Micro-hole chamfer machining equipment and method based on adjustable Airy beam

Abstract

The invention discloses a micropore chamfer machining device and method based on an adjustable Airy beam, and belongs to the technical field of laser precision machining.The micropore chamfer machining device comprises a light source module, a beam modulation module and a beam scanning module, and the light source module is used for outputting a laser beam; the light beam modulation module comprises a liquid crystal spatial light modulator and a regulation and control assembly, the laser beam is modulated into an Airy beam through the liquid crystal spatial light modulator, and the regulation and control assembly loads different phase holograms to the liquid crystal spatial light modulator to regulate and control the Airy beam; the light beam scanning module comprises a high-speed two-dimensional scanning assembly and a bearing platform, the bearing platform is used for bearing a to-be-machined part, the Airy light beam is emitted to the to-be-machined part through the high-speed two-dimensional scanning assembly, and the high-speed two-dimensional scanning assembly is used for driving the Airy light beam to conduct scanning along a preset track so as to conduct chamfering machining on the to-be-machined part; therefore, the machining efficiency and the machining quality of the micropore chamfering can be improved.

Description

Technical Field

[0001] This invention belongs to the field of laser precision machining technology, specifically relating to a micro-hole chamfering processing device and method based on an adjustable Airy beam. Background Technology

[0002] In recent years, the demand for precision machining of straight circular holes and inverted conical micro-holes has become increasingly stringent in the field of high-end equipment precision manufacturing. For example, in the field of aero-engines, dense film cooling micro-holes prepared on materials such as nickel-based superalloys can improve the cooling efficiency of turbine blades under high temperature and high pressure environments. In the automotive industry, in order to meet higher fuel emission standards, machining inverted conical micro-injection holes on fuel injectors can significantly improve the fuel atomization effect.

[0003] Currently, the mainstream processing technology commonly used for machining straight circular holes and inverted conical micro-holes is abrasive flow machining. For example, Chinese invention patent CN114952587A, entitled "A Method for Chamfering Film Bore Holes on Aero-engine Turbine Blades," specifically discloses a method for chamfering the openings of film bore holes on both sides of the blade using an alternating forward and reverse cycle of abrasive materials. This method can achieve chamfering of micro-holes using abrasive flow machining. However, when using abrasive flow machining for chamfering, abrasive needs to be filled into the micro-holes, resulting in low processing efficiency and easy clogging of the micro-holes by abrasive particles. Furthermore, because the movement of abrasive particles is random, the surface finish at multiple chamfered locations is inconsistent, thus affecting the overall forming quality of the micro-holes. Summary of the Invention

[0004] To address the aforementioned problems in the prior art, this invention provides a micro-aperture chamfering device and method based on an adjustable Airy beam. The technical problem to be solved by this invention is achieved through the following technical solution: In a first aspect, the present invention provides a micro-hole chamfering processing device based on an adjustable Airy beam, comprising a light source module, a beam modulation module and a beam scanning module, wherein the light source module is used to output a laser beam; The beam modulation module includes a liquid crystal spatial light modulator and a control component. The laser beam is modulated into an Airy beam by the liquid crystal spatial light modulator, and the control component controls the Airy beam by loading different phase holograms onto the liquid crystal spatial light modulator. The beam scanning module includes a high-speed two-dimensional scanning component and a support platform. The support platform is used to support the workpiece to be processed. The Airy beam is emitted onto the workpiece through the high-speed two-dimensional scanning component. The high-speed two-dimensional scanning component is used to drive the Airy beam to scan along a preset trajectory in order to perform chamfering on the workpiece.

[0005] In one embodiment of the present invention, the control component includes an industrial control computer and a drive control board, which are electrically connected. The industrial control computer is used to adjust the cubic phase term and shift transform in the Fourier spectrum of the finite Airy beam to obtain an adjusted phase hologram. The drive control board is used to load the adjusted phase hologram onto the liquid crystal spatial light modulator.

[0006] In one embodiment of the present invention, the beam scanning module further includes a beam translation and rotation assembly and a focusing lens, which are located between the high-speed two-dimensional scanning assembly and the support platform; The light beam emitted by the high-speed two-dimensional scanning component is focused onto the workpiece by the beam translation and rotation component and the focusing lens in sequence. The support platform is a multi-axis displacement platform.

[0007] In one embodiment of the present invention, a dichroic mirror and a coaxial monitoring module are also included. The dichroic mirror is located between the beam translation and rotation assembly and the focusing lens, and the coaxial monitoring module and the dichroic mirror are arranged opposite to each other. The light beam reflected by the workpiece is focused by a focusing lens and then incident on a dichroic mirror, and reflected by the dichroic mirror into the coaxial monitoring module.

