Light-emitting display device, electronic device, and method of manufacturing light-emitting display device

Abstract

The invention provides a light emitting display device, an electronic device including the same, and a method of manufacturing the light emitting display device. The light emitting display device includes a substrate, a transistor, an insulating layer, a pixel electrode, a pixel defining layer, a spacer, and a protective layer. The transistor is on the substrate, and the insulating layer is on the transistor. The pixel electrode is on the insulating layer and is electrically connected to the transistor. The pixel defining layer is on the insulating layer and has an opening overlapping the pixel electrode. A spacer is on the pixel defining layer, and a protective layer is on the spacer. The protective layer includes a first layer on the spacer and a second layer on the first layer.

Description

Technical Field

[0001] This disclosure relates to a light-emitting display device and a method for manufacturing a light-emitting display device, and more specifically, to a light-emitting display device including a light-emitting device and a method for manufacturing a light-emitting display device including a light-emitting device. Background Technology

[0002] A light-emitting display device (also referred to herein as a display device) may include light-emitting devices corresponding to pixels. An image can be displayed by controlling the brightness of each of the light-emitting devices included in the light-emitting display device. Unlike light-receiving display devices such as liquid crystal displays, light-emitting display devices do not require a light source such as a backlight, thus reducing their thickness and weight. Furthermore, image quality can be improved due to the high brightness, contrast, color reproduction, and response speed of light-emitting display devices.

[0003] To provide high-quality images, light-emitting display devices are used in a variety of electronic devices such as mobile devices (such as smartphones, tablets, or laptops), monitors, and televisions, as well as in automotive display devices. Summary of the Invention

[0004] When forming a light-emitting layer in a light-emitting display device, a mask can be used. The mask can be supported by spacers. The spacers supporting the mask may be pressed or stamped by the mask, resulting in defects such as dark spots.

[0005] The embodiments attempt to provide a display device capable of reducing defects such as dark spots by preventing spacers from being squeezed or stamped, as well as a method of manufacturing the display device.

[0006] A light-emitting display device according to an embodiment includes: a substrate; a transistor located on the substrate; an insulating layer located on the transistor; a pixel electrode located on the insulating layer and electrically connected to the transistor; a pixel defining layer located on the insulating layer and having an opening overlapping the pixel electrode; a spacer located on the pixel defining layer; and a protective layer located on the spacer. The protective layer includes a first layer located on the spacer and a second layer located on the first layer.

[0007] The spacer may include a central portion containing the center of the spacer, a stepped portion surrounding the central portion, and a peripheral portion surrounding the stepped portion, wherein the stepped portion may have a step that is recessed in the direction toward the pixel defining layer.

[0008] The protective layer may include a main body located on the central portion and protective wing located on the stepped portion.

[0009] The main body can contact the central part, and the protective layer wings can be spaced apart from the step part.

[0010] The thickness of the protective wing can be less than the thickness of the main body.

[0011] The ends of the protective wing can have an inner angle of 30° to 50°.

[0012] The protective layer may not be located on the outer part.

[0013] The protective layer may include metal oxides.

[0014] The light-emitting display device may further include: an intermediate layer located on at least one of a pixel electrode, a pixel defining layer, a spacer, and a protective layer, and including a light-emitting layer and a functional layer; and a common electrode located on the intermediate layer, wherein the protective layer may be located between the spacer and the intermediate layer.

[0015] The light-emitting display device may further include: an encapsulation substrate located on a common electrode; a filler located between at least one of the substrate and the common electrode and the encapsulation substrate; and a sealing member located at the edge of the substrate and bonding the substrate and the encapsulation substrate.

[0016] An electronic device according to an embodiment includes a light-emitting display device. The light-emitting display device includes: a substrate; a transistor located on the substrate; an insulating layer located on the transistor; a pixel electrode located on the insulating layer and electrically connected to the transistor; a pixel defining layer located on the insulating layer and having an opening overlapping the pixel electrode; a spacer located on the pixel defining layer; and a protective layer located on the spacer. The protective layer includes a first layer located on the spacer and a second layer located on the first layer.

[0017] A method for manufacturing a light-emitting display device according to an embodiment includes: forming a transistor on a substrate; forming an insulating layer on the transistor; forming a pixel electrode electrically connected to the transistor on the insulating layer; forming a pixel defining layer on the insulating layer having an opening overlapping the pixel electrode; forming a spacer on the pixel defining layer; and forming a protective layer on the spacer.

[0018] Forming a protective layer includes forming a first layer on the spacer and forming a second layer on the first layer.

[0019] Forming the first layer and the second layer may include: forming a preliminary first layer on a spacer; etching the preliminary first layer to form an etched preliminary first layer; forming a preliminary second layer on the etched preliminary first layer and the spacer; and etching the etched preliminary first layer and the preliminary second layer together to form the first layer and the second layer.

[0020] Forming a preliminary first layer may include depositing a first metal oxide on a spacer, and forming a preliminary second layer may include depositing a second metal oxide on an etched preliminary first layer and a spacer.

[0021] The method of manufacturing a light-emitting display device may also include forming a stepped portion by ashing a portion of the spacer.

[0022] Forming the stepped portion may include plasma treatment of the surface of the stepped portion.

[0023] The step formation can be achieved by ashing the area of ​​the spacer that does not overlap with the etched initial first layer.

[0024] The spacer may include a central portion containing the center of the spacer, a stepped portion surrounding the central portion, and a peripheral portion surrounding the stepped portion, and forming the first layer and the second layer may include etched preliminary first layer and preliminary second layer formed on the peripheral portion.

[0025] Etching the initial first layer may include forming a first layer wing located on the stepped portion.

[0026] Forming a second layer may include forming a second wing located on top of the first wing to form a protective wing.

[0027] Forming the protective wing may include etching an etched preliminary first layer and a preliminary second layer, such that the ends of the protective wing have an inner angle of 30° to 50°.

[0028] According to the embodiment, the spacers of the light-emitting display device can be prevented from being squeezed or punched, thereby preventing filler from seeping into the common electrode, light-emitting device, etc. Therefore, dark spots caused by squeezing and punching the spacers can be suppressed. Furthermore, gas release in the spacers and pixel defining layer of the display device can be suppressed. Therefore, the appearance of dots visible from the outside can be prevented. Therefore, the image quality of the display device can be improved, and defects in the display area of ​​the display device can be reduced.

[0029] According to the method for manufacturing a display device according to the embodiment, the spacers of the display device can be prevented from being squeezed or stamped, thereby preventing filler from seeping into the common electrode, light-emitting device, etc. Furthermore, gas release in the spacers and pixel defining layer can be suppressed. Therefore, defects such as dark spots and dot visibility can be prevented. Thus, a display device with improved image quality and reduced defects in the display area can be provided. Attached Figure Description

[0030] Figure 1 It is a schematic perspective view of an electronic device including a display device according to an embodiment.

