Processing device and manufacturing method

Abstract

According to the present invention, it is possible to provide a processing device and a manufacturing method that can suppress the remaining of air bubbles in a workpiece and can suppress the relative positional displacement between an upper mold and a lower mold. This machining device performs press machining on a workpiece, and is provided with: a lower die on which the workpiece is placed; an upper die that pressurizes the workpiece together with the lower die and has a convex curved shape in the pressurizing direction; and a plurality of positioning mechanisms that are respectively provided on the upper die and the lower die and that position the upper die with respect to the lower die, the upper die transitions from a curved shape to a flat shape from a state in which the upper die is in line contact with the workpiece at a position closest to the workpiece as the pressing force increases, and at least one of the positioning mechanisms is provided on an extension line of the contact line.

Description

Technical Field

[0001] This invention relates to a processing apparatus and a manufacturing method. Background Technology

[0002] For example, when stamping workpieces made of resin sheets or workpieces composed of resin sheets and substrates, air bubbles may remain inside the workpiece. Patent Document 1 discloses a method for extruding air bubbles from a workpiece by pressing a bent elastic resin plate, i.e., an upper die, against the workpiece in such a way that it is bent from one end of the elastic resin plate toward the other end.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2021-174932 Summary of the Invention

[0004] Regarding the technology disclosed in Patent Document 1, the inventors discovered the following problem. If a relative positional misalignment occurs between the upper and lower dies during stamping, it may be impossible to accurately stamp the workpiece. Therefore, in order to suppress the relative positional misalignment between the upper and lower dies, positioning mechanisms such as pins or guide pillars are provided at two positions as far apart as possible on the machining surfaces of the upper and lower dies. However, when a curved upper die is used to suppress residual air bubbles in the workpiece, the relative position between the upper and lower dies may not be able to be determined in the above-described positioning mechanism configuration.

[0005] The present invention was made to solve this problem by providing a processing apparatus and a manufacturing method that can suppress the residual air bubbles in the workpiece and suppress the relative positional shift between the upper and lower molds.

[0006] The processing apparatus of the present invention is a processing apparatus for stamping a workpiece, comprising: a lower die for holding the workpiece; an upper die for pressing the workpiece together with the lower die, and having a convex curved shape in the pressing direction; and a plurality of positioning mechanisms respectively disposed on the upper die and the lower die for positioning the upper die relative to the lower die. The upper die, at its position closest to the workpiece, transitions from a state of line contact with the workpiece to a flat shape as the applied pressure increases. At least one of the positioning mechanisms is disposed on the extension line of the contact line.

[0007] By transitioning the upper die from a curved shape to a flat shape to perform stamping on the workpiece, the processing device can simultaneously expel air bubbles from the workpiece and perform stamping. Furthermore, a positioning mechanism located on the extension line of the contact line positions the upper die relative to the lower die. This allows the processing device to suppress relative positional misalignment between the lower and upper dies.

[0008] In the positioning mechanism, one side of the upper mold and the lower mold can be a guide pin, and the other side can be a guide hole.

[0009] The contact line can extend along the width direction of the workpiece.

[0010] The workpiece can be a resin sheet with air bubbles.

[0011] The manufacturing method involved in this invention is a method for stamping a workpiece, comprising:

[0012] The steps include: making a curved upper die with a convex shape in the pressure direction make line contact with the workpiece placed on a lower die; and making the upper die transition from the curved shape to a flat shape. In the line contact step, the upper die is positioned relative to the lower die by a positioning mechanism provided on the extension line of the contact line.

[0013] Invention Effects

[0014] According to the present invention, a processing apparatus and manufacturing method are provided that can suppress residual air bubbles in the workpiece and suppress relative positional displacement between the upper and lower molds. Attached Figure Description

[0015] Figure 1 This is a cross-sectional view of the processing apparatus according to Embodiment 1.

[0016] Figure 2 This is a cross-sectional view showing the process by which the upper mold in Embodiment 1 transitions from a curved shape to a flat shape.

[0017] Figure 3 This is a top view showing the lower mold and workpiece involved in Embodiment 1.

[0018] Figure 4 This is a top view showing another example of the lower mold and workpiece involved in Embodiment 1.

[0019] Figure 5 This is a cross-sectional view showing another example of the processing apparatus according to Embodiment 1.

[0020] Figure 6 This is a flowchart of the manufacturing method involved in Implementation Method 1. Detailed Implementation

[0021] Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the following embodiments. Furthermore, for the sake of clarity, the following description and drawings have been appropriately simplified.

[0022] (Implementation Method 1)

[0023] <Structure of the processing device>

[0024] First, refer to Figures 1 to 4 The processing apparatus 1 according to Embodiment 1 will be described. Figure 1 This is a cross-sectional view of the processing apparatus according to Embodiment 1.

