Display device including semiconductor light emitting element and method of manufacturing same

Abstract

A display device including a semiconductor light emitting element of an embodiment includes: a display panel; and a frame connected to the display panel, the display panel including: a first display module and a second display module, each including a plurality of semiconductor light emitting elements disposed on a substrate and disposed adjacent to each other; and a seam filler disposed between the first display module and the second display module, one surface of the seam filler having a curved surface.

Description

Technical Field

[0001] The embodiments relate to a display device including a semiconductor light-emitting element and a method of manufacturing the same. Background Technology

[0002] Large-area display devices include liquid crystal displays (LCDs), OLED displays, and micro-LED displays.

[0003] Micro-LED displays are displays that use micro-LEDs, semiconductor light-emitting elements with a diameter or cross-sectional area of ​​less than 100µm, as display elements.

[0004] Micro-LED displays use semiconductor light-emitting elements, namely micro-LEDs, as display elements, thus possessing excellent performance in many characteristics such as brightness ratio, response speed, color reproduction rate, viewing angle, brightness, resolution, lifespan, luminous efficiency, or luminance.

[0005] In particular, micro-LED displays can separate and combine images in a modular manner, thus having the advantages of freely adjustable size or resolution and being able to demonstrate the advantages of flexible displays.

[0006] However, large-scale micro-LED displays require millions of micro-LEDs, which presents a technical challenge in rapidly and accurately transferring micro-LEDs onto the display panel.

[0007] In recent years, transfer technologies have been developed, including pick-and-place processes, laser lift-off methods, and self-assembly methods. Among these, the self-assembly method, which involves semiconductor light-emitting elements finding their own assembly positions within a fluid, is advantageous for display devices that can display large images.

[0008] On the other hand, conventional display devices using semiconductor light-emitting elements are manufactured by transferring the semiconductor light-emitting elements onto substrates such as module substrates or wiring substrates. However, productivity has declined due to issues such as the defect rate of semiconductor light-emitting elements during transfer, and there is a particularly low production output for large-area display devices.

[0009] To address this issue, in recent years, research has been conducted and developed on 'multi-screen display devices' that combine multiple semiconductor light-emitting element display modules with relatively small dimensions to create a large display device.

[0010] However, in the case of multi-screen display devices, gap areas may be generated between connected unit display devices due to the bezel areas existing at the edges of each unit display device. These bezel areas exist through side electrodes (or side wiring) for electrical connection between structures disposed on the upper part of the substrate and structures disposed on the lower part of the substrate.

[0011] When an image is displayed across the entire area of ​​a multi-screen display device, such gaps or boundary lines between modules are visually recognized as seams, creating a sense of discontinuity and disharmony in the image, thereby reducing the immersive experience.

[0012] Techniques that make the seams between display modules undetectable physically or optically require changes to process conditions or seam-eliminating processes during the manufacturing and assembly of the display modules, making it difficult to eliminate the seams after the display panel is completed.

[0013] In addition, eliminating seams after the display panel is completed requires changes in the process environment, such as creating a vacuum state. Summary of the Invention

[0014] Technical issues

[0015] The technical challenge of the embodiments lies in achieving seamlessness in the display device.

[0016] In addition, the technical challenge of the embodiment is to perform the seam elimination process without setting vacuum conditions.

[0017] In addition, the technical challenge of the embodiment is to achieve seamlessness through simplified processes after the display panel is manufactured.

[0018] The technical issues addressed in the embodiments are not limited to those described in this project, but include those that can be grasped from the description of the invention.

[0019] means of solving technical problems

[0020] The embodiment of the display device including semiconductor light-emitting elements includes: a display panel; and a frame connected to the display panel, the display panel including: a first display module and a second display module, which respectively include a plurality of semiconductor light-emitting elements disposed on a substrate and disposed adjacent to each other; and a joint filler material disposed between the first display module and the second display module, one side of the joint filler material having a curved surface.

[0021] In addition, in the embodiments, the first display module and the second display module include passivation layers disposed on adjacent surfaces, and the seam filling material may include a first region disposed to cover the passivation layer and a second region disposed between the first regions.