[0031] Figure 2 This is a schematic perspective view of a display device according to an embodiment.

[0032] Figure 3 It is along Figure 2A cross-sectional view taken along line I-I' in the thickness direction.

[0033] Figure 4 This is a schematic cross-sectional view showing a portion of the display area of ​​the display device according to an embodiment.

[0034] Figure 5 It is a schematic cross-sectional view of the spacer and protective layer included in the display device according to the embodiment.

[0035] Figure 6 yes Figure 5 A magnified view of region A.

[0036] Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 11 This is a schematic cross-sectional view illustrating a method for manufacturing a protective layer according to an embodiment.

[0037] Figure 12A These are photographs taken with an electron microscope of portions of the spacers and protective layers included in the display device according to the embodiment.

[0038] Figure 12B yes Figure 12A The features shown in the photo are line drawings.

[0039] Figure 13A These are photographs taken with an electron microscope of portions of the spacers and protective layers included in the display device according to the embodiment.

[0040] Figure 13B yes Figure 13A The features shown in the photo are line drawings.

[0041] Figure 14A These are photographs taken with an electron microscope of portions of the spacer and the protective layer in the display device according to the comparative example.

[0042] Figure 14B yes Figure 14A The features shown in the photo are line drawings.

[0043] Figure 15 It is a block diagram of an electronic device according to some embodiments.

[0044] Figure 16 This is a schematic diagram of an electronic device according to some embodiments. Detailed Implementation

[0045] This disclosure will be described in detail below with reference to the accompanying drawings, in which embodiments of the disclosure are illustrated. As those skilled in the art will recognize, modifications may be made to the described embodiments in various ways without departing from the spirit or scope of this disclosure.

[0046] The accompanying drawings and descriptions are to be considered illustrative in nature and not restrictive, and the same reference numerals denote the same elements throughout the specification.

[0047] Furthermore, since the dimensions and thicknesses of the components shown in the figures can be arbitrarily given for ease of understanding and description, this disclosure is not limited to the dimensions and thicknesses shown. In the figures, the thicknesses of layers and regions are exaggerated for clarity. In the figures, the thicknesses of some layers and regions may be exaggerated for ease of understanding and description.

[0048] It should be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” another element, the element may be directly on the other element, or there may be an intervening element. Conversely, when an element is referred to as being “directly on another element,” there is no intervening element. Furthermore, when an element is referred to as being “on” or “above” the mentioned element, the element may be located above or below the mentioned element, and the element does not necessarily mean that it is located “on” or “above” the mentioned element in a direction opposite to gravity.

[0049] Furthermore, unless explicitly stated otherwise, the words “comprise” and “includes”, as well as variations such as “comprises” and “comprising”, should be understood to mean including the stated element but excluding any other element.

[0050] Furthermore, the phrase "in a plane" refers to a view obtained from above an object (e.g., from the top), and the phrase "in a section" refers to a view of a vertically cut section of an object obtained from the side.

[0051] Figure 1 It is a schematic perspective view of an electronic device including a display device according to an embodiment. Figure 2 This is a schematic perspective view of a display device according to an embodiment.

[0052] refer to Figure 1 and Figure 2The electronic device 1 may include a display screen capable of displaying an image on a third direction z corresponding to the front of the device on a plane defined by a first direction x and a second direction y. For example, the electronic device 1 may include a television, mobile phone, smartphone, tablet, laptop computer, monitor, multimedia player, billboard, electronic watch, smartwatch, watch phone, head-mounted display (HMD), mobile communication terminal, electronic notebook, e-book, portable multimedia player (PMP), navigation game console, digital camera, camcorder, and the like.

[0053] The electronic device 1 may include a cover window 2, a housing 3, a display device, etc.

[0054] Cover window 2 may include an insulating pattern. For example, cover window 2 may include glass, plastic, or a combination thereof. The front of cover window 2 may define the front of electronic device 1. The area in cover window 2 corresponding to the display screen may be optically transparent. Cover window 2 is located on the display device and can protect the display device from external impacts, etc., and can transmit the image displayed by the display device.

[0055] The housing 3 can be made of a material with relatively high rigidity. For example, the housing 3 may include multiple frames or panels made of glass, plastic, or metal, or a combination thereof. The housing 3 can be connected to the cover window 2, and the connected housing 3 and cover window 2 can form the exterior of the electronic device 1 and provide the internal space of the electronic device 1. For example, the housing 3 can form the back and sides of the electronic device 1, and the cover window 2 can form the front of the electronic device 1. Display devices, etc., can be located in the internal space defined by the cover window 2 and the housing 3, and can be protected from the influence of the external environment.

[0056] The display device can display images and provide a display screen for the electronic device 1. The display device can be a light-emitting display device such as an organic light-emitting display device, an inorganic light-emitting display device, or a quantum dot light-emitting display device.

[0057] Electronic device 1 can have various shapes. For example, such as Figure 1 As shown, when viewed from the front, electronic device 1 can be a quadrilateral with rounded corners. Furthermore, electronic device 1 can have shapes such as rectangles, squares, other polygons, circles, or ellipses.

[0058] The electronic device 1 and the display device may each include a display area DA and a non-display area NA. Figure 1 The display area DA and the non-display area NA shown can respectively correspond to Figure 2The display device shown has a display area DA and a non-display area NA. The display area DA is the area where images are displayed and may correspond to a display screen. The non-display area NA may be an area where no images are displayed. The display area DA may occupy most of the area based on the center of the front of the electronic device 1, and the non-display area NA may surround the display area DA.

[0059] like Figure 1 As shown, the display area DA may include a first display area DA1, a second display area DA2, and a third display area DA3. The second display area DA2 and the third display area DA3 may be areas where components such as sensors and cameras are disposed on the back to add various functions to the electronic device 1. The second display area DA2 and the third display area DA3 may correspond to component areas. The second display area DA2 and the third display area DA3 may be surrounded by the first display area DA1. Not only the first display area DA1, but also the second display area DA2 and the third display area DA3 can display images. The position and number of the second display area DA2 and the third display area DA3 can vary.

[0060] To describe the display device in more detail, the display device may provide a display screen within the electronic device 1. The display device can detect or capture the front of the electronic device 1. The display device may have a flat form similar to that of the electronic device 1.

[0061] The display device may include a display panel 10, a flexible printed circuit board 20 bonded to the display panel 10, and a driving unit including an integrated circuit chip 30.

[0062] The display panel 10 may include a display area DA corresponding to a screen on which an image is displayed, and a non-display area NA in which circuitry and signal lines for generating and transmitting various signals applied to the display area DA are disposed. The non-display area NA may surround the display area DA. Figure 2 In the diagram, the inner and outer sides of the dashed rectangle can correspond to the display area DA and the non-display area NA, respectively, and can also correspond to the reference area. Figure 1 The described electronic device 1 has a display area DA and a non-display area NA. Figure 2 In the text, for ease of description, the first display area DA1, the second display area DA2, and the third display area DA3 are not separated, but as shown... Figure 1 As in the example, the display area DA can include a first display area DA1, a second display area DA2, and a third display area DA3.

