Display panel and display device

By designing an isolation structure in the overlapping area of ​​the shielding part in the OLED display panel, the problem of easy breakage of the encapsulation layer in subsequent processes is solved, thereby improving encapsulation performance and product yield.

CN121924964APending Publication Date: 2026-04-24HEFEI VISIONOX TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
HEFEI VISIONOX TECH CO LTD
Filing Date
2024-10-24
Publication Date
2026-04-24

AI Technical Summary

Technical Problem

Existing OLED display products are prone to sealing failure during the packaging process, leading to a decrease in product yield.

Method used

By designing an isolation structure in the display panel, the encapsulation layer of adjacent sub-pixels covers the isolation opening and overlaps the side wall of the isolation structure. There is a shielding part on the side of the isolation structure away from the substrate. The orthogonal projection of the shielding part on the substrate has an overlapping area, which prevents the encapsulation layer from being broken by external force in subsequent processes.

Benefits of technology

It improves the encapsulation performance of the encapsulation layer, reduces the risk of seal failure, and increases product yield.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides a display panel and a display device. The display panel substrate comprises a display area and a non-display area. The isolation structures are arranged on the substrate and at least located in the display area, and a plurality of isolation openings are defined by the isolation structures located in the display area; the display function layer comprises a plurality of light-emitting devices, each light-emitting device comprises a plurality of sub-pixels, and each sub-pixel is at least partially located in the corresponding isolation opening; the packaging layer comprises a plurality of sub-packaging layers, each sub-packaging layer covers the side, away from the substrate, of the corresponding sub-pixel and is in lap joint with the side wall face of the isolation structure, the sub-packaging layer comprises a shielding part extending to the side, away from the substrate, of the isolation structure, and a gap is formed between the shielding part and the side, away from the substrate, of the isolation structure; and the shielding parts corresponding to part of adjacent sub-pixels are constructed to have overlapping areas on orthographic projections of the shielding parts on the substrate. Through the design, the shielding part is prevented from being broken under the action of external force in the subsequent washing / cleaning process, the packaging performance of the packaging layer is improved, and the product yield is improved.
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Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display panel and display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) are organic thin-film electroluminescent devices. They have attracted great attention and are widely used in electronic display products due to their advantages such as low power consumption, high brightness, wide viewing angle, high contrast, and the ability to realize flexible displays.

[0003] However, current electronic display products are prone to packaging failure due to their structural design limitations. Summary of the Invention

[0004] The purpose of this invention is to provide a display panel and a display device to solve the problems mentioned above.

[0005] To achieve the above objectives, this application adopts the following technical solution:

[0006] A first aspect of this disclosure provides a display panel, the display panel comprising:

[0007] The substrate includes a display area and a non-display area;

[0008] An isolation structure is disposed on the substrate and at least located in the display area, wherein the isolation structure located in the display area encloses and forms a plurality of isolation openings;

[0009] The display functional layer includes a plurality of light-emitting devices, each light-emitting device includes a plurality of sub-pixels, and each sub-pixel is at least partially located within the corresponding isolation opening;

[0010] The encapsulation layer includes multiple sub-encapsulation layers. Each sub-encapsulation layer covers the side of the corresponding sub-pixel away from the substrate and overlaps the sidewall of the isolation structure. It also includes a shielding portion extending to the side of the isolation structure away from the substrate. The shielding portion has a gap with the side of the isolation structure away from the substrate. The shielding portions corresponding to some adjacent sub-pixels are configured such that the orthographic projections of the shielding portions on the substrate overlap.

[0011] In one embodiment, a plurality of light-emitting devices are arranged in an array, and the plurality of sub-pixels include a first sub-pixel, a second sub-pixel, and a third sub-pixel. The second sub-pixel and the third sub-pixel are arranged in a column and then placed side by side with the first sub-pixel.

[0012] The occlusion portion corresponding to the second sub-pixel and the occlusion portion corresponding to the third sub-pixel respectively have overlapping areas with the orthographic projection of the occlusion portion corresponding to the first sub-pixel in the same light-emitting device on the substrate, and have overlapping areas with the orthographic projection of the occlusion portion corresponding to the first sub-pixel in the adjacent light-emitting device in the same row on the substrate;

[0013] Preferably, in the same light-emitting device, the gap between the shading portion corresponding to the second sub-pixel and the isolation structure on the side away from the substrate is equal to or approximately equal to the gap between the shading portion corresponding to the third sub-pixel and the isolation structure on the side away from the substrate.

[0014] Preferably, in the same light-emitting device, the orthographic projection of the occluding portion corresponding to the second sub-pixel on the substrate and the orthographic projection of the occluding portion corresponding to the third sub-pixel on the substrate are spaced apart;

[0015] Preferably, in two adjacent light-emitting devices in the same column, the obscuring portion corresponding to the first sub-pixel in the two light-emitting devices is spaced apart on the substrate by the orthogonal projection.

[0016] Preferably, in two adjacent light-emitting devices in the same column, the occlusion portion corresponding to the second sub-pixel in one light-emitting device and the occlusion portion corresponding to the third sub-pixel in the other light-emitting device have an overlapping area on the substrate.

[0017] In one embodiment, the isolation opening includes at least two sidewalls and a curved portion connecting the adjacent sidewalls, wherein the length of the blocking portion at the curved portion is greater than the length of the blocking portion at the sidewall.

[0018] In one embodiment, the isolation structure includes a support portion and a crown portion, the support portion being disposed on the substrate, and the crown portion being disposed on the side of the support portion opposite to the substrate;

[0019] Preferably, the orthographic projection of the crown on the substrate covers the orthographic projection of the support portion on the substrate;

[0020] Preferably, the shielding portion is located on the side of the crown portion opposite to the substrate;

[0021] Preferably, both the support portion and the crown portion are made of metal.

