Semiconductor sensor detection device and detection method

Abstract

The invention relates to the technical field of semiconductor sensor detection, and discloses a semiconductor sensor detection device and method, an extrusion assembly is fixedly assembled in a conveying assembly, detection assemblies are uniformly and fixedly assembled on the conveying assembly, and a driving assembly is fixedly assembled on the conveying assembly. The extrusion assembly cooperates with the conveying assembly to complete extrusion of the detection assembly, so that the detection assembly can effectively support, clamp and limit the semiconductor sensor, and can complete length detection of the semiconductor sensor; the limiting area of the semiconductor sensor can be adjusted first according to the actual length size of the semiconductor sensor, the orientation state of the pins of the semiconductor sensor can be detected, and the clamping application range of the semiconductor sensor is widened. The driving assembly is controlled to act according to the length size of the semiconductor sensor to adjust the angle position of the CCD camera, shooting detection of the semiconductor sensor is better completed, and the quality inspection accuracy is improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor sensor detection technology, and in particular to a semiconductor sensor detection device and detection method. Background Technology

[0002] With the development of technology, semiconductor components are widely used in various industries. In order to ensure the pass rate of semiconductor components, after the semiconductor sensor is manufactured, it is usually necessary to inspect whether its size meets the requirements and whether there are surface defects such as wear. However, the current inspection technology still requires each semiconductor component to be inspected individually, and defective products need to be manually rejected. This is not only inefficient, but also wastes manpower and increases production costs.

[0003] A semiconductor sensor testing device with application number 201920586761.8 includes a photoelectric sensor. When the sensor under test comes directly below the testing component, the moving plate moves laterally along the guide rod driven by the gear. The telescopic cylinder drives the testing mechanism to move downward. The coarse testing module of the testing mechanism inspects the sensor under test on the carrier plate by taking pictures and transmits the picture information to the central control box. The central control box pre-determines whether the sensor under test is qualified. Thus, the quality inspection of the semiconductor sensor is completed through the photoelectric sensor and the visual imaging module.

[0004] In actual use, the aforementioned application documents only use photoelectric sensors to sense the sensors, and then use a vision imaging system to detect the images of the semiconductor sensors. However, during the actual transport process, the belt conveyor cannot limit the movement of the semiconductor sensors, resulting in the semiconductor sensors being disorganized. In addition, the semiconductor sensors are equipped with multiple sets of pins, and the presence of these pins causes the semiconductor sensors to be placed at different angles. This leads to inconsistent position angles of the semiconductor sensors, making it impossible for the vision imaging module to completely capture and detect the semiconductor sensors. The quality inspection matching degree is low, resulting in poor quality inspection accuracy.

[0005] Therefore, it is necessary to solve the above problems by means of a semiconductor sensor detection device and detection method. Summary of the Invention

[0006] The purpose of this invention is to provide a semiconductor sensor detection device and detection method to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor sensor detection device, comprising a conveying component, a pressing component fixedly mounted inside the conveying component, a detection component uniformly fixedly mounted on the conveying component, a driving component fixedly mounted on the conveying component, and a CCD camera movably mounted at the output end of the driving component.

[0008] The conveying assembly includes two sets of opposing conveyor pulleys, with a connecting rod fixedly connected between the two sets of conveyor pulleys, and a conveyor belt wound around the conveyor pulleys.

[0009] The extrusion assembly includes a first fixing ring sleeved and assembled on the outer wall of the right connecting rod and a second fixing ring sleeved and assembled on the outer wall of the left connecting rod. A first horizontal plate is fixedly connected at the top between the first fixing ring and the second fixing ring, and a second horizontal plate is fixedly connected at the bottom between the first fixing ring and the second fixing ring.

[0010] The detection assembly includes opposing arc-shaped plates. Limiting seats are fixedly mounted at the ends of both sets of arc-shaped plates. A receiving groove is provided on each arc-shaped plate, and a limiting plate is slidably mounted within the receiving groove. A first expansion airbag is fixed to the side wall of the limiting plate. A second expansion airbag is fixed to the opposite side of each of the two sets of limiting seats. A clamping plate is fixed to the end of the second expansion airbag. A pressure-bearing airbag is fixed to the inner wall of the conveyor belt. The pressure-bearing airbag is connected to the second expansion airbag via a duct pipe. A pressure solenoid valve is fixedly mounted on the duct pipe. The second expansion airbag is connected to the first expansion airbag via a gas supply pipe. A gas electrically controlled valve is fixedly mounted on the gas supply pipe. A telescopic component is fixedly mounted at the top center of the first horizontal plate. A compression wheel is fixedly mounted on the top of the telescopic component. A relief groove adapted to the compression wheel is provided between the two sets of arc-shaped plates.

[0011] Preferably, the conveying assembly further includes a base plate, a bracket is fixed to the top of the base plate, the conveyor belt pulley is rotatably mounted on the bracket via a rotating shaft, a drive motor is fixedly mounted on the bracket, and a guide channel is provided between the two sets of conveyor belts.

