White-light lamp bead preparation method and white-light lamp bead
By integrating blue-green light chips, fluorescent adhesive, and infrared adhesive into white LED chips, the problem of complex white LED chip packaging was solved, and the infrared function was simplified while the stability of the light source was improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- DONGGUAN FURIYUANLEI TECH CO LTD
- Filing Date
- 2025-12-03
- Publication Date
- 2026-04-24
AI Technical Summary
To enable infrared functionality in existing white LED chips, an infrared chip needs to be added, which increases packaging complexity.
The design integrates blue-green light chips with fluorescent and infrared adhesives. By fixing the blue-green light chips inside the bracket cup and applying fluorescent and infrared adhesives, the use of infrared chips is reduced, and the infrared receiver is integrated using printed circuit board traces.
It simplifies the packaging complexity of the LED beads, improves the stability and reliability of the light source, reduces energy loss, and realizes the integration of infrared functions.
Smart Images
Figure CN121924918A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of LED chip manufacturing, and more particularly to a method for manufacturing white LED chips and white LED chips. Background Technology
[0002] Infrared touch control is a non-contact touch technology based on infrared sensing, which detects the touch position through a grid of infrared emitting and receiving elements. It is widely used in large-screen displays, educational whiteboards, industrial control, and other fields, offering advantages such as high durability, strong anti-interference capabilities, and low cost. Meanwhile, white LED chips, because they provide white light similar to natural light, meet the lighting needs of various indoor and outdoor scenarios, making them a key component in the lighting industry.
[0003] Currently, to enable white LED chips to have infrared functionality, an infrared chip needs to be added to emit infrared signals, requiring separate wiring design, which increases the overall packaging complexity of the LED chip. Summary of the Invention
[0004] In view of the shortcomings of the prior art, the purpose of this invention is to provide a method for manufacturing white light LED chips and white light LED chips, so that the white light LED chips have infrared function and reduce the overall packaging complexity of the LED chips.
[0005] The technical solution of the present invention is as follows: A method for preparing white LED beads includes the following steps: Fabrication of blue-green light chips; A predetermined number of blue-green light chips are fixedly connected inside the support bowl; A layer of fluorescent adhesive is applied on top of the blue-green light chip inside the bowl and the fluorescent adhesive is allowed to cure. The fluorescent adhesive is obtained by mixing KSF phosphor and glue. Apply a layer of infrared adhesive on top of the fluorescent adhesive and wait for the infrared adhesive to cure. The infrared adhesive is obtained by mixing infrared powder and glue.
[0006] Optionally, the step of fabricating the blue-green light chip specifically includes: The first indium gallium nitride active layer required for growing green light units on the substrate; The material in the blue light unit region on the substrate is removed using photolithography and etching techniques; The second indium gallium nitride active layer required for growing blue light-emitting cells is grown on the exposed substrate.
[0007] Optionally, the step of fabricating the blue-green light chip further includes: A trench is formed between the green light unit and the blue light unit using etching technology; P-type electrodes and N-type electrodes were fabricated for the blue light unit and the green light unit, respectively.
[0008] Optionally, the preset number of blue-green light chips ranges from 1 to 3.
[0009] Optionally, the support cup is a circular cup support with asymmetrical functional areas.
[0010] Optionally, the thickness of the fluorescent adhesive ranges from 1 / 3 to 2 / 3 of the height of the cup inside the support bowl.
[0011] Optionally, the thickness of the infrared adhesive is one-third of the height of the inner bowl of the support cup.
[0012] Optionally, the blue-green light chip is connected to the bracket cup by wire bonding or solder paste connection.
[0013] Optionally, the wavelength of the infrared powder is the wavelength of invisible light.
[0014] This invention also proposes a white light LED based on the above-described method for preparing white light LEDs, the white light LED comprising: Support for bowls and cups; A blue-green light chip is disposed inside the cup of the support. A fluorescent adhesive layer is disposed above the blue-green light chip; An infrared adhesive layer is disposed above the fluorescent adhesive layer.
