Pluggable optical transmission micro-module assembly method for photoelectric integrated micro-system

Abstract

The invention provides a pluggable optical transmission micro-module assembly method for a photoelectric integrated micro-system. The pluggable optical transmission micro-module assembly method comprises the steps of positioning an optical transmission micro-module lower shell and a substrate, leveling the optical transmission micro-module lower shell, calculating tightening force when the optical transmission micro-module and the lower shell are installed, and calculating screwing depth when the optical transmission micro-module and the lower shell are installed. According to the pluggable optical transmission micro-module assembly method for the photoelectric integrated micro-system, reliable and stable assembly of the optical transmission micro-module is achieved through reasonable design of the pluggable optical transmission micro-module assembly method for the photoelectric integrated micro-system. The assembling method can be suitable for application scenes that a pluggable optical transmission micro module / optical module cannot be installed through a positioning hole due to limitation of characteristics of a substrate material and the like, and the influence of height difference possibly generated by uneven temperature distribution and uneven welding pressure in the welding process of a ball grid array (BGA) is made up.

Description

Technical Field

[0001] This invention relates to the field of optoelectronic integrated microsystems technology, and more specifically to a method for assembling a pluggable optical transmission micromodule for optoelectronic integrated microsystems. Background Technology

[0002] With the rapid development of information technology, optoelectronic integrated microsystems have been widely used in fields such as communication and data processing. One of the core components of these systems is the optical transmission micromodule, responsible for high-speed data transmission and reception. The reliability and stability of the optical transmission micromodule directly affect the performance and lifespan of the entire system. However, in practical applications, the assembly process of optical transmission micromodules often faces numerous challenges, especially in certain application scenarios. For example, in data centers and cloud computing infrastructure, optoelectronic integrated microsystems are widely used to achieve high-density optoelectronic interconnects to support the efficient transmission of massive amounts of data. In this case, the optical transmission micromodule needs to possess high reliability and stability to operate for extended periods in complex electromagnetic and high-temperature environments. Furthermore, in 5G communication and next-generation mobile networks, optoelectronic integrated microsystems are also used to achieve high-frequency signal transmission and processing, which places even higher demands on the assembly precision of the optical transmission micromodule.

[0003] Traditional optical transmission micro-module assembly methods typically rely on positioning holes for precise alignment. While effective in most cases, these methods are unsuitable for certain specialized applications. For example, in high-density packaging or miniaturized optoelectronic integrated systems, substrate space is extremely limited, leaving insufficient room for positioning holes. Furthermore, in some high-end optical devices, substrate materials may be expensive or specialized (such as ceramic or glass substrates), and drilling can reduce substrate strength or even cause breakage, increasing production costs and lowering product yield. Besides space and material limitations, some applications also dictate that positioning holes cannot be drilled due to the substrate's inherent functional characteristics. For instance, in some high-performance optoelectronic integrated systems, the substrate may require excellent thermal conductivity or electromagnetic shielding properties, and drilling could compromise its integrity, thus affecting its functional characteristics. Additionally, in some high-precision optical systems, the flatness and smoothness of the substrate surface are crucial; drilling can introduce stress concentration or surface defects, thereby impacting optical performance.

[0004] Therefore, there is an urgent need to provide a method for assembling pluggable optical transmission micromodules for optoelectronic integrated microsystems. Summary of the Invention

[0005] The purpose of this invention is to overcome the above-mentioned defects of the prior art and provide an assembly method for pluggable optical transmission micro-modules for optoelectronic integrated microsystems, so as to achieve reliable and stable assembly of pluggable optical transmission micro-modules with substrates, while compensating for the influence of solder ball height differences caused by uneven temperature distribution or uneven welding pressure during the welding process of high-speed elastic connectors to substrates.

[0006] The above-mentioned objectives of the present invention are mainly achieved through the following technical solutions:

[0007] This invention provides a method for assembling a pluggable optical transmission micromodule for an optoelectronic integrated microsystem, which mainly includes: positioning the lower housing of the optical transmission micromodule and the substrate, leveling the lower housing of the optical transmission micromodule, calculating the tightening torque when installing the optical transmission micromodule and the lower housing of the optical transmission micromodule, and calculating the screw engagement depth when installing the optical transmission micromodule and the lower housing of the optical transmission micromodule.