[0008] In one embodiment of the present invention, the light source module includes a femtosecond laser, a collimating beam expander, a half-wave plate, a polarizing beam splitter prism, and a polarization-maintaining mirror. The femtosecond laser is used to generate a femtosecond laser beam, which is incident on the liquid crystal spatial light modulator in sequence through the collimating beam expander, the half-wave plate, the polarizing beam splitter prism, and the polarization-maintaining mirror.

[0009] Secondly, the present invention also provides a micro-aperture chamfering method based on an adjustable Airy beam, comprising a micro-aperture chamfering apparatus based on an adjustable Airy beam as described above. The micro-aperture chamfering apparatus includes a light source module, a beam modulation module, and a beam scanning module. The beam modulation module includes a liquid crystal spatial light modulator and a modulation component, and the beam scanning module includes a high-speed two-dimensional scanning component. The method includes: Step 1: Generate a laser beam using the light source module; Step 2: Modulate the laser beam into an Airy beam using a liquid crystal spatial light modulator; Step 3: By loading different phase holograms onto the liquid crystal spatial light modulator through the control components, the propagation trajectory and energy distribution of the Airy beam are controlled; Step 4: Drive the Airy beam along a preset trajectory using a high-speed 2D scanning component to perform chamfering on the workpiece.

[0010] In one embodiment of the present invention, the light source module includes a femtosecond laser, the control component includes an industrial control computer and a drive control board, and the beam scanning module further includes a beam translation and rotation component. Step one specifically includes: A femtosecond laser beam is generated using a femtosecond laser. Step three specifically includes: Determine the aperture and depth of the microholes on the workpiece, the scanning space tilt angle of the high-speed two-dimensional scanning component, and the preset dimensions of the chamfer; The phase hologram of the Airy beam is dynamically controlled by adjusting the cubic phase term and shift transform in the Fourier spectrum of the finite Airy beam using an industrial control computer. The controlled phase hologram is then loaded onto the spatial light modulator by the drive control board to change the energy distribution, focal depth, and three-dimensional light field trajectory of the Airy beam. Based on the modulated phase hologram, a modulated Airy beam is generated by a liquid crystal spatial light modulator; Step four specifically includes: Vector analysis is performed on the pre-input micro-aperture diameter, number of feed layers, chamfer angle, and beam scanning trajectory determined by the phase hologram of the Airy beam to calculate the real-time deflection of the micro-motion mirror inside the high-speed two-dimensional scanning component. The high-speed two-dimensional scanning component and the beam translation and rotation component are driven to move synchronously based on the real-time deflection amount, so as to drive the Airy beam to scan and process the micro-holes on the workpiece along the preset trajectory to form a chamfer.

[0011] In one embodiment of the present invention, adjusting the cubic phase term and shift transform in the Fourier spectrum of a finite Airy beam using an industrial control computer specifically includes: Based on Equation 1, the cubic phase term and shift transform in the Fourier spectrum of a finite Airy beam are adjusted, and Equation 1 is as follows:

[0012] in, For Airy functions, For cubic phase terms, It is a displacement transformation quantity; Based on Equation 2, the functional solution of the Airy beam is calculated. Equation 2 is:

[0013] in, For the propagation distance of Airy's light field, ,in The refractive index of the medium, For wavelength, 、z The horizontal and vertical axes are represented separately. i It is the imaginary unit.

[0014] In one embodiment of the present invention, a modulated Airy beam is generated by a liquid crystal spatial light modulator based on a modulated phase hologram, specifically including: Based on Equation 3, the beam phase diagram of the modulated Airy beam is calculated. Equation 3 is as follows:

[0015] in, for x, y Wave vector in the direction, The attenuation coefficient is... The rotation angle is... The phase diagram of the Airy beam after intensity transformation is shown, where It is the energy tuning function. v This is the intensity transformation factor. The phase diagram of the Airy beam after displacement transformation. The phase diagram of the Airy beam after rotation transformation.

[0016] In one embodiment of the present invention, before step one, the method further includes: By loading a 0-value grayscale phase map onto the liquid crystal spatial light modulator through the control component, the liquid crystal spatial light modulator is prevented from modulating the light beam. A laser beam is generated using a light source module; A high-speed two-dimensional scanning component drives a laser beam to scan along a preset trajectory to perform micro-hole processing on the workpiece. After the micro-hole processing is completed, the power of the laser beam is reduced and the scanning trajectory of the high-speed two-dimensional scanning component is optimized. The laser beam is driven by the high-speed two-dimensional scanning component to scan along the preset trajectory in order to perform fine processing on the micro-holes on the workpiece.

