Wire welding machine protection device for semiconductor manufacturing

Abstract

The invention discloses a wire welding machine protection device for semiconductor manufacturing, and relates to the technical field of welding equipment, the wire welding machine protection device comprises a wire welding device table, a three-axis adjusting device is arranged on the upper side of the wire welding device table, a wire welding head is installed on one side of the three-axis adjusting device, and a protection mechanism is arranged on the side, close to the wire welding head, of the three-axis adjusting device. The protection mechanism comprises a first fixing block, a flow guide block and a connecting block, the lower end of the first fixing block is fixedly connected with the flow guide block, one side of the three-axis adjusting device is fixedly connected with the connecting block, and the first fixing block and the flow guide block are used for protecting a semiconductor workpiece during wire welding; the first draught fan, the flow guide groove and the flow guide block form the annular air curtain, meanwhile, the annular air curtain, the second draught fan and the exhaust pipe form central concentrated pumping and discharging, a dynamic and directionally-flowing clean air environment is created, and the annular air curtain can prevent external air impurities from entering a bonding wire area.

Description

Technical Field

[0001] This invention relates to the field of welding equipment technology, specifically a protective device for a wire bonding machine used in semiconductor manufacturing. Background Technology

[0002] Semiconductor wire bonding machines are welding equipment. During operation, semiconductor wire bonding machines present problems such as high temperature, fumes, and easy contamination of precision components. The melting of solder produces fumes containing irritating substances, with concentrations far exceeding safety standards. Long-term inhalation can easily cause respiratory diseases. At the same time, solder slag and debris can easily adhere to and clog or wear parts, leading to frequent machine shutdowns for cleaning. Protective devices are designed to protect both the semiconductor wire bonding machine and the workers during the welding process.

[0003] The main frame of the protective device for wire bonding machines used in semiconductor workpiece manufacturing is made of aluminum alloy profiles or stainless steel. It is a fully enclosed or semi-enclosed box covering the working area of ​​the equipment. The static box can only prevent external dust from entering, but it cannot deal with the contaminants (metal spatter particles, organic fumes) generated inside the welding process. It simply isolates the contaminants, but the contaminants are still inside the wire bonding machine used in semiconductor workpiece manufacturing without being treated. When the protective device is opened during loading and unloading, the toxic gases generated by welding will still drift to the outside. Moreover, the protective device needs to be opened and closed frequently every time the material is loaded or unloaded.

[0004] Therefore, those skilled in the art have provided a protective device for a wire bonding machine used in semiconductor manufacturing to solve the problems mentioned in the background art. Summary of the Invention

[0005] The purpose of this invention is to provide a protective device for a wire bonding machine used in semiconductor manufacturing, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: A protective device for a wire bonding machine used in semiconductor manufacturing includes a wire bonding platform. A three-axis adjustment device is mounted on the upper side of the platform. A wire bonding head is installed on one side of the three-axis adjustment device. A protective mechanism is located on the side of the three-axis adjustment device near the wire bonding head. The protective mechanism includes a connecting block, which is fixedly connected to one side of the three-axis adjustment device. A first fixing block is fixedly connected to the other side of the connecting block. A connecting guide block is fixed to the lower end of the first fixing block. The first fixing block and the guide block are used to protect the semiconductor workpiece during wire bonding. A clamping mechanism is located on the side of the wire bonding platform near the wire bonding head. The clamping mechanism includes a semiconductor welding table, which is installed on the side near the wire bonding head. A placement groove is formed on the upper side of the semiconductor welding table. Slider blocks are slidably connected to both sides of the placement groove. Clamping blocks are slidably connected to the inner sides of the two sliders. First racks are slidably connected to both sides of the semiconductor welding table near the placement groove. When the guide block descends and closes, it drives the two first racks to move, and the two first racks respectively drive the two clamping blocks to clamp and fix the semiconductor workpiece.