[0025] The processing apparatus 1 is a stamping processing apparatus for stamping workpiece W. More specifically, the processing apparatus 1 is capable of stamping workpiece W while appropriately extruding the air bubbles from workpiece W.

[0026] As a specific example of workpiece W, a resin sheet used for separators in fuel cells, in which a matrix resin is impregnated with reinforcing fibers, can be cited. If a separator with a large number of residual air bubbles is used in a fuel cell, it may lead to a decrease in the power generation efficiency of the fuel cell. Therefore, in the stamping process, the processing apparatus 1 needs to suppress the residual air bubbles in the resin sheet that serves as workpiece W. In addition, workpiece W is not limited to a resin sheet used for separators; for example, it can also be other resin sheets with air bubbles inside, or electronic components with air bubbles mixed between the resin sheet and the substrate.

[0027] Furthermore, in the following description, a three-dimensional orthogonal coordinate system of xyz will be appropriately used. The x, y, and z directions are parallel to the sides of the workpiece W in a horizontal state. In this embodiment 1, the width direction of the workpiece W is defined as the x direction, the length direction of the workpiece W as the y direction, and the thickness direction of the workpiece as the z direction. In the following description, the z direction is defined as the vertical direction, and the xy plane is defined as the horizontal plane. Of course, the z direction can also be a direction inclined from the vertical direction, and the xy plane can also be a plane inclined from the horizontal plane.

[0028] like Figure 1 As shown, the processing device 1 includes a lower mold 10, an upper mold 20, a base plate 30, an ejector 40, and a positioning mechanism 50.

[0029] The lower die 10 is a base for holding the workpiece W. A machining surface for stamping the workpiece W is formed on the upper surface (+z direction side) of the lower die 10.

[0030] The upper mold 20 is mounted on the processing device 1 so that it can be raised and lowered in the vertical direction (z direction). The upper mold 20 includes a spring plate 21 and a mold component 22.

[0031] Spring plate 21 is a plate with a convex curved shape in the downward direction (-z direction) which is the direction of pressure.

[0032] The die component 22, together with the lower die 10, clamps the workpiece W and applies pressure to the workpiece W, thereby performing a stamping process on the workpiece W. A machining surface for stamping the workpiece W is formed on the lower surface (-z direction side) of the die component 22. The die component 22 is fastened to the spring plate 21 by fastening bolts 23. Therefore, similar to the spring plate 21, the die component 22 is also formed into a convex curved shape in the downward direction (-z direction).

[0033] As described above, the upper mold 20 is bent into a convex shape in the downward direction (-z direction) by means of the spring plate 21.

[0034] The base plate 30 is located above the upper mold 20 (in the +z direction). The base plate 30 is raised and lowered in the vertical direction (z direction) by a drive source not shown. The upper mold 20 is suspended on the base plate 30 by suspension bolts 24. Therefore, if the base plate 30 is raised and lowered in the vertical direction, the upper mold 20 is also raised and lowered in the vertical direction (z direction) in the same way as the base plate 30.

[0035] Here, for reference Figure 2 and Figure 3 The shape changes of the upper die 20 during stamping are explained. Figure 2 This is a cross-sectional view showing the process by which the upper mold in Embodiment 1 transitions from a curved shape to a flat shape. Figure 2 The image above shows the upper mold 20 with a curved shape. Figure 2 The image below shows the upper mold 20 with a flat shape. Figure 3 This is a top view showing the lower mold and workpiece involved in Embodiment 1.

[0036] If the base plate 30 descends, the upper mold 20 will also descend accordingly. Furthermore, if... Figure 2 As shown in the diagram above, the upper mold 20 is in line contact with the workpiece W at its closest position to the workpiece W. More specifically, the upper mold 20 is in... Figure 3 The contact line L shown is in contact with the workpiece line W. If from... Figure 2 As the base plate 30 descends further in the state shown in the diagram above, the pressure applied to the upper mold 20 based on the base plate 30 increases, such as... Figure 2 As shown in the figure below, the upper mold 20 transitions from a curved shape to a flat shape.

[0037] As described above, the processing apparatus 1 transitions the upper die 20, which is in contact with the workpiece W, from a curved shape to a flat shape, so that it faces the end direction (+y and -y directions) of the workpiece W along the upper surface (+z direction side). Thus, the processing apparatus 1 can perform stamping processing on the workpiece W while extruding air bubbles from the contact line L towards the end direction (+y and -y directions) of the workpiece W.

