Conductive damper preparation method and loudspeaker structure

Abstract

The invention discloses a preparation method of a conductive damper and a loudspeaker structure, and relates to the technical field of loudspeakers, and the preparation method of the conductive damper specifically comprises the following steps: selecting a material with a preset ratio, and preparing a conductive colloid; processing the damper base material to form a preprocessed damper; curing a conductive colloid on the pretreated damper to form a conductive damper; the loudspeaker comprises a conductive damper, a magnetic conductive structure, a frame and a voice coil structure, and a magnetic gap is formed in the inner side of the magnetic conductive structure; the basin stand is arranged on the magnetic conductive structure, a conductive connecting part is arranged on the basin stand, and a vibrating diaphragm structure is arranged at the opening end of the basin stand; the voice coil structure is connected to the diaphragm structure, and one end of the voice coil structure is at least partially located in the magnetic gap; the conductive damper is arranged on the basin frame and is connected to the voice coil structure and the conductive connecting part so as to be used for electric conduction of the voice coil structure and the conductive connecting part.

Description

Technical Field

[0001] This invention relates to the field of loudspeaker technology, and in particular to a method for preparing a conductive spider and a loudspeaker structure. Background Technology

[0002] The electrical connection between the damper and voice coil in traditional loudspeakers is typically made by soldering nylon wire (such as silver-plated copper wire). However, this traditional connection method has poor mechanical reliability, and the nylon wire is prone to fatigue and breakage under long-term vibration, affecting the speaker's lifespan. Furthermore, the actual assembly process is also relatively complex, requiring soldering or riveting, which increases manufacturing costs and can easily lead to unstable contact resistance due to poor soldering. Summary of the Invention

[0003] The main objective of this invention is to propose a method for preparing a conductive spider and a loudspeaker structure, aiming to solve the problems of poor reliability and complex assembly process of the electrical connection between the traditional loudspeaker spider and voice coil.

[0004] To achieve the above objectives, the present invention proposes a method for preparing conductive elastic waves, which specifically includes the following steps:

[0005] Select materials with a predetermined ratio to prepare a conductive colloid; The spar substrate is treated to form a pretreated spar; The conductive colloid is cured on the pretreated spherical wave to form a conductive spherical wave.

[0006] The present invention also proposes a loudspeaker structure, the loudspeaker structure comprising: A magnetically conductive structure with a magnetic gap formed on its inner side; A basin frame is disposed on the magnetic conductive structure, the basin frame is provided with a conductive connection part, and the open end of the basin frame is provided with a diaphragm structure; A voice coil structure connected to the diaphragm structure, wherein at least one end of the voice coil structure is located within the magnetic gap; and, A conductive spring wave, prepared by the method described in the embodiment, is disposed on the frame and connected to the voice coil structure and the conductive connection portion for electrical conduction between the voice coil structure and the conductive connection portion. Attached Figure Description

[0007] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0008] Figure 1 A flowchart illustrating an embodiment of the method for preparing a conductive elastic wave provided by the present invention; Figure 2 for Figure 1 A flowchart of one embodiment of "processing the spar substrate to form a pre-treated spar"; Figure 3 for Figure 2 A flowchart of one embodiment of "curing the conductive colloid on the pretreated spar" in the examples; Figure 4 for Figure 1 A flowchart of one embodiment of "processing the spar substrate to form a pre-treated spar" in another embodiment; Figure 5 for Figure 4 A flowchart of one embodiment of "curing the conductive colloid on the pretreated spar" in the examples; Figure 6 for Figure 5 A schematic diagram of a process between "placing the pretreated elastic wave in a negative pressure environment and allowing it to stand" and "heating and curing the conductive elastic wave substrate" in the embodiment; Figure 7 for Figure 5 A flowchart of one embodiment of "heat curing the conductive elastic wave substrate" in the embodiments; Figure 8 For corresponding Figure 2 A schematic diagram of the conductive elastic wave structure in the Chinese embodiment; Figure 9 For including Figure 8 A schematic diagram of a loudspeaker structure with a conductive spinner. Figure 10 For including Figure 4 A schematic diagram of the loudspeaker structure of the conductive spinner in the Chinese embodiment.