[0007] As a further aspect of the present invention: the protective mechanism further includes four first fans, which are fixedly connected at equal intervals to the outside of the first fixed block. Each of the four first fans is provided with a guide groove on the first fixed block. An exhaust pipe is fixedly connected to the middle of the first fixed block and passes through the first fixed block. A second fan is fixedly connected to the upper end of the exhaust pipe.

[0008] As a further embodiment of the present invention: the protective mechanism further includes a sealing corrugated cloth, which is installed on the inner side of the first fixing block, and a fixing sleeve is installed on the inner side of the sealing corrugated cloth, through which the welding wire head passes.

[0009] As a further embodiment of the present invention: the protective mechanism further includes a filter plate, the filter plate being fixedly connected to the inside of the exhaust pipe near the second fan, a guide plate being fixedly connected to the inside of the exhaust pipe near the filter plate, a collection plate being fixedly connected to the inside of the exhaust pipe near the guide plate, and a collection box being detachably connected to the side of the exhaust pipe near the collection plate.

[0010] As a further embodiment of the present invention, the protective mechanism further includes a filter, which is detachably connected to the lower side of the second fan.

[0011] As a further embodiment of the present invention: the clamping mechanism further includes two double gears, which are rotatably connected to the semiconductor welding station near the two first racks. The two double gears are respectively meshed with the two first racks. The semiconductor welding station is slidably connected to the two double gears near each of the two double gears. The two double gears are respectively meshed with the two second racks. The ends of the two second racks that are close to each other are respectively fixedly connected to two sliders.

[0012] As a further aspect of the present invention, the clamping mechanism further includes two springs, which are respectively fixedly connected between the two first racks and the semiconductor bonding station.

[0013] As a further embodiment of the present invention, the clamping mechanism further includes two threaded rods, which are respectively threadedly connected to two sliders, and one end of each threaded rod passing through a slider is rotatably connected to a nearby clamping block.

[0014] Compared with the prior art, the beneficial effects of the present invention are: This invention creates a dynamic, directional clean air environment by forming an annular air curtain with a first fan, a guide channel, and a guide block, while simultaneously forming a central centralized extraction and exhaust system with a second fan and an exhaust pipe.

[0015] The annular air curtain blocks external air impurities (such as dust and fibers) from entering the wire bonding area, preventing contamination of the solder joints and affecting welding quality. It also isolates solder fumes and resin volatiles generated during the wire bonding process, preventing them from spreading to the surrounding equipment and protecting the respiratory health of operators. The airflow from the air curtain can directly act on the wire bonding head, providing auxiliary cooling for the wire bonding head that has been operating at high temperatures for a long time, preventing performance degradation due to excessive temperature. The concentrated exhaust creates a stable airflow direction within the air curtain, and the fumes will converge towards the exhaust duct inlet under negative pressure, collecting and cleaning the dust generated during welding. This allows for source control and real-time removal of pollutants without interfering with the welding process (as long as the air curtain velocity is below the critical value).

[0016] When the protective mechanism descends to the working position, it automatically triggers and completes the clamping and fixing of the workpiece; when the protective mechanism is raised, it automatically releases, simplifying the operation steps, avoiding the risk of human forgetting to clamp, and significantly improving the production cycle and the degree of equipment automation.

[0017] By changing the airflow direction through the deflector plate, and in conjunction with the inclined collection plate, larger particles are guided into the visual collection box by gravity for easy observation and cleaning. High-efficiency filters (such as activated carbon filters) adsorb toxic and harmful gases and fine particles, ensuring that the exhaust gas meets environmental and health standards, thereby cleaning the emitted gas. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of a protective device for a wire bonding machine used in semiconductor manufacturing.

[0019] Figure 2 for Figure 1 A magnified schematic diagram of the structure of A in the middle.

[0020] Figure 3 This is a schematic diagram of the protective mechanism in a protective device for a wire bonding machine used in semiconductor manufacturing.

[0021] Figure 4 This is a cross-sectional schematic diagram of the protective mechanism in a protective device for a wire bonding machine used in semiconductor manufacturing.

