Automatic wiring method for gold-plated lead of DRAM (Dynamic Random Access Memory) packaging substrate
By using automated routing methods, the problem of cumbersome design of gold-plated leads on DRAM packaging substrates has been solved, enabling efficient and accurate drawing of gold-plated leads and improving design efficiency and flexibility.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- PAYTON TECHNOLOGY (SHENZHEN) CO LTD
- Filing Date
- 2026-01-19
- Publication Date
- 2026-04-28
AI Technical Summary
In existing technologies, the design of gold-plated leads on DRAM packaging substrates relies on manual addition, resulting in a cumbersome and time-consuming workflow that fails to meet the requirements of efficient design.
An automated routing method is adopted, which uses structured data input, VBA program intelligent calculation, network screening and deduplication, and script automatic generation. Data is entered through Excel templates, VBA program is used to calculate gold-plated lead paths and deduplication networks, Allegro script files are generated, and gold-plated leads are automatically drawn in Allegro software.
It improves the design efficiency of gold-plated leads, reduces human error, shortens the development cycle, enhances the accuracy and flexibility of the design, and reduces maintenance difficulty.
Smart Images
Figure CN121936404A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of DRAM packaging substrate design technology, specifically to a method for automatic routing of gold-plated leads on a DRAM packaging substrate. Background Technology
[0002] DRAM packaging substrates form electrical connections and signal transmission circuits with DIEs through wire bonding technology. In this process, gold-gold contacts can form strong and low-resistance bonding points, while gold-plated pads can provide a flat, clean and non-oxidizing surface, which significantly improves the success rate and reliability of soldering. Therefore, the wire bonding area on the substrate usually needs to be gold-plated. For the successful implementation of the electroplating gold process, additional gold-plating leads need to be designed on the packaging substrate. These leads guide the current to the isolated patterns requiring electroplating, ensuring that all areas are uniformly coated with gold. This necessitates a design that ensures all independent electroplating networks are equipped with gold-plating leads while maintaining design simplicity. For electrically connected areas within the substrate, different gold-plating regions should not require repeated leads, thus avoiding design redundancy. In existing technologies, the design of gold-plated leads relies on manual addition by designers. DRAM products typically use wBGA packaging, with the bonding wire passing through a slotted area in the middle of the substrate, connecting the diepad to the gold-plated area. To prevent the bonding wire from bending into adjacent gold-plated areas and causing short circuits between different networks, designers need to add gold-plated leads along the bonding wire direction within a range of approximately 100µm from the gold-plated area to the edge of the slot. Then, the angle of the gold-plated leads is adjusted and they are connected parallel to the main lead to achieve connectivity with other leads.
[0003] However, existing manual design methods have many drawbacks. For DRAM packaging substrates containing dozens to hundreds of gold-plated areas, designers manually design, draw, and assign nets to each gold-plated lead, which is a cumbersome and time-consuming process, becoming a bottleneck in the design flow.
[0004] Therefore, we propose an automated routing method for gold-plated leads on DRAM packaging substrates. Summary of the Invention
[0005] The purpose of this invention is to provide an automatic wiring method for gold-plated leads on a DRAM packaging substrate, which solves the problems mentioned in the background art.
[0006] To achieve the above objectives, the present invention provides the following technical solution: a method for automatic wiring of gold-plated leads on a DRAM packaging substrate, comprising the following steps: S1: Structured data input. Construct a standardized Excel template as the input interface. Input the network name of the gold-plated area, the starting point (X1, Y1) of the bonding line, the ending point (X2, Y2) of the bonding line, the slot width, and the gold-plated lead width information in the specified worksheet area. S2: Intelligent coordinate calculation. The VBA program calculates the bond wire angle based on the start and end points of the bond wire input in S1. The gold-plated lead maintains the same angle as the bond wire within a range of 100um±10um at the edge of the slot. Combined with the slot width information input in S1, the distance from the inflection point of the gold-plated lead to the main lead is calculated to obtain the accurate routing path and vertex coordinate sequence of the gold-plated lead. S3: Network screening and deduplication. The VBA program automatically analyzes the connection relationship between the network and the bond line in the gold-plated area, identifies and filters out duplicate networks from the network name information input in S1, and performs deduplication to retain unique network connections. S4: Generate a wiring instruction set, bind the cleaned network connection relationship in S3 with the geometric coordinates calculated in S2, and form an intermediate data file to be converted into a script; S5: Automatic script generation. The intermediate data file generated by S4 is written into a complete Allegro script file according to the syntax rules of the Allegro script language, which includes creating line segments, setting line segment widths, and placing line segments to the specified routing layer. S6: Automated execution and graphics generation. Open the package substrate file to be designed in Allegro software, call the script file generated by S5, and the software automatically reads and executes the commands to draw all gold-plated leads in batches.