[0009] Explanation of reference numerals in the attached figures: 100. Loudspeaker structure; 1. Magnetic structure; 11. U-shaped iron; 12. Washer; 13. Main magnet; 14. Secondary magnet; 2. Magnetic gap; 3. Bass; 31. Conductive connection; 32. Diaphragm structure; 4. Voice coil structure; 5. Conductive spider; 6. Conductive colloid.

[0010] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0011] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0012] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0013] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0014] The electrical connection between the damper and voice coil in traditional loudspeakers is typically made by soldering nylon wire (such as silver-plated copper wire). However, this traditional connection method has poor mechanical reliability, and the nylon wire is prone to fatigue and breakage under long-term vibration, affecting the speaker's lifespan. Furthermore, the actual assembly process is also relatively complex, requiring soldering or riveting, which increases manufacturing costs and can easily lead to unstable contact resistance due to poor soldering.

[0015] This invention proposes a method for preparing a conductive elastic wave 5.

[0016] Please see Figure 1 In one embodiment of the present invention, the method for preparing the conductive elastic wave 5 includes the following steps; Conductive colloid 6 was prepared by selecting materials with a preset ratio; In this embodiment, unlike conventional wire connection structures, the conductive colloid 6 material is used to directly form an electrically conductive structure on a conventional spinner structure. This conductive structure is then connected to the terminal structure on the voice coil wire frame 3 to achieve electrical connection. This structural design requires the conductive colloid 6 to have excellent electrical conductivity; therefore, the formulation of the conductive colloid 6 needs to be optimized. Specifically, a highly conductive and highly elastic conductive colloid material needs to be selected to ensure low resistance and long-term vibration stability.

[0017] The spar substrate is treated to form a pretreated spar; To ensure effective bonding between the conductive colloid 6 and the elastomeric substrate, the substrate needs to be pretreated before attaching the conductive colloid 6. This pretreatment enhances the bonding performance between the substrate and the conductive colloid 6. Specific pretreatment methods include, but are not limited to, roughening the surface of the substrate. Roughening increases the surface roughness of the substrate, thereby increasing the contact area between the conductive colloid 6 and the substrate, resulting in a stronger bond. Besides surface roughening, the substrate can also be chemically treated, for example, by activating its surface with specific chemical reagents to alter its chemical properties and improve its affinity with the conductive colloid 6. Alternatively, plasma treatment can be used, where high-energy plasma particles bombard the surface of the substrate to remove contaminants and impurities, while simultaneously generating active groups that further enhance the bonding force with the conductive colloid 6. After pretreatment, the conductive colloid 6 can be better integrated with the conductive colloid 6 when it is subsequently attached, forming a stable and reliable electrical conduction structure. This effectively avoids problems such as decreased conductivity or loose structure caused by loose bonding, and further improves the overall performance and stability of the conductive colloid 5.

[0018] After the slab substrate is processed, the conductive colloid 6 needs to be cured on the pre-treated slab to form a conductive slab 5. The conductive colloid 6 itself has a certain degree of adhesion, and after the above pretreatment, the bonding ability between the elastic substrate and the conductive colloid 6 is significantly improved. After the conductive colloid 6 is attached to the elastic substrate, it needs to be cured to form a tight integrated structure between the conductive colloid 6 and the pretreated elastic substrate.

[0019] The pre-treated spider 5, incorporating the conductive colloid 6, possesses electrical conductivity. When the conductive spider 5 is actually installed on the speaker structure 100, it is mounted on the frame 3 and fixed with adhesive. The conductive spider 5 can directly connect to the voice coil wire and external conductive terminals. This conductive structure effectively replaces the traditional cotton wire connection method, especially in high-frequency vibration scenarios like loudspeakers. It effectively avoids the problem of cotton wire fatigue and breakage under long-term vibration, which affects the speaker's lifespan. Furthermore, reducing the number of cotton wire components reduces the distance between the spider and the diaphragm, allowing for a thinner speaker and facilitating the development of a lighter and thinner speaker structure 100. In addition, in terms of assembly, the integrated conductive spider 5 can quickly establish conductivity with the voice coil and terminals through adhesive application. Compared to traditional cotton wire welding, this method is more convenient, simplifies the assembly process, reduces manufacturing difficulty, and has excellent application prospects.

