Controller of multi-partition electro-dimming glass

Abstract

The invention discloses a controller for multi-partition electro-dimming glass, which comprises an LIN (Local Interconnect Network) transceiver, an external microprocessor, an isolation power supply, a digital isolator, an internal microprocessor, a boost converter, a digital-to-analog converter, a square-wave-to-sine-wave converter and a plurality of drivers, the external microprocessor communicates with the internal microprocessor through the digital isolator, the boost converter converts 12V direct-current voltage of the whole vehicle into 160V direct-current voltage, and square-wave-to-sine-wave converts the 160V direct-current voltage into 110V alternating-current voltage and supplies power to the drivers. According to the invention, one controller can be used for simultaneously controlling the dimming glass of a plurality of subareas, so that the space and the cost in a vehicle are greatly saved.

Description

Technical Field

[0001] This invention relates to a controller, and more particularly to a controller for multi-zone electroluminescent glass, belonging to the field of control technology. Background Technology

[0002] Cars have become the primary mode of transportation for most families, and with technological advancements, many vehicles now use dimmable glass. Users can adjust the light transmittance of this glass to create a comfortable lighting environment. Currently, all car dimmable glass uses a single piece of glass for dimming, resulting in uniform light transmittance and a limited range of display effects.

[0003] To further refine the dimming zones of glass and allow users to freely adjust the light transmittance and dimming display effect of each area on the vehicle's dimming glass according to their preferences, dimming glass has begun to evolve towards multi-zone dimming. However, there is currently no controller on the market capable of simultaneously controlling multiple dimming zones of glass. Therefore, it is necessary to design a multi-zone dimming glass controller that allows a single controller to manage multiple dimming zones of glass at the same time. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a controller for multi-zone electroluminescent dimming glass, so that one controller can simultaneously control dimming glass with multiple dimming zones.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows: A controller for a multi-zone electroluminescent glass includes a LIN transceiver, an external microprocessor, an isolation power supply, a digital isolator, an internal microprocessor, a boost converter, a digital-to-analog converter, a square wave to sine wave converter, and several drivers. The external microprocessor is connected to one end of the LIN transceiver and the digital isolator, and the other end of the digital isolator is connected to the internal microprocessor. The external microprocessor communicates with the vehicle via the LIN transceiver and with the internal microprocessor via the digital isolator. The isolation power supply is connected to the external microprocessor. The boost converter, digital-to-analog converter, and square wave to sine wave converter are each connected to the internal microprocessor. One end of each driver is connected to the internal microprocessor, and the other end of each driver is connected to a dimming film of the multi-zone electroluminescent glass. The boost converter converts the vehicle's 12V DC voltage to 160V DC voltage, and the square wave to sine wave converter converts the 160V DC voltage to 110V AC voltage and supplies power to the drivers.

[0006] Furthermore, the isolated power supply includes transistor Q1, resistors R1-R9, capacitors C1-C8, an isolated flyback controller chip U1, diodes D1-D3, MOSFET M1, transformer T1, and current transformer chip U2. The base of transistor Q1 is connected to the input voltage PWR_ISO1_EN. The collector of transistor Q1 is connected to one end of resistor R1, one end of resistor R2, and pin 6 of the isolated flyback controller chip U1. The other end of resistor R1 is connected to one end of capacitor C1 and pin 5 of the isolated flyback controller chip U1, and is connected to the power supply PWR_ISO. Pin 4 of the isolated flyback controller chip U1 is connected to one end of resistor R3; pin 3 of the isolated flyback controller chip U1 is connected to one end of resistor R4; pin 1 of the isolated flyback controller chip U1 is connected to the source of MOSFET M1, one end of resistor R6, and one end of resistor R5; the other end of resistor R4 is connected to the gate of MOSFET M1; the other end of resistor R3 is connected to the drain of MOSFET M1, one end of capacitor C2, one end of capacitor C3, the anode of diode D2, and pin 1 of transformer T1; the other end of capacitor C2 is connected to the other end of resistor R5; diode D... The cathode of diode 2 is connected to the cathode of diode D1. The anode of diode D1 is connected to one end of resistor R7, one end of capacitor C4, and pin 2 of transformer T1, and connected to power supply PWR_IOS. The other end of capacitor C3 is connected to the other end of resistor R7. Pins 5 and 7 of transformer T1, one end of resistor R8, and the anode of diode D3 are connected. The other end of resistor R8 is connected to one end of capacitor C5. The other end of capacitor C5 is connected to the cathode of diode D3 and one end of resistor R9. The other end of resistor R9 is connected to one end of capacitor C6, one end of capacitor C7, and one end of capacitor C... One end of 8 is connected to and generates the signal 12V_ISO1. Pin 2 of the current transformer chip U2 is connected to the signal 12V_ISO1. Pin 3 of the current transformer chip U2 generates the signal 12V_ISO. The emitter of transistor Q1, the other end of resistor R2, pin 2 of the isolation flyback controller chip U1, the other end of capacitor C1, the other end of resistor R6, the other end of capacitor C4, pin 6 of transformer T1, pin 8 of transformer T1, the other end of capacitor C6, the other end of capacitor C7, the other end of capacitor C8, pin 1 and pin 4 of current transformer chip U2 are grounded.

[0007] Furthermore, the isolated power supply also includes resistor R10, resistor R11 and capacitor C9. One end of resistor R10 is connected to signal 12V_ISO1, and the other end of resistor R10 is connected to one end of resistor R11 and one end of capacitor C9 to generate signal ISO12V_MON. The other end of resistor R11 and the other end of capacitor C9 are grounded.

[0008] Furthermore, the isolated flyback controller chip U1 is a low-power isolated flyback controller of model LT8306, and the current transformer chip U2 is a current transformer chip of model L102.

