Heat dissipation structure and plug-in box with heat dissipation structure

Abstract

The invention provides a heat dissipation structure and a plug-in box with the heat dissipation structure. The heat dissipation structure comprises a single plate, a radiator and a heat conduction material. The single board is configured to bear an electronic device; the radiator is provided with a plurality of radiating teeth, a substrate and an enclosure frame, the radiating teeth are arranged on the first side of the substrate, the enclosure frame is arranged on the second side of the substrate, and the enclosure frame is constructed to be attached to the side, bearing the electronic device, of the single board to form a sealed cavity; the enclosure frame is arranged in the sealing cavity, so that the electronic device is accommodated in the sealing cavity, and under the condition that the enclosure frame is attached to one side, bearing the electronic device, of the single plate, the outer side edge, not surrounded by the enclosure frame, of the single plate forms a guide rail edge used for enabling the single plate to be inserted into the subrack; the heat conduction material is arranged between the electronic device and the second side of the substrate so that heat generated by the electronic device can be conducted to the radiator.

Description

Technical Field

[0001] This disclosure relates to, but is not limited to, the field of communication network equipment technology, and particularly to a heat dissipation structure for a single board and a socket having a heat dissipation structure. Background Technology

[0002] With the development of 5G technology, a large number of communication devices have been deployed in various environments, often with harsh conditions. This makes the devices' resistance to corrosion a critical requirement. Especially considering installation and maintenance costs, many devices using air-cooling technology are placed in simple outdoor facilities, directly ventilated cabinets, or under eaves. Under such deployment conditions, the devices directly exchange heat with the outside air, and the fans draw dust, corrosive substances, and moisture from the outside air into the devices. Over time, these impurities accumulate on the surfaces of the electronic components, leading to corrosion and ultimately affecting the normal operation of the equipment, causing malfunctions.

[0003] In traditional modular board designs, there is usually a gap between the heatsink substrate and the board, and some areas are exposed. When the device's cooling fan operates, air flows through the heatsink fins, gaps, and exposed areas, carrying away the heat generated by the electronic components on the board. However, during the heat dissipation process, dust and moisture in the air also accumulate on the surface of the board's components. As the device continues to operate, dust accumulates, gradually increasing the corrosion of the electronic components, which may eventually lead to board failure.

[0004] In view of the above, there is an urgent need for a design solution that can effectively prevent dust and moisture from entering the board while ensuring good heat dissipation performance. Summary of the Invention

[0005] This disclosure provides a heat dissipation structure for a single board and a socket having a heat dissipation structure.

[0006] In a first aspect, embodiments of this disclosure provide a heat dissipation structure, comprising: a single board, a heat sink, and a thermally conductive material. The single board is configured to carry electronic devices; the heat sink has a plurality of heat dissipation teeth, a substrate, and a frame, the plurality of heat dissipation teeth being arranged on a first side of the substrate, and the frame being arranged on a second side of the substrate, wherein the frame is configured to fit against the side of the single board carrying the electronic devices to form a sealed cavity, such that the electronic devices are accommodated in the sealed cavity, and when the frame is fitted against the side of the single board carrying the electronic devices, the outer edge of the single board not surrounded by the frame forms a guide rail edge for inserting the single board into a socket; the thermally conductive material is disposed between the electronic devices and the second side of the substrate to conduct heat generated by the electronic devices to the heat sink.

[0007] Secondly, embodiments of the present disclosure provide a plug box, the plug box including a heat dissipation structure according to any embodiment of the present disclosure; and a guide rail groove, wherein the guide rail edge of the heat dissipation structure is configured to slide in the guide rail groove.