[0020] In one embodiment, such as Figure 1 , Figure 2 and Figure 3 As shown, attaching the conductive colloid 6 to the pretreated bouncy wave allows it to adhere directly to the pretreated bouncy wave in a near-solid state, forming an external conductive structure on the surface of the pretreated bouncy wave. In this state, in addition to excellent conductivity, the conductive colloid 6 also needs to have poor flowability, maintaining a good solid state on the surface of the pretreated bouncy wave, and possess good adhesive ability to form a good fixed connection on the pretreated bouncy wave. The specific structure can be found in [reference needed]. Figure 3 .

[0021] In this embodiment, the conductive colloid 6 comprises the following components by weight: 50-70 parts of matrix resin, 20-40 parts of conductive filler, 5-10 parts of carbon microtubes or graphene, and 1-3 parts of leveling agent or curing agent.

[0022] In the above component configuration, the matrix resin comprises 50-70 parts. The relatively high content of the matrix resin is primarily to ensure good elasticity and adhesion of the entire conductive colloid 6, and to a certain extent, reduces its fluidity, thus ensuring a stable morphology on the pretreated elastomeric surface. The matrix resin includes, but is not limited to, flexible epoxy or silicone. The conductive filler in the components is the basis for the high conductivity of the conductive colloid 6. It is typically composed of metal powder, specifically including, but not limited to, micron-sized silver particles or silver-copper composites. The conductive filler is uniformly distributed in the matrix resin to give the resin material excellent conductivity. The filler also contains 5-10 parts of carbon microtubes or graphene material, whose main function is to enhance the stability of the conductive network within the matrix resin.

[0023] The carbon microtubes and graphene possess excellent electrical and mechanical properties. The unique tubular structure of the carbon microtubes endows them with good electron transport capabilities, enabling them to form highly efficient conductive channels within the matrix resin. Graphene, with its ultra-high conductivity and large specific surface area, significantly increases the number of conductive contact points after dispersion in the matrix resin, further enhancing the stability of the conductive network. This stability is reflected not only in maintaining good conductivity under normal operating conditions but also in the absence of significant fluctuations in conductivity when exposed to changes in the external environment, such as temperature and humidity variations.

[0024] Meanwhile, the addition of 5 to 10 parts by mass of the carbon microtubes and graphene was precisely calculated. If the addition amount is too small, a sufficiently dense and stable conductive network cannot be formed, resulting in limited improvement in the conductivity of the conductive colloid 6; while if the addition amount is too large, it will increase costs and may affect the original properties of the matrix resin, such as reducing elasticity and adhesion, or adversely changing the flowability of the conductive colloid 6, making it difficult to maintain a stable solid state on the pretreated elastomeric surface.

[0025] The leveling agent or curing agent, in parts by weight of 1 to 3, can improve the coating process of the conductive colloid 6 to a certain extent.

[0026] The leveling agent effectively reduces the surface tension of the conductive colloid 6, allowing it to spread better on the pretreated wave surface and reducing defects such as pinholes and orange peel caused by surface tension differences, further improving the smoothness and uniformity of the coating. The curing agent, in addition to accelerating the curing process, also regulates the viscosity of the colloid during the coating process. With an appropriate amount of curing agent, the viscosity of the conductive colloid 6 remains relatively stable during coating, neither too thin to cause dripping nor too viscous to make coating difficult. This allows operators to more easily control the coating thickness and range in actual production, improving production efficiency and product quality. Furthermore, the conductive colloid 6, using appropriate amounts of the leveling agent and curing agent, reaches a state ready for further processing more quickly after coating, shortening the entire production cycle and facilitating large-scale industrial production. Simultaneously, the improved coating process also helps to enhance the adhesion between the conductive colloid 6 and the pretreated wave surface, making the conductive wave 5 more stable and reliable during long-term use, reducing the probability of performance degradation and malfunctions due to poor coating.

[0027] In the above-described embodiment of the externally applied conductive colloid 6, the above formulation enables the conductive colloid 6 to possess the following performance effects. Specifically, the volume resistivity of the conductive colloid 6 is less than 10⁻⁶. -3 The conductive colloid 6 has a tensile strength greater than 15 MPa, an elongation at break greater than 100%, and a viscosity greater than 10000 cP (high viscosity, anti-flow).

[0028] The aforementioned performance effects enable the conductive colloid 6 in the above embodiments to be externally attached to the outer surface of the treated spindle, thereby forming a conductive spindle structure with excellent conductivity and a long service life.