[0009] Furthermore, the boost converter includes capacitors C10-C29, resistors R12-R29, transistor Q2, MOSFET controller chip U3, digital-to-analog converter chip U4, MOSFET M2, inductor L1, and diodes D4-D6. One end of capacitor C10, one end of capacitor C11, one end of capacitor C12, one end of resistor R12, pin 1 of MOSFET controller chip U3, and one end of inductor L1 are connected to signal 12V_ISO. The other end of resistor R12 is connected to pin 7 of MOSFET controller chip U3, one end of resistor R13, and the collector of transistor Q2. The base of transistor Q2 is connected to signal DCPWR_EN. Pin 9 of MOSFET controller chip U3 is connected to resistor M2. One end of R14 is connected; pin 10 of MOSFET controller chip U3 is connected to one end of capacitor C13; pin 3 of MOSFET controller chip U3 is connected to one end of capacitor C14 and one end of capacitor C15; the other end of capacitor C14 is connected to one end of resistor R15; the other end of resistor R15 is connected to the other end of capacitor C15, pin 2 of MOSFET controller chip U3, one end of resistor R29, one end of resistor R22, and one end of resistor R23; the VCC terminal of MOSFET controller chip U3 is connected to one end of capacitor C16; the CS terminal of MOSFET controller chip U3 is connected to one end of resistor R17; the other end of resistor R17 is connected to one end of capacitor C17 and resistor R18. One end of resistor R18 is connected to the source of MOSFET M2, one end of resistor R19, one end of resistor R20, and one end of capacitor C18, generating the signal CSP_BOOST. The OUT terminal of MOSFET controller chip U3 is connected to one end of resistor R16. The other end of resistor R16 is connected to the gate of MOSFET M2 and the other end of resistor R19. The drain of MOSFET M2 is connected to one end of resistor R21, the other end of inductor L1, the anode of diode D4, and one end of capacitor C19. The other end of resistor R21 is connected to the other end of capacitor C18. The cathode of diode D4 is connected to the anode of diode D5, one end of capacitor C20, and one end of capacitor C21. The cathode of diode D5... The cathode of diode D6 is connected to the other end of capacitor C19 and the anode of diode D6. The cathode of diode D6 is connected to the other end of capacitor C20, one end of capacitor C22, one end of capacitor C23, one end of capacitor C24, one end of capacitor C25, one end of capacitor C26, the other end of resistor R22, and one end of resistor R24, which are connected to signal HV. The other end of resistor R24 ​​is connected to one end of resistor R25 and one end of capacitor C27 to generate signal HVBB_AI. Pin 1 of digital-to-analog converter chip U4 is connected to one end of resistor R26 and is connected to signal I2C_ADR. The other end of resistor R26 is connected to signal 5V_SW. Pin 2 of digital-to-analog converter chip U4 is connected to one end of resistor R28 and is connected to signal I2C_SCL.Pin 3 of the digital-to-analog converter chip U4 is connected to one end of resistor R27 and connected to the signal I2C_SDA. The other ends of resistor R27 and R28 are connected to the signal 5V_SW. Pin 6 of the digital-to-analog converter chip U4 is connected to the other end of resistor R29. Pin 5 of the digital-to-analog converter chip U4 is connected to one end of capacitor C28 and C29 and connected to the signal 5V_SW. The other ends of capacitors C10, C11, and C12, the other end of resistor R13, the emitter of transistor Q2, and the other end of resistor R14 are also connected. The other end of capacitor C13, the other end of resistor R23, pin 6 of MOSFET controller chip U3, the other end of capacitor C16, the other end of capacitor C17, the other end of resistor R20, the other end of capacitor C21, the other end of capacitor C22, the other end of capacitor C23, the other end of capacitor C24, the other end of capacitor C25, the other end of capacitor C26, the other end of resistor R25, the other end of capacitor C27, the other end of capacitor C28, the other end of capacitor C29, pin 4 and pin 7 of digital-to-analog converter chip U4 are grounded.

[0010] Furthermore, the MOSFET controller chip U3 is a high-voltage, low-side N-channel MOSFET controller chip of model LM5022, and the digital-to-analog converter chip U4 is a 10-bit, single-channel, voltage output digital-to-analog converter of model DAC101C081.

[0011] Furthermore, the square wave to sine wave conversion includes resistors R30-R35, capacitors C30-C35, a half-bridge gate driver chip U5, diodes D6-D10, MOSFETs M3 and M4, and inductors L2-L4. Pin 7 of the half-bridge gate driver chip U5 is connected to one end of capacitor C30 and the anode of diode D6, and is connected to the signal 12V_ISO. The cathode of diode D6 is connected to pin 13 of the half-bridge gate driver chip U5 and one end of capacitor C31. The other end of capacitor C31 is connected to the half-bridge gate driver chip U5. Pin 11 of half-bridge gate driver chip U5 is connected to the source of MOSFET M3, one end of resistor R32, the drain of MOSFET M4, and one end of inductor L2. Pin 1 of half-bridge gate driver chip U5 is connected to the PWM_IN signal. Pin 2 of half-bridge gate driver chip U5 is connected to DO_SD. Pin 4 of half-bridge gate driver chip U5 is connected to one end of resistor R30. Pin 12 of half-bridge gate driver chip U5 is connected to the cathode of diode D7 and one end of resistor R31. The anode of diode D7 is connected to the other end of resistor R31 and the gate of MOSFET M3. The other end of resistor R32 is connected to the other end of the half-bridge gate driver chip U5. Pin 6 is connected to the cathode of diode D8 and one end of resistor R33. The anode of diode D8 is connected to the other end of resistor R33. The gate of MOSFET M4 is connected to one end of resistor R34. The drain of MOSFET M3, one end of capacitor C32, one end of capacitor C33, and the cathode of diode D9 are connected to signal HV. The other end of inductor L2 is connected to one end of inductor L3. The other end of inductor L3 is connected to one end of inductor L4. The other end of inductor L4 is connected to diode D9. The anode of diode 9, the cathode of diode D10, one end of capacitor C34, one end of capacitor C35, and one end of resistor R35 are connected. The other end of resistor R35 is connected to signal HVC. The other end of capacitor C30, the other end of resistor R30, pin 3 of half-bridge gate driver chip U5, pin 5 of half-bridge gate driver chip U5, the other end of resistor R34, the source of MOSFET M4, the other end of capacitor C32, the other end of capacitor C33, the anode of diode D10, the other end of capacitor C34, and the other end of capacitor C35 are grounded.

[0012] Furthermore, the half-bridge gate driver chip U5 is an IR21834 half-bridge gate driver chip.