[0008] The heat dissipation structure according to embodiments of this disclosure effectively isolates the electronic components on the single board from dust and moisture in the external environment by completely encapsulating them within a sealed cavity formed by the heat sink frame and the single board. This significantly reduces the risk of corrosion caused by contamination, thereby improving the reliability and lifespan of the equipment. Simultaneously, the thermally conductive material disposed between the electronic components and the heat sink substrate ensures that the heat generated by the electronic components is rapidly transferred to the heat sink and dissipated through the heat dissipation fins, maintaining the operating temperature of the electronic components within a safe range and guaranteeing the system's heat dissipation efficiency. Furthermore, the single board is designed with an outer edge not enclosed by the frame as a guide rail, which not only simplifies the installation process between the single board and the enclosure but also improves insertion and removal accuracy, facilitating docking with the backplane connector of the enclosure system. Moreover, it is lighter than traditional metal guide rails. In summary, this invention provides excellent dust and corrosion protection while ensuring heat dissipation performance, significantly enhancing the stability and durability of communication equipment in harsh environments. Attached Figure Description

[0009] In the accompanying drawings of the embodiments disclosed herein:

[0010] Figure 1 This is a schematic diagram of the heat dissipation structure of a traditional plug-in enclosure;

[0011] Figure 2 This is an exploded view of the heat dissipation structure provided in an embodiment of the present disclosure;

[0012] Figure 3 A schematic diagram of a heat sink according to an embodiment of the heat dissipation structure provided in this disclosure;

[0013] Figure 4 This is a schematic diagram of the assembly state of the heat dissipation structure provided in the embodiments of this disclosure;

[0014] Figure 5 The side view of the heat dissipation structure provided in the embodiment of this disclosure shows a schematic diagram of the heat dissipation structure being inserted into the socket;

[0015] Figure 6 A schematic diagram of another heat sink for the heat dissipation structure provided in the embodiments of this disclosure; and

[0016] Figure 7 This is a schematic diagram of another heat sink provided in an embodiment of the heat dissipation structure of this disclosure. Detailed Implementation

[0017] To enable those skilled in the art to better understand the technical solutions of this disclosure, the embodiments of this disclosure will be described in detail below with reference to the accompanying drawings.

[0018] The present disclosure will be described more fully below with reference to the accompanying drawings; however, the embodiments shown may be embodied in different forms, and the present disclosure should not be construed as limited to the embodiments set forth below. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will enable those skilled in the art to fully understand the scope of the disclosure.

[0019] The accompanying drawings of the embodiments of this disclosure are provided to further illustrate the embodiments of this disclosure and form part of the specification. They are used together with the detailed embodiments to explain this disclosure and do not constitute a limitation thereof. The above and other features and advantages will become more apparent to those skilled in the art from the description of the detailed embodiments with reference to the accompanying drawings.

[0020] This disclosure may be described with reference to plan and / or cross-sectional views using the ideal schematic diagrams of this disclosure. Therefore, the example illustrations may be modified according to manufacturing techniques and / or tolerances.

[0021] Where there is no conflict, the various embodiments of this disclosure and the features thereof in the embodiments may be combined with each other.

[0022] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to limit the disclosure. The term "and / or" as used in this disclosure includes any and all combinations of one or more of the associated enumerated entries. The singular forms "a" and "the" as used in this disclosure are also intended to include the plural forms, unless the context clearly indicates otherwise. The terms "comprising," "made of," etc., as used in this disclosure specify the presence of the stated feature, integral, step, operation, element, and / or component, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof.

[0023] Unless otherwise specified, all terms used in this disclosure (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art. It will also be understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and this disclosure, and will not be interpreted as having an idealized or overly formal meaning, unless expressly so defined in this disclosure.

[0024] This disclosure is not limited to the embodiments shown in the accompanying drawings, but includes modifications to the configuration based on the manufacturing process. Therefore, the areas illustrated in the drawings are schematic, and the shapes of the areas shown illustrate specific shapes of areas of an element, but are not intended to be limiting.

[0025] In some related technologies, such as Figure 1 As shown, in the traditional single-board design of a plug-in system, there is usually a gap between the heat sink substrate 10 and the single board, and some areas are exposed. When the device's cooling fan is running, air (such as...) Figure 1 (As indicated by the middle arrow) Heat generated by the electronic components on the board is dissipated through the heat dissipation fins 20, gaps, and exposed areas of the heat sink. However, during the heat dissipation process, dust and moisture in the air also accumulate on the surface of the components on the board. As the equipment continues to operate, dust accumulates, gradually increasing the corrosion of the electronic components, which may eventually lead to board failure.

