Vehicle-mounted C-band power amplifier

Abstract

The invention relates to a vehicle-mounted C-frequency-band power amplifier, and belongs to the technical field of electronic countermeasures. The system comprises a signal amplification unit, a power amplifier control unit, a secondary power supply, a power amplifier liquid cooling cabinet and the like, and has multiple functions of silencing, amplification, control, protection, communication and the like. On the basis of the high-power cooling requirement, all parts are subjected to integrated comprehensive structural design, and the double advantages of efficient liquid cooling heat dissipation and high-linearity design are achieved. The system has the advantages of high emission output power, high efficiency, high linearity, high communication, high working reliability and the like. The invention is suitable for being used in a C-band ultra-wideband transmit-receive system.

Description

Technical Field

[0001] This invention relates to a C-band power amplifier for automotive applications, belonging to the field of amplifier technology, and can meet the application requirements of C-band broadband high-power systems. Background Technology

[0002] As a core component of wireless communication systems, vehicle-mounted C-band power amplifiers have extremely stringent requirements for power, bandwidth, linearity, communication performance, and reliability. They need to simultaneously meet the requirements of high power, high efficiency, high linearity, and ultra-wideband. Traditional design concepts cannot meet the usage requirements of vehicle-mounted systems. Summary of the Invention

[0003] This invention provides an in-vehicle C-band power amplifier. The amplifier uses ADS large-signal model simulation to perform impedance matching of the power transistors, employs a 3dB balanced coupler for circuit splitting and combining, designs a high-efficiency final-stage amplification module, and designs a high-power waveguide and high-power combiner assembly using a five-stage magic T cascade method to achieve low-loss power combining in the C-band. At the same time, the power amplifier uses a combination of digital simulation and structural optimization to design a liquid-cooled chassis, and uses ICEPAK software to design a high-efficiency heat sink, solving the problems of high power, high efficiency, high linearity, and efficient heat dissipation in in-vehicle power amplifiers.

[0004] A vehicle-mounted C-band power amplifier, include: Signal amplification unit 1 is used to amplify the input signal; The power amplifier control unit 2 provides logic control signals to the signal amplification unit and acquires the operating current of the sixteen final stage amplification modules in real time; it communicates with the host computer, receives commands from the host computer, and reports the operating status and fault information of the power amplifier. The secondary power supply 3 of the power amplifier converts the input voltage into the corresponding output voltage. Both the power amplifier control unit 2 and the signal amplification unit 1 are connected to the power amplifier secondary power supply 3 and are powered by the power amplifier secondary power supply 3; the power amplifier control unit 2 and the signal amplification unit 1 are connected to transmit control information to the signal amplification unit. The power amplifier liquid-cooled chassis 18 contains the power amplifier control unit 2, which is located in the power amplifier liquid-cooled chassis 4 and is used to dissipate the large amount of heat generated by the signal amplification unit 2.

[0005] Furthermore, the signal amplification unit 1 includes: a driver amplification module 4, a secondary amplification module 5, a filter 6, a splitter 7, a final stage amplification module 8, a waveguide high-power combiner assembly 9, and a sapphire pressure window 10 connected in sequence. The amplification module 4 is connected to the external signal input, the output is connected to the secondary amplification module 5, then to the filter 6, and then to the splitter 7 to divide the input signal equally. The split signal is then amplified by sixteen final stage amplification modules 8, and then enters the waveguide high-power combiner assembly 9 for signal synthesis and coupling. The output is connected to the sapphire pressure window 10 for input.

[0006] Furthermore, the final stage amplifier module 8 adopts a quick-connect design; it has a separate internal cavity, the two amplification paths share the same control circuit, and adopt a step-by-step gain control method; the high-power combiner assembly adopts a five-stage magic T cascade and a split-type isolated load design.