[0008] In the positioning of the lower housing of the optical transmission micromodule and the substrate, pole positioning in the XY directions is achieved using a high-speed flexible connector. Specifically, the lower housing of the optical transmission micromodule is tightened to the leveling fixture with screws. After applying adhesive along the dispensing trajectory on the bottom of the lower housing, the pole structure on the connector frame on the substrate is used to align and place the lower housing. The peripheral dimensional tolerance of the high-speed flexible connector is ±D. To ensure the accurate positioning of the lower housing of the optical transmission micromodule in the XY directions, the single-sided gap D / 2 between the connector and the lower housing is controlled.

[0009] During Z-axis positioning, place the pressure block on the leveling fixture and measure the flatness of four points sequentially using a height gauge, ensuring consistent flatness across all points. After measurement, remove the pressure block and observe the glue overflow area. External overflow should not extend beyond the lower housing, and internal overflow should not exceed the glue overflow observation port.

[0010] After baking and curing, remove the pressure block and leveling fixture, and position the waist-shaped posts on the optical transmission micromodule one-to-one with the waist-shaped posts on the lower housing of the optical transmission micromodule. Use a torque screwdriver to fix the optical transmission micromodule to the lower housing of the optical transmission micromodule with screws to ensure that the high-speed elastic connector is evenly and fully stressed. The tightening torque of the screwdriver and the screw engagement depth should be controlled as follows.

[0011] (1) The compression stroke of the spring in the high-speed elastic connector is X, and the minimum positive force of a single spring is Fmin. The pre-designed spring compression ratio is 50%, that is, when the compression amount is X / 2, the spring is in the elastic deformation stage; the positive force of each spring is F(X / 2)=(Fmin / X)*(X / 2); if the high-speed elastic connector contains N springs, then the positive force of N springs is F=N*F(X / 2); therefore, the tightening force of each screw downward needs to be controlled to be FO=F / 4.

[0012] The nominal diameter of the mounting screw for the optical transmission micro-module is d, and the tightening torque coefficient of the lower housing of the optical transmission micro-module is K. The calculated tightening torque of the torque screwdriver required to install the optical transmission micro-module is T = K * FO * d.

[0013] (2) The yield strength of the material of the lower shell of the optical transmission micro-module is Re, and the average diameter of the mounting screw is Dmean. The engagement depth Le = FO / (Re*π*Dmean) is calculated. That is, the engagement depth of the mounting screw in the lower shell of the optical transmission micro-module needs to be controlled to Le, so that it can withstand the torque of T mentioned above without stripping or pulling out.

[0014] Compared with the prior art, the present invention has the following advantages:

[0015] (1) The positioning technology of the lower shell and substrate of the optical transmission micro-module has gotten rid of the traditional method of assembling the optical transmission micro-module by relying on positioning holes. It can be flexibly applied to scenarios where the optical transmission micro-module cannot be installed by positioning holes due to the limitations of substrate material characteristics, thereby improving the assembly efficiency of optoelectronic integrated micro-systems.

[0016] (2) The leveling technology of the lower shell of the optical transmission micro-module compensates for the difference in BGA collapse caused by uneven temperature distribution and uneven welding pressure during the welding process.

[0017] (3) Controlling the tightening torque and screw engagement depth during the installation of the optical transmission micro-module ensures that the optical transmission micro-module forms a stable mechanical connection with the substrate during installation, and does not affect the optical performance of the optical transmission micro-module. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the assembly process for a pluggable optical transmission micromodule used in optoelectronic integrated microsystems.

[0019] Figure 2 An exploded view of a pluggable optical transmission micromodule for optoelectronic integrated microsystems;

[0020] Figure 3 This is a diagram of an assembly tooling for a pluggable optical transmission micromodule used in optoelectronic integrated microsystems.