[0022] Preferably, the support portion includes a first sub-support portion and a second sub-support portion, the second sub-support portion is located on the side of the first sub-support portion away from the substrate, and the orthographic projection of the second sub-support portion on the substrate covers the orthographic projection of the first sub-support portion on the substrate.

[0023] In one embodiment, each sub-pixel includes a first electrode, a light-emitting functional layer, and a second electrode. The first electrode is disposed on the substrate and is exposed at least partially through the isolation opening. The light-emitting functional layer is located inside the isolation opening. The second electrode covers the side of the light-emitting functional layer away from the substrate and overlaps the sidewall of the isolation structure.

[0024] Preferably, the first sub-pixel includes a first light-emitting functional layer located within the isolation opening, and the second electrode covers the side of the first light-emitting functional layer facing away from the substrate.

[0025] The plurality of sub-encapsulation layers include a first sub-encapsulation layer corresponding to the first sub-pixel. The first sub-encapsulation layer covers the side of the second electrode away from the substrate and overlaps the sidewall of the corresponding support portion. It also includes a first shielding portion extending to the side of the crown away from the substrate, and the first shielding portion has a gap with the side of the crown away from the substrate.

[0026] Preferably, the second sub-pixel includes a second light-emitting functional layer, the second light-emitting functional layer is located within the isolation opening, and the second electrode covers the second light-emitting functional layer.

[0027] The plurality of sub-encapsulation layers include a second sub-encapsulation layer corresponding to the second sub-pixel, the second sub-encapsulation layer covering the side of the second electrode away from the substrate and overlapping the sidewall of the corresponding support portion, and including a second shielding portion extending to the side of the crown away from the substrate, and the second shielding portion having a gap with the side of the crown away from the substrate.

[0028] Preferably, the third sub-pixel includes a third light-emitting functional layer, the third light-emitting functional layer is located within the isolation opening, and the second electrode covers the third light-emitting functional layer.

[0029] The plurality of sub-encapsulation layers include a third sub-encapsulation layer corresponding to the third sub-pixel, the third sub-encapsulation layer covering the side of the second electrode away from the substrate and overlapping the sidewall of the corresponding support portion, and including a third shielding portion extending to the side of the crown away from the substrate, and the second shielding portion having a gap with the side of the crown away from the substrate.

[0030] In one embodiment, among the light-emitting devices in the same row, the third blocking portion is located on the side of the first blocking portion away from the substrate, and the orthographic projection of the third blocking portion on the substrate overlaps with the orthographic projection of the first blocking portion on the substrate.

[0031] In one embodiment, among the light-emitting devices in the same row, the second blocking portion is located on the side of the first blocking portion away from the substrate, and the orthographic projection of the second blocking portion on the substrate overlaps with the orthographic projection of the first blocking portion on the substrate.

[0032] In one embodiment, among two adjacent light-emitting devices in the same column, the second blocking portion corresponding to one light-emitting device is located on the side of the third blocking portion of the other light-emitting device that is away from the substrate, and the orthographic projection of the third blocking portion on the substrate overlaps with the orthographic projection of the second blocking portion on the substrate.

[0033] In one embodiment, in the same light-emitting device, the orthographic projection of the third blocking portion on the substrate and the orthographic projection of the second blocking portion on the substrate are spaced apart;

[0034] In two adjacent light-emitting devices in the same column, the first blocking portion of the two light-emitting devices is arranged with its orthographic projection on the substrate at intervals.

[0035] In one embodiment, a pixel defining layer is further included, disposed on the side of the isolation structure near the substrate. The pixel defining layer defines a pixel defining opening and is configured to cover the gap between adjacent first electrodes, with a portion of the first electrodes exposed through the pixel defining opening.

[0036] Preferably, the pixel defining layer is mesh-like.

[0037] In one embodiment, the substrate includes a substrate and a driving layer located on the substrate, the driving layer including a pixel driving circuit, the pixel driving circuit being electrically connected to the light-emitting device.

[0038] In one embodiment, the display panel further includes at least one planarization layer, on which a via is provided, and the first electrode passes through the via and is electrically connected to the pixel driving circuit.

[0039] Based on the same concept and approach, a second aspect of this disclosure provides a display device that includes a display panel as described above.

[0040] The advantages of this invention are: the display panel proposed in this application optimizes the structure of the encapsulation layer of the sub-pixels of the light-emitting device, with adjacent sub-pixels sharing an isolation structure. The encapsulation layer of adjacent sub-pixels covers the corresponding isolation openings and overlaps with the sidewalls of the isolation structure, and has a partially extended shielding portion that extends to the side of the isolation structure away from the substrate. The shielding portion of the sub-pixel is constructed such that its orthogonal projection on the substrate has a partially overlapping area. This design avoids the shielding portion from breaking under external force during subsequent water washing / cleaning processes, thereby improving the encapsulation performance of the encapsulation layer and increasing product yield. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 This is a schematic diagram of the structure of a display panel according to an embodiment of this application.

[0043] Figure 2 for Figure 1 An enlarged schematic diagram of point a in the middle.

[0044] Figure 3 This is a schematic cross-section of a display panel with the display function layer hidden, according to an embodiment of this application.

[0045] Figure 4 for Figure 2 Schematic diagram of the cross section at point b.

[0046] Figure 5 for Figure 2 Schematic diagram of the cross section at point c.

[0047] Figure 6 for Figure 2 Schematic diagram of the cross section at point d. Detailed Implementation

[0048] The following description, with reference to the accompanying drawings, illustrates preferred embodiments of the present invention, demonstrating its implementability. These embodiments provide a complete overview of the invention for those skilled in the art, making its technical content clearer and easier to understand. The present invention can be embodied in many different forms of embodiments, and the scope of protection of the present invention is not limited to the embodiments mentioned herein.