[0013] Further, the driver includes diodes D11-D13, capacitors C36-C39, resistors R36-R39, a gate driver chip U6, a MOSFET M5, and an inductor L5. Pin 1 of the gate driver chip U6 is connected to the anode of diode D11 and one end of capacitor C36, and is connected to the signal VD_SW_GD. Pin 2 of the gate driver chip U6 is connected to the signal Bridge1_H. Pin 3 of the gate driver chip U6 is connected to the signal Bridge1_L. Pin 8 of the gate driver chip U6 is connected to the cathode of diode D11 and one end of capacitor C37. Pin 7 of the gate driver chip U6 is connected to the cathode of diode D12 and one end of resistor R36. The anode of diode D12 and the other end of resistor R36 are connected to the gate of MOSFET M5. Pin 6 is connected to the other end of capacitor C37, one end of inductor L5, the source of MOSFET M5, and the drain of MOSFET M6. Pin 5 of gate driver chip U6 is connected to the cathode of diode D13 and one end of resistor R37. The anode of diode D13 is connected to the other end of resistor R37 and the gate of MOSFET M6. The drain of MOSFET M5 is connected to signal HVC, and the source of MOSFET M6 is connected to signal COMN. The other end of inductor L5 is connected to one end of capacitor C38 and one end of resistor R38 to generate signal OUT1. The other end of resistor R38 is connected to one end of resistor R39 and one end of capacitor C39 to generate signal OUT1_FB. Pin 4 of gate driver chip U6, the other end of capacitor C36, the other end of capacitor C38, the other end of resistor R39, and the other end of capacitor C39 are grounded.

[0014] Furthermore, the gate driver chip U6 is a gate driver chip with model number AUIRS2301S.

[0015] Compared with the prior art, the present invention has the following advantages and effects: 1. This invention enables one controller to control multiple dimming zones simultaneously: Currently, dimming glass controllers on the market control one dimming zone per controller. If multiple dimming zones need to be adjusted, multiple controllers need to be installed. Using our multi-zone controller, one controller can control dimming glass in multiple zones simultaneously, which greatly saves vehicle interior space and costs. 2. The invention has good safety protection performance: isolation protection measures are added between the controller working part and the vehicle circuit interface. The output voltage is only transmitted to the dimming film inside the dimming glass, which is completely isolated from the vehicle body, preventing electric shock caused by the user touching the glass or touching it during maintenance. 3. This invention has a good EMC grounding design: Since the controller output is high voltage, the controller is designed with the screw hole for fixing the controller connected to the controller ground, so that the controller and the whole vehicle share the same ground, ensuring that the electromagnetic compatibility requirements of the whole vehicle are met. Attached Figure Description

[0016] Figure 1 This is a schematic diagram illustrating the control of a multi-zone electroluminescent glass according to the present invention.

[0017] Figure 2 This is a circuit diagram of the isolated power supply of the present invention.

[0018] Figure 3 This is a circuit diagram of the boost converter of the present invention.

[0019] Figure 4 This is a circuit diagram of the square wave to sine wave conversion of the present invention.

[0020] Figure 5 This is a circuit diagram of the driver of the present invention. Detailed Implementation

[0021] To illustrate in detail the technical solutions adopted by the present invention to achieve the intended technical objectives, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Furthermore, the technical means or technical features in the embodiments of the present invention can be replaced without creative effort. The present invention will be described in detail below with reference to the accompanying drawings and embodiments.

[0022] like Figure 1 As shown, the controller for a multi-zone electroluminescent dimming glass according to the present invention includes a LIN transceiver, an external microprocessor, an isolation power supply, a digital isolator, an internal microprocessor, a boost converter, a digital-to-analog converter, a square wave to sine wave converter, and several drivers. The external microprocessor is connected to one end of the LIN transceiver and the digital isolator, and the other end of the digital isolator is connected to the internal microprocessor. The external microprocessor communicates with the vehicle through the LIN transceiver and with the internal microprocessor through the digital isolator. The isolation power supply is connected to the external microprocessor. The boost converter, the digital-to-analog converter, and the square wave to sine wave converter are respectively connected to the internal microprocessor. One end of the several drivers is connected to the internal microprocessor, and the other end of the several drivers is respectively connected to each dimming film of the multi-zone dimming glass. The boost converter converts the vehicle's 12V DC voltage to 160V DC voltage, and the square wave to sine wave converter converts the 160V DC voltage to 110V AC voltage and supplies power to the several drivers.

[0023] The LIN transceiver uses the TJA1028TK / 5V0 / 20 communication chip, and the digital isolator uses the ISO6721RBQDRQ1 isolation transceiver chip. The external microprocessor uses the R5F10A6E chip, and the internal microprocessor uses the R5F10ALGLFB chip.

[0024] The controller for a multi-zone electroluminescent glass of the present invention further includes modules such as a voltage regulator, power switching, power voltage monitoring, a temperature sensor, internal temperature monitoring, a high-side drive module, a pull-up output voltage, and internal current monitoring. The voltage regulator converts the external voltage into a stable 5V voltage to power both the external and internal microprocessors. The power switching and power voltage monitoring modules are connected to the external microprocessor to respectively implement power switching and voltage monitoring functions. The temperature sensor, internal temperature monitoring, high-side drive module, pull-up output voltage, and internal current monitoring modules are connected to the internal microprocessor to realize functions such as internal and external temperature monitoring, high-side drive, pull-up output voltage, and internal current monitoring.

