Molding condition adjustment method and molding condition adjustment device

Abstract

Provided is a molding condition adjustment method capable of appropriately adjusting molding conditions during blow molding. A molding condition adjustment method for a molding condition adjustment device (3) adjusts molding conditions when a hollow molded body is manufactured by blow molding an object to be molded by a molded body manufacturing device operating in accordance with a plurality of device setting values. The molding condition adjustment method includes a plurality of adjustment steps (S20 to S50) in which a plurality of adjustment items related to a molded body and a molded body are adjusted in an adjustment order predetermined for the plurality of adjustment items. Each of the plurality of adjustment steps (S20 to S50) sets a device setting value related to the adjustment item by at least one setting method among the plurality of setting methods, thereby adjusting the adjustment item.

Description

Technical Field

[0001] This invention relates to a method and apparatus for adjusting molding conditions. Background Technology

[0002] Conventionally, molding body manufacturing apparatuses have been used as devices for blow molding hollow molded bodies (bottles, etc.) from a preform (preform, parison, etc.). Molding body manufacturing apparatuses are, for example, devices that manufacture molded bodies from a preform by performing a heating process, a stretching process, and a blow molding process on the preform (see, for example, Patent Document 1).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2007-045119 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] The shape and quality of a molded body, manufactured through processes such as heating, stretching, and blow molding, are affected by various molding conditions, including temperature, pressure, and time. Therefore, to achieve the desired shape and quality for multiple adjustments, it is necessary to determine the molding conditions for each process before production. However, because molding conditions can be combined in various ways, this process often relies heavily on the experience and intuition of skilled personnel, making it a very difficult operation.

[0008] The present invention was made to solve the problems mentioned above, and its purpose is to provide a molding condition adjustment method and a molding condition adjustment device that can appropriately adjust the molding conditions in blow molding.

[0009] Solution for solving the problem

[0010] To achieve the above objectives, one aspect of the present invention involves a molding condition adjustment method that uses a computer to adjust the molding conditions when a molding body manufacturing apparatus, which operates according to multiple device setting values, blow-moldes a workpiece to manufacture a hollow molded body.

[0011] The molding condition adjustment method includes multiple adjustment steps that adjust multiple adjustment items in a predetermined order for multiple adjustment items related to the molded body and the molded body.

[0012] In each of the multiple adjustment steps, the device setting value related to the adjustment item is set by at least one of the multiple setting methods, thereby adjusting the adjustment item.

[0013] The effects of the invention

[0014] According to the molding condition adjustment method and apparatus of the present invention, when multiple adjustment items are adjusted in a predetermined adjustment sequence in multiple adjustment steps, a device setting value related to the adjustment item is set by at least one of multiple setting methods, thereby adjusting the adjustment item. Therefore, the molding conditions in blow molding can be appropriately adjusted. Attached Figure Description

[0015] Figure 1 This is a schematic diagram representing an example of a bottle manufacturing management system 1.

[0016] Figure 2 This is a schematic front view showing an example of a preform heating device 20d.

[0017] Figure 3 This is a block diagram representing an example of a preform heating device 20d.

[0018] Figure 4 This is a schematic top view showing an example of a blow molding apparatus 20f.

[0019] Figure 5 This is a schematic diagram showing an example of the molding unit 25.

[0020] Figure 6 This is a block diagram representing an example of a blow molding apparatus 20f.

[0021] Figure 7 This is a flowchart illustrating the bottle manufacturing process.

[0022] Figure 8 This is a data structure diagram representing an example of database 310.

[0023] Figure 9 This is a block diagram showing an example of a molding condition adjustment device 3.

[0024] Figure 10 This is a hardware structure diagram showing an example of a computer 900 that comprises various devices.

[0025] Figure 11 This is a flowchart illustrating an example of a molding condition adjustment method for the molding condition adjustment device 3.

[0026] Figure 12This is a flowchart detailing the adjustment steps (step S20) for adjusting the temperature of the preform 10.

[0027] Figure 13 This is a flowchart detailing the adjustment steps (step S30) for adjusting the mass distribution of the adjustment bottle 11.

[0028] Figure 14 This is a flowchart detailing the steps (step S40) for adjusting the height of the adjustment bottle 11.

[0029] Figure 15 This is a flowchart detailing the steps (step S50) for adjusting the internal volume of the adjustment bottle 11. Detailed Implementation

[0030] Hereinafter, embodiments for carrying out the present invention will be described with reference to the accompanying drawings, etc. The scope of the description for achieving the objectives of the present invention is schematically shown below, primarily focusing on the scope of the description of corresponding parts of the present invention; omitted descriptions are based on prior art.

[0031] (The composition of the bottle manufacturing management system 1)

[0032] Figure 1 This is a schematic diagram illustrating an example of a bottle manufacturing management system 1. The bottle manufacturing management system 1 functions as a system for manufacturing hollow molded bodies by blow molding a workpiece. Furthermore, the bottle manufacturing management system 1 is a system for managing various information related to the workpiece, the molded body, molding conditions, etc.

[0033] In this embodiment, the case of manufacturing a hollow bottle 11 (e.g., a PET bottle) as a molded body from a preform 10, which is a type of molded body, by biaxial stretch blow molding will be described. It should be noted that the molded body is not limited to the bottle 11, and can have any shape as long as it is blow molded from the preform.

[0034] like Figure 1 As shown, the bottle manufacturing management system 1 comprises a bottle manufacturing device 2, a molding condition adjustment device 3, and a user terminal device 4 as its main components. Each device 2 to device 4 is, for example, a general-purpose or special-purpose computer (see below). Figure 10 The system is configured to connect to a wired or wireless network 5, enabling it to send and receive various types of data. Furthermore, the number of devices 2 to 4 and the connection structure of the network 5 are not limited to... Figure 1 Examples can also be modified appropriately.

[0035] The bottle manufacturing apparatus 2 is an apparatus that blow-moldes a preform 10 into a bottle 11 by using a mold 200 and operating according to adjusted molding conditions. The molding conditions include various device settings for each part of the bottle manufacturing apparatus 2 when it operates.

[0036] The bottle manufacturing apparatus 2 includes: an injection molding unit 20a, which injects synthetic resin as raw material into a preform 10; a preform removal unit 20b, which removes the preform 10 from the injection molding unit 20a and transfers it to a preform conveyor 20c; a preform conveyor 20c, which transports the preform 10; a preform heating unit 20d, which is located midway along the preform conveyor 20c and heats the preform 10; a preform supply unit 20e, which receives the preform 10 from the preform conveyor 20c and supplies it to a blow molding unit 20f; a blow molding unit 20f, which molds the heated preform 10 into a bottle 11; a molded body removal unit 20g, which removes the bottle 11 from the blow molding unit 20f and transfers it to a molded body conveyor 20h; and a molded body conveyor 20h, which transports the molded bottle 11. It should be noted that the configuration of the bottle manufacturing apparatus 2 is not limited to... Figure 1 Examples can also be modified appropriately.

[0037] The molding condition adjustment device 3 is a device that works in conjunction with the bottle manufacturing device 2 and the user terminal device 4 to adjust the molding conditions (specifically, various device settings) for multiple adjustment items related to the preform 10 and the bottle 11.

[0038] The molding condition adjustment device 3 includes a database 310, which is capable of establishing and registering molding condition information A, representing molding conditions, with adjustment item information B, representing target values ​​or adjustment results for multiple adjustment items. The molding condition information A and adjustment item information B registered in the database 310 are referenced by the bottle manufacturing device 2 and the user terminal device 4 for the manufacturing of the bottle 11.

[0039] User terminal device 4 is, for example, a device used by users such as the manufacturing manager of bottle 11. User terminal device 4 is equipped with applications, web browsers, and other programs, accepts various input operations, and outputs various information through displaying images and sound. User terminal device 4 is used when users input instructions to molding condition adjustment device 3, output the processing results of molding condition adjustment device 3, or edit database 310.

[0040] (Preform heating device 20d)

[0041] Figure 2 This is a schematic front view showing an example of a preform heating device 20d. Figure 3This is a block diagram illustrating an example of a preform heating device 20d. The preform heating device 20d performs a preform heating process on preforms 10 that are sequentially conveyed by a preform conveyor 20c. The preforms 10 are held upright, for example, by a self-rotating mandrel (not shown), and are conveyed by the preform conveyor 20c at a predetermined conveying speed.

[0042] The preform heating device 20d has multiple preform heating units 21 for heating the preform 10 and a control unit 22 for controlling each part of the preform heating device 20d as its main components. Figure 1 As shown, multiple preform heating units 21 are arranged at predetermined intervals along the conveying direction of the preform conveyor 20c to the preform 10.

[0043] Each of the multiple preform heating units 21 includes: multiple preform heating modules 210 for heating different parts of the preform 10; a preform local heating module 211 for locally heating a portion of the preform 10; and a temperature sensor 212. The multiple preform heating modules 210 are arranged at predetermined intervals in the vertical direction and are each composed of an infrared heater or the like. The preform local heating module 211 is, for example, positioned at a location capable of locally heating the neck of the preform 10 and is also composed of an infrared heater or the like. In this case, the preform local heating module 211 can also be used concurrently with the preform heating module 210. The number and arrangement of the preform heating modules 210, the preform local heating module 211, and the temperature sensor are not limited to... Figure 2 The example can also be modified appropriately. It should be noted that the preform heating unit 21 may also include a heating module disposed inside the preform 10 to heat the inside of the preform 10. In addition, the preform heating unit 21 may also include a blower module that supplies air at a specified temperature to the preform 10.

