing out.

[0180] The baffle 202 is specifically a combination of one or more of the following structures: multi-segment structure, tangent structure, cotangent structure, sine structure, and cosine structure.

[0181] The radiator connector 4 is provided with a connector structure 411 for pipe connection, and the bottom structure 412 of the radiator connector 4 is used for connector installation. The radiator connector 4 includes a first radiator connector 41 and a second radiator connector 42, which are used for the input and output of the cooling working fluid, respectively.

[0182] The first working fluid flow port 311 includes a first working fluid inlet 3111 and a first working fluid outlet 3112, and the second working fluid flow port 321 includes a second working fluid inlet 3211 and a second working fluid outlet 3212. The first radiator connector 41 is connected to the first working fluid inlet 3111 or the second working fluid inlet 3211 to cool the input of the working fluid, and the second radiator connector 42 is connected to the first working fluid outlet 3112 or the second working fluid outlet 3212 to cool the output of the working fluid.

[0183] like Figure 19 As shown, the lower surface 207 of the inner baffle of the heat dissipation device's diversion plate 2 is the upper base surface; in applications with compact space or high requirements for structural integration, the diversion plate 2 is omitted, and the side of the cover plate 3 facing the heat dissipation substrate 1 is the upper base surface; the distances between the top surface of the micro-rib structure 102 and the top surface of the porous skeleton 103 and the upper base surface are H1 and H2, respectively, and there are several possible configuration methods:

[0184] When H1 = H2 > 0, the microrib structure 102 and the porous skeleton 103 are at the same height and have a certain gap with the upper base surface; when H1 > H2 > 0, the microrib structure 102 is lower than the porous skeleton 103 and has a certain gap with the upper base surface; when H1 > H2 = 0, the microrib structure 102 has a certain gap with the upper base surface, and the upper surface of the porous skeleton 103 is at the same height as the upper base surface; when H2 > H1 > 0, the microrib structure 102 is higher than the porous skeleton 103 and has a certain gap with the upper base surface; when H2 > H1 = 0, the upper surface of the microrib structure 102 is at the same height as the upper base surface, and the porous skeleton 103 has a certain gap with the upper base surface; when H1 = H2 = 0, the upper surfaces of the microrib structure 102 and the porous skeleton 103 are at the same height as the upper base surface.

[0185] like Figure 20 As shown, a heat dissipation substrate with a composite enhanced heat transfer structure and its application in heat dissipation devices for electronic devices are disclosed. The working principle of the heat dissipation structure is as follows: a low-temperature cooling medium enters the heat exchange chamber composed of the heat dissipation substrate, the flow divider and the cover plate through the first heat sink connector 41 to exchange heat, taking away the heat conducted by the high-temperature chip to the composite enhanced heat transfer structure, and then discharges to the external circulation pipeline through the second heat sink connector 42.

[0186] In summary, this invention first proposes a composite structure of a porous framework and microribs to maximize the heat transfer area. The porous structure significantly increases the contact area between the heat sink and the coolant, greatly enhancing convective heat transfer and rapidly removing high-density heat generated by chips, power modules, etc. Furthermore, it optimizes fluid flow; when the coolant flows through the porous framework, it forms a complex turbulent flow state, breaking the laminar boundary layer on the surface of traditional heat sinks, reducing thermal resistance, and further improving the heat transfer rate. By combining the porous framework with the microrib structure, the synergistic effect of the efficient heat conduction of the microrib structure and the optimized fluid flow of the porous framework is achieved. This increases the heat transfer area while avoiding dead zones in the coolant flow within the microrib gaps, significantly improving overall heat transfer efficiency and heat flow uniformity.

[0187] The porous framework can adopt one or more of various structural forms, such as granular, wire mesh, foam, or periodic geometry. The microrib structure can also be flexibly designed into different shapes and arrangements according to heat flux density and process requirements, possessing good customizability and adaptability, and can meet the heat dissipation requirements of chips with different power levels. Combining the shunt plate and cover plate structure, two efficient heat dissipation devices are formed: a cold plate type and a cover plate type, which improves the uniformity of fluid distribution, ensures continuous and efficient heat dissipation of the chip under high power operation, and effectively prevents the accumulation of local hot spots.

[0188] The above description of the embodiments is provided to enable those skilled in the art to understand and use the invention. It will be apparent to those skilled in the art that various modifications can be made to these embodiments, and the general principles described herein can be applied to other embodiments without inventive effort. Therefore, the present invention is not limited to the above embodiments, and any improvements and modifications made by those skilled in the art based on the disclosure of the present invention without departing from the scope of the invention should be within the protection scope of the present invention.

