Micro-channel layer and micro-channel cold plate
By employing a multi-layer metal foil hollowed-out mesh structure and a complex flow channel design in the microfluidic cold plate, the problem of simple flow patterns in existing microfluidic cold plates is solved, achieving efficient solid-liquid heat exchange and stable heat dissipation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- FUZHOU BOJING SEMICONDUCTOR CO LTD
- Filing Date
- 2025-12-18
- Publication Date
- 2026-04-24
AI Technical Summary
The existing microchannel cold plates have a simple flow channel structure, resulting in a simple cooling fluid flow pattern that cannot generate effective disturbance. This leads to a large thermal resistance at the solid-liquid interface, which cannot meet the heat dissipation requirements of high power density chips.
It adopts a multi-layer structure of metal foils, each of which has a hollowed-out grid. The grid lines are connected through the mesh of adjacent foils, and the cooling fluid generates disturbance when it flows through. Combined with the design of manifold layer and bottom plate layer, a complex flow channel structure is formed to enhance heat exchange.
By generating disturbances to reduce the thermal resistance at the solid-liquid interface, the heat dissipation effect is improved, meeting the heat dissipation requirements of high power density chips. It also has good structural stability and is suitable for high-voltage environments.
Smart Images
Figure CN121925127A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of heat dissipation device technology, and in particular to a microchannel layer and a microchannel cold plate. Background Technology
[0002] As chip power density continues to increase, heat dissipation has become a key factor limiting its performance, especially during chip testing, where precise temperature control is required to ensure the validity of test results. While liquid cooling technology has become the mainstream solution due to the superior thermal conductivity of the cooling fluid, its effectiveness hinges on the flow pattern and channel structure of the cooling fluid. Current mainstream microchannel cold plates (such as two-dimensional parallel channels created through shoveling and milling) have inherent drawbacks: their channel structure is simple and fixed in direction, resulting in a simple cooling fluid flow pattern that cannot generate effective disturbance, leading to high thermal resistance at the solid-liquid interface. This makes them unable to meet the heat dissipation requirements of high-power-density chips. Summary of the Invention
[0003] The main objective of this invention is to provide a microchannel layer that effectively disturbs the cooling fluid, reduces the thermal resistance of the solid-liquid interface, and thus meets the heat dissipation requirements of high power density chips.
[0004] To achieve the above objectives, the microchannel layer proposed in this invention includes multiple stacked metal foils, each of which has a perforated mesh. The mesh openings of the multiple metal foils are interconnected, and the mesh lines of the metal foils pass through the mesh openings of adjacent metal foils, so that the cooling fluid generates disturbance when flowing through two adjacent metal foils.
[0005] Optionally, in the three adjacent metal foils, the mesh openings of two alternately arranged metal foils are connected, and the mesh lines of the middle metal foil are passed through the mesh openings of the two alternately arranged metal foils, so as to generate disturbance when the cooling fluid flows along the thickness direction of the metal foil.
[0006] Optionally, the metal foil includes horizontal and inclined mesh lines forming the perforated grid, and the inclined mesh line of the middle metal foil passes through the mesh of two alternately arranged metal foils, so as to disturb the cooling fluid flowing through the inclined mesh line.
[0007] Optionally, the plurality of metal foils include a first metal foil and a second metal foil, which are alternately stacked to align the horizontal mesh lines of the first metal foil and the second metal foil, while the inclined mesh lines of the first metal foil and the second metal foil disturb the cooling fluid.
[0008] Optionally, the first metal foil and the second metal foil have the same pattern of perforated grid, so that the first metal foil and the second metal foil are aligned with horizontal grid lines by alternating overlapping of the front and back sides, and their inclined grid lines cause disturbance to the cooling fluid flowing through them.
[0009] The present invention also proposes a microchannel cold plate, comprising a manifold layer, a base plate layer and the aforementioned microchannel layer, wherein the base plate layer is positioned close to the heating element, the microchannel layer is disposed between the manifold layer and the base plate layer, and the manifold layer has an inlet and an outlet communicating with the microchannel layer.
[0010] Optionally, the manifold layer includes a manifold section and a drainage section stacked together. The manifold section has the liquid inlet and the liquid outlet, and the drainage section has a drainage channel. The liquid inlet and the liquid outlet are connected to the microchannel layer through the drainage channel.