[0044] The control unit 22 is electrically connected to the module groups and sensor groups of the multiple preform heating units 21, and functions as a control unit for unified control of the multiple preform heating units 21. It should be noted that... Figure 3 The diagram shows the preform heating module 210 and the preform local heating module 211 as part of the module group, and the temperature sensor 212 as part of the sensor group, but the diagrams of other module groups and sensor groups are omitted.

[0045] The control unit 22 is, for example, a general-purpose or special-purpose computer (see below). Figure 10The control unit 22 is composed of a control unit 220, a communication unit 221, an input unit 222, an output unit 223, and a storage unit 224 as its main components.

[0046] The storage unit 224 stores various programs (operating system (OS), preform heating program 2240, etc.) and data (device setting information 2241, etc.) used in the operation of the preform heating device 20d. The device setting information 2241 is information that can register various device setting values ​​when the preform heating device 20d performs preform heating treatment, and is configured to be editable by the device user via a display image (setting interface).

[0047] The control unit 220 may be composed of, for example, a processing unit (CPU, MPU, GPU, etc.) and a sequencer. The control unit 220 functions as a preform heating control unit 2200 by executing a preform heating program 2240 stored in the storage unit 224.

[0048] The preform heating control unit 2200 activates the module groups of each preform heating unit 21. At this time, the preform heating control unit 2200 activates each preform heating module 210 according to the device setting value registered in the device setting information 2241, thereby heating each part of the preform 10 respectively.

[0049] The communication unit 221 connects to the communication network and functions as a communication interface for transmitting and receiving various data not only with the molding condition adjustment device 3 and the user terminal device 4, but also with the terminal device (not shown) used by the device user of the preform heating device 20d and the manufacturing management device (not shown) that performs manufacturing management in the bottle manufacturing management system 1. The input unit 222 accepts various input operations performed by the user of the preform heating device 20d, and the output unit 223 outputs various information to the device user through image display, signal tower illumination, and buzzer sounding, thereby functioning as a user interface.

[0050] (Blow molding device 20f)

[0051] Figure 4 This is a schematic top view showing an example of a blow molding apparatus 20f. Figure 5 This is a schematic diagram showing an example of the molding unit 25. Figure 6This is a block diagram illustrating an example of a blow molding apparatus 20f. The blow molding apparatus 20f is an apparatus that uses multiple molds 200 (12 in this embodiment) to supply blow molding fluid into a preform 10 held by the molds 200, and repeatedly performs a blow molding process to form a hollow bottle 11 from the preform 10 for each mold 200. It should be noted that in this embodiment, the blow molding fluid is described as air, but it can also be any gas other than air, or even a liquid.

[0052] The blow molding apparatus 20f comprises a rotating unit 24, a plurality of molding units 25 (12 in this embodiment) arranged at predetermined intervals on the circumferential track of the rotating unit 24, and a control unit 26 for controlling each part of the blow molding apparatus 20f, as its main components.

[0053] The rotating unit 24 is formed in the shape of a disk, for example, and has a rotating support portion 240 that supports a plurality of molding units 25 and a rotating mechanism portion 241 that rotates the rotating support portion 240 at a predetermined rotation speed (rotation cycle).

[0054] Each of the multiple molding units 25 includes: a mold support unit 251 that supports the mold 200 so that it can be opened and closed; a holding unit 251 that holds the preform 10 held by the mold 200 in a sealed state; a stretching unit 252 that stretches the preform 10 supported by the holding unit 251; a blow molding unit 253 that supplies blow molding fluid (air) to the preform 10 supported by the holding unit 250 or discharges blow molding fluid (air) from the preform 10 supported by the holding unit 210; and a mold heating unit 254 that heats the mold 210.

[0055] The stretching unit 252 includes: a stretching rod 2520, which is inserted into the preform 10; and a stretching rod support mechanism 2521, which supports the stretching rod 2520 so that it can move back and forth.

[0056] The blow molding unit 253 includes: a main pipe 2530 connected to a tension rod 2520 via a holding unit 251; three branch pipes 2531A to 2531C branching from the main pipe 2530; a pre-blow valve 2532 located on the branch pipe 2531A connected to a low-pressure pre-blow air supply source; a main blow valve 2533 located on the branch pipe 2531B connected to a high-pressure main blow air supply source; an exhaust valve 2534 located on the branch pipe 2531C connected to an exhaust system; and a pressure sensor 2535, a flow sensor 2536, and a temperature sensor 2537 located on the main pipe 2530 or the holding unit 251. Pressure sensor 2535, flow sensor 2536 and temperature sensor 2537 function as measuring units that can measure the pressure, flow rate and temperature of the blow molding fluid (pre-blow molding air, main blow molding air and blow molding air exhaust) supplied to the preform 10 at predetermined measurement time intervals, and output the measurement values ​​at each time point as measurement results.

[0057] In addition, Figure 4 and Figure 5 The specific structures of the rotating mechanism 241, mold support unit 250, holding unit 251, and stretching unit 252 are omitted, but they are constructed by appropriately combining, for example, modules for generating driving force such as servo motors and cylinders, linear guides, ball screws, gears, cams, belts, couplings, and bearings, as well as sensors such as linear sensors, encoder sensors, and limit sensors. Furthermore, in Figure 4 and Figure 5 The specific structure of the mold heating unit 254 is omitted, but it is constructed by appropriately combining modules such as electric heaters and sensors such as temperature sensors.

[0058] The control unit 26 is electrically connected to the module groups and sensor groups of the rotating unit 24 and the multiple molding units 25, and functions as a control unit for unified control of the rotating unit 24 and the multiple molding units 25. It should be noted that... Figure 6 The diagram shows the pre-blowing valve 2532, main-blowing valve 2533, and exhaust valve 2534 as part of a module group, and the pressure sensor 2535, flow sensor 2536, and temperature sensor 2537 as part of a sensor group, but illustrations of other module groups and sensor groups are omitted.

[0059] The control unit 26 is, for example, a general-purpose or special-purpose computer (see below). Figure 10 The control unit 26 comprises a control unit 260, a communication unit 261, an input unit 262, an output unit 263, and a storage unit 264 as its main components.

[0060] The storage unit 264 stores various programs (operating system (OS), blow molding program 2640, etc.) or data (device setting information 2641, etc.) used in the operation of the blow molding apparatus 20f. The device setting information 2641 is information that can register various device setting values ​​when the blow molding apparatus 20f performs blow molding processing, and is configured to be editable by the device user via a display image (setting interface).

[0061] The control unit 260 may consist of, for example, a processing unit (CPU, MPU, GPU, or other processor) and a sequencer. The control unit 260 functions as a blow molding control unit 2600 by executing a blow molding program 2640 stored in the storage unit 264.

[0062] The blow molding control unit 2600 operates the module groups of the rotating unit 24 and the module groups of each molding unit 25. At this time, the blow molding control unit 2600 operates the rotating unit 24 and each molding unit 25 according to the device setting values ​​registered in the device setting information 2641, thereby stretching the preform 10 and supplying blow molding fluid into the preform 10, thereby blow molding a hollow bottle 11 from the preform 10.

[0063] The communication unit 261 is connected to the communication network and functions as a communication interface for transmitting and receiving various data not only with the molding condition adjustment device 3 and the user terminal device 4, but also with the terminal device (not shown) used by the user of the blow molding apparatus 20f and the manufacturing management device (not shown) that performs manufacturing management in the bottle manufacturing management system 1. The input unit 262 receives various input operations performed by the user of the blow molding apparatus 20f, and the output unit 263 outputs various information to the user of the apparatus through image display, signal tower illumination, and buzzer sounding, thereby functioning as a user interface.

[0064] Figure 7 This is a flowchart illustrating the bottle manufacturing process. The bottle manufacturing process involves heating a preform 10, placing the heated preform 10 in a mold 200, and blow molding the preform 10 to produce a bottle 11. The bottle manufacturing process includes a preform heating process (step S100), a pre-blow molding process (steps S110 to S114), and a main blow molding process (steps S120 to S124).

[0065] First, in step S100, as the preform 10 conveyed by the preform conveyor 20c passes through the heating zone of the preform heating device 20d, the preform heating device 20d heats the preform 10 to a predetermined temperature through each preform heating module 210. Then, the preform supply device 20e supplies the heated preform 10 to the blow molding device 20f.

[0066] Next, in step S110, the blow molding apparatus 20f holds the heated preform 10 by the holding unit 251. In step S111, the blow molding apparatus 20f closes the mold 200 by the mold support unit 250. At this time, the mold 200 is heated to a predetermined temperature by the mold heating unit 254. In step S112, the blow molding apparatus 20f stretches the preform 10 by advancing the tension rod 2520 along the central axis of the preform 10. In step S113, the blow molding apparatus 20f opens the pre-blow valve 2532. In step S114, the blow molding apparatus 20f maintains the pre-blow pressure at the target pressure by continuing the supply of pre-blow air for the pre-blow time while advancing the tension rod 2520.