[0026] Firstly, to address the problems of traditional plug-in systems, embodiments of this disclosure provide a heat dissipation structure. For example... Figures 2 to 4 As shown, the heat dissipation structure according to an embodiment of this disclosure includes: a single board 100, a heat sink 200, and a thermally conductive material 300. The single board 100 is configured to carry an electronic device 110. The heat sink 200 has a plurality of heat dissipation teeth 210, a substrate 220, and a frame 230. The plurality of heat dissipation teeth 210 are arranged on a first side of the substrate 220, and the frame 230 is arranged on a second side of the substrate 220. The frame 230 is configured to fit against the side of the single board 100 carrying the electronic device 110 to form a sealed cavity, such that the electronic device 110 is accommodated in the sealed cavity. When the frame 230 fits against the side of the single board 100 carrying the electronic device 110, the outer edge of the single board 100 not surrounded by the frame 230 forms a guide rail edge 120 for inserting the single board into a socket. The thermally conductive material 300 is disposed between the electronic device and the second side of the substrate 100 so that the heat generated by the electronic device is conducted to the heat sink 200.

[0027] Here, "single board 100" usually refers to a printed circuit board (PCB), which is the core component of the interlocking system and carries all the necessary electronic devices, such as processors, memory and other types of integrated circuits.

[0028] The tooth height, tooth thickness, geometry, and tooth spacing of the heat dissipation fins 210 can be set and adjusted according to the specific heat dissipation requirements of the heat dissipation system. For example, increasing the tooth height can expand the heat dissipation area and improve heat dissipation efficiency; adjusting the tooth thickness and tooth spacing can optimize the airflow resistance while ensuring strength, allowing the airflow to cover the heat dissipation fin surface more evenly, thereby improving heat exchange efficiency. The geometry of the heat dissipation fins can also be optimized through computational fluid dynamics simulation analysis, enabling them to better guide airflow, reduce flow resistance, and improve heat dissipation performance. For example, in some applications, using a curved surface design or an asymmetric design can create favorable vortices around the heat dissipation fins, thereby enhancing heat exchange.

[0029] The guide rail edge 120 is an extension of the material of the single plate 100. The material of the single plate 100 has a certain rigidity and toughness, which can withstand the stress generated during insertion and removal. Considering the positioning and fixing of the guide rail edge 120 in the insertion box, positioning holes or other fixing structures can also be provided at both ends of the guide rail edge 120 to ensure the accurate position of the single plate 100 in the insertion box.

[0030] The heat dissipation structure according to embodiments of this disclosure effectively isolates the electronic components on the single board from dust and moisture in the external environment by completely encapsulating them within a sealed cavity formed by the heat sink frame and the single board. This significantly reduces the risk of corrosion caused by contamination, thereby improving the reliability and lifespan of the equipment. Simultaneously, the thermally conductive material disposed between the electronic components and the heat sink substrate ensures that the heat generated by the electronic components is rapidly transferred to the heat sink and dissipated through the heat dissipation fins, maintaining the operating temperature of the electronic components within a safe range and guaranteeing the system's heat dissipation efficiency. Furthermore, the single board is designed with an outer edge not enclosed by the frame as a guide rail, which not only simplifies the installation process between the single board and the enclosure but also improves insertion and removal accuracy, facilitating docking with the backplane connector of the enclosure system. Moreover, it is lighter than traditional metal guide rails. In summary, the heat dissipation structure according to embodiments of this disclosure provides excellent dust and corrosion protection while ensuring heat dissipation performance, significantly enhancing the stability and durability of communication equipment in harsh environments.

[0031] In some embodiments, a heat dissipation protrusion 240 for contacting the thermally conductive material is provided on the second side of the substrate. The heat dissipation protrusion 240 should be as close as possible to the heat source, such as high-power chips like CPUs and GPUs, to improve heat conduction efficiency. Precise heat source positioning and protrusion design ensure that heat can be quickly transferred from the electronic device to the heat sink. In practical applications, the position of the heat dissipation protrusion can be adjusted according to the heat flow distribution to ensure that heat is evenly distributed across the entire heat sink, avoiding the formation of localized hot spots. In the case of multiple chips or multiple heat sources, multiple heat dissipation protrusions can be designed, or the heat dissipation protrusions can be designed in segments to accommodate heat source distributions at different locations.