[0011] Optionally, the drainage section has multiple drainage channels, which are spaced apart along the length of the microchannel layer and extend along the width of the microchannel layer. Adjacent drainage channels are respectively connected to the inlet and the outlet.
[0012] Optionally, the drainage channel has two end faces facing away from each other, and the flow area of the end face of the drainage channel near the manifold is larger than the flow area of the end face of the drainage channel near the microchannel layer, so that the drainage channel is narrowed and the cooling fluid flowing out of the inlet is sprayed onto the microchannel layer.
[0013] Optionally, the flow channel includes a plurality of flow channels arranged in alignment. Along the direction from the manifold to the microchannel layer, the length of the plurality of flow channels arranged in an increasing trend and their width arranged in a narrowing trend, so that the cooling fluid is sprayed onto the perforated grid of the microchannel layer along the width direction of the microchannel layer.
[0014] In the technical solution of the present invention, the microchannel layer includes multiple metal foils, each metal foil having a hollowed-out mesh. The mesh openings of the multiple metal foils are interconnected, and the mesh lines of the metal foils pass through the mesh openings of adjacent metal foils. In this way, when the cooling fluid flows through two adjacent metal foils, it generates disturbance, thereby reducing the thermal resistance of the solid-liquid interface, enhancing the solid-liquid heat exchange, improving the heat dissipation effect, and meeting the heat dissipation requirements of high power density chips. Attached Figure Description
[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0016] Figure 1 This is a schematic diagram of the structure of a microchannel cold plate according to an embodiment of the present invention; Figure 2 for Figure 1 Exploded view of a microchannel cold plate; Figure 3 for Figure 2 Exploded view of the middle manifold; Figure 4 for Figure 2 Exploded view of a portion of the microchannel layer; Figure 5 for Figure 2 A partial cross-sectional view of the microchannel layer; Figure 6 for Figure 5 Enlarged view of section A; Explanation of icon numbers: The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.
[0018] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.
[0019] See Figures 1 to 6 As shown, in one embodiment of the present invention, a microchannel layer includes a plurality of stacked metal foils, each of which has a perforated grid. The mesh openings of the plurality of metal foils are interconnected, and the mesh lines of the metal foils pass through the mesh openings of adjacent metal foils, so that the cooling fluid generates disturbance when flowing through two adjacent metal foils.
[0020] In the technical solution of the present invention, the microchannel layer includes multiple metal foils, each metal foil having a hollowed-out mesh. The mesh openings of the multiple metal foils are interconnected, and the mesh lines of the metal foils pass through the mesh openings of adjacent metal foils. In this way, when the cooling fluid flows through two adjacent metal foils, it generates disturbance, thereby reducing the thermal resistance of the solid-liquid interface, enhancing the solid-liquid heat exchange, improving the heat dissipation effect, and meeting the heat dissipation requirements of high power density chips.
[0021] It should be noted that the metal foil in this embodiment can be made of a thermally conductive metal with good thermal conductivity. The thermally conductive metal can be copper foil, aluminum foil, or even a precious metal. Preferably, the thickness of the metal foil in this embodiment is 0.02~2mm. The number of layers of the metal foil can be set as needed. Preferably, the number of layers of the metal foil is 2~1000. The metal foil can be laser-cut or chemically etched to form a hollow grid. The metal foil can form a hollow grid with horizontal and vertical mesh lines, or with horizontal and inclined mesh lines. In this embodiment, a microchannel is formed by the hollow grid of multiple stacked metal foils. Preferably, the width of the microchannel is 10~1000μm and the depth of the microchannel is 10~1000μm. In this embodiment, the aspect ratio of the microchannel can be adjusted to increase the heat exchange area of the solid-liquid heat exchange, thereby ensuring sufficient heat exchange between the solid and liquid and improving the heat dissipation effect. In this embodiment, the mesh of the metal foil passes through the mesh openings of adjacent metal foils. This creates disturbance when the cooling fluid flows through adjacent metal foils. The cooling fluid can be cooling water, condensate, fluorinated liquid, silicone oil, or a phase change fluid such as refrigerant or Freon, as long as it can effectively absorb heat. For ease of explanation, this embodiment uses coolant as an example. Furthermore, the multiple metal foils stacked in this embodiment can be thermo-bonded, friction-welded, or metal-welded, as long as a metallurgical bond is formed between the multiple metal foils. This embodiment is not limited to these methods, and all are within the scope of protection of this embodiment. Preferably, the multiple metal foils stacked in this embodiment are thermo-bonded. This embodiment achieves a metallurgical bond between the multiple metal foils through thermo-bonding, ensuring that no weld seams appear between the multiple metal foils and the leakage rate is less than 10%. -6 mL / h avoids liquid leakage and the influence of interfacial thermal resistance, thereby improving the heat dissipation effect of the microchannel layer.