[0067] Next, in step S120, the blow molding apparatus 20f closes the pre-blow valve 2532, stops the supply of pre-blow air, and opens the main blow valve 2533 to increase the main blow pressure. In step S121, the blow molding apparatus 20f maintains the main blow pressure at the target pressure by continuing the supply of main blow air for the main blow molding time. In step S122, the blow molding apparatus 20f closes the main blow valve 2533 and opens the exhaust valve 2534 to discharge the blow molding fluid from the main pipe 2530 to the outside. In step S123, the blow molding apparatus 20f opens the mold 200 through the mold support unit 250 while retracting the tension rod 2520 from the inside of the preform 10. In step S124, the blow molding apparatus 20f releases the bottle 11 from the mold by the holding unit 251. Then, the molded body removal device 20g removes the blow-molded bottle 11 from the mold 200.

[0068] Figure 8 This is a data structure diagram representing an example of database 310. Database 310 has multiple records for each bottle management ID used to establish associations for various information to be processed in the bottle manufacturing management system 1. The bottle management ID is information used to identify bottle 11 (product number, model, etc.). Each record has, for example, fields that can register multiple device settings contained in molding condition information A, target values ​​for multiple adjustment items contained in adjustment item information B, and measurement results.

[0069] The molding condition information A and adjustment item information B, which are registered in database 310, can be referenced from molding condition adjustment device 3 and user terminal device 4. It should be noted that data can also be added, deleted, or corrected in the display image on user terminal device 4.

[0070] Molding condition information A represents Figure 7 Information on molding conditions in the bottle manufacturing process shown. Molding condition information A includes, for example, device settings for the preform heating unit 21 of the preform heating device 20d, and device settings for the stretching unit 252, blow molding unit 253, and mold heating unit 254 of the blow molding device 20f.

[0071] The device settings for the preform heating unit 21 include settings for increasing or decreasing the heating amount of multiple preform heating modules 210 as a whole, settings for increasing or decreasing the heating amount of multiple preform heating modules 210 individually, settings for increasing or decreasing the heating amount of the preform local heating module 211 individually, and settings for increasing or decreasing the air volume and air pressure of the blower module. The device settings for the preform heating module 210 and the preform local heating module 211 are set by specifying any one of multiple heating levels. The device settings for the blower module are set by specifying any one of multiple air volume levels and multiple air pressure levels.

[0072] The device settings for the tensioning unit 252 include device settings for increasing or decreasing the tension amount and tension speed of the tensioning rod 2520. The device settings for the tensioning unit 252 are set by specifying values ​​equivalent to the tension amount and tension speed.

[0073] The device settings for the blow molding unit 253 include device settings for increasing or decreasing the pre-blow molding pressure, pre-blow molding time, and pre-blow molding flow rate, as well as device settings for increasing or decreasing the main blow molding pressure, main blow molding time, and main blow molding flow rate. The device settings for the blow molding unit 253 are set by specifying a value equivalent to the pre-blow molding pressure or main blow molding pressure, a time equivalent to the pre-blow molding time or main blow molding time, or a value equivalent to the pre-blow molding flow rate or main blow molding flow rate.

[0074] The device settings for the mold heating unit 254 include device settings for increasing or decreasing the heating amount of the mold 200. The device settings for the mold heating unit 254 are set by specifying any one of the heating levels having multiple stages.

[0075] Adjustment item information B represents information about target values ​​for multiple adjustment items related to preform 10 and bottle 11. Target values ​​are values ​​set during the design and inspection phases of preform 10 and bottle 11, equivalent to design values ​​or standard values. The multiple adjustment items include at least one of the following: temperature of preform 10, mass distribution of bottle 11, height of bottle 11, and internal volume of bottle 11. In particular, it is preferable to include at least one of the following among the multiple adjustment items: temperature of preform 10, mass distribution of bottle 11, height of bottle 11, and internal volume of bottle 11. In this embodiment, the case where the multiple adjustment items are the temperature of preform 10, mass distribution of bottle 11, height of bottle 11, and internal volume of bottle 11 will be described. It should be noted that adjustment items can be any items related to the shape and quality of preform 10 and bottle 11, and adjustment items other than those described above can also be used. Furthermore, the adjustment items may vary depending on the product number, model, etc., of bottle 11.

[0076] The "temperature of preform 10" as an adjustment item is, for example, the temperature of the preform 10 at a time point after it is heated in step S100 and before it is held by the holding unit 251 in step S110. The adjustment item information B contains the target value of the temperature of the preform 10 at this time and the measurement results of the temperature of the preform 10.

[0077] The "mass distribution of bottle 11" as an adjustment item is, for example, the mass distribution of bottle 11 at the time point after it is removed from mold 200 in S124. The adjustment item information B contains the target value for the mass distribution of bottle 11 at this time and the measurement results of the mass distribution of bottle 11.

[0078] The "height of bottle 11" as an adjustment item is, for example, the height of bottle 11 at the point in time after it is removed from mold 200 in S124. The adjustment item information B contains the target value for the height of bottle 11 at this time and the measurement result of the height of bottle 11.

[0079] The "internal volume of bottle 11" as an adjustment item is, for example, the internal volume of bottle 11 at the point in time after it is removed from mold 200 in S124. The adjustment item information B contains the target value of the internal volume of bottle 11 at this time and the measurement result of the internal volume of bottle 11.

[0080] (Molding condition adjustment device 3)

[0081] Figure 9This is a block diagram illustrating an example of a molding condition adjustment device 3. The molding condition adjustment device 3 includes: a control unit 30, comprising a processor, etc.; a storage unit 31, comprising an HDD, SSD, memory, etc.; a communication unit 32, serving as a communication interface with a network 5 and external devices; an input unit 33, comprising a keyboard, mouse, etc.; and an output unit 34, comprising a display, etc. It should be noted that the input unit 33 and the output unit 34 may be omitted.

[0082] The storage unit 31 stores the database 310 and the molding condition adjustment program 311, and also stores the operating system, other programs or data, etc.

[0083] The control unit 30 functions as multiple adjustment processing units 300A to 300D by executing the molding condition adjustment program 311 stored in the storage unit 31.

[0084] Multiple adjustment processing units 300A to 300D adjust multiple adjustment items related to the preform 10 and the bottle 11 according to a predetermined adjustment sequence. Furthermore, the multiple adjustment processing units 300A to 300D adjust the adjustment item by setting the device setting value related to the adjustment item using at least one of multiple setting methods. At this time, the multiple adjustment processing units 300A to 300D refer to the database 310 and register the adjustment result of the device setting value in the database 310.

[0085] The adjustment order of the adjustment items is predetermined for multiple adjustment items. For example, the adjustment order for the temperature of the preform 10 is set to be earlier than the adjustment order for other adjustment items. More specifically, the adjustment order for the temperature of the preform 10 is set to be earlier than the adjustment order for the mass distribution of the bottle 11, and the adjustment order for the mass distribution of the bottle 11 is set to be earlier than the adjustment order for the height of the bottle 11 and the adjustment order for the internal volume of the bottle 11. In this embodiment, the following situation will be described: as the adjustment order of the adjustment items, the first adjustment processing unit 300A adjusts the temperature of the preform 10, the second adjustment processing unit 300B adjusts the mass distribution of the bottle 11, the third adjustment processing unit 300C adjusts the height of the bottle 11, and the fourth adjustment processing unit 300D adjusts the internal volume of the bottle 11. The adjustment order of the adjustment items is not limited to the above example and can be appropriately changed.

[0086] The following setting method is used as the method for setting device settings.

[0087] (a) Overall heating conditions for preforms: Set device settings related to the overall heating of preforms 10, such as device settings for increasing or decreasing the heating amount of multiple preform heating modules 210 as a whole.

[0088] (b) Individual heating conditions for preforms: such as the device settings for increasing or decreasing the heating amount of the multiple preform heating modules 210, the device settings related to the individual heating of the preform 10 are set.

[0089] (c) Preform local heating conditions: Set device settings related to the local heating of the preform 10, such as device settings for increasing or decreasing the heating amount of the preform local heating module 211.

[0090] (d) Pre-blow molding conditions: Set device settings related to pre-blow molding, such as the device settings for increasing or decreasing the stretching amount and stretching speed of the stretching unit 252, and the device settings for increasing or decreasing the pre-blow molding pressure, pre-blow molding time, and pre-blow molding flow rate of the blow molding unit 253.

[0091] (e) Main blow molding conditions: Set the device settings related to the main blow molding, such as the device settings for increasing or decreasing the main blow molding pressure, main blow molding time, and main blow molding flow rate of the blow molding unit 253.

[0092] (f) Bottle cooling conditions: Set device settings related to the cooling of bottle 11, such as the device setting value for increasing or decreasing the heating amount of mold 200 by mold heating unit 254.