[0022] In addition, in the embodiments, the back side of the first region may have a recessed shape.

[0023] In addition, in the embodiments, the first region and the second region may have different heights.

[0024] In addition, in the embodiments, the horizontal width of the joint filler material may be greater than the interval between the first display module and the second display module.

[0025] In addition, in the embodiments, the seam filler material may include a hydrophilic material.

[0026] In addition, in the embodiment, the frame includes: a first frame disposed on the display panel; a second frame disposed on the first frame; and a third frame disposed on the second frame, wherein the spacing of the first frame may be smaller than the spacing of the second frame, and the spacing of the second frame may be smaller than the spacing of the third frame.

[0027] Another embodiment of a method for manufacturing a display device including a semiconductor light-emitting element may include the following steps: inserting a seam filler tube into the display device including a display panel; bringing the seam filler tube into contact with a seam area of ​​the display panel; injecting a seam filler material into the seam area through the seam filler tube; removing the seam filler tube; and hardening the seam filler material.

[0028] In addition, in the embodiment, the seam filling tube can be fixed by the step difference of the frame of the display device.

[0029] In addition, in this embodiment, the joint filling tube can move while injecting the joint filling material into the joint area.

[0030] Invention Effects

[0031] The display device including semiconductor light-emitting elements in the embodiments has the technical effect of exhibiting a seamless appearance even after the display panel has been manufactured.

[0032] In addition, the embodiments have the technical effect of achieving a seamless finish without the need for additional vacuum forming processes.

[0033] In addition, the embodiment has the technical effect of supplementing the flatness and step difference of the seam area so that the seam cannot be identified physically or optically.

[0034] In addition, the embodiments have the technical effect of allowing the seam filling tube to be disposed within the display device and moved without the use of additional adhesives or fixing devices.

[0035] The technical effects of the embodiments are not limited to those described in this project, but also include other effects that can be grasped from the description of the invention. Attached Figure Description

[0036] Figure 1 This is an example diagram of a living room in a residence equipped with the display device of the embodiment.

[0037] Figure 2 yes Figure 1 An enlarged view of the first panel area in the display device.

[0038] Figure 3 It is along Figure 2 A cross-sectional view of region A2 cut off by line B1-B2.

[0039] Figure 4 This is an example diagram of a multi-screen display device that incorporates multiple display panels, based on internal technology.

[0040] Figure 5 This is a cross-sectional view of the display panel including semiconductor light-emitting elements according to the first embodiment.

[0041] Figure 6 This is a cross-sectional view of a display device including a semiconductor light-emitting element according to the second embodiment.

[0042] Figure 7 It is shown Figure 6 A conceptual diagram of a joint filling tube.

[0043] Figure 8 and Figure 9 This is a schematic diagram illustrating the joint filling process of the third embodiment.

[0044] Figures 10a to 10d This is a process diagram illustrating the seam filling process of the third embodiment. Detailed Implementation

[0045] The embodiments disclosed in this specification will now be described in detail with reference to the accompanying drawings. The suffixes 'module' and 'part' used in the following description regarding constituent elements are assigned or used interchangeably for ease of writing and do not inherently distinguish one from another. Furthermore, the accompanying drawings are provided to aid in understanding the embodiments disclosed in this specification, and the technical concepts disclosed in this specification are not limited to the contents of the drawings. Additionally, when referring to elements such as layers, regions, or substrates as existing 'on' other constituent elements, this indicates a situation where they exist directly on or between other constituent elements.

[0046] The display devices described in this specification may include digital TVs, mobile phones, smartphones, laptop computers, digital broadcasting terminals, PDAs (personal digital assistants), PMPs (portable multimedia players), navigation devices, Slate PCs, tablet PCs, Ultrabooks, desktop computers, etc. However, even for new product forms developed subsequently, the structure of the embodiments described in this specification can be applied to displayable devices.

[0047] The light-emitting element and the display device including it according to the embodiments will now be described.

[0048] Figure 1 The living room of a residence is shown, in which the display device 100 of the embodiment is configured.