[0007] In a preferred embodiment of the present invention, the specified worksheet area of the Excel template in S1 is divided into independent data input columns, which correspond to the input items of the network name of the gold-plated area, the starting point of the bonding line (X1, Y1), the ending point of the bonding line (X2, Y2), the slot width, and the width of the gold-plated lead.
[0008] In a preferred embodiment of the present invention, in step S2, the VBA program calculates the coordinate difference between the starting point (X1, Y1) and the ending point (X2, Y2) of the bond line and obtains the bond line angle by combining the arctangent function.
[0009] In a preferred embodiment of the present invention, in step S2, the vertex coordinate sequence of the gold-plated lead includes the coordinate data of the gold-plated area connection point, slot edge transition point, inflection point, and main lead connection point.
[0010] In a preferred embodiment of the present invention, in step S3, the VBA program establishes a network name database and iterates through and compares the input network names to identify and filter duplicate networks.
[0011] In a preferred embodiment of the present invention, in step S5, the Allegro script file further includes layer matching instructions to ensure that the gold-plated leads are placed on a preset gold-plated wiring layer.
[0012] In a preferred embodiment of the present invention, in step S6, the script file automatically checks whether the lead spacing conforms to the design rules during execution, and generates an error message if there is a spacing violation.
[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: This invention replaces the traditional, tedious manual design, drawing, and net assignment work with an automated routing process, improving the efficiency of the gold-plated lead design stage in the packaging substrate design process and effectively shortening the product development cycle. By adopting a procedural execution method, product defects such as incomplete or excessive lead wire addition or spacing violations caused by human error are avoided, thus improving the accuracy and reliability of the design. When the chip pad layout or gold finger position changes, simply update the input data in the Excel template to quickly regenerate the routing script and complete automatic routing, giving the design greater flexibility and the ability to respond quickly to changes, and reducing the difficulty of design maintenance. Attached Figure Description
[0014] Other features, objects, and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings: Figure 1 This is a flowchart of an automatic routing method for gold-plated leads on a DRAM packaging substrate according to the present invention. Detailed Implementation
[0015] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.
[0016] like Figure 1 As shown, a method for automatic wiring of gold-plated leads on a DRAM packaging substrate includes: S1: Structured data input. Construct a standardized Excel template as the input interface. Input the network name of the gold-plated area, the starting point (X1, Y1) of the bonding line, the ending point (X2, Y2) of the bonding line, the slot width, and the gold-plated lead width information in the specified worksheet area. The specified worksheet area of the Excel template is divided into independent data input columns, which correspond to the input items of the network name of the gold-plated area, the starting point of the bonding line (X1, Y1), the ending point of the bonding line (X2, Y2), the slot width, and the width of the gold-plated lead.
[0017] S2: Intelligent coordinate calculation. The VBA program calculates the bond wire angle based on the start and end points of the bond wire input in S1. The gold-plated lead maintains the same angle as the bond wire within a range of 100um±10um at the edge of the slot. Combined with the slot width information input in S1, the distance from the inflection point of the gold-plated lead to the main lead is calculated to obtain the accurate routing path and vertex coordinate sequence of the gold-plated lead. The VBA program calculates the coordinate difference between the starting point (X1, Y1) and the ending point (X2, Y2) of the bond wire, and then uses the arctangent function to solve for the bond wire angle. The vertex coordinate sequence of the gold-plated lead includes the coordinate data of the gold-plated area connection point, slot edge transition point, inflection point, and main lead connection point.
[0018] S3: Network screening and deduplication. The VBA program automatically analyzes the connection relationship between the network and the bond line in the gold-plated area, identifies and filters out duplicate networks from the network name information input in S1, and performs deduplication to retain unique network connections. The VBA program establishes a network name database and iterates through and compares the input network names to identify and filter duplicate networks.
[0019] S4: Generate a wiring instruction set, bind the cleaned network connection relationship in S3 with the geometric coordinates calculated in S2, and form an intermediate data file to be converted into a script; S5: Automatic script generation. The intermediate data file generated by S4 is written into a complete Allegro script file according to the syntax rules of the Allegro script language, which includes creating line segments, setting line segment widths, and placing line segments to the specified routing layer. The Allegro script file also includes layer matching instructions to ensure that gold-plated leads are placed on preset gold-plated wiring layers.