[0021] Figure 4 This is a flatness test point diagram for a pluggable optical transmission micromodule used in optoelectronic integrated microsystems. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0023] The assembly method of the pluggable optical transmission micro-module 7 in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0024] like Figure 1 As shown, the main steps in assembling the optical transmission micro-module 7 are as follows:

[0025] S1: Positioning of the lower housing 1 and substrate 2 of the optical transmission micro-module;

[0026] S2: Level the lower housing 1 of the optical transmission micro-module, and then place the optical transmission micro-module 7.

[0027] S3: Calculate the tightening force of the mounting screw 9, and then calculate the tightening torque when the optical transmission micro-module 7 and the lower housing 1 of the optical transmission micro-module are installed; based on the calculation results, control the tightening torque to achieve a stable mechanical connection between the optical transmission micro-module 7 and the lower housing 1 of the optical transmission micro-module;

[0028] S4: Calculate the screw engagement depth of the screw 9 when the optical transmission micro-module 7 and the lower housing 1 of the optical transmission micro-module are installed; based on the calculation results, control the screw engagement depth of the screw 9 to achieve uniform and sufficient force on the high-speed elastic connector 4, and achieve consistency of the floating gap between the optical transmission micro-module 7 and the lower housing 1 of the optical transmission micro-module.

[0029] In step S1, as Figure 3 As shown, substrate 2 is fixed to the optical transmission micro-module assembly fixture, and the bottom of substrate 2 is supported. The substrate 2 is held in place by elbows on both sides of the fixture. Then, the lower housing 1 of the optical transmission micro-module is tightened to the leveling fixture 5 with screws. Adhesive is applied along the dispensing trajectory on the bottom of the lower housing using OP606 adhesive. After dispensing, the lower housing 1 of the optical transmission micro-module is positioned relative to substrate 2. In the XY direction, pole positioning is achieved using the outer frame of the LGA01-10P100X-Z11 type high-speed elastic connector 4. Specifically, the lower housing 1 of the optical transmission micro-module is placed on substrate 2, and the pole structure on the outer frame of the high-speed elastic connector 4 on substrate 2 is used to align with the lower housing. The peripheral dimensional tolerance of the high-speed elastic connector 4 is ±0.15mm, and the single-sided gap between the connector and the lower housing is 0.08mm. Figure 2 As shown, a pluggable optical transmission micromodule 7 for optoelectronic integrated microsystems.

[0030] In step S2, after the lower housing 1 of the optical transmission micro-module is aligned and positioned with the substrate 2 in the XY direction, the pressure block 6 is placed on the leveling fixture 5, and then the following steps are performed sequentially. Figure 4After placing the height gauge at point A and zeroing it, measure the flatness of point A'; place the height gauge at point B and zeroing it, then measure the flatness of point B'; place the height gauge at point C and zeroing it, then measure the flatness of point C'; place the height gauge at point D and zeroing it, then measure the flatness of point D'. The measurements show consistent flatness along the Z-axis. After measurement, remove the pressure block and observe the glue overflow area. External overflow does not exceed the lower housing, and internal overflow does not exceed the glue overflow observation port. This step primarily compensates for the height difference that may occur during BGA soldering due to uneven temperature distribution and uneven soldering pressure.

[0031] In step S3, the three waist-shaped pillars on the top, left, and right of the optical transmission micro-module 7 are positioned in a one-to-one correspondence with the three waist-shaped pillars on the top, left, and right of the lower housing 1 of the optical transmission micro-module.

[0032] In step S4, in order to ensure the consistency of the floating gap between the optical transmission micro-module 7 and the lower housing 1 of the optical transmission micro-module, and at the same time to ensure that the high-speed elastic connector 4 is subjected to uniform and sufficient force, and to ensure that the optical transmission micro-module 7 and the substrate 2 form a stable mechanical connection, the tightening torque of the torque screwdriver and the engagement depth of the screw 9 must be accurately controlled when the optical transmission micro-module 7 is installed.