[0012] Preferably, the width of the extrusion assembly is adapted to the length of the connecting rod, and the length of the first horizontal plate is adapted to the length of the conveyor belt. The thickness of the second fixing ring is greater than the thickness of the first fixing ring, the thickness of the first horizontal plate is greater than the thickness of the second horizontal plate, a first extrusion rib is fixed in the middle of the outer side wall of the second fixing ring, and a second extrusion rib is fixed at the bottom of the second fixing ring.

[0013] Preferably, a compression channel is provided between the first fixing ring and the conveyor belt, a holding channel is provided between the first horizontal plate and the conveyor belt, and a reset channel is provided between the second horizontal plate and the conveyor belt.

[0014] Preferably, the height of the pressure-bearing airbag is adapted to the size of the reset channel, the length of the pressure-bearing airbag is adapted to the width of the conveyor belt, and a gas inlet one-way valve is fixedly installed on the pressure-bearing airbag.

[0015] Preferably, the relief groove and the extrusion wheel are directly opposite each other, and a wear-resistant rubber pad is fixedly mounted on the outer surface of the extrusion wheel. The length of the extrusion wheel is adapted to the size of the guide channel. The telescopic assembly includes an outer cylinder fixed to the top of the first horizontal plate, an inner rod inserted into the top of the outer cylinder, a pressure spring fixedly connected between the bottom end of the inner rod and the bottom of the inner cavity of the outer cylinder, and the top of the inner rod and the end of the extrusion wheel are fixedly connected.

[0016] Preferably, a slide rail is fixed at the bottom of the storage groove, the limiting plate is slidably mounted on the slide rail, the first inflatable airbag is movably sleeved on the outside of the slide rail, and the other end of the first inflatable airbag is fixed on the inner side wall of the storage groove.

[0017] Preferably, the drive assembly includes a support rod fixed to a base plate, a top plate fixedly mounted on the top of the support rod, an electric telescopic rod fixedly mounted at the bottom center of the top plate, an arc-shaped seat fixedly mounted at the output end of the electric telescopic rod, a slide rail opened at the bottom of the arc-shaped seat, a slide block slidably mounted in the slide rail, an armature plate fixedly mounted on the front and rear side walls of the slide block, an electromagnet adapted to the armature plate fixedly mounted in the slide rail, and a support spring fixedly connected between the armature plate and the electromagnet.

[0018] Preferably, the curvature of the support spring is adapted to the slide rail, the CCD camera is fixed to the bottom of the slide block, and a dovetail groove is provided on the inner side wall of the slide rail, and a dovetail block adapted to the dovetail groove is fixed on the outer side wall of the slide block.

[0019] A method for using a semiconductor sensor detection device, the specific steps of which are as follows:

[0020] S1: During operation, the external semiconductor sensor feeding device sequentially feeds the semiconductor sensors into the detection assembly, and the detection assembly supports the semiconductor sensors.

[0021] S2: During the conveying process, the extrusion component extrudes the pressure-bearing airbag in the detection component. Then, the gas is transmitted to the second expansion airbag through the air guide tube to cause it to expand. This causes the clamping plates to move towards each other. The clamping plates make contact with both ends of the semiconductor sensor and clamp it. The expansion amount of the second expansion airbag is used to detect the length of the semiconductor sensor. This allows for adjustment of the CCD camera's angle position based on the actual length of the semiconductor sensor, thus enabling better imaging and detection of the semiconductor sensor.

[0022] S3: During the clamping process, the compression deformation of the pressure-bearing airbag remains unchanged. When the clamping plate contacts the semiconductor sensor, it will generate a reaction force. When the gas pressure in the second expansion airbag reaches the pressure threshold of the pressure solenoid valve, the gas is introduced into the first expansion airbag through the gas supply pipe to push the limiting plates to move towards each other. The amount of gas input into the first expansion airbag is adjusted according to the length of the semiconductor sensor, which facilitates the movement of the limiting plate position according to the size of the semiconductor sensor and improves the clamping adaptability of the semiconductor sensor. In this way, the side limiting clamping of the semiconductor sensor is completed by two sets of limiting plates, which better achieves the limiting treatment of the semiconductor sensor.

[0023] S4: When the detection component holding the semiconductor sensor passes the extrusion roller, the extrusion roller extrudes the semiconductor sensor through the relief groove. The telescopic component compresses, providing friction by extruding the semiconductor sensor. Then, the extrusion roller causes the semiconductor sensor to rotate while the detection component holds the semiconductor sensor. Meanwhile, the CCD camera continuously takes pictures of the semiconductor sensor below to complete the quality inspection. The drive component moves the CCD camera to change its shooting angle, which can be adjusted to match the angle of different semiconductor sensors, thus improving the targeting of semiconductor sensor quality inspection.