[0017] Compared with the prior art, the beneficial effects of the present invention are as follows: In the above-described scheme of this application, the micro-hole chamfering processing equipment includes a light source module, a beam modulation module, and a beam scanning module. The light source module is used to output a laser beam; the beam modulation module includes a liquid crystal spatial light modulator and a control component. The laser beam is modulated into an Airy beam by the liquid crystal spatial light modulator, and the control component controls the Airy beam by loading different phase holograms onto the liquid crystal spatial light modulator; the beam scanning module includes a high-speed two-dimensional scanning component and a support platform. The support platform is used to support the workpiece to be processed, and the Airy beam is emitted onto the workpiece by the high-speed two-dimensional scanning component. The high-speed two-dimensional scanning component is used to drive the Airy beam to scan along a preset trajectory to perform chamfering processing on the workpiece. Using this structure, an Airy beam is obtained by modulation with a liquid crystal spatial light modulator, and the Airy beam is driven to scan along a preset trajectory by the high-speed two-dimensional scanning component, which can process chamfers on the micro-holes of the workpiece. Compared with traditional abrasive flow processes, this application uses an Airy beam to process chamfers without the need for abrasive particles, which can improve processing efficiency, processing accuracy, and processing quality. Furthermore, this application uses a control component to load different phase holograms onto the liquid crystal spatial light modulator to control the propagation trajectory and energy distribution of the Airy beam, thereby further improving the processing accuracy and quality of chamfering and micro-holes.

[0018] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the micro-hole chamfering processing equipment in an embodiment of the present invention; Figure 2 This is a phase diagram of the Airy beam in an embodiment of the present invention; Figure 3 This is a schematic diagram of the simulation results of the Airy beam in an embodiment of the present invention; Figure 4 This is a schematic diagram of the micro-hole chamfering processing method in an embodiment of the present invention.

[0020] Reference numerals: 1-Light source module, 11-Femtosecond laser, 12-Collimator and expander, 13-Half-wave plate, 14-Polarization beam splitter prism, 15-Polarization-maintaining mirror, 2-Beam modulation module, 21-Liquid crystal spatial light modulator, 22-Control component, 221-Industrial control computer, 222-Drive control board, 3-Beam scanning module, 31-High-speed two-dimensional scanning component, 32-Bearing platform, 33-Beam translation and rotation component, 34-Focusing lens, 4-Dichroic mirror, 5-Coaxial monitoring module, 6-4f lens group. Detailed Implementation

[0021] The present invention will be further described in detail below with reference to specific embodiments, but the implementation of the present invention is not limited thereto.

[0022] Example 1: Please see Figure 1 This invention provides a micro-hole chamfering processing device based on an adjustable Airy beam, including a light source module 1, a beam modulation module 2, and a beam scanning module 3. The light source module 1 is used to output a laser beam; the beam modulation module 2 includes a liquid crystal spatial light modulator 21 and a control component 22. The laser beam is modulated into an Airy beam by the liquid crystal spatial light modulator 21, and the control component 22 controls the Airy beam by loading different phase holograms onto the liquid crystal spatial light modulator 21; the beam scanning module 3 includes a high-speed two-dimensional scanning component 31 and a support platform 32. The support platform 32 is used to support the workpiece to be processed. The Airy beam is emitted onto the workpiece by the high-speed two-dimensional scanning component 31, and the high-speed two-dimensional scanning component 31 is used to drive the Airy beam to scan along a preset trajectory to perform chamfering processing on the workpiece.

[0023] In some embodiments of this application, the Liquid Crystal Spatial Light Modulator 21 (LC-SLM) is a programmable optical device that precisely spatially modulates the wavefront (phase and / or amplitude) of light using electrical signals. In this embodiment, the laser intensity emitted by the light source module 1 has a Gaussian distribution. After passing through the Liquid Crystal Spatial Light Modulator 21, the Gaussian laser beam can be modulated into an Airy beam. The Liquid Crystal Spatial Light Modulator 21 in this embodiment can precisely program and control the propagation trajectory and energy distribution of the Airy beam.

[0024] In some embodiments of this application, the Airy beam is a non-diffraction laser beam with unique physical properties. Its main characteristics are that the main lobe of the beam moves along a curved trajectory during propagation and exhibits lateral self-acceleration and near-non-diffraction characteristics within a certain propagation distance.

[0025] In some embodiments of this application, the high-speed two-dimensional scanning component 31 is an actuator in the laser processing system responsible for driving the laser focus to perform high-speed, precise two-dimensional motion on the working surface. In this embodiment, the high-speed two-dimensional scanning component 31 consists of an X-axis high-speed galvanometer and a Y-axis high-speed galvanometer. By adjusting the deflection of the X-axis and Y-axis high-speed galvanometers, the Airy beam can be controlled to scan.