[0049] The display device 100 of the embodiment can display the status of various electronic products such as washing machine 101, cleaning robot 102, and air purifier 103, can communicate with each electronic product based on IoT, and can also control each electronic product based on user settings.

[0050] The display device 100 of the embodiment may include a flexible display disposed on a thin and flexible substrate. The flexible display retains the characteristics of conventional flat panel displays while also being able to be bent or rolled up like paper.

[0051] In a flexible display, time information is represented by independently controlling the emission of unit pixels arranged in a matrix. A unit pixel is the smallest unit used to represent a color. The unit pixels of a flexible display can be represented by light-emitting elements. In embodiments, the light-emitting elements can be micro-LEDs or nano-LEDs, but are not limited to these.

[0052] Figure 2 yes Figure 1 An enlarged view of the first panel area A1 in the display device.

[0053] according to Figure 2 The display device 100 in the embodiment may be manufactured by splicing together multiple panel areas such as the first panel area A1 in a functional and electrically connected manner.

[0054] The first panel area A1 may include individual unit pixels ( Figure 2 The PX configuration includes multiple light-emitting elements 150.

[0055] For example, a unit pixel PX may include a first sub-pixel PX1, a second sub-pixel PX2, and a third sub-pixel PX3. For instance, multiple red light-emitting elements 150R may be configured in the first sub-pixel PX1, multiple green light-emitting elements 150G may be configured in the second sub-pixel PX2, and multiple blue light-emitting elements 150B may be configured in the third sub-pixel PX3. The unit pixel PX may also include a fourth sub-pixel without any light-emitting elements, but is not limited thereto. On the other hand, the light-emitting element 150 may be a semiconductor light-emitting element.

[0056] then, Figure 3 It is along Figure 2 A cross-sectional view of region A2 cut off by line B1-B2.

[0057] Reference Figure 3 The display device 100 of the embodiment may include a substrate 200, assembly lines 201 and 202, a first insulating layer 211a, a second insulating layer 211b, a third insulating layer 206, and a plurality of light-emitting elements 150.

[0058] The assembly line may include a first set of assembly lines 201 and a second set of assembly lines 202 spaced apart from each other. The first set of assembly lines 201 and the second set of assembly lines 202 are used to generate dielectric forces for assembling the light-emitting element 150. In addition, the first set of assembly lines 201 and the second set of assembly lines 202 may also be electrically connected to the electrodes of the light-emitting element to serve as electrodes of the display panel.

[0059] Assembly lines 201 and 202 may be formed of transparent electrode ITO or comprise a metallic material with excellent conductivity. For example, assembly lines 201 and 202 may be formed of at least one of titanium (Ti), chromium (Cr), nickel (Ni), aluminum (Al), platinum (Pt), gold (Au), tungsten (W), and molybdenum (Mo) or alloys thereof.

[0060] A first insulating layer 211a may be disposed between the first assembly line 201 and the second assembly line 202, and a second insulating layer 211b may be disposed on the first assembly line 201 and the second assembly line 202. The first insulating layer 211a and the second insulating layer 211b may be an oxide film, a nitride film, etc., but are not limited thereto.

[0061] The light-emitting elements 150 may include red light-emitting elements 150, green light-emitting elements 150G and blue light-emitting elements 150B0 to constitute a unit pixel (sub-pixel), but are not limited to these. They may also have red phosphors and green phosphors to represent red and green respectively.

[0062] The substrate 200 may be formed of glass or polyimide. Alternatively, the substrate 200 may include flexible materials such as PEN (polyethylene naphthalate) and PET (polyethylene terephthalate). Furthermore, the substrate 200 may be made of a light-transmitting material, but is not limited to these.

[0063] The third insulating layer 206 may include insulating and flexible materials such as polyimide, PEN, and PET, or it may be integrally formed with the substrate 200 to form a substrate.

