Display device

Abstract

According to one aspect of the present disclosure, a display device includes a display panel including a pattern layer, and a resin film that is flexible and disposed in at least one position below or above the display panel. The pattern layer includes: a plurality of first plate patterns spaced apart from each other, in which sub-pixels including display elements and driving elements are disposed; a plurality of first line patterns connecting the plurality of first plate patterns; a plurality of second plate patterns spaced apart from each other, the second plate patterns having gate drivers disposed therein; and a plurality of second line patterns connecting the plurality of second plate patterns or connecting the first plate pattern and the second plate pattern. The resin film may be obtained by curing a material including a urethane acrylate and two types of photoinitiators.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2024-0144741, filed with the Korean Intellectual Property Office on October 22, 2024, the disclosure of which is incorporated herein by reference. Technical Field

[0003] This disclosure relates to display devices, and more specifically to stretchable display devices that can be stretched. Background Technology

[0004] As display devices used as monitors for computers, televisions, or cellular phones, there are organic light-emitting display devices (OLEDs) that are self-emissive and liquid crystal display devices (LCDs) that require a separate light source.

[0005] The applications of display devices have diversified to personal digital assistants and monitors for computers and televisions, and research is underway on display devices with large display areas and reduced size and weight.

[0006] Recently, display devices that are manufactured by forming display units and wiring on a flexible substrate, such as plastic, a flexible material, so that they can be stretched in a specific direction and change in various forms, have attracted attention as the next generation of display devices.

[0007] Stretchable display devices require properties that allow for easy bending and stretching, which necessitates the use of a substrate formed from polydimethylsiloxane (PDMS) with a low modulus to provide ductility, and the use of an adhesive layer and cover components with matching stretchability. Summary of the Invention

[0008] When PDMS substrates are used in stretchable display devices, a silicon-based adhesive layer with similar stretching properties is used. While the silicon-based adhesive layer exhibits excellent adhesion to the PDMS substrate, its high releasing strength makes it difficult to form the panel configuration layer on the adhesive layer, and furthermore, the layer is prone to peeling.

[0009] Therefore, acrylic adhesive layers can be used. Acrylic adhesive layers have lower peel strength than silicone-based adhesive layers, making them easier to form display panels. However, due to the surface characteristics of the PDMS substrate with low surface energy, there is a problem of low adhesion strength between the PDMS substrate and the acrylic adhesive layer, which causes interface separation and Z-axis deformation of the panel lines.

[0010] Therefore, the objective of this disclosure is to provide a display device that has excellent tensile reliability by solving the interface separation problem caused by the difference in tensile properties between the substrate and the adhesive layer.

[0011] Another objective of this disclosure is to provide a display device that simplifies the structure and has high tensile properties and improved manufacturing efficiency.

[0012] The purpose of this disclosure is not limited to the purposes mentioned above, and other purposes not mentioned above will be clearly understood by those skilled in the art from the following description.

[0013] To achieve the above objectives, according to one aspect of this disclosure, a display device may be included, comprising: a display panel including a pattern layer; and a resin film, which is a flexible film and disposed at at least one location below or above the display panel. The pattern layer includes: a plurality of first plate patterns spaced apart from each other, each first plate pattern having sub-pixels including display elements and driving elements; a plurality of first line patterns connecting the plurality of first plate patterns; a plurality of second plate patterns spaced apart from each other, each second plate pattern having a gate driver; and a plurality of second line patterns connecting the plurality of second plate patterns or connecting the first plate patterns and the second plate patterns. The resin film can be obtained by curing a material comprising polyurethane acrylate and two types of photoinitiators.

[0014] Other specific details of the exemplary implementation are included in the detailed implementation and the accompanying drawings.

[0015] According to an exemplary embodiment of this disclosure, the display device may include a flexible resin film in at least one of the following locations: below the display panel, between the display panel and the touch panel, and above the touch panel. The resin film may include polyurethane acrylate and two types of photoinitiators with different absorption wavelengths. Such a resin film serves as a substrate supporting and protecting components disposed above and / or below the resin film, and has adhesive properties. Therefore, when the resin film is provided, the adhesive layer for bonding components disposed above and / or below the resin film can be omitted, thereby simplifying the structure and manufacturing process of the display device.

[0016] Furthermore, in related technologies, adhesive layers are used to bond the lower substrate, upper substrate, and / or cover member. However, a problem arises in this case where the materials configuring the lower substrate, upper substrate, cover member, and adhesive layer have physical properties different from the desired physical properties, necessitating the matching of tensile characteristics. Moreover, when a substrate formed from a silicon-based elastic material with excellent tensile properties and a silicon-based adhesive layer are bonded, the adhesive strength between them is excellent; however, the peel strength of the silicon-based adhesive layer is high, resulting in poor adhesion between the silicon-based adhesive layer and the display panel. This makes it difficult to manufacture the display panel and may lead to interface separation. Simultaneously, when an acrylic adhesive layer is bonded to a substrate formed from a silicon-based elastic material, the surface energy difference between the two materials is so large due to their material properties that interface separation or Z-axis deformation of the wiring in the panel configuration can occur.

[0017] According to an exemplary embodiment of this disclosure, a resin film disposed in the display device serves as a substrate and has adhesive properties, eliminating the need for a bonding adhesive layer. Furthermore, compared to a substrate bonded with an adhesive layer, the resin film exhibits superior tensile properties, tensile durability, and reliability. Moreover, the omission of the adhesive layer reduces the thickness of the display device, thereby reducing tensile stress and achieving a highly stretchable display device.

[0018] The effects of this disclosure are not limited to those illustrated above, and this specification includes many more effects. Attached Figure Description

[0019] The foregoing and other aspects, features and other advantages of this disclosure will become clearer from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0020] Figure 1 This is an exploded perspective view schematically illustrating a display device according to an exemplary embodiment of the present disclosure;

[0021] Figure 2 It is shown that it includes Figure 1 A plan view of an example display panel in a display device;

[0022] Figure 3 It is shown Figure 2 Enlarged plan view of part A of the example;

[0023] Figure 4 It shows along Figure 3 A cross-sectional view of an example taken from line III-III';

[0024] Figures 5A to 5J This is a cross-sectional view illustrating a method for manufacturing a display device according to an exemplary embodiment of the present disclosure;

[0025] Figure 6 This is a schematic cross-sectional view used to illustrate another example of a display device;

[0026] Figure 7 This is a schematic cross-sectional view used to illustrate yet another example of a display device; and

[0027] Figure 8 This is a schematic cross-sectional view used to illustrate yet another example of a display device. Detailed Implementation

[0028] The advantages and features of this disclosure, as well as methods for achieving these advantages and features, will become clear from the exemplary embodiments described in detail below, together with the accompanying drawings. However, this disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. Exemplary embodiments are provided by way of example only so that those skilled in the art can fully understand the disclosure and scope of this disclosure.

[0029] The shapes, dimensions, ratios, angles, numbers, etc., shown in the accompanying drawings to describe exemplary embodiments of this disclosure are merely examples, and this disclosure is not limited thereto. Throughout the specification, similar reference numerals generally denote similar elements. Furthermore, in the following description of this disclosure, detailed descriptions of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of this disclosure. Terms such as “comprising,” “having,” and “consisting of” as used herein are generally intended to allow for the addition of additional components, unless these terms are used in conjunction with the term “only.” Unless otherwise expressly stated, any reference to the singular may include the plural.

[0030] Even without explicit explanation, components are interpreted as including the normal tolerance range.

[0031] When described as a “connection” or “coupled”, unless the terms “direct” or “immediate” are used, a connection or coupling may include an indirect connection or coupling through one or more other components located between two elements.

[0032] Although the terms "first," "second," etc., are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from other components. Therefore, the first component referred to below may be the second component in the technical concept of this disclosure.

[0033] Throughout the specification, similar reference numerals generally denote similar elements.

[0034] For ease of description, the dimensions and thickness of each component shown in the accompanying drawings are illustrated, and this disclosure is not limited to the dimensions and thickness of the components shown.

[0035] Features of various embodiments of this disclosure may be partially or completely adhered to or combined with each other and may be interlocked and operated in technically different ways, and the embodiments may be performed independently of each other or in relation to each other.

[0036] The present disclosure will be described in detail below with reference to the accompanying drawings.

[0037] The display device according to the exemplary embodiments of this disclosure is a display device capable of displaying images even in a bent or extended state, and may also be referred to as a stretchable display device, a flexible display device, and an extendable display device. Compared to general display devices of the prior art, this display device can not only have high flexibility but also stretchability. Therefore, the user can bend or extend the display device, and the shape of the display device can be freely changed according to the user's manipulation. For example, when the user pulls the display device by holding its end, the display device can extend in the direction of the user's pull. Alternatively, when the user places the display device on a non-flat outer surface, the display device can be configured to bend according to the shape of the outer surface of the wall. Furthermore, when the force applied by the user is removed, the display device can return to its original shape.

[0038] Will refer to together Figures 1 to 4 This describes a display device according to an exemplary embodiment of the present invention.

[0039] Figure 1 This is an exploded perspective view schematically illustrating a display device according to an exemplary embodiment of the present disclosure. Figure 2 It is shown that it includes Figure 1 A plan view of an example of a display panel, a first resin film, and a second resin film in a display device. Figure 3 It is shown Figure 2 An enlarged plan view of part A of the example. Figure 4 It shows along Figure 3 A cross-sectional view of an example taken from line III-III'.

[0040] First, refer to Figure 1 The display device 1000 disclosed herein may include a board assembly Pass'y, a first resin film RF1, a display panel 100, a second resin film RF2, a touch panel 200, a third resin film RF3, and a functional layer 300. (See also...) Figure 2A display panel 100 according to an exemplary embodiment of this disclosure may include a pattern layer 120, a plurality of pixels PX, a gate driver GD, a data driver DD, and a power supply PS. In one exemplary embodiment, referring to... Figure 4 The display panel 100 may also include a filling layer 190.