[0093] The method for setting the device settings is not limited to the examples described above and can be appropriately modified. For example, when (a) overall preform heating conditions, (b) individual preform heating conditions, and (c) partial preform heating conditions are set as preform heating conditions that set device settings related to the heating of preform 10, the device settings for increasing or decreasing the air volume and air pressure of the blower module can be further set within the preform heating conditions. Furthermore, one setting method described above can be divided into multiple setting methods. For example, (d) pre-blow molding conditions can be divided into a first pre-blow molding condition that sets device settings for stretching amount and stretching speed, and a second pre-blow molding condition that sets device settings for pre-blow molding pressure, pre-blow molding time, and pre-blow molding flow rate. Furthermore, multiple setting methods described above can be combined into one setting method. For example, a setting method combining (a) overall preform heating conditions and (d) pre-blow molding conditions can be processed as a single setting method. Moreover, in one setting method, multiple device settings can be set, or only one device setting value can be set. For example, in (e) the main blow molding condition, the device settings for the main blow molding pressure and the main blow molding flow rate can be set, or only the device settings for the main blow molding pressure can be set, or only the device settings for the main blow molding flow rate can be set.

[0094] It should be noted that each of the multiple adjustment processing units 300A to 300D can also perform multiple setting processes to set device setting values ​​related to the adjustment item using multiple setting methods. In this case, each of the multiple adjustment processing units 300A to 300D performs multiple setting processes sequentially according to a predetermined setting order. Moreover, each of the multiple adjustment processing units 300A to 300D determines whether the device setting values ​​set by the setting processes performed in the order from earliest to latest meet the target value for the adjustment item. If the target value is met, the adjustment of the adjustment item ends; if the target value is not met, the setting process based on the setting method of the next setting order begins, thereby continuing the adjustment of the adjustment item. Thus, by performing setting processes based on multiple setting methods in stages for each adjustment item, the molding conditions in blow molding can be appropriately adjusted.

[0095] At this point, the setting order of the multiple setting methods is predetermined for each method. For example, the setting order for methods used for coarse adjustments to the adjustment item is determined to be earlier, while the setting order for methods used for fine adjustments is determined to be later. Therefore, by appropriately setting the priority order of setting processes based on multiple methods for each adjustment item, the device setting values ​​tend to converge, thus enabling appropriate adjustment of the molding conditions in blow molding. It should be noted that the setting methods and the setting order can vary for each adjustment item.

[0096] The output processing unit 301 performs output processing, which outputs the adjustment results after adjustment by the adjustment processing units 300A to 300D to external devices. As an example of output processing, the output processing unit 301 sends the adjustment results of the adjustment processing units 300A to 300D to the bottle manufacturing device 2 and the user terminal device 4, etc.

[0097] Figure 10 This is a hardware structure diagram showing an example of a computer 900 that constitutes each device. Each device 2 to device 4 constituting the bottle manufacturing management system 1 is composed of a general-purpose or special-purpose computer 900.

[0098] like Figure 10As shown, the computer 900 includes a bus 910, a processor 912, a memory 914, an input device 916, an output device 917, a display device 918, a storage device 920, a communication I / F (interface) unit 922, a peripheral I / F unit 924, an I / O (input / output) I / F unit 926, and a media input / output unit 928 as its main components. It should be noted that the above-mentioned components may be appropriately omitted depending on the intended use of the computer 900.

[0099] The processor 912 consists of one or more arithmetic processing units (CPU (Central Processing Unit), MPU (Micro-processing Unit), DSP (Digital Signal Processor), GPU (Graphics Processing Unit), etc.) and acts as the control unit for the unified control of the computer 900 as a whole. The memory 914 stores various data and programs 930, and is composed of volatile memory (DRAM, SRAM, etc.), non-volatile memory (ROM), flash memory, etc., which function as main memory.

[0100] Input device 916, for example, comprises a keyboard, mouse, numeric keypad, electronic pen, etc., and functions as an input unit. Output device 917, for example, comprises a sound (voice) output device, vibration device, etc., and functions as an output unit. Display device 918, for example, comprises a liquid crystal display, organic EL display, electronic paper, projector, etc., and functions as an output unit. Input device 916 and display device 918 can be integrated as a single unit, such as a touch panel display. Storage device 920, for example, comprises an HDD, SSD, etc., and functions as a storage unit. Storage device 920 stores various data required for executing the operating system and program 930.

[0101] The communication I / F unit 922 connects to the Internet or intranet via wired or wireless means 940 (or can also connect to...). Figure 1The network 5 is the same as the network 950, and functions as a communication unit for sending and receiving data with other computers according to the prescribed communication standards. The external device I / F unit 924 is connected to external devices 950 such as cameras, printers, scanners, and readers via wired or wireless means, and functions as a communication unit for sending and receiving data with external devices 950 according to the prescribed communication standards. The I / O device I / F unit 926 is connected to I / O devices 960 such as various sensors and actuators, and functions as a communication unit for sending and receiving various signals and data, such as sensor-based detection signals and actuator control signals, with I / O devices 960. The media input / output unit 928 is composed of, for example, a DVD (Digital Versatile Disc) drive, a CD (Compact Disc) drive, a memory card slot, and a USB connector, and reads and writes data to media (non-temporary storage media) 970 such as DVDs, CDs, memory cards, and USB memories.

[0102] In the computer 900 with the above-described structure, the processor 912 loads the program 930 stored in the storage device 920 into the memory 914 and executes it, controlling various parts of the computer 900 via the bus 910. It should be noted that the program 930 can also be stored in the memory 914 instead of the storage device 920. The program 930 can be recorded in the medium 970 in an installable file format or an executable file format, and can be provided to the computer 900 via the media input / output unit 928. The program 930 can also be provided to the computer 900 by downloading it via the network 940 through the communication I / F unit 922. Furthermore, the computer 900 can also implement the various functions achieved by the processor 912 executing the program 930 using hardware such as FPGA (field-programmable gate array) or ASIC (application-specific integrated circuit).

[0103] Computer 900, for example, consists of a desktop computer or a portable computer, and is an electronic device of any form. Computer 900 can be a client computer, a server computer, a cloud computer, or, for example, an embedded computer referred to as a control panel, controller (including microcomputers, programmable logic controllers, sequencers, etc.).

[0104] (Method for adjusting molding conditions of molding condition adjustment device 3)

[0105] Figure 11This is a flowchart illustrating an example of a molding condition adjustment method for the molding condition adjustment device 3. The following describes a scenario where a manufacturing manager adjusts the molding conditions of a bottle 11, whose specific product number is determined by the bottle management ID, by performing various input operations on the user terminal device 4.

[0106] First of all, Figure 11 In step S20 (adjustment step) shown, the first adjustment processing unit 300A adjusts the "temperature of the preform 10" as the first adjustment item.

[0107] Figure 12 This is a flowchart detailing the adjustment steps (step S20) for adjusting the temperature of the preform 10. In these steps, multiple setting processes are performed to set the device settings for the preform heating device 20d using various setting methods. As the setting methods used, one or more of the following methods are employed: (a) overall preform heating condition, (b) individual preform heating condition, and (c) localized preform heating condition. For example, (a) overall preform heating condition and (b) individual preform heating condition are used.

[0108] exist Figure 12 In this section, we will explain the case where any two of the above setting methods are used as the first setting method and the second setting method.

[0109] In step S200, the first adjustment processing unit 300A sets an initial value for the device setting related to the temperature of the preform 10. For example, initial values ​​are set for the multiple preform heating modules 210 of the preform heating unit 21. At this time, if the device setting value used in the past manufacturing of bottles 11 with the same product number is stored in the molding condition information A of the database 310, that device setting value or a similar device setting value is set as the initial value. It should be noted that the first adjustment processing unit 300A can also set the initial value by accepting the device setting value input by the manufacturing manager via the display image of the user terminal device 4.

[0110] In step S201, the first adjustment processing unit 300A measures the temperature of the preform 10 when it has been heated to the device setting value set for the preform heating unit 21 in step S200, and obtains the measurement result. The temperature of the preform 10 is measured, for example, by a temperature sensor 212 and obtained from the preform heating device 20d. Alternatively, the temperature of the preform 10 can also be measured by an external measuring device. The first adjustment processing unit 300A obtains the measurement result by receiving the measurement result from the measuring device input by the manufacturing manager via the display image of the user terminal device 4.

[0111] In step S202, the first adjustment processing unit 300A determines whether the temperature measurement result of the preform 10 measured in step S201 meets the target temperature value of the preform 10. The target temperature value of the preform 10 is represented, for example, by a temperature distribution showing the temperature at multiple locations of the preform 10. The determination of whether the target value is met is made, for example, based on whether the temperature measurement result of the preform 10 is within a range specified based on the target value. The target value is obtained by referring to the adjustment item information B in the database 310. In addition, the first adjustment processing unit 300A can also obtain the target value by receiving the target value input by the manufacturing manager via the display image of the user terminal device 4.

[0112] If the determination result in step S202 is that the temperature measurement result of the preform 10 meets the target value (step S202: Yes), proceed to step S230, register the current device setting value and measurement result in database 310, and normally end the temperature adjustment of the preform 10. On the other hand, if the target value is not met (step S202: No), proceed to step S210.

[0113] In step S210, the first adjustment processing unit 300A performs a setting process to set a device setting value related to the temperature of the preform 10 using a first setting method. As the first setting method, when using the overall heating condition of the preform (a) described above, the device setting value is the overall heating level; when using the individual heating condition of the preform (b) described above, the device setting value is the individual heating level. For example, the device setting value is set based on the difference between the measured temperature of the preform 10 and the target value. Furthermore, the first adjustment processing unit 300A can also set the device setting value by allowing the manufacturing manager to input the device setting value via the display image on the user terminal device 4.