Claims

1. A heat dissipation substrate with a composite enhanced heat transfer structure, characterized in that, The heat dissipation substrate (1) includes a base plate (101) with an integral structure and a micro-rib structure (102); the heat dissipation substrate (1) also includes a porous skeleton (103). The microrib structure (102) is located on the upper surface of the base plate (101), and the porous skeleton (103) fills the spaces between the microrib structures (102).

2. A heat dissipation substrate with a composite enhanced heat transfer structure according to claim 1, characterized in that, The microrib structure (102) is one or more of the structure of rib (1021) or rib column (1022).

3. A heat dissipation substrate with a composite enhanced heat transfer structure according to claim 1, characterized in that, The porous skeleton (103) is selected from one or more of the following: granular porous skeleton structure, wire mesh porous skeleton structure, foam porous skeleton structure and periodic geometric porous skeleton structure. The porous framework (103) is prepared by sintering, melt foaming and / or additive manufacturing.

4. A heat dissipation substrate with a composite enhanced heat transfer structure according to claim 3, characterized in that, The granular porous framework structure is a porous medium entity formed by stacking several particles of the same or different sizes. The particles form interconnected pores as fluid flow paths. The particle shape is irregular or regular geometric shape. The particle size and porosity of different horizontal regions or vertical heights are matched with local heat density and fluid flow state. The wire mesh porous skeleton structure is a porous medium entity formed by stacking several layers of wires or wire meshes with the same or different diameters. The wires or wire meshes form interconnected pores as fluid flow paths. The wire diameter, number of layers and porosity of different horizontal regions or vertical heights match the local heat density and fluid flow state.

5. A heat dissipation substrate with a composite enhanced heat transfer structure according to claim 3, characterized in that, The foam-type porous skeleton structure is a porous medium entity composed of randomly distributed and three-dimensionally connected foam-like ribs. The pores formed between the foam-like ribs serve as fluid flow paths, and the porosity of different horizontal regions or vertical heights matches the local heat density and fluid flow state.

6. A heat dissipation substrate with a composite enhanced heat transfer structure according to claim 3, characterized in that, The periodic geometric porous skeleton structure specifically includes one or more of the following: frame-type periodic skeleton structure, plate-frame-type periodic skeleton structure, and minimal curved surface-type periodic skeleton structure. The frame-type periodic skeleton structure includes one or more of the following: a cube frame, a face-diagonal cube, a truncated cube, a cube truss, a star truss, an octagonal truss, an octahedron, a truncated octahedron, and a cube wireframe; The plate-frame periodic skeleton structure includes one or more of the following: star-shaped tetrahedron, concave regular icosahedron, cubic cross plate frame, concave octahedron, and icosahedron. The internal fluid channels of the minimal curved periodic skeleton structure are composed of three-dimensional periodic surfaces, which satisfy parametric equations: in, (n = 1, 2, 3); X n , Y n , Z n , (n = 1, 2, 3) is a function of the x coordinate, y coordinate, and z coordinate, p i , q i , r i , (i = 1, 2, 3) are the powers of the parametric equations respectively, A, B, and C are the weight coefficients of each term, D ∈ [k1, k2], where -3 < k1 < k2 < 3. When the D takes values within [k1, k2], the set of all solutions of the parametric equation constitutes the solid part of the minimal surface type periodic skeleton structure, and the remaining part forms interconnected pores as fluid flow paths; α, β, and γ are the size-related constants of the minimal surface periodic skeleton structure in the x, y, and z directions, respectively. The phase of the parametric equation is used to determine the specific shape of the surface, the reference position, and the initial distribution of the periodic structure; When A, B, and C are equal, the minimal curved surface periodic skeleton structure is isotropic and suitable for uniform heat dissipation conditions; when A, B, and C are not all equal, the minimal curved surface periodic skeleton structure is anisotropic and enhances heat dissipation in a specific direction. For the aforementioned parametric equations, the constructed minimal surface-type periodic skeleton structure includes one or more of the following: stepped surface structure, porous spherical surface structure, spiral surface structure, grid surface structure, "S" shaped surface structure, porous interlaced surface structure, cylindrical array surface structure, vase-shaped surface structure, pupil-shaped surface structure, spiral surface structure, candy-shaped surface structure, wave-shaped karst cave surface structure, porous layered surface structure, rhombus-grid arranged surface structure, multi-vortex surface structure, heterogeneous interconnected surface structure, circular hole array surface structure, ravine surface structure, crater surface structure, and rhombus grid surface structure; The parametric equations are used to generate a three-dimensional channel network with a periodic minimal surface skeleton. The topological continuity and node curvature distribution of the three-dimensional channel network control the fluid heat transfer path and reduce thermal resistance. The selection of parameters in the parametric equations enables the minimal curved periodic skeleton structure to form a continuous and interconnected fluid network on any cross section, thereby reducing the thermal resistance of the heat transfer interface and enhancing turbulent heat transfer.

