Miniaturized ultra-wideband frequency conversion receiving SiP module

Abstract

The invention discloses a miniaturized ultra-wideband receiving frequency conversion SiP module, which comprises a radio frequency unit, a local oscillator frequency multiplication filtering unit and a frequency conversion unit, and is characterized in that the radio frequency unit amplifies, filters and balances a received radio frequency signal; a local oscillator frequency multiplication filtering unit carries out frequency multiplication and filtering on the first local oscillator signal and then carries out frequency mixing on the first local oscillator signal and the radio frequency signal to generate a middle signal; the frequency conversion unit down-converts an intermediate signal into an intermediate frequency signal; a board-level stacking technology is adopted in the module, a bottom layer HTCC tube shell is connected with an upper layer printed board through a ball grid array, and a radio frequency amplification area is defined by an amplitude limiter, an amplifier, a numerical control attenuator, an equalizer and an amplifier of the radio frequency unit through the ball grid array. A local oscillator frequency mixing area is defined by one local oscillator frequency multiplication filtering unit through the ball grid array. The amplifier, the band-pass filter and the frequency-mixing amplification multifunctional function of the frequency conversion unit define a two-local-oscillator frequency-mixing area through a ball grid array. The receiving frequency conversion SiP module has the advantages of miniaturization, high integration level, high spurious suppression and low noise coefficient.

Description

A miniaturized ultrawideband receiver frequency conversion SiP module Technical Field

[0001] This invention belongs to the field of radar, specifically relating to a miniaturized ultra-wideband receiving frequency conversion SiP module. Background Technology

[0002] In the radar field, ultra-wideband (UWB) receiver systems serve as the core unit for battlefield electromagnetic reconnaissance, and their performance directly impacts the system's ability to intercept and analyze broadband electromagnetic signals. However, traditional discrete microwave circuit architectures are no longer adequate for the demands of modern electronic warfare systems in terms of system bandwidth, integration density, and reliability. While SiP (System-in-Package) technology can overcome physical space constraints and improve link integration density through three-dimensional heterogeneous integration, the increased integration density significantly exacerbates the problems of spurious emission reduction caused by interlayer coupling and spatial leakage. Summary of the Invention

[0003] The purpose of this invention is to provide a miniaturized ultra-wideband receiver frequency conversion SiP module, which solves the problems of large size, low integration and poor spurious suppression in traditional ultra-wideband receiver systems.

[0004] To achieve the above objectives, one aspect of the present invention provides a miniaturized ultra-wideband receiver frequency conversion SiP module, comprising a radio frequency unit, a local oscillator frequency doubling and filtering unit, and a frequency conversion unit. The radio frequency unit includes a first limiter, a first amplifier, a first digitally controlled attenuator, a first equalizer, a second amplifier, a first switching filter multifunction, and a first temperature-compensated attenuator. The local oscillator frequency doubling and filtering amplification unit includes a first mixer amplification and filtering multifunction, a second switching filter multifunction, and a frequency multiplier. The frequency conversion unit includes a third amplifier, a second bandpass filter, a mixer amplification and filtering multifunction, a first low-pass filter, a fourth amplifier, a second temperature-compensated attenuator, a second equalizer, a second digitally controlled attenuator, a first single-pole double-throw switch, a second low-pass filter, a second bandpass filter, a second single-pole double-throw switch, a fifth amplifier, and a third bandpass filter. The module internally employs a board-level stacking process, including a bottom HTCC housing and an upper printed circuit board. The first limiter, first amplifier, first digitally controlled attenuator, first equalizer, and first frequency conversion unit are described. Two amplifiers, a first temperature-compensated attenuator, a first mixer-amplifier-filter multifunction unit, a second switching-filter multifunction unit, a frequency multiplier, a third amplifier, a second bandpass filter, and a mixer-amplifier-filter multifunction unit are disposed on the bottom HTCC housing; a first switching-filter multifunction unit, a first low-pass filter, a fourth amplifier, a second temperature-compensated attenuator, a second equalizer, a second digitally controlled attenuator, a first single-pole double-throw switch, a second low-pass filter, a second bandpass filter, a second single-pole double-throw switch, a fifth amplifier, and a third bandpass filter are disposed on the upper printed circuit board; the bottom HTCC housing and the upper printed circuit board are connected by a ball grid array; a first limiter, a first amplifier, a first digitally controlled attenuator, a first equalizer, and a second amplifier are arranged in an RF amplification area by the ball grid array; a first temperature-compensated attenuator, a first mixer-amplifier-filter multifunction unit, a second switching-filter multifunction unit, and a frequency multiplier are arranged in a local oscillator mixing area by the ball grid array; a third amplifier, a second bandpass filter, and a mixer-amplifier-filter multifunction unit are arranged in a dual local oscillator mixing area by the ball grid array.