[0041] The display device 1000 may be stretchable along either a first direction X or a second direction Y different from the first direction X, or it may be stretchable in two dimensions along the first direction X and the second direction Y. Furthermore, the display device 1000 may also be stretchable in three dimensions along the first direction X, the second direction Y, and the third direction Z.

[0042] For ease of description, in the following text, a first length direction (e.g., a horizontal direction) on the plane will be referred to as the first direction X, and a second length direction (e.g., a vertical direction) on the plane will be referred to as the second direction Y. For example, the plane defined by the first direction X and the second direction Y may be parallel to the plane of the display device 1000, and the second direction Y may be perpendicular to the first direction X. Furthermore, the normal direction of the plane defined by the first direction X and the second direction Y, such as the thickness direction of the display device 1000, may be defined as the third direction Z.

[0043] The plate assembly Pass'y is disposed at the bottom of the display device 1000 to support and protect the components disposed above the plate assembly Pass'y. In addition, the plate assembly Pass'y supports the display panel 100, which has bending or stretching properties, and the first resin film RF1 to suppress sagging.

[0044] The plate assembly Pass'y can be used as a base material to be coated with a first resin film RF1 during the manufacturing process of the display device 1000. Specifically, after the resin composition is coated onto the plate assembly Pass'y, the display panel 100 is bonded and cured to form the first resin film RF1. Therefore, the plate assembly Pass'y can be bonded to the bottom of the display panel 100 through the first resin film RF1.

[0045] A first resin film RF1 is disposed on the board assembly Pass'y. The first resin film RF1 is disposed between the board assembly Pass'y and the display panel 100 to contact each of the board assembly Pass'y and the display panel 100. That is, the first resin film RF1 can be used as an adhesive layer to bond the board assembly Pass'y and the display panel 100.

[0046] The first resin film RF1 can be a substrate that supports and protects the components that make up the display panel 100. For example, the first resin film RF1 can be a substrate that supports the pattern layer 120, on which pixels PX, gate drivers GD, and power supplies PS, which are components of the display panel 100, are formed. Therefore, the first resin film RF1 can be referred to as the lower substrate.

[0047] The first resin film RF1 is a flexible film and can be reversibly stretchable and shrinkable. The first resin film RF1 may include a bendable or stretchable insulating material. The materials configured for the first resin film RF1 will be described below.

[0048] The first resin film RF1 may include an active region AA (or display region) and a non-active region NA (or non-display region) other than the active region. For example, the non-active region NA may surround the active region AA.

[0049] Multiple pixels (PX) can be set on the active area AA, and each pixel PX includes display elements and circuit elements.

[0050] In addition, on the non-active region NA, gate drivers GD and power supplies PS can be set to drive the multiple pixels PX set in the active region AA.

[0051] The pattern layer 120 can be disposed on the first resin film RF1.

[0052] In one exemplary embodiment, the pattern layer 120 may include a plurality of first plate patterns 121 and a plurality of first line patterns 122 disposed in the active region AA, and a plurality of second plate patterns 123 and a plurality of second line patterns 124 disposed in the non-active region NA.

[0053] Multiple first plate patterns 121 can be disposed in the active region AA of the first resin film RF1, and multiple pixels PX can be formed on the multiple first plate patterns 121. Multiple second plate patterns 123 can be disposed in the non-active region NA of the first resin film RF1, and gate driver GD and power supply PS can be formed on the multiple second plate patterns 123.

[0054] Furthermore, despite Figure 2 In the process, the multiple first plate patterns 121 and the multiple second plate patterns 123 have quadrilateral shapes, but the shapes of the multiple first plate patterns 121 and the multiple second plate patterns 123 are not limited to this, and can be varied in various forms.

[0055] Reference Figure 2 The pattern layer 120 may also include a plurality of first line patterns 122 disposed in the active region AA and a plurality of second line patterns 124 disposed in the non-active region NA.

[0056] Multiple first line patterns 122 can be patterns that are set in the active region AA and connect adjacent first plate patterns 121, and can be referred to as first connection patterns.

[0057] The multiple second line patterns 124 can be patterns that are disposed in the non-active region NA and connect the first plate pattern 121 and the second plate pattern 123 that are adjacent to each other, or patterns that connect multiple second plate patterns 123 that are adjacent to each other.

[0058] Reference Figure 2 The plurality of first line patterns 122 and second line patterns 124 may have a wavy shape (e.g., a sine wave shape), but are not limited thereto. The plurality of first line patterns 122 and second line patterns 124 may extend in a zigzag shape or have various shapes, such as a plurality of rhomboid substrates connected at their vertices to extend.

[0059] In one exemplary embodiment, the plurality of first plate patterns 121, the plurality of first line patterns 122, the plurality of second plate patterns 123, and the plurality of second line patterns 124 may be rigid patterns. That is, the plurality of first plate patterns 121, the plurality of first line patterns 122, the plurality of second plate patterns 123, and the plurality of second line patterns 124 may be more rigid than the first resin film RF1 and the second resin film RF2 described below. Therefore, the elastic modulus and hardness of the plurality of first plate patterns 121, the plurality of first line patterns 122, the plurality of second plate patterns 123, and the plurality of second line patterns 124 may be higher than the elastic modulus and hardness of the first resin film RF1 and the second resin film RF2. The elastic modulus of the plurality of first plate patterns 121, the plurality of first line patterns 122, the plurality of second plate patterns 123, and the plurality of second line patterns 124 may be 1000 times higher than the elastic modulus of the first resin film RF1 and the second resin film RF2, but is not limited thereto.

[0060] The plurality of first plate patterns 121, the plurality of first line patterns 122, the plurality of second plate patterns 123 and the plurality of second line patterns 124, which are multiple rigid substrates, can be formed of a plastic material that is less flexible than the first resin film RF1 and the second resin film RF2 described below.

[0061] A gate driver GD can supply gate signals to multiple pixels PX disposed in an active region AA. The gate driver GD can include multiple stages formed on multiple second board patterns 123, and each stage of the gate driver GD can be electrically connected to each other by means of multiple gate interconnect lines. Therefore, a gate signal output from any stage can be transmitted to another stage. Each stage can sequentially supply gate signals to multiple pixels PX connected to each stage.

[0062] The power supply PS is connected to the gate driver GD to supply the gate drive voltage and the gate clock voltage. Additionally, the power supply PS is connected to multiple pixels PX to supply the pixel drive voltage to each of the multiple pixels PX.

[0063] A printed circuit board (PCB) includes a controller, such as an IC chip or circuit unit and / or memory or processor, to transmit signals and voltages for driving display elements from the controller to the display elements. The PCB may include stretchable and non-stretchable areas to ensure stretchability. For example, IC chips, circuit units, memory, and processors can be mounted in the non-stretchable areas, while wiring electrically connected to the IC chips, circuit units, memory, and processors can be provided in the stretchable areas.

[0064] The data driver DD can supply data voltage to multiple pixels PX located in the active area AA. The data driver DD can be mounted in the non-stretchable area of ​​a printed circuit board (PCB).

[0065] Reference Figure 2 and Figure 3 Multiple first plate patterns 121 can be disposed on the active region AA of the first resin film RF1. The multiple first plate patterns 121 are spaced apart from each other to be disposed on the first resin film RF1. For example, as... Figure 2 As shown, a plurality of first plate patterns 121 may be arranged in a matrix on the first resin film RF1, but are not limited thereto.

[0066] Reference Figure 3 and Figure 4 A pixel PX comprising multiple sub-pixels SPX can be disposed in the first plate pattern 121. Each of the sub-pixels SPX may include an LED 170 as a display element, as well as a driving transistor 160 and a switching transistor 150 for driving the LED 170. However, in the sub-pixel SPX, the display element is not limited to LEDs and may also be changed to an organic light-emitting diode.

[0067] Multiple subpixel SPXs can include red subpixels, green subpixels, and blue subpixels, but are not limited to these, and the colors of multiple subpixel SPXs can be modified to various colors as needed.

[0068] Multiple subpixels SPX can be connected to multiple connection lines 181 and 182 (which are sometimes referred to as first connection line 181 and second connection line 182).

[0069] In the following text, reference will be made to Figure 4 The cross-sectional structure of the display panel 100 in the active region AA is described in more detail.

[0070] Reference Figure 4Multiple inorganic insulating layers may be disposed on multiple first board patterns 121. For example, the multiple inorganic insulating layers may include a buffer layer 141, a gate insulating layer 142, a first interlayer insulating layer 143, a second interlayer insulating layer 144, and a passivation layer 145. However, exemplary embodiments of this disclosure are not limited thereto, and various inorganic insulating layers are additionally disposed on the multiple first board patterns 121. One or more of the buffer layer 141, gate insulating layer 142, first interlayer insulating layer 143, second interlayer insulating layer 144, and passivation layer 145, which are inorganic insulating layers, may be omitted.

[0071] A buffer layer 141 may be disposed on a plurality of first plate patterns 121. The buffer layer 141 comprises an insulating material and may be formed on the plurality of first plate patterns 121 to protect various components of the display panel 100 from the penetration of moisture (H2O) and oxygen (O2) from the outside of the first resin film RF1 and the plurality of first plate patterns 121. However, depending on the structure or characteristics of the display panel 100, the buffer layer 141 may be omitted.

[0072] In one exemplary embodiment, the buffer layer 141 may be formed only in the region where the first resin film RF1 overlaps with the plurality of first plate patterns 121 and the plurality of second plate patterns 123. As described above, the buffer layer 141 may be formed of an inorganic material, making it susceptible to cracking and damage during the stretching of the display panel 100. Therefore, the buffer layer 141 is not formed in the region between the plurality of first plate patterns 121 and the plurality of second plate patterns 123. Instead, the buffer layer 141 is patterned to have the shape of the plurality of first plate patterns 121 and the plurality of second plate patterns 123, so as to be formed only above the plurality of first plate patterns 121 and the plurality of second plate patterns 123. Therefore, in the display panel 100 and the display device 1000 including the display panel 100 according to the exemplary embodiments of the present disclosure, the buffer layer 141 is formed only in the region overlapping with the plurality of first plate patterns 121 and the plurality of second plate patterns 123, which are rigid patterns. Therefore, even if the display panel 100 is bent or stretched and deformed, damage to various components of the display panel 100 can be suppressed.