[0007] Furthermore, the final stage method module 8 includes: isolator one, preamplifier, isolator two, driver amplifier, 3dB balanced splitter, final stage amplifier, and 3dB balanced combiner connected in sequence; the RF input signal is amplified by three stages of amplifiers, and the final stage amplifier uses two power transistors for combining to improve output power; each stage of amplifier is well cascaded and matched through isolators and impedance transformation lines, and the final stage amplifier uses a 3dB balanced coupler for splitting / combining to achieve a power output of over 150W; the two amplifiers share a single control circuit, and the RF circuits amplify independently.

[0008] 1. The final stage module of the signal amplification unit of this invention uses the ADS large signal model to accurately model the power transistor, establishes the DC bias and matching circuit using simulation software, and adopts a 3dB balanced coupler for circuit splitting and combining. While keeping the output power constant, it can significantly improve the linearity characteristics of the circuit and reduce the size of the device. 2. The waveguide high-power combiner component in the signal amplification unit of this invention adopts a five-stage magic-T cascade configuration. The magic-Ts satisfy the power combining of equal-amplitude and in-phase power signals, while ensuring high isolation between input ports and reducing mutual interference. Simulation using electromagnetic simulation software CST shows that when the output power of the combining port reaches 6400W, the maximum field strength within the combiner is significantly lower than the waveguide breakdown field strength in air.

[0009] 3. The sapphire pressure window in the signal amplification unit of this invention uses a sapphire window with circumferential metallization treatment. It has low insertion loss, high high temperature resistance, and can be reliably sealed with metal to ensure high vacuum and airtightness of the equipment.

[0010] 4. The power amplifier control unit of this invention can monitor the operating current of the sixteen final stage amplification modules in real time to determine the working status of the final stage modules. At the same time, it can collect the power supply voltage of the secondary power supply, report and display the power supply voltage status, and can burn and download the monitoring program through the external communication interface of the chassis.

[0011] 5. The signal power amplifier liquid-cooled chassis of this invention adopts an integrated structural design technology, with sixteen final-stage amplification modules evenly placed on four layers of liquid-cooled surfaces to ensure efficient heat dissipation for all amplification modules; the modules are connected to the waveguide high-power combiner assembly via quick-connect fittings and secured by locking strips in guide slots, facilitating installation and subsequent replacement and maintenance; to ensure the heat dissipation requirements of the high-power combiner assembly, the liquid-cooled chassis inlet has a one-to-three function, with one stream of coolant entering the cold plate at the bottom of the waveguide high-power combiner assembly, fully ensuring efficient heat dissipation for the waveguide high-power combiner and its four isolated loads. Attached Figure Description

[0012] Figure 1 This is a block diagram illustrating the electrical principle of the present invention.

[0013] Figure 2 This is a block diagram of the electrical principle of the signal amplification unit of the present invention.

[0014] Figure 3 This is a block diagram of the electrical principle of the final stage amplification module of the present invention.

[0015] Figure 4 This is a block diagram of the power amplifier liquid-cooled chassis structure installation of the present invention. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0017] A vehicle-mounted C-band power amplifier includes: a signal amplification unit 1 for amplifying input signals; a power amplifier control unit 2 for providing logic control signals to the signal amplification unit; real-time monitoring of the operating current of all final-stage amplification modules; communication with a host computer to receive commands and report the power amplifier's operating status and fault information; a power amplifier secondary power supply 3 for converting the input DC28V voltage to the required DC15V, DC5V, and DC-5V; and a power amplifier liquid-cooled chassis 18 to ensure efficient heat dissipation, thus guaranteeing the power amplifier's stability and reliability. Both the power amplifier control unit 2 and the signal amplification unit 1 are connected to and powered by the power amplifier secondary power supply 3. The power amplifier control unit 2 transmits control information to the signal amplification unit, and the power amplifier liquid-cooled chassis 18 dissipates the large amount of heat generated by the signal amplification unit 2.