[0024] The technical effects and advantages of this invention are as follows:

[0025] 1. The conveying component in this invention synchronously transports the detection component and the semiconductor sensor. The squeezing component works in conjunction with the conveying component to squeeze the detection component, enabling the detection component to effectively support and clamp the semiconductor sensor. Simultaneously, it can detect the length of the semiconductor sensor, facilitating the adjustment of the limiting area based on the actual length of the semiconductor sensor. It can also detect the orientation of the semiconductor sensor pins and move the limiting plate position according to the size of the semiconductor sensor, improving the clamping range. Thus, two sets of limiting plates achieve lateral limiting and clamping of the semiconductor sensor, better limiting its position. The drive component's movement is controlled based on the length of the semiconductor sensor to adjust the angle of the CCD camera, better completing the imaging and detection of the semiconductor sensor and improving quality inspection accuracy.

[0026] 2. In this invention, when the detection component holding the semiconductor sensor passes the extrusion roller, the extrusion roller extrudes the semiconductor sensor through the relief groove. The telescopic component compresses, providing frictional force through the extrusion roller's pressure on the semiconductor sensor. Subsequently, the extrusion roller, while holding the semiconductor sensor with the detection component, causes the semiconductor sensor to rotate between the two sets of clamping plates along with the movement of the conveyor belt. Meanwhile, the CCD camera continuously photographs the semiconductor sensor below, completing quality inspection. In this way, the cooperation between the extrusion roller and the conveyor belt completes the rotation operation of the semiconductor sensor, improving the comprehensiveness of the semiconductor sensor's image capture. Furthermore, based on the first and second extrusion ridges, the unloading operation of unqualified and qualified products can be completed, improving the automatic collection efficiency of the semiconductor sensor. Attached Figure Description

[0027] Figure 1 This is a first-view structural diagram of the overall structure of the present invention.

[0028] Figure 2 This is a second-view structural diagram of the overall structure of the present invention.

[0029] Figure 3 This is a schematic cross-sectional view of the overall structure of the present invention.

[0030] Figure 4 This is a schematic diagram of the assembly structure of the extrusion component and the detection component of the present invention.

[0031] Figure 5 This is a schematic diagram of a partial assembly structure of the present invention.

[0032] Figure 6 This is a schematic diagram of the detection component structure of the present invention.

[0033] Figure 7 This is a schematic diagram of the driving component structure of the present invention.

[0034] In the diagram: 1. Conveying assembly; 101. Base plate; 102. Bracket; 103. Conveyor pulley; 104. Connecting rod; 105. Conveyor belt; 106. Guide channel; 2. Extrusion assembly; 201. First fixing ring; 202. First horizontal plate; 203. Second fixing ring; 204. Second horizontal plate; 205. First extrusion protrusion; 206. Second extrusion protrusion; 207. Extrusion channel; 208. Holding channel; 209. Reset channel; 3. Detection assembly; 301. Arc plate; 302. Limiting seat 303. Storage slot; 304. Slide rail; 305. Limiting plate; 306. First expansion airbag; 307. Recessing groove; 308. Second expansion airbag; 309. Clamping plate; 310. Extrusion wheel; 311. Pressure-bearing airbag; 312. Telescopic assembly; 4. Drive assembly; 401. Support rod; 402. Top plate; 403. Electric telescopic rod; 404. Arc-shaped seat; 405. Slide rail; 406. Slide seat; 407. Electromagnet; 408. Armature plate; 409. Support spring; 5. CCD camera. Detailed Implementation

[0035] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0036] First Embodiment

[0037] This invention provides, for example Figures 1 to 7 The semiconductor sensor detection device shown includes a conveying component 1, a pressing component 2 fixedly mounted inside the conveying component 1, a detection component 3 uniformly fixedly mounted on the conveying component 1, a driving component 4 fixedly mounted on the conveying component 1, a CCD camera 5 movably mounted at the output end of the driving component 4, and a controller fixedly mounted on the conveying component 1, which can realize integrated control of the entire device.

[0038] In actual use, the conveying component 1 completes the synchronous transport of the detection component 3 and the semiconductor sensor. The squeezing component 2 works with the conveying component 1 to squeeze the detection component 3, so that the detection component 3 can effectively support and clamp the semiconductor sensor. At the same time, it can also detect the length of the semiconductor sensor, which makes it convenient to first adjust the limiting area of ​​the semiconductor sensor according to the actual length of the semiconductor sensor. Then, based on the length of the semiconductor sensor, the drive component 4 is controlled to adjust the angle and position of the CCD camera 5, so as to better complete the shooting and detection of the semiconductor sensor and improve the accuracy of quality inspection.

[0039] Please see Figures 1-3 The conveying assembly 1 includes two sets of opposing conveyor pulleys 103, with connecting rods 104 fixedly connected between the two sets of conveyor pulleys 103. A conveyor belt 105 is wound and mounted on the conveyor pulleys 103. The conveying assembly 1 also includes a base plate 101, with a bracket 102 fixedly mounted on the top of the base plate 101. The conveyor pulleys 103 are rotatably mounted on the bracket 102 via a rotating shaft. A drive motor is fixedly mounted on the bracket 102. A guide channel 106 is provided between the two sets of conveyor belts 105.