[0022] Figure 5 This is a schematic diagram of the exhaust pipe in a protective device for a wire bonding machine used in semiconductor manufacturing.

[0023] Figure 6 This is a schematic diagram of the internal structure of the exhaust pipe in a protective device for a wire bonding machine used in semiconductor manufacturing.

[0024] Figure 7 This is a schematic diagram of the internal structure of a collection plate in a protective device for a wire bonding machine used in semiconductor manufacturing.

[0025] Figure 8 This is a schematic diagram of the clamping mechanism in a protective device for a wire bonding machine used in semiconductor manufacturing.

[0026] Figure 9 This is a cross-sectional schematic diagram of the clamping mechanism in a protective device for a wire bonding machine used in semiconductor manufacturing.

[0027] In the picture: 1. Wire bonding device platform; 2. Three-axis adjustment device; 3. Wire bonding head; 41. First fixed block; 411. First fan; 412. Guide channel; 42. Guide block; 43. Connecting block; 44. Sealing corrugated cloth; 45. Exhaust pipe; 46. Second fan; 47. Filter plate; 471. Guide plate; 472. Collection plate; 473. Collection box; 48. Filter; 51. Semiconductor soldering station; 52. Placement slot; 53. Slider; 54. Double gear; 55. First rack; 56. Second rack; 57. Spring; 58. Clamping block; 59. Threaded rod. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, this embodiment of the invention provides a protective device for a wire bonding machine used in semiconductor manufacturing, including a wire bonding device platform 1. A three-axis adjustment device 2 is provided on the upper side of the wire bonding device platform 1. A wire bonding head 3 is installed on one side of the three-axis adjustment device 2. A protective mechanism is provided on the side of the three-axis adjustment device 2 near the wire bonding head 3. The protective mechanism includes a connecting block 43, which is fixedly connected to one side of the three-axis adjustment device 2. A first fixing block 41 is fixedly connected to the other side of the connecting block 43. A connecting guide block 42 is fixed to the lower end of the first fixing block 41. The first fixing block 41 and the guide block 42 are used to protect the semiconductor workpiece during wire bonding. A clamping mechanism is provided on the side of the wire bonding device platform 1 near the wire bonding head 3. The clamping mechanism includes a semiconductor welding table 51, which is installed on the side near the wire bonding head 3. A placement groove 52 is opened on the upper side of the semiconductor welding table 51. Slider blocks 53 are slidably connected to both sides of the placement groove 52. The inner side of 53 is slidably connected with clamping blocks 58. The semiconductor welding station 51 is slidably connected with first racks 55 on both sides near the placement groove 52. When the guide block 42 is lowered and closed, it drives the two first racks 55 to move. The two first racks 55 respectively drive the two clamping blocks 58 to clamp and fix the semiconductor workpiece. The protective mechanism also includes four first fans 411. The four first fans 411 are fixedly connected at equal distances to the outside of the first fixed block 41. The first fixed block 41 is provided with guide grooves 412 near the four first fans 411. The middle of the first fixed block 41 is fixedly connected with an exhaust pipe 45, and the exhaust pipe 45 passes through the first fixed block 41. The upper end of the exhaust pipe 45 is fixedly connected with a second fan 46. The protective mechanism also includes a sealing corrugated cloth 44. The sealing corrugated cloth 44 is installed on the inner side of the first fixed block 41. A fixing sleeve is installed on the inner side of the sealing corrugated cloth 44. The welding wire head 3 is inserted into the fixing sleeve and passes downward through the fixing sleeve.