[0063] Pixels PX can be arranged in a matrix within the display area DA of the display panel 10. Furthermore, signal lines such as gate lines, data lines, and drive voltage lines can be provided within the display area DA. Gate lines can extend in a first direction x, and data lines and drive voltage lines can extend in a second direction y. Signal lines such as gate lines, data lines, and drive voltage lines are connected to each pixel PX, such that each pixel PX can receive a gate signal (also called a scan signal), data voltage, and drive voltage from the signal lines. Each pixel PX may include a light-emitting device and pixel circuitry connected thereto. The pixel circuitry can generate a drive current based on signals applied through signal lines such as gate lines and data lines, and can apply the drive current to the light-emitting device.

[0064] Touch sensors can be placed in the display area DA to detect both contact and non-contact touch from the user. Figure 1 In the diagram, the display area DA is shown as a quadrilateral, but the display area DA can have various shapes other than quadrilaterals, such as other polygons, circles, or ellipses.

[0065] The pad portion PP, which has pads for receiving signals from the outside of the display panel 10, can be located in the non-display area NA of the display panel 10. The pad portion PP can be positioned along any edge of the display panel 10 in a first direction x. A flexible printed circuit board 20 can be bonded to the pad portion PP, and the pads of the flexible printed circuit board 20 can be electrically connected to the pads of the pad portion PP.

[0066] A driving unit that generates and processes various signals for driving the display panel 10 may be located in the non-display area NA of the display panel 10. The driving unit may include a data driver that applies data voltages to data lines, a gate driver that applies gate signals to gate lines, and a signal controller that controls the data driver and the gate driver. Pixels PX may receive data voltages according to the gate signals generated by the gate drivers. The gate drivers may be integrated into the display panel 10 and may be located on at least one side of the display area DA. The data driver and signal controller may be configured as an integrated circuit chip (also referred to as a driver IC chip or driver IC) 30, and the integrated circuit chip 30 may be mounted in the non-display area NA of the display panel 10. The integrated circuit chip 30 may be mounted on a flexible printed circuit board 20 or similar and electrically connected to the display panel 10.

[0067] Figure 3 It is along Figure 2 A schematic cross-sectional view taken from line I-I'.

[0068] refer to Figure 3The light-emitting display device may include a substrate 110, a display layer DL located on the substrate 110, and an encapsulation substrate 510 located on the display layer DL. A filler 400 may be located between at least one of the substrate 110 and the display layer DL and the encapsulation substrate 510, and a sealing member 40 may be located at the edge of the substrate 110 and the edge of the encapsulation substrate 510.

[0069] Substrate 110 may be a rigid substrate comprising a material such as glass. Substrate 110 may also be a flexible substrate comprising a polymer resin such as polyimide, polyamide, or polyethylene terephthalate.

[0070] The encapsulation substrate 510 may be formed of substantially the same material as the substrate 110. For example, the encapsulation substrate 510 may be a rigid substrate comprising a material such as glass. For example, the encapsulation substrate 510 may be a flexible substrate comprising a polymer resin.

[0071] The filler 400 may be located between at least one of the substrate 110 and the display layer DL and the encapsulation substrate 510. One surface of the filler 400 may contact at least one of the capping layers of the substrate 110 and the display layer DL, and the other surface of the filler 400 may contact the encapsulation substrate 510.

[0072] The filler 400 can fill the space between at least one of the substrate 110 and the display layer DL and the encapsulation substrate 510 to increase the compressive strength between the substrate 110 and the encapsulation substrate 510 or between the display layer DL and the encapsulation substrate 510. The filler 400 can be formed by printing or applying a filler material onto the encapsulation substrate 510, bonding the encapsulation substrate 510 to the substrate 110, and then curing it. The filler 400 can include organic materials such as epoxy resin, polyacrylate resin, phenolic resin, polyester resin, etc.

[0073] The substrate 110 and the package substrate 510 can be joined and sealed by a sealing member 40. The sealing member 40 can be formed at the edges of the substrate 110 and the package substrate 510 to join the substrate 110 and the package substrate 510. For example, the sealing member 40 can be located at a reference... Figure 1 and Figure 2 The non-display area NA is described.

[0074] The sealing member 40 formed at the edge of the encapsulation substrate 510 may be located at the edge of the substrate 110 on which the display layer DL is formed. After the substrate 110 and the encapsulation substrate 510 are overlapped, a laser is irradiated on the sealing member 40 to cure it, thereby bonding the substrate 110 and the encapsulation substrate 510.

[0075] The sealing member 40 may include a photocurable material. The sealing member 40 may include a glass frit. The glass frit may refer to a glass raw material in powder form, or it may refer to a paste-like material containing laser or infrared absorbers, organic binders, fillers, etc., in silica (SiO2). The sealing member 40 may include epoxy acrylate-based resins, polyester acrylate-based resins, polyurethane acrylate-based resins, polybutadiene acrylate-based resins, silicone acrylate-based resins, alkyl acrylate-based resins, and the like.

[0076] Figure 4 This is a schematic cross-sectional view showing a portion of the display area of ​​the display device according to an embodiment. Figure 4 The portion of the display device that roughly corresponds to two pixel areas is shown.

[0077] refer to Figure 4 The buffer layer 120 can be located on the substrate 110. During the formation of the semiconductor layer AL, the buffer layer 120 can block impurities from the substrate 110, thereby improving the characteristics of the semiconductor layer AL, and can also alleviate stress on the semiconductor layer AL by planarizing the surface of the substrate 110. The buffer layer 120 can include materials such as silicon nitride (SiN). x ), silicon oxide (SiO) x ) or silicon nitride oxide (SiO) x N y The inorganic insulating layer of the inorganic insulating material can have a single-layer structure or a multi-layer structure.

[0078] The transistor TR can be located on the substrate 110. For example, the transistor TR can be located on the buffer layer 120 positioned on the substrate 110.

[0079] The semiconductor layer AL of the transistor TR can be located on the substrate 110. The semiconductor layer AL may include a first semiconductor region, a second semiconductor region, and a channel region located between the first semiconductor region and the second semiconductor region. The semiconductor layer AL may include any of amorphous silicon, polycrystalline silicon, and oxide semiconductors. For example, the semiconductor layer AL may include low-temperature polycrystalline silicon (LTPS) or an oxide semiconductor material comprising at least one of zinc (Zn), indium (In), gallium (Ga), and tin (Sn). For example, the semiconductor layer AL may include indium gallium zinc oxide (IGZO).