[0114] In step S211, the first adjustment processing unit 300A measures the temperature of the preform 10 when it is heated to the device setting value set by the first setting method in step S210, and obtains the measurement result in the same way as in step S201.

[0115] In step S212, the first adjustment processing unit 300A determines, in the same manner as in step S202, whether the measurement result of the temperature of the preform 10 measured in step S211 meets the target value of the temperature of the preform 10.

[0116] If the determination result in step S212 is that the temperature measurement result of the preform 10 meets the target value (step S212: Yes), proceed to step S230, register the current device setting value and measurement result in database 310, and normally end the temperature adjustment of the preform 10. On the other hand, if the target value is not met (step S212: No), proceed to step S220.

[0117] In step S220, the first adjustment processing unit 300A performs a setting process to set a device setting value related to the temperature of the preform 10 using a second setting method. As the second setting method, when using the overall heating condition of the preform (a) described above, the device setting value is the overall heating level; when using the individual heating condition of the preform (b) described above, the device setting value is the individual heating level. For example, the device setting value is set based on the difference between the measured temperature of the preform 10 and the target value. Furthermore, the first adjustment processing unit 300A can also set the device setting value by allowing the manufacturing manager to input the device setting value via the display image on the user terminal device 4.

[0118] In step S221, the first adjustment processing unit 300A measures the temperature of the preform 10 when it is heated to the device setting value set by the second setting method in step S220, and obtains the measurement result in the same way as in steps S201 and S211.

[0119] In step S222, the first adjustment processing unit 300A determines, in the same manner as steps S202 and S212, whether the measurement result of the temperature of the preform 10 measured in step S221 meets the target value of the temperature of the preform 10.

[0120] If the determination result in step S222 is that the measured temperature of the preform 10 meets the target value (step S222: Yes), proceed to step S230, register the current device settings and measurement results in database 310, and the temperature adjustment of the preform 10 ends normally. On the other hand, if the target value is not met (step S222: No), the process ends abnormally. It should be noted that in the case of abnormal ending, the process can be terminated midway. Figure 11 The flowchart shown can also be used to confirm with the manufacturing manager whether the process has ended midway through the display image on the user terminal device 4.

[0121] Next, in Figure 11 In step S30 (adjustment step) shown, the second adjustment processing unit 300B adjusts "mass distribution of bottle 11" as the second adjustment item.

[0122] Figure 13This is a flowchart detailing the adjustment steps (step S30) for adjusting the mass distribution of bottle 11. In these steps, multiple setting processes are performed to set device setting values ​​for at least one of the preform heating device 20d and the blow molding device 20f using multiple setting methods. As setting methods at this time, one or more of the following are used: (a) overall preform heating conditions, (b) individual preform heating conditions, (c) partial preform heating conditions, (d) pre-blow molding conditions, (e) main blow molding conditions, (f) bottle cooling conditions. For example, (a) overall preform heating conditions, (b) individual preform heating conditions, and (d) pre-blow molding conditions are used.

[0123] exist Figure 13 In this section, the case where any two of the above setting methods are used as the first setting method and the second setting method will be explained. Furthermore, Figure 13 The basic actions shown in the flowchart are Figure 12 The flowcharts shown are common, so the explanation will focus on the different parts.

[0124] In step S300, the second adjustment processing unit 300B sets initial values ​​for device settings related to the mass distribution of the bottle 11. For example, initial values ​​are set for the preform heating unit 21, stretching unit 252, blow molding unit 253, and mold heating unit 254.

[0125] In step S301, the second adjustment processing unit 300B measures the mass distribution of the bottle 11 when the preform 10 is heated according to the device settings set in step S300 for the preform heating unit 21, stretching unit 252, blow molding unit 253, and mold heating unit 254, and obtains the measurement result. The mass distribution of the bottle 11 can also be obtained, for example, by measuring the mass of each part of the bottle 11 when it is divided into multiple parts (e.g., neck, shoulder, body, bottom, etc.) using an external measuring device, and the second adjustment processing unit 300B receives the measurement result of the measuring device input by the manufacturing manager via the display image of the user terminal device 4.

[0126] In step S302, the second adjustment processing unit 300B determines whether the measurement result of the mass distribution of bottle 11 measured in step S301 meets the target value of the mass distribution of bottle 11.

[0127] If the determination result in step S302 is that the measurement result of the mass distribution of bottle 11 meets the target value (step S302: Yes), proceed to step S330, register the current device setting value and measurement result in database 310, and normally end the adjustment of the mass distribution of bottle 11. On the other hand, if the target value is not met (step S302: No), proceed to step S310.

[0128] In step S310, the second adjustment processing unit 300B performs setting processing to set device setting values ​​related to the mass distribution of the bottle 11 using the first setting method. In step S311, the second adjustment processing unit 300B measures the mass distribution of the bottle 11 during blow molding using the device setting values ​​set in step S310 using the first setting method, and obtains the measurement result in the same manner as in step S301. In step S312, the second adjustment processing unit 300B, in the same manner as in step S302, determines whether the measurement result of the mass distribution of the bottle 11 measured in step S311 meets the target value for the mass distribution of the bottle 11.

[0129] If the determination result in step S312 is that the measurement result of the mass distribution of bottle 11 meets the target value (step S312: Yes), proceed to step S330, register the current device setting value and measurement result in database 310, and the adjustment of the mass distribution of bottle 11 ends normally. On the other hand, if the target value is not met (step S312: No), proceed to step S320.

[0130] In step S320, the second adjustment processing unit 300B performs setting processing to set device setting values ​​related to the mass distribution of bottle 11 using the second setting method. In step S321, the second adjustment processing unit 300B measures the mass distribution of bottle 11 during blow molding using the device setting values ​​set in step S320 using the second setting method, and obtains the measurement results in the same manner as in steps S301 and S311. In step S322, the second adjustment processing unit 300B, in the same manner as in steps S302 and S312, determines whether the measurement results of the mass distribution of bottle 11 measured in step S321 meet the target value for the mass distribution of bottle 11.

[0131] If the determination result in step S322 is that the measurement result of the mass distribution of bottle 11 meets the target value (step S322: Yes), proceed to step S330, register the current device setting value and measurement result in database 310, and the adjustment of the mass distribution of bottle 11 ends normally. On the other hand, if the target value is not met (step S322: No), the process ends with an error.

[0132] Next, in Figure 11In step S40 (adjustment step) shown, the third adjustment processing unit 300C adjusts the "height of bottle 11" as the third adjustment item.

[0133] Figure 14 This is a flowchart detailing the steps (step S40) for adjusting the height of the adjusting bottle 11. In the steps for adjusting the height of the adjusting bottle 11,

[0134] Multiple setting processes are performed to set device setting values ​​for at least one of the preform heating device 20d and the blow molding device 20f using multiple setting methods. As setting methods at this time, one or more of the following are used: (a) overall preform heating condition, (b) individual preform heating condition, (c) partial preform heating condition, (d) pre-blow molding condition, (e) main blow molding condition, (f) bottle cooling condition. For example, (c) partial preform heating condition, (d) pre-blow molding condition, and (f) bottle cooling condition are used.

[0135] exist Figure 14 In this section, the case where any two of the above setting methods are used as the first setting method and the second setting method will be explained. Furthermore, Figure 14 The basic actions shown in the flowchart are Figure 12 The flowcharts shown are common, so the explanation will focus on the different parts.

[0136] In step S400, the third adjustment processing unit 300C sets initial values ​​for device settings related to the height of the bottle 11. For example, initial values ​​are set for the preform heating unit 21, stretching unit 252, blow molding unit 253, and mold heating unit 254.

[0137] In step S401, the third adjustment processing unit 300C measures the height of the bottle 11 when the preform 10 has been heated to the device settings set in step S400 for the preform heating unit 21, stretching unit 252, blow molding unit 253, and mold heating unit 254, and obtains the measurement result. The height of the bottle 11 is measured, for example, by an external measuring device, and the third adjustment processing unit 300C can also obtain the measurement result by viewing the image on the user terminal device 4 and receiving the measurement result from the measuring device input by the manufacturing manager.

[0138] In step S402, the third adjustment processing unit 300C determines whether the measurement result of the height of bottle 11 measured in step S401 meets the target value of the height of bottle 11.

[0139] If the determination result in step S402 is that the measured height of bottle 11 meets the target value (step S402: Yes), proceed to step S430, register the current device setting value and measurement result in database 310, and the adjustment of the height of bottle 11 ends normally. On the other hand, if the target value is not met (step S402: No), proceed to step S410.

[0140] In step S410, the third adjustment processing unit 300C performs a setting process to set a device setting value related to the height of the bottle 11 using the first setting method. In step S411, the third adjustment processing unit 300C measures the height of the bottle 11 during blow molding using the device setting value set in step S410 using the first setting method, and obtains the measurement result in the same manner as in step S401. In step S412, the third adjustment processing unit 300C, in the same manner as in step S402, determines whether the measurement result of the height of the bottle 11 measured in step S411 meets the target value for the height of the bottle 11.