[0030] It should be noted that the sealing corrugated cloth 44 is made of high-temperature resistant and corrosion-resistant polytetrafluoroethylene. It can synchronously expand and contract with the movement of the welding head 3 driven by the three-axis adjustment device 2, ensuring both the flexibility of the welding head 3's movement and effectively sealing the internal space of the protective mechanism to prevent the overflow of smoke and debris generated during the welding process. Four first fans 411 are arranged in a ring array outside the first fixed block 41, with their outlets all facing the inside of the guide channel 412. The outlets of the guide channel 412 are vertically downward, forming a ring-shaped air curtain with the guide block 42, enclosing the welding area. The second fan... Machine 46 is a high-pressure centrifugal fan, whose exhaust power can be adjusted according to the welding process requirements. It works in conjunction with the first fan 411 to form a dual purification mode of air curtain enclosure plus centralized exhaust. The airflow speed of the air curtain enclosure is lower than the critical wind speed that would interfere with the welding arc, so the welding device can perform welding normally. The first fixed block 41 is installed on the vertical moving mechanism of the three-axis adjustment device 2 through the connecting block 43. The vertical moving device of the three-axis adjustment device 2 drives the horizontal moving device to move. The horizontal moving device is connected to the connecting block 43 and the vertical moving device. The vertical moving device drives the welding wire head 3 to move and adjust.

[0031] In this embodiment, when welding a semiconductor workpiece, the workpiece is placed on the clamping mechanism. A vertical moving device drives the protective mechanism and the welding wire head 3 downwards. The protective mechanism engages in a slot on the clamping mechanism (the slot limits and fixes the protective mechanism), simultaneously clamping the semiconductor workpiece. The welding wire head 3 moves via the lateral and longitudinal moving devices of the three-axis adjusting device 2 to weld the semiconductor workpiece (the welding wire head 3 has a built-in micro-electric telescopic mechanism that raises and lowers during welding). After the protective mechanism is fixed, the sealing corrugated cloth 44 adjusts to follow the welding wire head 3 as it moves. During semiconductor workpiece welding, four first fans 411 on the outside of the first fixing block 41 are activated. The air from the four first fans 411 is directed vertically through the guide groove 412. The airflow is guided downwards. The guide block 42 is conical and is used to guide the airflow guided by the guide groove 412 to the center. At the same time, the second fan 46 discharges the guided airflow from the center, thus forming an air curtain enclosure. The air curtain enclosure can block external air impurities (such as dust and fibers) from entering the wire bonding area, preventing impurities from contaminating the solder joints and affecting the welding quality. It can also isolate the solder fumes and resin volatiles generated during the wire bonding process, preventing them from spreading to the surrounding equipment and protecting the respiratory health of the operators. The airflow of the air curtain can directly act on the wire bonding head 3, providing auxiliary cooling for the wire bonding head 3, which is in a high-temperature working state for a long time, and preventing its performance from deteriorating due to excessive temperature. The concentrated extraction makes a stable airflow direction in the air curtain. The smoke and dust will converge towards the air inlet of the exhaust pipe 45 under the action of negative pressure.

[0032] like Figure 2 , Figure 3, Figure 4 , Figure 5 , Figure 6 and Figure 7 As shown, optionally, the protective mechanism also includes a filter plate 47, which is fixedly connected to the inside of the exhaust pipe 45 near the second fan 46. A guide plate 471 is fixedly connected to the inside of the exhaust pipe 45 near the filter plate 47, and a collection plate 472 is fixedly connected to the inside of the exhaust pipe 45 near the guide plate 471. A collection box 473 is detachably connected to the side of the exhaust pipe 45 near the collection plate 472. The protective mechanism also includes a filter 48, which is detachably connected to the lower side of the second fan 46. Specifically, the filter 48 is inserted into the second fan 46.

[0033] It should be noted that: the filter plate 47 is made of stainless steel, and its mesh size is precisely controlled between 0.8 and 1 mm. This effectively intercepts larger impurities (typically larger than 1 mm in particle size) such as solder wire debris and solder slag generated during the welding process. The guide plate 471 is made of polycarbonate through one-piece injection molding, and its surface is treated with anti-static agents to prevent fine dust from being attracted to the surface of the guide plate 471 and causing blockage due to electrostatic adsorption. The collection plate 472 is designed with a 30° tilt angle. This angle ensures that larger impurities can slide smoothly into the collection box 473 under the action of gravity, while avoiding the airflow carrying fine smoke and dust directly impacting the collection box 473 and causing smoke and dust to overflow due to an excessively large angle. The surface of the collection plate 472 is coated with a Teflon coating, which has a low coefficient of friction and can reduce the residue of impurities on the plate surface, reducing the cleaning frequency. The collection box 473 is made of transparent ABS plastic, allowing operators to visually observe the amount of impurities accumulated inside the box. The filter 48 is filled with modified activated carbon as the adsorbent material to remove harmful substances and irritating gases from the solder fumes.

