Embedded chip of new energy automobile automatic parking software

Abstract

The invention discloses an embedded chip of automatic parking software of a new energy automobile, which comprises a substrate, a PCB (Printed Circuit Board), welding pins, a heat dissipation mechanism, an embedded chip body, heat dissipation holes, a heat conduction piece, heat dissipation salient points and a supporting mechanism, the lower end of the substrate is fixedly connected with the welding pins, the heat dissipation mechanism is arranged on the substrate, and the heat conduction piece is fixedly connected with the heat dissipation mechanism. An embedded chip body is arranged at the upper end of the PCB, heat dissipation holes are formed in the PCB, a heat conduction piece is fixedly connected to the lower end of the PCB, heat dissipation protruding points are fixedly connected to the heat conduction piece, and the PCB and the substrate are jointly provided with a supporting mechanism. The invention relates to an embedded chip of automatic parking software of a new energy automobile, which has the function of effectively dissipating heat of an embedded chip body and a PCB (Printed Circuit Board) and has the characteristic of releasing and buffering the impact force borne by the PCB.

Description

Technical Field

[0001] This invention belongs to the field of embedded chip technology, specifically an embedded chip for automatic parking software for new energy vehicles. Background Technology

[0002] As we all know, with the increasing scarcity of non-renewable resources such as oil and coal, the focus of global energy strategies has shifted to the field of new energy. As a result, the electric vehicle trend has been unstoppable in recent years, and there are many well-developed new energy electric vehicles to replace traditional fuel vehicles and avoid the problem of increasing shortage of traditional energy.

[0003] Currently, as a new force in car manufacturing, new energy electric vehicles mainly use a three-electric system for control, abandoning the traditional internal combustion engine structure, and are equipped with high-precision PCB chip vehicle systems to control the overall operation of electric vehicles. Among them, the embedded chip of the automatic parking software for new energy vehicles is one of the components of the control system, which can greatly improve the efficiency of parking.

[0004] However, existing embedded chips in automatic parking software for new energy vehicles also have certain shortcomings. First, most embedded chips in existing automatic parking software are fixed to the substrate using screws or welding. External forces such as vibration can cause rigid impacts to the embedded chips, hindering their long-term use. Second, existing automatic parking software simply uses heat dissipation holes and heat-conducting components to cool the PCB board and embedded chips. Due to the poor efficiency of natural heat dissipation, the heat dissipation effect on the PCB board and embedded chips is weak under high-speed operation. Therefore, improvements are needed. Summary of the Invention

[0005] The purpose of this invention is to provide an embedded chip for automatic parking software for new energy vehicles in order to solve the above-mentioned problems, thereby solving the problems mentioned in the background art.

[0006] To address the above problems, the present invention provides a technical solution:

[0007] An embedded chip for automatic parking software of new energy vehicles includes a substrate, a PCB board, soldering pins, a heat dissipation mechanism, an embedded chip body, heat dissipation holes, a heat-conducting component, heat dissipation bumps, and a support mechanism. The lower end of the substrate is fixedly connected to soldering pins, and a heat dissipation mechanism is provided on the substrate. The upper end of the PCB board is provided with the embedded chip body. Heat dissipation holes are opened in the PCB board. The lower end of the PCB board is fixedly connected to a heat-conducting component, and heat dissipation bumps are fixedly connected to the heat-conducting component. A support mechanism is provided on both the PCB board and the substrate.

[0008] Preferably, the heat dissipation mechanism includes a reversible motor, a first gear, a threaded rod, a second gear, a moving plate, a silent fan, a slide cylinder, a guide rod, an impact ball, a square plate, an impact block, a filter screen, a fixed plate, a top rod, an end plate, and a first spring. The reversible motor is fixedly installed inside the base plate. A first gear is fixedly sleeved on the outer side of the output shaft of the reversible motor. A threaded rod is installed inside the base plate via a bearing. A second gear is fixedly sleeved on the outer side of the threaded rod, meshing with the first gear. A moving plate is threadedly connected to the outer side of the threaded rod. A silent fan is fixedly connected to the moving plate. A slide cylinder is fixedly connected inside the base plate. A guide rod is slidably connected inside the slide cylinder. The guide rod is slidably connected to the base plate and fixedly connected to the silent fan. Through the arrangement of the reversible motor, the second gear, and other structures, the threaded rod can be driven to rotate, thereby moving the silent fan.