[0032] In some embodiments, the heat dissipation teeth 210, the heat dissipation bosses 240, and the substrate 220 can be integrally die-cast. In other embodiments, the heat dissipation teeth 210, the heat dissipation bosses 240, and the substrate 220 can also be assembled by separate welding. The electronic devices 110 on the single board 100 contact the heat dissipation bosses 240 through the thermally conductive material 300 to enhance heat conduction efficiency. It should be noted that the size and area of ​​the heat dissipation bosses are determined according to the heat dissipation requirements of the single board, and for single boards with low heat dissipation requirements, heat dissipation bosses may not be provided.

[0033] The heat sink 200 is also provided with mounting holes 250. The mounting holes 250 can mate with fasteners 400 to securely connect the heat sink 200 to the board 100. With the heat sink 200 and board 100 securely connected, the frame 230 of the heat sink 200 fits tightly against the board 100, forming a sealed cavity structure consisting of the frame 230, the substrate 220, and the board 100, encapsulating all electronic components on the board 100 within the sealed cavity. During operation of the air-cooling system, the sealed cavity design prevents airflow from directly entering the cavity, effectively preventing the intrusion of dust and moisture, and improving the board's dust and corrosion resistance.

[0034] In some embodiments, the frame 230 is attached to the side of the single panel 100 that carries the electronic device 110 by a sealing strip, thereby further enhancing the sealing and dustproof effect.

[0035] For example, sealing strips can be made of rubber or silicone with a certain amount of elastic compression. Due to unavoidable mechanical tolerances during processing and assembly, the elastic compression of the sealing strip allows it to adapt to these minute dimensional differences during installation, ensuring a tight contact between the sealing strip and the veneer and frame. In practical applications, slight displacement or deformation may occur between the veneer and frame due to factors such as temperature changes and mechanical vibration. The elastic sealing strip can fill these gaps through its own compression deformation, maintaining a good seal and preventing dust and moisture from entering the enclosed cavity.

[0036] In some embodiments, at least one heat pipe 500 is embedded in the second side of the substrate 220. It should be noted that, although... Figure 6 The image shows two heat pipes of equal length 500, but in practice, the length, number, and layout of the heat pipes can be selected and adjusted according to the heat dissipation requirements of the single board.

[0037] It should be noted that, to adapt to different heat dissipation requirements, especially when dealing with the heat dissipation problems of single-board components with high-power electronic devices, heat sinks can rapidly conduct heat by embedding heat pipes within the substrate, thereby further improving heat dissipation efficiency. As a highly efficient heat conduction device, heat pipes can accelerate the heat transfer process from electronic devices to the heat sink, maintaining a lower operating temperature even when high-power electronic devices are operating. The heat pipe design can improve heat dissipation capacity while maintaining the dustproof and corrosion-resistant effects of the sealed cavity, thus ensuring the long-term stable operation of the single-board component in complex environments.

[0038] In some embodiments, a portion of the radiator 200 is cut to form a space 270 in the plurality of heat dissipation teeth 210 of the radiator 200, and the heat dissipation structure further includes a single heat dissipation component 600 disposed within the space 270 formed after the radiator is cut.

[0039] In some embodiments, a flange edge 260 is provided between the cut portion of the radiator 200 and the space 270 formed in the plurality of heat dissipation teeth 210, the flange edge 260 being formed by the substrate 220 of the radiator 200.

[0040] In some embodiments, the individual heat dissipation component 600 is fixedly connected to the flange edge 260. It should be noted that the individual heat dissipation component 600 can be fixedly connected to the flange edge 260 by any suitable means, including but not limited to welding, bonding, fastener connection, etc., to ensure structural stability and good thermal contact.

[0041] In some embodiments, the single heat dissipation component 600 is a VC heat dissipation component or an aluminum substrate fin heat dissipation component, thereby further enhancing the heat dissipation effect.