[0080] The first gate insulating layer 130 may be located on the semiconductor layer AL. The first gate insulating layer 130 may include an inorganic insulating material such as silicon nitride, silicon oxide, or silicon oxide nitride. The first gate insulating layer 130 may have a single-layer structure or a multi-layer structure.

[0081] The gate conductive layer, which may include the gate electrode GE of the transistor TR, may be located on the first gate insulating layer 130. The gate conductive layer may include molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may have a single-layer structure or a multi-layer structure.

[0082] The second gate insulating layer 140 may be located on the gate conductive layer. The second gate insulating layer 140 may include an inorganic insulating material such as silicon nitride, silicon oxide, or silicon oxide nitride. The second gate insulating layer 140 may have a single-layer structure or a multi-layer structure.

[0083] Interlayer insulating layer 160 may be located on second gate insulating layer 140. Interlayer insulating layer 160 may include inorganic insulating materials such as silicon nitride, silicon oxide, or silicon nitride. Interlayer insulating layer 160 may have a single-layer structure or a multilayer structure. An additional gate conductive layer may be located on interlayer insulating layer 160.

[0084] A data conductive layer, which may include a first electrode SE and a second electrode DE of a transistor TR, may be located on an interlayer insulating layer 160. The first electrode SE and the second electrode DE may be connected to a first semiconductor region and a second semiconductor region of the semiconductor layer AL, respectively, through contact holes formed in the insulating layer (including a first gate insulating layer 130, a second gate insulating layer 140, and an interlayer insulating layer 160). One of the first electrode SE and the second electrode DE may be a source electrode and the other may be a drain electrode.

[0085] The data conductive layer may include at least one of aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and copper (Cu), and may have a single-layer or multi-layer structure. For example, the data conductive layer may include a lower layer comprising a refractory metal such as molybdenum, chromium, tantalum, or titanium, an intermediate layer comprising a low-resistivity metal such as aluminum, copper, or silver, and an upper layer comprising a refractory metal. For example, the data conductive layer may have a three-layer structure such as titanium (Ti) / aluminum (Al) / titanium (Ti).

[0086] The insulating layer 180 may be located on the data conductive layer. The insulating layer 180 located on the data conductive layer may be configured as a planarization layer. For example, the insulating layer 180 configured as a planarization layer may be located on the transistor TR, which includes a semiconductor layer AL, a gate electrode GE, a first electrode SE, and a second electrode DE. The insulating layer 180 may be located on the interlayer insulating layer 160.

[0087] Insulating layer 180 may include an organic insulating material comprising a general polymer such as poly(methyl methacrylate) or polystyrene, a polymer derivative having a phenol-based group, an acrylic-based polymer, an imide-based polymer (e.g., polyimide), or a siloxane-based polymer.

[0088] In one embodiment, the light-emitting device ED may be located on the insulating layer 180. For example, the light-emitting device ED may be located on the insulating layer 180, which is configured as a planarization layer, and may be electrically connected to the transistor TR.

[0089] The light-emitting device ED may include a pixel electrode E1. For example, the pixel electrode E1 may be the anode of the light-emitting device ED. The pixel electrode E1 may be electrically connected to the transistor TR. For example, the pixel electrode E1 may be connected to the second electrode DE of the transistor TR through a contact hole formed in the insulating layer 180. The pixel electrode E1 may be formed of a reflective conductive material or a semi-transparent conductive material, or it may be formed of a transparent conductive material. The pixel electrode E1 may include a metal or metal alloy such as lithium (Li), calcium (Ca), aluminum (Al), silver (Ag), magnesium (Mg), or gold (Au). For example, the pixel electrode E1 may be multilayered and may have a three-layer structure such as indium tin oxide (ITO) / silver (Ag) / ITO.

[0090] A pixel defining layer 190 having an opening overlapping with the pixel electrode E1 can be located on the insulating layer 180. The pixel electrode E1 can be located in the opening of the pixel defining layer 190. The opening can correspond to the light-emitting area of ​​the light-emitting device ED.

[0091] The pixel defining layer 190 may include an organic insulating material comprising a general polymer such as poly(methyl methacrylate) or polystyrene, a polymer derivative having a phenol-based group, an acrylic acid-based polymer, an imide-based polymer, or a siloxane-based polymer.

[0092] Spacer 195 may be located on pixel defining layer 190. Spacer 195, located on pixel defining layer 190, may support a mask for forming the light-emitting layer, as will be described later. Spacer 195 may be formed of substantially the same material as pixel defining layer 190. For example, pixel defining layer 190 and spacer 195 may be formed of the same material in the same process. Pixel defining layer 190 and spacer 195 may be integrally formed in one process, but may also be formed separately in separate processes.

[0093] The protective layer 200 may be located on the spacer 195. The protective layer 200 may be located between the spacer 195 and the intermediate layer EM. In an embodiment, the protective layer 200 may include a first layer 210 located on the spacer 195 and a second layer 220 located on the first layer 210.

[0094] The intermediate layer EM may be located on at least one of the pixel electrode E1, pixel defining layer 190, spacer 195, and protective layer 200. The intermediate layer EM may include a light-emitting layer EL and a functional layer FL.

[0095] The light-emitting layer (EL) is a layer in which electro-optical conversion occurs through the recombination of electrons and holes, and may include at least one of organic and inorganic materials that emit light of a predetermined color. The EL may be located in an opening of the pixel defining layer 190 and may overlap with the pixel electrode E1. A portion of the EL may be located on the pixel defining layer 190. The EL may include an organic light-emitting diode (OLED) or an inorganic light-emitting diode (OLED).

[0096] The functional layer FL may include at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. The functional layer FL may include a first functional layer FL1 located between the pixel electrode E1 and the light-emitting layer EL, and a second functional layer FL2 located between the light-emitting layer EL and the common electrode E2. The first functional layer FL1 may include at least one of a hole injection layer and a hole transport layer. The second functional layer FL2 may include at least one of an electron transport layer and an electron injection layer. The functional layer FL may span the entire area as shown in the reference. Figure 1 The display area DA is described. The functional layer FL can be located within the opening of the pixel limiting layer 190. The functional layer FL can also be located outside the opening of the pixel limiting layer 190.

[0097] The common electrode E2 can be disposed on the intermediate layer EM. The pixel electrode E1 can be the anode of the light-emitting device ED, and the common electrode E2 can be the cathode of the light-emitting device ED. The common electrode E2 can span the entire area as shown in the reference. Figure 1 and Figure 2 The description specifies the location of the display area DA.

[0098] The common electrode E2 may comprise a metal or metal alloy having a low work function, such as calcium (Ca), barium (Ba), magnesium (Mg), aluminum (Al), or silver (Ag). For example, light transmittance can be achieved by forming a thin layer of a metal or metal alloy having a low work function. The common electrode E2 may comprise a transparent conductive oxide such as ITO or indium zinc oxide (IZO).