[0005] The miniaturized ultra-wideband receiver frequency conversion SiP module according to the above aspects of the present invention has the advantages of miniaturization, high integration, high spurious suppression, and low noise figure. Attached Figure Description

[0006] To more clearly illustrate the technical solution of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort: Figure 1 is a link diagram of a miniaturized ultra-wideband receiver frequency conversion SiP module according to an embodiment of the present invention; Figure 2 is a ball grid array distribution diagram of a miniaturized ultra-wideband receiver frequency conversion SiP module according to an embodiment of the present invention. Detailed Implementation

[0007] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0008] An embodiment of the present invention provides a miniaturized ultra-wideband receiver frequency conversion SiP module, as shown in Figure 1. The miniaturized ultra-wideband receiver frequency conversion SiP module of this embodiment includes a radio frequency (RF) unit, a local oscillator frequency doubling and filtering unit, and a frequency conversion unit. The RF unit is used to amplify, filter, and equalize the received 0.8-18 GHz RF signal; the local oscillator frequency doubling and filtering unit is used to multiply and filter the first local oscillator signal and then mix it with the RF signal to generate a medium frequency signal; the frequency conversion unit is used to down-convert the medium frequency signal to an intermediate frequency (IF) signal.

[0009] The radio frequency unit includes a first limiter A1, a first amplifier A2, a first digitally controlled attenuator A3, a first equalizer A4, a second amplifier A5, a first switching filter multifunction A6, and a first temperature-compensated attenuator A7.

[0010] The first limiter A1 limits the received input signal, enabling the receiving channel to handle larger input signals. The first amplifier A2 amplifies the small signals received by the channel. The first digitally controlled attenuator A3 adjusts the RF link gain by switching the attenuation amount. The first equalizer A4 adjusts the RF link flatness and reduces the power of low-frequency signals, especially 0.8-1GHz RF signals, entering the subsequent amplifier, thereby reducing the second harmonic generated by the subsequent amplifier. The second amplifier A4 further amplifies the received signal; this amplifier is a high harmonic suppression amplifier, further ensuring the second harmonic suppression of the 0.8-1GHz signal.

[0011] The first multi-function switch filter A6 consists of eight single-pole triple-throw switches and eight bandpass filters with different frequency bands. The single-pole triple-throw switches are used to switch channels to select the corresponding bandpass filter. The bandpass filter frequencies are 0.8-1.4GHz, 1.2-2.2GHz, 2-3.6GHz, 2.6-4.6GHz, 3.6-6.2GHz, 5.2-9.2GHz, 8.2-13.2GHz, and 12.2-18GHz, respectively. It is mainly used to filter out spurious signals generated in each frequency band, especially the 0.8-1.4GHz filter, which can further suppress the second harmonic of the 0.8-1GHz RF signal. The first temperature-compensated attenuator A7 is used to balance the gain of the RF link under high and low temperature operating conditions.

[0012] The primary oscillator frequency multiplier filter amplification unit includes a first mixer amplification filter multifunction A8, a second switch filter multifunction A9, and a frequency multiplier A10.

[0013] The A8 multi-functional mixer amplifier and filter includes an RF low-pass filter, a local oscillator amplifier, a mixer, and a band-pass filter. The RF low-pass filter is used to suppress spurious signals and signal harmonics above 18 GHz. The local oscillator amplifier ensures that the local oscillator signal power entering the mixer can effectively drive the mixer. The mixer is used to upconvert signals from 0.8-18 GHz to signals in the 21.5-22.5 GHz range. The band-pass filter is used to suppress spurious signals generated during the first mixing.

[0014] The second switching filter multifunction A9 consists of two single-pole double-throw switches and two filters covering the frequency band of 22.8-40GHz. It is used to filter out the fundamental and third harmonic frequencies generated by the local oscillator frequency multiplier, reducing the spurious signals generated by them. The frequency multiplier A10 is used to multiply the input local oscillator signal frequency of 11.4-20GHz to the frequency required for mixing.