[0009] Preferably, an impact ball is fixedly connected to the threaded rod, a square plate is slidably connected inside the base plate, an impact block is fixedly connected to the square plate, the impact block contacts the impact ball, and a filter screen is fixedly connected inside the square plate. Through the arrangement of the impact ball, impact block and other structures, the square plate can be pushed to move, thereby driving the filter screen to move.

[0010] Preferably, a fixing plate is fixedly connected inside the substrate, a top rod is slidably connected inside the fixing plate, an end plate is fixedly connected to the top rod, the end plate is slidably connected to the substrate, the end plate is fixedly connected to the square plate, and a spring is provided on the outside of the top rod. One end of the spring is welded to the end plate, and the other end of the spring is welded to the fixing plate. The end plate can be connected and used by the spring.

[0011] Preferably, the filter screen is rectangular in shape and is made of stainless steel dense woven mesh. By setting the filter screen, dust and other impurities in the air can be filtered out, avoiding the problem of dust and other impurities adhering to the surface of the fan blades of the silent fan, which would cause poor rotation efficiency.

[0012] Preferably, the support mechanism includes a support column, a second spring, a protective sleeve, a sliding column, a friction block, a wear hole, a connecting rod, a wear ball, and an elastic airbag. The support column is fixedly connected inside the PCB board and slidably connected to the substrate. A second spring is provided on the outer side of the support column, with one end welded to the PCB board and the other end welded to the substrate. A protective sleeve is provided on the outer side of the second spring. A sliding column is fixedly connected to the support column, and a friction block is adhered to the sliding column, slidably connected to the substrate. A wear hole is formed inside the sliding column. A connecting rod is slidably connected inside the substrate, and a wear ball is fixedly connected to the connecting rod, slidably connected to the wear hole. An elastic airbag is adhered to the connecting rod, with the other end of the elastic airbag adhered to the substrate. Through the arrangement of the second spring, the support column, and other structures, the PCB board can be supported.

[0013] Preferably, one end of the protective sleeve is bonded to the PCB board, and the other end of the protective sleeve is bonded to the substrate. The protective sleeve can protect the second spring.

[0014] Preferably, multiple wear holes are provided, and the multiple wear holes are evenly distributed on the sliding column. By providing wear holes, they can be used in conjunction with wear balls to reduce friction and wear.

[0015] The beneficial effects of this invention are as follows: This invention relates to an embedded chip for automatic parking software of new energy vehicles, which has the function of effectively dissipating heat from the embedded chip body and PCB board, and can release and buffer the impact force borne by the PCB board. In specific use, compared with traditional embedded chips for automatic parking software of new energy vehicles, it has the following beneficial effects:

[0016] Firstly, by setting up a heat dissipation mechanism, a forward and reverse motor, gear one, a threaded rod, gear two, a moving plate, a silent fan, a slide, a guide rod, and an impact ball, the forward and reverse motor drives gear one to rotate, which in turn drives gear two to rotate, which in turn drives the threaded rod to rotate, pushing the moving plate to slide, and in turn driving the silent fan core to move, effectively dissipating heat from the PCB board and the embedded chip body. Under the action of the filter, dust and other impurities in the air can be filtered out. Under the action of the impact ball and spring one, the filter can be shaken, thereby cleaning the impurities and preventing the filter from becoming clogged, which would cause poor air circulation.

[0017] Secondly, by setting up a support mechanism, support column, spring 2, protective sleeve, sliding column, friction block, wear hole, connecting rod, wear ball and other structures, the PCB board can be supported by the support column and spring 2. Under the deformation of spring 2, the external force impact on the PCB board can be released. Under the action of wear hole, wear ball and friction block and other structures, the excess deformation stress generated by spring 2 can be frictionally worn away, avoiding the problem of excessive vibration of spring 2. Attached Figure Description

[0018] For ease of explanation, the present invention will be described in detail below with reference to specific embodiments and accompanying drawings.

[0019] Figure 1 This is a perspective view of the overall structure of the present invention;

[0020] Figure 2 For the present invention Figure 1 A front sectional view;

[0021] Figure 3 For the present invention Figure 2 Enlarged view of the heat dissipation mechanism;

[0022] Figure 4 For the present invention Figure 3 Enlarged view of point A;

[0023] Figure 5 For the present invention Figure 3 Enlarged view of point B;

[0024] Figure 6 For the present invention Figure 2 Enlarged view of the local support structure;

[0025] Figure 7 For the present invention Figure 6 Enlarged view of point C.