[0015] The technical solution of this invention first fabricates blue-green light chips, then fixes a predetermined number of blue-green light chips into a bracket cup; a layer of fluorescent adhesive is applied above the blue-green light chips in the cup and allowed to cure; finally, a layer of infrared adhesive is applied above the fluorescent adhesive and allowed to cure. In this way, the number of blue-green light chips in the white LED can be selected according to actual brightness, voltage, and other requirements; and the infrared light signal can be presented through the infrared adhesive, reducing the use of infrared chips and avoiding packaging complexity; moreover, the infrared adhesive is integrated into the LED, and the circuitry is integrated through printed circuit board traces to connect to the infrared receiver, reducing the need for separate infrared receiver wiring design. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0017] Figure 1 This is a flowchart of the method steps of an embodiment of the white LED chip preparation method of the present invention.
[0018] Figure 2This is a flowchart of the method steps of another embodiment of the white LED chip preparation method of the present invention.
[0019] Figure 3 This is a flowchart of the method steps for another embodiment of the white LED chip preparation method of the present invention.
[0020] Figure 4 This is a schematic diagram of the structure of an embodiment of the white LED bead of the present invention.
[0021] Figure 5 This is a top view of the bracket cup in the white light bulb of the present invention.
[0022] Explanation of reference numerals in the attached diagram: 10, support cup; 20, blue-green light chip; 30, fluorescent adhesive layer; 40, infrared adhesive layer. Detailed Implementation
[0023] To make the objectives, technical solutions, and effects of this invention clearer and more explicit, the invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
[0024] In the implementation methods and claims, unless otherwise specified in the text, the terms "a," "an," "the," and "the" may also include plural forms. If the embodiments of the present invention involve descriptions of "first," "second," etc., such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.
[0025] It should be further understood that the term "comprising" as used in this specification means the presence of the stated features, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. It should be understood that when an element is referred to as "connected" or "coupled" to another element, it can be directly connected or coupled to the other element, or there may be intermediate elements present. Furthermore, "connected" or "coupled" as used herein can include wireless connections or wireless coupling. The term "and / or" as used herein includes all or any unit and all combinations of one or more associated listed items.
[0026] It will be understood by those skilled in the art that, unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It should also be understood that terms such as those defined in general dictionaries should be understood to have the same meaning as in the context of the prior art, and should not be interpreted in an idealized or overly formal sense unless specifically defined as herein.
[0027] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are feasible for those skilled in the art. If the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.
[0028] Infrared touch control is a non-contact touch technology based on infrared sensing, which detects the touch position through a grid of infrared emitting and receiving elements. It is widely used in large-screen displays, educational whiteboards, industrial control, and other fields, offering advantages such as high durability, strong anti-interference capabilities, and low cost. Meanwhile, white LED chips, because they provide white light similar to natural light, meet the lighting needs of various indoor and outdoor scenarios, making them a key component in the lighting industry.
[0029] Currently, to enable white LED chips to have infrared functionality, an infrared chip needs to be added to emit infrared signals, requiring separate wiring design, which increases the overall packaging complexity of the LED chip.
[0030] To address the above problems, this invention proposes a method for preparing white LED beads.
[0031] Reference Figure 1 In one embodiment, the method for preparing white LED chips includes the following steps: S100, fabrication of blue-green light chips; S200. Fix a preset number of blue-green light chips inside the support bowl; S300. Apply a layer of fluorescent adhesive on top of the blue-green light chip inside the bowl and wait for the fluorescent adhesive to cure. The fluorescent adhesive is obtained by mixing KSF phosphor and glue. S400. Apply a layer of infrared adhesive on top of the fluorescent adhesive and wait for the infrared adhesive to cure. The infrared adhesive is obtained by mixing infrared powder and glue.
[0032] In this embodiment, the blue-green light chip is a single chip capable of emitting two colors of light. Fabricating a single blue-green light chip allows for the simultaneous emission of both blue and green light, reducing chip complexity, the number of chips required, and the overall chip size, making it suitable for applications with limited space. Furthermore, the integrated design reduces the need for external circuitry and drivers. Simultaneously generating blue and green light within a single chip optimizes light output and utilization efficiency, reducing energy loss. Fixing the blue-green light chip within a support cup provides stable support, reducing movement or vibration during use, thereby improving the stability and reliability of the light source. The support cup design also helps optimize the light emission angle and distribution, allowing light to more effectively illuminate the target area and improving light utilization efficiency.