[0026] In some embodiments of this application, the micro-hole chamfering processing equipment further includes a 4f lens group 6, which is located between the spatial light modulator and the high-speed two-dimensional scanning component 31. The 4f lens group 6 includes two lenses with the same focal length, and the Airy beam is transmitted to the high-speed two-dimensional scanning component 31 through the two lenses in sequence.

[0027] In the above-described scheme of this application, the micro-hole chamfering processing equipment includes a light source module 1, a beam modulation module 2, and a beam scanning module 3. The light source module 1 is used to output a laser beam; the beam modulation module 2 includes a liquid crystal spatial light modulator 21 and a control component 22. The laser beam is modulated into an Airy beam by the liquid crystal spatial light modulator 21, and the control component 22 controls the Airy beam by loading different phase holograms onto the liquid crystal spatial light modulator 21; the beam scanning module 3 includes a high-speed two-dimensional scanning component 31 and a support platform 32. The support platform 32 is used to support the workpiece to be processed. The Airy beam is emitted onto the workpiece by the high-speed two-dimensional scanning component 31, and the high-speed two-dimensional scanning component 31 is used to drive the Airy beam to scan along a preset trajectory to perform chamfering processing on the workpiece. With this structure, the Airy beam is modulated by the liquid crystal spatial light modulator 21, and the Airy beam is driven by the high-speed two-dimensional scanning component 31 to scan along a preset trajectory, which can process chamfers on the micro-holes of the workpiece. Compared to traditional abrasive flow processes, this application uses Airy beams to process chamfers without the need for abrasive particles, thus improving processing efficiency, accuracy, and quality. Furthermore, this application uses the control component 22 to load different phase holograms onto the liquid crystal spatial light modulator 21 to control the propagation trajectory and energy distribution of the Airy beam, further enhancing the processing accuracy and quality of chamfers and micro-holes.

[0028] It is understood that this embodiment allows for hole making, hole trimming, and hole chamfering processes to be performed within the same optical path, without any switching or mechanical displacement devices. The phase diagram is controlled by liquid crystal deflection, resulting in extremely high optical path stability. Furthermore, all processing steps are implemented within the optical path of this embodiment, avoiding secondary workpiece clamping and positioning, and simplifying the hole making and chamfering process.

[0029] In some embodiments of this application, such as Figure 1 As shown, the control component 22 includes an industrial control computer 221 and a drive control board 222, which are electrically connected. The industrial control computer 221 is used to adjust the cubic phase term and displacement transform in the Fourier spectrum of the finite Airy beam to obtain an adjusted phase hologram. The drive control board 222 is used to load the adjusted phase hologram onto the liquid crystal spatial light modulator 21. With this structure, by adjusting the cubic phase term and displacement transform in the Fourier spectrum of the finite Airy beam through the industrial control computer 221, the phase hologram of the Airy beam can be dynamically controlled to change the energy distribution, focal depth, and three-dimensional light field trajectory of the Airy light field, allowing the Airy beam to adapt to different process parameter changes. The drive control board 222 can load the phase hologram onto the target surface of the liquid crystal spatial light modulator 21, thereby selecting the modulation parameters of the Airy beam in combination with the actual optimal process conditions to obtain a laser energy action path that matches the spatial morphology of the process chamfer requirements.

[0030] Please see Figure 2 and Figure 3 , Figure 2 The phase diagram of the Airy beam in an embodiment of the present invention is shown. Figure 3 A schematic diagram illustrating the simulation results of the Airy beam in an embodiment of the present invention is shown. Figure 2 and Figure 3 It is understood that the embodiments of this application can precisely program and control the propagation trajectory and energy distribution of the Airy beam.

[0031] In some embodiments of this application, such as Figure 1 As shown, the beam scanning module 3 also includes a beam translation and rotation assembly 33 and a focusing lens 34, which are located between the high-speed two-dimensional scanning assembly 31 and the support platform 32. The beam emitted from the high-speed two-dimensional scanning assembly 31 is focused onto the workpiece by the beam translation and rotation assembly 33 and the focusing lens 34 in sequence. The support platform 32 is a multi-axis displacement platform. With this structure, the beam translation and rotation assembly 33 performs dynamic position and angle compensation on the beam emitted from the high-speed two-dimensional scanning assembly 31, so that the beam can be incident on the focusing lens 34 in a stable and optimized state. Then, the focusing lens 34 focuses the compensated beam onto the surface of the workpiece, forming a high-energy-density focused spot on the surface of the workpiece. The support platform 32 is a multi-axis displacement platform, which can carry and accurately position the workpiece, realize the translation and rotation of the workpiece in different dimensions, and enable the micro-hole chamfering processing equipment to adapt to the micro-hole chamfering processing requirements of different positions and angles.