[0029] like Figure 1 , Figure 2 and Figure 3 As shown, when the conductive colloid 6 is applied externally, the slicker substrate needs to be pretreated before the conductive colloid 6 is attached to the pretreated slicker to improve the bonding performance between the two. Specifically, the requirement to "treat the slicker substrate to form a pretreated slicker" includes the following embodiment: First, the elastic substrate needs to be hot-pressed to form a molded elastic wave. The hot pressing process allows the elastic substrate to form a stable wavy extension structure. Then, the surface of the molded elastic wave needs to be roughened to form a pre-treated elastic wave.

[0030] Roughening treatment increases the surface roughness of the molded wave spring, thereby increasing its contact area with the conductive colloid 6. This allows the conductive colloid 6 to better bond with the pretreated wave spring surface during adhesion, improving the bonding force and stability between the two. Specific methods for roughening the molded wave spring include, but are not limited to, plasma cleaning or chemical treatment. During plasma cleaning, high-energy particles in the plasma collide with the surface of the molded wave spring, breaking the molecular bonds and removing impurities such as organic matter and oxides. Simultaneously, the plasma forms microscopic uneven structures on the surface of the molded wave spring, further increasing surface roughness and facilitating the adhesion of the conductive colloid 6. This method has advantages such as good treatment effect, minimal damage to the molded wave spring, and environmental friendliness. Chemical treatment involves treating the surface of the molded wave spring with specific chemical reagents. These reagents can react chemically with the material of the molded wave spring surface, changing the surface's chemical properties and microstructure, thereby achieving the purpose of surface roughening. For example, certain acidic or alkaline solutions can corrode the surface of the molded wave spring, forming tiny pits and protrusions. The advantages of chemical treatment are that it is relatively simple to operate and low in cost, but it requires the selection of appropriate chemical reagents and treatment conditions to avoid excessive corrosion or other adverse effects on the molded elastic wave.

[0031] In practical applications, a suitable roughening treatment method can be selected based on factors such as the material properties, production process requirements, and cost of the molded elastic wave. Sometimes, two methods can be combined to achieve a better roughening effect, further improving the bonding performance between the conductive colloid 6 and the pretreated elastic wave, thereby ensuring that the conductive elastic wave structure has excellent conductivity and a long service life.

[0032] To further ensure the adhesion and fixation effect of the conductive colloid 6 on the pretreated wavelet, in this embodiment, a gradient curing method is used to cure the conductive colloid 6 on the pretreated wavelet. Specifically, in some embodiments, curing the conductive colloid 6 on the pretreated wavelet includes: Pre-curing is performed at a first preset temperature and a first preset time. Specifically, the pre-curing temperature is set between 45°C and 50°C, and the pre-curing time is controlled between 8 minutes and 12 minutes. Pre-curing can be performed using a resistance heating box to initially cure the conductive colloid 6 through thermal radiation, so that the conductive colloid 6 can have a stable adhesive foundation on the pretreated elastic surface.

[0033] After the first stage of fixation is completed, the pre-cured material needs to undergo a second curing process. Specifically, final curing is required at a second preset temperature and for a second preset time. For the second stage of curing, UV curing (mainly for light-curing conductive adhesives) can be used, with the curing time controlled at approximately 10 hours to ensure the adhesion of the conductive adhesive 6 to the pre-treated elastic wave.

[0034] The multi-stage curing method described above effectively improves the bonding strength between the conductive colloid 6 and the pretreated elastic wave.

[0035] Furthermore, this improved bonding strength brings several benefits. In practical applications, such as in loudspeaker equipment where the performance of the conductive spider 5 is extremely demanding, a stable and high-strength bond ensures that the conductive colloid 6 will not detach or loosen under prolonged high-frequency vibration. This allows the conductive spider 5 to continuously and stably perform its conductive properties, thereby improving the overall stability and reliability of the loudspeaker.

[0036] From an acoustic perspective, because the conductive colloid 6 is tightly bonded to the pre-treated spider, no noise or interference signals will be generated due to relative displacement between the two. This helps to reproduce a purer and more realistic sound, improving the speaker's sound quality. This high-strength bond also offers better adaptability under different environmental conditions. Whether in complex environments such as high temperature, low temperature, or humidity, the connection between the conductive colloid 6 and the pre-treated spider remains stable, providing stable electrical and mechanical performance support for the speaker, extending its lifespan, and reducing equipment failures and maintenance costs caused by bonding issues with the conductive colloid 6.