[0025] like Figure 2As shown, the isolated power supply includes transistor Q1, resistors R1-R9, capacitors C1-C8, an isolated flyback controller chip U1, diodes D1-D3, MOSFET M1, transformer T1, and current transformer chip U2. The base of transistor Q1 is connected to the input voltage PWR_ISO1_EN. The collector of transistor Q1 is connected to one end of resistor R1, one end of resistor R2, and pin 6 of the isolated flyback controller chip U1. The other end of resistor R1 is connected to one end of capacitor C1 and pin 5 of the isolated flyback controller chip U1, and is connected to the power supply PWR_ISO. Pin 4 of the flyback controller chip U1 is connected to one end of resistor R3. Pin 3 of the flyback controller chip U1 is connected to one end of resistor R4. Pin 1 of the flyback controller chip U1 is connected to the source of MOSFET M1, one end of resistor R6, and one end of resistor R5. The other end of resistor R4 is connected to the gate of MOSFET M1. The other end of resistor R3 is connected to the drain of MOSFET M1, one end of capacitor C2, one end of capacitor C3, the anode of diode D2, and pin 1 of transformer T1. The other end of capacitor C2 is connected to the other end of resistor R5. Diode D2... The cathode of diode D1 is connected to the cathode of diode D1. The anode of diode D1 is connected to one end of resistor R7, one end of capacitor C4, and pin 2 of transformer T1, and connected to power supply PWR_IOS. The other end of capacitor C3 is connected to the other end of resistor R7. Pins 5 and 7 of transformer T1, one end of resistor R8, and the anode of diode D3 are connected. The other end of resistor R8 is connected to one end of capacitor C5. The other end of capacitor C5 is connected to the cathode of diode D3 and one end of resistor R9. The other end of resistor R9 is connected to one end of capacitor C6, one end of capacitor C7, and one end of capacitor C8. One end of the current transformer chip U2 is connected to generate the signal 12V_ISO1. Pin 2 of the current transformer chip U2 is connected to the signal 12V_ISO1. Pin 3 of the current transformer chip U2 generates the signal 12V_ISO. The emitter of transistor Q1, the other end of resistor R2, pin 2 of isolation flyback controller chip U1, the other end of capacitor C1, the other end of resistor R6, the other end of capacitor C4, pin 6 of transformer T1, pin 8 of transformer T1, the other end of capacitor C6, the other end of capacitor C7, the other end of capacitor C8, pin 1 and pin 4 of current transformer chip U2 are grounded.

[0026] The isolation power supply also includes resistors R10 and R11 and capacitor C9. One end of resistor R10 is connected to signal 12V_ISO1, and the other end of resistor R10 is connected to one end of resistor R11 and one end of capacitor C9 to generate signal ISO12V_MON. The other end of resistor R11 and the other end of capacitor C9 are grounded.

[0027] The isolated flyback controller chip U1 is a low-power isolated flyback controller with model number LT8306, and the current transformer chip U2 is a current transformer chip with model number L102.

[0028] The isolated power supply uses an LT8306 controller to precisely control the switching action of M1 by adjusting the PWM pulse width. Power transfer and electrical isolation are achieved using transformer T1, and output voltage stability is maintained through feedback voltage. The LT8306 employs current-mode control, sensing the primary winding current by detecting the voltage at the SENSE pin (i.e., the voltage drop across the source resistor R6 of M1) and adjusting the duty cycle accordingly to achieve precise power transfer control. When the primary winding current (T1's 1-2) reaches a set threshold, the chip automatically shuts off M1, entering an "intermittent conduction" state. The secondary windings (T1's 5-6 and 7-8) output 12V through rectifier diode D3 and filter capacitors C5, C6, C7, and C8. The output voltage information is fed back to the primary side (T1's 1-2) through the secondary windings of the transformer (T1's 5-6 and 7-8), forming a feedback network via components such as R3, and then sent to the RFB pin. The LT8306's internal comparator dynamically adjusts the PWM pulse width based on the difference between the RFB voltage and the reference voltage, thereby achieving closed-loop stability of the output voltage.

[0029] The advantage of this design is that it uses transformer coupling to achieve optocoupler-free feedback, and combines current-mode control to ensure dynamic response and safety. The overall structure is simple and reliable.

[0030] like Figure 3As shown, the boost converter includes capacitors C10-C29, resistors R12-R29, transistor Q2, MOSFET controller chip U3, digital-to-analog converter chip U4, MOSFET M2, inductor L1, and diodes D4-D6. One end of capacitor C10, one end of capacitor C11, one end of capacitor C12, one end of resistor R12, pin 1 of MOSFET controller chip U3, and one end of inductor L1 are connected to signal 12V_ISO. The other end of resistor R12 is connected to pin 7 of MOSFET controller chip U3, one end of resistor R13 is connected to the collector of transistor Q2, and the base of transistor Q2 is connected to signal DCPWR_EN. Pin 9 of MOSFET controller chip U3 is connected to resistor R14. One end of the MOSFET controller chip U3 is connected to one end of capacitor C13. Pin 3 of the MOSFET controller chip U3 is connected to one end of capacitor C14 and one end of capacitor C15. The other end of capacitor C14 is connected to one end of resistor R15. The other end of resistor R15 is connected to the other end of capacitor C15, pin 2 of the MOSFET controller chip U3, one end of resistor R29, one end of resistor R22, and one end of resistor R23. The VCC terminal of the MOSFET controller chip U3 is connected to one end of capacitor C16. The CS terminal of the MOSFET controller chip U3 is connected to one end of resistor R17. The other end of resistor R17 is connected to one end of capacitor C17 and one end of resistor R18. The terminals are connected as follows: the other end of resistor R18 is connected to the source of MOSFET M2, one end of resistor R19, one end of resistor R20, and one end of capacitor C18, generating the signal CSP_BOOST. The OUT terminal of MOSFET controller chip U3 is connected to one end of resistor R16. The other end of resistor R16 is connected to the gate of MOSFET M2 and the other end of resistor R19. The drain of MOSFET M2 is connected to one end of resistor R21, the other end of inductor L1, the anode of diode D4, and one end of capacitor C19. The other end of resistor R21 is connected to the other end of capacitor C18. The cathode of diode D4 is connected to the anode of diode D5, one end of capacitor C20, and one end of capacitor C21. The cathode of diode D5... The cathode of diode D6 is connected to the other end of capacitor C19 and the anode of diode D6. The cathode of diode D6 is connected to the other end of capacitor C20, one end of capacitor C22, one end of capacitor C23, one end of capacitor C24, one end of capacitor C25, one end of capacitor C26, the other end of resistor R22, and one end of resistor R24, which are connected to signal HV. The other end of resistor R24 ​​is connected to one end of resistor R25 and one end of capacitor C27 to generate signal HVBB_AI. Pin 1 of digital-to-analog converter chip U4 is connected to one end of resistor R26 and is connected to signal I2C_ADR. The other end of resistor R26 is connected to signal 5V_SW. Pin 2 of digital-to-analog converter chip U4 is connected to one end of resistor R28 and is connected to signal I2C_SCL.Pin 3 of the digital-to-analog converter chip U4 is connected to one end of resistor R27 and connected to the signal I2C_SDA. The other ends of resistor R27 and R28 are connected to the signal 5V_SW. Pin 6 of the digital-to-analog converter chip U4 is connected to the other end of resistor R29. Pin 5 of the digital-to-analog converter chip U4 is connected to one end of capacitor C28 and C29 and connected to the signal 5V_SW. The other ends of capacitors C10, C11, and C12, the other end of resistor R13, the emitter of transistor Q2, and the other end of resistor R14 are also connected. The other end of capacitor C13, the other end of resistor R23, pin 6 of MOSFET controller chip U3, the other end of capacitor C16, the other end of capacitor C17, the other end of resistor R20, the other end of capacitor C21, the other end of capacitor C22, the other end of capacitor C23, the other end of capacitor C24, the other end of capacitor C25, the other end of capacitor C26, the other end of resistor R25, the other end of capacitor C27, the other end of capacitor C28, the other end of capacitor C29, pin 4 and pin 7 of digital-to-analog converter chip U4 are grounded.