[0026] In the diagram: 1. Substrate; 2. PCB board; 3. Soldering pins; 4. Heat dissipation mechanism; 5. Embedded chip body; 6. Heat dissipation hole; 7. Heat-conducting component; 8. Heat dissipation bump; 9. Support mechanism; 41. Forward and reverse motor; 42. Gear 1; 43. Threaded rod; 44. Gear 2; 45. Moving plate; 46. Silent fan; 47. Slide cylinder; 48. Guide rod; 49. Impact ball; 491. Square plate; 492. Impact block; 493. Filter screen; 494. Fixing plate; 495. Top rod; 496. End plate; 497. Spring 1; 91. Support column; 92. Spring 2; 93. Protective sleeve; 94. Slide column; 95. Friction block; 96. Wear hole; 97. Connecting rod; 98. Wear ball; 99. Elastic airbag. Detailed Implementation

[0027] like Figure 1-7 As shown, the specific implementation adopts the following technical solution:

[0028] Example:

[0029] An embedded chip for automatic parking software of new energy vehicles includes a substrate 1, a PCB board 2, soldering pins 3, a heat dissipation mechanism 4, an embedded chip body 5, heat dissipation holes 6, a heat-conducting component 7, heat dissipation bumps 8, and a support mechanism 9. The lower end of the substrate 1 is fixedly connected to the soldering pins 3, and the heat dissipation mechanism 4 is provided on the substrate 1. The upper end of the PCB board 2 is provided with the embedded chip body 5. The PCB board 2 has heat dissipation holes 6. The lower end of the PCB board 2 is fixedly connected to the heat-conducting component 7, and the heat dissipation bumps 8 are fixedly connected on the heat-conducting component 7. The PCB board 2 and the substrate 1 are jointly provided with the support mechanism 9.

[0030] The heat dissipation mechanism 4 includes a reversible motor 41, a first gear 42, a threaded rod 43, a second gear 44, a moving plate 45, a silent fan 46, a slide cylinder 47, a guide rod 48, an impact ball 49, a square plate 491, an impact block 492, a filter screen 493, a fixed plate 494, a top rod 495, an end plate 496, and a first spring 497. The reversible motor 41 is fixedly installed inside the base plate 1. A first gear 42 is fixedly sleeved on the outer side of the output shaft of the reversible motor 41. A threaded rod 43 is installed inside the base plate 1 via a bearing. A second gear 44 is fixedly sleeved on the outside, and the second gear 44 meshes with the first gear 42. A movable plate 45 is threadedly connected to the outside of the threaded rod 43, and a silent fan 46 is fixedly connected to the movable plate 45. A slide cylinder 47 is fixedly connected inside the base plate 1, and a guide rod 48 is slidably connected inside the slide cylinder 47. The guide rod 48 is slidably connected to the base plate 1 and fixedly connected to the silent fan 46. Through the arrangement of the forward and reverse motor 41, the second gear 44, and other structures, the threaded rod 43 can be driven to rotate, thereby driving the silent fan 46 to move.

[0031] The threaded rod 43 is fixedly connected to an impact ball 49, a square plate 491 is slidably connected inside the base plate 1, an impact block 492 is fixedly connected to the square plate 491, the impact block 492 is in contact with the impact ball 49, and a filter screen 493 is fixedly connected inside the square plate 491. Through the arrangement of the impact ball 49, impact block 492 and other structures, the square plate 491 can be pushed to move, thereby driving the filter screen 493 to move.

[0032] The base plate 1 is fixedly connected to a fixing plate 494, and a top rod 495 is slidably connected to the fixing plate 494. An end plate 496 is fixedly connected to the top rod 495. The end plate 496 is slidably connected to the base plate 1 and fixedly connected to the square plate 491. A spring 497 is provided on the outside of the top rod 495. One end of the spring 497 is welded to the end plate 496, and the other end of the spring 497 is welded to the fixing plate 494. The end plate 496 can be connected and used through the setting of the spring 497.

[0033] The filter screen 493 is rectangular in shape and is made of stainless steel dense mesh. By setting the filter screen 493, dust and other impurities in the air can be filtered out, avoiding the problem of dust and other impurities adhering to the surface of the fan blades of the silent fan 46, which would cause poor rotation efficiency.