[0073] Reference Figure 4 A switching transistor 150, including a gate electrode 151, an active layer 152, a source electrode 153, and a drain electrode 154, and a driving transistor 160, including a gate electrode 161, an active layer 162, a source electrode (not shown in the figure), and a drain electrode 164, can be formed on a buffer layer 141.

[0074] The active layer 152 of the switching transistor 150 and the active layer 162 of the driving transistor 160 can be disposed on the buffer layer 141. For example, the active layer 152 of the switching transistor 150 and the active layer 162 of the driving transistor 160 can be formed of oxide semiconductor or amorphous silicon (a-Si), polycrystalline silicon (poly-Si) or organic semiconductor.

[0075] A gate insulating layer 142 may be disposed on the active layer 152 of the switching transistor 150 and the active layer 162 of the driving transistor 160. The gate insulating layer 142 may include an insulating material and electrically insulates the gate electrode 151 of the switching transistor 150 from the active layer 152 of the switching transistor 150 and electrically insulates the gate electrode 161 of the driving transistor 160 from the active layer 162 of the driving transistor 160.

[0076] The gate electrode 151 of the switching transistor 150 and the gate electrode 161 of the driving transistor 160 can be disposed on the gate insulating layer 142. The gate electrode 151 of the switching transistor 150 and the gate electrode 161 of the driving transistor 160 can be disposed on the gate insulating layer 142 at a distance from each other. The gate electrode 151 of the switching transistor 150 can overlap with the active layer 152 of the switching transistor 150, and the gate electrode 161 of the driving transistor 160 can overlap with the active layer 162 of the driving transistor 160.

[0077] The first interlayer insulating layer 143 may be disposed on the gate electrode 151 of the switching transistor 150 and the gate electrode 161 of the driving transistor 160. The first interlayer insulating layer 143 may include an insulating material and insulate the gate electrode 161 of the driving transistor 160 from the intermediate metal layer IM.

[0078] An intermediate metal layer IM, comprising a metallic material, can be disposed on the first interlayer insulating layer 143. The intermediate metal layer IM can overlap with the gate electrode 161 of the driving transistor 160. Therefore, a storage capacitor can be formed in the overlapping region of the intermediate metal layer IM and the gate electrode 161 of the driving transistor 160. For example, the gate electrode 161 of the driving transistor 160, the first interlayer insulating layer 143, and the intermediate metal layer IM can form a storage capacitor. However, the placement area of ​​the intermediate metal layer IM is not limited to this, and the intermediate metal layer IM can overlap with other electrodes to form a storage capacitor in various forms.

[0079] The second interlayer insulating layer 144 may be disposed on the intermediate metal layer IM. The second interlayer insulating layer 144 may include an insulating material and insulate the gate electrode 151 of the switching transistor 150 from the source electrode 153 and the drain electrode 154 of the switching transistor 150. The second interlayer insulating layer 144 may also insulate the intermediate metal layer IM from the source electrode and the drain electrode 164 of the driving transistor 160.

[0080] The source electrode 153 and drain electrode 154 of the switching transistor 150 can be disposed on the second interlayer insulating layer 144. The source electrode and drain electrode 164 of the driving transistor 160 can be disposed on the second interlayer insulating layer 144. The source electrode 153 and drain electrode 154 of the switching transistor 150 can be disposed on the same layer with a gap between them.

[0081] Despite Figure 4 In this design, the source electrode of the driving transistor 160 is omitted, but it can also be positioned on the same layer and spaced apart from the drain electrode 164. In the switching transistor 150, the source electrode 153 and drain electrode 154 can contact the active layer 152 for electrical connection. In the driving transistor 160, the source electrode and drain electrode 164 can contact the active layer 162 for electrical connection. The drain electrode 154 of the switching transistor 150 contacts the gate electrode 161 of the driving transistor 160 through a contact hole for electrical connection.

[0082] Gate pads (not shown), data pads DP and voltage pads VP can be provided on the second interlayer insulating layer 144.

[0083] Specifically, the gate pad can transmit gate signals to multiple sub-pixels (SPX). The gate pad can be connected to the first connection line 181 via contact holes. The gate signal supplied from the first connection line 181 can be transmitted from the gate pad to the gate electrode 151 of the switching transistor 150 via wiring formed on the first board pattern 121.

[0084] Reference Figure 4 The data pad DP can transmit data voltage to multiple sub-pixels SPX. The data pad DP can be connected to the second connection line 182 via contact holes. The data voltage supplied from the second connection line 182 can be transmitted from the data pad DP to the source electrode 153 of the switching transistor 150 via wiring formed on the first board pattern 121.

[0085] Reference Figure 4 The voltage pad VP can transmit a low-potential voltage to multiple sub-pixels SPX. The voltage pad VP can be connected to the first connection line 181 through a contact hole. The low-potential voltage supplied from the first connection line 181 can be transmitted from the voltage pad VP to the n-electrode 174 of the LED 170 through wiring formed on the first board pattern 121.

[0086] The gate pad and data pad DP can be formed of the same material as the source electrode 153 and the drain electrodes 154 and 164, but are not limited thereto.

[0087] Reference Figure 4A passivation layer 145 can be formed on the switching transistor 150 and the driving transistor 160. That is, the passivation layer 145 can be configured to cover the switching transistor 150 and the driving transistor 160 to protect them from the penetration of moisture and oxygen. The passivation layer 145 can be formed of inorganic materials and can be configured as a single layer or a double layer, but is not limited thereto.

[0088] The gate insulating layer 142, the first interlayer insulating layer 143, the second interlayer insulating layer 144, and the passivation layer 145 are patterned to form only in the regions overlapping with the plurality of first plate patterns 121. Similar to the buffer layer 141, the gate insulating layer 142, the first interlayer insulating layer 143, the second interlayer insulating layer 144, and the passivation layer 145 can also be formed from inorganic materials. Therefore, during the stretching process of the display panel 100 or the display device 1000, the gate insulating layer 142, the first interlayer insulating layer 143, the second interlayer insulating layer 144, and the passivation layer 145 may also be prone to cracking and damage. Therefore, the gate insulating layer 142, the first interlayer insulating layer 143, the second interlayer insulating layer 144, and the passivation layer 145 are not formed in the regions between the plurality of first plate patterns 121. However, the gate insulating layer 142, the first interlayer insulating layer 143, the second interlayer insulating layer 144 and the passivation layer 145 are patterned into a shape having a plurality of first plate patterns 121, so as to be formed only over the plurality of first plate patterns 121.

[0089] A planarization layer 146 can be formed on the passivation layer 145. The planarization layer 146 can planarize the upper parts of the switching transistor 150 and the driving transistor 160. The planarization layer 146 can be configured as a single layer or multiple layers and can be formed of an organic material.

[0090] Reference Figure 4The planarization layer 146 can be configured to cover the top and side surfaces of the buffer layer 141, gate insulating layer 142, first interlayer insulating layer 143, second interlayer insulating layer 144, and passivation layer 145 on a plurality of first board patterns 121. The planarization layer 146 can be configured to surround the buffer layer 141, gate insulating layer 142, first interlayer insulating layer 143, second interlayer insulating layer 144, and passivation layer 145 together with the plurality of first board patterns 121. Specifically, the planarization layer 146 can be configured to cover the top and side surfaces of the passivation layer 145, the side surfaces of the first interlayer insulating layer 143, the second interlayer insulating layer 144, the side surfaces of the gate insulating layer 142, the side surfaces of the buffer layer 141, and a portion of the top surfaces of the plurality of first board patterns 121. Therefore, the planarization layer 146 can supplement the steps on the side surfaces of the buffer layer 141, the gate insulating layer 142, the first interlayer insulating layer 143, the second interlayer insulating layer 144, and the passivation layer 145. In addition, the planarization layer 146 can enhance the adhesion strength of the connecting lines 181 and 182 disposed on the side surface of the planarization layer 146.

[0091] Reference Figure 4 The tilt angle of the side surface of the planarization layer 146 can be smaller than the tilt angle formed by the side surfaces of the buffer layer 141, the gate insulating layer 142, the first interlayer insulating layer 143, the second interlayer insulating layer 144, and the passivation layer 145. For example, the side surface of the planarization layer 146 can have a gentler slope than the slope formed by each of the side surfaces of the passivation layer 145, the first interlayer insulating layer 143, the second interlayer insulating layer 144, the gate insulating layer 142, and the buffer layer 141. Therefore, the connection lines 181 and 182, which are configured to contact the side surface of the planarization layer 146, are provided with a gentle slope so that the stress generated in the connection lines 181 and 182 can be reduced when the display panel 100 is stretched. Furthermore, the side surface of the planarization layer 146 has a relatively gentle slope, which can suppress cracks in the connecting lines 181 and 182 or their separation from the side surface of the planarization layer 146.

[0092] Reference Figure 3 and Figure 4 Connecting lines 181 and 182 can electrically connect to pads on multiple first board patterns 121. Connecting lines 181 and 182 can be disposed on multiple first line patterns 122. Connecting lines 181 and 182 can extend onto the multiple first board patterns 121 to electrically connect to gate pads and data pads DP on the multiple first board patterns 121. Meanwhile, the first line patterns 122 may not be disposed in the areas between the multiple first board patterns 121 where connecting lines 181 and 182 are not disposed.

[0093] The connecting lines 181 and 182 may include a first connecting line 181 and a second connecting line 182. The first connecting line 181 and the second connecting line 182 are made of metallic material and may be disposed between a plurality of first plate patterns 121.

