Micro-channel layer and micro-channel cold plate

By employing a multi-layer metal foil hollowed-out mesh structure and a complex flow channel design in the microfluidic cold plate, the problem of simple flow patterns in existing microfluidic cold plates is solved, achieving efficient solid-liquid heat exchange and stable heat dissipation.

CN121925127APending Publication Date: 2026-04-24FUZHOU BOJING SEMICONDUCTOR CO LTD
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Patent Information

Application Number
CN202511918449.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-18
Publication Date
2026-04-24

AI Technical Summary

Technical Problem

The existing microchannel cold plates have a simple flow channel structure, resulting in a simple cooling fluid flow pattern that cannot generate effective disturbance. This leads to a large thermal resistance at the solid-liquid interface, which cannot meet the heat dissipation requirements of high power density chips.

Method used

It adopts a multi-layer structure of metal foils, each of which has a hollowed-out grid. The grid lines are connected through the mesh of adjacent foils, and the cooling fluid generates disturbance when it flows through. Combined with the design of manifold layer and bottom plate layer, a complex flow channel structure is formed to enhance heat exchange.

Benefits of technology

By generating disturbances to reduce the thermal resistance at the solid-liquid interface, the heat dissipation effect is improved, meeting the heat dissipation requirements of high power density chips. It also has good structural stability and is suitable for high-voltage environments.

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Abstract

The invention discloses a micro-channel layer and a micro-channel cold plate, the micro-channel layer comprises a plurality of metal foils, each metal foil is provided with a hollow grid, the meshes of the plurality of metal foils are communicated, and the mesh lines of the metal foils pass through the meshes of the adjacent metal foils, so that the mesh lines of the adjacent metal foils are communicated with the hollow grids. When cooling fluid flows through the two adjacent metal foils, disturbance is generated, so that the thermal resistance of a solid-liquid interface is reduced, solid-liquid heat exchange is enhanced, the heat dissipation effect is improved, and the heat dissipation requirement of a high-power-density chip is met.
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