[0032] In some embodiments of this application, the translation and rotation component is an integrated module in a high dynamic laser scanning system used for real-time active compensation of beam drift and angular errors. Its function is to synchronously and inversely adjust the position and angle of the incident beam according to the real-time deflection angle of the scanning galvanometer in the high-speed two-dimensional scanning component 31, ensuring that the beam can enter the subsequent focusing optical path in an optimal and stable state regardless of how the galvanometer is deflected.

[0033] In some embodiments of this application, such as Figure 1As shown, the micro-hole chamfering processing equipment also includes a dichroic mirror 4 and a coaxial monitoring module 5. The dichroic mirror 4 is located between the beam translation and rotation assembly 33 and the focusing lens 34, while the coaxial monitoring module 5 and the dichroic mirror 4 are arranged opposite each other. The beam reflected from the workpiece is incident on the dichroic mirror 4 through the focusing lens 34 and then reflected by the dichroic mirror 4 into the coaxial monitoring module 5. With this structure, the dichroic mirror 4 and the coaxial monitoring module 5 can cooperate to form a module for real-time monitoring of the laser spot. The dichroic mirror 4 utilizes its wavelength selectivity to allow the processing laser beam to pass through efficiently, while guiding the reflected light from the surface of the workpiece to the coaxial monitoring module 5. Thus, during the processing, the state information of the workpiece surface can be observed in real time through the coaxial monitoring module 5, that is, the position of the laser spot, the morphology of the micro-hole, and the progress of chamfering can be observed in real time, further improving the processing accuracy.

[0034] In some embodiments of this application, the coaxial monitoring module 5 includes a camera and a lens group. The light beam reflected by the dichroic mirror 4 passes through the lens group and enters the camera. The camera can be used to observe the state information of the surface of the workpiece.

[0035] In some embodiments of this application, such as Figure 1 As shown, the light source module 1 includes a femtosecond laser 11, a collimating beam expander 12, a half-wave plate 13, a polarizing beam splitter prism 14, and a polarization-maintaining mirror 15. The femtosecond laser 11 generates a femtosecond laser beam, which is sequentially incident on the liquid crystal spatial light modulator 21 via the collimating beam expander 12, the half-wave plate 13, the polarizing beam splitter prism 14, and the polarization-maintaining mirror 15. With this structure, the femtosecond laser 11 can provide femtosecond laser light. The ultrashort pulse characteristics of the femtosecond laser allow the material to be directly stripped through a nonlinear absorption process, with almost no heat transfer to the surroundings. This completely avoids the formation of remelted layers, heat-affected zones, and the resulting microcracks. Compared to traditional abrasive flow chamfering processes, this embodiment utilizes an ultrafast femtosecond laser to process micro-hole chamfers, significantly improving the consistency and quality of the micro-hole chamfers. The collimating beam expander 12 amplifies and collimates the original beam. The half-wave plate 13 and the polarizing beam splitter prism 14 can adjust the polarization direction and polarization state of the beam, ensuring that the polarization direction at the rear end is parallel to the liquid crystal direction of the target surface of the liquid crystal spatial light modulator 21. The polarization-maintaining mirror 15 can guide the beam to the spatial light modulator without changing the polarization state.

[0036] In some embodiments of this application, the femtosecond laser 11 is the core light source system, the laser wavelength is selected as 515nm or 1030nm according to the type of material being processed, the pulse width is <500fs, and the single pulse energy is 50μJ~100μJ.

[0037] In some embodiments of this application, the collimator expander 12 is used to magnify the emitted laser spot by 2 to 3 times in order to obtain a diffraction-limited focused spot size (<40 μm) after subsequent focusing, thereby achieving micron-level processing accuracy.

[0038] In some embodiments of this application, the half-wave plate 13 is mounted in an electric rotating frame, and its angle deflection is controlled by a specified programming signal to change the linear polarization direction in the optical path. This, combined with the polarization beam splitter prism 14, regulates the output light power and ensures that the polarization direction at the rear end is parallel to the liquid crystal direction of the target surface of the liquid crystal spatial light modulator 21.

[0039] Example 2: Please see Figure 4 This invention also provides a micro-aperture chamfering method based on an adjustable Airy beam, including a micro-aperture chamfering device based on an adjustable Airy beam as described above. The micro-aperture chamfering device includes a light source module, a beam modulation module, and a beam scanning module. The beam modulation module includes a liquid crystal spatial light modulator and a modulation component, and the beam scanning module includes a high-speed two-dimensional scanning component. The method includes: S1: Generates a laser beam through the light source module; S2: Modulate the laser beam into an Airy beam using a liquid crystal spatial light modulator; S3: By loading different phase holograms onto the liquid crystal spatial light modulator through the control components, the propagation trajectory and energy distribution of the Airy beam can be controlled; S4: Drive the Airy beam along a preset trajectory using a high-speed two-dimensional scanning component to perform chamfering on the workpiece.