[0034] The support mechanism 9 includes a support column 91, a second spring 92, a protective sleeve 93, a sliding column 94, a friction block 95, a wear hole 96, a connecting rod 97, a wear ball 98, and an elastic airbag 99. The support column 91 is fixedly connected inside the PCB board 2 and is slidably connected to the substrate 1. A second spring 92 is provided on the outer side of the support column 91. One end of the second spring 92 is welded to the PCB board 2, and the other end is welded to the substrate 1. A protective sleeve 93 is provided on the outer side of the second spring 92. A sliding column 94 is fixedly connected to the upper part of the substrate 1. A friction block 95 is bonded to the sliding column 94. The friction block 95 is slidably connected to the substrate 1. A wear hole 96 is opened in the sliding column 94. A connecting rod 97 is slidably connected to the substrate 1. A wear ball 98 is fixedly connected to the connecting rod 97. The wear ball 98 is slidably connected to the wear hole 96. An elastic airbag 99 is bonded to the connecting rod 97. The other end of the elastic airbag 99 is bonded to the substrate 1. Through the setting of spring 2 92, support column 91 and other structures, the PCB board 2 can be supported.

[0035] One end of the protective sleeve 93 is bonded to the PCB board 2, and the other end of the protective sleeve 93 is bonded to the substrate 1. The protective sleeve 93 can protect the spring 92.

[0036] The wear holes 96 are provided in multiple ways and are evenly distributed on the sliding column 94. The wear holes 96 can be used in conjunction with the wear balls 98 to reduce friction.

[0037] The invention is used as follows: In use, the support column 91, spring 92, and protective sleeve 93 support the PCB board 2. When the PCB board 2 is subjected to external impact, the support column 91 slides along the inner wall of the substrate 1, the spring 92 deforms under force to release the external force, and the sliding column 94 moves under force to drive the friction block 95 to slide along the inner wall of the substrate 1. The wear hole 96 is pressed against the wear ball 98, and the wear ball 98 pushes the connecting rod 97 to move. The elastic airbag... 99 deforms under force, eventually causing the wear ball 98 to detach from the wear hole 96. Under the action of force, the wear ball 98 slides along the surface of the sliding column 94. When the wear ball 98 slides into the next wear hole 96, the elastic air bag 99 restores its deformation to push the wear ball 98 into the wear hole 96. This process repeats continuously. With the coordinated use of the friction block 95, wear ball 98, wear hole 96 and other structures, the excess deformation stress generated by the second spring 92 can be treated by friction and wear, avoiding the problem of excessive vibration of the second spring 92.

[0038] When the silent fan 46 is activated, it can blow air to circulate rapidly and dissipate heat from the PCB board 2 and the embedded chip body 5. When the forward and reverse motor 41 is activated, it drives the gear 1 42 to rotate. Under the meshing relationship, the gear 1 42 drives the gear 2 44 to rotate. The gear 2 44 is forced to drive the threaded rod 43 to rotate. Under the threaded connection, it pushes the moving plate 45 to move, which in turn drives the silent fan 46 to move. The silent fan 46 is lifted by the guide rod 48 and slides along the slide cylinder 47 and the inner wall of the substrate 1 to guide the silent fan 46 and ensure its effective movement. This allows the silent fan 46 to perform mobile heat dissipation and improve the heat dissipation effect.

[0039] During this process, under the action of filter screen 493, dust and other impurities in the air can be filtered out. The threaded rod 43 is forced to rotate the impact ball 49. When the impact ball 49 squeezes the impact block 492, the impact block 492 is forced to push the square plate 491 to move, thereby driving the filter screen 493 to move. The square plate 491 is forced to move the end plate 496, thereby pushing the top rod 495 to slide. The spring 497 is deformed by force. When the impact ball 49 disengages from the impact block 492, the spring 497 returns to its original deformation, thereby pushing the end plate 496 to move upward, and thus driving the filter screen 493 to move. This cycle repeats, causing the filter screen 493 to shake back and forth, cleaning the dust and other impurities attached to the filter screen 493, and preventing the filter screen 493 from becoming clogged, which would cause poor air circulation.

[0040] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the present invention. Various changes and modifications can be made to the present invention without departing from its spirit and scope. All such changes and modifications fall within the scope of the present invention as claimed, which is defined by the appended claims and their equivalents.