[0018] The signal amplification unit 1 of the present invention includes: a driver amplification module 4, a secondary amplification module 5, a filter 6, a splitter 7, a final stage amplification module 8, a waveguide high-power combiner assembly 9, and a sapphire pressure window 10 connected in sequence. The driver amplification module 4 is connected to the external signal input, and its output is connected to the secondary amplification module 5, then to the filter 6 for filtering, and then enters the splitter 7 to divide the signal equally. The split signal is then amplified by sixteen dual-channel final stage amplification modules 8, and then enters the waveguide high-power combiner assembly 9 for signal synthesis and coupling. The output is connected to the sapphire pressure window 10 for input.

[0019] The final stage amplifier module 8 adopts a quick-connect design; it has a separate internal cavity, the two amplification paths share the same control circuit, and adopt a step-by-step gain control method; the waveguide high-power combiner assembly adopts a five-stage magic T cascade and a split-type isolated load design. The power amplifier liquid-cooled chassis 18 uses four layers of liquid cooling surfaces to dissipate heat from the sixteen final stage amplification modules, ensuring efficient heat dissipation of the power amplifier.

[0020] The following is a more detailed explanation: Reference Figures 1 to 2 This invention includes a signal amplification unit 1, a power amplifier control unit 2, a power amplifier secondary power supply 3, and a power amplifier liquid-cooled chassis 18. The signal amplification unit 1 amplifies the input small radio frequency signal to the large signal required by the power amplifier. The power amplifier control unit 2 employs communication control, enabling real-time monitoring of the operating current of the sixteen final stage modules. It can receive commands from the host computer, report the power amplifier's operating status and fault information, and implement the power amplifier's protection function. The power amplifier power supply 3 converts the input DC28V voltage to the required DC15V, DC5V, and DC-5V for operation.

[0021] The signal amplification unit of this invention includes a driver amplification module 4, a secondary amplification module 5, a filter 6, a splitter 7, a final-stage amplification module 8, a waveguide high-power combiner assembly 9, and a sapphire pressure window 10. The driver amplification module 4 is connected to the external signal input, and its output is connected to the secondary amplification module 5. The amplified signal is filtered by the filter 6 to increase out-of-band harmonic suppression. It then enters the splitter 7 to divide the input signal into equal parts. The split signals enter sixteen final-stage amplification modules 8 for power amplification, and then enter the waveguide high-power combiner assembly 9 for signal synthesis and coupling. The synthesized signal then passes through the sapphire pressure window 10 before being output.

[0022] Its application specifications in the field of electronic warfare are as follows: operating frequency band: C band, continuous wave output power ≥2500W, gain: ≥63dB, spurious rejection ≥60dBc, input-output VSWR ≤2:1, third-order intermodulation rejection: ≥25 dBc (total power of two tones 800W).

[0023] Reference Figures 1 to 2 The present invention includes a signal amplification unit 1, a power amplifier control unit 2, a power amplifier power supply 3, and a power amplifier liquid cooling chassis 18. Figure 1 This is a block diagram of the electrical principle of the present invention. The embodiments are as follows: Figure 1 Connection lines. The signal amplification unit amplifies the small input RF signal to the large signal required by the power amplifier. The power amplifier control unit 2 sends logic control signals to the signal amplification unit, implements the power amplifier's protection functions, and has the ability to communicate with a host computer, receiving commands and reporting the power amplifier's operating status and fault information. The power amplifier power supply 3 converts the input DC28V voltage to the required DC15V, DC5V, and DC-5V.

[0024] Figure 2 This is a block diagram of the electrical principle of the signal amplification unit of the present invention. The embodiments are as follows: Figure 2 Connection circuit. The small input signal is first amplified by the drive amplification module 4, then amplified a second time by the secondary amplification module 5. The amplified signal is then divided equally by the splitter 7, and subsequently enters sixteen final-stage amplification modules 8 for further amplification. The amplified multi-channel signals are then combined by the waveguide high-power combiner assembly 9. The combined signal is then output after passing through the sapphire pressure window 10. The signal forward-coupled from the high-power combiner assembly is split into two paths that enter the power amplifier control unit 3: one path for forward power control and the other for forward power indication.

