Mirror light-emitting device, preparation method thereof and display equipment

Abstract

The invention relates to a mirror light-emitting device, a preparation method thereof and display equipment. The mirror light-emitting device comprises a driving substrate, a light-emitting element, an adhesive layer, a packaging adhesive film layer and a metal coating. The driving substrate is provided with a working surface, and the light-emitting element and the adhesive layer are arranged on the working surface. The adhesive layer covers the light-emitting element and the working surface exposed out of the surface of the light-emitting element. The packaging adhesive film layer is arranged on the surface, deviating from the driving substrate, of the adhesive layer, and the surface, deviating from the adhesive layer, of the packaging adhesive film layer forms a plane. The metal coating is arranged on the surface, away from the adhesive layer, of the packaging adhesive film layer. The mirror light-emitting device provided by the invention can reduce the risk of stripping of the metal coating while having a relatively good mirror effect, so that the mirror light-emitting device can have relatively good long-term stability.

Description

Technical Field

[0001] This application relates to the field of light-emitting device technology, and in particular to mirror light-emitting devices, their preparation methods, and display devices. Background Technology

[0002] LED mirror screens, when the screen is off, have a mirror-like surface with strong reflection and very low haze. When the screen is on, the image can still be displayed normally behind the mirror effect, thus providing information interaction while reflecting the image. They have broad application prospects in both commercial and home display fields.

[0003] Currently, there are two technical approaches to LED mirror screens. The first approach involves fixing or bonding a semi-transparent, mirror-effect film or cover plate to the surface of a conventional LED display. This approach has the following disadvantages: bulky appearance, inconvenient maintenance, difficulty in leveraging the advantages of flexible LED display splicing, and a large gap between the mirror layer and the LED display layer, resulting in poor mirror and display effects. The second approach involves first encapsulating the surface of a conventional LED module into a flat plane using COB or GOB, and then achieving a mirror effect by applying a semi-transparent mirror film or plating silver onto the COB / GOB surface. This approach can create a mirror effect on the LED module surface, but both film application and silver plating suffer from poor adhesion, easily leading to peeling of the film or metal plating, resulting in poor long-term stability of the LED mirror screen. Summary of the Invention

[0004] Therefore, it is necessary to provide a mirror-emitting device, its fabrication method, and a display device. The mirror-emitting device of this application can not only have a good mirror effect, but also reduce the risk of metal coating peeling, thus having good long-term stability.

[0005] In a first aspect, this application provides a mirror-finished light-emitting device, including: a driving substrate, a light-emitting element, an adhesive layer, an encapsulating film layer, and a metal plating layer;

[0006] The driving substrate has a working surface, and the light-emitting element and the adhesive layer are disposed on the working surface; the adhesive layer covers the light-emitting element and the working surface is exposed on the surface of the light-emitting element;

[0007] The encapsulating film layer is disposed on the surface of the adhesive layer opposite to the driving substrate, and the surface of the encapsulating film layer opposite to the adhesive layer forms a plane; the metal plating layer is disposed on the surface of the encapsulating film layer opposite to the adhesive layer.

[0008] In some embodiments, the surface roughness Ra of the encapsulating film layer facing away from the adhesive layer is <0.05 μm, and the haze is <1%.

[0009] In some embodiments, the encapsulating film layer comprises the following components in parts by weight: 50 to 65 parts of a host resin, 20 to 30 parts of a reactive monomer, 4 to 8 parts of a photoinitiator, 5 to 15 parts of a filler, and 3 to 10 parts of a functional additive, wherein the functional additive includes at least two of an antioxidant, an ultraviolet absorber, a leveling agent, and an antifoaming agent.

[0010] In some embodiments, the host resin includes at least one of polyurethane acrylate, epoxy acrylate, and silicone-modified acrylate.

[0011] In some embodiments, the reactive monomers include at least one of tripropylene glycol diacrylate, 1,6-hexanediol diacrylate, isobornyl acrylate, trimethylolpropane triacrylate, and diethylene glycol diacrylate.

[0012] In some embodiments, the photoinitiator includes at least one selected from phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide, 1-hydroxy-cyclohexyl-phenyl ketone, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 1-hydroxycyclohexylphenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-dimethylamino-2-benzyl-1-[4-(4-morpholinyl)phenyl]-1-butanone, and 2-isopropylthioxanthraphenone.

[0013] In some embodiments, the filler includes at least one of nano-silica, nano-alumina, titanium dioxide, magnesium oxide, zinc oxide, calcium carbonate, barium sulfate, and organically modified montmorillonite.

[0014] In some embodiments, the antioxidant includes at least one of BASF Irganox 1076, BASF Irganox 1010, BASF Irganox 1135, BASF Irganox 245, and BASF Irganox 1330.

[0015] In some embodiments, the ultraviolet absorber includes at least one of BASF Tinuvin 326, BASF Tinuvin 328, BASF Tinuvin 329, UV-531, and UV-9.

[0016] In some embodiments, the leveling agent includes at least one of BYK-306, BYK-310, BYK-333, and BYK-361N.

[0017] In some embodiments, the defoamer includes at least one of BYK-011, BYK-024, BYK-055, BYK-057, and BYK-141.

[0018] In some embodiments, the adhesive layer comprises the following components in parts by weight: 30 to 50 parts epoxy resin, 15 to 30 parts UV acrylate, 3 to 10 parts latent curing agent, 5 to 10 parts tackifier, 5 to 15 parts filler, and 1 to 5 parts functional additive; the latent curing agent comprises at least one of dicyandiamide, modified amines, and imidazole salts; the tackifier comprises at least one of hydrogenated petroleum resin, hydrogenated terpene resin, and rosin ester.

[0019] In some embodiments, the thickness of the adhesive layer is 20 μm to 50 μm.

[0020] In some embodiments, a moisture-proof layer is also included; the moisture-proof layer is disposed between the adhesive layer and the working surface; the moisture-proof layer covers the light-emitting element and the working surface is exposed on the surface of the light-emitting element.

[0021] In some embodiments, a protective layer is further included; the protective layer is disposed on the surface of the metal plating layer opposite to the encapsulating film layer; the protective layer includes at least one of silicon oxide, aluminum oxide, and zirconium oxide; the thickness of the protective layer is 40 nm to 150 nm.