[0040] The beneficial effects of Embodiment 2 and its various implementations of the present invention can be found in the analysis of the beneficial effects of Embodiment 1 and its various implementations, and will not be repeated here.

[0041] In some embodiments of this application, the light source module includes a femtosecond laser, the control components include an industrial control computer and a drive control board, and the beam scanning module further includes a beam translation and rotation component; Step one specifically includes: By generating a femtosecond laser beam using a femtosecond laser, the ultrashort pulse characteristics of the femtosecond laser allow the material to be directly stripped away through a nonlinear absorption process with almost no heat transfer to the surroundings. This completely avoids the formation of remelted layers, heat-affected zones, and the resulting microcracks. Compared to traditional abrasive flow chamfering processes, this embodiment utilizes an ultrafast femtosecond laser to process micro-hole chamfers, which can significantly improve the consistency and quality of micro-hole chamfers.

[0042] Step three specifically includes: Determine the aperture and depth of the microholes on the workpiece, the scanning space tilt angle of the high-speed two-dimensional scanning component, and the preset dimensions of the chamfer; The phase hologram of the Airy beam is dynamically controlled by adjusting the cubic phase term and shift transform in the Fourier spectrum of the finite Airy beam using an industrial control computer. The controlled phase hologram is then loaded onto the spatial light modulator by the drive control board to change the energy distribution, focal depth, and three-dimensional light field trajectory of the Airy beam. Based on the modulated phase hologram, a modulated Airy beam is generated using a liquid crystal spatial light modulator. Thus, by adjusting the cubic phase term and shift transform in the Fourier spectrum of the finite Airy beam using an industrial control computer, the phase hologram of the Airy beam can be dynamically controlled to change the energy distribution, focal depth, and three-dimensional trajectory of the Airy light field, allowing the Airy beam to adapt to different process parameter variations. The drive control board can load the phase hologram onto the target surface of the liquid crystal spatial light modulator, thereby selecting the modulation parameters of the Airy beam based on the optimal process conditions to obtain a laser energy path that matches the spatial morphology required by the process chamfering.

[0043] Step four specifically includes: Vector analysis is performed on the pre-input micro-aperture diameter, number of feed layers, chamfer angle, and beam scanning trajectory determined by the phase hologram of the Airy beam to calculate the real-time deflection of the micro-motion mirror inside the high-speed two-dimensional scanning component. The high-speed two-dimensional scanning component and the beam translation and rotation component are driven to move synchronously based on the real-time deflection amount, so as to drive the Airy beam to scan and process the micro-holes on the workpiece along the preset trajectory to form a chamfer. In this way, it can be ensured that the modulated Airy beam can accurately scan and process along the preset beam trajectory.

[0044] In some embodiments of this application, adjusting the cubic phase term and shift transform in the Fourier spectrum of a finite Airy beam using an industrial control computer specifically includes: Based on Equation 1, the cubic phase term and shift transform in the Fourier spectrum of a finite Airy beam are adjusted, and Equation 1 is as follows:

[0045] in, For Airy functions, For cubic phase terms, It is a displacement transformation quantity; Based on Equation 2, the functional solution of the Airy beam is calculated. Equation 2 is:

[0046] in, For the propagation distance of Airy's light field, ,in The refractive index of the medium, For wavelength, 、z The horizontal and vertical axes are represented separately. i The unit is the imaginary unit. Thus, an industrial control computer can dynamically control the phase hologram of an Airy beam by adjusting the cubic phase term and shift transform in the Fourier spectrum of the finite Airy beam.

[0047] In some embodiments of this application, a modulated Airy beam is generated using a liquid crystal spatial light modulator based on a modulated phase hologram, specifically including: Based on Equation 3, the beam phase diagram of the modulated Airy beam is calculated. Equation 3 is as follows:

[0048] in, Let x and y be the wave vectors. The attenuation coefficient is... The rotation angle is... The phase diagram of the Airy beam after intensity transformation. The phase diagram of the Airy beam after displacement transformation. This is the phase diagram of the Airy beam after rotational transformation. Thus, the liquid crystal spatial light modulator can generate the Airy beam intensity, displacement, and the phase diagram of the rotated Airy beam, thereby achieving control over the Airy beam.