[0038] The stamping process disclosed in Patent Document 1 extrudes air bubbles from one end of a workpiece W toward the other. In other words, the extrusion direction of the air bubbles in the stamping process disclosed in Patent Document 1 is only one direction. On the other hand, the stamping process according to this embodiment extrudes air bubbles from the contact line L located approximately at the center of the workpiece W toward both ends of the workpiece W. In other words, the extrusion direction of the air bubbles in the stamping process according to this embodiment is two directions. Therefore, compared with the stamping process disclosed in Patent Document 1, the stamping process according to this embodiment can perform air bubble extrusion more efficiently.

[0039] If the stamping process of workpiece W is completed and the base plate 30 rises, the upper die 20 will also rise. Moreover, as the pressure applied to the upper die 20 based on the base plate 30 decreases, the upper die 20 transitions from a flat shape to a curved shape through the restoring force of the spring plate 21.

[0040] Return to Figure 1 The ejector 40 is provided on the lower mold 10 and the upper mold 20 in a manner that allows it to move in the vertical direction (z-direction). When the upper mold 20 is pressed onto the workpiece W by the descent of the base plate 30, the ejector 40 provided on the lower mold 10 sinks downward (-z-direction), and the ejector 40 provided on the upper mold 20 sinks upward (+z-direction). On the other hand, if the base plate 30 rises, for example by the restoring force of the spring, the ejector 40 provided on the lower mold 10 floats upward, and the ejector 40 provided on the upper mold 20 floats downward. By the floating of the ejector 40, the upper mold 20 can separate from the workpiece W from the end of the workpiece W, and the processing device 1 can suppress the generation of wrinkles or scratches on the workpiece W.

[0041] To position the upper mold 20 relative to the lower mold 10 in the horizontal direction (xy plane direction), multiple positioning mechanisms 50 are provided on both the lower mold 10 and the upper mold 20. In the positioning mechanism 50, one side of the lower mold 10 and the upper mold 20 is a guide pin, and the other side is a guide hole. In addition, the shape of the guide pin and the guide hole is not particularly limited to, for example, circles or polygons.

[0042] Figure 1 The positioning mechanism 50 shown includes a main guide pin 50a and a main guide hole 50b as the main positioning mechanism, and a secondary guide pin 50c and a secondary guide hole 50d as the secondary positioning mechanism. By entering the main guide hole 50b through the main guide pin 50a and the secondary guide hole 50d through the secondary guide pin 50c, the processing device 1 can position the upper mold 20 relative to the lower mold 10 in the horizontal direction (xy plane direction).

[0043] Here, the location of the positioning mechanism 50 will be described in detail. In this embodiment, the upper die 20 transitions from a curved shape to a flat shape during stamping. As the upper die 20 transitions from a curved shape to a flat shape, the position of the end of the upper die 20 moves in the horizontal direction (xy plane direction). Therefore, if the main positioning mechanism and the auxiliary positioning mechanism are provided, for example, at two positions where the ends of the lower die 10 and the upper die 20 are as far apart as possible from each other in the horizontal direction, it is sometimes impossible to determine the relative position of the lower die 10 and the upper die 20.

[0044] In this embodiment, such as Figure 3 As shown, the main guide pin 50a and the main directional hole 50b of the main positioning mechanism are located on the extension line of the contact line L, which is the closest position between the lower die 10 and the upper die 20. Therefore, when the upper die 20 descends, it aligns with the lower die 10 at the position closest to the workpiece W. In other words, the upper die 20 maintains its curved shape through the main guide pin 50a and the main directional hole 50b of the main positioning mechanism, and the relative position of the lower die 10 and the upper die 20 is determined. Therefore, even as the upper die 20 transitions from a curved shape to a flat shape, and the end of the upper die 20 moves in the horizontal direction (xy plane direction), the relative positional shift between the lower die 10 and the upper die 20 can be suppressed.

[0045] Furthermore, the secondary guide pin 50c and secondary guide hole 50d of the secondary positioning mechanism suppress the rotation of the upper die 20 relative to the lower die 10. Additionally, as... Figure 3 As shown, the positions of the secondary guide pin 50c and secondary guide hole 50d of the secondary positioning mechanism are not limited to the end side of the lower mold 10. Figure 4 This is a top view showing another example of the lower mold and workpiece involved in Embodiment 1. For example... Figure 4 As shown, the positions of the secondary guide pin 50c and secondary guide hole 50d of the secondary positioning mechanism can be set on the extension line of the contact line L. Furthermore, the positioning mechanism 50 includes two sets: a main positioning mechanism and a secondary positioning mechanism, but it can also have three or more sets. That is, there can be multiple secondary positioning mechanisms.

[0046] Figure 5 This is a cross-sectional view showing another example of the processing apparatus according to Embodiment 1. For example... Figure 5 As shown in the figure above, the main guide pin 50a can be located on the base plate 30 instead of the upper mold 20. Furthermore, as... Figure 5 As shown in the figure below, the main guide pin 50a and the main guide hole 50b of the main positioning mechanism can be a combination of a guide post and a bushing, respectively.