[0015] The frequency converter unit includes a third amplifier A11, a second bandpass filter A12, a mixer amplifier multifunction A13, a first low-pass filter A14, a fourth amplifier A15, a second temperature-compensated attenuator A16, a second equalizer A17, a second digitally controlled attenuator A18, a first single-pole double-throw switch A19, a second low-pass filter A20, a second bandpass filter A21, a second single-pole double-throw switch A22, a fifth amplifier A23, and a third bandpass filter A24.

[0016] The third amplifier A11 amplifies the first intermediate frequency (IF) signal. The second bandpass filter A12 is a MEMS bandpass filter with advantages such as high spurious suppression and good bandpass flatness. It is mainly used to further suppress spurious signals generated in the first mixing and improve the suppression of the local oscillator frequency harmonic signal. The mixer-amplifier multifunction A13 consists of a mixer and an amplifier, used to amplify the 23.875GHz dual local oscillator signal and the second mixing of the link. The first low-pass filter A14 is used to suppress spurious signals generated in the second mixing. The fourth amplifier A15 amplifies the IF signal. The second temperature-compensated attenuator A16 is used to equalize the gain of the IF link under high and low temperature operating conditions. The second equalizer A17 is used to equalize the IF flatness. The second digitally controlled attenuator A18 is used to adjust the link gain. The first single-pole double-throw switch A19 is used to switch between IF broadband and narrowband operating modes. The second low-pass filter A20 is a filter for selecting the IF broadband mode and is used to suppress spurious signals generated in the second mixing.

[0017] The second bandpass filter A21 is a narrowband intermediate frequency (IF) mode selector used to suppress spurious signals generated during the second mixing. The second single-pole double-throw (SPDT) switch A22 is used to switch between IF wideband and narrowband operating modes. The fifth amplifier A23 is used to further amplify the IF signal. The third bandpass filter A24 is used to filter out harmonics generated by the fifth amplifier, outputting an IF signal in the range of 1.375–2.375 Hz.

[0018] The first limiter A1, first amplifier A2, first digitally controlled attenuator A3, first equalizer A4, second amplifier A5, and first temperature-compensated attenuator A7 in the RF unit; the first mixer amplifier filter multifunction A8, second switch filter multifunction A9, and frequency multiplier A10 in the local oscillator frequency doubling filter amplifier unit; and the third amplifier A11, second bandpass filter A12, and mixer amplifier multifunction A13 in the frequency conversion unit are installed in the bottom HTCC (high temperature co-fired ceramic) housing; the first switch filter multifunction A6 in the RF unit and the first low-pass filter A14, fourth amplifier A15, second temperature-compensated attenuator A16, second equalizer A17, second digitally controlled attenuator A18, first single-pole double-throw switch A19, second low-pass filter A20, second bandpass filter A21, second single-pole double-throw switch A22, fifth amplifier A23, and third bandpass filter A24 in the frequency conversion unit are installed in the upper printed circuit board (PCB).

[0019] The miniaturized ultra-wideband receiver frequency conversion SiP module of this invention employs a board-level stacking process, comprising a bottom HTCC housing and an upper printed circuit board. The HTCC housing and the printed circuit board are connected via a ball grid array to achieve three-dimensional stacking. The bottom HTCC housing receives radio frequency signals through a coaxial-microstrip line vertical transition structure and transmits signals vertically to the upper printed circuit board through the microstrip line-coaxial-microstrip line vertical transition structure. The upper printed circuit board achieves horizontal signal transmission through a microstrip line-stripline-microstrip line horizontal transition structure.

[0020] As shown in Figure 2, the first limiter A1, the first amplifier A2, the first digitally controlled attenuator A3, the first equalizer A4, and the second amplifier A5 form an RF amplification region via a ball grid array; the first temperature-compensated attenuator A7, the first mixer-amplifier-filter multifunction A8, the second switch-filter multifunction A9, and the frequency multiplier A10 form a local oscillator mixing region via a ball grid array; and the third amplifier A11, the second bandpass filter A12, and the mixer-amplifier-filter multifunction A13 form a dual local oscillator mixing region via a ball grid array. This layout can divide RF, local oscillator, first intermediate frequency, and intermediate frequency signals into different regions. The shielding function of the array solder balls improves spatial isolation, achieving a spatial isolation greater than 70 dBc, thereby improving spurious emission suppression.