[0141] If the determination result in step S412 is that the measured height of bottle 11 meets the target value (step S412: Yes), proceed to step S430, register the current device setting value and measurement result in database 310, and the adjustment of the height of bottle 11 ends normally. On the other hand, if the target value is not met (step S412: No), proceed to step S420.

[0142] In step S420, the third adjustment processing unit 300C performs a setting process to set a device setting value related to the height of the bottle 11 using the second setting method. In step S421, the third adjustment processing unit 300C measures the height of the bottle 11 during blow molding using the device setting value set in step S420 using the second setting method, and obtains the measurement result in the same manner as in steps S401 and S411. In step S422, the third adjustment processing unit 300C, in the same manner as in steps S402 and S412, determines whether the measurement result of the height of the bottle 11 measured in step S421 meets the target value for the height of the bottle 11.

[0143] If the determination result in step S422 is that the measured height of bottle 11 meets the target value (step S422: Yes), proceed to step S430, register the current device settings and measurement results in database 310, and the adjustment of the height of bottle 11 ends normally. On the other hand, if the target value is not met (step S422: No), the process ends abnormally.

[0144] Next, in Figure 11 In step S50 (adjustment step) shown, the fourth adjustment processing unit 300D adjusts the "internal volume of bottle 11" as the fourth adjustment item.

[0145] Figure 15 This is a flowchart detailing the steps for adjusting the internal volume of the adjusting bottle 11 (step S50). In this step, multiple setting processes are performed to set device setting values ​​for at least one of the preform heating device 20d and the blow molding device 20f using multiple setting methods. As the setting methods used at this time, one or more of the following methods are employed: (a) overall preform heating condition, (b) individual preform heating condition, (c) partial preform heating condition, (d) pre-blow molding condition, (e) main blow molding condition, (f) bottle cooling condition. For example, (a) overall preform heating condition, (e) main blow molding condition, and (f) bottle cooling condition are used.

[0146] exist Figure 15 In this section, the case where any two of the above setting methods are used as the first setting method and the second setting method will be explained. Furthermore, Figure 15 The basic actions shown in the flowchart are Figure 12 The flowcharts shown are common, so the explanation will focus on the different parts.

[0147] In step S500, the fourth adjustment processing unit 300D sets initial values ​​for device settings related to the internal volume of the bottle 11. For example, initial values ​​are set for the preform heating unit 21, stretching unit 252, blow molding unit 253, and mold heating unit 254.

[0148] In step S501, the fourth adjustment processing unit 300D measures the internal volume of the bottle 11 when the preform 10 has been heated to the device settings set in step S500 for the preform heating unit 21, stretching unit 252, blow molding unit 253, and mold heating unit 254, and obtains the measurement result. The internal volume of the bottle 11 is measured, for example, by an external measuring device, and the fourth adjustment processing unit 300D can also obtain the measurement result by viewing the image on the user terminal device 4 and receiving the measurement result from the measuring device input by the manufacturing manager.

[0149] In step S502, the fourth adjustment processing unit 300D determines whether the measurement result of the internal volume of the bottle 11 measured in step S501 meets the target value of the internal volume of the bottle 11.

[0150] If the determination result in step S502 is that the measurement result of the internal volume of bottle 11 meets the target value (step S502: Yes), proceed to step S530, register the current device setting value and measurement result in database 310, and the adjustment of the internal volume of bottle 11 ends normally. On the other hand, if the target value is not met (step S502: No), proceed to step S510.

[0151] In step S510, the fourth adjustment processing unit 300D performs a setting process to set a device setting value related to the internal volume of the bottle 11 using the first setting method. In step S511, the fourth adjustment processing unit 300D measures the internal volume of the bottle 11 during blow molding using the device setting value set in step S510 using the first setting method, and obtains the measurement result in the same manner as in step S501. In step S512, the fourth adjustment processing unit 300D, in the same manner as in step S502, determines whether the measurement result of the internal volume of the bottle 11 measured in step S511 meets the target value for the internal volume of the bottle 11.

[0152] If the determination result in step S512 is that the measurement result of the internal volume of bottle 11 meets the target value (step S512: Yes), proceed to step S530, register the current device setting value and measurement result in database 310, and the adjustment of the internal volume of bottle 11 ends normally. On the other hand, if the target value is not met (step S512: No), proceed to step S520.

[0153] In step S520, the fourth adjustment processing unit 300D performs a setting process to set a device setting value related to the internal volume of the bottle 11 using the second setting method. In step S521, the fourth adjustment processing unit 300D measures the internal volume of the bottle 11 during blow molding using the device setting value set in step S520 using the second setting method, and obtains the measurement result in the same manner as in steps S501 and S511. In step S522, the fourth adjustment processing unit 300D, in the same manner as in steps S502 and S512, determines whether the measurement result of the internal volume of the bottle 11 measured in step S521 meets the target value for the internal volume of the bottle 11.

[0154] If the determination result in step S522 is that the measurement result of the internal volume of bottle 11 meets the target value (step S522: Yes), proceed to step S530, register the current device setting value and measurement result in database 310, and the adjustment of the internal volume of bottle 11 ends normally. On the other hand, if the target value is not met (step S522: No), the process ends with an error.

[0155] Next, in Figure 11In step S60 (output step) shown, the output processing unit 301 outputs the adjustment results after adjustments made in steps S20 to S50. For example, the output processing unit 301 outputs the adjustment results to the user terminal device 4, thereby providing the adjustment results to the manufacturing manager via the display image on the user terminal device 4. Furthermore, the output processing unit 301 outputs the adjustment results to the bottle manufacturing apparatus 2, thereby storing the adjustment results in the device setting information 2241 of the preform heating device 20d and the device setting information 2641 of the blow molding device 20f. Then, the bottle manufacturing apparatus 2 operates according to the adjustment results, i.e., the adjusted molding conditions, thereby manufacturing the bottle 11.

[0156] As mentioned above, the end. Figures 11 to 15 The diagram illustrates a series of molding condition adjustment methods. It should be noted that these molding condition adjustment methods can be executed at any time before the start of bottle 11 manufacturing, for example, based on the instructions of the manufacturing manager. However, they can also be executed when specific execution conditions such as changes in the surrounding environment (temperature, humidity, etc.) or changes in raw materials are met.

[0157] As described above, according to the molding condition adjustment device 3 and the molding condition adjustment method based on the molding condition adjustment device 3 of this embodiment, when each of the multiple adjustment steps (steps S20 to S50) of the adjustment processing unit 300A to the adjustment processing unit 300D adjusts multiple adjustment items according to a predetermined adjustment sequence, it sets a device setting value related to the adjustment item by at least one of multiple setting methods, thereby adjusting the adjustment item. Therefore, the molding conditions in blow molding can be appropriately adjusted.

[0158] At this point, the multiple adjustment steps (steps S20 to S50) include at least the steps of adjusting the temperature of the preform 10, the mass distribution of the bottle 11, the height of the bottle 11, and the internal volume of the bottle 11 in sequence. Thus, by first adjusting the temperature of the preform 10, which affects the overall adjustment items, and then adjusting the mass distribution of the bottle 11, the height of the bottle 11, and the internal volume of the bottle 11 in that order, the molding conditions in blow molding can be appropriately adjusted.

[0159] Furthermore, each of the multiple adjustment steps (steps S20 to S50) performs multiple setting processes according to a predetermined setting order for multiple setting methods, setting the device setting values ​​related to the adjustment item using multiple setting methods. Thus, for each adjustment item, setting processes based on multiple setting methods are performed, so even if it is difficult to adjust the adjustment item using only a specific setting method, the molding conditions in blow molding can be appropriately adjusted.

[0160] (Other implementation methods)

[0161] This invention is not limited to the embodiments described above, and various modifications and implementations can be made without departing from the spirit of this invention. Moreover, all of these are included in the technical concept of this invention.

[0162] In the above embodiment, the case where the database 310 is stored in the storage unit 31 of the molding condition adjustment device 3 was described. In contrast, the database 310 may also be stored in an external storage device, in which case each device 2 to device 4 can access the database 310 via the network 5.

[0163] In the above embodiment, the molding condition adjustment device 3 is configured according to... Figures 11 to 15 The flowchart shown illustrates the actions performed in each step.

[0164] In contrast, some steps can be omitted, or additional steps can be added. For example, Figures 12 to 15 Each adjustment step shown (steps S20 to S50) executes two setting methods, but more than three setting methods can also be executed. In this case, Figures 12 to 15 In each of the adjustment steps shown (steps S20 to S50), after the setting process based on the second setting method, for example, a setting process based on the third setting method is added, and then a setting process based on the fourth setting method is added, thereby performing setting processes based on three or more setting methods.

[0165] In addition, each adjustment step (steps S20 to S50) can also be configured using the following setting method.

[0166] For example, each adjustment step (steps S30 to S50) after the adjustment order is determined to be second may perform the following setting process: as the setting method determined to be first in the setting order, the device setting value is set using a setting method different from the setting methods already performed in other adjustment steps. Figures 11 to 15 In the example shown, as the setting method for step S20, after (a) overall heating conditions for the preform and (b) individual heating conditions for the preform, the setting process in the first setting method of step S30 is performed using (d) pre-blow molding conditions, which are different from those setting methods. Therefore, when adjusting new adjustment items, the setting method, as the first setting method in the setting sequence, uses a setting method not performed in other adjustment steps, thus suppressing the need for readjustment of the adjusted items.