[0040] When the controller controls the drive motor to work, it can drive the conveyor belt 105 to rotate through the conveyor pulley 103, which in turn can drive the detection component 3 to move synchronously. The extrusion component 2 is mounted on the connecting rod 104, so the position of the extrusion component 2 will not move.

[0041] Please see Figures 2-4 The extrusion assembly 2 includes a first fixing ring 201 sleeved and assembled on the outer wall of the right connecting rod 104 and a second fixing ring 203 sleeved and assembled on the outer wall of the left connecting rod 104. A first horizontal plate 202 is fixedly connected at the top between the first fixing ring 201 and the second fixing ring 203, and a second horizontal plate 204 is fixedly connected at the bottom between the first fixing ring 201 and the second fixing ring 203. The width of the extrusion assembly 2 is adapted to the length of the connecting rod 104, and the length of the first horizontal plate 202 is adapted to the length of the conveyor belt 105. The thickness of the second fixing ring 203 is greater than the thickness of the first fixing ring 201, and the thickness of the first horizontal plate 202 is greater than the thickness of the second horizontal plate 204. A first extrusion rib 205 is fixed in the middle of the outer wall of the second fixing ring 203, and a second extrusion rib 206 is fixed at the bottom of the second fixing ring 203.

[0042] A compression channel 207 is provided between the first fixed ring 201 and the conveyor belt 105, a holding channel 208 is provided between the first horizontal plate 202 and the conveyor belt 105, and a reset channel 209 is provided between the second horizontal plate 204 and the conveyor belt 105. Since the space of the compression channel 207 gradually decreases from bottom to top, it is convenient to compress the pressure-bearing airbag 311. The space of the holding channel 208 does not change from left to right. Therefore, the pressure-bearing airbag 311 will not be compressed twice in this space. The space of the reset channel 209 is larger than that of the holding channel 208. Therefore, when the pressure-bearing airbag 311 passes through the reset channel 209, it will expand and reset, which is convenient for the next compression process.

[0043] Please see Figures 1-6The detection component 3 includes opposing arc-shaped plates 301. Limiting seats 302 are fixedly mounted at the ends of both sets of arc-shaped plates 301. A receiving groove 303 is provided on each arc-shaped plate 301, and a limiting plate 305 is slidably mounted within the receiving groove 303. A first inflatable airbag 306 is fixed to the side wall of the limiting plate 305. A second inflatable airbag 308 is fixed to the opposite side of the two sets of limiting seats 302. A clamping plate 309 is fixed to the end of the second inflatable airbag 308. A clamping plate 309 is fixed to the inner wall of the conveyor belt 105. There is a pressure-bearing airbag 311, which is connected to a second expansion airbag 308 through an air guide pipe. A pressure solenoid valve is fixedly installed on the air guide pipe. The second expansion airbag 308 is connected to the first expansion airbag 306 through an air supply pipe. A gas electric control valve is fixedly installed on the air supply pipe. A telescopic component 312 is fixedly installed in the middle of the top of the first horizontal plate 202. A compression wheel 310 is fixedly installed on the top of the telescopic component 312. A relief groove 307 adapted to the compression wheel 310 is opened between the two sets of arc plates 301.

[0044] When the conveyor belt 105 drives the detection assembly 3 to move synchronously, when the pressure-bearing airbag 311 passes through the compression channel 207, the first fixing ring 201 and the conveyor belt 105 cooperate to compress the pressure-bearing airbag 311. Then, gas is introduced into the second expansion airbag 308 through the air guide tube, causing it to expand. This, in turn, drives the clamping plate 309 to move towards each other, allowing the clamping plate 309 to contact both ends of the semiconductor sensor, thus completing the clamping. When the clamping plate 309 contacts the semiconductor sensor, it generates a reaction force. When the gas pressure in the second expansion airbag 308 reaches the pressure threshold of the pressure solenoid valve, the clamping operation of the semiconductor sensor is complete. Under this clamping pressure, the leads of the semiconductor sensor will not deform or bend, and the semiconductor sensor can be clamped to a limited position. When the pressure solenoid valve reaches the threshold, the controller can calculate the length of the semiconductor sensor based on the expansion amount of the second expansion airbag 308. When the length of the semiconductor sensor is not less than the first threshold, i.e., the leads of the semiconductor sensor are relatively long, the semiconductor sensor is placed into the detection assembly. Within component 3, there will be no excessive tilt angle or pins pointing vertically downwards. The semiconductor sensor will lie flat within the arc-shaped plate 301, with the pins in a horizontal or near-horizontal state. This allows the CCD camera 5 to capture images with a larger exposed pin area without blind spots. Furthermore, the longer the semiconductor sensor of the same type, the larger its width. Therefore, the controller controls the amount of gas input into the first expansion bladder 306 based on the length of the semiconductor sensor. This allows for real-time control of the movement distance of the limiting plate 305 based on the length of the semiconductor sensor. Gas is introduced into the first expansion bladder 306 from the pressure solenoid valve through the gas supply pipe. The expansion of the first expansion bladder 306 pushes the limiting plate 305 to move towards each other, thereby changing the position of the limiting plate 305. This facilitates movement of the limiting plate 305 according to the size of the semiconductor sensor, improving the clamping range of the semiconductor sensor. Thus, the two sets of limiting plates 305 achieve lateral limiting and clamping of the semiconductor sensor, better limiting its position.