[0099] The common electrode E2 can be used together with the pixel electrode E1 and the intermediate layer EM to form a light-emitting device ED. For example, the pixel electrode E1, the light-emitting layer EL, and the common electrode E2 can form a light-emitting device ED. The light-emitting device ED may include a functional layer FL containing a first functional layer FL1 and a second functional layer FL2.

[0100] The emissive layer EL may include emissive layers ELa and ELb that display different colors. For example, the emissive layer EL may include a first emissive layer ELa that displays a first color and a second emissive layer ELb that displays a second color different from the first color. For example, the first emissive layer ELa and the second emissive layer ELb may each display a different color among red, green, and blue. The first emissive layer ELa and the second emissive layer ELb may be spaced apart from each other, with a pixel defining layer 190 between them.

[0101] Pixel electrode E1 may include a first pixel electrode E1a and a second pixel electrode E1b. A first light-emitting layer ELa may be located on the first pixel electrode E1a. A second light-emitting layer ELb may be located on the second pixel electrode E1b. The first pixel electrode E1a and the second pixel electrode E1b may be spaced apart from each other, and a pixel defining layer 190 is located between them.

[0102] A first pixel electrode E1a, a first light-emitting layer ELa, and a common electrode E2 can form a first light-emitting device EDa. A second pixel electrode E1b, a second light-emitting layer ELb, and a common electrode E2 can form a second light-emitting device EDb. The first light-emitting device EDa and the second light-emitting device EDb can each include a functional layer FL containing a first functional layer FL1 and a second functional layer FL2.

[0103] The light-emitting device ED can correspond to the reference. Figure 2 The pixel PX is described. The first light-emitting device EDa and the second light-emitting device EDb correspond to different pixels and can display different colors. For example, the first light-emitting device EDa and the second light-emitting device EDb can each correspond to different pixels and can each display one of the colors red, green, and blue.

[0104] The capping layer 300 can be located on the common electrode E2. The capping layer 300 can improve optical efficiency by adjusting its refractive index.

[0105] The filler 400 may be located on the capping layer 300. The filler 400 may be located between the encapsulation substrate 510 and the light-emitting device ED to protect the light-emitting device ED from external or internal impacts.

[0106] Encapsulation substrate 510 may be located on filler 400. Encapsulation substrate 510 may encapsulate display layer DL, particularly light-emitting device ED, to prevent moisture or oxygen from penetrating from the outside. Instead of or together with encapsulation substrate 510, a thin film encapsulation layer comprising one or more inorganic layers and one or more organic layers may be located on capping layer 300.

[0107] A touch sensor layer (not shown) may be located on the packaging substrate 510, and an anti-reflective layer (not shown) may be located on the touch sensor layer to reduce external light reflection.

[0108] Figure 5 It is a schematic cross-sectional view of the spacer and protective layer included in the display device according to the embodiment. Figure 6 yes Figure 5 A magnified view of region A.

[0109] In description Figure 5 and Figure 6 At that time, cross-referencing is possible. Figure 4 .

[0110] refer to Figure 5 and Figure 6 The protective layer 200 located on the spacer 195 may include a first layer 210 and a second layer 220.

[0111] The spacer 195 may include a central portion 196 containing the center of the spacer 195, a stepped portion 197 surrounding the central portion 196, and a peripheral portion 198 surrounding the stepped portion 197. The central portion 196 may refer to the portion extending from the center of the spacer 195 to a predetermined distance. The stepped portion 197 may refer to the portion extending from the outer edge of the central portion 196 to a predetermined distance. The stepped portion 197 may have a step recessed from the upper surfaces of the central portion 196 and the peripheral portion 198 in a direction toward the pixel defining layer 190. The peripheral portion 198 may refer to the portion extending from the outer edge of the stepped portion 197 to the outer edge of the spacer 195. The height of the peripheral portion 198 may be less than the height of the central portion 196. The spacer 195 may include the central portion 196, the stepped portion 197, and the peripheral portion 198.

[0112] For example, refer to Figure 4The described light-emitting layer EL can be deposited using a mask such as a fine metal mask, and the mask can contact the spacer 195. Pressure can be applied to the spacer 195 through the mask, which may cause cracks to appear in the spacer 195. Cracks formed in the spacer 195 may cause cracks to appear in the intermediate layer EM, the common electrode E2, and the capping layer 300 located on the spacer 195. Material of the filler 400 located on the capping layer 300 may flow into the intermediate layer EM through the cracks. Therefore, dark spots may appear in the areas where the filler is introduced. In addition, due to the cracks formed in the spacer 195, gas release may occur in the spacer 195, resulting in stains.

[0113] However, according to embodiments of this disclosure, the protective layer 200 may be located on the spacer 195 to prevent cracking of the spacer 195 due to a mask or similar cause. Therefore, the filler 400 can be prevented from flowing into the intermediate layer EM through cracks, and gas release through cracks formed in the spacer 195 can be suppressed. Thus, dark spots or blemishes can be prevented from appearing in the display area DA.

[0114] A protective layer 200 may be located on the central portion 196 of the spacer 195. The protective layer 200 may completely cover the central portion 196 of the spacer 195, and both sides of the protective layer 200 may laterally protrude from the central portion 196. The protective layer 200 may include a body 201 located on the central portion 196 and wings 202 located on the stepped portion 197 of the spacer 195. The body 201 may refer to the portion of the protective layer 200 located on the central portion 196 of the spacer 195. The wings 202 may not overlap with the central portion 196, but may overlap with the stepped portion 197. The protective layer 200 including the wings 202 can prevent dark spots from occurring at the stepped portion 197 due to defects that may occur at the step portion 197 caused by pressure applied to the spacer 195, for example, by a mask used for depositing an EL light-emitting layer.

[0115] The main body 201 can contact the central portion 196. The main body 201 may include the main body of the first layer 210 and the main body of the second layer 220. For example, the main body 201 may include the main body of the first layer 210 that contacts the central portion 196 and the main body of the second layer 220 that contacts the main body of the first layer 210.

[0116] Wing 202 may be spaced apart from step portion 197. Wing 202 may include the wing of the first layer 210 and the wing of the second layer 220. For example, wing 202 may include the portion of the first layer 210 located on and spaced apart from step portion 197 and the portion of the second layer 220 located on the portion of the first layer 210 spaced apart from step portion 197. The wing 202, spaced apart from step portion 197, can prevent foreign matter from seeping into step portion 197. Therefore, dark spots caused by foreign matter seeping into step portion 197 can be prevented.

[0117] In this embodiment, the thickness of the wing 202 can be less than the thickness of the body 201. The end of the wing 202 can have a chamfered shape. For example, the wing 202 can have an inclined surface that slopes in the direction of the end of the wing 202. The inclined surface can be formed in a direction from the boundary between the body 201 and the wing 202 toward the end of the wing 202. Therefore, the thickness of the wing 202 can be less than the thickness of the body 201.