[0033] After fixing the blue-green LED chip inside the bracket cup, a layer of fluorescent adhesive, made of KSF phosphor and glue, can be applied on top of the chip and allowed to cure. KSF phosphor can be composed of elements such as potassium, strontium, fluorine, and manganese. KSF phosphor emits red fluorescence under excitation light, so the blue and green light emitted by the blue-green LED chip mixes with the red fluorescence emitted by the fluorescent adhesive to produce white light. Understandably, because the high color gamut TV manufacturing process uses a blue LED chip + green phosphor + KSF powder solution, the large variety and quantity of powders result in a high solubility of the powder and glue mixture. The heat generated during LED operation can easily cause the powder-glue mixture to crack, leading to poor reliability. In this embodiment, a combination of blue-green light chip and KSF phosphor colloid is used. On the one hand, the blue and green light emitted by the blue-green light chip can better excite the KSF phosphor to obtain a higher color gamut. On the other hand, the blue and green light are integrated on a single blue-green light chip, which reduces the amount of green powder required in the powder and lowers the solubility of the powder colloid, thereby improving the reliability of the LED.
[0034] Finally, a layer of infrared adhesive, made by mixing infrared powder and glue, is applied on top of the fluorescent adhesive and left to cure. This completes the fabrication of the white LED chip. In practical applications, when an electric current is applied to the white LED chip, the blue-green light chip emits blue and green light, which mixes with the red fluorescence emitted by the KSF phosphor in the fluorescent adhesive to produce white light. The remaining unexcited blue light from the KSF phosphor penetrates the infrared adhesive and excites the infrared powder, thus exciting its infrared light.
[0035] The technical solution of this invention first fabricates blue-green light chips, then fixes a predetermined number of blue-green light chips into a bracket cup; a layer of fluorescent adhesive is applied above the blue-green light chips in the cup and allowed to cure; finally, a layer of infrared adhesive is applied above the fluorescent adhesive and allowed to cure. In this way, the number of blue-green light chips in the white LED can be selected according to actual brightness, voltage, and other requirements; and the infrared light signal can be presented through the infrared adhesive, reducing the use of infrared chips and avoiding packaging complexity; moreover, the infrared adhesive is integrated into the LED, and the circuitry is integrated through printed circuit board traces to connect to the infrared receiver, reducing the need for separate infrared receiver wiring design.
[0036] Reference Figure 2 In one embodiment, the step of fabricating the blue-green light chip specifically includes: S110, The first indium gallium nitride active layer required for growing green light units on the substrate; S120: The material in the blue light unit region on the substrate is removed by photolithography and etching techniques; S130. Grow the second indium gallium nitride active layer required for the blue light unit on the exposed substrate.
[0037] In this embodiment, the blue-green light chip can emit blue-green light, specifically including green light units and blue light units. The green and blue light units can be constructed using an indium gallium nitride (IGaN) active layer. The wavelength of the emitted light is changed by adjusting the indium content; the higher the indium content in the IGaN active layer, the longer the wavelength and the more greenish the color. Conversely, the indium content in the IGaN active layer used for blue light emission is lower, achieving blue light emission. Therefore, in this embodiment, the indium content in the first IGaN active layer is higher than that in the second IGaN active layer. Specifically, the fabrication process involves first growing all the epitaxial layers required for the green light units on the substrate, i.e., the first IGaN active layer; then, the material in the blue light unit region on the substrate is removed using photolithography and etching techniques, and finally, the epitaxial layer of the blue light units, i.e., the second IGaN active layer, is regrown on the exposed substrate. Thus, the green and blue light units are grown sequentially, allowing the blue-green light chip to emit both blue and green light simultaneously.
[0038] Reference Figure 3 In one embodiment, the step of fabricating the blue-green light chip further includes: S140. A trench is formed between the green light unit and the blue light unit using etching technology; S150, P-type electrodes and N-type electrodes are fabricated for the blue light unit and the green light unit, respectively.