[0022] See Figures 1 to 6As shown, in one embodiment of the present invention, among the three adjacent metal foils, the meshes of two metal foils arranged alternately are connected, and the mesh lines of the middle metal foil are passed through the meshes of the two metal foils arranged alternately, so as to generate disturbance when the coolant flows along the thickness direction of the metal foil. It should be noted that the three adjacent metal foils in this embodiment include a first metal foil 110, a second metal foil 130 and a first metal foil 110 stacked in sequence. The first mesh 110a of the two alternating first metal foils 110 are connected. The second metal foil 130 is the middle metal foil between the two alternating first metal foils 110. The mesh lines of the second metal foil 130 are passed through the first mesh 110a of the two first metal foils 110. In this way, when the coolant flows along the thickness direction (i.e., the Z direction) of the metal foil, this direction serves as the heat conduction direction. By setting the mesh lines along the heat convection direction, an effective disturbance is generated to the coolant, thereby reducing the thermal resistance of the solid-liquid interface, which is conducive to sufficient solid-liquid heat exchange and further improves the heat dissipation effect on the chip.
[0023] See Figures 1 to 6 As shown, in one embodiment of the present invention, the metal foil includes horizontal and inclined mesh lines forming the perforated grid. The inclined mesh lines of the intermediate metal foil are inserted between the mesh openings of two alternately arranged metal foils, so as to disturb the flowing coolant through the inclined mesh lines. It should be noted that in this embodiment, the metal foil forms a perforated grid with openings through the horizontal and inclined mesh lines. Thus, the multiple stacked metal foils achieve conductivity between the mesh openings distributed in the length and thickness directions through the inclined mesh lines. Specifically, the first metal foil 110 includes a first horizontal mesh line 111 and a first inclined mesh line 113. The first horizontal mesh line 111 and the first inclined mesh line 113 are angled together to form a perforated grid with multiple first mesh holes 110a. The second metal foil 130 includes a second horizontal mesh line 131 and a second inclined mesh line 133. The second horizontal mesh line 131 and the second inclined mesh line 133 are angled together to form a perforated grid with multiple second mesh holes 130a. The second inclined mesh line 133 of the second metal foil 130 is inserted through... Between the first mesh 110a of the two alternating first metal foils 110, when the coolant flows between the first mesh 110a of the two alternating first metal foils 110, the coolant is disturbed by the second inclined mesh line 133, and at the same time, the coolant is guided by the inclined mesh line to flow along the length direction (i.e., the Y direction) of the metal foil, thereby realizing the flow of coolant in two different directions, the Z direction and the Y direction, which further enhances the solid-liquid heat exchange and improves the heat dissipation effect on the chip.
[0024] See Figures 1 to 6As shown, in one embodiment of the present invention, the plurality of metal foils include a first metal foil 110 and a second metal foil 130. The first metal foil 110 and the second metal foil 130 are alternately stacked so that when the horizontal mesh lines of the first metal foil 110 and the second metal foil 130 are aligned, the inclined mesh lines of the first metal foil 110 and the second metal foil 130 disturb the flowing coolant. It should be noted that in this embodiment, the inclination angle of the first inclined mesh line 113 of the first metal foil 110 relative to the first horizontal mesh line 111 can be the same as or different from the inclination angle of the second inclined mesh line 133 of the second metal foil 130 relative to the second horizontal mesh line 131, as long as the included angle between the first inclined mesh line 113 and the second inclined mesh line 133 is set. This embodiment is not limited to this, and all of the above are within the protection scope of the present invention. In this embodiment, on the one hand, the horizontal mesh lines of the first metal foil 110 and the second metal foil 130 are aligned to form the main channel of the coolant. The coolant achieves convective heat exchange through the flow of the coolant in the main channel (i.e., the Z direction), thereby ensuring efficient heat dissipation for the chip. On the other hand, the angle between the inclined mesh lines of the first metal foil 110 and the second metal foil 130 is set to generate effective disturbance while enhancing the planar strength of the metal foil, avoiding deformation of the metal foil caused by the high-pressure jet of the coolant, thus facilitating stable heat dissipation for the chip.