[0034] In this embodiment, when the second fan 46 is started to exhaust air from the first fixed block 41, the welding dust and impurities are drawn into the exhaust pipe 45. The filter plate 47 intercepts larger impurities. The collection plate 472 is tilted, and the guide plate 471 directs the airflow to the tilted side of the collection plate 472 to prevent dust from falling into the protective mechanism. The tilted side of the collection plate 472 is detachably connected to the collection box 473. When the second fan 46 is working at the same time, larger impurities fall onto the tilted collection plate 472. The collection box 473 collects the dust on the collection plate 472. At the same time, the filter 48 treats harmful or irritating fumes to ensure that the exhaust gas is harmless to the human body. Both the filter 48 and the collection box 473 are detachable and replaceable.

[0035] like Figure 2 , Figure 8 and Figure 9As shown, optionally, the clamping mechanism further includes two double gears 54, which are rotatably connected to the semiconductor welding station 51 near the two first racks 55. The two double gears 54 are meshed with the two first racks 55 respectively. The semiconductor welding station 51 is slidably connected to the two double gears 54 with second racks 56, which are meshed with the two second racks 56 respectively. The ends of the two second racks 56 that are close to each other are fixedly connected to two sliders 53 respectively. The clamping mechanism also includes two springs 57, which are fixedly connected between the two first racks 55 and the semiconductor welding station 51 respectively. The two springs 57 are assumed to be in an uncompressed state. The clamping mechanism also includes two threaded rods 59, which are threadedly connected to the two sliders 53 respectively. The ends of the two threaded rods 59 that pass through the sliders 53 are rotatably connected to the adjacent clamping blocks 58 respectively.

[0036] It should be noted that two clamping blocks 58 have 0.5mm thick silicone pads attached to one side of each other. The surface of the silicone pads has anti-slip textures, which can increase the friction between the clamping blocks 58 and the workpiece, preventing the workpiece from sliding during welding, and also prevent the metal clamping blocks 58 from directly contacting the workpiece and causing surface scratches. The protrusion on the outer side of the guide block 42 and the first toothed rack 55 are in the same position. The clamping blocks 58 are adjusted by the threaded rod 59 to ensure that when the protective mechanism is fully lowered, the clamping blocks 58 on both sides maintain proper clamping of the semiconductor workpiece, and will not be too tight to cause damage or too loose to cause movement.

[0037] In this embodiment, when the protective mechanism is closed before welding, during the descent of the protective mechanism of the three-axis adjustment device 2, the protective mechanism presses the first rack 55 extending from the clamping mechanism. The first racks 55 on both sides move downward in the semiconductor welding table 51. At the same time, the first racks 55 on both sides compress the spring 57 at the lower end. The first racks 55 on both sides drive the meshing double gear 54 to rotate. The double gear 54 on both sides drive the second rack 56 to slide. The second racks 56 on both sides drive the slider 53 to move closer to the center in the placement groove 52 to clamp the semiconductor workpiece to be welded. After welding is completed, the three-axis adjustment device 2 drives the protective mechanism to move back to its original position. The protective mechanism stops pressing the first racks 55 on both sides. The spring 57 drives the two first racks 55 to slide upward back to their original position. Thus, the first racks 55 on both sides drive the slider 53 to slide back to its original position. The position of the clamping block 58 can be adjusted by rotating the threaded rod 59 of the slider 53 on both sides, so that the semiconductor workpiece is clamped when pressed down. At the same time, it can be adjusted according to the size of the semiconductor workpiece.