[0118] The end of wing 202 may have an interior angle θ of 30° to 50°, 35° to 50°, or 35° to 45°. For example, the end of wing 202 may have a sloped surface to have an interior angle θ within the above range. Within the above interior angle range, it is possible to prevent wing 202 from becoming too thin. Therefore, it is possible to prevent wing 202 from breaking, thereby preventing damage to the stepped portion 197 of spacer 195.

[0119] In some embodiments, the protective layer 200 may not be formed on the peripheral portion 198 of the spacer 195. For example, the protective layer 200 may be formed on the central portion 196 and a portion of the stepped portion 197 of the spacer 195. The first layer 210 and the second layer 220 of the protective layer 200 may be located together on the central portion 196. The first layer 210 and the second layer 220 of the protective layer 200 may be located together on the stepped portion 197. For example, the first layer 210 and the second layer 220 may be located on the stepped portion 197 as wings 202 spaced apart from the stepped portion 197. For example, a portion of the second layer 220 may be located on the stepped portion 197 in contact with it. The protective layer 200 may be formed only on the central portion 196 of the spacer 195.

[0120] Protective layer 200 may include metal oxides. For example, protective layer 200 may include IGZO, IZO, indium zinc tin oxide (IZTO), ITO, zinc tin oxide (ZTO), or the like. Protective layer 200 may include metal oxides such as zinc (Zn), indium (In), gallium (Ga), tin (Sn), or titanium (Ti). First layer 210 and second layer 220 may include the metal oxides described above.

[0121] In the following text, reference will be made to Figures 7 to 11 Description of manufacturing Figures 2 to 6 The method of the display device shown.

[0122] Figures 7 to 11 This is a schematic cross-sectional view illustrating a method for manufacturing a light-emitting display device according to an embodiment.

[0123] refer to Figure 7 A buffer layer 120 may be formed on the substrate 110. A transistor TR may be formed on the substrate 110. For example, a buffer layer 120 may be formed on the substrate 110, and a semiconductor material layer of the transistor TR may be formed on the buffer layer 120 and then patterned to form a semiconductor layer AL. A first gate insulating layer 130 may be formed on the semiconductor layer AL. A conductive material layer may be formed on the first gate insulating layer 130 and then patterned to form a gate conductive layer, which may include the gate electrode GE of the transistor TR. A second gate insulating layer 140 may be formed on the gate conductive layer. An interlayer insulating layer 160 may be formed on the second gate insulating layer 140. A conductive material layer may be formed on the interlayer insulating layer 160 and then patterned to form a data conductive layer, which may include the first electrode SE and the second electrode DE of the transistor TR.

[0124] An insulating layer 180 may be formed on the first electrode SE and the second electrode DE. The insulating layer 180 may be formed on the interlayer insulating layer 160. The insulating layer 180 may be configured as a planarization layer. A contact hole overlapping at least one of the first electrode SE and the second electrode DE may be formed in the insulating layer 180, which may be configured as a planarization layer. A light-emitting device electrically connected to the transistor TR may be formed on the insulating layer 180.

[0125] A conductive material layer can be formed on the insulating layer 180, which can be configured as a planarization layer, and then patterned to form the pixel electrode E1 of the light-emitting device. The pixel electrode E1 can be electrically connected to the transistor TR through contact holes formed in the insulating layer 180.

[0126] The pixel defining layer 190 can be formed by coating an organic material layer onto the insulating layer 180 and then patterning it. Spacers 195 can be formed on the pixel defining layer 190. The pixel defining layer 190 and spacers 195 can be formed independently or simultaneously. Spacers 195 can be formed to contact a fine metal mask to prevent damage to the previously formed structure from the fine metal mask used during the deposition of the light-emitting layer. Spacers 195 can have various planar shapes such as polygons (e.g., triangles) or circles.

[0127] A protective layer may be formed on the spacer 195. Forming the protective layer may include forming a first layer on the spacer 195 and forming a second layer on the first layer.

[0128] The spacer 195 may include a central portion, a stepped portion surrounding the central portion, and a peripheral portion surrounding the stepped portion. The central portion may refer to the portion extending from the center of the spacer 195 to a predetermined distance. The stepped portion may refer to the portion extending from the outer edge of the central portion to a predetermined distance. The peripheral portion may refer to the portion extending from the outer edge of the stepped portion to the outer edge of the spacer 195.

[0129] A preliminary first layer 211 can be formed on spacer 195. A first metal oxide can be deposited on spacer 195. The first metal oxide may include, as in reference, […]. Figure 4 and Figure 5 The metal oxides described are essentially the same material. The first metal oxide can be deposited integrally on the spacer 195 to form a preliminary first layer 211.

[0130] refer to Figure 8 A first photoresist can be applied to the spacer 195 on which the preliminary first layer 211 is formed. The first photoresist can be a negative photoresist. The first photoresist can be applied to the central and peripheral portions of the spacer 195 on which the preliminary first layer 211 is formed. Therefore, the stepped portions can be etched. The first photoresist can also be applied to the stepped portion 197 of the spacer 195 on which the preliminary first layer 211 is formed (see...). Figure 5 and Figure 11 The portion above the step portion 197. Therefore, the initial first layer 211 on the portion above the step portion 197, on which the first photoresist has been applied, can be left unremoved.

[0131] The spacer 195 on which the first photoresist is applied can be etched. At least a portion of the preliminary first layer 211 above the step portion 197 can be removed by etching. The portion of the preliminary first layer 211 above the step portion 197 may not be etched. The unetched preliminary first layer 211 above the step portion 197 can be configured as a wing of a protective layer. For example, at least a portion of the preliminary first layer 211 can be etched to form the wing portion above the step portion 197.

[0132] Etching can be performed using a wet etching process. For example, a spacer 195 on which a first photoresist is applied can be placed in an etching solution to remove a preliminary first layer 211 formed in the region where the first photoresist is not applied.

[0133] The first photoresist can be removed to form an etched preliminary first layer 212 from which the preliminary first layer 211 has been removed. For example, the portion of the preliminary first layer 211 located at the step portion of the spacer 195 can be removed to form the etched preliminary first layer 212.

[0134] refer to Figure 9 An ashing process can be performed to form a stepped portion 197 on which the spacer 195, on which the etched preliminary first layer 212 is formed, is formed. Therefore, the stepped portion 197 can have a hole recessed in the direction toward the pixel defining layer 190.

[0135] Forming the stepped portion 197 may include plasma treatment of the surface of the stepped portion 197. The ashing process may include plasma treatment using plasma. For example, helium (He) plasma, oxygen (O2) plasma, nitrogen (N2) plasma, or similar types may be used to perform the ashing process. Therefore, the surface of the stepped portion 197 of the spacer 195 can be modified. Therefore, the release of gas through the stepped portion 197 can be suppressed, and stains such as spots due to the release of gas through the stepped portion 197 can be prevented.