[0033] The compression stroke of the upper spring 3 of the high-speed elastic connector 4 is 0.2mm, and the minimum positive force of a single spring 3 is 15g. The compression amount of the upper spring 3 of the connector is taken as the midpoint of the stroke, that is, the compression ratio of the spring 3 is 50%. When the compression amount is 0.1mm, the spring 3 is in the elastic deformation stage, and the positive force of each spring 3 is F(0.1)=(15*0.00981 / 0.2)*0.1N=0.0736N; the high-speed elastic connector 4 contains 100 springs 3, so the positive force of 100 springs 3 is F=100*0.0736N=7.36N; therefore, the tightening force of each screw 9 needs to be controlled to be FO=7.36 / 4=1.84N.

[0034] The mounting screws 9 used in the optical transmission micro-module 7 are M1.6*3, made of A27 stainless steel, with a nominal diameter of 1.6mm. The tightening torque coefficient between the screws and the lower housing 1 of the optical transmission micro-module is 0.22. The tightening torque of the control torque screwdriver when installing the optical transmission micro-module 7 is calculated to be T=0.22*0.0016*1.84Nm=0.648N.mm.

[0035] The average diameter of the screws 9 used when installing the optical transmission micro-module 7 is 1.5mm, and the yield strength of the material of the lower housing 1 of the optical transmission micro-module is 300MPa. The engagement depth Le can be calculated as 1.84 / (300*π*1.5) = 1.3mm. That is, as long as the engagement depth of the mounting screws 9 of the optical transmission micro-module 7 in the lower housing 1 of the optical transmission micro-module is 1.3mm, it can withstand a torque of 0.648N.mm (corresponding to an axial force of 1.84N) without stripping or pulling out.

[0036] The contents not described in detail in this specification are common knowledge to those skilled in the art.

[0037] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make possible changes and modifications to the technical solutions of the present invention by utilizing the methods and techniques disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solutions of the present invention shall fall within the protection scope of the technical solutions of the present invention.

Claims

1. A method for assembling a pluggable optical transmission micromodule for an optoelectronic integrated microsystem, characterized in that, Includes the following steps: Step 1: Position the lower housing (1) of the optical transmission micro-module with the substrate (2); Step 2: Level the lower housing (1) of the optical transmission micro-module, and then place the optical transmission micro-module (7) in it. Step 3: Calculate the tightening force of the mounting screw (9), and then calculate the tightening torque when the optical transmission micro-module (7) and the lower housing (1) of the optical transmission micro-module are installed; according to the calculation results, control the tightening torque to achieve a stable mechanical connection between the optical transmission micro-module (7) and the lower housing (1) of the optical transmission micro-module; Step 4: Calculate the screw engagement depth of the screw (9) when the optical transmission micro-module (7) and the lower housing (1) of the optical transmission micro-module are installed; according to the calculation results, control the screw engagement depth of the screw (9) to achieve uniform and sufficient force on the high-speed elastic connector (4) and achieve consistency of the floating gap between the optical transmission micro-module (7) and the lower housing (1) of the optical transmission micro-module.

2. The assembly method for a pluggable optical transmission micromodule for an optoelectronic integrated microsystem according to claim 1, characterized in that, In step 1, the substrate (2) is first placed into the optical transmission micro-module assembly fixture, the bottom of the substrate (2) is supported, and the XY direction is limited. At the same time, the two sides of the fixture are pressed down on the two sides of the substrate (2) to fix the substrate (2).

3. The assembly method for a pluggable optical transmission micromodule for an optoelectronic integrated microsystem according to claim 1, characterized in that, In step 2, the lower housing (1) of the optical transmission micro-module is tightened with screws to the leveling fixture (5), and then glue is applied along the bottom glue application trajectory of the lower housing (1) of the optical transmission micro-module. After the glue application is completed, the lower housing (1) of the optical transmission micro-module is positioned with the substrate (2). In the XY direction, the pole is positioned by the outer frame of the high-speed elastic connector (4). In the Z direction, the flatness of the lower housing (1) of the optical transmission micro-module is measured and leveling is performed in the Z direction.