7. A heat dissipation substrate with a composite enhanced heat transfer structure according to claim 6, characterized in that, The parametric equations of the minimal surface periodic skeleton structure are constructed by linearly superimposing at least two basic parametric equations to form a minimal surface periodic skeleton structure that combines the surface characteristics of each basic parametric equation. Specifically, it includes one or more of the following: "X" shaped porous surface structure, interlocking porous surface structure, petal-shaped surface structure, rounded rectangle porous surface structure, rhombic porous surface structure, elliptical interconnected surface knot, peanut-shaped porous surface structure, twisted wavy surface structure, and four-leaf clover-shaped surface structure. The parametric equations of the minimal curved periodic skeleton structure are obtained by applying α, β, γ, and The adjustment controls the scaling and phase shift of the periodic skeleton structure in the x, y, and z directions, forming a minimal curved surface periodic skeleton structure that matches the heat transfer space size and heat distribution characteristics.

8. The application of a heat dissipation substrate with a composite enhanced heat transfer structure as described in any one of claims 1-7 in a heat dissipation device for electronic devices, characterized in that, The heat dissipation device specifically includes: a heat dissipation base plate (1), a flow distribution plate (2), a cover plate (3), and a heat sink connector (4); The cover plate (3) is equipped with radiator connectors (4) for the inflow and outflow of cooling working fluid, respectively. A cavity is provided on the side of the cover plate (3) facing the flow divider (2) to support the heat dissipation substrate (1) and the flow divider (2). The flow divider (2) is located above the heat dissipation substrate (1). A heat exchange cavity (201) is provided on the side of the flow divider (2) facing the heat dissipation substrate (1). A heat exchange chamber is formed between the bottom plate (101) of the heat dissipation substrate (1) and the heat exchange cavity (201).

9. The application of a heat dissipation substrate with a composite enhanced heat transfer structure according to claim 8 in a heat dissipation device for electronic devices, characterized in that, The heat dissipation device is divided into a cold plate type heat dissipation device and a cover plate type heat dissipation device. The cold plate heat dissipation device is applied to packaged chips (511) or bare chips (521). In the cold plate heat dissipation device, the cover plate (3) is set as a heat dissipation cover plate (31). The cold plate heat dissipation device includes a heat sink connector (4), a heat dissipation cover plate (31), a flow divider (2), a heat dissipation substrate (1), and a main board (51). The main board (51) is provided with chip carrier mounting holes (512). The main board (51) is used to carry the chip (511). The heat dissipation cover plate (31) is provided with fixed mounting holes (312) corresponding to the chip carrier mounting holes (512). The bottom surface of the heat dissipation substrate (1) is tightly attached to the chip (511) through the fastening connection between the fixed mounting holes (312) of the chip carrier mounting holes (512). The cover plate heat dissipation device is applied to the chip die (521). The cover plate (3) is set in the form of a chip cover plate (32). The cover plate heat dissipation device includes a heat sink connector (4), a chip cover plate (32), a splitter plate (2), a heat dissipation substrate (1), and a core motherboard (52). The core motherboard (52) is used to support the chip die (521). The cover plate heat dissipation device is directly installed on top of the chip die (521). By applying a fastening connection between the bottom surface of the heat dissipation substrate (1) and the chip die (521) and / or between the chip cover plate (32) and the core motherboard (52), the bottom surface of the heat dissipation substrate (1) is tightly attached to the chip die (521).

10. The application of a heat dissipation substrate with a composite enhanced heat transfer structure according to claim 8 in a heat dissipation device for electronic devices, characterized in that, The lower surface (207) of the baffle in the diversion plate (2) of the heat dissipation device is the upper base surface; in application scenarios with compact space or high requirements for structural integration, the diversion plate (2) is omitted, and the side of the cover plate (3) facing the heat dissipation substrate (1) is the upper base surface; the distances between the top surface of the micro-rib structure (102) and the top surface of the porous skeleton (103) and the upper base surface are H1 and H2, respectively, and there are several ways to set them: When H1=H2>0, the micro-rib structure (102) is flush with the porous skeleton (103) and has a certain gap with the upper base surface; When H1>H2>0, the height of the microrib structure (102) is lower than that of the porous skeleton (103), and there are certain gaps between it and the upper base surface; When H1>H2=0, there is a certain gap between the microrib structure (102) and the upper base surface, and the upper surface of the porous skeleton (103) is flush with the upper base surface; When H2>H1>0, the height of the microrib structure (102) is higher than that of the porous skeleton (103), and there are different gaps between it and the upper base surface; When H2>H1=0, the upper surface of the microrib structure (102) is flush with the upper base surface, and the porous skeleton (103) has a certain gap with the upper base surface; When H1=H2=0, the upper surfaces of the micro-rib structure (102) and the porous skeleton (103) are flush with the upper base surface.

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