[0094] More specifically, the first connecting line 181 may refer to the wiring in connecting lines 181 and 182 that extends in a first direction X between the plurality of first board patterns 121. The second connecting line 182 may refer to the wiring in connecting lines 181 and 182 that extends in a second direction Y between the plurality of first board patterns 121.

[0095] Meanwhile, in the case of a display panel in a general display device, various wirings such as multiple gate lines and multiple data lines extend in straight lines between multiple sub-pixels, and multiple sub-pixels are connected to a single signal line. Therefore, in the display panel of a general display device, various wirings such as gate lines, data lines, high-potential voltage lines, and reference voltage lines extend from one side of the display panel of the organic light-emitting display device to the other side without being interrupted on the substrate.

[0096] In contrast, in the case of the display panel 100 included in the exemplary embodiment of the display device 1000 according to the present disclosure, various wirings with linear shapes, such as gate lines, data lines, high-potential voltage lines, reference voltage lines, or initialization voltage lines, which are considered to be used in a general display device display panel, can be provided only on the plurality of first board patterns 121 and the plurality of second board patterns 123. That is, in the display panel 100 included in the exemplary embodiment of the display device 1000 according to the present disclosure, linear wirings can be provided only on the plurality of first board patterns 121 and the plurality of second board patterns 123.

[0097] In the display panel 100 of the display device 1000 according to an exemplary embodiment of the present disclosure, pads on two adjacent first board patterns 121 can be connected by connection lines 181 and 182. Therefore, connection lines 181 and 182 can electrically connect gate pads or data pads DP on two adjacent first board patterns 121. Thus, the display panel 100 included in the display device 1000 according to an exemplary embodiment of the present disclosure can include multiple connection lines 181 and 182 that electrically connect various wirings, such as gate lines, data lines, high-potential voltage lines, and reference voltage lines, between multiple first board patterns 121. For example, gate lines can be disposed on multiple first board patterns 121 arranged adjacent to each other along a first direction X, and gate pads can be disposed at both ends of the gate lines. In this case, multiple gate pads on multiple first board patterns 121 adjacent to each other in the first direction X can be connected to each other by the first connection line 181 serving as a gate line. Therefore, the gate lines disposed on the plurality of first plate patterns 121 and the first connecting lines 181 disposed on the first line pattern 122 can be used as a single gate line. The aforementioned gate line can be referred to as a scan signal line. Furthermore, among all the various wirings that may be included in the display panel 100, wirings extending in the first direction X, such as light-emitting signal lines, low-potential voltage lines, and high-potential voltage lines, can also be electrically connected via the first connecting line 181 as described above.

[0098] Reference Figure 3 and Figure 4 The first connection line 181 can connect to the gate pads on two adjacent first board patterns 121 arranged side-by-side in the first direction X. The first connection line 181 can be used as a gate line, a light-emitting signal line, a high-potential voltage line, or a low-potential voltage line, but is not limited thereto. The gate pads on the multiple first board patterns 121 arranged in the first direction X can be connected by the first connection line 181, which serves as a gate line, and a gate signal can be transmitted.

[0099] Reference Figure 3 and Figure 4 The second connection line 182 can connect to the data pads DP on two adjacent first board patterns 121 arranged side-by-side in the second direction Y. The second connection line 182 can be used as a data line, a high-potential voltage line, a low-potential voltage line, or a reference voltage line, but is not limited thereto. Internal lines on the multiple first board patterns 121 arranged in the second direction Y can be connected by multiple second connection lines 182 used as data lines, and a data voltage can be transmitted.

[0100] At the same time, refer to Figure 4A dam 147 can be formed on the connecting pads CNT, connecting lines 181 and 182, and planarization layer 146. The dam 147 may include insulating material and divide adjacent sub-pixels SPX. The dam 147 can be configured to cover at least a portion of the connecting lines 181 and 182 and planarization layer 146. Although in Figure 4 The diagram shows that the height of the embankment 147 is lower than the height of the LED 170, but this disclosure is not limited thereto, and the height of the embankment 147 may be equal to the height of the LED 170.

[0101] Reference Figure 4 The LED 170 can be disposed on the connection pad CNT and the first connection line 181. The LED 170 may include an n-type layer 171, an active layer 172, a p-type layer 173, an n-electrode 174, and a p-electrode 175. The LED 170 of the display panel 100 according to an exemplary embodiment of the present disclosure may have a flip-chip structure, wherein the n-electrode 174 and the p-electrode 175 are formed on one surface, but is not limited thereto.

[0102] The n-type layer 171 can be formed by implanting n-type impurities into gallium nitride (GaN) with excellent crystallinity. The n-type layer 171 can be disposed on a separate substrate formed of a light-emitting material.

[0103] An active layer 172 may be disposed on an n-type layer 171. The active layer 172 is a light-emitting layer that emits light in the LED 170 and may be formed of a nitride semiconductor such as indium gallium nitride (InGaN). A p-type layer 173 may be disposed on the active layer 172. The p-type layer 173 may be formed by implanting p-type impurities into gallium nitride (GaN).

[0104] As described above, an LED 170 according to an exemplary embodiment of this disclosure can be manufactured by sequentially laminating an n-type layer 171, an active layer 172, and a p-type layer 173, and then etching predetermined portions to form n-electrodes 174 and p-electrodes 175. In this case, predetermined portions serving as spaces for separating the n-electrodes 174 and p-electrodes 175 from each other can be etched to expose a portion of the n-type layer 171. In other words, the surface of the LED 170 on which the n-electrodes 174 and p-electrodes 175 are disposed is not a flat surface, but can have different heights.

[0105] As described above, the n-electrode 174 can be disposed in the etched area and can be formed of a conductive material. The p-electrode 175 can be disposed in the unetched area and can also be formed of a conductive material. For example, the n-electrode 174 can be disposed on the n-type layer 171 exposed by the etching process, and the p-electrode 175 can be disposed on the p-type layer 173. The p-electrode 175 can be formed of the same material as the n-electrode 174.

[0106] A conductive adhesive layer AD is disposed on the top surface of the connecting pad CNT and the first connecting line 181, and between the connecting pad CNT and the first connecting line 181, so that the LED 170 can be adhered to the connecting pad CNT and the first connecting line 181. At this time, the n electrode 174 can be disposed on the first connecting line 181, and the p electrode 175 can be disposed on the connecting pad CNT.

[0107] The conductive adhesive layer AD can be an adhesive layer in which conductive spheres are dispersed in an insulating substrate to have conductivity. When heat or pressure is applied to the conductive adhesive layer AD, the conductive spheres are electrically connected in the portions where heat or pressure is applied to have conductivity, and the unpressurized areas can have insulating properties. For example, the n-electrode 174 can be electrically connected to the first connection line 181 by means of the conductive adhesive layer AD, and the p-electrode 175 can be electrically connected to the connection pad CNT by means of the conductive adhesive layer AD. After the conductive adhesive layer AD is applied to the top surfaces of the connection pad CNT and the first connection line 181 by an inkjet method, the LED 170 is transferred onto the conductive adhesive layer AD and is pressurized and heated. In this way, the connection pad CNT can be electrically connected to the p-electrode 175, and the first connection line 181 can be electrically connected to the n-electrode 174. However, other portions of the conductive adhesive layer AD, excluding the portion disposed between the n-electrode 174 and the first connection line 181, and the portion disposed between the p-electrode 175 and the connection pad CNT, can have insulating properties. Meanwhile, the conductive adhesive layer AD can be segmented to be disposed on the connection pad CNT and the first connection line 181, respectively.

[0108] The connection pad CNT is electrically connected to the drain electrode 164 of the driver transistor 160 to be applied with a drive voltage from the driver transistor 160 to drive the LED 170. Although in Figure 4The diagram shows that the connection pad CNT and the drain electrode 164 of the driving transistor 160 are not in direct contact but indirect contact, but this disclosure is not limited to this. Therefore, the connection pad CNT and the drain electrode 164 of the driving transistor 160 can be in direct contact with each other. Furthermore, a low-potential driving voltage can be applied to the first connection line 181 to drive the LED 170. Therefore, when the display panel 100 is turned on, different voltage levels applied to the connection pad CNT and the first connection line 181 are transmitted to the n electrode 174 and the p electrode 175, causing the LED 170 to emit light.

[0109] The second resin film RF2 supports various components disposed below it. The second resin film RF2 can be a substrate that covers and protects the various components of the display panel 100. For example, the second resin film RF2 can be a substrate that covers the pixels PX, gate drivers GD, and power supplies PS, which are components of the display panel 100. Therefore, the second resin film RF2 can be referred to as the upper substrate.

[0110] The second resin film RF2 is disposed between the display panel 100 and the touch panel 200 to bond the display panel 100 and the touch panel 200. Specifically, the second resin film RF2 is formed by coating the display panel 100 with a material in which the second resin film RF2 is disposed, bonding it to the touch panel 200, and then curing it. Therefore, the second resin film RF2 can be configured to directly contact the display panel 100 and the touch panel 200, respectively.

[0111] The second resin film RF2 can be formed from the same material as the first resin film RF1. Therefore, the second resin film RF2 can include a bendable or stretchable insulating material and is a reversibly stretchable or shrinkable flexible film. The materials used to configure the second resin film RF2 will be described below.

[0112] although Figure 4 Although not shown, a polarizing layer can be provided on the second resin film RF2. The polarizing layer can be used to polarize light incident from outside the display panel 100 to reduce external light reflection. In addition, optical films other than the polarizing layer can be provided on the second resin film RF2.