[0049] In some embodiments of this application, before step one, the following steps are also included: By loading a 0-value grayscale phase map onto the liquid crystal spatial light modulator through the control component, the liquid crystal spatial light modulator is prevented from modulating the light beam. A laser beam is generated using a light source module; A high-speed two-dimensional scanning component drives a laser beam to scan along a preset trajectory to perform micro-hole processing on the workpiece. After the micro-hole machining is completed, the power of the laser beam is reduced, and the scanning trajectory of the high-speed two-dimensional scanning component is optimized. The high-speed two-dimensional scanning component drives the laser beam to scan along a preset trajectory to perform fine machining on the micro-holes on the workpiece. Using this method, before chamfering, the micro-hole making and finishing processes can be performed using a Gaussian beam. This allows the micro-hole making, finishing, and chamfering processes to be completed using a single optical path device, improving the convenience of processing and the stability of the optical path.

[0050] Specifically, firstly, a pure black phase map is loaded without beam modulation. A Gaussian beam is used to perform rotary scanning to create holes using a high dynamic beam scanning system at a scanning speed of 2000-4000 mm / s. After creating the holes, the laser power is reduced and the scanning trajectory is improved. The remelted layer on the hole sidewall is then used to repair the holes, thereby improving the remelted layer and microcracks formed during high-power microhole processing.

[0051] Secondly, an Airy beam chamfering process is performed. A liquid crystal spatial light modulator loads an adjustable Airy beam phase map, converting the Gaussian beam into an Airy beam, and scans the micro-hole according to the beam trajectory determined by vector analysis. Through a single or a few scans, smooth and uniform chamfers can be formed on both the inlet and outlet sides of the micro-hole. Simultaneously, the slight abrasive action of the Airy beam on the hole wall during scanning also improves the surface roughness of the hole wall. The entire process requires no abrasives or complex subsequent cleaning steps. Based on the dynamic control advantage of the liquid crystal spatial light modulator, it is possible to freely switch between multiple beams and flexibly adjust the light field parameters, significantly simplifying the micro-hole perforation and chamfering process and improving processing efficiency.

[0052] In the description of this invention, it should be understood that the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0053] Although this application has been described herein in conjunction with various embodiments, those skilled in the art will understand and implement other variations of the disclosed embodiments by reviewing the accompanying drawings, the disclosure, and the appended claims in carrying out the claimed application. The word "comprising" does not exclude other components or steps, and "a" or "an" does not exclude a plurality.

[0054] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the scope of protection of the present invention.

Claims

1. A micro-hole chamfering processing device based on an adjustable Airy beam, characterized in that, It includes a light source module, a beam modulation module, and a beam scanning module, wherein the light source module is used to output a laser beam; The beam modulation module includes a liquid crystal spatial light modulator and a control component. The laser beam is modulated into an Airy beam by the liquid crystal spatial light modulator, and the control component controls the Airy beam by loading different phase holograms onto the liquid crystal spatial light modulator. The beam scanning module includes a high-speed two-dimensional scanning component and a support platform. The support platform is used to support the workpiece to be processed. The Airy beam is emitted onto the workpiece through the high-speed two-dimensional scanning component. The high-speed two-dimensional scanning component is used to drive the Airy beam to scan along a preset trajectory to perform chamfering on the workpiece.

2. The micro-aperture chamfering equipment based on an adjustable Airy beam according to claim 1, characterized in that, The control component includes an industrial control computer and a drive control board, which are electrically connected. The industrial control computer is used to adjust the cubic phase term and shift transform in the Fourier spectrum of the finite Airy beam to obtain an adjusted phase hologram. The drive control board is used to load the adjusted phase hologram onto the liquid crystal spatial light modulator.

3. The micro-aperture chamfering equipment based on an adjustable Airy beam according to claim 1, characterized in that, The beam scanning module further includes a beam translation and rotation component and a focusing lens, which are located between the high-speed two-dimensional scanning component and the support platform. The light beam emitted by the high-speed two-dimensional scanning component is sequentially focused onto the workpiece by the beam translation and rotation component and the focusing lens. The bearing platform is a multi-axis displacement platform.

4. The micro-aperture chamfering equipment based on an adjustable Airy beam according to claim 3, characterized in that, It also includes a dichroic mirror and a coaxial monitoring module. The dichroic mirror is located between the beam translation and rotation assembly and the focusing lens, and the coaxial monitoring module and the dichroic mirror are arranged opposite to each other. The light beam reflected by the workpiece is incident on the dichroic mirror through the focusing lens, and then reflected by the dichroic mirror into the coaxial monitoring module.