4. The assembly method for a pluggable optical transmission micromodule for an optoelectronic integrated microsystem according to claim 3, characterized in that, The lower housing (1) of the optical transmission micro-module is positioned with the substrate (2) as follows: The lower housing (1) of the optical transmission micro-module is placed on the substrate (2), and the pole structure on the outer frame of the high-speed elastic connector (4) on the substrate (2) is aligned with the lower housing (1); the peripheral dimension accuracy tolerance of the high-speed elastic connector (4) is ±D, and the single-sided gap between the high-speed elastic connector (4) and the lower housing (1) of the optical transmission micro-module is D / 2, to ensure the accurate position of the lower housing (1) of the optical transmission micro-module in the XY direction.

5. The assembly method for a pluggable optical transmission micromodule for an optoelectronic integrated microsystem according to claim 3, characterized in that, After the lower housing (1) of the optical transmission micro-module and the substrate (2) are aligned and positioned in the XY direction, the pressure block (6) is placed on the leveling fixture (5). Then, the height gauge is placed at point A in the middle of the right frame of the high-speed elastic connector (4) and then zeroed. The flatness of the point A' is measured at the midpoint of the straight line formed between the middle of the right frame of the lower housing (1) of the optical transmission micro-module and point A. The height gauge is placed at point B in the middle of the upper frame of the high-speed elastic connector (4) and then zeroed. The flatness of the point B' is measured at the midpoint of the straight line formed between the middle of the upper frame of the lower housing (1) of the optical transmission micro-module and point B. The height gauge is placed at point C in the middle of the left frame of the high-speed elastic connector (4) and then zeroed. The flatness of point C' is recorded as the midpoint of the straight line formed by the middle of the left frame of the lower housing (1) of the optical transmission micro-module and point C. The height gauge is placed at the middle of the lower frame of the high-speed elastic connector (4) and marked as point D. After the height gauge is zeroed, the flatness of point D' is recorded as the midpoint of the straight line formed by the middle of the lower frame of the lower housing (1) of the optical transmission micro-module and point D. After the measurement is completed, the flatness of points A', B', C' and D' is compared. If the flatness is inconsistent, continue to apply glue along the glue application trajectory at the bottom of the lower housing (1) of the optical transmission micro-module and repeat the above steps. If the flatness is consistent, remove the pressure block (6) and observe the glue overflow range. The external overflow should not exceed the lower housing (1) of the optical transmission micro-module and the internal overflow should not exceed the glue overflow observation port.

6. The assembly method for a pluggable optical transmission micromodule for an optoelectronic integrated microsystem according to claim 1, characterized in that, In step 2, after leveling, the optical transmission micro-module (7) is placed, which means that the three waist-shaped columns on the upper, left and right of the optical transmission micro-module (7) are placed in correspondence with the three waist-shaped columns (8) on the upper, left and right of the lower shell (1) of the optical transmission micro-module.

7. The assembly method for a pluggable optical transmission micromodule for an optoelectronic integrated microsystem according to claim 1, characterized in that, In step 3, the tightening torque is specifically calculated as follows: According to the manual of the high-speed elastic connector (4), the compression stroke of the upper spring (3) is X, and the minimum positive force of the single spring (3) is Fmin; the compression ratio of the spring (3) is pre-designed to be 50%, that is, when the compression amount is X / 2, the spring (3) is in the elastic deformation stage, and the positive force of each spring (3) is F(X / 2)=(Fmin / X)*(X / 2). If the high-speed elastic connector (4) contains N springs, then the positive force of N springs is F=N*F(X / 2), and then the tightening force of each screw downward needs to be controlled to be FO=F / 4; The nominal diameter of the mounting screw (9) of the optical transmission micro-module is d. Based on its material properties, the tightening torque coefficient K between it and the lower housing (1) of the optical transmission micro-module is obtained. Then, the tightening torque of the torque screwdriver that needs to be controlled when installing the optical transmission micro-module (7) is calculated to be T=K*FO*d.

8. The assembly method for a pluggable optical transmission micromodule for an optoelectronic integrated microsystem according to claim 7, characterized in that, In step 4, the engagement depth is specifically calculated as follows: engagement depth Le = FO / (Re * π * Dmean), where Re is the yield strength of the material of the lower housing (1) of the optical transmission micro-module, and Dmean is the average diameter of the mounting screw (9).

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