[0045] It is worth noting that when the gas pressure in the second expansion bladder 308 reaches the threshold of the pressure solenoid valve, the gas will naturally be introduced into the first expansion bladder 306 through the gas delivery pipe. The pressure threshold of the pressure control valve is determined by the amount of gas introduced. Therefore, when the amount of gas introduced into the first expansion bladder 306 reaches the target, the pressure control valve will automatically open. Since the volume of the pressure bladder 311 that is compressed is a fixed amount, the excess gas in the pressure bladder 311 will be discharged through the pressure control valve, ensuring the correspondence between the gas pressure in the first expansion bladder 306 and the actual position of the limit plate 305.

[0046] A slide rail 304 is fixed at the bottom of the storage slot 303. The limiting plate 305 is slidably mounted on the slide rail 304. The first inflatable airbag 306 is movably sleeved on the outside of the slide rail 304, and the other end of the first inflatable airbag 306 is fixed on the inner side wall of the storage slot 303. This facilitates the sliding of the limiting plate 305 on the slide rail 304, ensuring the freedom of the limiting plate 305 while facilitating the pushing of the limiting plate 305 by the first inflatable airbag 306.

[0047] The height of the pressure-bearing airbag 311 is compatible with the size of the reset channel 209, the length of the pressure-bearing airbag 311 is compatible with the width of the conveyor belt 105, and a gas inlet check valve is fixedly installed on the pressure-bearing airbag 311.

[0048] The relief groove 307 and the extrusion wheel 310 are directly opposite each other, and the outer surface of the extrusion wheel 310 is fixedly fitted with a wear-resistant rubber pad. The length of the extrusion wheel 310 is adapted to the size of the guide channel 106. The telescopic assembly 312 includes an outer cylinder fixed to the top of the first horizontal plate 202. An inner rod is inserted into the top of the outer cylinder. A pressure spring is fixedly connected between the bottom end of the inner rod and the bottom of the inner cavity of the outer cylinder. The top of the inner rod is fixedly connected to the end of the extrusion wheel 310.

[0049] It is worth noting that when the detection component 3 holding the semiconductor sensor passes the extrusion roller 310, the extrusion roller 310 extrudes the semiconductor sensor through the relief groove 307. The telescopic component 312 is compressed, providing friction by the extrusion roller 310 extruding the semiconductor sensor. Then, under the premise that the detection component 3 is holding the semiconductor sensor, the extrusion roller 310 causes the semiconductor sensor to rotate between the two sets of clamping plates 309 as the conveyor belt 105 moves. Meanwhile, the CCD camera 5 takes pictures of the semiconductor sensor below at all times to complete the quality inspection. In this way, the cooperation between the extrusion roller 310 and the conveyor belt 105 completes the rotation operation of the semiconductor sensor, improving the comprehensiveness of the semiconductor sensor image.

[0050] It is worth noting that the inner wall of the relief groove 307 is evenly provided with air jet holes that are directly opposite the semiconductor sensor. The air jet holes are connected to the pressure-bearing airbag 311 through the air blower pipe. A gas control valve is fixedly installed on the air blower pipe. After the semiconductor sensor completes the quality inspection operation, the detection component 3 will disengage from the extrusion wheel 310 and move with the conveyor belt 105. When the CCD camera 5 detects that the semiconductor sensor is qualified, when the pressure-bearing airbag 311 moves to the position of the first extrusion protrusion 205, the pressure-bearing airbag 311 will complete the secondary pressurization through the cooperation of the first extrusion protrusion 205 and the conveyor belt 105. At this time, the controller keeps the gas control valve in the closed state so that the gas will not be ejected through the air jet holes. When the pressure-bearing airbag 311 passes through the first extrusion protrusion 205 and reaches the position of the second extrusion protrusion 206, the pressure-bearing airbag 311 will pass through the second extrusion protrusion 206 and the conveyor belt 105. The conveyor belt 105 completes the repressurization operation. At this time, the controller controls the gas control valve to open, so the gas in the pressure bladder 311 will be ejected through the jet hole, which will blow off the qualified semiconductor sensors and complete the collection of qualified semiconductor sensors. When the CCD camera 5 detects that the semiconductor sensor is unsuitable or defective, when the pressure bladder 311 moves to the position of the first extrusion protrusion 205, the pressure bladder 311 will complete the repressurization through the cooperation of the first extrusion protrusion 205 and the conveyor belt 105. At this time, the controller controls the gas control valve to be in the open state, so the gas will be ejected directly through the jet hole, which can blow off the unqualified semiconductor sensors for collection. Therefore, the first extrusion protrusion 205 and the second extrusion protrusion 206 can complete the unloading operation of unqualified and qualified products, improving the automatic collection efficiency of semiconductor sensors.