[0022] In some embodiments, a silver ink sealing layer is also included; the silver ink sealing layer covers the sides of the driving substrate, the adhesive layer, the encapsulating film layer, the metal plating layer, and the protective layer.

[0023] Secondly, this application provides a method for fabricating a mirror-emitting device, comprising the following steps:

[0024] A pre-finished encapsulating film layer is formed on the first release film;

[0025] An adhesive pre-finished layer is formed on the surface of the encapsulating film pre-finished layer that is opposite to the first release film, and a second release film is disposed on the surface of the adhesive pre-finished layer that is opposite to the encapsulating film pre-finished layer.

[0026] Remove the first release film and form a metal plating layer on the surface of the encapsulating film pre-finished layer opposite to the adhesive pre-finished layer;

[0027] A driving substrate is provided, the driving substrate having a working surface, and a light-emitting element is disposed on the working surface;

[0028] After removing the second release film and attaching the adhesive pre-finished layer to the working surface, perform a hot-press bonding process.

[0029] In some embodiments, the hot-pressing bonding process includes multiple heat preservation processes, with the temperature and pressure of each heat preservation process increasing progressively.

[0030] In some embodiments, the total duration of the hot-press bonding process is 2 to 4 hours.

[0031] In some embodiments, the maximum heat preservation temperature of the hot pressing bonding process is 135°C to 145°C.

[0032] In some embodiments, the pressure range of the hot-press bonding process is 0.2 MPa to 1.5 MPa.

[0033] In some embodiments, except for the final heat preservation treatment, the duration of each subsequent heat preservation treatment is 1 min to 20 min.

[0034] In some embodiments, the temperature difference between two adjacent insulation treatments is 20°C to 30°C.

[0035] Thirdly, this application provides a display device comprising the mirror light-emitting device described in any one of the above descriptions or the mirror light-emitting device prepared by the method described in any one of the above descriptions.

[0036] In the aforementioned mirror-finish light-emitting devices, to improve the adhesion between the metal coating and the substrate, the mirror-finish light-emitting devices of this application use an adhesive film instead of traditional transparent films or hard materials such as glass. During the thermosetting process, the encapsulating adhesive film can strengthen the bonding force with the metal coating, thereby avoiding peeling or cracking of the metal coating under high temperature and high humidity or thermal shock conditions. As a result, the mirror-finish light-emitting devices of this application can have both a good mirror effect and good long-term stability.

[0037] Furthermore, this application employs a stepped heating process for final thermal curing during the curing of the encapsulating film. This effectively absorbs and disperses the internal stress generated during the thermal curing process, avoids the formation of bubbles or voids, and reduces the macroscopic deformation that may occur on the upper surface of the encapsulating film layer, thereby ensuring the mirror flatness of the metal plating layer and achieving a better mirror effect. Attached Figure Description

[0038] Figure 1 This is a schematic diagram of the structure of a mirror light-emitting device provided in one embodiment of this application;

[0039] Figure 2 This is an actual effect diagram of the mirror light-emitting device prepared in Example 1 of this application.

[0040] Explanation of reference numerals in the attached figures:

[0041] 10-Driver substrate; 20-Light-emitting element; 30-Moisture-proof layer; 40-Adhesive layer; 50-Encapsulation film layer; 60-Metal plating layer; 70-Protective layer; 80-Silver ink edge sealing layer; 90-Electronic components. Detailed Implementation

[0042] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, a detailed description of specific embodiments of this application is provided below. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0044] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0045] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0046] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0047] Reference Figure 1 As shown, one embodiment of this application provides a mirror-finish light-emitting device, including: a driving substrate 10, a light-emitting element 20, an adhesive layer 40, an encapsulating film layer 50, and a metal plating layer 60. The driving substrate 10 has a working surface, and the light-emitting element 20 and the adhesive layer are disposed on the working surface. The adhesive layer covers the light-emitting element 20, and the working surface is exposed on the surface of the light-emitting element 20. The encapsulating film layer 50 is disposed on the surface of the adhesive layer 40 facing away from the driving substrate 10, and the surface of the encapsulating film layer 50 facing away from the adhesive layer 40 forms a plane. The metal plating layer 60 is disposed on the surface of the encapsulating film layer 50 facing away from the adhesive layer 40.

[0048] In the aforementioned mirror-finish light-emitting device, to improve the adhesion between the metal plating layer 60 and the substrate, the mirror-finish light-emitting device of this application uses an adhesive film instead of traditional transparent films or hard materials such as glass. During the thermosetting process, the encapsulating adhesive film can strengthen the bonding force with the metal plating layer 60, thereby avoiding the problem of peeling or cracking of the metal plating layer 60 under high temperature and high humidity or thermal shock conditions. As a result, the mirror-finish light-emitting device of this application can have a good mirror effect while also having good long-term stability.

[0049] Furthermore, this application employs a stepped heating process for final thermal curing during the curing of the encapsulating film. This effectively absorbs and disperses the internal stress generated during the thermal curing process, avoids the formation of bubbles or voids, reduces the macroscopic deformation that may occur on the upper surface of the encapsulating film layer 50, thereby ensuring the mirror flatness of the metal plating layer 60 and achieving a better mirror effect.

[0050] In some embodiments, the surface roughness Ra of the encapsulating film layer 50 facing away from the adhesive layer 40 is <0.05μm, and the haze is <1%.

[0051] It is understandable that Ra is an abbreviation for Arithmetic Average Roughness, a core parameter for measuring the microscopic unevenness of a surface. It refers to the arithmetic mean of the absolute values ​​of the profile deviations within the sampling length; the smaller the Ra, the smoother the surface. Haze is a core indicator for measuring the optical uniformity of transparent or translucent materials. It refers to the degree of light scattering by the material, characterizing the percentage of diffuse transmission light that deviates from the incident direction after passing through the material, expressed as a percentage. The higher the haze value, the lower the light transmission clarity of the material, and the more hazy the appearance; the lower the haze value, the more transparent and clear the material. Within the range of surface roughness and haze of the encapsulation film layer 50 away from the adhesive layer 40, it is easier to achieve a high mirror flatness of the metal plating layer 60, giving the mirror light-emitting device of this application a better mirror effect.