[0047] The contact line L can extend along either the length or width direction of the workpiece W. Furthermore, when the contact line L extends along the width direction of the workpiece W, the upper die 20 can more effectively suppress relative positional misalignment with the lower die 10 due to the shorter contact line L.

[0048] <Manufacturing Method>

[0049] Next, a manufacturing method for manufacturing stamped products using the processing apparatus 1 according to Embodiment 1 will be described. Figure 6 This is a flowchart of the manufacturing method involved in Implementation Method 1. Figure 6 The flowchart shown begins with the workpiece W placed on the lower mold 10. However, the order of the steps is not limited to this and can be appropriately replaced.

[0050] First, the processing device 1 lowers the base plate 30, causing the upper mold 20 to make line contact with the workpiece W (step S101). Figure 2 As shown in the figure above, the upper mold 20 is in line contact with the workpiece W at the position closest to it. In this step S101, the processing device 1 positions the upper mold 20 relative to the lower mold 10 through the main guide pin 50a and the main guide hole 50b of the main positioning mechanism.

[0051] Next, the processing device 1 further lowers the base plate 30, causing the upper mold 20 to transition from a curved shape to a flat shape (step S102). If from... Figure 2 As the base plate 30 descends further in the state shown in the diagram above, the pressure exerted on the upper mold 20 by the base plate 30 increases. With this increase in pressure, such as... Figure 2 As shown in the figure below, the upper die 20, which is in line contact with the workpiece W, transitions from a curved shape to a flat shape. Thus, the processing device 1 can simultaneously extrude air bubbles from the workpiece W and perform stamping processing on the workpiece W.

[0052] If the stamping process is completed, the processing device 1 raises the base plate 30, causing the upper die 20 to separate from the lower die 10 (step S103). When the base plate 30 rises, for example, the ejector 40 provided on the lower die 10 floats upwards by the restoring force of the spring, and the ejector 40 provided on the upper die 20 floats downwards. By the floating of the ejector 40, the upper die 20 can separate from the workpiece W starting from its end, and the processing device 1 can suppress the generation of wrinkles or scratches on the workpiece W.

[0053] As explained above, the processing apparatus 1 of this embodiment 1 performs stamping processing on the workpiece W by transitioning the upper die 20 from a curved shape to a flat shape. Therefore, the processing apparatus 1 can perform stamping processing on the workpiece W while extruding air bubbles within it. Furthermore, the processing apparatus 1 positions the upper die 20 relative to the lower die 10 using a positioning mechanism provided on the extension line of the contact line L. Thus, even if the end of the upper die 20 moves in the horizontal direction (xy-plane direction) as it transitions from a curved shape to a flat shape, the processing apparatus 1 can suppress relative positional shift between the lower die 10 and the upper die 20.

[0054] Furthermore, the present invention is not limited to the above-described embodiments, and appropriate modifications can be made without departing from its spirit.

[0055] Symbol Explanation

[0056] 1-Processing device, 10-Lower mold, 20-Upper mold, 21-Spring plate, 22-Mold component, 23-Fasting bolt, 24-Suspension bolt, 30-Base plate, 40-Ejector, 50-Positioning mechanism, 50a-Main guide pin, 50b-Main guide hole, 50c-Secondary guide pin, 50d-Secondary guide hole, L-Contact line, W-Workpiece.

Claims

1. A processing apparatus for stamping workpieces, characterized in that, have: The lower mold holds the workpiece; The upper die, together with the lower die, applies pressure to the workpiece and has a convex, curved shape in the pressure direction; and Multiple positioning mechanisms are respectively disposed on the upper mold and the lower mold, and perform positioning of the upper mold relative to the lower mold. The upper die, at its closest position to the workpiece, begins in line contact with the workpiece and, as the applied pressure increases, transitions from a curved shape to a flat shape. At least one of the positioning mechanisms is located on the extension line of the contact line.

2. The processing apparatus according to claim 1, characterized in that, In the positioning mechanism One side of the upper mold and the lower mold is a guide pin. The other side has a guide hole.

3. The processing apparatus according to claim 1 or 2, characterized in that, The contact line extends along the width direction of the workpiece.

4. The processing apparatus according to claim 1 or 2, characterized in that, The workpiece is a resin sheet containing air bubbles.

5. A manufacturing method for stamping a workpiece, characterized in that, include: The step of making the upper die, which has a convex curved shape in the pressure direction, make line contact with the workpiece placed on the lower die; and The step of transitioning the upper mold from the curved shape to a flat shape. In the line contact step, the upper mold is positioned relative to the lower mold by a positioning mechanism provided on the extension line of the contact line.

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