[0037] In another embodiment, such as Figure 1 , Figure 4 and Figure 5 As shown, a conductive colloid 6 with good flowability can be prepared and coated onto a pretreated slab, allowing the conductive colloid 6 to penetrate the pretreated slab, thereby forming a permeable conductive slab structure.

[0038] In this embodiment, the conductive colloid 6 to be prepared not only has good conductivity, but also good fluidity, so that it can be uniformly attached to the pretreated slab, and even penetrate into the pretreated slab, thereby forming the above-mentioned permeable point slab structure together with the pretreated slab.

[0039] To meet the requirements of the above embodiments, in some embodiments, the conductive colloid 6 comprises the following components by weight: 40-50 parts of matrix resin, 50-60 parts of conductive filler, 5-10 parts of carbon microtubes and / or graphene, 1-3 parts of wetting agent, and 0.3-0.7 parts of penetrant.

[0040] In the above embodiments, the matrix resin comprises 40-50 parts by mass, and the matrix resin includes either low-molecular-weight epoxy resin or polyurethane. This selection ensures that the conductive colloid 6 has good mechanical properties and adhesion after curing. The conductive filler comprises 50-60 parts by mass, and can be a metal powder with good conductivity, such as nano-silver particles or silver-copper composite materials, to provide the main conductive pathways for the conductive colloid 6. The addition of carbon microtubes and / or graphene, comprising 5-10 parts by mass, can significantly improve the conductivity and thermal stability of the conductive colloid 6, while enhancing its interfacial bonding with the matrix resin. The wetting agent comprises 1-3 parts by mass, and the wetting agent includes fluorinated surfactants, which reduce the surface tension of the conductive colloid 6, allowing it to better wet the surface of the pretreated elastic wave and improve the adhesion effect. The penetrant comprises 0.3-0.7 parts by mass, which can promote the penetration of the conductive colloid 6 into the interior of the pretreated elastic wave, forming a more robust penetrating bonding structure.

[0041] The conductive colloid 6 formed by the above ratio has good fluidity. During the coating process, it can uniformly cover the surface of the elastomeric structure, and the mass fraction of conductive filler is relatively high, so that the entire conductive colloid 6 has excellent conductivity.

[0042] Among the specific parameters, the conductive colloid 6 prepared in the above-mentioned mass fractions exhibits the following excellent properties. Specifically, the cured resistivity of the conductive colloid 6 is 2.7 × 10⁻⁶. -4 The conductive colloid 6 has a tensile strength greater than 10 MPa, an elongation at break greater than 80%, and a viscosity less than 3500 cP (low viscosity facilitates capillary penetration). These properties allow the conductive colloid 6 to penetrate into the pores of the elastomeric structure, thereby forming a more stable integrated conductive elastomeric structure.

[0043] In some embodiments, the processing of the spar substrate to form a pretreated spar includes: Clean the spar substrate; In practice, the elastomeric substrate can be cleaned using plasma cleaning. Specifically, the output power of the cleaning equipment should be no less than 50W, and the cleaning time should be no less than 5 minutes. Besides plasma cleaning, the elastomeric substrate can also be treated using ozone cleaning.

[0044] During ozone cleaning, the slab substrate is placed in an ozone-filled environment, with the ozone concentration maintained at a certain level. The cleaning time is no less than 8 minutes to ensure that dirt and impurities on the surface of the slab substrate are effectively removed. These two cleaning methods significantly improve the surface cleanliness of the slab substrate, providing a good foundation for the subsequent coating and penetration of the conductive colloid 6, thereby enhancing the overall performance and quality of the conductive slab 5.

[0045] Micropore activation is performed on the cleaned spar substrate to form a high-porosity spar substrate structure; Specifically, the micropores of the elastomeric substrate can be activated using a certain mass fraction of alkaline solution. For example, the elastomeric substrate can be immersed in 5% NaOH (sodium hydroxide) for 30 seconds, followed by rinsing with deionized water to remove residual chemical solution from its outer surface. This treatment effectively expands the locating gaps of the elastomeric substrate (increasing porosity by 5-10%), promoting adhesive penetration.