[0052] Optionally, the surface roughness Ra of the encapsulating film layer 50 facing away from the adhesive layer 40 is less than 0.02 μm, or the surface roughness Ra of the encapsulating film layer 50 facing away from the adhesive layer 40 is less than 0.01 μm, or the surface roughness Ra of the encapsulating film layer 50 facing away from the adhesive layer 40 is less than 0.005 μm, or the surface roughness Ra of the encapsulating film layer 50 facing away from the adhesive layer 40 is less than 0.002 μm, or the surface roughness Ra of the encapsulating film layer 50 facing away from the adhesive layer 40 is less than 0.001 μm.

[0053] Optionally, the haze of the surface of the encapsulating film layer 50 facing away from the adhesive layer 40 is <1%, or the haze of the surface of the encapsulating film layer 50 facing away from the adhesive layer 40 is <0.8%, or the haze of the surface of the encapsulating film layer 50 facing away from the adhesive layer 40 is <0.5%, or the haze of the surface of the encapsulating film layer 50 facing away from the adhesive layer 40 is <0.2%, or the haze of the surface of the encapsulating film layer 50 facing away from the adhesive layer 40 is <0.1%.

[0054] In some embodiments, the metal coating 60 includes at least one of silver, silver alloy, aluminum, aluminum alloy, chromium, and chromium alloy.

[0055] In some embodiments, the light-emitting element 20 includes at least one of LED beads and chips.

[0056] In some embodiments, the encapsulating film layer 50 comprises the following components in parts by weight: 50 to 65 parts of a host resin, 20 to 30 parts of a reactive monomer, 4 to 8 parts of a photoinitiator, 5 to 15 parts of a filler, and 3 to 10 parts of a functional additive, the functional additive including at least two of an antioxidant, an ultraviolet absorber, a leveling agent, and an antifoamer.

[0057] Optionally, the mass fraction of the main resin is 50 parts, 52 parts, 55 parts, 58 parts, 60 parts, 62 parts or 65 parts, or the mass fraction of the main resin may be within the range of any two of the above mass fractions.

[0058] Optionally, the mass fraction of the reactant monomer is 20 parts, 22 parts, 24 parts, 26 parts, 28 parts, or 30 parts, or the mass fraction of the reactant monomer may be within the range of any two of the above mass fractions.

[0059] Optionally, the mass fraction of the photoinitiator is 4, 5, 6, 7 or 8 parts, or the mass fraction of the photoinitiator may be within the range of any two of the above mass fractions.

[0060] Optionally, the mass fraction of the packing is 5, 7, 9, 11, 13 or 15 parts, or the mass fraction of the packing may be within any two of the above-mentioned mass fractions.

[0061] Optionally, the mass fraction of the functional additive is 3, 4, 5, 6, 7, 8, 9 or 10 parts, or the mass fraction of the functional additive may be within the range of any two of the above mass fractions.

[0062] In some embodiments, the host resin includes at least one of polyurethane acrylate, epoxy acrylate, and silicone-modified acrylate.

[0063] In some embodiments, the reactive monomers include at least one of tripropylene glycol diacrylate, 1,6-hexanediol diacrylate, isobornyl acrylate, trimethylolpropane triacrylate, and diethylene glycol diacrylate.

[0064] In some embodiments, the photoinitiator includes at least one selected from phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide, 1-hydroxy-cyclohexyl-phenyl ketone, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 1-hydroxycyclohexylphenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-dimethylamino-2-benzyl-1-[4-(4-morpholinyl)phenyl]-1-butanone, and 2-isopropylthioxanthraphenone.

[0065] In some embodiments, the filler includes at least one of nano-silica, nano-alumina, titanium dioxide, magnesium oxide, zinc oxide, calcium carbonate, barium sulfate, and organically modified montmorillonite.

[0066] In some embodiments, the antioxidant includes at least one of BASF Irganox 1076, BASF Irganox 1010, BASF Irganox 1135, BASF Irganox 245, and BASF Irganox 1330.

[0067] In some embodiments, the ultraviolet absorber includes at least one of BASF Tinuvin 326, BASF Tinuvin 328, BASF Tinuvin 329, UV-531, and UV-9.

[0068] In some embodiments, the leveling agent includes at least one of BYK-306, BYK-310, BYK-333, and BYK-361N.

[0069] In some embodiments, the defoamer includes at least one of BYK-011, BYK-024, BYK-055, BYK-057, and BYK-141.

[0070] In some embodiments, the adhesive layer 40 comprises the following components in parts by weight: 30 to 50 parts of epoxy resin, 15 to 30 parts of UV acrylate, 3 to 10 parts of latent curing agent, 5 to 10 parts of tackifier, 5 to 15 parts of filler, and 1 to 5 parts of functional additive; the latent curing agent includes at least one of dicyandiamide, modified amines, and imidazole salts; the tackifier includes at least one of hydrogenated petroleum resin, hydrogenated terpene resin, and rosin ester.

[0071] It is understood that the filler in adhesive layer 40 is independently selected from at least one of the fillers described above. The functional additive in adhesive layer 40 is independently selected from at least one of the functional additives described above.

[0072] Optionally, the mass fraction of epoxy resin is 30 parts, 32 parts, 35 parts, 38 parts, 40 parts, 42 parts, 45 parts, 48 ​​parts or 50 parts, or the mass fraction of epoxy resin may be within the range of any two of the above mass fractions.

[0073] Optionally, the mass fraction of UV acrylate is 15, 18, 20, 22, 25, 28 or 30 parts, or the mass fraction of UV acrylate may be within the range of any two of the above mass fractions.

[0074] Optionally, the mass fraction of the latent curing agent is 3, 4, 5, 6, 7, 8, 9, or 10 parts, or the mass fraction of the latent curing agent may be within the range of any two of the above mass fractions.

[0075] Optionally, the mass fraction of the packing is 5, 7, 9, 11, 13 or 15 parts, or the mass fraction of the packing may be within the range of any two of the above mass fractions.

[0076] Optionally, the mass fraction of the functional additive is 1 part, 2 parts, 3 parts, 4 parts or 5 parts, or the mass fraction of the functional additive may be within the range of any two of the above mass fractions.

[0077] In some embodiments, the thickness of the adhesive layer 40 is 20 μm to 50 μm.