[0020] S6: Automated execution and graphics generation. Open the package substrate file to be designed in Allegro software, call the script file generated by S5, and the software automatically reads and executes the commands to draw all gold-plated leads in batches.
[0021] The script file automatically checks whether the lead spacing conforms to the design rules during execution. If there is a spacing violation, an error message is generated.
[0022] The specific implementation is as follows: This system achieves automated routing of gold-plated leads on DRAM packaging substrates through a collaborative process encompassing structured data input, VBA intelligent calculation and data cleaning, script conversion, automated execution, and graphics generation. It utilizes standardized Excel templates for standardized input of basic data, employs VBA programs to handle critical logic processing such as coordinate calculations and network deduplication, and then automatically generates and executes Allegro scripts to precisely and batch-draw gold-plated leads that meet design requirements. This completely replaces the traditional manual design method, solving problems such as low efficiency, error-proneness, and difficult maintenance.
[0023] The steps are as follows: 1. Structured data input First, create a standardized Excel template and then create a dedicated worksheet within it. This worksheet is divided into independent data input columns, corresponding to the input fields for the network name of the gold-plated area, the coordinates of the start and end points of the bond line, the slot width, and the width of the gold-plated leader line. Set up data input cells below each column header and add data format hints to the cells to avoid input errors.
[0024] Designers should enter the relevant data for each gold-plated area in the corresponding cells of the specified columns according to the design requirements of the DRAM packaging substrate. For DRAM packaging substrates with multiple gold-plated areas, enter the relevant data for all gold-plated areas row by row in the above manner to ensure data completeness and accuracy.
[0025] 2. Intelligent coordinate calculation Launch the pre-written VBA program, which uses Excel's macro function to establish a connection with the data input template mentioned above and automatically reads all the data entered in the worksheet.
[0026] Bond line angle calculation: The VBA program calculates the bond line angle by using the coordinate difference between the start and end points of the bond line and the corresponding function.
[0027] Gold-plated lead routing path and vertex coordinate calculation: According to design specifications, the gold-plated lead must maintain the same angle as the bond wire within a certain range outside the slot edge. First, calculate the slot edge position and determine the slot edge range based on the entered slot width information; then, determine the starting transition point of the gold-plated lead at a specified position outside this edge; next, calculate the distance from the gold-plated lead inflection point to the main lead through geometric calculations to ensure that the inflection point position does not affect the layout of other lines; finally, determine the main lead connection point to form a complete routing path and generate a precise coordinate sequence containing each key node.
[0028] After the coordinates of all gold-plated areas are calculated, the VBA program automatically creates a new worksheet in the Excel template, and enters the network name, bond wire angle, and leader vertex coordinate sequence of each gold-plated area into the worksheet one by one, so that designers can view and verify it.
[0029] 3. Network screening and deduplication The VBA program reads the network name data from the worksheet and simultaneously creates a temporary network name database. The database stores the network names and the corresponding gold-plated area quantity information in a specific format.
[0030] The program iterates through and compares all network names. If the same network name appears multiple times, meaning the same network corresponds to multiple gold-plated areas, it is determined to be a duplicate network. The program only retains the complete data of the first gold-plated area corresponding to that network name, while marking the gold-plated areas corresponding to the remaining duplicate networks, and no longer allocating independent gold-plated lead resources to them.
[0031] After deduplication is complete, the VBA program generates a dedicated worksheet that records the unique network name to be retained, the corresponding gold-plated area number, and associated data. It also lists the duplicate network names that were removed and their corresponding gold-plated areas, making it easy for designers to trace.
[0032] 4. Generate routing instruction set The VBA program binds the vertex coordinate sequence in the coordinate calculation result with the unique network connection relationship in the network deduplication result to form an intermediate data file. The intermediate data file is stored in a structured format, and each data record contains key fields such as network name, vertex coordinates, lead width, and routing layer. The routing layer field is preset to the gold-plated routing layer of the DRAM package substrate, and can be configured in advance in the VBA program if necessary.
[0033] 5. Scripts are automatically generated. The VBA program calls the script generation module, which converts each record in the intermediate data file into a corresponding Allegro operation command according to the syntax rules of the Allegro scripting language.
[0034] The script file contains the following core instructions: Layer switching command: Ensure that the leader line is drawn on the preset gold-plated wiring layer; Line segment creation command: Draws a leader line based on the vertex coordinate sequence; Line width setting command: Set the lead wire width according to the entered line width parameters; Network association command: Binds the drawn leader to the corresponding network; After all intermediate data records have been converted, the VBA program automatically generates an Allegro script file and saves it to a preset path.