[0113] Furthermore, a filler layer 190 can be provided on the entire first resin film RF1 to fill the space between components disposed on the second resin film RF2 and the first resin film RF1. The filler layer 190 can be configured with a curable adhesive. Specifically, the material configuring the filler layer 190 is applied to the entire surface of the first resin film RF1 and then cured, such that the filler layer 190 can be disposed between components disposed on the second resin film RF2 and the first resin film RF1. For example, the filler layer 190 can be an optically clear adhesive (OCA) and can be configured with acrylic adhesives, silicone adhesives, and polyurethane adhesives. According to an exemplary embodiment, the filler layer 190 can be omitted, and the material configuring the second resin film RF2 is applied to the entire surface of the first resin film RF1 and then bonded and cured to the touch panel 200 to bond the display panel 100 and the touch panel 200.

[0114] The touch panel 200 may include a material that responds to stretching of the display device 1000. The touch panel 200 is disposed above the display panel 100 and may have a shape corresponding to the display panel 100, for example, a shape corresponding to the first resin film RF1 that supports the display panel 100.

[0115] For example, the touch panel 200 may include: a substrate (or a touch substrate), a plurality of touch sensing films disposed on the substrate, a plurality of touch lines disposed in different directions on the substrate and the plurality of touch sensing films, a plurality of wirings, and a plurality of connecting lines. The plurality of wirings are connected to the plurality of touch lines to transmit touch signals detected by the plurality of touch lines, and the plurality of connecting lines are connected to the plurality of wirings and touch circuit units.

[0116] The substrate can support multiple touch sensing films, multiple touch lines, multiple wirings, and multiple connecting lines. The substrate is a flexible substrate and is reversibly stretchable and shrinkable.

[0117] Multiple touch-sensing films can be disposed on the active region AA of a substrate, spaced apart from each other at a predetermined distance. In one exemplary embodiment, the size of each of the multiple touch-sensing films can correspond to a previously referenced dimension. Figure 2 The dimensions of each of the plurality of first plate patterns 121 disposed on the display panel 100 are described. In one exemplary embodiment, the plurality of touch-sensing films may include touch-sensing materials. For example, the plurality of touch-sensing films may include a touch base film formed of a flexible or stretchable insulating material and touch-sensing materials dispersed in the touch base film in particulate form, but are not limited thereto.

[0118] Multiple touch lines for detecting touch can be positioned above and below the touch sensing membrane.

[0119] The multiple touch lines may include: multiple first touch lines disposed on an active region AA of a substrate in a first direction X, and multiple second touch lines disposed in a second direction Y to intersect the multiple first touch lines, with a touch sensing film located therebetween. The intersection area of ​​the multiple first touch lines and the multiple second touch lines is defined as a touch sensing area, and the multiple touch sensing films may be configured to overlap with the touch sensing area. Therefore, the touch panel 200 can use the resistance change of the touch sensing films relative to the touch input to sense touch coordinates and touch input.

[0120] Multiple touch lines can have a straight shape in an area that overlaps with multiple touch sensing films (e.g., a touch sensing area) and a curved shape in another area.

[0121] As described above, in an exemplary embodiment of the display device 1000 according to this disclosure, a plurality of touch sensing films of the touch panel 200 are disposed spaced apart from each other on a base substrate, which is a flexible substrate, and are disposed in the region overlapping with the first plate pattern 121 of the display panel 100. Thus, when the display panel 100 is stretched in two directions, the touch panel 200 can also be stretched in two directions.

[0122] Multiple wirings can be disposed on the non-active region NA of the substrate and can be connected to multiple touch lines disposed in the active region AA. Therefore, touch signals detected by multiple touch lines can be transmitted to multiple wirings.

[0123] Multiple wirings can have curved shapes to ensure the stretchability of the touch panel 200.

[0124] Multiple link lines can electrically connect multiple wirings to the touch circuit unit. Therefore, touch signals detected by multiple touch lines and intended for transmission to multiple wirings can be transmitted to the touch circuit unit via multiple link lines. Thus, the touch circuit unit can detect touch inputs from external sources (e.g., user touches).

[0125] A third resin film RF3 can be disposed above the touch panel 200. The third resin film RF3 covers various components of the display panel 100 and the touch panel 200, and protects the display panel 100 and the touch panel 200 from external impacts or moisture. Therefore, the third resin film RF3 can be referred to as a cover component.

[0126] The third resin film RF3 can be formed from the same material as the first resin film RF1 and the second resin film RF2. Therefore, the third resin film RF3 can include a bendable or stretchable insulating material and is a reversibly stretchable or shrinkable flexible film. The materials configured for the third resin film RF3 will be described below.

[0127] A functional layer 300 may be formed over the third resin film RF3. For example, the functional layer 300 may include at least one layer selected from an anti-fingerprint layer, an anti-reflective layer, and an anti-fouling layer. The functional layer 300 may be coated on the top surface of the third resin film RF3 and may improve the surface quality and display quality of the display device 1000.

[0128] A third resin film RF3 is disposed between the functional layer 300 and the touch panel 200 to bond the functional layer 300 and the touch panel 200. Therefore, the third resin film RF3 is configured to directly contact the functional layer 300 and the touch panel 200. That is, the third resin film RF3 can bond the functional layer 300 and the touch panel 200, and can also serve as a cover member.

[0129] In one exemplary embodiment, the display device 1000 includes a first resin film RF1 serving as a lower substrate and a second resin film RF2 serving as an upper substrate, and a third resin film RF3 serving as a cover member.

[0130] The first resin film RF1, the second resin film RF2, and the third resin film RF3 can be stretch films and include flexible or stretchable insulating materials. Therefore, the first resin film RF1, the second resin film RF2, and the third resin film RF3 can have flexible properties and can be reversibly stretchable and shrinkable.

[0131] The elastic modulus of each of the first resin film RF1, the second resin film RF2, and the third resin film RF3 may be 7 MPa or lower. According to an exemplary embodiment, the ductile fracture rate of each of the first resin film RF1, the second resin film RF2, and the third resin film RF3 may be 400% or higher. Here, the ductile fracture rate refers to the elongation at which a stretched object breaks or cracks. Specifically, for example, the elastic modulus of each of the first resin film RF1, the second resin film RF2, and the third resin film RF3 may be 3.7 MPa, and the ductile fracture rate may be 800%. According to another exemplary embodiment, the elastic modulus of each of the first resin film RF1, the second resin film RF2, and the third resin film RF3 may be 4.4 MPa, and the ductile fracture rate may be 550%.

[0132] The first resin film RF1, the second resin film RF2, and the third resin film RF3 can be formed from the same material. Each of the first resin film RF1, the second resin film RF2, and the third resin film RF3 can be a flexible film comprising polyurethane acrylate and two types of photoinitiators. Specifically, each of the first resin film RF1, the second resin film RF2, and the third resin film RF3 can be formed by coating a resin composition comprising polyurethane acrylate and two types of photoinitiators and then curing it. If desired, the resin composition may optionally include additives, such as dyes or pigments.

[0133] Polyurethane acrylates refer to compounds comprising both polyurethane bonds and acrylates. In exemplary embodiments, polyurethane acrylates may be acrylate-modified polyurethanes or polyurethanes with both ends capped with acrylates. For example, polyurethane acrylates may be compounds represented by the following formula, but are not limited thereto. For example, compounds of the following formula can be obtained by synthesizing dicarboxylic acids or polycarboxylic acids and diisocyanates from hydroxyalkyl acrylates, but are not limited thereto.

[0134]

[0135] In the formula, acryl can be an acrylate functional group, and n can be an integer of 1 or greater.

[0136] The two types of photoinitiators can be photoinitiators with different absorption wavelengths. For example, the photoinitiator may include a first photoinitiator with an absorption wavelength of 400 nm or higher and a second photoinitiator with an absorption wavelength of 370 nm or lower. Therefore, each of the first resin film RF1, the second resin film RF2, and the third resin film RF3 achieves adhesion by initial curing of a resin composition comprising two types of photoinitiators with different absorption wavelengths, and can be formed by secondary curing through complete curing. Thus, each of the first resin film RF1, the second resin film RF2, and the third resin film RF3 can serve as a substrate supporting or covering some components and as a layer above and / or below the bonding resin film.

[0137] In the following text, reference will be made to Figures 5A to 5J A method for manufacturing a display device according to an exemplary embodiment of the present disclosure is described. Figures 5A to 5J This is a cross-sectional view illustrating a method for manufacturing a display device according to an exemplary embodiment of the present disclosure.

[0138] Reference Figure 5AThe display device 1000 can be formed by laser lift-off. Next, a display panel 100 including a pattern layer 120 is formed on a carrier substrate CG1. The display panel 100 including the pattern layer 120 can be formed by methods known in the art. A sacrificial layer can be formed on one surface of the carrier substrate CG on which the pattern layer 120 is formed to facilitate laser lift-off.

[0139] Reference Figure 5B A touch panel 200 is formed on a carrier substrate CG2, and the carrier substrate CG2 is separated by laser lift-off process to manufacture the touch panel 200.

[0140] Reference Figure 5C A resin composition comprising polyurethane acrylate and two types of photoinitiators is coated and initially cured on the display panel 100 to form a semi-cured second resin film RF2'. The resin composition may be coated over the entire surface of the display panel 100 or may be applied spirally. After coating the resin composition, UV irradiation is used to initially cure the resin composition to form the semi-cured second resin film RF2'. In this step, UV irradiation with a first energy is used to cure the resin composition. For example, the intensity of the irradiated UV may be 1000 mW / cm². 2 Furthermore, the UV light dose can be 5000 mJ / cm². 2 However, it is not limited to this. When irradiated with UV light of the first energy, the first photoinitiator of the resin composition is activated to carry out the curing reaction.

[0141] Reference Figure 5D The touch panel 200 is disposed on a semi-cured second resin film RF2' and undergoes secondary curing to form the second resin film RF2. The semi-cured second resin film RF2' has adhesive properties to bond the touch panel 200 to the display panel 100. For the secondary curing, UV light with a second energy higher than the first energy can be irradiated. For example, the intensity of the UV light irradiated in the secondary curing step can be 1000 mW / cm². 2 Furthermore, the UV light dose can be 10000 mJ / cm². 2 However, it is not limited to this. When irradiated with UV light of a second energy, the second photoinitiator of the semi-cured second resin film RF2' is activated to carry out a curing reaction. In this step, UV light of a second energy higher than that in the initial curing step is irradiated to form a fully cured second resin film RF2.