[0078] Optionally, the thickness of the adhesive layer 40 is 20μm, 25μm, 30μm, 35μm, 40μm, 45μm or 50μm, or the thickness of the adhesive layer 40 may be within any two of the above thicknesses.

[0079] In some embodiments, a moisture barrier 30 is also included; the moisture barrier 30 is disposed between the adhesive layer 40 and the working surface; the moisture barrier 30 covers the light-emitting element 20 and the working surface is exposed on the surface of the light-emitting element 20; the moisture barrier 30 includes silicon dioxide; the thickness of the moisture barrier 30 is 20nm~100nm.

[0080] Optionally, the thickness of the moisture barrier 30 is 20nm, 30nm, 40nm, 50nm, 60nm, 70nm, 80nm, 90nm or 100nm, or the thickness of the moisture barrier 30 may be within any two of the above thicknesses.

[0081] In some embodiments, a protective layer 70 is also included; the protective layer 70 is disposed on the surface of the metal plating layer 60 away from the encapsulating film layer 50; the protective layer 70 includes at least one of silicon oxide, aluminum oxide and zirconium oxide; the thickness of the protective layer 70 is 40 nm to 150 nm.

[0082] Optionally, the thickness of the protective layer 70 is 40nm, 60nm, 80nm, 100nm, 120nm or 150nm, or the thickness of the protective layer 70 may be within any two of the above thicknesses.

[0083] In some embodiments, a silver ink sealing layer 80 is also included; the silver ink sealing layer 80 covers the sides of the driving substrate 10, the adhesive layer 40, the encapsulating film layer 50, the metal plating layer 60, and the protective layer 70.

[0084] In some embodiments, the thickness of the metal coating 60 is 15 nm to 40 nm.

[0085] Optionally, the thickness of the metal coating 60 is 15nm, 20nm, 25nm, 30nm, 35nm or 40nm, or the thickness of the metal coating 60 may be within any two of the above thicknesses.

[0086] In some embodiments, the mirror light-emitting device further includes an electronic component 90 disposed on the surface of the driving substrate 10 opposite to the light-emitting element 20.

[0087] Furthermore, the mirror-emitting device of this application can achieve the following beneficial effects:

[0088] (1) In order to improve the adhesion between the metal coating 60 and the substrate, the mirror light-emitting device of this application uses an adhesive film instead of traditional transparent film or hard materials such as glass. The encapsulating adhesive film can strengthen the bonding force with the metal coating 60 during the thermal curing process, thereby avoiding the problem of peeling or cracking of the metal coating 60 under high temperature and high humidity or thermal shock conditions. As a result, the mirror light-emitting device of this application can have a good mirror effect and also have good long-term stability.

[0089] (2) This application introduces a low-shrinkage resin / monomer combined with inorganic rigid particles and plasticizer into the film material. At the same time, a stepped heating process is used for final thermal curing during the curing process of the encapsulation film. This can effectively absorb and disperse the internal stress generated during the thermal curing process, avoid the generation of bubbles or voids, reduce the macroscopic deformation that may occur on the upper surface of the encapsulation film layer 50, thereby ensuring the mirror flatness of the metal plating layer 60 and achieving a surface roughness Ra<0.05μm and haze<1%.

[0090] (3) The present invention adopts a multi-layer protection design, performs moisture-proof treatment on the surface of the light-emitting element 20, and performs anti-oxidation (protective layer 70) treatment on the surface of the metal plating layer 60, avoiding problems such as moisture absorption caused by insufficient airtightness of the lamp beads due to the encapsulation of the film.

[0091] (4) This application uses a film + silver-plated mirror instead of the traditional encapsulation glue + bonding mirror process, which can effectively reduce the thickness of the surface functional layer and ultimately achieve a total thickness of less than 200μm of the functional layer above the lamp surface, avoiding the problem of bright and dark lines and blue and yellow lines at the splicing position that may be caused by excessively thick functional layers.

[0092] (5) In this application, the four sides of the light-emitting device are sealed with silver ink to ensure that there is no black seam at the splicing position when viewing the display screen from the side, thus ensuring the continuity and consistency of the mirror surface.

[0093] Another embodiment of this application provides a method for fabricating a mirror-emitting device, comprising the following steps:

[0094] A pre-finished encapsulating film layer is formed on the first release film;

[0095] An adhesive pre-finished layer is formed on the surface of the encapsulation film pre-finished layer that is opposite to the first release film, and a second release film is disposed on the surface of the adhesive pre-finished layer that is opposite to the encapsulation film pre-finished layer.

[0096] Remove the first release film and form a metal plating layer 60 on the surface of the encapsulating film pre-finished layer opposite to the adhesive pre-finished layer;

[0097] A driving substrate 10 is provided, the driving substrate 10 has a working surface, and a light-emitting element 20 is disposed on the working surface;

[0098] After removing the second release film and attaching the pre-adhesive layer to the working surface, perform a hot-press bonding process.

[0099] It is understandable that after forming the encapsulation film pre-finished layer and the adhesive pre-finished layer, both the encapsulation film pre-finished layer and the adhesive pre-finished layer are made to be surface dry to facilitate subsequent operations. After being bonded to the working surface, they are dried by hot pressing to form the encapsulation film layer 50 and the adhesive layer 40.

[0100] In some embodiments, the hot-pressing process includes multiple insulation processes, with the temperature and pressure of each insulation process increasing progressively.

[0101] In this application, a stepped heating process is used for final thermal curing during the curing of the encapsulating film. This process can effectively absorb and disperse the internal stress generated during thermal curing, avoid the formation of bubbles or voids, reduce the macroscopic deformation that may occur on the upper surface of the encapsulating film layer 50, thereby ensuring the mirror flatness of the metal plating layer 60 and achieving a better mirror effect.

[0102] In some implementations, the heat preservation process is divided into 3, 4, or 5 stages.

[0103] In some embodiments, the total duration of the hot-press bonding process is 2 to 4 hours.

[0104] Optionally, the total duration of the hot-pressing process is 2h, 2.2h, 2.5h, 2.8h, 3h, 3.2h, 3.5h, 3.8h or 4h, or the total duration of the hot-pressing process can be within any two of the above durations.

[0105] In some embodiments, the maximum heat preservation temperature of the hot pressing bonding process is 135°C to 145°C.