[0046] Simultaneously, the surface energy of the microporous activated elastic substrate is significantly improved, which facilitates better adhesion of the conductive colloid 6 and enhances the conductivity of the conductive elastic wave 5. Moreover, this treatment method is relatively simple to operate, low in cost, and highly feasible for large-scale production. The elastic substrate after microporous activation treatment lays a solid foundation for the subsequent preparation of the high-performance conductive elastic wave 5.

[0047] The high-porosity elastomeric substrate structure is fixed and corrected to form a pretreated elastomeric structure; Because the elastomeric substrate itself is relatively thin, it is prone to deformation after the above treatment. Therefore, it needs to be corrected after cleaning and microporous activation. Specifically, a vacuum adsorption platform is generally used to adsorb and shape it under negative pressure to prevent deformation and ensure that the conductive colloid 6 can be uniformly penetrated onto the pretreated elastomeric substrate.

[0048] In some embodiments, such as Figure 4 , Figure 5 and Figure 6 As shown, curing the conductive colloid 6 on the pretreated slab includes: The conductive colloid 6 is coated onto the pretreated slab to form a pretreated slab with adhesive. The pretreated elastic wave has a large fiber gap. When combined with the conductive colloid 6 prepared in the above proportion, the conductive colloid 6 can be uniformly penetrated on the pretreated elastic wave, thereby forming a pretreated elastic wave with adhesive.

[0049] The formation of the pre-treated elastomeric material results in a tighter bond between the conductive colloid 6 and the elastomeric substrate, effectively improving the stability and reliability of conductivity. Furthermore, this uniform penetration method prevents the conductive colloid 6 from accumulating in certain areas, reducing safety hazards such as localized overheating caused by uneven conductivity.

[0050] The pre-treated elastic wave with adhesive is placed in a negative pressure environment and left to stand to form a conductive elastic wave substrate. To ensure the effective penetration of the conductive colloid 6 into the pretreated spherical structure, a vacuum device is preferably used to assist the penetration process. Specifically, a vacuum level of -0.08 MPa is set because the viscosity of the conductive colloid 6 is less than 3500 cP, and the penetration time is set to 30-60 seconds. The negative pressure environment helps to form a highly conductive and precise spherical structure (porosity less than 80%).

[0051] After treating the pre-treated elastic wave in a negative pressure environment, the surface tension of the adhesive needs to be monitored simultaneously. When the adhesive tension is less than 30mN / m, continue to allow it to stand and penetrate (takes 5~10 minutes).

[0052] The conductive elastic wave substrate is heated and cured; like Figure 5 , Figure 6 and Figure 7 As shown, after the conductive colloid 6 completes the above-mentioned penetration process, the pre-treated elastic wave needs to be cured. Specifically, to ensure the bonding and conductivity of the cured conductive colloid 6, a stepped curing method is preferred. This involves first setting multiple gradient curing parameters for the curing equipment; these gradient curing parameters include a first curing parameter and a second curing parameter. The equipment is first controlled to operate with the first curing parameters to pre-cur the conductive elastic wave substrate; Firstly, UV curing can be used to pre-cure the pre-treated elastic band with adhesive, so that the conductive colloid 6 initially fixes the shape of the adhesive and avoids uncontrolled flow of the conductive colloid 6 when the pre-treated elastic band with adhesive is hot-pressed later. The UV curing parameters are controlled between 200 mJ / cm² and 300 mJ / cm².

[0053] After the pre-curing is completed, the curing equipment needs to be switched to the second curing parameter and the pre-cured conductive elastic substrate needs to be cured a second time.

[0054] The secondary curing process employs a thermosetting method, where the conductive colloid 6 is fully cured by heating, ensuring good bonding and conductivity. The thermosetting is controlled at 60℃ for 5 minutes (epoxy system), and the curing time is controlled until the resistivity drops to 50% of its initial value.

[0055] The multi-stage curing method described above can significantly improve the curing quality of the conductive elastic wave 5. It not only effectively avoids the problem of uncontrolled flow of the conductive colloid 6 in subsequent processing, but also greatly enhances the bonding strength between the conductive elastic wave substrate and the conductive colloid 6. At the same time, it ensures the stability and reliability of the conductivity, providing a strong guarantee for the performance improvement of electronic products such as loudspeakers.

[0056] The conductive elastic wave substrate, after being heated and cured, is hot-pressed to form a conductive elastic wave 5.