[0025] See Figures 1 to 6As shown, in one embodiment of the present invention, the first metal foil 110 and the second metal foil 130 have the same pattern of perforated grid, so that the first metal foil 110 and the second metal foil 130 are aligned by alternating overlapping of the front and back sides, and the inclined grid lines of the first metal foil 110 and the second metal foil 130 disturb the flowing cooling fluid. It should be noted that in this embodiment, the first metal foil 110 and the second metal foil 130 have the same pattern of perforated grid. The first metal foil 110 and the second metal foil 130 are stacked alternately on their front and back sides, that is, the front side of the first metal foil 110 faces up and the back side of the second metal foil 130 faces up. The first metal foil 110, the second metal foil 130, the first metal foil 110, the second metal foil 130, ..., and so on, with multiple metal foils stacked alternately. In this way, when the first horizontal grid line 111 of the first metal foil 110 is aligned with the second horizontal grid line 131 of the second metal foil 130, the angle between the first inclined grid line 113 of the first metal foil 110 and the second inclined grid line 133 of the second metal foil 130 is set. This embodiment forms a microchannel for coolant flow by alternating the front and back sides of multiple metal foil sheets, which facilitates the processing and shaping of the microchannel. While ensuring the processing accuracy of the microchannel, it reduces the processing cost and shortens the processing cycle, thus promoting the widespread application of microchannels.
[0026] See Figures 1 to 6As shown, in one embodiment of the present invention, a microchannel cold plate 1000 includes a manifold layer 300, a microchannel layer 100 and a base plate layer 500. The base plate layer 500 is used to be close to the heating element. The microchannel layer 100 is disposed between the manifold layer 300 and the base plate layer 500. The manifold layer 300 has an inlet 310a and an outlet 310b that communicate with the microchannel layer 100. It should be noted that the heat source can be a chip. The base plate layer 500 is close to the chip. The base plate layer 500 is heated and continuously conducts heat to the manifold layer 300. The liquid inlet 310a and the liquid outlet 310b can be set on the same side of the manifold layer 300, or they can be set on different sides of the manifold layer 300, as long as the liquid inlet 310a and the liquid outlet 310b are respectively connected to the microfluidic layer 100. In this embodiment, the coolant flows to the microfluidic layer 100 through the liquid inlet 310a and undergoes solid-liquid heat exchange in the microfluidic layer 100. After the heat exchange, the coolant flows out from the liquid outlet 310b. This cycle repeats, achieving efficient heat dissipation for the chip. It should be noted that in this embodiment, the manifold layer 300, microchannel layer 100, and base plate layer 500 are all structural components formed from a metal thermally conductive material. This metal thermally conductive material can be copper foil, aluminum foil, or even a precious metal, as long as it enables heat conduction. In this embodiment, the microchannel cold plate 1000 is formed from a metal thermally conductive material, resulting in a thermal resistance of 0.02~0.05ºC / W. This significantly reduces the thermal resistance at the solid-liquid interface, thereby enhancing solid-liquid heat exchange and improving heat dissipation. Furthermore, the microchannel cold plate 1000 can withstand water pressures exceeding 10 bar, preventing deformation after high-pressure coolant injection and ensuring stable heat dissipation. The microchannel cold plate 1000 in this embodiment achieves precise temperature control of the chip through efficient heat dissipation, and has broad application potential in chip testing systems, data servers, 5G base stations, electronic control systems, and aerospace electronic equipment.