[0035] 6. Automated execution and graphics generation Open Allegro software, open the DRAM package substrate file to be designed in the software, and ensure that the basic substrate layout design has been completed in the file and the corresponding gold-plated wiring layers have been preset.
[0036] Enter the corresponding command in the Allegro software command line, a file selection dialog box will pop up. Browse to the above script file save path, select the script file and execute it.
[0037] The software automatically reads all instructions from the script file and executes them sequentially, drawing all gold-plated leads in batches according to preset parameters such as vertex coordinates, line width, and layers. Upon completion, the software's graphical interface displays that all gold-plated leads accurately connect to the gold-plated areas and the main leads, with no overlaps or gap violations.
[0038] When the chip pad layout or gold finger position changes, there is no need to rewrite the program or script. Simply modify the corresponding bonding wire start point coordinates, bonding wire end point coordinates and other related data in the Excel data input template, and then repeat the steps S2 to S6 above to quickly generate a new Allegro script and complete the rerouting, which greatly improves design and maintenance efficiency.
[0039] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or basic characteristics. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within the present invention.
[0040] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
Claims
1. A method for automatic wiring of gold-plated leads on a DRAM packaging substrate, characterized in that: The methods and steps include the following: S1: Structured data input. Construct a standardized Excel template as the input interface. Input the network name of the gold-plated area, the starting point (X1, Y1) of the bonding line, the ending point (X2, Y2) of the bonding line, the slot width, and the gold-plated lead width information in the specified worksheet area. S2: Intelligent coordinate calculation. The VBA program calculates the bond wire angle based on the start and end points of the bond wire input in S1. The gold-plated lead maintains the same angle as the bond wire within a range of 100um±10um at the edge of the slot. Combined with the slot width information input in S1, the distance from the inflection point of the gold-plated lead to the main lead is calculated to obtain the accurate routing path and vertex coordinate sequence of the gold-plated lead. S3: Network screening and deduplication. The VBA program automatically analyzes the connection relationship between the network and the bond line in the gold-plated area, identifies and filters out duplicate networks from the network name information input in S1, and performs deduplication to retain unique network connections. S4: Generate a wiring instruction set, bind the cleaned network connection relationship in S3 with the geometric coordinates calculated in S2, and form an intermediate data file to be converted into a script; S5: Automatic script generation. The intermediate data file generated by S4 is written into a complete Allegro script file according to the syntax rules of the Allegro script language, which includes creating line segments, setting line segment widths, and placing line segments to the specified routing layer. S6: Automated execution and graphics generation. Open the package substrate file to be designed in Allegro software, call the script file generated by S5, and the software automatically reads and executes the commands to draw all gold-plated leads in batches.
2. The method for automatic wiring of gold-plated leads on a DRAM packaging substrate according to claim 1, characterized in that: In S1, the specified worksheet area of the Excel template is divided into independent data input columns, which correspond to the input items of the network name of the gold-plated area, the starting point of the bonding line (X1, Y1), the ending point of the bonding line (X2, Y2), the slot width, and the width of the gold-plated lead.
3. The method for automatic wiring of gold-plated leads on a DRAM packaging substrate according to claim 1, characterized in that: In S2, the VBA program calculates the coordinate difference between the starting point (X1, Y1) and the ending point (X2, Y2) of the bond line, and then uses the arctangent function to solve for the bond line angle.
4. The method for automatic wiring of gold-plated leads on a DRAM packaging substrate according to claim 1, characterized in that: In S2, the vertex coordinate sequence of the gold-plated lead includes the coordinate data of the gold-plated area connection point, slot edge transition point, inflection point, and main lead connection point.
5. The method for automatic wiring of gold-plated leads on a DRAM packaging substrate according to claim 1, characterized in that: In S3, the VBA program establishes a network name database and iterates through and compares the input network names to identify and filter duplicate networks.
6. The method for automatic wiring of gold-plated leads on a DRAM packaging substrate according to claim 1, characterized in that: In S5, the Allegro script file also contains layer matching instructions to ensure that the gold-plated leads are placed on a preset gold-plated wiring layer.
7. The method for automatic wiring of gold-plated leads on a DRAM packaging substrate according to claim 1, characterized in that: In step S6, the script file automatically checks whether the lead spacing conforms to the design rules during execution. If there is a spacing violation, an error message is generated.