[0042] It should be noted that, to adapt to different heat dissipation requirements, especially when dealing with the heat dissipation problems of high-density, high-power electronic devices on a single board, heat sinks can further improve heat dissipation efficiency by incorporating individual heat dissipation components. Individual heat sinks, such as VC (Vapor Chamber) heat sinks or aluminum-based finned heat sinks, can enhance heat dissipation performance through optimized heat diffusion design. The design of using individual heat sinks can improve heat dissipation capacity while maintaining the dust and corrosion protection provided by the sealed cavity, thereby ensuring the long-term stable operation of the single board in complex environments.

[0043] As mentioned above, individual heat dissipation components, such as VC heat sinks or aluminum-based finned heat sinks, enhance heat dissipation performance through optimized thermal diffusion design. Specifically, VC heat sinks utilize the principle of vapor chambers for heat dissipation. The interior of the VC heat sink is filled with a working fluid. When heat is transferred to the interior of the VC heat sink, the liquid absorbs heat and evaporates into gas. The gas rises and condenses back into liquid at the other end of the VC heat sink (the cooler area). The liquid then returns to the heat source through capillary action, completing a cycle. This process can rapidly remove a large amount of heat, making it particularly suitable for heat dissipation of high-power-density devices. Aluminum-based finned heat sinks improve heat dissipation efficiency by increasing surface area. The structure of an aluminum-based finned heat sink typically consists of a substrate and multiple fins perpendicular to the substrate. The fins increase the contact area with air, thereby improving heat exchange efficiency. Compared to other materials, aluminum-based finned heat sinks are lightweight and have good thermal conductivity, making them suitable for applications requiring weight control. Both VC heat sinks and aluminum-based finned heat sinks can work in conjunction with other parts of the heat sink (such as the substrate, frame, etc.) to form a complete heat dissipation system. In this way, the design of the single heat dissipation component not only enhances the heat dissipation effect, but also maintains the dust and corrosion resistance, ensuring the long-term stable operation of the single board under high-density, high-power electronic device conditions.

[0044] Different heat dissipation solutions can be adopted for different application scenarios. In outdoor or semi-outdoor environments, equipment may face significant temperature and humidity variations. In such cases, heat dissipation solutions with good weather resistance and dust and water resistance should be selected, such as adding sealing strips and adopting designs with high IP ratings. In relatively stable indoor environments, simple and low-cost heat sink designs can be used, but temperature fluctuations and ventilation conditions still need to be considered to ensure the long-term effectiveness of the heat sink. For cost-sensitive applications, simple heat sink designs can be chosen, such as ordinary heat sinks without heat pipes or single heat dissipation components. By optimizing the design of heat dissipation fins and protrusions, cost and heat dissipation efficiency can be balanced. In applications requiring high-performance heat dissipation, designs with embedded heat pipes or single heat dissipation components (such as VC heat sinks or aluminum substrate fin heat sinks) can be adopted. Although the cost is higher, they can provide better heat dissipation, especially for the heat dissipation needs of high-power devices. Through the above design optimization and application scenario selection guidelines, it can be ensured that the heat sink provides optimal heat dissipation efficiency under different environmental conditions, while balancing cost and performance requirements.

[0045] Secondly, embodiments of this disclosure provide a plug box, the plug box including: a heat dissipation structure of any of the above embodiments; and a guide rail groove 700, wherein the guide rail edge 120 of the heat dissipation structure is configured to slide in the guide rail groove 700.

[0046] like Figure 5 As shown, to ensure that the board 100 can be smoothly inserted into the insertion box, the board 100 according to this embodiment of the present disclosure is designed with two guide rail edges 120. These two guide rail edges 120 can cooperate with the guide rail grooves 700 of the insertion box to realize smooth insertion and removal of the board. Using the outer edge of the board 100 not surrounded by the frame 230 as the guide rail edge 120 for inserting the board into the insertion box not only improves the insertion and removal accuracy of the board 100, but also facilitates the docking between the board 100 and the back panel connector of the insertion box. Compared with traditional metal guide rail edges, using the outer edge of the board 100 not surrounded by the frame 230 as the guide rail edge has a lighter weight, which helps to reduce the weight of the entire insertion box system. This design not only simplifies the installation and removal process of the board, but also improves the system integration and ease of operation, making equipment maintenance more convenient and efficient. In addition, this design helps to optimize the spatial layout of the equipment and improve the overall performance and reliability of the equipment.