[0027] See Figures 1 to 6As shown, in one embodiment of the present invention, the manifold layer 300 includes a manifold portion 310 and a drainage portion 330 stacked together. The manifold portion 310 has an inlet 310a and an outlet 310b, and the drainage portion 330 has a drainage channel 330a. The inlet 310a and the outlet 310b are connected to the microchannel layer 100 through the drainage channel 330a. It should be noted that in this embodiment, a universal joint 311 is installed on the surface of the manifold portion 310. The manifold portion 310 is installed and fixed through the universal joint 311, thereby adjusting the installation position and installation direction of the microchannel cold plate 1000. To facilitate drainage, the manifold section 310 is equipped with two manifolds to form an inlet 310a and an outlet 310b. The drainage section 330 has drainage channels 330a, which can have different shapes, such as being curved or elongated. The inlet 310a and outlet 310b can be connected to the two ends of the drainage channel 330a respectively, or the drainage section 330 can have multiple drainage channels 330a spaced apart, with each channel 330a connected to other channels. As long as the inlet 310a and outlet 310b are connected to the microchannel layer 100 through the flow channel 330a, the coolant flowing out of the inlet 310a flows to the microchannel layer 100 through the flow channel 330a to form a high-pressure zone. Under the influence of the water pressure, the water in the low-pressure zone of the microchannel layer 100 flows to the outlet 310b through the flow channel 330a, thereby achieving sufficient heat exchange between solid and liquid, thus improving the heat dissipation effect on the chip.
[0028] See Figures 1 to 6As shown, in one embodiment of the present invention, the drainage section 330 has multiple drainage channels 330a. These drainage channels 330a are spaced apart along the length direction of the microfluidic layer 100 and extend along the width direction of the microfluidic layer 100. Adjacent drainage channels 330a are connected to the inlet 310a and the outlet 310b, respectively. It should be noted that this embodiment has drainage channels 330a extending along the width direction (X direction) of the microfluidic layer 100. This allows the coolant flowing from the inlet 310a to flow through the drainage channels 330a, achieving a distribution of coolant along the width direction of the microfluidic layer 100. The coolant distributed along the width direction of the microfluidic layer 100 flows along the length direction (Y direction) and thickness direction (Z direction) of the microfluidic layer 100, thereby achieving solid-liquid heat exchange in three-dimensional space and improving the heat dissipation effect on the chip. Specifically, in this embodiment, the drainage section 330 has four drainage channels 330a, which are spaced apart along the length of the microfluidic layer 100, namely, a first drainage channel, a second drainage channel, a third drainage channel, and a fourth drainage channel. The four drainage channels 330a are alternately connected to the inlet 310a and the outlet 310b. For example, the first drainage channel is connected to the inlet 310a, the second drainage channel is connected to the outlet 310b, and the third drainage channel is connected to the inlet 310a. a) The fourth drainage channel flows through the pre-outlet 310b. In this way, the coolant flowing in from the inlet 310a flows to the microchannel layer 100 through the first and third drainage channels. Thus, the first and third drainage channels form a high-pressure zone, while the second and fourth drainage channels serve as low-pressure zones. The liquid flowing to the microchannel layer 100 flows out through the second and fourth drainage channels, so that the coolant continuously flows from the high-pressure zone to the low-pressure zone, thereby continuously carrying out solid-liquid heat exchange and achieving a highly efficient heat dissipation effect.
[0029] See Figures 1 to 6As shown, in one embodiment of the present invention, the flow channel 330a has two end faces facing away from each other. The flow area of the end face of the flow channel 330a near the manifold portion 310 is larger than the flow area of the end face of the flow channel 330a near the microchannel layer 100, so that the flow channel 330a is narrowed and the coolant flowing out of the inlet 310a is sprayed onto the microchannel layer 100. It should be noted that in this embodiment, the flow channel 330a can be narrowed by a gradual change, or by adjusting the length-to-width ratio of the flow channel 331a to different metal sheets 331. This embodiment is not limited to these methods, and all of the above are within the protection scope of this embodiment. In this embodiment, by using the narrowed flow channel 330a, the coolant flowing through it is gathered and accelerated to form a concentrated jet, so that the coolant can be sprayed into the deeper microchannel more quickly, thereby further reducing the solid-liquid interface thermal resistance, thereby fully carrying out solid-liquid heat exchange and further improving the heat dissipation effect on the chip.