[0039] In this embodiment, device isolation is also required during the fabrication of the blue-green light chip to ensure that the two colors of light do not interfere with each other. Specifically, a physical trench can be formed between the green and blue light units using etching techniques (such as dry etching) to ensure that the two light-emitting units are electrically independent and can be controlled separately. Furthermore, P-type and N-type electrodes are fabricated for the blue and green light units respectively. Through precise photolithography and vapor deposition processes, a blue-green light chip will have at least four electrode pins (blue P-p, blue N-p, green P-p, and green N-p), allowing the driving circuit to independently control the on / off state of the two colors.
[0040] In one embodiment, the preset number of blue-green light chips ranges from 1 to 3.
[0041] In this embodiment, the preset number of blue-green light chips is set to 1 to 3. By adjusting the number of blue-green light chips, white light of different brightness can be achieved to meet the needs of different situations. Furthermore, setting it to 1 to 3 chips can reduce manufacturing costs and complexity while maintaining performance.
[0042] In one embodiment, the support cup is a circular cup support with asymmetrical functional areas.
[0043] In this embodiment, the asymmetrical support cup allows for the placement of more blue-green light chips, while the round cup is used to improve the light output effect.
[0044] In one embodiment, the thickness of the fluorescent adhesive ranges from 1 / 3 to 2 / 3 of the height of the cup inside the support bowl.
[0045] In this embodiment, controlling the thickness of the fluorescent adhesive within a certain range helps to ensure uniform scattering and absorption of light within the adhesive. If the fluorescent adhesive is too thin, some blue and green light may not fully interact with the phosphor before being emitted; if the fluorescent adhesive is too thick, excessive light loss during propagation may result in uneven white light color and localized color distortion.
[0046] In one embodiment, the thickness of the infrared adhesive is one-third of the height of the inner bowl of the support cup.
[0047] In this embodiment, the infrared adhesive is placed above the fluorescent adhesive and its thickness is controlled to be 1 / 3 of the height inside the cup. This ensures stable transmission of infrared light within the adhesive layer, reduces light loss, and allows the infrared light to be effectively emitted from the LED beads, enabling functions such as infrared sensing and remote control. Furthermore, a suitable thickness of the infrared adhesive avoids interference between infrared and white light. If the infrared adhesive is too thick, it may affect the emission of white light, causing changes in the color and intensity of the white light; if the infrared adhesive is too thin, it may not be able to effectively emit or transmit infrared light, affecting the normal operation of the infrared function.
[0048] In one embodiment, the blue-green light chip is connected to the support cup by wire bonding or solder paste connection.
[0049] In this embodiment, wire bonding can be used for upright-mounted products (i.e., products with the blue / green LED chip facing upwards). Connecting the chip to the support cup via wire bonding achieves good electrical contact and thermal conductivity, suitable for applications requiring high reliability and stability. Solder paste bonding, on the other hand, is used for flip-chip products (i.e., products with the chip facing downwards). Solder paste bonding can be achieved through reflow soldering, suitable for mass production, and can improve production efficiency.
[0050] In one embodiment, the wavelength of the infrared powder is the wavelength of invisible light.
[0051] In this embodiment, the use of infrared powder with an invisible wavelength can help improve the color rendering index of white light bulbs, making the colors of objects under the light source more realistic and natural.
[0052] The present invention also proposes a white light lamp bead based on the white light lamp bead preparation method described above.
[0053] Reference Figure 4 In one embodiment, the white LED chip includes: 10 cups / stands; A blue-green light chip 20 is disposed inside the bracket cup 10; A fluorescent adhesive layer 30 is disposed above the blue-green light chip 20; An infrared adhesive layer 40 is disposed above the fluorescent adhesive layer 30.