[0051] After the pressure-bearing airbag 311 bypasses the second compression protrusion 206, it enters the reset channel 209. In this way, external gas enters the pressure-bearing airbag 311 through the gas inlet one-way valve. At the same time, the gas inside the first expansion airbag 306 is introduced into the second expansion airbag 308 through the gas supply pipe, and the gas inside the second expansion airbag 308 also flows back into the pressure-bearing airbag 311 through the gas guide pipe. This facilitates the synchronous reset operation of the pressure-bearing airbag 311, the second expansion airbag 308, and the first expansion airbag 306, making it convenient for the next pressurization operation.

[0052] Please see Figure 5 and Figure 7The drive assembly 4 includes a support rod 401 fixed on the base plate 101. A top plate 402 is fixedly mounted on the top of the support rod 401. An electric telescopic rod 403 is fixedly mounted in the middle of the bottom of the top plate 402. An arc-shaped seat 404 is fixedly mounted at the output end of the electric telescopic rod 403. A slide rail 405 is provided at the bottom of the arc-shaped seat 404. A slide block 406 is slidably mounted in the slide rail 405. An armature plate 408 is fixed on both the front and rear side walls of the slide block 406. An electromagnet 407 adapted to the armature plate 408 is fixed in the slide rail 405. A support spring 409 is fixedly connected between the armature plate 408 and the electromagnet 407. The curvature of the support spring 409 is adapted to the slide rail 405. The CCD camera 5 is fixed at the bottom of the slide block 406. A dovetail groove is provided on the inner side wall of the slide rail 405. A dovetail block adapted to the dovetail groove is fixed on the outer side wall of the slide block 406.

[0053] In actual operation, the controller can control the current supplied to the electromagnet 407, which in turn generates different magnetic repulsion forces on the armature plate 408. When the magnetic repulsion force increases, it overcomes the rebound force of the support spring 409, pushing the slide block 406 to slide in the slide rail 405. This, in turn, moves the CCD camera 5 on the arc-shaped base 404, thereby driving the CCD camera 5 to move via the drive assembly 4, changing its shooting angle. This facilitates matching angle adjustments based on the tilt angle of different semiconductor sensors, improving the targeted nature of semiconductor sensor quality inspection.

[0054] When the length of the semiconductor sensor is less than the first threshold, meaning the semiconductor sensor pins are too short, the semiconductor sensor placed in the detection assembly 3 may tilt at too large an angle or have the pins pointing vertically downwards due to the short pins, causing the pins to be blocked or covered. In this case, the semiconductor sensor pins will be in a downward-facing state, and the CCD camera 5 cannot accurately acquire all the image information of the pins. Therefore, the controller controls the current introduced into the electromagnet 407 on the corresponding side to decrease and simultaneously increase the current into the electromagnet 407 on the other side according to the length of the semiconductor sensor. This causes the slide 406 to move along the slide rail 405 towards the pin side, so that the CCD camera 5 is tilted to face the semiconductor sensor pins, achieving vertical pin imaging quality inspection. When the length of the semiconductor sensor decreases, the controller controls the drive assembly 4 to increase the tilt angle of the CCD camera 5, achieving a match between the length of the semiconductor sensor and the tilt angle of the CCD camera 5. In this way, when the extrusion wheel 310 drives the semiconductor sensor to rotate on the clamping plate 309, the CCD camera 5 can achieve comprehensive pin imaging processing, improving the accuracy of sensor quality inspection.

[0055] It is worth noting that the surface of the clamping plate 309 can be made of graphite plate. In this way, when the two sets of clamping plates 309 clamp the semiconductor sensor, the conductivity of the graphite plate can be used to simultaneously complete the conductivity quality inspection operation of the semiconductor sensor, thereby improving the comprehensiveness of the quality inspection.

[0056] It is worth noting that when the length of the semiconductor sensor is not greater than the second threshold, it indicates that the length of the semiconductor sensor is very small and the pin length is not up to standard. At this time, the controller will directly determine that it is unqualified, and finally the unqualified products will be collected by the cooperation of the extrusion component 2 and the detection component 3.

[0057] Second Embodiment

[0058] This invention also discloses a method for using a semiconductor sensor detection device, the specific steps of which are as follows:

[0059] S1: During operation, the semiconductor sensors are sequentially fed into the detection component 3 using the external semiconductor sensor feeding device, and the semiconductor sensors are supported by the detection component 3.

[0060] S2: During the conveying process of the conveying component 1, the squeezing component 2 squeezes the pressure-bearing airbag 311 in the detection component 3. Then, the gas is transmitted to the second expansion airbag 308 through the air guide tube to cause it to expand. This causes the clamping plate 309 to move towards each other. The clamping plate 309 makes contact with both ends of the semiconductor sensor and completes the clamping. The expansion amount of the second expansion airbag 308 completes the length detection of the semiconductor sensor. This makes it easier to adjust the angle position of the CCD camera 5 according to the actual length of the semiconductor sensor, and better complete the shooting and detection of the semiconductor sensor.