[0030] See Figures 1 to 6 As shown, in one embodiment of the present invention, the drainage channel 330a includes a plurality of flow channels 331a arranged in alignment. Along the direction from the manifold portion 310 to the microchannel layer 100, the length of the plurality of flow channels 331a arranged in an increasing trend and their width arranged in a narrowing trend, so that the cooling fluid is sprayed onto the perforated grid of the microchannel layer 100 along the width direction of the microchannel layer 100. It should be noted that the drainage portion 330 in this embodiment includes a plurality of metal sheets 331 stacked in arrangement. Each metal sheet 331 has four flow channels 331a arranged at intervals. The plurality of flow channels 331a arranged in alignment form a drainage channel 330a. The plurality of metal sheets 331 stacked in this way form four drainage channels 330a arranged at intervals, namely the first drainage channel, the second drainage channel, the third drainage channel, and the fourth drainage channel. In this embodiment, by setting the length of the multiple channels 331a in an increasing trend and their width in a narrowing trend, the coolant is sprayed while ensuring that the sprayed coolant can be dispersed in the hollow mesh of the microchannel layer 100 along the width direction (X direction). In this way, the coolant dispersed along the width direction of the microchannel layer 100 flows along the thickness direction (Z direction) and length direction (Y direction) of the microchannel layer 100, thereby realizing the flow of coolant in three-dimensional space, thus fully realizing solid-liquid heat exchange, improving the heat dissipation effect, and facilitating precise control of chip temperature.
[0031] The above description is merely an optional embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.
Claims
1. A microchannel layer, characterized in that, It includes multiple metal foils stacked together, each of which has a perforated grid. The mesh openings of the multiple metal foils are interconnected, and the mesh lines of the metal foils pass through the mesh openings of adjacent metal foils, so that the cooling fluid is disturbed when it flows through two adjacent metal foils.
2. The microchannel layer according to claim 1, characterized in that, In the three adjacent metal foils, the mesh openings of two metal foils arranged alternately are connected, and the mesh lines of the middle metal foil are passed through the mesh openings of the two metal foils arranged alternately, so as to generate disturbance when the cooling fluid flows along the thickness direction of the metal foil.
3. The microchannel layer according to claim 2, characterized in that, The metal foil includes horizontal and inclined mesh lines forming the perforated grid. The inclined mesh line of the middle metal foil passes through the mesh of two alternately arranged metal foils to disturb the cooling fluid flowing through it.
4. The microchannel layer according to claim 3, characterized in that, The plurality of metal foils include a first metal foil and a second metal foil, which are alternately stacked to align the horizontal mesh lines of the first metal foil and the second metal foil, while the inclined mesh lines of the first metal foil and the second metal foil disturb the cooling fluid.
5. The microchannel layer according to claim 4, characterized in that, The first metal foil and the second metal foil have the same pattern of perforated grid, so that the first metal foil and the second metal foil are aligned with the horizontal grid lines by alternating overlapping of the front and back sides, and the inclined grid lines of the first metal foil and the second metal foil cause disturbance to the cooling fluid flowing through them.
6. A microchannel cold plate, characterized in that, It includes a manifold layer, a base plate layer, and a microchannel layer according to any one of claims 1 to 5, wherein the base plate layer is used to be close to the heating element, the microchannel layer is disposed between the manifold layer and the base plate layer, and the manifold layer has an inlet and an outlet communicating with the microchannel layer.
7. The microchannel cold plate as described in claim 6, characterized in that, The manifold layer includes a manifold section and a drainage section stacked together. The manifold section has the liquid inlet and the liquid outlet, and the drainage section has a drainage channel. The liquid inlet and the liquid outlet are connected to the microchannel layer through the drainage channel.
8. The microchannel cold plate as described in claim 7, characterized in that, The drainage section has multiple drainage channels, which are spaced apart along the length of the microchannel layer and extend along the width of the microchannel layer. Adjacent drainage channels are respectively connected to the inlet and the outlet.
9. The microchannel cold plate as described in claim 7, characterized in that, The drainage channel has two end faces facing away from each other. The flow area of the end face of the drainage channel near the manifold is larger than the flow area of the end face of the drainage channel near the microchannel layer, so that the drainage channel is narrowed and the cooling fluid flowing out of the inlet is sprayed onto the microchannel layer.
10. The microchannel cold plate as described in claim 9, characterized in that, The flow channel includes multiple flow channels arranged in alignment. Along the direction from the manifold to the microchannel layer, the length of the multiple flow channels arranged in an increasing trend and their width arranged in a narrowing trend, so that the cooling fluid is sprayed onto the hollow grid of the microchannel layer along the width direction of the microchannel layer.