[0049] In the accompanying drawings, components with the same structure are indicated by the same numerical designation, and components with similar structures or functions are indicated by similar numerical designations. The dimensions and thicknesses of each component shown in the drawings are arbitrary, and the present invention does not limit the dimensions and thicknesses of each component. To make the illustrations clearer, the thickness of components is appropriately exaggerated in some places in the drawings.

[0050] Furthermore, the following descriptions of the embodiments of the invention are made with reference to the accompanying illustrations, illustrating specific embodiments in which the invention can be implemented. Directional terms used in this invention, such as "upper," "lower," "front," "rear," "left," "right," "inner," "outer," and "side," are merely directional references to the accompanying drawings. Therefore, the use of directional terms is for better and clearer explanation and understanding of the invention, and does not indicate or imply that the referred device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0051] When a component is described as being "on" another component, the component may be placed directly on the other component; alternatively, there may be an intermediate component on which the component is placed, and the intermediate component is placed on the other component. When a component is described as being "installed to" or "connected to" another component, both can be understood as being directly "installed" or "connected" to, or as being indirectly "installed to" or "connected to" another component via an intermediate component.

[0052] In related display technologies, in order to achieve high resolution and color in OLED (Organic Light-Emitting Diode), and to better address issues such as low resolution of the OLED cathode film and low device yield, an isolation structure has been introduced. This isolation structure defines the isolation opening, and then light-emitting devices are fabricated (each light-emitting device includes multiple sub-pixels, which are arranged in a preset pattern, such as red and green sub-pixels arranged in a row and then combined with blue sub-pixels in a row). In the process of sub-pixel fabrication, no metal mask is used. Instead, an organic light-emitting thin film is deposited over the entire surface, and a cathode is deposited on the light-emitting thin film (the light-emitting thin film and cathode cover the ends of the isolation structure). Then, the sub-pixels are fabricated by etching.

[0053] The inventors discovered in actual production that during sub-pixel fabrication, an organic film layer for light emission is deposited across the entire surface, followed by a cathode film layer. An encapsulation layer (CVD film layer) is then deposited on the cathode film layer. The encapsulation layer is then patterned (e.g., using dry etching to pattern the CVD film layer, etching away unwanted portions, followed by wet etching to remove irrelevant areas of the cathode film layer). Sub-pixels are then fabricated through processes such as peeling and washing. In this method, a portion of the encapsulation layer is suspended at the end of the isolation structure (this portion does not contact the surface of the isolation structure end, i.e., the CVD film layer overlaps the isolation structure (VSS metal surface) with a suspended portion). This suspended portion is prone to breakage under external force during subsequent peeling and washing processes, leading to seal failure at the breakage point. Alternatively, the suspended portion may vibrate, causing seal failure at the overlap between the CVD film layer and the isolation structure, resulting in dark spots and affecting product yield.

[0054] To address this issue, the applicant proposes a display panel and a display device. This display panel can avoid the problem of encapsulation layer failure.

[0055] like Figure 1 The diagram shown is a schematic representation of the structure of a display panel according to an embodiment of this application.

[0056] The display panel 100 includes a display area 110 and a non-display area 120 (also called a border area) located outside the display area 110.

[0057] The display area 110 includes regularly arranged light-emitting devices 111, each of which includes multiple sub-pixels, such as red sub-pixels 111b, green sub-pixels 111c, and blue sub-pixels 111a. Red sub-pixels 111b and green sub-pixels 111c are arranged in a row and then placed side-by-side with blue sub-pixels 111a. During fabrication, the sub-pixels are deposited onto the entire substrate by vapor deposition combined with etching. In practice, the width of the sub-pixels and / or the gap between adjacent sub-pixels can be further reduced, thereby increasing the pixel density to greater than 400 PPI (e.g., 403 PPI, Pixels Per Inch). This overcomes the current limitation of difficult-to-increase pixel density in OLED display panels and avoids the problems of poor product quality and high mask usage costs caused by repeated mask stretching and fixing, mask sagging, etc., in mask-based solutions. Preferably, in this embodiment, blue sub-pixels, red sub-pixels, and green sub-pixels are fabricated sequentially. In other embodiments, blue sub-pixels, green sub-pixels, and red sub-pixels can be prepared sequentially, or the preparation order of the sub-pixels is not limited.

[0058] Figure 2 for Figure 1The enlarged view at point a shows the arrangement of subpixels when there are 4 light-emitting devices (2 rows * 2 columns). In each light-emitting device 111, the red subpixel 111b and the green subpixel 111c are arranged in a column and then placed side by side with the blue subpixel 111a.

[0059] In the non-display area of ​​the display panel, a binding area (not shown) is set up. This binding area is used to mount binding components in subsequent processes.

[0060] Figure 3 The diagram shown is a cross-sectional view of a display panel according to an embodiment of this application, with the display function layer hidden.

[0061] The display panel includes a substrate, a pixel defining layer 152, a display function layer, an isolation structure 160, and an encapsulation layer.

[0062] The substrate includes a substrate 130 and a driving circuit layer 140 and a planarization layer 150 located on the substrate. The substrate can be a flexible substrate, and its material can be selected from one or a mixture of polyimide (PI), polyethylene naphthalate (PEN) or polyethylene terephthalate (PET). The substrate can also be a rigid substrate, which can be selected from glass.

[0063] A driving layer 140 covers both the display area and the non-display area. The portion of the driving layer 140 corresponding to the display area includes a pixel driving circuit, and a display function layer (not shown) is located on this driving layer. The pixel driving circuit may include multiple transistors (TFTs), capacitors, etc., for example, configured as a 7T1C circuit, 7T2C circuit, 8T1C circuit, 8T2C circuit, etc., without limitation, as long as it drives the light-emitting device. The pixel driving circuit is electrically connected to the light-emitting device to control the switching state and brightness of the light-emitting device.