[0031] The MOSFET controller chip U3 is a high-voltage, low-side N-channel MOSFET controller chip with model number LM5022, and the digital-to-analog converter chip U4 is a 10-bit, single-channel, voltage output digital-to-analog converter with model number DAC101C081.

[0032] A step-up transformer is primarily used to boost DC voltage output. Its core function is to take the input 12V ISO power supply, control it via a switch, and store energy through an inductor to ultimately output a higher, stable voltage (HV), supplemented by feedback control and protection mechanisms. This circuit uses a dedicated automotive-grade boost converter chip, LM5022-Q1 (U3), which generates a PWM signal through an internal oscillator to drive an external MOSFET M2. L1 is the energy storage inductor; it stores energy while M2 is on and releases it when M2 is off. The energy is rectified by D4, then passed through D5, D6, C19, C20, and C21 to form a voltage multiplier circuit, and finally filtered and stored by C20-C26 to charge the output HV. R22 and R23 are feedback resistors that divide the high-voltage output HV and send it to the FB (feedback) pin of U3. U3 automatically adjusts the PWM duty cycle based on the comparison between the FB voltage and an internal reference, achieving closed-loop voltage regulation. Pin 8 of U3 can detect the source current of M2 via R17, R18, R20, and C17, thus achieving overcurrent protection. Additionally, the HV voltage can be adjusted by changing the voltage at the FB pin via U4.

[0033] Advantages of this design: 1. High efficiency: It adopts a switching mode rather than a nonlinear voltage regulation, which greatly reduces power consumption, especially in applications with large voltage drop.

[0034] 2. High integration: Uses a dedicated power management IC (LM5022-Q1) to simplify design and improve reliability.

[0035] 3. Multiple protections: Equipped with overcurrent, undervoltage, and soft-start protection mechanisms to enhance system robustness.

[0036] like Figure 4 As shown, the square wave to sine wave conversion includes resistors R30-R35, capacitors C30-C35, a half-bridge gate driver chip U5, diodes D6-D10, MOSFETs M3 and M4, and inductors L2-L4. Pin 7 of the half-bridge gate driver chip U5 is connected to one end of capacitor C30 and the anode of diode D6, and is connected to the signal 12V_ISO. The cathode of diode D6 is connected to pin 13 of the half-bridge gate driver chip U5 and one end of capacitor C31. The other end of capacitor C31 is connected to pin 1 of the half-bridge gate driver chip U5. Pin 1 of the half-bridge gate driver chip U5 is connected to the source of MOSFET M3, one end of resistor R32, the drain of MOSFET M4, and one end of inductor L2. Pin 1 of the half-bridge gate driver chip U5 is connected to the signal PWM_IN. Pin 2 of the half-bridge gate driver chip U5 is connected to DO_SD. Pin 4 of the half-bridge gate driver chip U5 is connected to one end of resistor R30. Pin 12 of the half-bridge gate driver chip U5 is connected to the cathode of diode D7 and one end of resistor R31. The anode of diode D7 is connected to the other end of resistor R31, the gate of MOSFET M3, and the drain of inductor L2. The other end of resistor R32 is connected to pin 6 of the half-bridge gate driver chip U5, which is connected to the cathode of diode D8 and one end of resistor R33. The anode of diode D8 is connected to the other end of resistor R33, the gate of MOSFET M4 is connected to one end of resistor R34, the drain of MOSFET M3, one end of capacitor C32, one end of capacitor C33, and the cathode of diode D9 are connected to signal HV. The other end of inductor L2 is connected to one end of inductor L3, the other end of inductor L3 is connected to one end of inductor L4, and the other end of inductor L4 is connected to diode D9. The anode of the diode, the cathode of the diode D10, one end of the capacitor C34, one end of the capacitor C35, and one end of the resistor R35 are connected. The other end of the resistor R35 is connected to the signal HVC. The other end of the capacitor C30, the other end of the resistor R30, pin 3 of the half-bridge gate driver chip U5, pin 5 of the half-bridge gate driver chip U5, the other end of the resistor R34, the source of the MOSFET M4, the other end of the capacitor C32, the other end of the capacitor C33, the anode of the diode D10, the other end of the capacitor C34, and the other end of the capacitor C35 are grounded.

[0037] The U5 half-bridge gate driver chip uses the IR21834 half-bridge gate driver chip.

[0038] The square wave to sine wave conversion mainly uses IR21834(U5) to implement a typical half-bridge inverter circuit structure. It mainly uses PWM to drive the MOSFET half-bridge to chop and generate a half-wave sine modulated wave, which is used to prepare for the subsequent conversion to full-wave AC voltage.

[0039] PWM_IN and DO_SD are external control signal inputs to pins 1 and 2 of U5, used to control the on / off state of M3 and M4. Pin 4 of U5 is the chip dead time setting pin, which prevents shoot-through short circuits between the upper and lower bridge arms. The specific dead time is set by the resistance value of R30. By adjusting PWM_IN and DO_SD, the pulse width of M3 and M4 is controlled by U5, from low duty cycle to high duty cycle and then back to low duty cycle. Combined with L2, L3, L4, D9, and D10, a sinusoidal modulated wave is finally output.