[0047] The guide rail edge 120 is an extension of the material of the single plate 100. The material of the single plate 100 has a certain rigidity and toughness, which can withstand the stress generated during insertion and removal. Considering the positioning and fixation of the guide rail edge 120 in the insertion box, positioning holes or other fixing structures can also be provided at both ends of the guide rail edge 120 to ensure the accurate position of the single plate 100 in the insertion box. A guide slope is designed at the front end of the guide rail edge 120 to facilitate the positioning of the single plate when it is inserted into the guide rail groove 700 and reduce the resistance during insertion. After the single plate 100 is inserted into the insertion box, it is fixed by a locking mechanism (such as a spring buckle or a snap fastener) to ensure that the single plate will not shift after it is inserted into place and to prevent accidental fall-off. During manufacturing, the manufacturing tolerances between the guide rail edge 120 and the guide rail groove 700 of the insertion box are strictly controlled to ensure the fitting accuracy between the guide rail edge 120 and the guide rail groove 700 of the insertion box.

[0048] This disclosure has disclosed exemplary embodiments, and although specific terminology has been used, it is for general illustrative purposes only and should not be construed as limiting. In some instances, it will be apparent to those skilled in the art that features, characteristics, and / or elements described in conjunction with particular embodiments may be used alone, or in combination with features, characteristics, and / or elements described in conjunction with other embodiments, unless otherwise expressly indicated. Therefore, those skilled in the art will understand that various changes in form and detail may be made without departing from the scope of this disclosure as set forth by the appended claims.

Claims

1. A heat dissipation structure, comprising: The single-board, heat sink, and thermally conductive material are characterized in that, The single board is configured to carry electronic devices; The heat sink has multiple heat dissipation teeth, a substrate, and a frame. The multiple heat dissipation teeth are arranged on a first side of the substrate, and the frame is arranged on a second side of the substrate. The frame is configured to fit against the side of the single board that carries electronic devices to form a sealed cavity, such that the electronic devices are housed in the sealed cavity. When the frame fits against the side of the single board that carries electronic devices, the outer edge of the single board that is not surrounded by the frame forms a guide rail edge for inserting the single board into a socket. The thermally conductive material is disposed between the electronic device and the second side of the substrate to conduct the heat generated by the electronic device to the heat sink.

2. The heat dissipation structure according to claim 1, characterized in that, The second side of the substrate is provided with a heat dissipation protrusion for contacting the thermally conductive material.

3. The heat dissipation structure according to claim 2, characterized in that, The plurality of heat dissipation teeth and the heat dissipation boss are integrally die-cast with the substrate.

4. The heat dissipation structure according to claim 1, characterized in that, At least one heat pipe is embedded in the second side of the substrate.

5. The heat dissipation structure according to claim 1, characterized in that, A portion of the radiator is cut away to create spaces within the plurality of heat dissipation fins of the radiator, and The heat dissipation structure also includes a single heat dissipation component, which is disposed within the space formed after the heat sink is cut.

6. The heat dissipation structure according to claim 5, characterized in that, A flange edge is provided between the cut portion of the radiator and the space formed in the plurality of heat dissipation teeth, the flange edge being formed by the substrate of the radiator.

7. The heat dissipation structure according to claim 6, characterized in that, The individual heat dissipation component is fixedly connected to the edge of the flange.

8. The heat dissipation structure according to any one of claims 5-7, characterized in that, The individual heat dissipation component is a VC heat dissipation component or an aluminum substrate fin heat dissipation component.

9. The heat dissipation structure according to any one of claims 1-7, characterized in that, The frame is attached to the side of the single board that carries the electronic components by a sealing strip.

10. A type of insert box, characterized in that, The insertion box includes: The heat dissipation structure according to any one of claims 1-9; and The guide rail groove, wherein the guide rail edge of the heat dissipation structure is configured to slide in the guide rail groove.

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