[0064] The planarization layer 150 is disposed on the side of the driving layer 140 away from the substrate at 130. A first electrode 151 is disposed on the side of the planarization layer 150 away from the substrate at 130. The planarization layer 150 covers the display area. Preferably, the planarization layer 150 covers both the display area and the non-display area. In one embodiment, the first electrode 151 is embedded in the planarization layer 150 on the side away from the substrate at 130, exposing its top surface.

[0065] The pixel defining layer 152 is disposed on the planarization layer 150 (such as on the planarization layer 150 in the display area). The pixel defining layer defines a pixel defining opening 152a. The pixel defining layer 152 is configured to cover the gap between adjacent first electrodes 151, and the pixel defining opening 152a exposes the first electrodes 151. The pixel defining layer 152 is mesh-like, with the first electrodes 151 exposed at the mesh sections.

[0066] An isolation structure 160 is disposed on the side of the pixel defining layer 152 facing away from the substrate. The isolation structure 160 in the display area encloses and forms a plurality of isolation openings 163, which correspond to and communicate with the pixel defining openings 152a. Each isolation opening 163 includes at least two sidewalls and a curved portion 111a0 connecting adjacent sidewalls. The isolation structure 160 includes a support portion 161 and a crown portion 162. The support portion 161 is located on the pixel defining layer 152, and the crown portion 162 is disposed on the side of the support portion 161 facing away from the substrate. The width of the crown portion 162 is greater than the width of the support portion 161, meaning that the projection (orthographic projection) of the crown portion 162 onto the substrate covers the projection of the support portion 161 onto the substrate. The isolation structure 160 is made of a metallic material, such as molybdenum, aluminum, or titanium. Preferably, the cross-section of the support portion is V-shaped or trumpet-shaped. Furthermore, the support portion includes a first sub-support portion and a second sub-support portion. The second sub-support portion is located on the side of the first sub-support portion facing away from the substrate. The orthographic projection of the second sub-support portion on the substrate covers the orthographic projection of the first sub-support portion on the substrate. For example, the crown portion is made of titanium, the second sub-support portion is made of aluminum, and the first sub-support portion is made of molybdenum. The composition and preparation of the isolation structure (or partition structure or isolation pillar) mentioned in this disclosure are detailed in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, and PCT / CN2024. Further descriptions are provided in / 099072, CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A for reference.

[0067] The display panel includes a display functional layer comprising a plurality of light-emitting devices 111, each light-emitting device 111 comprising a plurality of sub-pixels, at least a portion of each sub-pixel being located in a corresponding isolation opening. Specifically, each sub-pixel includes a first electrode 151, a light-emitting functional layer, and a second electrode. The light-emitting functional layer is located on the side of the first electrode facing away from the substrate and is at least partially located within the isolation opening 163. The second electrode covers the light-emitting functional layer and overlaps the side wall of the support portion 161 (the second electrode is electrically connected to the support portion). The first electrode may be an anode, and the second electrode may be a cathode. The light-emitting functional layer includes stacked hole injection layers, hole transport layers, electron blocking layers, electron injection layers, electron transport layers, and light-emitting layers. In some embodiments of this disclosure, some film layers in the light-emitting functional layer, such as the light-emitting layer, can be prepared using a non-evaporation method, such as inkjet printing. The specific method can be selected based on the material of these film layers. For example, if these film layers are polymer materials and evaporation is not applicable, inkjet printing can be used to prepare them.

[0068] refer to Figure 2 Multiple light-emitting devices 111 are arranged in an array, and multiple sub-pixels include a first sub-pixel 111a, a second sub-pixel 111b, and a third sub-pixel 111c. The first sub-pixel emits blue light and is also called the blue sub-pixel; the second sub-pixel 111b emits red light and is also called the red sub-pixel; and the third sub-pixel 111c emits green light and is also called the green sub-pixel. Within a light-emitting device, the second sub-pixel 111b and the third sub-pixel 111c are arranged in a column and then placed side by side with the first sub-pixel 111a. Specifically, the second sub-pixel 111b and the third sub-pixel 111c are arranged along the column direction (y-direction), the second sub-pixel 111b and the first sub-pixel 111a are arranged along the row direction (x-direction), and the third sub-pixel 111c is also arranged along the row direction (x-direction) with the first sub-pixel 111a. Both the column direction (y-direction) and the row direction (x-direction) are parallel to the surface of the substrate.

[0069] refer to Figures 3-6The display panel includes an encapsulation layer, which includes multiple sub-encapsulation layers. Each sub-encapsulation layer covers the side of a corresponding sub-pixel away from the substrate and overlaps the sidewall of the isolation structure 160. It also includes a shielding portion extending to the side of the isolation structure away from the substrate. The shielding portion has a gap with the side of the isolation structure away from the substrate. At least some adjacent sub-pixels have shielding portions configured such that their orthographic projections on the substrate overlap. For example, the shielding portions corresponding to the second sub-pixel 111b and the third sub-pixel 111c overlap with the orthographic projections on the substrate of the shielding portions corresponding to the first sub-pixel 111a within the same light-emitting device 111, and also overlap with the orthographic projections on the substrate of the shielding portions corresponding to the first sub-pixel 111a within adjacent light-emitting devices 111 in the same row. In the same light-emitting device 111, the second sub-pixel 111b... The gap between the shading portion corresponding to 11b and the side of the isolation structure 160 facing away from the substrate is equal to or approximately equal to the gap between the shading portion corresponding to the third sub-pixel 111c and the side of the isolation structure 160 facing away from the substrate. In the same light-emitting device 111, the orthographic projection of the shading portion corresponding to the second sub-pixel 111b on the substrate and the orthographic projection of the shading portion corresponding to the third sub-pixel 111c on the substrate are spaced apart. In two adjacent light-emitting devices 111 in the same column, the orthographic projections of the shading portions corresponding to the first sub-pixel 111a in the two light-emitting devices are spaced apart. Preferably, in two adjacent light-emitting devices in the same column, the orthographic projections of the shading portion corresponding to the second sub-pixel 111b in one light-emitting device 111 and the shading portion corresponding to the third sub-pixel 111c in the other light-emitting device 111 overlap on the substrate.