[0106] Optionally, the maximum heat preservation temperature for hot pressing is 135℃, 137℃, 139℃, 140℃, 141℃, 143℃ or 145℃, or the maximum heat preservation temperature for hot pressing can be within the range of any two of the above temperatures.

[0107] In some embodiments, the pressure range of the hot-press bonding process is 0.2 MPa to 1.5 MPa.

[0108] Optionally, the pressure of the hot pressing process is 0.2MPa, 0.4MPa, 0.6MPa, 0.8MPa, 1MPa, 1.2MPa, 1.4MPa or 1.5MPa, or the pressure during each heat preservation process in the hot pressing process can be within the range of any two of the above pressures.

[0109] In some embodiments, except for the final heat preservation treatment, the duration of each subsequent heat preservation treatment is 1 min to 20 min.

[0110] Optionally, except for the last heat preservation treatment, the time for each of the remaining heat preservation treatments is 1 min, 2 min, 5 min, 8 min, 10 min, 12 min, 15 min, 18 min or 20 min. Alternatively, except for the last heat preservation treatment, the time for each of the remaining heat preservation treatments can also be within any two of the above-mentioned time ranges.

[0111] In some embodiments, the temperature difference between two adjacent insulation treatments is 20°C to 30°C.

[0112] Optionally, the temperature difference between two adjacent insulation treatments can be 20℃, 22℃, 24℃, 26℃, 28℃ or 30℃, or the temperature difference between two adjacent insulation treatments can be within any two of the above-mentioned differences.

[0113] Within the range of the parameters of the above-mentioned heat preservation treatment, the internal stress generated during the heat curing process can be effectively absorbed and dispersed, avoiding the generation of bubbles or voids, reducing the macroscopic deformation that may occur on the upper surface of the encapsulation film layer 50, thereby ensuring the mirror flatness of the metal plating layer 60, and facilitating the achievement of a surface roughness Ra < 0.05 μm and haze < 1% for the encapsulation film layer 50.

[0114] In some embodiments, the insulation process includes:

[0115] Set the target temperature for the first heating stage to 80℃, the pressure to 0.5MPa, the heating rate to 2℃ / min, and hold at 80℃ for 5min.

[0116] The target temperature for the second heating stage is set at 110℃, the pressure at 1MPa, and the heating rate at 1.5℃ / min. After reaching 110℃, the temperature is held for 10 minutes.

[0117] The target temperature for the third heating stage is set at 135℃, the pressure at 1.2MPa, and the heating rate at 1℃ / min. After reaching 135℃, the temperature is held for 120min, and then cooled to room temperature.

[0118] In some embodiments, the insulation process includes:

[0119] The target temperature for the first heating stage is set at 60℃, the pressure at 0.2MPa, and the heating rate at 2℃ / min. After reaching 60℃, the temperature is held for 10min.

[0120] Set the target temperature for the second heating stage to 90℃, the pressure to 1MPa, the heating rate to 1.5℃ / min, and hold at 90℃ for 10min.

[0121] The target temperature for the third heating stage is set at 115℃, the pressure at 1.2MPa, and the heating rate at 1℃ / min. After reaching 115℃, the temperature is held for 10min.

[0122] The target temperature for the fourth heating stage is set at 140℃, the pressure at 1.5MPa, and the heating rate at 1℃ / min. After reaching 140℃, the temperature is held for 100min, and then cooled to room temperature.

[0123] In some embodiments, the adhesive pre-finished layer is applied to the back of the encapsulating film pre-finished layer using a microgravure coating or slot extrusion coating process.

[0124] In some embodiments, the adhesive pre-finished layer retains normal tack below 80°C and is fully cured above 130°C.

[0125] In some embodiments, attaching the adhesive pre-finished layer to the work surface includes:

[0126] A moisture-proof layer 30 is prepared on the working surface.

[0127] The pre-adhesive layer is attached to the moisture-proof layer 30.

[0128] In some embodiments, the moisture barrier 30 is formed on the working surface using PECVD or spraying processes.

[0129] In some implementations, the precursors for PECVD are hexamethyldisiloxane and oxygen.

[0130] In some implementations, the PECVD deposition rate is 5 nm / min to 10 nm / min.

[0131] Optionally, the PECVD deposition rate is 5 nm / min, 6 nm / min, 7 nm / min, 8 nm / min, 9 nm / min or 10 nm / min, or the PECVD deposition rate can be within any two of the above rates.

[0132] In some embodiments, after forming the metal plating 60, a protective layer 70 is formed on the surface of the metal plating 60 opposite to the encapsulation film pre-finished layer.

[0133] In some embodiments, the protective layer 70 is prepared by vacuum evaporation or coating.

[0134] In some embodiments, the material for vacuum evaporation is silicon dioxide or aluminum oxide.

[0135] In some embodiments, the coating material comprises the following components in parts by weight: 45 to 60 parts inorganic nanoparticles, 15 to 25 parts silicone resin, 6 to 10 parts silane coupling agent, 5 to 10 parts photocurable acrylic resin, 1 to 3 parts photoinitiator, 0 to 3 parts functional additives, and 2 to 5 parts solvent.

[0136] Optionally, the mass fraction of the inorganic nanoparticles is 45, 48, 50, 52, 55, 58, or 60 parts, or the mass fraction of the inorganic nanoparticles may be within the range of any two of the above mass fractions.

[0137] Optionally, the mass fraction of the silicone resin is 15 parts, 17 parts, 19 parts, 21 parts, 23 parts, or 25 parts, or the mass fraction of the silicone resin may be within the range of any two of the above mass fractions.

[0138] Optionally, the mass fraction of the silane coupling agent is 6, 7, 8, 9 or 10 parts, or the mass fraction of the silane coupling agent may be within the range of any two of the above mass fractions.

[0139] Optionally, the mass fraction of the light-cured acrylic resin is 5, 6, 7, 8, 9, or 10 parts, or the mass fraction of the light-cured acrylic resin may be within any two of the above-mentioned mass fractions.

[0140] Optionally, the mass fraction of the photoinitiator is 1 part, 1.2 parts, 1.5 parts, 1.8 parts, 2 parts, 2.2 parts, 2.5 parts, 2.8 parts, or 3 parts, or the mass fraction of the photoinitiator may be within the range of any two of the above mass fractions.