[0064] The third insulating layer 206 can be a conductive adhesive layer with adhesive and conductive properties, and the conductive adhesive layer is flexible to realize the flexible function of the display device. For example, the third insulating layer 206 can be an anisotropic conductive film (ACF), an anisotropic conductive medium, a solution containing conductive particles, or other conductive adhesive layers. The conductive adhesive layer can be a layer with a relative thickness that has electrical conductivity in the vertical direction or a relative thickness that has electrical insulation in the horizontal direction.

[0065] The third insulating layer 206 may include an assembly hole 203 for inserting the light-emitting element 150. Therefore, during self-assembly, the light-emitting element 150 can be easily inserted into the assembly hole 203 of the third insulating layer 206. The assembly hole 203 may be referred to as an insertion hole, a fixing hole, an alignment hole, etc.

[0066] The spacing between assembly lines 201 and 202 can be smaller than the width of the light-emitting element 150 and the width of the assembly hole 203, so that the assembly position of the light-emitting element 150 utilizing the electric field can be fixed more precisely.

[0067] A third insulating layer 206 is formed on assembly lines 201 and 202, thereby protecting the assembly lines 201 and 202 in the fluid 1200 and preventing leakage of current flowing on the assembly lines 201 and 202. The third insulating layer 206 may be formed as a single layer or multiple layers of inorganic insulators such as silicon dioxide and alumina, or organic insulators.

[0068] In addition, the third insulating layer 206 may include insulating and flexible materials such as polyimide, PEN, and PET, and may also be integrally formed with the substrate 200 to form a substrate.

[0069] The third insulating layer 206 can be an adhesive insulating layer or a conductive adhesive layer. The third insulating layer 206 is flexible, thus enabling the flexible function of the display device.

[0070] The third insulating layer 206 has a partition wall through which mounting holes 203 can be formed. For example, when forming the substrate 200, a portion of the third insulating layer 206 is removed, so that the light-emitting elements 150 can be assembled into the mounting holes 203 of the third insulating layer 206 respectively.

[0071] An assembly hole 203 is formed on the substrate 200, and the light-emitting element 150 is attached to the assembly hole 203. The surface with the assembly hole 203 can contact the fluid 1200. The assembly hole 203 can guide the light-emitting element 150 to the correct assembly position.

[0072] On the other hand, the assembly hole 203 may have a shape and size corresponding to the shape of the light-emitting element 150 to be assembled in the corresponding position. Therefore, it is possible to prevent the assembly of other light-emitting elements or multiple light-emitting elements in the assembly hole 203.

[0073] Figure 4 A multi-screen display device 600, including multiple display panels with internal technology, is shown.

[0074] Reference Figure 4 The multi-screen display device 600 can be manifested in the form of multiple display panels 600a to 600d spliced ​​together. For example, the multi-screen display device 600 may include a first display panel 600a, a second display panel 600b, a third display panel 600c, and a fourth display panel 600d, but is not limited thereto. The aforementioned multiple display panels 600a to 600d can each be a display device manufactured by the self-assembly method described above, but is not limited thereto.

[0075] In the internal technology, the multi-screen display device 600 can be used as a large-area display device that provides an image through multiple display panels 600a to 600d. In each of the multiple display panels 600a to 600d, the side bezel area is minimized to reduce the gap area between it and the adjacent display device.

[0076] According to the internal technology, as the gap area between the display devices is reduced, the dark area generated by the gap area can be minimized when outputting the image, thereby displaying an image with minimized fragmentation on the entire screen of the multi-screen display device 600.

[0077] On the other hand, refer to Figure 4 Although the physical spacing, or gap, between multiple display panels in the internal technology is reduced, there is a problem that from an optical point of view, this gap or boundary line is 'visually recognized' as a seam S1.

[0078] According to internal technology, there is a problem that the gaps between display modules are identified as seams due to the gaps between the display modules. In particular, the seams become more noticeable when the display device is switched to a black state.

[0079] In addition, according to the internal technology, there are empty spaces between the display modules, making it difficult to attach adhesive layers or front covers using OCA or similar methods.

[0080] Additionally, according to internal technology, when attaching the front cover, the cover bends due to the step difference (empty space) at the seam, making the seam more noticeable.