[0070] Each sub-encapsulation layer covers the side of the second electrode away from the substrate and overlaps the sidewall of the isolation structure. Specifically, the sidewall refers to the side of the isolation structure facing the isolation opening, and includes a partial shielding portion extending to the isolation structure (crown) away from the substrate. The shielding portions of at least some adjacent sub-pixels are staggered, with the shielding portions corresponding to at least some adjacent sub-pixels constructed such that their orthographic projections on the substrate overlap. For example, the orthographic projections of the shielding portion corresponding to the red sub-pixel and the shielding portion corresponding to the blue sub-pixel on the substrate partially overlap. This design prevents the shielding portion from breaking under external force during subsequent washing / cleaning processes. Breakage at the breakage point can easily lead to seal failure and dark spots, thereby improving the encapsulation performance of the encapsulation layer and reducing the impact on product yield. The encapsulation layer seals the red, green, and blue sub-pixels individually.

[0071] For example, the multiple sub-encapsulation layers include a first sub-encapsulation layer 111a3 corresponding to the first sub-pixel 111a, a second sub-encapsulation layer 111b3 corresponding to the second sub-pixel 111b, and a third sub-encapsulation layer 111c3 corresponding to the third sub-pixel 111. The corresponding occlusion portion also includes a first occlusion portion 111a31, a second occlusion portion 111b31, and a third occlusion portion 111c31.

[0072] Next, combine Figures 4 to 6 And refer to Figure 2 This describes the structure of the encapsulation layer corresponding to the sub-pixel.

[0073] The first sub-pixel 111a has a light-emitting functional layer called the first light-emitting functional layer 111a1. The second electrode 111a2 of the first sub-pixel covers the first light-emitting functional layer 111a1. The first sub-encapsulation layer 111a3 covers the second electrode 111a2 and overlaps the side wall of the support portion 161. The first shielding portion 111a31 of the first sub-encapsulation layer 111a3 extends to the side of the crown portion 162 away from the substrate, and there is a gap between the first shielding portion 111a31 of the first sub-encapsulation layer 111a3 and the crown portion 162.

[0074] The second sub-pixel 111b has a light-emitting functional layer called the second light-emitting functional layer 111b1. The second electrode 111b2 of the second sub-pixel covers the second light-emitting functional layer 111b1. The second sub-encapsulation layer 111b3 covers the second electrode 111b2 of the second sub-pixel and overlaps the side wall of the corresponding support portion 161. The second shielding portion 111b31 of the second sub-encapsulation layer 111b3 extends to the side of the corresponding crown portion 162 away from the substrate, and there is a gap between the second shielding portion 111b31 and the side of the corresponding crown portion 162 away from the substrate.

[0075] The third sub-pixel 111c has a light-emitting functional layer called the third light-emitting functional layer 111c1. The second electrode 111c2 of the third sub-pixel 111c covers the third light-emitting functional layer 111c1. The third sub-encapsulation layer covers the second electrode 111c2 of the third sub-pixel and overlaps the sidewall of the corresponding support portion 161. The third shielding portion 111c31 of the third sub-encapsulation layer 111c3 extends to the side of the corresponding crown portion 162 away from the substrate, and there is a gap between the third shielding portion 111c31 of the third sub-encapsulation layer 111c3 and the crown portion 162. Preferably, the first sub-encapsulation layer, the second sub-encapsulation layer, and the third sub-encapsulation layer (collectively referred to as encapsulation layers) can be prepared by deposition, also known as CVD film layers.

[0076] Figure 4 for Figure 2A schematic cross-section of the light-emitting device at point b. A schematic cross-section of the first sub-pixel 111a and the third sub-pixel 111c within the light-emitting device, showing an isolation structure between the first and third sub-pixels.

[0077] The first sub-encapsulation layer 111a3 of the first sub-pixel 111a covers the isolation opening and overlaps with the support portion 161 and extends from the support portion 161 to the side of the crown portion 162 away from the substrate (upper surface side). The first shielding portion 111a31 located on the side of the crown portion 162 away from the substrate (upper surface side) has a gap with the crown portion 162.

[0078] The third sub-encapsulation layer 111c3 of the third sub-pixel 111c covers the isolation opening and overlaps with the support portion 161 and the side (upper surface side) of the crown portion 162 that is away from the substrate. The third blocking portion 111c31 on the side (upper surface side) of the crown portion 162 away from the substrate has a gap with the crown portion 162. The orthographic projection of the first blocking portion 111a31 of the first sub-encapsulation layer 111a3 on the substrate and the orthographic projection of the third blocking portion on the substrate have a partially overlapping area. The third blocking portion 111c31 is located on the side of the first blocking portion 111a31 that is away from the substrate. Based on the same idea, the third blocking portion in the third sub-pixel and the first blocking portion in the first sub-pixel of the adjacent light-emitting device (in the same row) adopt a similar staggered structure. In the light-emitting devices located in the same row, the orthographic projection of the third blocking portion 111c31 on the substrate overlaps with the orthographic projection of the first blocking portion 111a31 on the substrate, and the third blocking portion 111c31 is located on the side of the first blocking portion 111a31 that faces away from the substrate. This design prevents the first / third blocking portion from breaking under external force during subsequent water washing / cleaning processes, as the breakage point is prone to seal failure and the generation of dark spots.