[0167] At this time, it is also possible that, in at least one of the adjustment steps (steps S30 to S50) after the adjustment order is determined to be the second position, the following setting process is performed: as a setting method where the setting order is determined to be the first position, the device setting value is set by a setting method different from the setting method performed last in the adjustment step where the adjustment order is the first position. Figures 11 to 15 In the example shown, when the individual heating conditions for the preform were performed at the end of step S20 (b), the setting process in the first setting method of step S30 is performed using the pre-blow molding conditions (d), which is a different setting method. Therefore, when adjusting new adjustment items, the setting method that was not performed at the end of the previous adjustment step is used as the first setting method in the setting sequence, thus suppressing the need to readjust the adjusted items.

[0168] Alternatively, in at least one of the adjustment steps (steps S30 to S50) after the adjustment order has been determined to be second, the following setting process may be performed: as at least one of the setting methods after the setting order has been determined to be second, the device setting value may be set using a setting method common to setting methods already performed in other adjustment steps. Figures 11 to 15 In the example shown, as the setting method for step S20, after (a) overall heating conditions for the preform and (b) individual heating conditions for the preform, in the setting methods after the second position in step S30, the setting process is performed using either (a) overall heating conditions for the preform or (b) individual heating conditions for the preform, which are common to both. Therefore, when adjusting a new adjustment item, as the setting method after the second position in the setting sequence, the setting method already performed in other adjustment steps is used, thus minimizing the impact on the adjusted items and enabling convergence of adjustments for the new adjustment item.

[0169] Furthermore, each of the multiple adjustment steps (steps S20 to S50) can also perform setting processing for the device setting values ​​of the preform heating module 210 as at least one of multiple setting methods. That is, when setting (a) overall preform heating conditions, (b) individual preform heating conditions, and (c) local preform heating conditions as common categories such as preform heating conditions, each of the multiple adjustment steps (steps S20 to S50) can perform setting processing for the device setting values ​​of the preform heating module 210 and the local preform heating module 211 using any of the setting methods included in the preform heating conditions described above. As a result, since the heating conditions of the preform 10, which have a high influence on the shape and quality of the bottle 11, are set in each of the multiple adjustment steps, the molding conditions in blow molding can be appropriately adjusted.

[0170] The following is a summary of the various schemes disclosed herein, recorded as an appendix.

[0171] (Note 1)

[0172] A method for adjusting molding conditions, wherein the method uses a computer to adjust the molding conditions when a molding body manufacturing device, which operates according to multiple device setting values, blow-moldes a workpiece to manufacture a hollow molded body, wherein...

[0173] The molding condition adjustment method includes multiple adjustment steps that adjust multiple adjustment items in a predetermined order for multiple adjustment items related to the molded body and the molded body.

[0174] In each of the multiple adjustment steps, at least one of the multiple setting methods is used to set the device setting value related to the adjustment item, thereby adjusting the adjustment item.

[0175] (Note 2)

[0176] According to the molding condition adjustment method described in Appendix 1, wherein...

[0177] In each of the multiple adjustment steps, the following multiple setting processes are performed: setting the device setting value related to the adjustment item according to a predetermined setting order for the multiple setting methods and through the multiple setting methods.

[0178] (Note 3)

[0179] According to the molding condition adjustment method described in Appendix 1 or Appendix 2, wherein,

[0180] Each of the aforementioned adjustment steps performs the following actions:

[0181] Based on the device setting values ​​set according to the setting process performed in the predetermined order from morning to evening, it is determined whether the target values ​​for the adjustment item are met.

[0182] Once the target value is met, the adjustment process for this project will be terminated.

[0183] If the target value is not met, the setting process is initiated based on the setting method of the next setting sequence, thereby continuing the adjustment of the adjustment item.

[0184] (Note 4)

[0185] The molding condition adjustment method according to any one of Appendix 1 to Appendix 3, wherein...

[0186] In each of the multiple adjustment steps, multiple setting processes are performed according to the predetermined sequence, wherein...

[0187] The setting order is a setting order in which the setting methods used for coarse adjustments to the adjustment items are set earlier, and the setting methods used for fine adjustments to the adjustment items are set later.

[0188] (Note 5)

[0189] The molding condition adjustment method according to any one of Appendix 1 to Appendix 4, wherein,

[0190] In each of the adjustment steps after the adjustment order is determined to be second, the following setting processes are performed:

[0191] The setting method, which is determined to be the first in the setting order, sets the device setting value by a setting method that is different from the setting method that is the last step in the adjustment order.

[0192] (Note 6)

[0193] The molding condition adjustment method according to any one of Annexes 1 to 5, wherein...

[0194] In at least one of the adjustment steps after the adjustment order is determined to be second, the following setting process is performed:

[0195] The setting method, which is determined to be the first in the setting order, sets the device setting value using a setting method different from the setting methods already performed in other adjustment steps.

[0196] (Note 7)

[0197] The molding condition adjustment method according to any one of Annexes 1 to 6, wherein...

[0198] In at least one of the adjustment steps after the adjustment order is determined to be second, the following setting process is performed:

[0199] As at least one of the setting methods in which the setting order is determined to be the second position, the device setting value is set by the setting method common to the setting methods already performed in the other adjustment steps.

[0200] (Note 8)

[0201] The molding condition adjustment method according to any one of Annexes 1 to 7, wherein...

[0202] The plurality of adjustment items include at least one of the following: the temperature of the molded body, the mass distribution of the molded body, the height of the molded body, and the internal volume of the molded body.

[0203] The plurality of adjustment steps include at least one of the following adjustment steps:

[0204] Adjustment steps for adjusting the temperature of the molded body;

[0205] Adjustment steps for adjusting the mass distribution of the molded body;

[0206] The steps for adjusting the height of the molded body; and

[0207] The adjustment steps for adjusting the internal volume of the molded body.

[0208] (Note 9)

[0209] The molding condition adjustment method according to any one of Annexes 1 to 8, wherein...

[0210] Several of the aforementioned adjustments include:

[0211] The temperature of the molded body, the mass distribution of the molded body, and at least one of the height and internal volume of the molded body.

[0212] The plurality of adjustment steps include at least one of the following adjustment steps:

[0213] Adjustment steps for adjusting the temperature of the molded body;

[0214] The adjustment steps for adjusting the mass distribution of the molded body; and

[0215] The adjustment steps for adjusting the height of the molded body and

[0216] The adjustment steps for adjusting the internal volume of the molded body.

[0217] (Postscript 10)

[0218] The molding condition adjustment method according to any one of Annexes 1 to 9, wherein...

[0219] The adjustment sequence for the temperature of the molded body is determined to be earlier than the adjustment sequence for other adjustment items.

[0220] (Postscript 11)

[0221] The molding condition adjustment method according to any one of Annexes 1 to 10, wherein,

[0222] The adjustment sequence for the temperature of the molded body is determined to be earlier than the adjustment sequence for the mass distribution of the molded body.

[0223] The adjustment order for the mass distribution of the molded body is determined to be earlier than the adjustment order for the mass distribution of the molded body.

[0224] (Postscript 12)

[0225] The molding condition adjustment method according to any one of Appendix 1 to Appendix 11, wherein,

[0226] The molding body manufacturing apparatus includes at least:

[0227] A heating device for the workpiece being molded, for heating the workpiece being molded; and

[0228] A blow molding apparatus manufactures a molded body by blow molding a workpiece heated by a workpiece heating device.

[0229] The following settings are performed during the temperature adjustment step of the molded body:

[0230] The device setting value for the heating device of the molded body is set by one or more of the following setting methods: setting an overall heating condition for the molded body related to the overall heating of the molded body, setting an individual heating condition for the molded body related to the individual heating of the molded body, and setting a local heating condition for the molded body related to the local heating of the molded body.

[0231] The following settings are performed in the steps of adjusting the mass distribution of the molded body, adjusting the height of the molded body, and adjusting the internal volume of the molded body:

[0232] The device setting value for at least one of the devices of the heating device for the molded body and the blow molding device is set by one or more of the setting methods of the overall heating condition for the molded body, the individual heating condition for the molded body, the local heating condition for the molded body, the pre-blow molding condition with setting device setting value related to pre-blow molding, the main blow molding condition with setting device setting value related to main blow molding, and the molded body cooling condition with setting device setting value related to cooling of the molded body.

[0233] (Postscript 13)

[0234] The molding condition adjustment method according to any one of Appendix 1 to Appendix 12, wherein,

[0235] Each of the aforementioned adjustment steps involves the following settings:

[0236] According to a predetermined setting order for the multiple setting methods, the device setting value related to the adjustment item is set using the multiple setting methods.

[0237] In each of the adjustment steps after the adjustment order is determined to be second, the following setting processes are performed:

[0238] The setting method, which is determined to be the first in the setting order, sets the device setting value by a setting method that is different from the setting method that is the last step in the adjustment order.

[0239] (Postscript 14)

[0240] According to the molding condition adjustment method described in Appendix 12 or Appendix 13, wherein,

[0241] In at least one of the adjustment steps after the adjustment order is determined to be second, the following setting process is performed:

[0242] The setting method, which is determined to be the first in the setting order, sets the device setting value using a setting method different from the setting methods already performed in other adjustment steps.