[0061] S3: During the clamping process, the compression deformation of the pressure-bearing airbag 311 remains unchanged. When the clamping plate 309 contacts the semiconductor sensor, a reaction force is generated. When the gas pressure in the second expansion airbag 308 reaches the pressure threshold of the pressure solenoid valve, the gas is introduced into the first expansion airbag 306 through the gas supply pipe to push the limiting plate 305 to move towards each other. The amount of gas input into the first expansion airbag 306 is adjusted according to the length of the semiconductor sensor, which facilitates the movement of the limiting plate 305 according to the size of the semiconductor sensor and improves the clamping adaptability of the semiconductor sensor. In this way, the side limiting clamping of the semiconductor sensor is completed by the two sets of limiting plates 305, and the limiting treatment of the semiconductor sensor is better achieved.

[0062] S4: When the detection component 3 holding the semiconductor sensor passes the extrusion roller 310, the extrusion roller 310 extrudes the semiconductor sensor through the relief groove 307. The telescopic component 312 is compressed, which provides friction force by extruding the semiconductor sensor through the extrusion roller 310. Then, the extrusion roller 310 causes the semiconductor sensor to rotate under the premise that the detection component 3 is holding the semiconductor sensor. Meanwhile, the CCD camera 5 takes pictures of the semiconductor sensor below at all times to complete the quality inspection. The drive component 4 drives the CCD camera 5 to move and change its shooting angle, which facilitates the matching angle adjustment according to different semiconductor sensor tilt angles, thereby improving the pertinence of semiconductor sensor quality inspection.

[0063] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A semiconductor sensor detection device, characterized in that: It includes a conveying component (1), a pressing component (2) is fixedly assembled inside the conveying component (1), a detection component (3) is uniformly fixedly assembled on the conveying component (1), a driving component (4) is fixedly assembled on the conveying component (1), and a CCD camera (5) is movably assembled at the output end of the driving component (4). The conveying assembly (1) includes two sets of opposing conveyor pulleys (103), and a connecting rod (104) is fixedly connected between the two sets of conveyor pulleys (103). A conveyor belt (105) is wound and assembled on the conveyor pulleys (103). The extrusion assembly (2) includes a first fixing ring (201) sleeved and assembled on the outer wall of the right connecting rod (104) and a second fixing ring (203) sleeved and assembled on the outer wall of the left connecting rod (104). A first horizontal plate (202) is fixedly connected at the top between the first fixing ring (201) and the second fixing ring (203), and a second horizontal plate (204) is fixedly connected at the bottom between the first fixing ring (201) and the second fixing ring (203). The detection component (3) includes opposing arc-shaped plates (301). Limiting seats (302) are fixedly mounted at the ends of both sets of arc-shaped plates (301). A receiving groove (303) is provided on each arc-shaped plate (301). A limiting plate (305) is slidably mounted within the receiving groove (303). A first inflatable airbag (306) is fixed to the side wall of the limiting plate (305). A second inflatable airbag (308) is fixed to the opposite side of each of the two sets of limiting seats (302). A clamping plate (309) is fixed to the end of the second inflatable airbag (308). The inner side of the conveyor belt (105)... A pressure-bearing airbag (311) is fixed on the wall. The pressure-bearing airbag (311) is connected to a second expansion airbag (308) through an air guide pipe. A pressure solenoid valve is fixedly installed on the air guide pipe. The second expansion airbag (308) is connected to a first expansion airbag (306) through an air supply pipe. A gas electric control valve is fixedly installed on the air supply pipe. A telescopic component (312) is fixedly installed in the middle of the top of the first horizontal plate (202). A compression wheel (310) is fixedly installed on the top of the telescopic component (312). A relief groove (307) adapted to the compression wheel (310) is opened between the two sets of arc plates (301).

2. The semiconductor sensor detection device according to claim 1, characterized in that: The conveying assembly (1) also includes a base plate (101), a bracket (102) is fixed on the top of the base plate (101), the conveyor belt pulley (103) is rotatably mounted on the bracket (102) via a rotating shaft, a drive motor is fixedly mounted on the bracket (102), and a guide channel (106) is provided between the two sets of conveyor belts (105).

3. The semiconductor sensor detection device according to claim 1, characterized in that: The width of the extrusion assembly (2) is adapted to the length of the connecting rod (104), and the length of the first horizontal plate (202) is adapted to the length of the conveyor belt (105). The thickness of the second fixing ring (203) is greater than the thickness of the first fixing ring (201), the thickness of the first horizontal plate (202) is greater than the thickness of the second horizontal plate (204), a first extrusion protrusion (205) is fixed in the middle of the outer side wall of the second fixing ring (203), and a second extrusion protrusion (206) is fixed at the bottom of the second fixing ring (203).

4. The semiconductor sensor detection device according to claim 3, characterized in that: A compression channel (207) is provided between the first fixing ring (201) and the conveyor belt (105), a holding channel (208) is provided between the first horizontal plate (202) and the conveyor belt (105), and a reset channel (209) is provided between the second horizontal plate (204) and the conveyor belt (105).