[0057] The aforementioned pre-treated elastic wave is an integrated planar conductive structure. In practical applications, it also needs to be hot-pressed to form a stable wave-shaped structure. Specifically, the actual molding temperature of the hot-pressing equipment is 118℃ to 122℃, the pressure during hot-pressing is controlled at 0.55MPa to 0.65MPa, and the hot-pressing time is 30s to 60s.

[0058] By precisely controlling the temperature, pressure, and time parameters of hot pressing, a uniform and stable wave-shaped structure can be formed in the conductive elastic wave 5. This structure not only effectively disperses vibration energy but also enhances the mechanical strength of the elastic wave while maintaining its conductivity. Actual tests show that the conductive elastic wave 5 formed using this parameter range exhibits excellent performance at 10... 7 The rate of change in resistance after one vibration cycle is ≤5%.

[0059] In the above embodiments, the conductive spring wave 5 is an integral, penetrating spring wave structure. After assembly, it can directly connect to the voice coil and external terminals. However, since the entire conductive spring wave 5 is located in a high-frequency vibration environment, to ensure the conductive connection between the conductive spring wave 5 and the corresponding conductive structure, in some embodiments, after placing the pre-treated spring wave with adhesive in a negative pressure environment for static placement, and before heating and curing the conductive spring wave substrate, the method further includes: applying adhesive to the conductive contact area on the conductive spring wave substrate using high pressure.

[0060] After the conductive colloid 6 with good flowability is coated onto the pretreated bobbin 5, more colloid can be injected into the conductive contact area of ​​the conductive bobbin 5. Specifically, a high-pressure nitrogen environment can be provided, and a dispensing device can be used to replenish the amount of colloid. For example, 0.2 MPa nitrogen pressure can be used in conjunction with a microneedle array (50 μm needle diameter) to locally inject colloid at the conductive contact position, thereby maximizing the conductivity stability of the entire conductive bobbin 5.

[0061] The present invention also proposes a speaker structure 100, please refer to [reference needed]. Figures 8 to 9 The loudspeaker structure 100 includes a conductive spring 5 prepared by the method described above. The specific structure of the method for preparing the conductive spring 5 is as described in the above embodiments. Since the loudspeaker structure 100 adopts all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated further here. The loudspeaker structure 100 also includes a magnetically conductive structure 1, a frame 3, and a voice coil structure 4. The magnetically conductive structure 1 has a magnetic gap 2 formed on its inner side; the frame 3 is disposed on the magnetically conductive structure 1, and a conductive connection portion 31 is provided on the frame 3, with a diaphragm structure 32 provided on the open end of the frame 3; the voice coil structure 4 is connected to the diaphragm structure 32, and at least one end of the voice coil structure 4 is located within the magnetic gap 2; the conductive spring 5 is disposed on the frame 3 and connected to the voice coil structure 4 and the conductive connection portion 31 for electrical conduction between the voice coil structure 4 and the conductive connection portion 31.

[0062] like Figure 3 As shown, in the actual structure, the aforementioned conductive spring wave 5 can directly replace traditional cotton thread welding. During installation, the assembled magnetic circuit frame 3 is placed on a glue applicator, and water-based / oil-based / UV adhesive is applied to the frame 3. The spring wave is then placed on the frame 3 and installed. The connection between the voice coil structure 4 and the conductive connection part 31 (i.e., the terminal) is achieved by applying conductive adhesive through dotting or spraying, ensuring low-resistance contact between the conductive coating on the conductive spring wave 5 and the voice coil structure 4 and the terminal. When the terminal is energized, the voice coil structure 4 is energized through the conductive spring wave 5. The energized voice coil structure 4 interacts with the magnetically conductive structure 1, causing vibration in the magnetic gap 2, which in turn drives the diaphragm structure 32 to vibrate and produce sound.

[0063] This method of directly connecting the terminals and the voice coil structure 4 via the conductive spring wave 5 can not only effectively improve the service life of the entire speaker structure 100, but also optimize the speaker space and simplify the actual production process.

[0064] The magnetically conductive structure 1 mainly includes a U-shaped iron 11, a washer 12, a main magnet 13, and a secondary magnet 14. An installation space is formed within the U-shaped iron 11, and the main magnet 13, washer 12, and secondary magnet 14 are arranged sequentially from the bottom upwards within the installation space. The main magnet 13, washer 12, and secondary magnet 14 form an inner magnetically conductive structure 1, and a magnetic gap 2 is formed between the inner wall of the U-shaped iron 11 and the inner magnetically conductive structure 1.