[0079] Preferably, the length of the shielding portion at the bend 111a0 is greater than the length of the shielding portion at the corresponding sidewall. It should be noted that in this embodiment, the length of the shielding portion specifically refers to the direction parallel to the surface of the substrate (specifically, the x-direction). The distance between the side of the shielding portion closest to the isolation opening and the side of the shielding portion furthest from the opening is also considered. For example, the length of the first shielding portion 111a31 at the bend / corner 111a0 is greater than the length of the first shielding portion 111a31 at the corresponding sidewall. This prevents the first shielding portion at the bend / corner 111a0 from breaking. Similarly, the length of the second shielding portion 111b31 at the bend / corner 111a0 is greater than the length of the second shielding portion 111b31 at the corresponding sidewall. The length of the third shielding portion 111c31 at the bend / corner 111a0 is greater than the length of the third shielding portion 111c31 at the corresponding sidewall. The first, second, and third sub-pixels are fabricated in an irregular square shape (roughly square), with beveled corners, bends, curves, and straight sections. The length of the shading portion at the bends is longer than the length of the shading portion at the straight section. This avoids CVD film breakage at the four corners of the square shape, reducing the risk of seal failure.

[0080] Based on the same concept, in the light-emitting devices on the same row, the first sub-encapsulation layer 111a3 covers the isolation opening and overlaps the side wall of the support, and includes a first shielding portion 111a31 extending to the side of the crown away from the substrate.

[0081] The second sub-encapsulation layer 111b3 covers the isolation opening and overlaps the side wall of the support portion 161, and includes a second shielding portion 111b31 extending to the side of the crown facing away from the substrate. The second shielding portion 111b31 is located on the side of the first shielding portion 111a31 facing away from the substrate (structural reference). Figure 4 Furthermore, the orthographic projection of the second shielding portion on the substrate overlaps with the orthographic projection of the first shielding portion on the substrate. This design prevents the first / third shielding portion from breaking under external force during subsequent water washing / cleaning processes, as the breakage point is prone to seal failure and the generation of dark spots.

[0082] Furthermore, in two adjacent light-emitting devices in the same column, the first blocking portion 111a31 of the two light-emitting devices is spaced apart on the substrate by its orthogonal projection.

[0083] Figure 5 for Figure 2 A cross-sectional view of the light-emitting device at point c. A schematic diagram showing the structure of the third sub-pixel (green sub-pixel) in one light-emitting device and the second sub-pixel (red sub-pixel) in the other light-emitting device, in two adjacent light-emitting devices on the same column, with an isolation structure between the second and third sub-pixels.

[0084] In a light-emitting device, the third sub-encapsulation layer 111c3 of the third sub-pixel covers the isolation opening and overlaps the support portion 161 and the side wall extending from the support portion 161 to the crown portion 162. The third shielding portion 111c31 is located on the side of the crown portion 162 away from the substrate (upper surface side), and there is a gap between the third shielding portion 111c31 and the crown portion 162.

[0085] In another light-emitting device, the second sub-encapsulation layer 111b3 of the second sub-pixel covers the isolation opening and overlaps with the support portion 161 and extends from the side wall surface 161 of the support portion to the side of the crown portion 162 facing away from the substrate (upper surface side). The second blocking portion 111b31 located on the side of the crown portion 162 facing away from the substrate (upper surface side) has a gap with the crown portion 162, and the orthographic projection of the second blocking portion 111b31 on the substrate and the orthographic projection of the third blocking portion 111c31 on the substrate have a partially overlapping area. The second blocking portion 111b31 is located on the side of the third blocking portion 111c31 facing away from the substrate 10. In two adjacent light-emitting devices in the same column, the second shielding part 111b31 of one light-emitting device is located on the side of the third shielding part 111c31 of the other light-emitting device that is away from the substrate. The orthographic projection of the third shielding part 111b31 on the substrate overlaps with the orthographic projection of the second shielding part 111b31 on the substrate. This design avoids the first / third shielding part from breaking under external force during subsequent water washing / cleaning processes. At the breakage point, the seal is prone to failure, resulting in dark spots.

[0086] Figure 6 for Figure 2 The diagram shows a cross-section of the light-emitting device at point d. In the same light-emitting device, the second sub-encapsulation layer 111b3 of the second sub-pixel and the third sub-encapsulation layer 111c3 of the third sub-pixel are spaced apart. Furthermore, in the same light-emitting device, the gap between the occlusion portion 111b31 of the second sub-pixel and the isolation structure 160 on the side facing away from the substrate is equal to or approximately equal to the gap between the occlusion portion 111c31 of the third sub-pixel and the isolation structure 160 on the side facing away from the substrate. In other embodiments, the second occlusion portion 111b31 of the second sub-encapsulation layer 111b3 of the second sub-pixel and the third occlusion portion 111c31 of the third sub-pixel's third sub-encapsulation layer 111c3 of the third sub-pixel are staggered.

[0087] The following describes a method for manufacturing a display panel according to an embodiment of this application.

[0088] The preparation method includes the following steps:

[0089] S10. A planarization layer is deposited on a substrate, which may cover the display area for light emission and the bezel area surrounding the display area. The substrate may be a flexible substrate (such as a flexible substrate) or a rigid substrate (such as glass).

[0090] S20. A first conductive layer is formed on the planarization layer and then patterned to form a first electrode. This step includes forming the first conductive layer on the side of the planarization layer away from the substrate by means of deposition, sputtering, or evaporation, and then etching to obtain the first electrode. The first electrode covers the display area and is an anode.

[0091] S30. An insulating layer is deposited on the planarization layer where the first electrode is formed, and a patterning process is performed on the portion of the insulating layer corresponding to the display area to form a pixel defining layer. The planar shape of the pixel defining layer is grid-like to expose the first electrode. The thickness of the pixel defining layer is between 100nm and 1000nm (the thickness in the display area and the thickness in the border area can be different or the same). In the border area, the pixel defining layer can serve as a protective layer.