[0141] Optionally, the mass fraction of the functional additive is 0, 0.5, 1, 1.5, 2, 2.5, or 3 parts, or the mass fraction of the functional additive may be within the range of any two of the above mass fractions.

[0142] Optionally, the mass fraction of the solvent is 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, or 5 parts, or the mass fraction of the solvent may be within the range of any two of the above mass fractions.

[0143] In some embodiments, the inorganic nanoparticles include at least one of silica sol, alumina sol, and zirconium oxide sol.

[0144] In some embodiments, the silicone resin includes at least one of methylphenyl silicone resin, epoxy-modified silicone resin, acrylate-modified silicone resin, and MQ silicone resin.

[0145] In some embodiments, the silane coupling agent includes at least one of KH-560, KH-570, and A-1120.

[0146] In some embodiments, the functional additives include leveling agents and defoamers.

[0147] In some embodiments, the hot-press bonding process further includes: forming a silver ink sealing layer 80; the silver ink sealing layer 80 covers the sides of the driving substrate 10, the adhesive layer 40, the encapsulating film layer 50, the metal plating layer 60, and the protective layer 70.

[0148] In some embodiments, silver ink is applied using a single-point spraying or brush coating method.

[0149] In some of these embodiments, the silver ink comprises silver powder.

[0150] It is understood that the silver ink sealing layer 80 of this application can be prepared using any silver ink in the art, and the specific composition of the silver ink is not limited in this application.

[0151] Another embodiment of this application provides a display device, including a mirror light-emitting device according to any one of the above claims or a mirror light-emitting device prepared by any one of the above claims.

[0152] The following is the specific implementation:

[0153] Example 1

[0154] Fabrication method of mirror light-emitting devices:

[0155] (1) Pre-made encapsulation film: Provide an encapsulation film material, including 30 parts aliphatic polyurethane acrylate (model: Sartoma CN991), 20 parts bisphenol A epoxy acrylate (model: Changxing Chemical 6215-100), 20 parts dipropylene glycol diacrylate, 10 parts 1,6-hexanediol diacrylate, 6 parts nano-fumed silica, 2 parts titanium dioxide dispersant, 2 parts spherical silica with a particle size of 0.5 μm, 1.5 parts organic modified montmorillonite, 4 parts photoinitiator bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, 2 parts photoinitiator 2,4,6-trimethylbenzoyl diphenylphosphine oxide, 1.5 parts 2-ethylhexyl acrylate, 0.5 parts leveling agent BYK-361N and 0.5 parts defoamer BYK-066N;

[0156] An optical-grade PET release film with a width of 200 mm and a surface roughness Ra < 0.005 μm is provided. The film material is coated onto the release film surface using a slotted extrusion coating machine with a slot gap of 180 μm and a coating speed of 0.8 m / min. After standing in a Class 100 cleanroom leveling tunnel for 90 s with an airflow velocity < 0.1 m / s, it is UV surface cured for 10 s using a UV mercury lamp in a nitrogen atmosphere, achieving a strength of 1500 mW / cm². 2 .

[0157] (2) Coating the pre-finished adhesive layer: Provide an adhesive layer 40 material, including 60 parts of bisphenol A type epoxy resin, 20 parts of hydrogenated petroleum resin, 8 parts of dicyandiamide, 2 parts of urea accelerator, 6 parts of spherical silica powder, 1.5 parts of fumed silica, 1.5 parts of silane coupling agent KH-560, 0.4 parts of defoamer BYK-055 and 0.6 parts of leveling agent BYK-361N; peel off the release film after the surface-drying adhesive film, and uniformly coat a layer of adhesive layer 40 material on it using a micro-gravure coating machine (200 lines / inch anilox roller), with a wet film thickness of 25μm. After drying with hot air at 60℃ for 3min, cover with a release film and cut the adhesive film into 180mm×180mm size for later use.

[0158] (3) Vacuum metal coating 60: The above-mentioned pre-finished encapsulating film is placed into the plasma equipment chamber with the release film facing down. The working power is set to 300W, and the surface is plasma cleaned for 10 minutes in an argon atmosphere to raise the surface energy to above 60mN / m. Then it is placed in the vacuum coating machine and separated by baffles. The vacuum chamber is evacuated to 5×10 - 3Pa; High-purity silver particles are packed into a resistance heating boat, and the silver material is slowly heated to a molten state. Evaporation is carried out for 30 seconds to remove impurity gases. The heating boat current is then gradually increased until the silver material is stably evaporated. The baffle is opened, and the deposition rate is controlled at 0.2 nm / s. The value change of the quartz crystal microbalance is continuously monitored. Evaporation is carried out for 150 seconds until the thickness of the metal coating deposited on the film surface reaches 30 nm.

[0159] (4) Preparation of protective layer 70: Turn off the silver evaporation source, introduce high-purity oxygen into the vacuum chamber, and maintain the working pressure at 1×10 -2 Pa to 5×10 -2 Pa, with a baffle blocking the film, slowly increase the current of the silicon monoxide heating boat to melt and evaporate the silicon monoxide material for 30 seconds to remove impurity gases. Then gradually increase the heating boat current until the silicon monoxide evaporates stably. Open the baffle and control the deposition rate at 0.2 nm / s, continuously monitoring the value changes of the quartz crystal microbalance. Evaporate for 300 seconds until the thickness of the silicon dioxide coating deposited on the film surface reaches 60 nm. Turn off the evaporation source and oxygen, close the baffle, cool to room temperature, and then introduce dry air to remove the finished silver-plated film.

[0160] (5) Spraying a moisture-proof layer 30: Provide an LED light board with a size of 150mm×168.5mm, complete the die bonding process of the LED chip, perform plasma cleaning on its surface for 10min, provide a moisture-proof coating liquid, the main components of which are methyltrimethoxysilane, ethanol solvent and silicon dioxide particles, and spray it evenly on the surface of the LED chip using a spraying process, with a wet film thickness of 5μm, heat it in a tunnel oven at 75℃ for 45min, and let it stand at room temperature for 24h until it is completely cured.