[0136] refer to Figure 10 A second metal oxide can be additionally deposited on the spacer 195 on which the etched preliminary first layer 212 is formed. Therefore, a preliminary second layer 221 can be formed. The second metal oxide may include, as referenced... Figure 5 and Figure 6 The metal oxides described are essentially the same materials.

[0137] A second photoresist can be applied to the preliminary second layer 221 and the etched preliminary first layer 212. The second photoresist can be a negative photoresist. The second photoresist can be applied to the central portion of the spacer 195. The second photoresist can also be applied to a portion of the step portion 197 of the spacer 195. The second photoresist can also be applied to a portion of the step portion 197 so that a protective layer can be formed on and spaced apart from the step portion 197. The second photoresist can also be partially applied to the preliminary second layer 221 located on and in contact with the step portion 197.

[0138] refer to Figure 11The preliminary second layer 221 on which the second photoresist is applied and the etched preliminary first layer 212 can be etched. At least a portion of the preliminary second layer 221 located on the peripheral portion 198 can be removed by etching. The portion of the preliminary second layer 221 located on the stepped portion 197 can be left unetched. The unetched preliminary second layer 221 can form a wing of the second layer 220 on the wing of the first layer 210. For example, the wing can be formed by forming a wing of the second layer 220 on the wing of the first layer 210.

[0139] Etching can be performed using a wet etching process. For example, a spacer 195 on which a second photoresist is applied can be placed in an etching solution to remove the etched preliminary first layer 212 and preliminary second layer 221 formed in the area where the second photoresist is not applied. Thus, the etched preliminary first layer 212 and preliminary second layer 221 located on the peripheral portion 198 can be removed to form a first layer 210 and a second layer 220.

[0140] The etched initial first layer 212 and initial second layer 221 can be etched to give the wing tip an inner angle of 30° to 50°, 35° to 50°, or 35° to 45°. Therefore, the wing can have an appropriate thickness, thus suppressing defects such as cracks in the wing caused by external forces.

[0141] The first layer 210 and the second layer 220, formed by etching the etched preliminary first layer 212 and preliminary second layer 221, can also be cured. Therefore, the strength of the protective layer 200, including the first layer 210 and the second layer 220, can be improved. Thus, even if the mask used to form the light-emitting layer is located on the protective layer 200, defects such as cracks can be avoided in the protective layer 200. For example, curing can be performed by irradiating with ultraviolet light.

[0142] An intermediate layer comprising an emissive layer and a functional layer can be formed on the pixel electrode E1. The emissive layer can be deposited using a fine metal mask. The functional layer can be completely deposited using an aperture mask. The functional layer may include two or more functional layers.

[0143] For example, a first functional layer, a light-emitting layer, and a second functional layer can be formed sequentially. The first and second functional layers can be completely deposited using an aperture mask. Therefore, the first and second functional layers can be formed across the entire display area. The light-emitting layer can be deposited using a fine metal mask. Given the margin in the deposition process, the light-emitting layer can be formed over a wide area, and therefore, portions of the light-emitting layer can also be located on the pixel-defining layer 190.

[0144] Figure 12A These are photographs taken with an electron microscope of portions of the spacers and protective layers included in the display device according to the embodiment. Figure 12AThese are photographs of the spacer portion and the protective layer portion manufactured using the method described above. Figure 12B yes Figure 12A The features shown in the photo are line drawings.

[0145] refer to Figure 12A and Figure 12B A protective layer 200, comprising a first layer 210 and a second layer 220, is formed on the spacer 195. The protective layer 200 includes a main body 201 located at the central portion 196 of the spacer 195 and a wing 202 located at the stepped portion 197 of the spacer 195. Furthermore, the end of the wing 202 includes an inclined surface at a certain angle. Therefore, it can be seen that the protective layer 200 manufactured according to the manufacturing process described above includes the main body 201 and the wing 202, and is stably formed on the spacer 195.

[0146] Examples and Comparison Examples

[0147] Example 1

[0148] A preliminary first protective cell is formed by depositing IGZO on a spacer comprising a central portion, a stepped portion, and a peripheral portion, and a first photoresist is applied to the central portion and the stepped portion. The spacer coated with the first photoresist is placed in an etching solution, and a wet etching process is performed to fabricate a spacer on which the etched preliminary first protective cell is deposited.

[0149] A preliminary second protective unit is formed by additionally depositing IGZO on the preliminary first protective unit, and a second photoresist is applied to the central portion and the stepped portion. The spacer coated with the second photoresist is placed in an etching solution, and a wet etching process is performed to fabricate a spacer having a protective layer including the first and second protective units deposited thereon.

[0150] Example 2 and Example 3

[0151] Additionally, the spacers with a protective layer deposited on them are manufactured using the same method as in Example 1.

[0152] Comparison Example 1

[0153] IGZO is deposited on a spacer comprising a central portion, a stepped portion, and a peripheral portion, and a first photoresist is applied to the central portion and the stepped portion. The spacer coated with the first photoresist is immersed in an etching solution, and a wet etching process is performed to fabricate a spacer on which a preliminary protective layer is deposited.

[0154] A second photoresist is applied to the central and stepped portions of the spacer on which the initial protective layer has been deposited. The spacer coated with the second photoresist is placed in an etching solution, and a wet etching process is performed to fabricate the spacer on which the protective layer has been deposited.

[0155] Experimental results

[0156] The angles of the ends of spacers with protective layers deposited thereon, manufactured according to the example and comparative examples, are measured. The measured angles are shown in Table 1 below.

[0157]

[0158] Figure 13A These are photographs taken with an electron microscope of portions of the spacers and protective layers included in the display device according to the embodiment. Figure 13A The image is a photograph taken with an electron microscope of a portion of a spacer with a protective layer deposited thereon, formed according to Example 2. Figure 13B yes Figure 13A Line drawings of the features shown in the photograph. (Reference) Figure 13A and Figure 13B According to Table 1, when the protective layer is formed as a two-layer structure including a first layer and a second layer, the angle at the end of the spacer is maintained at 40° to 50°. Therefore, the protective layer can have a robust structure, thus reducing defects such as cracks.

[0159] Figure 14A These are photographs taken with an electron microscope of portions of the spacer and the protective layer in the display device according to the comparative example. Figure 14A This is a photograph taken with an electron microscope of a portion of a spacer with a protective layer deposited thereon, formed according to Comparative Example 1. Figure 14B yes Figure 14A The features shown in the photo are line drawings.

[0160] refer to Figure 14A and Figure 14B As shown in Table 1, when the protective layer is formed as a single layer, the angle at the end of the spacer decreases. Therefore, the protective layer may become weaker, which may increase defects such as cracks.