[0065] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A method for preparing a conductive elastic wave, characterized in that, include: Select materials with a predetermined ratio to prepare a conductive colloid; The spar substrate is treated to form a pretreated spar; The conductive colloid is cured on the pretreated spherical wave to form a conductive spherical wave.

2. The method for preparing a conductive elastic wave as described in claim 1, characterized in that, The conductive colloid comprises, by weight, the following components: 50-70 parts of matrix resin, 20-40 parts of conductive filler, 5-10 parts of carbon microtubes or graphene, and 1-3 parts of leveling agent or curing agent.

3. The method for preparing a conductive elastic wave as described in claim 2, characterized in that, The matrix resin includes flexible epoxy or silicone; and / or... The conductive filler includes micron-sized silver particles or a silver-copper composite.

4. The method for preparing a conductive elastic wave as described in claim 2, characterized in that, The process of treating the spar substrate to form a pretreated spar includes: The elastic substrate is hot-pressed to form a molded elastic wave; The surface of the shaped elastic wave is roughened to form a pre-treated elastic wave.

5. The method for preparing a conductive elastic wave as described in claim 4, characterized in that, Curing the conductive colloid on the pretreated slab includes: Pre-curing is performed at a first preset temperature and a first preset time. Final curing is performed at the second preset temperature and for the second preset time.

6. The method for preparing a conductive elastic wave as described in claim 1, characterized in that, The conductive colloid comprises the following components by weight: 40-50 parts of matrix resin, 50-60 parts of conductive filler, 5-10 parts of carbon microtubes and / or graphene, 1-3 parts of wetting agent, and 0.3-0.7 parts of penetrant.

7. The method for preparing a conductive elastic wave as described in claim 6, characterized in that, The matrix resin includes low molecular weight epoxy resin or polyurethane; and / or, The conductive filler comprises silver nanoparticles or a silver-copper composite; and / or, The wetting agent includes fluorinated surfactants.

8. The method for preparing a conductive elastic wave as described in claim 6, characterized in that, The process of treating the spar substrate to form a pretreated spar includes: Clean the spar substrate; Micropore activation is performed on the cleaned spar substrate to form a high-porosity spar substrate structure; The high-porosity elastomeric substrate structure is fixed and corrected to form a pretreated elastomeric structure.

9. The method for preparing a conductive elastic wave as described in claim 8, characterized in that, Curing the conductive colloid on the pretreated slab includes: A conductive colloid is coated onto the pretreated spool to form a pretreated spool with adhesive. The pre-treated elastic wave with adhesive is placed in a negative pressure environment and left to stand to form a conductive elastic wave substrate. The conductive elastic wave substrate is heated and cured; The conductive elastic wave substrate, after being heated and cured, is hot-pressed to form a conductive elastic wave.

10. The method for preparing a conductive elastic wave as described in claim 9, characterized in that, After the pre-treated elastic wave with adhesive is placed in a negative pressure environment and allowed to stand, and before the conductive elastic wave substrate is heated and cured, the process further includes: High voltage is used to apply adhesive to the conductive contact area on the conductive elastic substrate.

11. The method for preparing a conductive elastic wave as described in claim 9, characterized in that, The heating and curing of the conductive elastic wave substrate includes: Multiple gradient curing parameters are set for the curing equipment; wherein, the multiple gradient curing parameters include a first curing parameter and a second curing parameter; The equipment is first controlled to operate with the first curing parameters to pre-cur the conductive elastic wave substrate; The curing equipment is switched to the second curing parameter and the pre-cured conductive elastic wave substrate is subjected to a secondary curing process.

12. A loudspeaker structure, characterized in that, include: A magnetically conductive structure with a magnetic gap formed on its inner side; A basin frame is disposed on the magnetic conductive structure, the basin frame is provided with a conductive connection part, and the open end of the basin frame is provided with a diaphragm structure; A voice coil structure is connected to the diaphragm structure, and at least one end of the voice coil structure is located within the magnetic gap; as well as, A conductive spring wave, the conductive spring wave prepared by the method of preparing a conductive spring wave according to any one of claims 1-11, wherein the conductive spring wave is disposed on the frame and connected to the voice coil structure and the conductive connection portion for electrical conduction between the voice coil structure and the conductive connection portion.

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