[0161] (6) Hot pressing and bonding of adhesive film: Place the LED light board with the light surface facing up in the vacuum bonding fixture. After removing the release film, use the roller bonding process to bond the adhesive film to the LED light surface with the adhesive layer 40 facing down. Vacuum and remove bubbles for 1 minute. Place the LED light board with the adhesive film bonded in the hot press. Set the target temperature of the first heating stage to 80℃, the pressure to 0.5MPa, and the heating rate to 2℃ / min. After reaching 80℃, hold for 5 minutes. Set the target temperature of the second heating stage to 110℃, the pressure to 1MPa, and the heating rate to 1.5℃ / min. After reaching 110℃, hold for 10 minutes. Set the target temperature of the third heating stage to 135℃, the pressure to 1.2MPa, and the heating rate to 1℃ / min. After reaching 135℃, hold for 120 minutes. Then cool to room temperature.

[0162] (7) Silver edge coating: The process edge of the LED light board is cut off by CNC equipment and installed on the jig of the spraying equipment. Silver ink material is loaded into the injection gun and the nozzle performs line spraying along the four sides of the LED light board. After the spraying is completed, the ink solvent evaporates and dries naturally to obtain an LED module with a mirror effect.

[0163] Reference Figure 2 As shown, Figure 2 This is an actual effect diagram of the mirror-emitting device prepared in Example 1 of this application. It can be seen that the mirror-emitting device prepared in Example 1 of this application has a good mirror effect.

[0164] Example 2

[0165] Fabrication method of mirror light-emitting devices:

[0166] (1) Pre-made encapsulation film: Provide an encapsulation film material, including 40 parts of polyurethane acrylate, 25 parts of epoxy acrylate, 20 parts of 1,6-hexanediol diacrylate, 6 parts of dioctyl phthalate, 6 parts of photoinitiator bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, 1 part of UV absorber 2-isopropylthioxanthone, 1 part of antioxidant Irganox 1010, 0.5 parts of leveling agent BYK-333 and 0.5 parts of defoamer BYK-055;

[0167] An optical-grade PET release film with a width of 300 mm and a surface roughness Ra < 0.005 μm is provided. The film material is coated onto the release film surface using a slotted extrusion coating machine with a slot gap of 450 μm and a coating speed of 0.4 m / min. After standing in a Class 100 cleanroom leveling tunnel for 90 s with an airflow velocity < 0.1 m / s, it is UV surface cured for 30 seconds under a nitrogen atmosphere using a UV mercury lamp, achieving a strength of 1000 mW / cm². 2 .

[0168] (2) Coating the pre-finished adhesive layer: Provide an adhesive layer 40 material, including 30 parts of bisphenol A type epoxy resin, 15 parts of flexible epoxy resin, 30 parts of polyurethane acrylate, 5 parts of dicyandiamide, 8 parts of hydrogenated terpene resin, 2 parts of phenyl bis(2,4,6-trimethylbenzoyl)phosphorus oxide, 1 part of 1-hydroxy-cyclohexyl-phenyl ketone, 2 parts of silane coupling agent KH-560, 4 parts of fumed silica particles, 2 parts of titanium dioxide powder, 0.4 parts of defoamer BYK-011 and 0.6 parts of leveling agent BYK-333; peel off the release film after the surface-drying adhesive film, and uniformly coat a layer of adhesive layer 40 material on it using a micro-gravure coating machine (200 lines / inch anilox roller), with a wet film thickness of 30 μm, dry at 60℃ for 1 min, and then use a UV mercury lamp at 800mW / cm 2 UV curing was performed for 15 seconds under high irradiation intensity to achieve surface drying. A release film was then applied, and the film was cut into 260mm×260mm sizes for later use.

[0169] (3) Vacuum metal coating 60: Place the above adhesive film into the plasma equipment chamber with the release film facing down, set the working power to 300W, and perform surface plasma cleaning for 10 minutes in an argon atmosphere to raise the surface energy to above 60mN / m. Then place it in the vacuum coating machine and use baffles to separate it, and evacuate the vacuum chamber to 5×10 -3 Pa. High-purity silver particles were packed into a resistance heating boat, and the silver was slowly heated to a molten state. Evaporation was carried out for 30 seconds to remove impurity gases. The heating boat current was then gradually increased until the silver material was stably evaporated. The baffle was opened, and the deposition rate was controlled at 0.2 nm / s. The value change of the quartz crystal microbalance was continuously monitored. Evaporation was carried out for 150 seconds until the thickness of the metal coating deposited on the film surface reached 30 nm.

[0170] (4) Preparation of protective layer 70: Provide an antioxidant layer material comprising 20 parts of silicone resin, 50 parts of silica sol, 10 parts of silica dispersion with a solid content of 40%, 7 parts of polyurethane acrylate, 2 parts of phenyl bis(2,4,6-trimethylbenzoyl)phosphorus oxide, 8 parts of silane coupling agent KH-570, 2 parts of isopropanol and 1 part of leveling agent BYK-310; uniformly coat the above materials onto the surface of the metal plating layer 60, with a wet film thickness of 25 μm, preheat and dry at 60°C for 1 min, and then perform UV surface curing under a nitrogen atmosphere using a UV mercury lamp for 20 s, achieving a strength of 500 mW / cm. 2 .

[0171] (5) PECVD moisture-proof coating: Provide an LED light board with a size of 250mm×250mm, use MIP lamp beads to complete the die bonding, and place the lamp surface in the PECVD equipment after plasma cleaning for 10min. Use hexamethyldisiloxane and oxygen as precursors, set the working pressure to 50Pa, the substrate temperature to 80℃, the deposition rate to 10nm / min, and the deposition time to 5min. A dense silicon dioxide layer is deposited on the lamp surface through the precursor reaction.

[0172] (6) Hot pressing and bonding of adhesive film: Place the LED light board with the light surface facing up in the vacuum bonding fixture. After removing the release film, use a roller bonding process to bond the adhesive film to the LED light surface with the adhesive layer 40 facing down. Vacuum and remove bubbles for 1 minute. Place the LED light board with the adhesive film bonded in the hot press. Set the target temperature of the first heating stage to 60℃, the pressure to 0.2MPa, and the heating rate to 2℃ / min. After reaching 60℃, hold for 10 minutes. Set the second heating stage. The target temperature for the first heating stage is 90℃, the pressure is 1MPa, and the heating rate is 1.5℃ / min. After reaching 110℃, the temperature is held for 10min. The target temperature for the third heating stage is set at 115℃, the pressure is 1.2MPa, and the heating rate is 1℃ / min. After reaching 115℃, the temperature is held for 10min. The target temperature for the fourth heating stage is set at 140℃, the pressure is 1.5MPa, and the heating rate is 1℃ / min. After reaching 140℃, the temperature is held for 100min, and then cooled to room temperature.