[0142] Reference Figure 5E A functional layer 300 is formed on the carrier substrate CG3. The functional layer 300 is coated on the entire surface of the carrier substrate CG3.

[0143] Reference Figure 5F The carrier substrate CG3 is separated from the functional layer 300. The carrier substrate CG3 can be separated from the functional layer 300 by laser lift-off. After separating the carrier substrate CG3, a resin composition is coated onto the functional layer 300 and initially cured to form a semi-cured third resin film RF3'. The resin composition may include components already pre-formed with... Figure 5C The resin composition is made of the same material as the resin composition described herein. The resin composition can be coated onto the entire surface of the functional layer 300, or it can be applied spirally. After coating the resin composition, UV irradiation is performed to initially cure the resin composition. In this step, UV irradiation with a first energy is performed to cure the resin composition. For example, the intensity of the irradiated UV can be 1000 mW / cm². 2 Furthermore, the UV light dose can be 5000 mJ / cm². 2 However, it is not limited to this. When irradiated with UV light of the first energy, the first photoinitiator of the resin composition is activated to carry out a curing reaction. Thus, a semi-cured third resin film RF3' can be formed.

[0144] Next, refer to Figure 5G ,according to Figure 5D In the process shown, a semi-cured third resin film RF3' is disposed on the display panel 200, opposite to the touch panel 200. The semi-cured third resin film RF3' has adhesive properties to bond the functional layer 300 to the touch panel 200. The semi-cured third resin film RF3' is irradiated with UV light for secondary curing, thereby forming a fully cured third resin film RF3. The secondary curing can be performed by irradiating with UV light of a second energy higher than the first energy. For example, the intensity of the UV light irradiated in the secondary curing step can be 1000 mW / cm². 2 Furthermore, the UV light dose can be 10000 mJ / cm². 2 However, it is not limited to this. When irradiated with UV light of a second energy, the second photoinitiator of the semi-cured third resin film RF3' is activated to carry out a curing reaction. In this step, UV light of a second energy higher than that in the initial curing step is irradiated to form a fully cured third resin film RF3.

[0145] Reference Figure 5H ,according to Figure 5G The previous processing separates the carrier substrate CG1 from the device. The carrier substrate CG1 can be separated from the display panel 100 by laser peeling.

[0146] Next, refer to Figure 5I The process involves preparing a panel assembly Pass'y by coating a resin composition onto the panel assembly Pass'y and subjecting it to initial curing to form a semi-coated first resin film RF1'. The resin composition may include components already prepared with... Figure 5CThe resin composition is made of the same material as the resin composition described herein. The resin composition can be coated onto the entire surface of the plate assembly Pass'y, or it can be applied spirally. After coating the resin composition, UV irradiation is used to initially cure the resin composition to form a semi-cured first resin film RF1'. In this step, UV irradiation with a first energy is used to cure the resin composition. For example, the intensity of the irradiated UV can be 1000 mW / cm². 2 Furthermore, the UV light dose can be 5000 mJ / cm². 2 However, it is not limited to this. When irradiated with UV light of the first energy, the first photoinitiator of the resin composition is activated to carry out the curing reaction.

[0147] Reference Figure 5J , Figure 5H The display panel 100 is disposed on a semi-cured first resin film RF1', such that it is opposite to the display panel 100. The semi-cured first resin film RF1' has adhesive properties to bond the display panel 100 and the board assembly Pass'y. The semi-cured first resin film RF1' is further cured to form the first resin film RF1. For the secondary curing, UV light with a second energy higher than the first energy can be irradiated. For example, the intensity of the UV light irradiated in the secondary curing step is 1000 mW / cm². 2 Furthermore, the UV light dose can be 10000 mJ / cm². 2 However, this is not the only possibility. When irradiated with UV light of a second energy, the second photoinitiator of the semi-cured first resin film RF1' is activated to carry out a curing reaction. In this step, UV light of a second energy higher than that in the initial curing step is irradiated to form a fully cured first resin film RF1. By doing so, a display device 1000 according to an exemplary embodiment of this disclosure is manufactured.

[0148] Figures 5A to 5J The manufacturing process of the display device shown is an example, but is not limited to it. For example, in Figure 5D After the processing shown, the process can be performed by forming a semi-cured third resin film RF3' on the touch panel 200 and coating the functional layer 300 on top of it, followed by a second curing.

[0149] The first resin film RF1, the second resin film RF2, and the third resin film RF3 may have the same or different elastic moduli and thicknesses. The elastic modulus of each of the first resin film RF1, the second resin film RF2, and the third resin film RF3 can be controlled by changing the content of the initiator in the resin composition, the intensity of the UV irradiation on the resin composition, and the dose of UV light.

[0150] In an exemplary embodiment, the elastic modulus of each of the first resin film RF1, the second resin film RF2, and the third resin film RF3 may be from 3 MPa to 5 MPa.

[0151] In an exemplary embodiment, the thickness of the first resin film RF1 can be from 100 μm to 800 μm, the thickness of the second resin film RF2 can be from 50 μm to 500 μm, and the thickness of the third resin film RF3 can be from 50 μm to 500 μm.

[0152] The display device 1000 includes a first resin film RF1, a second resin film RF2, and a third resin film RF3 formed of the same material, serving as a lower substrate, an upper substrate, and a cover member. As described above, each of the first resin film RF1, the second resin film RF2, and the third resin film RF3 has adhesive properties to bond layers disposed above and / or below the resin film. In related art display devices, each of the lower substrate, the upper substrate, and the cover member is bonded to layers disposed above and / or below each of the lower substrate, the upper substrate, and the cover member by an adhesive layer. In contrast, in the display device 1000 of this disclosure, each of the first resin film RF1, the second resin film RF2, and the third resin film RF3 serves as a substrate and has adhesive properties, thereby eliminating the need for an adhesive layer. Therefore, a display device 1000 with a simple structure and reduced thickness can be provided, and it is easy to handle.

[0153] Furthermore, when a separate adhesive layer is provided, the materials of each of the lower substrate, upper substrate, and cover member differ from the material of the adhesive layer, resulting in a mismatch in tensile properties, which causes the adhesive layer to separate in reverse during stretching. However, the display device 1000 according to an exemplary embodiment includes a first resin film RF1, a second resin film RF2, and a third resin film RF3 that simultaneously serve as a substrate material and an adhesive layer, thereby solving the problem of reverse separation caused by mismatched tensile properties in the prior art. By doing so, a display device 1000 with excellent tensile durability and reliability can be provided.

[0154] In the following text, reference will be made to Figures 6 to 8 Various exemplary embodiments of display devices including resin films are described.

[0155] Figure 6 This is a schematic cross-sectional view used to illustrate another example of a display device. Figure 7 This is a schematic cross-sectional view used to illustrate yet another example of a display device. Figure 8 This is a schematic cross-sectional view used to illustrate yet another example of a display device.

[0156] When description Figures 6 to 8 When the display device shown is compared with the reference Figures 1 to 4 and Figures 5A to 5J Components that overlap in the description have the same characteristics, therefore redundant descriptions will be omitted. Furthermore, even in... Figures 6 to 8 Not shown in the image. Figures 6 to 8 The display device may also include board assemblies and functional layers.

[0157] Reference Figure 6 According to an exemplary embodiment, the display device 2000 includes a first resin film RF1, a display panel 100, a second resin film RF2, a touch panel 200, an adhesive layer ADH, and a cover member 400. Redundant descriptions of the remaining components other than the adhesive layer ADH and the cover member 400 are omitted.

[0158] and Figures 1 to 4 and Figures 5A to 5J Compared to the display device 1000 shown, Figure 6 The display device 2000 shown does not include a third resin film, but includes a cover member 400 and an adhesive layer ADH.

[0159] A cover member 400 is disposed above the touch panel 200. The cover member 400 covers and protects the touch panel 200 and the display panel 100. The cover member 400 may include silicone rubber, such as polydimethylsiloxane (PDMS), or elastomers, such as polyurethane (PU) or polytetrafluoroethylene (PTFE).

[0160] As described above, the third resin film used as the cover member has adhesive properties, but the cover member 400 formed of polyurethane and / or silicone has high peel strength. Therefore, in order to stably bond the cover member 400 and the touch panel 200, an adhesive layer ADH can be provided between the cover member 400 and the touch panel 200. The adhesive layer ADH can be an optically clear adhesive (OCA) and can be configured from acrylic adhesives, silicone-based adhesives, and polyurethane-based adhesives.

[0161] When the cover member 400 is bonded to the touch panel 200 by means of the adhesive layer ADH as described above, the tensile properties of the cover member 400 and the adhesive layer ADH can be matched to ensure tensile durability. Therefore, the elastic modulus of the cover member 400 can be 7 MPa or lower, and its thickness can be from 50 μm to 300 μm.

[0162] Figure 7 This is a schematic cross-sectional view used to illustrate yet another example of a display device.

[0163] Reference Figure 7The display device 3000 includes a lower substrate 111, an adhesive layer ADH1, a display panel 100, a resin film RF2, a touch panel 200, an adhesive layer ADH2, and a cover member 400. The display panel 100, touch panel 200, adhesive layer ADH2, and cover member 400 of the display device 3000 are... Figures 1 to 6 The resin film RF2 of the display device 3000 is the same as that described above, and the resin film RF2 of the display device 3000 is the same as that of the second resin film RF2 already described above, so redundant descriptions will be omitted.

[0164] The lower substrate 111 is a component that supports and protects the display panel 100 below the display panel 100.