5. The semiconductor sensor detection device according to claim 4, characterized in that: The height of the pressure-bearing airbag (311) is adapted to the size of the reset channel (209), the length of the pressure-bearing airbag (311) is adapted to the width of the conveyor belt (105), and a gas inlet one-way valve is fixedly mounted on the pressure-bearing airbag (311).

6. The semiconductor sensor detection device according to claim 5, characterized in that: The relief groove (307) and the extrusion wheel (310) are directly opposite each other, and the outer surface of the extrusion wheel (310) is fixedly fitted with a wear-resistant rubber pad. The length of the extrusion wheel (310) is adapted to the size of the guide channel (106). The telescopic assembly (312) includes an outer cylinder fixed to the top of the first horizontal plate (202). An inner rod is inserted into the top of the outer cylinder. A pressure spring is fixedly connected between the bottom end of the inner rod and the bottom of the inner cavity of the outer cylinder. The top of the inner rod is fixedly connected to the end of the extrusion wheel (310).

7. A semiconductor sensor detection device according to claim 2, characterized in that: The bottom of the storage groove (303) is fixed with a slide rail (304), the limiting plate (305) is slidably mounted on the slide rail (304), the first inflatable airbag (306) is movably sleeved on the outside of the slide rail (304), and the other end of the first inflatable airbag (306) is fixed on the inner side wall of the storage groove (303).

8. A semiconductor sensor detection device according to claim 2, characterized in that: The drive assembly (4) includes a support rod (401) fixed on a base plate (101). A top plate (402) is fixedly mounted on the top of the support rod (401). An electric telescopic rod (403) is fixedly mounted in the middle of the bottom of the top plate (402). An arc-shaped seat (404) is fixedly mounted on the output end of the electric telescopic rod (403). A slide rail (405) is provided at the bottom of the arc-shaped seat (404). A slide block (406) is slidably mounted in the slide rail (405). An armature plate (408) is fixed on the front and rear side walls of the slide block (406). An electromagnet (407) adapted to the armature plate (408) is fixed in the slide rail (405). A support spring (409) is fixedly connected between the armature plate (408) and the electromagnet (407).

9. A semiconductor sensor detection device according to claim 8, characterized in that: The curvature of the support spring (409) is adapted to the slide rail (405), and the CCD camera (5) is fixed at the bottom of the slide block (406). A dovetail groove is provided on the inner side wall of the slide rail (405), and a dovetail block adapted to the dovetail groove is fixed on the outer side wall of the slide block (406).

10. A method of using a semiconductor sensor detection device, the method of using the semiconductor sensor detection device as described in claim 1, characterized in that: The specific steps for using this method are as follows: S1: During operation, the semiconductor sensor is fed into the detection component (3) in sequence using the external semiconductor sensor feeding device, and the semiconductor sensor is supported by the detection component (3). S2: During the transmission process of the transmission component (1), the extrusion component (2) extrudes the pressure-bearing airbag (311) in the detection component (3), and then the gas is transmitted to the second expansion airbag (308) through the air guide tube to cause it to expand, and then drive the clamping plate (309) to move towards each other. The clamping plate (309) completes the contact between the two ends of the semiconductor sensor, and then completes the clamping. The length of the semiconductor sensor is detected by the expansion amount of the second expansion airbag (308), which makes it convenient to adjust the angle position of the CCD camera (5) according to the actual length of the semiconductor sensor, and better complete the shooting detection of the semiconductor sensor. S3: During the clamping process, the compression deformation of the pressure-bearing airbag (311) remains unchanged. When the clamping plate (309) contacts the semiconductor sensor, a reaction force will be generated. When the gas pressure in the second expansion airbag (308) reaches the pressure threshold of the pressure solenoid valve, the gas is introduced into the first expansion airbag (306) through the gas supply pipe to push the limiting plate (305) to move towards each other. The amount of gas input into the first expansion airbag (306) is adjusted according to the length of the semiconductor sensor, so as to facilitate the movement of the position of the limiting plate (305) according to the size of the semiconductor sensor and improve the clamping adaptation range of the semiconductor sensor. In this way, the side limiting clamping of the semiconductor sensor is completed by the two sets of limiting plates (305), and the limiting processing of the semiconductor sensor is better achieved. S4: When the detection component (3) holding the semiconductor sensor passes the extrusion roller (310), the extrusion roller (310) extrudes the semiconductor sensor through the relief groove (307). The telescopic component (312) is compressed to provide the extrusion roller (310) to extrude friction on the semiconductor sensor. Then, the extrusion roller (310) causes the semiconductor sensor to rotate under the premise that the detection component (3) holds the semiconductor sensor. Meanwhile, the CCD camera (5) takes pictures of the semiconductor sensor below at all times to complete the quality inspection. The drive component (4) drives the CCD camera (5) to move and change its shooting angle. This facilitates the matching angle adjustment according to the tilt angle of different semiconductor sensors, improving the pertinence of semiconductor sensor quality inspection.

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