[0081] The following is a detailed description of a display device including a semiconductor light-emitting element and a method for manufacturing the same, which are embodiments used to solve the technical problem.

[0082] Figure 5 This is a cross-sectional view of the display panel 110 including semiconductor light-emitting elements according to the first embodiment. (Refer to...) Figure 5 The display panel 110 may be formed by combining a first display module 110a and a second display module 110b. Each display module 110a, 110b may include a cover film 131, a second adhesive layer 132, a TFT substrate 133, and a driver IC 134.

[0083] Additionally, a passivation layer 135 may be disposed on one of the opposite sides of the display modules 110a and 110b. The passivation layer 135 serves to protect the side wiring connected to the semiconductor light-emitting element 150 and may be formed of a material that reduces the visibility of the seam 140. The passivation layer 135 may be formed as a single layer. Alternatively, the passivation layer 135 may be formed as a multilayer structure including a first passivation layer 135a and a second passivation layer 135b.

[0084] On the other hand, a seam 140 exists between the first display module 110a and the second display module 110b, but the seam filler 145 can fill the seam 140 through a seam filler tube. The seam filler 145 can be formed of resin, but is not limited to this. Additionally, the seam filler 145 can be formed of a black substance, but is not limited to this. The seam filler 145 can be a hydrophilic substance. Furthermore, the seam filler 145 can have a refractive index corresponding to the refractive index of the outermost cover film 131.

[0085] Additionally, the joint filler 145 may include a first region 145a covering the passivation layer 135 and a second region 145b disposed between the first regions 145a. The first region 145a may be directly in contact with the passivation layer 135. One surface of the first region 145a may be a curved surface with curvature, and may have a concave shape.

[0086] Furthermore, the first region 145a may be located between the first display module 110a and the second display module 110b. The back surface of the first region 145a may not be flat. The horizontal width of the seam filler 145 may be greater than the horizontal width of the seam 140.

[0087] In addition, the first region 145a and the second region 145b mentioned above may have different heights.

[0088] Additionally, the joint filler 145 may also include a third region 145c disposed in the second adhesive layer 132. The horizontal width of the third region 145c may be greater than the horizontal width of the joint 140.

[0089] In the event that the passivation layer 135 is damaged during the assembly of display modules 110a and 110b, the aforementioned first region 145a can prevent the side wiring from being exposed or from leaking current.

[0090] Figure 6 This is a cross-sectional view illustrating a display device including a semiconductor light-emitting element according to a second embodiment. The second embodiment may include the display panel including the semiconductor light-emitting element of the first embodiment.

[0091] Reference Figure 6 The display device 105, including a semiconductor light-emitting element, may include a display panel 110, a first frame 116, a frame fixing part 117, and a second frame 118. The display panel 110 can be bonded to the first frame 116 via a first adhesive layer 115. The first adhesive layer 115 may be adhesive on both sides, for example, it may be double-sided tape. Additionally, a seam 140 may be present on the display panel 110.

[0092] On the other hand, the display device 105, which includes a semiconductor light-emitting element, may have a hole 119 inside that separates the first adhesive layer 115, the first frame 116, and the frame fixing part 117.

[0093] The horizontal width of the aforementioned hole 119 may vary depending on the height. On the other hand, a seam filling tube 120 may be disposed within the aforementioned hole 119. The aforementioned seam filling tube 120 may be disposed by utilizing the internal step of the aforementioned display device 105.

[0094] For now, refer to Figure 7 The horizontal width L1 of the second nozzle portion 123b of the seam filling tube 120 may be greater than the horizontal width of the seam 140 of the display panel 110. Alternatively, the horizontal width L1 of the second nozzle portion 123b may be less than the horizontal width D1 of the first frame.

[0095] The horizontal width L2 of the second support portion 121b of the joint filling tube 120 may be greater than the horizontal width D1 of the first frame. Conversely, the horizontal width L2 of the second support portion 121a may be less than the horizontal width D2 of the first frame fixing portion 117a.

[0096] The horizontal width L3 of the first support portion 121a of the joint filling tube 120 may be greater than the horizontal width D2 of the first frame fixing portion 117a. Furthermore, the horizontal width L3 of the first support portion 121a may be less than the horizontal width of the second frame fixing portion 117b.