[0092] S40. An isolation functional film layer is deposited on the pixel defining layer, and a patterning process is performed on the isolation functional film layer located in the display area to form an isolation structure. The isolation structure includes a support portion 161, and the side of the support portion 161 away from the pixel defining layer has a crown portion 162, which surrounds / defines a plurality of isolation openings 163.

[0093] S50. A first light-emitting functional film layer and a second conductive layer of the first sub-pixel are deposited on the entire surface of the isolation functional film layer, and a first sub-encapsulation layer (such as by vapor deposition, also known as CVD film layer) is deposited on the second conductive layer. The first light-emitting functional film layer and the second electrode are located in the isolation opening and at the end of the crown away from the first electrode. The first sub-encapsulation layer is deposited on the entire surface, and a photoresist solution is coated on the first sub-encapsulation layer. The photoresist of the first sub-pixel area is retained after development.

[0094] S60. The first sub-encapsulation layer of the first sub-pixel region is patterned using an etching method. The length of the first occluding portion of the first sub-encapsulation layer in the x / y direction can be set during patterning. Following the same approach, the lengths of the second occluding portion of the second sub-encapsulation layer and the third occluding portion of the third sub-encapsulation layer in the x / y direction can also be set during patterning. Preferably, this patterning process can utilize a mask.

[0095] S70. Fabricate the second electrode of the first sub-pixel. This step involves removing the second conductive layer outside the first sub-pixel region using a wet etching method.

[0096] S80. Remove the first light-emitting functional film layer outside the first sub-pixel area by peeling and cleaning. Then repeat steps S50-S80 in a similar manner to prepare the second sub-pixel (when preparing the second sub-pixel, the second light-emitting functional film layer and the second conductive layer of the second sub-pixel are vapor-deposited on the entire surface of the second sub-pixel in step S50) and the third sub-pixel (when preparing the third sub-pixel, the third light-emitting functional film layer and the second conductive layer of the third sub-pixel are vapor-deposited on the entire surface of the third sub-pixel in step S50).

[0097] In one embodiment, after the light-emitting device is fabricated, a polarizing layer is stacked on the display functional layer. The structure of the polarizing layer can be an existing structure.

[0098] In one embodiment, a touch layer is further stacked on the polarizing layer. The touch layer may employ an existing structure.

[0099] It should be noted that the display panel can also include other functional structures. For example, the display panel can also include a touch structure to provide touch functionality. For example, the touch structure can be a touch panel or a touch layer. The touch panel can be bonded into the display panel, or the touch layer can be directly fabricated on the encapsulation layer of the display panel, which is beneficial for the thinner and lighter design of the display panel.

[0100] Other embodiments of this application provide a display device including the display panel described in the above embodiments. The pixel density of this display device ranges from 400 PPI to 7000 PPI, making it suitable for scenarios such as televisions and laptops, and also suitable for use in micro-display products (such as AR and VR). Furthermore, this display device can be any product or component with display functionality, such as a television, digital camera, mobile phone, watch, tablet computer, laptop computer, navigator, or console.

[0101] Although this application has been described in conjunction with specific embodiments thereof, many substitutions, modifications and variations of these embodiments will be apparent to those skilled in the art from the foregoing description.

[0102] It should be noted that the above description describes some embodiments of this application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in a different order than that shown in the above embodiments and still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0103] The embodiments of this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.

Claims

1. A display panel, characterized in that, include: The substrate includes a display area and a non-display area; An isolation structure is disposed on the substrate and at least located in the display area, wherein the isolation structure located in the display area encloses and forms a plurality of isolation openings; The display functional layer includes a plurality of light-emitting devices, each of the light-emitting devices includes a plurality of sub-pixels, and each sub-pixel is at least partially located within a corresponding isolation opening; The encapsulation layer includes multiple sub-encapsulation layers. Each sub-encapsulation layer covers the side of the corresponding sub-pixel away from the substrate and overlaps the sidewall of the isolation structure. It also includes a shielding portion extending to the side of the isolation structure away from the substrate. The shielding portion has a gap with the side of the isolation structure away from the substrate. The shielding portions corresponding to some adjacent sub-pixels are configured such that the orthographic projections of the shielding portions on the substrate overlap.

2. The display panel as described in claim 1, characterized in that, The plurality of light-emitting devices are arranged in an array, and the plurality of sub-pixels include a first sub-pixel, a second sub-pixel, and a third sub-pixel. The second sub-pixel and the third sub-pixel are arranged in a row and then placed side by side with the first sub-pixel. The occlusion portion corresponding to the second sub-pixel and the occlusion portion corresponding to the third sub-pixel respectively have overlapping areas with the orthographic projection of the occlusion portion corresponding to the first sub-pixel in the same light-emitting device on the substrate, and have overlapping areas with the orthographic projection of the occlusion portion corresponding to the first sub-pixel in the adjacent light-emitting device in the same row on the substrate; Preferably, in the same light-emitting device, the gap between the shading portion corresponding to the second sub-pixel and the isolation structure on the side away from the substrate is equal to or approximately equal to the gap between the shading portion corresponding to the third sub-pixel and the isolation structure on the side away from the substrate. Preferably, in the same light-emitting device, the orthographic projection of the occluding portion corresponding to the second sub-pixel on the substrate and the orthographic projection of the occluding portion corresponding to the third sub-pixel on the substrate are spaced apart; Preferably, in two adjacent light-emitting devices in the same column, the obscuring portion corresponding to the first sub-pixel in the two light-emitting devices is spaced apart on the substrate by the orthogonal projection. Preferably, in two adjacent light-emitting devices in the same column, the occlusion portion corresponding to the second sub-pixel in one light-emitting device and the occlusion portion corresponding to the third sub-pixel in the other light-emitting device have an overlapping area on the substrate.

3. The display panel as described in claim 2, characterized in that, The isolation opening includes at least two sidewalls and a curved portion connecting the adjacent sidewalls, wherein the length of the blocking portion at the curved portion is greater than the length of the blocking portion at the sidewall.