[0040] Advantages of this design: 1. Integrated driver design: Using the dedicated high-voltage driver chip IR21834 simplifies the design of peripheral circuits and improves reliability.

[0041] 2. High-efficiency power switching topology: This DC-AC module adopts a half-bridge structure, which can effectively utilize input energy and reduce heat loss.

[0042] 3. Flexible input control: Supports PWM modulation input + dead time setting.

[0043] like Figure 5As shown, the driver includes diodes D11-D13, capacitors C36-C39, resistors R36-R39, gate driver chip U6, MOSFET M5, and inductor L5. Pin 1 of gate driver chip U6 is connected to the anode of diode D11 and one end of capacitor C36, and is also connected to the signal VD_SW_GD. Pin 2 of gate driver chip U6 is connected to the signal Bridge1_H. Pin 3 of gate driver chip U6 is connected to the signal Bridge1_L. Pin 8 of gate driver chip U6 is connected to the cathode of diode D11 and one end of capacitor C37. Pin 7 of gate driver chip U6 is connected to the cathode of diode D12 and one end of resistor R36. The anode of diode D12 and the other end of resistor R36 are connected to the gate of MOSFET M5. Pin 6 of gate driver chip U6... The other end of capacitor C37, one end of inductor L5, the source of MOSFET M5, and the drain of MOSFET M6 are connected. Pin 5 of gate driver chip U6 is connected to the cathode of diode D13 and one end of resistor R37. The anode of diode D13 is connected to the other end of resistor R37 and the gate of MOSFET M6. The drain of MOSFET M5 is connected to signal HVC, and the source of MOSFET M6 is connected to signal COMN. The other end of inductor L5 is connected to one end of capacitor C38 and one end of resistor R38 to generate signal OUT1. The other end of resistor R38 is connected to one end of resistor R39 and one end of capacitor C39 to generate signal OUT1_FB. Pin 4 of gate driver chip U6, the other end of capacitor C36, the other end of capacitor C38, the other end of resistor R39, and the other end of capacitor C39 are grounded.

[0044] The gate driver chip U6 uses the AUIRS2301S gate driver chip.

[0045] The driver uses an AUIRS2301S (U6) with M5 and M6 to drive the switching on the high-voltage side or load side, and outputs a 50Hz full-wave sine wave in conjunction with a front-end half-wave sine circuit. Pin 2 of U5 is the control pin of the high-side MOS, which, with the bootstrap capacitor C37, controls the on / off state of M5; pin 3 of U5 is the control pin of the low-side MOS, used to control the on / off state of M6. R36 and R37 are the gate resistors of the MOS, mainly used to adjust the switching speed, suppress oscillation, and protect M5 and M6. D12 and D13 are segment diodes, used for fast turn-off of the MOS to prevent shoot-through. The output is filtered by L5 to ensure a smooth output waveform and reduce fluctuations. R38 and R39 are used to sample the feedback voltage (OUT1_FB) and output it to the MCU to achieve closed-loop control or status monitoring.

[0046] Advantages of this design: 1. Simplified peripheral circuit design: The bootstrap power supply structure eliminates the need for an independent high-side bias power supply, reducing system complexity and cost; it has high integration and only requires a few external components to complete the full half-bridge drive function.

[0047] 2. Good EMC: Reasonable gate resistor value, capacitor and inductor filtering and diode turn-off design can reduce switching noise and voltage spikes.

[0048] 3. Flexible input control and feedback mechanism: Supports PWM modulation input settings, suitable for precise modulation; OUT1_FB feedback loop facilitates closed-loop functions such as voltage regulation, current limiting or overload protection.

[0049] The working principle of the controller for a multi-zone electroluminescent dimming glass of the present invention is as follows: the external microprocessor receives the LIN information of the whole vehicle and provides an enable, enabling the isolation module to start working; after the internal microprocessor receives the enable, the boost module starts working, first converting the whole vehicle's electricity to 160V; then, the DC power is converted into sinusoidal power through the single-phase to sine wave module; the software controls the single-phase to sine wave module by adjusting the pulse width to achieve an equivalent sine wave output using power electronic modulation technology (SPWM), adjusting the voltage output to the dimming film, setting x output voltage values ​​through the duty cycle, with duty cycles of (1,2,3,4…x)*sin(π / x), rising x times and falling x times, simulating an output of 110V AC power, with a maximum sine wave voltage of 156V; then, the power supply of the transformer module is cyclically supplied to the dimming film from two directions through the ten-zone full-bridge inverter module, simulating a similar AC power effect, thereby enabling the dimming function.

[0050] This invention enables a single controller to simultaneously control multiple dimming zones: Currently, dimming glass controllers on the market operate on a one-controller-one-dimming-zone basis. Adjusting multiple dimming zones requires multiple controllers. Our multi-zone controller allows one controller to manage multiple dimming zones simultaneously, significantly saving vehicle space and cost. This invention also boasts excellent safety protection: Isolation measures are added between the controller's operating section and the vehicle's electrical interface. The output voltage is only transmitted to the dimming film inside the dimming glass, completely isolated from the vehicle body, preventing electric shock from users touching the glass or during maintenance. Furthermore, this invention features a superior EMC grounding design: Because the controller output is high voltage, the screw holes for fixing the controller are connected to the controller's ground, ensuring the controller shares a common ground with the vehicle and meeting the vehicle's electromagnetic compatibility requirements.

[0051] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent substitutions, and improvements made to the above embodiments without departing from the scope of the present invention, based on the technical essence of the present invention and within the spirit and principles of the present invention, shall still fall within the protection scope of the present invention.