[0097] Re-reference Figure 6Therefore, the seam filling tube 120 can be disposed within the hole 119 inside the display device 105 including the semiconductor light-emitting element. As the hole 119 extends, the seam filling tube 120 can move within the hole 119. Thus, in this embodiment, the seam filling tube 120 can be disposed within the display device, with the nozzle portion abutting against the seam 140, filling the seam 140 with seam filling material and moving there, thereby achieving the technical effect of eliminating seams. Furthermore, even without creating a vacuum state for the seam 140 within the display panel 110, after the seam filling tube 120 is tightly attached to the seam 140 and seam filling material is injected, the seam is filled through capillary action, thereby simplifying the seamless process without requiring additional equipment and processes such as creating a vacuum.

[0098] Figure 7 This is a schematic diagram of the joint filling tube 120 used in the embodiment. (Refer to...) Figure 7 The seam filling tube 120 may include a support portion 121 and a nozzle portion 123. The support portion 121 may include a first support portion 121a having a groove and a second support portion 121b extending downward from the first support portion 121a. The nozzle portion 123 may include a first nozzle portion 123a disposed within the groove of the support portion 121 and a second nozzle portion 123b extending from one end of the first nozzle portion 123a along the second support portion 121b. The nozzle portion 123 may have an elongated tube shape and may be hollow internally. Furthermore, the nozzle portion 123 is disposed on the back side of the display panel, abutting against the seam, and can then be used as an outlet for the seam filling material. The nozzle portion 123 may be circular, but is not limited thereto.

[0099] Figure 8 and Figure 9 This is a conceptual diagram showing the state of injecting seam filler material into a display device with multiple display panels 110 connected together.

[0100] Reference Figure 8 The process of filling the seams can be performed in the order of a, b, and c. Multiple display panels 110 can be arranged in a matrix, and seams 140 can exist between the display panels.

[0101] First, in step a, a seam filler tube 120 is inserted into the hole 119 of the display panel. The injection port 123 of the seam filler tube can be connected to the seam in the vertical direction and move within the hole 119.

[0102] Additionally, in step b, a seam filler material 145 can be injected into the seam via a seam filler tube. This seam filler tube can inject the seam filler material 145 into the seam and move within the hole 119.

[0103] Finally, in step c, after the joint filler material 145 has been injected, the joint filler tube can be removed. Then, the joint filler material 145 is allowed to harden and become fixed inside the joint.

[0104] Reference Figure 9 It can also be used in the horizontal direction of the display panel. Figure 8 The process of injecting seam filler material.

[0105] Figures 10a to 10d This is a process diagram illustrating the process of filling seams in a display device including semiconductor light-emitting elements according to an embodiment.

[0106] Reference Figure 10a In a display device including a semiconductor light-emitting element, a protective film 160 is disposed on one surface of the display panel 110. The protective film 160 prevents the seam 140 of the display panel 110 from opening to the outside. Additionally, a seam filling tube 120 is located in a hole inside the display device. The seam filling tube 120 can be positioned via a step inside the display device. Furthermore, the nozzle portion of the seam filling tube 120 can contact the seam 140.

[0107] Reference Figure 10b The joint 140 can be filled with joint filling material 145 through the joint filling tube 120. In addition, the joint filling tube 120 can be moved while the joint 140 is being filled with joint filling material 145.

[0108] The aforementioned seam filler 145 can be resin, and can be black, but is not limited to these. In addition, the aforementioned seam filler 145 can compensate for the height difference of the display module in the display panel 110, and can have a refractive index corresponding to the refractive index of the display panel 110.

[0109] Thus, the embodiment achieves the technical effect of making the seam 140 invisible both physically and optically through the seam filling material 145 described above.

[0110] Next, refer to Figure 10c After removing the seam filler tube from the display device, the seam filler material 145 can be located within the seam. Then, the cover film is removed, and the seam filler material 145 is heated and hardened using the hardening device 165. This eliminates the fluidity of the seam filler material 145 and fixes it within the seam.