[0038] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0039] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A protective device for a wire bonding machine used in semiconductor manufacturing, characterized in that, include: A wire bonding device platform (1) is provided on the upper side of the wire bonding device platform (1), and a wire bonding head (3) is installed on one side of the three-axis adjustment device (2). A protective mechanism is provided on the side of the three-axis adjustment device (2) near the wire bonding head (3). The protective mechanism includes a connecting block (43), which is fixedly connected to one side of the three-axis adjustment device (2). A first fixing block (41) is fixedly connected to the other side of the connecting block (43). A connecting guide block (42) is fixed at the lower end of the first fixing block (41). The first fixing block (41) and the guide block (42) are used to protect the semiconductor workpiece during wire bonding. A clamping mechanism is provided on the side of the wire bonding device platform (1) near the wire bonding head (3). The clamping mechanism includes a semiconductor welding platform (51). The semiconductor welding platform (51) is installed on the side near the wire bonding head (3). A placement groove (52) is provided on the upper side of the semiconductor welding platform (51). Slider blocks (53) are slidably connected to both sides of the placement groove (52). Clamping blocks (58) are slidably connected to the inner sides of the two sliders (53). First racks (55) are slidably connected to both sides of the semiconductor welding platform (51) near the placement groove (52). When the guide block (42) is lowered and closed, it drives the two first racks (55) to move. The two first racks (55) respectively drive the two clamping blocks (58) to clamp and fix the semiconductor workpiece.

2. The protective device for a wire bonding machine in semiconductor manufacturing according to claim 1, characterized in that, The protective mechanism also includes four first fans (411), which are fixedly connected at equal distances to the outside of the first fixed block (41). Each of the four first fans (411) has a guide groove (412) near the first fixed block (411). An exhaust pipe (45) is fixedly connected to the middle of the first fixed block (41), and the exhaust pipe (45) passes through the first fixed block (41). A second fan (46) is fixedly connected to the upper end of the exhaust pipe (45).

3. The protective device for a wire bonding machine in semiconductor manufacturing according to claim 2, characterized in that, The protective mechanism also includes a sealing corrugated cloth (44), which is installed on the inner side of the first fixing block (41). A fixing sleeve is installed on the inner side of the sealing corrugated cloth (44), and the welding wire head (3) passes through the fixing sleeve.

4. The protective device for a wire bonding machine in semiconductor manufacturing according to claim 3, characterized in that, The protective mechanism also includes a filter plate (47), which is fixedly connected to the inside of the exhaust pipe (45) near the second fan (46). A guide plate (471) is fixedly connected to the inside of the exhaust pipe (45) near the filter plate (47), and a collection plate (472) is fixedly connected to the inside of the exhaust pipe (45) near the guide plate (471). A collection box (473) is detachably connected to the side of the exhaust pipe (45) near the collection plate (472).

5. A protective device for a wire bonding machine in semiconductor manufacturing according to claim 4, characterized in that, The protective mechanism also includes a filter (48), which is detachably connected to the underside of the second fan (46).

6. The protective device for a wire bonding machine in semiconductor manufacturing according to claim 1, characterized in that, The clamping mechanism also includes two double gears (54), which are rotatably connected to the semiconductor welding station (51). The two double gears (54) are respectively meshed with two first racks (55). The semiconductor welding station (51) is slidably connected to two second racks (56) near the two double gears (54). The two double gears (54) are respectively meshed with two second racks (56). The two ends of the two second racks (56) that are close to each other are respectively fixedly connected to two sliders (53).

7. A protective device for a wire bonding machine in semiconductor manufacturing according to claim 6, characterized in that, The clamping mechanism also includes two springs (57), which are fixedly connected between the two first racks (55) and the semiconductor welding station (51).

8. A protective device for a wire bonding machine in semiconductor manufacturing according to claim 7, characterized in that, The clamping mechanism also includes two threaded rods (59), which are threadedly connected to two sliders (53) respectively. One end of each threaded rod (59) passes through a slider (53) and is rotatably connected to a nearby clamping block (58).

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