Claims

1. A controller for multi-zone electroluminescent glass, characterized in that: It includes a LIN transceiver, an external microprocessor, an isolated power supply, a digital isolator, an internal microprocessor, a boost converter, a digital-to-analog converter, a square wave to sine wave converter, and several drivers. The external microprocessor is connected to one end of the LIN transceiver and the digital isolator, and the other end of the digital isolator is connected to the internal microprocessor. The external microprocessor communicates with the vehicle through the LIN transceiver and with the internal microprocessor through the digital isolator. The isolated power supply is connected to the external microprocessor. The boost converter, digital-to-analog converter, and square wave to sine wave converter are each connected to the internal microprocessor. One end of each driver is connected to the internal microprocessor, and the other end of each driver is connected to the dimming film of the multi-zone dimming glass. The boost converter converts the vehicle's 12V DC voltage to 160V DC voltage, and the square wave to sine wave converter converts the 160V DC voltage to 110V AC voltage and powers the drivers.

2. The controller for a multi-zone electroluminescent glass according to claim 1, characterized in that: The isolated power supply includes transistor Q1, resistors R1-R9, capacitors C1-C8, an isolated flyback controller chip U1, diodes D1-D3, MOSFET M1, transformer T1, and current transformer chip U2. The base of transistor Q1 is connected to the input voltage PWR_ISO1_EN. The collector of transistor Q1 is connected to one end of resistor R1, one end of resistor R2, and pin 6 of the isolated flyback controller chip U1. The other end of resistor R1 is connected to one end of capacitor C1 and pin 5 of the isolated flyback controller chip U1, and is also connected to the power supply PWR_ISO. Pin 4 of the isolated flyback controller chip U1 is connected to one end of resistor R3. Pin 3 of the isolated flyback controller chip U1 is connected to one end of resistor R4. Pin 1 of the isolated flyback controller chip U1 is connected to the source of MOSFET M1, one end of resistor R6, and one end of resistor R5. The other end of resistor R4 is connected to the gate of MOSFET M1. The other end of resistor R3 is connected to the drain of MOSFET M1, one end of capacitor C2, one end of capacitor C3, the anode of diode D2, and pin 1 of transformer T1. The other end of capacitor C2 is connected to the other end of resistor R5. The cathode of diode D2... The cathode of diode D1 is connected to the anode of diode D1. The anode of diode D1 is connected to one end of resistor R7, one end of capacitor C4, and pin 2 of transformer T1, and connected to power supply PWR_IOS. The other end of capacitor C3 is connected to the other end of resistor R7. Pins 5 and 7 of transformer T1, one end of resistor R8, and the anode of diode D3 are connected to each other. The other end of resistor R8 is connected to one end of capacitor C5. The other end of capacitor C5 is connected to the cathode of diode D3 and one end of resistor R9. The other end of resistor R9 is connected to one end of capacitor C6, one end of capacitor C7, and one end of capacitor C8. One end of the current transformer chip U2 is connected to generate the signal 12V_ISO1. Pin 2 of the current transformer chip U2 is connected to the signal 12V_ISO1. Pin 3 of the current transformer chip U2 generates the signal 12V_ISO. The emitter of transistor Q1, the other end of resistor R2, pin 2 of isolation flyback controller chip U1, the other end of capacitor C1, the other end of resistor R6, the other end of capacitor C4, pin 6 of transformer T1, pin 8 of transformer T1, the other end of capacitor C6, the other end of capacitor C7, the other end of capacitor C8, pin 1 and pin 4 of current transformer chip U2 are grounded.

3. The controller for a multi-zone electroluminescent glass according to claim 2, characterized in that: The isolation power supply also includes resistors R10 and R11 and capacitor C9. One end of resistor R10 is connected to signal 12V_ISO1, and the other end of resistor R10 is connected to one end of resistor R11 and one end of capacitor C9 to generate signal ISO12V_MON. The other end of resistor R11 and the other end of capacitor C9 are grounded.

4. The controller for a multi-zone electroluminescent glass according to claim 2, characterized in that: The isolated flyback controller chip U1 is a low-power isolated flyback controller of model LT8306, and the current transformer chip U2 is a current transformer chip of model L102.

5. The controller for a multi-zone electroluminescent glass according to claim 1, characterized in that: The boost converter includes capacitors C10-C29, resistors R12-R29, transistor Q2, MOSFET controller chip U3, digital-to-analog converter chip U4, MOSFET M2, inductor L1, and diodes D4-D6. One end of capacitor C10, one end of capacitor C11, one end of capacitor C12, one end of resistor R12, pin 1 of MOSFET controller chip U3, and one end of inductor L1 are connected to signal 12V_ISO. The other end of resistor R12 is connected to pin 7 of MOSFET controller chip U3, one end of resistor R13, and the collector of transistor Q2. The base of transistor Q2 is connected to signal DCPWR_EN. Pin 9 of MOSFET controller chip U3 is connected to resistor R14. One end of the connection is as follows: Pin 10 of MOSFET controller chip U3 is connected to one end of capacitor C13; Pin 3 of MOSFET controller chip U3 is connected to one end of capacitor C14 and one end of capacitor C15; the other end of capacitor C14 is connected to one end of resistor R15; the other end of resistor R15 is connected to the other end of capacitor C15, pin 2 of MOSFET controller chip U3, one end of resistor R29, one end of resistor R22, and one end of resistor R23; the VCC terminal of MOSFET controller chip U3 is connected to one end of capacitor C16; the CS terminal of MOSFET controller chip U3 is connected to one end of resistor R17; the other end of resistor R17 is connected to one end of capacitor C17 and one end of resistor R18. The connections are as follows: the other end of resistor R18 is connected to the source of MOSFET M2, one end of resistor R19, one end of resistor R20, and one end of capacitor C18, generating the signal CSP_BOOST. The OUT terminal of MOSFET controller chip U3 is connected to one end of resistor R16. The other end of resistor R16 is connected to the gate of MOSFET M2 and the other end of resistor R19. The drain of MOSFET M2 is connected to one end of resistor R21, the other end of inductor L1, the anode of diode D4, and one end of capacitor C19. The other end of resistor R21 is connected to the other end of capacitor C18. The cathode of diode D4 is connected to the anode of diode D5, one end of capacitor C20, and one end of capacitor C21. The cathode of diode D5... The other end of capacitor C19 is connected to the anode of diode D6. The cathode of diode D6 is connected to the other end of capacitor C20, one end of capacitor C22, one end of capacitor C23, one end of capacitor C24, one end of capacitor C25, one end of capacitor C26, the other end of resistor R22, and one end of resistor R24, which are connected to signal HV. The other end of resistor R24 ​​is connected to one end of resistor R25 and one end of capacitor C27 to generate signal HVBB_AI. Pin 1 of digital-to-analog converter chip U4 is connected to one end of resistor R26 and is connected to signal I2C_ADR. The other end of resistor R26 is connected to signal 5V_SW. Pin 2 of digital-to-analog converter chip U4 is connected to one end of resistor R28 and is connected to signal I2C_SCL.Pin 3 of the digital-to-analog converter chip U4 is connected to one end of resistor R27 and connected to the signal I2C_SDA. The other ends of resistor R27 and R28 are connected to the signal 5V_SW. Pin 6 of the digital-to-analog converter chip U4 is connected to the other end of resistor R29. Pin 5 of the digital-to-analog converter chip U4 is connected to one end of capacitor C28 and C29 and connected to the signal 5V_SW. The other ends of capacitors C10, C11, and C12, the other end of resistor R13, the emitter of transistor Q2, and the other end of resistor R14 are also connected. The other end of capacitor C13, the other end of resistor R23, pin 6 of MOSFET controller chip U3, the other end of capacitor C16, the other end of capacitor C17, the other end of resistor R20, the other end of capacitor C21, the other end of capacitor C22, the other end of capacitor C23, the other end of capacitor C24, the other end of capacitor C25, the other end of capacitor C26, the other end of resistor R25, the other end of capacitor C27, the other end of capacitor C28, the other end of capacitor C29, pin 4 and pin 7 of digital-to-analog converter chip U4 are grounded.