[0165] The lower substrate 111, serving as a flexible substrate, may include a bendable or stretchable insulating material. The lower substrate 111 may include a material that responds to stretching of the display device 3000. For example, the lower substrate 111 and the upper substrate 112 may be formed of silicone rubber, such as polydimethylsiloxane (PDMS), and elastomers, such as polyurethane (PU) or polytetrafluoroethylene (PTFE), respectively.

[0166] The lower substrate 111 formed from this material has a higher peel strength than the first resin film described above. Therefore, in order to bond the lower substrate 111 and the display panel 100, an adhesive layer ADH1 can be provided between the lower substrate 111 and the display panel 100. The adhesive layer ADH1 can be an optically transparent adhesive (OCA) and can be configured from acrylic adhesives, silicone adhesives, and polyurethane adhesives.

[0167] The elastic modulus of the lower substrate 111 in the display device 3000 can be 1 MPa or lower, and the thickness can be from 25 μm to 150 μm. In this case, due to the tensile characteristics of the display device 3000, the tensile durability and reliability are superior.

[0168] Figure 8 This is a schematic cross-sectional view used to illustrate yet another example of a display device.

[0169] Reference Figure 8 According to an exemplary embodiment, the display device 4000 includes a first resin film RF1, a display panel 100, an adhesive layer ADH, a touch panel 200, and a second resin film RF2. Here, the display panel 100 and the touch panel 200 are the same as those described above, so redundant descriptions will be omitted.

[0170] A first resin film RF1 is disposed below the display panel 100 to support and protect the components of the display panel 100. As described above, the first resin film RF1 can serve as a lower substrate and also has adhesive properties. Therefore, the first resin film RF1 can be configured to directly contact the lower part of the display panel 100 without an adhesive layer.

[0171] The second resin film RF2 is disposed above the touch panel 200. The second resin film RF2 supports and covers the components of the touch panel 200. In the display device 4000, the second resin film RF2 covers and protects the display panel 100 and the touch panel 200, serving as a cover member.

[0172] The second resin film RF2 has adhesive properties. Therefore, the second resin film RF2 can be configured to directly contact the upper part of the touch panel 200 without an adhesive layer.

[0173] The display device 4000 can be manufactured by placing the display panel 100 on the first resin film RF1, placing the touch panel 200 on the second resin film RF2, and then bonding the display panel 100 and the touch panel 200 to each other using an adhesive layer ADH. Therefore, the adhesive layer ADH is disposed between the touch panel 200 and the display panel 100 to bond the touch panel 200 and the display panel 100.

[0174] The materials of the first resin film RF1 and the second resin film RF2 in the display device 4000 are the same as those described above, so redundant descriptions will be omitted.

[0175] In the display device 4000, the elastic modulus of each of the first resin film RF1 and the second resin film RF2 may be 7 MPa or lower, and the thickness may be from 50 μm to 800 μm.

[0176] As described above, according to exemplary embodiments of this disclosure, the display device includes a flexible resin film in at least one of the following locations: below the display panel, between the display panel and the touch panel, and above the touch panel. The resin film may comprise polyurethane acrylate and two types of photoinitiators with different absorption wavelengths. Such a resin film serves as a substrate supporting and protecting components disposed above and / or below the resin film, and has adhesive properties. Therefore, when the resin film is provided, the adhesive layer for bonding components disposed above and / or below the resin film is omitted, thereby simplifying the structure and manufacturing process of the display device.

[0177] Furthermore, in related technologies, adhesive layers are used to bond the lower substrate, upper substrate, and / or cover member. However, a problem arises in this case where the materials configuring the lower substrate, upper substrate, cover member, and adhesive layer have physical properties different from the desired physical properties, necessitating the matching of tensile characteristics. Additionally, when a substrate formed of a silicon-based elastic material and a silicon-based adhesive layer are bonded, the adhesive strength between them is excellent, but the peel strength of the silicon-based adhesive layer is high, resulting in poor adhesion between the silicon-based adhesive layer and the display panel. This makes it difficult to manufacture the display panel and may lead to interface separation. Simultaneously, when an acrylic adhesive layer is bonded to a substrate formed of a silicon-based elastic material, the surface energy difference between the two materials is so large due to their material properties that it can cause interface separation or Z-axis deformation of the wiring in the panel configuration.

[0178] In contrast, the resin film serves as the substrate and possesses adhesive properties, eliminating the need for a bonding adhesive layer. Furthermore, compared to substrates bonded with adhesive layers, the resin film exhibits superior tensile properties, tensile durability, and reliability. Moreover, the omission of the adhesive layer reduces the thickness of the display device, thereby reducing tensile stress and enabling a highly stretchable display device.

[0179] In the following description, the effects of the present disclosure described above will be explained with reference to exemplary embodiments. However, the scope of the present disclosure is not limited thereto, although the following exemplary embodiments are set forth to illustrate the present disclosure.

[0180] [Exemplary Implementation Method 1]

[0181] A sample with the following structure was prepared, wherein a first resin film having an elastic modulus of 3.7 MPa and a thickness of 100 μm to 800 μm, an LED display panel, a second resin film having an elastic modulus of 3.7 MPa and a thickness of 50 μm to 500 μm, a touch panel, and a third resin film having an elastic modulus of 3.7 MPa and a thickness of 50 μm to 500 μm were sequentially laminated.

[0182] At this point, each of the first resin film, the second resin film, and the third resin film is manufactured by the following steps: initial curing of a composition comprising polyurethane acrylate, a first photoinitiator having an absorption wavelength of 405 nm, and a second photoinitiator having an absorption wavelength of 365 nm (UV intensity 1000 mW / cm²). 2 And the UV light dose is 5000 mJ / cm 2 The composition is then subjected to a second curing process (UV intensity 1000mW / cm). 2 And the UV light dose is 10000 mJ / cm 2 ).

[0183] [Exemplary Implementation Method 2]

[0184] Except that the elastic modulus of each of the first, second, and third resin films is changed to 4.4 MPa, a specimen with the same structure as in Exemplary Embodiment 1 is manufactured by the same method.

[0185] [Comparative Implementation Method 1]

[0186] A sample with the following structure is manufactured, comprising a lower substrate formed of PDMS having an elastic modulus of 0.8 MPa and a thickness of 300 μm to 350 μm, and an acrylic adhesive layer (4 × 10⁻⁶) having a thickness of 75 μm to 150 μm. 4 Pa / Creep 127), LED display panel, acrylic adhesive layer with a thickness of 100μm (4×10 4 Pa / Creep 127), an upper substrate formed of PDMS with an elastic modulus of 0.8 MPa and a thickness of 300 μm to 350 μm, and an acrylic adhesive layer (4 × 10) with a thickness of 100 μm. 4 Pa / Creep 127), touch panel, acrylic adhesive layer with a thickness of 100μm (4×10 4 A polyurethane or silicone cover film with an elastic modulus of 0.8 MPa and a thickness of 300 μm (Pa / Creep 127) and a polyurethane or silicone cover film having an elastic modulus of 0.8 MPa and a thickness of 300 μm is sequentially laminated.

[0187] [Comparative Implementation Method 2]

[0188] A sample with the following structure was fabricated, comprising a lower substrate formed of PDMS with an elastic modulus of 0.8 MPa and a thickness of 300 μm to 350 μm, and a silicon-based adhesive layer (4.5 × 10⁻⁶) with a thickness of 75 μm to 150 μm. 4 Pa / Creep 39), LED display panel, and a 100μm thick silicone adhesive layer (4.5×10). 4 Pa / Creep 39), an upper substrate formed of PDMS with an elastic modulus of 0.8 MPa and a thickness of 300 μm to 350 μm, and a silicon-based adhesive layer with a thickness of 100 μm (4.5 × 10⁻⁶ Pa / Creep 39). 4 Pa / Creep 39), touch panel, and a 100μm thick silicone adhesive layer (4.5×10). 4 A polyurethane or silicone cover film with an elastic modulus of 0.8 MPa and a thickness of 300 μm (Pa / Creep39) and a polyurethane or silicone cover film are sequentially laminated.

[0189] [Comparative Implementation Method 3]

[0190] A sample with the following structure is manufactured, wherein a lower substrate is formed of PDMS with an elastic modulus of 0.8 MPa and a thickness of 300 μm to 350 μm, and an acrylic adhesive layer (7 × 10⁻⁶) with a thickness of 75 μm to 150 μm is formed. 4 Pa / Creep 43), LED display panel, acrylic adhesive layer with a thickness of 100μm (7×10 4 Pa / Creep 43), an upper substrate formed of PDMS with an elastic modulus of 0.8 MPa and a thickness of 300 μm to 350 μm, and an acrylic adhesive layer with a thickness of 100 μm (7 × 10). 4 Pa / Creep 43), touch panel, acrylic adhesive layer with a thickness of 100μm (7×10 4 A polyurethane or silicone cover film with an elastic modulus of 0.8 MPa and a thickness of 300 μm (Pa / Creep43) and a polyurethane or silicone cover film with an elastic modulus of 0.8 MPa and a thickness of 300 μm is sequentially laminated.

[0191] [Comparative Implementation Method 4]

[0192] A sample with the following structure is manufactured, comprising a lower substrate formed of PDMS having an elastic modulus of 0.8 MPa and a thickness of 300 μm to 350 μm, and an acrylic adhesive layer (1 × 10⁻⁶) having a thickness of 75 μm to 150 μm. 5 Pa / Creep 15), LED display panel, acrylic adhesive layer with a thickness of 100μm (1×10 5 Pa / Creep 15), an upper substrate formed of PDMS with an elastic modulus of 0.8 MPa and a thickness of 300 μm to 350 μm, and an acrylic adhesive layer with a thickness of 100 μm (1×10). 5 Pa / Creep 15), touch panel, acrylic adhesive layer with a thickness of 100μm (1×10 5 A polyurethane or silicone cover film with an elastic modulus of 0.8 MPa and a thickness of 300 μm (Pa / Creep15) and a polyurethane or silicone cover film were sequentially laminated.