[0111] Next, refer to Figure 10d The joint filler 145 may also be formed on the outside of the joint. The joint filler 145 may be formed with a recessed shape on the outside of the joint, but is not limited thereto.

[0112] Therefore, this embodiment arranges a seam filling tube within a display device including a semiconductor light-emitting element, and fills the seam while moving the tube in contact with the seam. This improves the speed and simplifies the seam-less process. Through this embodiment, the seams of the display device cannot be physically or optically identified, thus achieving the technical effect of a seamless process. Filling the seam after assembling the display module prevents step differences. Furthermore, since resin is injected through a nozzle, a separate vacuum treatment process is unnecessary, further simplifying the seamless process.

[0113] The display device including semiconductor light-emitting elements in the embodiments has the technical effect of exhibiting a seamless appearance even after the display panel has been manufactured.

[0114] In addition, the embodiments have the technical effect of achieving a seamless finish without the need for additional vacuum forming processes.

[0115] In addition, the embodiment has the technical effect of supplementing the flatness and step difference of the seam area and making the seam undetectable both physically and optically.

[0116] In addition, the embodiments have the technical effect of enabling the seam filling tube to be disposed within the display device and moved without the use of additional adhesives or fixing devices.

[0117] The above description has been based on embodiments of the present invention. However, those skilled in the art will readily understand that various modifications and alterations can be made to the present invention without departing from the spirit and scope of the invention as set forth in the following claims.

[0118] Industrial utilization potential

[0119] The embodiments are applicable to the field of displays that show images or information.

[0120] The embodiments are applicable to the field of displays that use semiconductor light-emitting elements to display images or information.

[0121] The embodiments are applicable to the field of displays that utilize micro or nanoscale semiconductor light-emitting elements to display images or information.

Claims

1. A display device including a semiconductor light-emitting element, comprising: Display panel; and The frame, which is connected to the aforementioned display panel, The aforementioned display panel includes: The first display module and the second display module each include a plurality of semiconductor light-emitting elements disposed on a substrate and arranged adjacent to each other; and A seam filler material is disposed between the first display module and the second display module. One side of the aforementioned joint filler material has a curved surface.

2. The display device including a semiconductor light-emitting element according to claim 1, wherein, The aforementioned first display module and the aforementioned second display module include passivation layers disposed on surfaces adjacent to each other. The aforementioned seam filler material includes a first region disposed in a manner that covers the aforementioned passivation layer and a second region disposed between the aforementioned first region.

3. The display device including a semiconductor light-emitting element according to claim 2, wherein, The back of the aforementioned first region has a concave shape.

4. The display device including a semiconductor light-emitting element according to claim 2, wherein, The first region and the second region mentioned above have different heights.

5. The display device including a semiconductor light-emitting element according to claim 1, wherein, The horizontal width of the joint filler material is greater than the gap between the first display module and the second display module.

6. The display device including a semiconductor light-emitting element according to claim 1, wherein, The aforementioned seam filler materials include hydrophilic substances.

7. The display device including a semiconductor light-emitting element according to claim 1, wherein, The aforementioned framework includes: a first frame disposed on the display panel; a second frame disposed on the first frame; and a third frame disposed on the second frame. The spacing of the first frame is smaller than the spacing of the second frame. The spacing of the second frame is smaller than the spacing of the third frame.

8. A method for manufacturing a display device including a semiconductor light-emitting element, comprising the following steps: Insert a seam filler tube into a display device, including a display panel; Make the joint filling tube contact the joint area of ​​the display panel. The joint filling material is injected into the joint area through the joint filling tube described above. Remove the aforementioned joint filler tube; This allows the joint filler material to harden.

9. The method of manufacturing a display device including a semiconductor light-emitting element according to claim 8, wherein, The aforementioned seam filling tube is fixed by the step difference of the frame of the aforementioned display device.

10. The method of manufacturing a display device including a semiconductor light-emitting element according to claim 8, wherein, The aforementioned joint filling tube moves while injecting the aforementioned joint filling material into the aforementioned joint area.

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