[0054] In this embodiment, the support bowl 10 can be a circular cup support with an asymmetrical functional area. An asymmetrical support allows for the placement of more blue-green light chips 20, while the circular cup design enhances the light emission effect. A top view of the support bowl 10 can be found in [reference needed]. Figure 5 The blue-green light chip 20 is a single chip that can emit two colors of light. Manufacturing a single blue-green light chip 20 allows for the simultaneous emission of both blue and green light, thus reducing chip complexity, the number of chips required, and the overall chip size, making it suitable for applications with limited space. Furthermore, the integrated design reduces the need for external circuitry and drivers. Additionally, simultaneously generating blue and green light within a single chip optimizes light output and utilization efficiency, reducing energy loss. Fixing the blue-green light chip 20 within the support cup 10 provides stable support, reducing movement or vibration during use, thereby improving the stability and reliability of the light source. The fluorescent adhesive layer 30 is obtained by mixing KSF phosphor and adhesive. KSF phosphor can be composed of elements such as potassium, strontium, fluorine, and manganese. KSF phosphor emits red fluorescence under excitation light, so the blue and green light emitted by the blue-green chip 20 can mix with the red fluorescence emitted by the fluorescent adhesive to emit white light. Understandably, because the high color gamut TV manufacturing scheme uses a blue chip + green phosphor + KSF powder, the variety and quantity of powders are large, resulting in a high solubility of the powder and adhesive mixture. The heat generated during LED operation can easily cause the powder-adhesive mixture to crack, leading to poor reliability. In this embodiment, a combination of blue-green chip 20 and KSF phosphor colloid is used. On the one hand, the blue and green light emitted by the blue-green chip 20 can better excite the KSF phosphor, resulting in a higher color gamut. Furthermore, the blue and green light are integrated onto a single blue-green chip 20, reducing the amount of green powder required and lowering the solubility of the powder mixture, thereby improving the reliability of the LED.
[0055] The infrared adhesive layer 40 is obtained by mixing infrared powder and glue, thus completing the preparation of the white light lamp bead. In practical applications, when an electric current is applied to the white light lamp bead, the blue-green light chip 20 emits blue and green light, which mixes with the red fluorescence emitted by the KSF phosphor in the fluorescent adhesive to emit white light; the remaining unexcited KSF phosphor's blue light penetrates the infrared adhesive to excite the infrared powder, thus exciting the infrared light of the infrared powder.
[0056] It should be understood that the application of the present invention is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.
Claims
1. A method for preparing white LED beads, characterized in that, Includes the following steps: Fabrication of blue-green light chips; A predetermined number of blue-green light chips are fixedly connected inside the support bowl; A layer of fluorescent adhesive is applied on top of the blue-green light chip inside the bowl and the fluorescent adhesive is allowed to cure. The fluorescent adhesive is obtained by mixing KSF phosphor and glue. Apply a layer of infrared adhesive on top of the fluorescent adhesive and wait for the infrared adhesive to cure. The infrared adhesive is obtained by mixing infrared powder and glue.
2. The method for preparing white LED beads as described in claim 1, characterized in that, The steps for fabricating the blue-green light chip specifically include: The first indium gallium nitride active layer required for growing green light units on the substrate; The material in the blue light unit region on the substrate is removed using photolithography and etching techniques; The second indium gallium nitride active layer required for growing blue light-emitting cells is grown on the exposed substrate.
3. The method for preparing white LED beads as described in claim 2, characterized in that, The steps for fabricating the blue-green light chip also include: A trench is formed between the green light unit and the blue light unit using etching technology; P-type electrodes and N-type electrodes were fabricated for the blue light unit and the green light unit, respectively.
4. The method for preparing white LED beads as described in claim 1, characterized in that, The preset number of blue-green light chips ranges from 1 to 3.
5. The method for preparing white LED beads as described in claim 1, characterized in that, The support cup is a round cup support with asymmetrical functional areas.
6. The method for preparing white LED beads as described in claim 1, characterized in that, The thickness of the fluorescent adhesive ranges from 1 / 3 to 2 / 3 of the height inside the cup of the support.
7. The method for preparing white LED beads as described in claim 1, characterized in that, The thickness of the infrared adhesive is one-third of the height of the bowl inside the support cup.
8. The method for preparing white LED beads as described in claim 1, characterized in that, The blue-green light chip is connected to the bracket cup by either wire bonding or solder paste connection.
9. The method for preparing white LED beads as described in claim 1, characterized in that, The infrared powder has a wavelength that is invisible to the naked eye.
10. A white light LED chip manufactured according to the method for manufacturing white light LED chips according to any one of claims 1-9, characterized in that, include: Support for bowls and cups; A blue-green light chip is disposed inside the cup of the support. A fluorescent adhesive layer is disposed above the blue-green light chip; An infrared adhesive layer is disposed above the fluorescent adhesive layer.