4. The display panel as described in claim 2, characterized in that, The isolation structure includes a support portion and a crown portion. The support portion is disposed on the substrate, and the crown portion is disposed on the side of the support portion opposite to the substrate. Preferably, the orthographic projection of the crown on the substrate covers the orthographic projection of the support portion on the substrate; Preferably, the shielding portion is located on the side of the crown portion opposite to the substrate; Preferably, both the support portion and the crown portion are made of metal. Preferably, the support portion includes a first sub-support portion and a second sub-support portion, the second sub-support portion is located on the side of the first sub-support portion away from the substrate, and the orthographic projection of the second sub-support portion on the substrate covers the orthographic projection of the first sub-support portion on the substrate.

5. The display panel as described in claim 4, characterized in that, Each sub-pixel includes a first electrode, a light-emitting functional layer, and a second electrode. The first electrode is disposed on the substrate and is exposed at least partially through the isolation opening. The light-emitting functional layer is located inside the isolation opening. The second electrode covers the side of the light-emitting functional layer away from the substrate and overlaps the side wall of the isolation structure. Preferably, the first sub-pixel includes a first light-emitting functional layer located within the isolation opening, and the second electrode covers the side of the first light-emitting functional layer facing away from the substrate. The plurality of sub-encapsulation layers include a first sub-encapsulation layer corresponding to the first sub-pixel. The first sub-encapsulation layer covers the side of the second electrode away from the substrate and overlaps the sidewall of the corresponding support portion. It also includes a first shielding portion extending to the side of the crown away from the substrate, and the first shielding portion has a gap with the side of the crown away from the substrate. Preferably, the second sub-pixel includes a second light-emitting functional layer, the second light-emitting functional layer is located within the isolation opening, and the second electrode covers the second light-emitting functional layer. The plurality of sub-encapsulation layers include a second sub-encapsulation layer corresponding to the second sub-pixel. The second sub-encapsulation layer covers the side of the second electrode away from the substrate and overlaps the sidewall of the corresponding support portion. It also includes a second shielding portion extending to the side of the crown away from the substrate, and the second shielding portion has a gap with the side of the crown away from the substrate. Preferably, the third sub-pixel includes a third light-emitting functional layer, the third light-emitting functional layer is located within the isolation opening, and the second electrode covers the third light-emitting functional layer. The plurality of sub-encapsulation layers include a third sub-encapsulation layer corresponding to the third sub-pixel, the third sub-encapsulation layer covering the side of the second electrode away from the substrate and overlapping the sidewall of the corresponding support portion, and including a third shielding portion extending to the side of the crown away from the substrate, and the second shielding portion having a gap with the side of the crown away from the substrate.

6. The display panel as described in claim 5, characterized in that, In the light-emitting devices located in the same row, the third blocking portion is located on the side of the first blocking portion away from the substrate, and the orthographic projection of the third blocking portion on the substrate overlaps with the orthographic projection of the first blocking portion on the substrate.

7. The display panel as described in claim 5, characterized in that, In the light-emitting devices located in the same row, the second blocking portion is located on the side of the first blocking portion away from the substrate, and the orthographic projection of the second blocking portion on the substrate overlaps with the orthographic projection of the first blocking portion on the substrate.

8. The display panel as described in claim 5, characterized in that, In two adjacent light-emitting devices in the same column, the second blocking portion corresponding to one light-emitting device is located on the side of the third blocking portion of the other light-emitting device that is away from the substrate, and the orthographic projection of the third blocking portion on the substrate overlaps with the orthographic projection of the second blocking portion on the substrate.

9. The display panel as described in claim 5, characterized in that, In the same light-emitting device, the orthographic projection of the third blocking portion on the substrate and the orthographic projection of the second blocking portion on the substrate are arranged at intervals; In two adjacent light-emitting devices in the same column, the first blocking portion of the two light-emitting devices is arranged with its orthographic projection on the substrate at intervals.

10. The display panel as claimed in claim 5, characterized in that, It also includes a pixel defining layer disposed on the side of the isolation structure close to the substrate. The pixel defining layer defines a pixel defining opening. The pixel defining layer is configured to cover the gap between adjacent first electrodes, and a portion of the first electrodes are exposed through the pixel defining opening. Preferably, the pixel defining layer is mesh-like.

11. The display panel as described in claim 5, characterized in that, The substrate includes a substrate and a driving layer located on the substrate. The driving layer includes a pixel driving circuit, which is electrically connected to the light-emitting device.

12. The display panel as claimed in claim 11, characterized in that, The display panel further includes at least one planarization layer, on which a via is provided, and the first electrode passes through the via and is electrically connected to the pixel driving circuit.

13. A display panel, characterized in that, include: The substrate includes a display area and a non-display area; An isolation structure is disposed on the substrate and at least located in the display area. The isolation structure located in the display area encloses and forms a plurality of isolation openings. The isolation openings include at least two sidewalls and a curved portion connecting adjacent sidewalls. The display functional layer includes a plurality of light-emitting devices, each of the light-emitting devices includes a plurality of sub-pixels, and each sub-pixel is at least partially located within a corresponding isolation opening; The encapsulation layer includes multiple sub-encapsulation layers, each sub-encapsulation layer being located on the side of the sub-pixel facing away from the substrate and overlapping the sidewall of the isolation structure, and including a shielding portion extending to the side of the isolation structure facing away from the substrate, wherein the length of the shielding portion at the bend is greater than the length of the shielding portion at the sidewall.

14. The display panel as claimed in claim 13, characterized in that, At least some of the occlusion portions of the adjacent sub-pixels are configured such that the orthographic projections of the occlusion portions on the substrate have overlapping regions.

15. A display device, characterized in that, Includes the display panel as described in any one of claims 1-14.

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