6. The controller for a multi-zone electroluminescent glass according to claim 5, characterized in that: The MOSFET controller chip U3 is a high-voltage, low-side N-channel MOSFET controller chip of model LM5022, and the digital-to-analog converter chip U4 is a 10-bit, single-channel, voltage output digital-to-analog converter of model DAC101C081.

7. The controller for a multi-zone electroluminescent glass according to claim 1, characterized in that: The square wave to sine wave conversion includes resistors R30-R35, capacitors C30-C35, a half-bridge gate driver chip U5, diodes D6-D10, MOSFETs M3 and M4, and inductors L2-L4. Pin 7 of the half-bridge gate driver chip U5 is connected to one end of capacitor C30 and the anode of diode D6, and is connected to the signal 12V_ISO. The cathode of diode D6 is connected to pin 13 of the half-bridge gate driver chip U5 and one end of capacitor C31. The other end of capacitor C31 is connected to pin 11 of the half-bridge gate driver chip U5. Pin 1 of the half-bridge gate driver chip U5 is connected to the source of MOSFET M3, one end of resistor R32, the drain of MOSFET M4, and one end of inductor L2. Pin 2 of the half-bridge gate driver chip U5 is connected to the PWM_IN signal. Pin 3 of the half-bridge gate driver chip U5 is connected to DO_SD. Pin 4 of the half-bridge gate driver chip U5 is connected to one end of resistor R30. Pin 12 of the half-bridge gate driver chip U5 is connected to the cathode of diode D7 and one end of resistor R31. The anode of diode D7 is connected to the other end of resistor R31, the gate of MOSFET M3, and resistor R32. The other end of R32 is connected to pin 6 of the half-bridge gate driver chip U5, which is connected to the cathode of diode D8 and one end of resistor R33. The anode of diode D8 is connected to the other end of resistor R33, the gate of MOSFET M4 is connected to one end of resistor R34, the drain of MOSFET M3, one end of capacitor C32, one end of capacitor C33, and the cathode of diode D9 are connected to signal HV. The other end of inductor L2 is connected to one end of inductor L3, the other end of inductor L3 is connected to one end of inductor L4, and the other end of inductor L4 is connected to diode D9. The anode, cathode of diode D10, one end of capacitor C34, one end of capacitor C35, and one end of resistor R35 are connected. The other end of resistor R35 is connected to signal HVC. The other end of capacitor C30, the other end of resistor R30, pin 3 of half-bridge gate driver chip U5, pin 5 of half-bridge gate driver chip U5, the other end of resistor R34, the source of MOSFET M4, the other end of capacitor C32, the other end of capacitor C33, the anode of diode D10, and the other ends of capacitors C34 and C35 are grounded.

8. The controller for a multi-zone electroluminescent glass according to claim 7, characterized in that: The half-bridge gate driver chip U5 is an IR21834 half-bridge gate driver chip.

9. The controller for a multi-zone electroluminescent glass according to claim 1, characterized in that: The driver includes diodes D11-D13, capacitors C36-C39, resistors R36-R39, a gate driver chip U6, a MOSFET M5, and an inductor L5. Pin 1 of the gate driver chip U6 is connected to the anode of diode D11 and one end of capacitor C36, and is also connected to the signal VD_SW_GD. Pin 2 of the gate driver chip U6 is connected to the signal Bridge1_H. Pin 3 of the gate driver chip U6 is connected to the signal Bridge1_L. Pin 8 of the gate driver chip U6 is connected to the cathode of diode D11 and one end of capacitor C37. Pin 7 of the gate driver chip U6 is connected to the cathode of diode D12 and one end of resistor R36. The anode of diode D12 and the other end of resistor R36 are connected to the gate of MOSFET M5. Pin 6 of the gate driver chip U6... The other end of capacitor C37, one end of inductor L5, the source of MOSFET M5, and the drain of MOSFET M6 are connected. Pin 5 of gate driver chip U6 is connected to the cathode of diode D13 and one end of resistor R37. The anode of diode D13 is connected to the other end of resistor R37 and the gate of MOSFET M6. The drain of MOSFET M5 is connected to signal HVC, and the source of MOSFET M6 is connected to signal COMN. The other end of inductor L5 is connected to one end of capacitor C38 and one end of resistor R38 to generate signal OUT1. The other end of resistor R38 is connected to one end of resistor R39 and one end of capacitor C39 to generate signal OUT1_FB. Pin 4 of gate driver chip U6, the other end of capacitor C36, the other end of capacitor C38, the other end of resistor R39, and the other end of capacitor C39 are grounded.

10. A controller for a multi-zone electroluminescent glass according to claim 9, characterized in that: The gate driver chip U6 is a gate driver chip with model number AUIRS2301S.

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