[0193] [Experimental Implementation Method]

[0194] The manufacturing performance and tensile properties of the samples from Exemplary Embodiments 1 and 2, and Comparative Embodiments 1 to 4, were evaluated. Additionally, the peel strength and adhesive strength of the bonded products of the PDMS substrate and adhesive layer from Comparative Embodiments 1 to 4 were evaluated. The results are shown in Table 1 below.

[0195] [Table 1]

[0196]

[0197] Referring to Table 1, it was confirmed that in each of the exemplary embodiments 1 and 2, which include a first resin film, a second resin film, and a third resin film, no defects such as Z-axis deformation of the panel lines occurred, and the surface was flat, resulting in excellent manufacturing performance. When comparing the evaluation results of the tensile properties of exemplary embodiments 1 and 2, it was confirmed that the ductile fracture rate of the display device of exemplary embodiment 1 was 800% or higher, and the ductile fracture rate of the display device of exemplary embodiment 2 was 550%. That is to say, it can be understood that the tensile properties of the display device including the resin film with a lower elastic modulus are excellent.

[0198] Meanwhile, Comparative Embodiment 1 exhibits excellent peel, adhesive, and tensile properties; however, in the manufacturing performance evaluation, the surface of the display device was found to be uneven, and minute wrinkles were observed. Furthermore, in Comparative Embodiment 2, the adhesive layer's adhesive strength was confirmed to be less than 0.4 kgf / inch, leading to interfacial separation in the tensile property evaluation. In Comparative Embodiment 3, the evaluation results for adhesive, peel, and manufacturing performance were excellent; however, it was confirmed that line breakage occurred in the tensile property evaluation due to sample deformation. Furthermore, in Comparative Embodiment 4, high peel strength was confirmed, but line breakage still occurred in the tensile property evaluation.

[0199] In addition, a high-temperature / high-humidity reliability assessment was performed on the resin film used in Exemplary Embodiment 1. While storing the samples for 3000 hours under three conditions—60°C, 80°C, and 60°C / 90% relative humidity—the transmittance was assessed by the change over time. As a result of the assessment, it was confirmed that in the resin film of the exemplary embodiment according to this disclosure, the transmittance remained almost unchanged under high-temperature and / or high-humidity conditions.

[0200] Exemplary implementations of this disclosure can also be described as follows:

[0201] According to one aspect of this disclosure, a display device includes: a display panel including a pattern layer; and a resin film that is flexible and disposed at at least one location below or above the display panel; the pattern layer includes: a plurality of first plate patterns spaced apart from each other, each first plate pattern having sub-pixels including display elements and driving elements; a plurality of first line patterns connecting the plurality of first plate patterns; a plurality of second plate patterns spaced apart from each other, each second plate pattern having a gate driver; and a plurality of second line patterns connecting the plurality of second plate patterns or connecting the first plate patterns and the second plate patterns. The resin film is obtained by curing a material including polyurethane acrylate and two types of photoinitiators.

[0202] The two types of photoinitiators may include a first photoinitiator with an absorption wavelength of 400 nm or higher and a second photoinitiator with an absorption wavelength of 370 nm or lower.

[0203] The elastic modulus of the resin film can be 7 MPa or lower, and the ductile fracture rate of the resin film can be 400% or higher.

[0204] The display device may also include a touch panel on the display panel. The resin film may be disposed in at least one location below the display panel, between the display panel and the touch panel, or above the touch panel.

[0205] A resin film can be placed between the display panel and the touch panel to bond the display panel and the touch panel.

[0206] The elastic modulus of the resin film can be from 3 MPa to 5 MPa, and the thickness of the resin film can be from 50 μm to 500 μm.

[0207] The display device may further include: a lower substrate bonded to the bottom of the display panel via an adhesive layer; and a cover member bonded to the top of the touch panel via an adhesive layer.

[0208] Each of the lower substrate and the cover member may include at least one of polyurethane and silicon, the elastic modulus of the lower substrate may be 1 MPa or lower, the thickness of the lower substrate may be 25 μm to 150 μm, and the elastic modulus of the cover member may be 7 MPa or lower, and the thickness of the cover member may be 50 μm to 300 μm.

[0209] The resin film may include: a first resin film supporting a pattern layer below the display panel; and a second resin film between the display panel and the touch panel to bond the display panel and the touch panel.

[0210] The elastic modulus of the first resin film can be from 3 MPa to 5 MPa, and the thickness of the first resin film can be from 100 μm to 800 μm. The elastic modulus of the second resin film can be from 3 MPa to 5 MPa, and the thickness of the second resin film can be from 50 μm to 500 μm.

[0211] The display device may also include a cover member bonded to the top of the touch panel via an adhesive layer. The cover member may include at least one of polyurethane and silicone, and the elastic modulus of the cover member may be 7 MPa or lower, and the thickness of the cover member may be from 50 μm to 300 μm.

[0212] The resin film may also include a third resin film on the touch panel for direct contact with the touch panel.

[0213] The elastic modulus of the third resin film can be from 3 MPa to 5 MPa, and the thickness of the third resin film can be from 50 μm to 500 μm.

[0214] The resin film may include a first resin film supporting a pattern layer beneath the display panel; and a second resin film on the touch panel for direct contact with the upper portion of the touch panel. The touch panel and the display panel may be bonded together using an adhesive layer.

[0215] The elastic modulus of the first resin film may be 7 MPa or lower, and the thickness of the first resin film may be from 50 μm to 800 μm. The elastic modulus of the second resin film may be 7 MPa or lower, and the thickness of the second resin film may be from 50 μm to 800 μm.

[0216] The adhesive layer can be an optically transparent adhesive (OCA) and can be configured from acrylic adhesives, silicone adhesives and polyurethane adhesives.

[0217] Although exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and may be embodied in many different forms without departing from the technical concept of the present disclosure. Therefore, exemplary embodiments of the present disclosure are provided for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are illustrative in all respects and do not limit the present disclosure. The scope of protection of the present disclosure should be interpreted based on the appended claims, and all technical concepts within their equivalents should be construed as falling within the scope of the present disclosure.

Claims

1. A display device, comprising: A display panel, the display panel including a pattern layer, the pattern layer including: Multiple first plate patterns spaced apart from each other, each first plate pattern having sub-pixels including display elements and driving elements; Multiple first line patterns connecting the multiple first plate patterns; A plurality of second plate patterns spaced apart from each other, wherein gate drivers are disposed in the second plate patterns; and A plurality of second line patterns connecting the plurality of second plate patterns or connecting the first plate pattern and the second plate patterns; and A resin film, which is flexible and disposed in at least one location below or above the display panel. The resin film is obtained by curing a material comprising polyurethane acrylate and two types of photoinitiators.

2. The display device according to claim 1, wherein, The two types of photoinitiators include a first photoinitiator with an absorption wavelength of 400 nm or higher and a second photoinitiator with an absorption wavelength of 370 nm or lower.

3. The display device according to claim 1, wherein, The resin film has an elastic modulus of 7 MPa or lower, and the resin film has a ductile fracture rate of 400% or higher.

4. The display device according to claim 1, further comprising: The touch panel on the display panel, The resin film is disposed in at least one location: below the display panel, between the display panel and the touch panel, or above the touch panel.

5. The display device according to claim 4, wherein, The resin film is disposed between the display panel and the touch panel to bond the display panel and the touch panel.

6. The display device according to claim 5, wherein, The resin film has an elastic modulus of 3 MPa to 5 MPa and a thickness of 50 μm to 500 μm.

7. The display device according to claim 5, further comprising: The lower substrate is bonded to the bottom of the display panel via an adhesive layer; as well as A cover member, which is bonded to the top of the touch panel via the adhesive layer.

8. The display device according to claim 7, wherein, Each of the lower substrate and the cover member comprises at least one of polyurethane and silicone. Wherein, the elastic modulus of the lower substrate is 1 MPa or lower, and the thickness of the lower substrate is 25 μm to 150 μm, and The elastic modulus of the cover member is 7 MPa or lower, and the thickness of the cover member is 50 μm to 300 μm.

9. The display device according to claim 4, wherein, The resin film comprises: A first resin film, the first resin film supporting the pattern layer beneath the display panel; and A second resin film is placed between the display panel and the touch panel to bond the display panel and the touch panel.

10. The display device according to claim 9, wherein, The elastic modulus of the first resin film is 3 MPa to 5 MPa, and the thickness of the first resin film is 100 μm to 800 μm. The elastic modulus of the second resin film is 3 MPa to 5 MPa, and the thickness of the second resin film is 50 μm to 500 μm.

11. The display device according to claim 10, further comprising: A cover component, which is bonded to the top of the touch panel by an adhesive layer. The cover component comprises at least one of polyurethane and silicone, and The elastic modulus of the cover member is 7 MPa or lower, and the thickness of the cover member is 50 μm to 300 μm.

12. The display device according to claim 10, wherein, The resin film further includes: A third resin film is placed on the touch panel to make direct contact with it.

13. The display device according to claim 12, wherein, The elastic modulus of the third resin film is 3 MPa to 5 MPa, and the thickness of the third resin film is 50 μm to 500 μm.

14. The display device according to claim 4, wherein, The resin film comprises: A first resin film, the first resin film supporting the pattern layer beneath the display panel; and A second resin film is placed on the touch panel to directly contact the upper part of the touch panel. The touch panel and the display panel are joined together by an adhesive layer.

15. The display device according to claim 14, wherein, The elastic modulus of the first resin film is 7 MPa or lower, and the thickness of the first resin film is 50 μm to 800 μm. The elastic modulus of the second resin film is 7 MPa or lower, and the thickness of the second resin film is 50 μm to 800 μm.

16. The display device according to any one of claims 7, 11, or 14, wherein, The adhesive layer is an optically transparent adhesive (OCA) and is configured with acrylic adhesive, silicone adhesive and polyurethane adhesive.

Images