[0161] The display device according to the embodiments can be applied to various electronic devices. The electronic device according to the embodiments may include a display device, and may also include modules or devices with additional functions in addition to the display device.

[0162] Figure 15 This is a block diagram of an electronic device according to an embodiment. (Reference) Figure 15The electronic device 1000 according to the embodiment may include a display module 1100, a processor 1200, a memory 1300, and a power module 1400.

[0163] The processor 1200 may include at least one of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.

[0164] The memory 1300 can store data information required for the operation of the processor 1200 or the display module 1100. When the processor 1200 executes the application stored in the memory 1300, video data signals and / or input control signals are transmitted to the display module 1100, and the display module 1100 can process the received signals to output video information through the display screen.

[0165] The power module 1400 may include a power supply module such as a power adapter or battery device, and a power conversion module that converts the power supplied by the power supply module to generate the power required for the operation of the electronic device 1000.

[0166] At least one of the components of the electronic device 1000 may be included within the display device according to the embodiments described above. Furthermore, some of the modules functionally included in a single module may be incorporated into the display device, while other modules may be disposed separately from the display device. For example, the display device may include a display module 1100, while the processor 1200, memory 1300, and power module 1400 may be disposed within the electronic device 1000 as other devices not part of the display device.

[0167] Figure 16 Schematic diagrams of electronic devices according to various embodiments are shown.

[0168] refer to Figure 16 The various electronic devices having display devices according to the embodiments may include not only image display electronic devices such as smartphones 1000_1a, tablet PCs 1000_1b, laptop computers 1000_1c, televisions 1000_1d, and desktop monitors 1000_1e, but also wearable electronic devices with display modules such as smart glasses 1000_2a, head-mounted displays 1000_2b, and smartwatches 1000_2c, as well as in-vehicle electronic devices with display modules 1000_3 (such as those placed on car dashboards, center consoles, CID (central information displays), interior mirror displays, and the like).

[0169] Although this disclosure has been described with reference to embodiments thereof, it will be apparent to those skilled in the art that various changes and modifications may be made thereto without departing from the scope and spirit of this disclosure as set forth in the appended claims.

Claims

1. A light-emitting display device, comprising: Substrate; Transistors are located on the substrate; An insulating layer is located on the transistor; Pixel electrodes are located on the insulating layer and are electrically connected to the transistor; A pixel defining layer is located on the insulating layer and has an opening that overlaps with the pixel electrode; Spacers are located on the pixel defining layer; as well as A protective layer is located on the spacer. The protective layer includes a first layer located on the spacer and a second layer located on the first layer.

2. The light-emitting display device according to claim 1, wherein, The spacer includes a central portion containing the center of the spacer, a stepped portion surrounding the central portion, and a peripheral portion surrounding the stepped portion. The stepped portion has a step that is recessed in the direction toward the pixel defining layer.

3. The light-emitting display device according to claim 2, wherein, The protective layer includes a main body located on the central portion and protective wing located on the stepped portion.

4. The light-emitting display device according to claim 3, wherein, The main body contacts the central portion, and The protective layer wing is spaced apart from the stepped portion.

5. The light-emitting display device according to claim 3, wherein, The thickness of the protective layer wing is less than the thickness of the main body.

6. The light-emitting display device according to claim 5, wherein, The end of the protective layer wing has an inner angle of 30° to 50°.

7. The light-emitting display device according to claim 2, wherein, The protective layer is not located on the outer portion.

8. The light-emitting display device according to claim 1, wherein, The protective layer comprises a metal oxide.

9. The light-emitting display device according to claim 1, further comprising: An intermediate layer is located on at least one of the pixel electrode, the pixel defining layer, the spacer, and the protective layer, and includes a light-emitting layer and a functional layer; as well as The common electrode is located on the intermediate layer. The protective layer is located between the spacer and the intermediate layer.

10. The light-emitting display device according to claim 9, further comprising: The packaging substrate is located on the common electrode; A filler is located between the common electrode and the packaging substrate; as well as A sealing member is located at the edge of the substrate and joins the substrate and the encapsulation substrate.

11. Electronic devices, including: A light-emitting display device, comprising: Substrate; Transistors are located on the substrate; An insulating layer is located on the transistor; Pixel electrodes are located on the insulating layer and are electrically connected to the transistor; A pixel defining layer is located on the insulating layer and has an opening that overlaps with the pixel electrode; Spacers, located on the pixel defining layer; and A protective layer is located on the spacer. The protective layer includes a first layer located on the spacer and a second layer located on the first layer.

12. A method for manufacturing a light-emitting display device, comprising: Transistors are formed on a substrate; An insulating layer is formed on the transistor; A pixel electrode electrically connected to the transistor is formed on the insulating layer; A pixel defining layer having an opening overlapping the pixel electrode is formed on the insulating layer; Spacers are formed on the pixel defining layer; as well as A protective layer is formed on the spacer. The formation of the protective layer includes: forming a first layer on the spacer and forming a second layer on the first layer.

13. The method of manufacturing a light-emitting display device according to claim 12, wherein, Forming the first layer and the second layer includes: A preliminary first layer is formed on the spacer; The preliminary first layer is etched to form an etched preliminary first layer; A preliminary second layer is formed on the etched preliminary first layer and the spacer; and The etched preliminary first layer and the preliminary second layer are etched together to form the first layer and the second layer.

14. The method of manufacturing a light-emitting display device according to claim 13, wherein, Forming the preliminary first layer includes: depositing a first metal oxide on the spacer, and Forming the preliminary second layer includes depositing a second metal oxide on the etched preliminary first layer and the spacer.

15. The method of manufacturing a light-emitting display device according to claim 13, further comprising: The stepped portion is formed by ash-processing a portion of the spacer.

16. The method of manufacturing a light-emitting display device according to claim 15, wherein, Forming the stepped portion includes: performing plasma treatment on the surface of the stepped portion.

17. The method of manufacturing a light-emitting display device according to claim 15, wherein, The formation of the stepped portion is performed by ashing the area of ​​the spacer that does not overlap with the etched preliminary first layer.

18. The method of manufacturing a light-emitting display device according to claim 13, wherein, The spacer includes a central portion containing the center of the spacer, a stepped portion surrounding the central portion, and a peripheral portion surrounding the stepped portion. Forming the first layer and the second layer includes etching the etched preliminary first layer and the preliminary second layer formed on the peripheral portion.

19. The method of manufacturing a light-emitting display device according to claim 18, wherein, Etching the etched initial first layer includes: forming a first layer wing located on the stepped portion, and Forming the second layer includes: forming a second wing located on the first wing to form a protective wing.

20. The method of manufacturing a light-emitting display device according to claim 19, wherein, Forming the protective wing includes etching the etched preliminary first layer and the preliminary second layer such that the ends of the protective wing have an inner angle of 30° to 50°.

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