[0025] Figure 3 This is a block diagram of the electrical principle of the final stage amplification module of the present invention. The embodiments are as follows: Figure 3 Connection circuit. The equally divided signal output from splitter 7 first passes through isolator 11, then through preamplifier 12 for the first amplification, then through isolator 2 13, and then through driver amplifier 14 for the second amplification. The amplified signal is then divided equally by 3dB balanced splitter 15, and then enters two final stage amplifiers 16 for further amplification. The two amplified signals are then combined and output by 3dB balanced combiner 17. In order to reduce the size of the final stage amplifier module, the final stage amplifier module 8 is equipped with two identical amplifier circuits. The two amplifiers share the control circuit, and the RF circuits amplify independently.

[0026] The input radio frequency signal is amplified by the signal amplification unit. The power amplifier control unit provides power amplifier control, protection and communication functions. The power amplifier power supply converts the input DC28V into the DC voltage required by the power amplifier.

[0027] The power amplifier features an integrated cooling plate, and all other components employ a modular design. Major heat-generating devices are mounted on four layers of liquid-cooled surfaces within the chassis. The modules are connected to the waveguide high-power combiner assembly via quick-connect fittings. This layered design effectively dissipates the heat generated during amplifier operation, improving equipment reliability and significantly reducing its size.

[0028] It should be noted that the above description is merely a preferred application example of the present invention and is not intended to limit the scope of protection of the present invention. All technical solutions employing equivalent substitutions or equivalent transformations are within the scope of protection of the present invention.

Claims

1. A vehicle-mounted C-band power amplifier, characterized in that, include: Signal amplification unit (1) is used to amplify the input signal; The power amplifier control unit (2) provides logic control signals to the signal amplification unit and acquires the operating current of the sixteen final stage amplification modules in real time; it communicates with the host computer, receives commands from the host computer, and reports the working status and fault information of the power amplifier. The secondary power supply of the power amplifier (3) converts the input voltage into the corresponding output voltage; The power amplifier control unit (2) and the signal amplification unit (1) are both connected to the power amplifier secondary power supply (3) and are powered by the power amplifier secondary power supply (3); the power amplifier control unit (2) and the signal amplification unit (1) are connected and transmit control information to the signal amplification unit; The power amplifier liquid cooling chassis (18) and the power amplifier control unit (2) are located in the power amplifier liquid cooling chassis (4) to dissipate the large amount of heat generated by the signal amplification unit (2).

2. The vehicle-mounted C-band power amplifier according to claim 1, characterized in that, The signal amplification unit (1) includes: a driver amplification module (4), a secondary amplification module (5), a filter (6), a splitter (7), a final stage amplification module (8), a waveguide high-power combiner assembly (9), and a sapphire pressure window (10) connected in sequence. The amplification module (4) is connected to the external signal input, the output is connected to the secondary amplification module (5), then connected to the filter (6), and then enters the splitter (7) to divide the input signal equally. The split signal is amplified by sixteen final stage amplification modules (8), and then enters the waveguide high-power combiner assembly (9) for signal synthesis and coupling. The output is connected to the sapphire pressure window (10) input.

3. The vehicle-mounted C-band power amplifier according to claim 1, characterized in that, The final stage amplifier module (8) adopts a quick-connect design; it has a separate internal cavity, the two amplifications share the same control circuit, and adopt a step-by-step gain control method; the high-power combiner assembly adopts a five-stage magic T cascade and a split-type isolated load design.

4. A vehicle-mounted C-band power amplifier according to claim 2, characterized in that, The final stage method module (8) includes: isolator one, preamplifier, isolator two, driver amplifier, 3dB balanced splitter, final stage amplifier and 3dB balanced combiner connected in sequence; the RF input signal is amplified by the three-stage amplifier, and the last stage amplifier uses two power transistors to combine and improve the output power; the amplifiers at each stage are well cascaded and matched through isolators and impedance transformation lines, and the final stage amplifier uses a 3dB balanced coupler to split / combine, achieving a power output of more than 150W; the two amplifiers share a control circuit, and the RF circuits amplify independently.

Images