[0243] (Postscript 15)

[0244] The molding condition adjustment method according to any one of Appendix 12 to Appendix 14, wherein,

[0245] In at least one of the adjustment steps after the adjustment order is determined to be second, the following setting process is performed:

[0246] As at least one of the setting methods in which the setting order is determined to be the second position, the device setting value is set by the setting method common to the setting methods already performed in the other adjustment steps.

[0247] (Postscript 16)

[0248] The molding condition adjustment method according to any one of Appendix 1 to Appendix 12, wherein,

[0249] Each of the aforementioned adjustment steps involves the following settings:

[0250] According to a predetermined setting order for the multiple setting methods, the device setting value related to the adjustment item is set using the multiple setting methods.

[0251] Each of the aforementioned adjustment steps involves the following setting process:

[0252] As at least one of the multiple setting methods, the device setting value for the heating device of the molded body is set by any one of the overall heating condition of the molded body, the individual heating condition of the molded body, and the local heating condition of the molded body.

[0253] Explanation of reference numerals in the attached figures

[0254] 1: Bottle manufacturing management system; 2: Bottle manufacturing equipment; 3: Molding condition adjustment device; 4: User terminal device; 5: Network; 10: Preform (formed body); 11: Bottle (formed body); 20a: Injection molding equipment; 20b: Preform removal device; 20c: Preform conveyor; 20d: Preform heating device; 20e: Preform supply device; 20f: Blow molding equipment; 20g: Formed body removal device; 20h: Formed body conveyor; 21: Preform heating unit; 22: Control unit; 24: Rotation unit; 25: Molding unit; 26: Control unit; 30: Control unit; 31: Storage unit; 32: Preform heating unit; 33: Communication Unit; 34: Input Unit; 200: Mold; 210: Preform Heating Module; 211: Preform Local Heating Module; 212: Temperature Sensor; 240: Rotary Support Unit; 241: Rotation Mechanism Unit; 250: Mold Support Unit; 251: Holding Unit; 252: Stretching Unit; 253: Blow Molding Unit; 254: Mold Heating Unit; 300A: First Adjustment Processing Unit; 300B: Second Adjustment Processing Unit; 300C: Third Adjustment Processing Unit; 300D: Fourth Adjustment Processing Unit; 301: Output Processing Unit; 310: Database; 311: Molding Condition Adjustment Program; 900: Computer.

Claims

1. A method for adjusting molding conditions, wherein the method uses a computer to adjust the molding conditions when a molding body manufacturing device, operating according to multiple device setting values, blow-moldes a workpiece to manufacture a hollow molded body, wherein... The molding condition adjustment method includes multiple adjustment steps that adjust multiple adjustment items in a predetermined order for multiple adjustment items related to the molded body and the molded body. In each of the multiple adjustment steps, the device setting value related to the adjustment item is set by at least one of the multiple setting methods, thereby adjusting the adjustment item.

2. The molding condition adjustment method according to claim 1, wherein, In each of the multiple adjustment steps, the following multiple setting processes are performed: setting the device setting value related to the adjustment item according to a predetermined setting order for the multiple setting methods and through the multiple setting methods.

3. The molding condition adjustment method according to claim 2, wherein, Each of the aforementioned adjustment steps performs the following actions: Based on the device setting values ​​set according to the setting process performed in the predetermined order from morning to evening, it is determined whether the target values ​​for the adjustment item are met. If the target value is met, the adjustment of the adjustment item is terminated. If the target value is not met, the setting process is initiated based on the setting method of the next setting sequence, thereby continuing the adjustment of the adjustment item.

4. The molding condition adjustment method according to claim 2, wherein, In each of the multiple adjustment steps, multiple setting processes are performed according to the predetermined sequence, wherein... The setting order is a setting order in which the setting methods used for coarse adjustments to the adjustment items are set earlier, and the setting methods used for fine adjustments to the adjustment items are set later.

5. The molding condition adjustment method according to claim 2, wherein, In each of the adjustment steps after the adjustment order is determined to be second, the following setting processes are performed: The setting method, which is determined to be the first in the setting order, sets the device setting value by a setting method that is different from the setting method that is the last step in the adjustment order.

6. The molding condition adjustment method according to claim 5, wherein, In at least one of the adjustment steps after the adjustment order is determined to be second, the following setting process is performed: The setting method, which is determined to be the first in the setting order, sets the device setting value using a setting method different from the setting methods already performed in other adjustment steps.

7. The molding condition adjustment method according to claim 6, wherein, In at least one of the adjustment steps after the adjustment order is determined to be second, the following setting process is performed: As at least one of the setting methods in which the setting order is determined to be the second position, the device setting value is set by the setting method common to the setting methods already performed in the other adjustment steps.

8. The molding condition adjustment method according to claim 1, wherein, The plurality of adjustment items include at least one of the following: the temperature of the molded body, the mass distribution of the molded body, the height of the molded body, and the internal volume of the molded body. The plurality of adjustment steps include at least one of the following adjustment steps: Adjustment steps for adjusting the temperature of the molded body; Adjustment steps for adjusting the mass distribution of the molded body; The steps for adjusting the height of the molded body; and The adjustment steps for adjusting the internal volume of the molded body.

9. The molding condition adjustment method according to claim 1, wherein, The plurality of adjustment items include at least one of the temperature of the molded body, the mass distribution of the molded body, and the height and internal volume of the molded body. The plurality of adjustment steps include at least one of the following adjustment steps: Adjustment steps for adjusting the temperature of the molded body; The adjustment steps for adjusting the mass distribution of the molded body; and The steps for adjusting the height of the molded body and the steps for adjusting the internal volume of the molded body.

10. The molding condition adjustment method according to claim 9, wherein, The adjustment sequence for the temperature of the molded body is determined to be earlier than the adjustment sequence for other adjustment items.

11. The molding condition adjustment method according to claim 9, wherein, The adjustment sequence for the temperature of the molded body is determined to be earlier than the adjustment sequence for the mass distribution of the molded body. The adjustment order for the mass distribution of the molded body is determined to be earlier than the adjustment order for the height of the molded body and the adjustment order for the internal volume of the molded body.

12. The molding condition adjustment method according to any one of claims 8 to 11, wherein, The molding body manufacturing apparatus includes at least: A heating device for the workpiece being molded, for heating the workpiece being molded; and A blow molding apparatus manufactures a molded body by blow molding the workpiece heated by the workpiece heating device. The following settings are performed during the temperature adjustment step of the molded body: The device setting value for the heating device of the molded body is set by one or more of the following setting methods: setting an overall heating condition for the molded body related to the overall heating of the molded body, setting an individual heating condition for the molded body related to the individual heating of the molded body, and setting a local heating condition for the molded body related to the local heating of the molded body. The following settings are performed in the steps of adjusting the mass distribution of the molded body, adjusting the height of the molded body, and adjusting the internal volume of the molded body: The device setting value for at least one of the devices of the heating device for the molded body and the blow molding device is set by one or more of the setting methods of the overall heating condition for the molded body, the individual heating condition for the molded body, the local heating condition for the molded body, the pre-blow molding condition with setting device setting value related to pre-blow molding, the main blow molding condition with setting device setting value related to main blow molding, and the molded body cooling condition with setting device setting value related to cooling of the molded body.

13. The molding condition adjustment method according to claim 12, wherein, Each of the aforementioned adjustment steps involves the following settings: According to a predetermined setting order for the multiple setting methods, the device setting value related to the adjustment item is set using the multiple setting methods. In each of the adjustment steps after the adjustment order is determined to be second, the following setting processes are performed: The setting method, which is determined to be the first in the setting order, sets the device setting value by a setting method that is different from the setting method that is the last step in the adjustment order.

14. The molding condition adjustment method according to claim 13, wherein, In at least one of the adjustment steps after the adjustment order is determined to be second, the following setting process is performed: The setting method, which is determined to be the first in the setting order, sets the device setting value using a setting method different from the setting methods already performed in other adjustment steps.

15. The molding condition adjustment method according to claim 14, wherein, In at least one of the adjustment steps after the adjustment order is determined to be second, the following setting process is performed: As at least one of the setting methods in which the setting order is determined to be the second position, the device setting value is set by the setting method common to the setting methods already performed in the other adjustment steps.

16. The molding condition adjustment method according to claim 12, wherein, Each of the aforementioned adjustment steps involves the following settings: According to a predetermined setting order for the multiple setting methods, the device setting value related to the adjustment item is set using the multiple setting methods. Each of the multiple adjustment steps performs the following setting process: As at least one of the multiple setting methods, the device setting value for the heating device of the molded body is set by any one of the overall heating condition of the molded body, the individual heating condition of the molded body, and the local heating condition of the molded body.

17. A molding condition adjustment device, wherein the molding condition adjustment device adjusts the molding conditions when a molding body manufacturing device, which operates according to multiple device setting values, blow-moldes a workpiece to manufacture a hollow molded body, wherein... The molding condition adjustment device includes multiple adjustment processing units, which adjust multiple adjustment items according to a predetermined adjustment sequence for multiple adjustment items related to the workpiece and the molded body. Each of the multiple adjustment processing units sets a device setting value related to the adjustment item using at least one of the multiple setting methods, thereby adjusting the adjustment item.

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