[0173] (7) Silver edge coating: The process edge of the LED light board is cut off by a dicing machine, and silver ink pen is used to apply ink along the four sides of the LED light board. Then the ink solvent evaporates and dries naturally to obtain an LED module with a mirror effect.

[0174] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0175] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims, and the specification and drawings can be used to interpret the content of the claims.

Claims

1. A mirror-emitting device, characterized in that, include: The driving substrate, light-emitting element, adhesive layer, encapsulating film layer, and metal plating layer; The driving substrate has a working surface, and the light-emitting element and the adhesive layer are disposed on the working surface; the adhesive layer covers the light-emitting element and the working surface is exposed on the surface of the light-emitting element; The encapsulating film layer is disposed on the surface of the adhesive layer opposite to the driving substrate, and the surface of the encapsulating film layer opposite to the adhesive layer forms a plane; the metal plating layer is disposed on the surface of the encapsulating film layer opposite to the adhesive layer.

2. The mirror-emitting device according to claim 1, characterized in that, The surface roughness Ra of the encapsulating film layer facing away from the adhesive layer is <0.05μm, and the haze is <1%.

3. The mirror-emitting device according to claim 1, characterized in that, The encapsulating film layer comprises the following components in parts by weight: 50 to 65 parts of main resin, 20 to 30 parts of reactive monomer, 4 to 8 parts of photoinitiator, 5 to 15 parts of filler, and 3 to 10 parts of functional additives, wherein the functional additives include at least two of antioxidants, ultraviolet absorbers, leveling agents, and defoamers.

4. The mirror-emitting device according to claim 3, characterized in that, The encapsulating film layer satisfies at least one of the following characteristics: (1) The main resin includes at least one of polyurethane acrylate, epoxy acrylate and silicone-modified acrylate; (2) The reaction monomers include at least one of tripropylene glycol diacrylate, 1,6-hexanediol diacrylate, isobornyl acrylate, trimethylolpropane triacrylate and diethylene glycol diacrylate. (3) The photoinitiator includes at least one of phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide, 1-hydroxy-cyclohexyl-phenyl ketone, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 1-hydroxycyclohexylphenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-dimethylamino-2-benzyl-1-[4-(4-morpholinyl)phenyl]-1-butanone, and 2-isopropylthioxanthonone; (4) The filler includes at least one of nano-silica, nano-alumina, titanium dioxide, magnesium oxide, zinc oxide, calcium carbonate, barium sulfate, and organically modified montmorillonite; (5) The antioxidants include at least one of BASF Irganox 1076, BASF Irganox 1010, BASF Irganox 1135, BASF Irganox 245 and BASF Irganox 1330; (6) The ultraviolet absorber includes at least one of BASF Tinuvin 326, BASF Tinuvin 328, BASF Tinuvin 329, UV-531 and UV-9; (7) The leveling agent includes at least one of BYK-306, BYK-310, BYK-333 and BYK-361N; (8) The defoamer includes at least one of BYK-011, BYK-024, BYK-055, BYK-057 and BYK-141.

5. The mirror-emitting device according to claim 1, characterized in that, The adhesive layer comprises the following components in parts by weight: 30 to 50 parts epoxy resin, 15 to 30 parts UV acrylate, 3 to 10 parts latent curing agent, 5 to 10 parts tackifier, 5 to 15 parts filler, and 1 to 5 parts functional additives; the latent curing agent includes at least one of dicyandiamide, modified amines, and imidazole salts; the tackifier includes at least one of hydrogenated petroleum resin, hydrogenated terpene resin, and rosin ester; and / or, the thickness of the adhesive layer is 20 μm to 50 μm.

6. The mirror-emitting device according to any one of claims 1 to 5, characterized in that, It also includes a moisture-proof layer; the moisture-proof layer is disposed between the adhesive layer and the working surface; the moisture-proof layer covers the light-emitting element and the working surface is exposed on the surface of the light-emitting element.

7. The mirror-emitting device according to any one of claims 1 to 5, characterized in that, It also includes a protective layer; the protective layer is disposed on the surface of the metal plating layer opposite to the encapsulating film layer; the protective layer includes at least one of silicon oxide, aluminum oxide, and zirconium oxide; the thickness of the protective layer is 40 nm to 150 nm; and / or, It also includes a silver ink sealing layer; the silver ink sealing layer covers the sides of the driving substrate, the adhesive layer, the encapsulation film layer and the metal plating layer.

8. A method for fabricating a mirror-emitting device, characterized in that, Includes the following steps: A pre-finished encapsulating film layer is formed on the first release film; An adhesive pre-finished layer is formed on the surface of the encapsulating film pre-finished layer that is opposite to the first release film, and a second release film is disposed on the surface of the adhesive pre-finished layer that is opposite to the encapsulating film pre-finished layer. Remove the first release film and form a metal plating layer on the surface of the encapsulating film pre-finished layer opposite to the adhesive pre-finished layer; A driving substrate is provided, the driving substrate having a working surface, and a light-emitting element is disposed on the working surface; After removing the second release film and attaching the adhesive pre-finished layer to the working surface, perform a hot-press bonding process.

9. The method for fabricating a mirror-emitting device according to claim 8, characterized in that, The hot-press bonding process satisfies at least one of the following characteristics: (1) The hot pressing bonding process includes multiple heat preservation processes, and the temperature and pressure of each heat preservation process are gradually increased; (2) The total duration of the hot-press bonding process is 2h~4h; (3) The maximum heat preservation temperature of the hot pressing bonding process is 135℃~145℃; (4) The pressure range of the hot-press bonding process is 0.2MPa~1.5MPa; (5) Except for the last heat preservation treatment, the time for each heat preservation treatment is 1 min to 20 min; (6) The temperature difference between two consecutive insulation treatments is 20℃~30℃.

10. A display device, characterized in that, The mirror light-emitting device includes the mirror light-emitting device prepared by the method of any one of claims 1 to 7 or any one of claims 8 to 9.

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