Claims

1. An embedded chip for automatic parking software of new energy vehicles, comprising a substrate (1), a PCB board (2), soldering pins (3), a heat dissipation mechanism (4), an embedded chip body (5), heat dissipation holes (6), a heat-conducting component (7), heat dissipation bumps (8), and a support mechanism (9), characterized in that: The lower end of the substrate (1) is fixedly connected to a soldering pin (3), a heat dissipation mechanism (4) is provided on the substrate (1), an embedded chip body (5) is provided on the upper end of the PCB board (2), a heat dissipation hole (6) is provided in the PCB board (2), a heat conduction component (7) is fixedly connected to the lower end of the PCB board (2), a heat dissipation bump (8) is fixedly connected to the heat conduction component (7), and a support mechanism (9) is provided on both the PCB board (2) and the substrate (1).

2. The embedded chip for automatic parking software for new energy vehicles according to claim 1, characterized in that: The heat dissipation mechanism (4) includes a reversible motor (41), a first gear (42), a threaded rod (43), a second gear (44), a moving plate (45), a silent fan (46), a slide cylinder (47), a guide rod (48), an impact ball (49), a square plate (491), an impact block (492), a filter screen (493), a fixed plate (494), a top rod (495), an end plate (496), and a first spring (497). The reversible motor (41) is fixedly installed inside the base plate (1). The first gear (42) is fixedly sleeved on the outside of the output shaft of the reversible motor (41). A threaded rod (43) is installed inside the base plate (1) via a bearing. A gear two (44) is fixedly sleeved on the outside of the threaded rod (43). The gear two (44) meshes with the gear one (42). A movable plate (45) is threadedly connected to the outside of the threaded rod (43). A silent fan (46) is fixedly connected to the movable plate (45). A slide cylinder (47) is fixedly connected inside the base plate (1). A guide rod (48) is slidably connected inside the slide cylinder (47). The guide rod (48) is slidably connected to the base plate (1). The guide rod (48) is fixedly connected to the silent fan (46).

3. The embedded chip for automatic parking software for new energy vehicles according to claim 2, characterized in that: An impact ball (49) is fixedly connected to the threaded rod (43), a square plate (491) is slidably connected inside the base plate (1), an impact block (492) is fixedly connected to the square plate (491), the impact block (492) contacts the impact ball (49), and a filter screen (493) is fixedly connected inside the square plate (491).

4. The embedded chip for automatic parking software for new energy vehicles according to claim 2, characterized in that: A fixing plate (494) is fixedly connected inside the substrate (1). A top rod (495) is slidably connected inside the fixing plate (494). An end plate (496) is fixedly connected to the top rod (495). The end plate (496) is slidably connected to the substrate (1). The end plate (496) is fixedly connected to the square plate (491). A spring (497) is provided on the outside of the top rod (495). One end of the spring (497) is welded to the end plate (496), and the other end of the spring (497) is welded to the fixing plate (494).

5. The embedded chip for automatic parking software for new energy vehicles according to claim 2, characterized in that: The filter screen (493) is rectangular in shape and is made of stainless steel dense woven mesh.

6. The embedded chip for automatic parking software for new energy vehicles according to claim 1, characterized in that: The support mechanism (9) includes a support column (91), a second spring (92), a protective sleeve (93), a sliding column (94), a friction block (95), a wear hole (96), a connecting rod (97), a wear ball (98), and an elastic airbag (99). The support column (91) is fixedly connected inside the PCB board (2). The support column (91) is slidably connected to the substrate (1). A second spring (92) is provided on the outside of the support column (91). One end of the second spring (92) is welded to the PCB board (2), and the other end of the second spring (92) is welded to the substrate (1). A protective sleeve (93) is provided on the outside. A sliding column (94) is fixedly connected to the support column (91). A friction block (95) is bonded to the sliding column (94). The friction block (95) is slidably connected to the base plate (1). A wear hole (96) is opened in the sliding column (94). A connecting rod (97) is slidably connected to the base plate (1). A wear ball (98) is fixedly connected to the connecting rod (97). The wear ball (98) is slidably connected to the wear hole (96). An elastic airbag (99) is bonded to the connecting rod (97). The other end of the elastic airbag (99) is bonded to the base plate (1).

7. The embedded chip for automatic parking software for new energy vehicles according to claim 6, characterized in that: One end of the protective sleeve (93) is bonded to the PCB board (2), and the other end of the protective sleeve (93) is bonded to the substrate (1).

8. The embedded chip for automatic parking software for new energy vehicles according to claim 6, characterized in that: Multiple wear holes (96) are provided, and the multiple wear holes (96) are evenly distributed on the slide column (94).

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