5. The micro-aperture chamfering equipment based on an adjustable Airy beam according to claim 1, characterized in that, The light source module includes a femtosecond laser, a collimator and beam expander, a half-wave plate, a polarizing beam splitter prism, and a polarization-maintaining mirror. The femtosecond laser is used to generate a femtosecond laser beam, which is incident on the liquid crystal spatial light modulator in sequence through the collimator and beam expander, the half-wave plate, the polarizing beam splitter prism, and the polarization-maintaining mirror.

6. A method for micro-aperture chamfering based on an adjustable Airy beam, characterized in that, The method includes a micro-aperture chamfering apparatus based on an adjustable Airy beam as described in any one of claims 1 to 5, wherein the micro-aperture chamfering apparatus comprises a light source module, a beam modulation module, and a beam scanning module, the beam modulation module comprising a liquid crystal spatial light modulator and a modulation component, the beam scanning module comprising a high-speed two-dimensional scanning component, and the method comprising: Step 1: Generate a laser beam using the light source module; Step 2: Modulate the laser beam into an Airy beam using the liquid crystal spatial light modulator; Step 3: Load different phase holograms onto the liquid crystal spatial light modulator through the control component to control the propagation trajectory and energy distribution of the Airy beam; Step 4: Drive the Airy beam along a preset trajectory using the high-speed two-dimensional scanning component to perform chamfering on the workpiece.

7. The micro-aperture chamfering method based on an adjustable Airy beam according to claim 6, characterized in that, The light source module includes a femtosecond laser, the control component includes an industrial control computer and a drive control board, and the beam scanning module also includes a beam translation and rotation component. Step one specifically includes: A femtosecond laser beam is generated by the femtosecond laser; Step three specifically includes: Determine the aperture and depth of the microholes on the workpiece to be processed, the scanning space tilt angle of the high-speed two-dimensional scanning component, and the preset size of the chamfer; The cubic phase term and shift transform in the Fourier spectrum of the finite Airy beam are adjusted by the industrial control computer to dynamically control the phase hologram of the Airy beam. The controlled phase hologram is then loaded onto the spatial light modulator by the drive control board to change the energy distribution, focal depth and three-dimensional light field trajectory of the Airy beam. Based on the modulated phase hologram, a modulated Airy beam is generated by the liquid crystal spatial light modulator; Step four specifically includes: Vector analysis is performed on the pre-input micro-aperture diameter, number of feed layers, chamfer angle, and beam scanning trajectory determined by the phase hologram of the Airy beam to calculate the real-time deflection of the micro-motion mirror inside the high-speed two-dimensional scanning component. Based on the real-time deflection, the high-speed two-dimensional scanning component and the beam translation and rotation component are driven to move synchronously, so as to drive the Airy beam to scan and process the micro-holes on the workpiece along a preset trajectory to form a chamfer.

8. The micro-aperture chamfering method based on an adjustable Airy beam according to claim 7, characterized in that, The adjustment of the cubic phase term and shift transform in the Fourier spectrum of the finite Airy beam via the industrial control computer specifically includes: Based on Equation 1, the cubic phase term and shift transform in the Fourier spectrum of a finite Airy beam are adjusted. Equation 1 is as follows: in, For Airy functions, For cubic phase terms, It is a displacement transformation quantity; Based on Formula 2, the functional solution of the Airy beam is calculated, where Formula 2 is: in, For the propagation distance of Airy's light field, , The refractive index of the medium, λ is the wavelength.

9. The micro-aperture chamfering method based on an adjustable Airy beam according to claim 8, characterized in that, The aforementioned generation of a modulated Airy beam based on the modulated phase hologram via the liquid crystal spatial light modulator specifically includes: Based on Formula 3, the beam phase diagram of the modulated Airy beam is calculated. Formula 3 is as follows: in, for x, y Wave vector in the direction, The attenuation coefficient is... The rotation angle is... The phase diagram of the Airy beam after intensity transformation is shown, where It is the energy tuning function. v This is the intensity transformation factor. The phase diagram of the Airy beam after displacement transformation. The phase diagram of the Airy beam after rotation transformation.

10. The micro-aperture chamfering method based on an adjustable Airy beam according to claim 6, characterized in that, Before step one, the following are also included: The control component loads a 0-value grayscale phase map onto the liquid crystal spatial light modulator, so that the liquid crystal spatial light modulator does not modulate the light beam. A laser beam is generated by the light source module; The high-speed two-dimensional scanning component drives the laser beam to scan along a preset trajectory in order to perform micro-hole processing on the workpiece. After the micro-hole processing is completed, the power of the laser beam is reduced, the scanning trajectory of the high-speed two-dimensional scanning component is optimized, and the laser beam is driven by the high-speed two-dimensional scanning component to scan along the preset trajectory to perform fine processing on the micro-holes on the workpiece.

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