[0021] When the miniaturized ultra-wideband receiver-conversion SiP module of this invention is working, the 0.8-18GHz radio frequency signal enters the bottom HTCC shell of the SiP through a coaxial-microstrip vertical transition structure. It first passes through a first limiter A1, a first amplifier A2, a first digitally controlled attenuator A3, and a first equalizer A4. This ensures that the power of the 0.8-1GHz radio frequency signal entering the second amplifier A5 is less than -22dBm, thereby ensuring that the second amplifier A5 has a harmonic suppression of greater than 45dBc for the 0.8-1GHz band. The first equalizer A4 has a relatively small high-frequency attenuation, which can reduce the impact on high-frequency noise while adjusting the attenuation of the 0.8-1GHz band. After passing through the second amplifier A5, the signal is transmitted to the upper printed circuit board through the microstrip-coaxial-microstrip vertical transition structure. After passing through the first switching filter multifunction A6, the harmonic suppression of the radio frequency link is greater than 50dBc, thereby avoiding spurious emissions due to excessive radio frequency harmonics during the first mixing. The RF signal returns to the underlying HTCC via a microstrip-quasi-coaxial-microstrip vertical transition structure. After passing through the first temperature-compensated attenuator A7, it enters the first mixer-amplifier-filter multifunction A8. The local oscillator signal is filtered by a frequency multiplier A10 and a second switching filter multifunction A9 to remove the local oscillator fundamental and third harmonics. The spurious suppression generated by the local oscillator fundamental and harmonics is greater than 50dBc. The frequency-multiplied local oscillator signal enters the first mixer-amplifier-filter multifunction A8 and mixes with the RF signal to generate a secondary signal. This secondary signal enters the microstrip-strip-microstrip horizontal transition structure and passes through the third amplifier A11 and the second bandpass filter A12. The two-stage filtering effectively suppresses out-of-band spuriouss and local oscillator leakage. The intermediate frequency (IF) signal then enters the mixing and amplification multifunction A13, where it is mixed with the two local oscillator signals to generate an IF signal. The IF signal is then transmitted to the upper printed circuit board through the microstrip-quasi-coaxial vertical transition structure. After passing through the first low-pass filter A14, the fourth amplifier A15, the second temperature-compensated attenuator A16, the second equalizer A17, and the second digitally controlled attenuator A18, the IF wideband or narrowband operating mode is selected by the first single-pole double-throw switch A19. The signal then enters the second bandpass filter A21 or the second low-pass filter A20, and then the second single-pole double-throw switch A22. After being amplified by the fifth amplifier A23, the signal passes through the third bandpass filter A24 to filter out harmonics, and is finally output through the microstrip-quasi-coaxial-microstrip structure.

[0022] The miniaturized ultra-wideband receiver frequency converter SiP module of this invention has the following advantages: The module employs a board-level stacking process, connecting the SiP's HTCC housing and the printed circuit board via a ball grid array to achieve three-dimensional stacking. Its dimensions are only 21mm*16mm*4.3mm, reducing the volume by 15% compared to traditional designs. This solves the problem of traditional frequency converter modules using mostly packaged devices, resulting in large size and low integration. The ball grid array's shielding function partitions different frequency signals within the SiP, such as RF, IF, intermediate frequency, and local oscillator, thereby improving the system's electromagnetic compatibility and signal integrity, achieving spurious rejection greater than 50dBc. This ensures both high integration and effective spurious rejection. The intermediate frequency signal link can be switched via a broadband connection. The system incorporates both wideband and narrowband receiving modes, addressing the compatibility issues of traditional modules and further improving out-of-band spurious suppression capabilities. By combining components such as RF equalizers, RF high-harmonic suppression amplifiers, and RF switching filters, it effectively reduces the power of spurious signals generated by low-frequency harmonics while maintaining a reasonable high-frequency noise figure. Through a rational equalization and ultra-wideband interconnect transmission structure, it improves broadband signal transmission efficiency, achieving a flatness of less than 4dB in the 1GHz mid-band and less than 6dB across the entire 0.8-18GHz frequency band. This solves the problems of poor signal transmission quality and flatness in traditional frequency converter modules, achieving a noise figure of less than 9dB, a gain of greater than 38dB, and spurious suppression of greater than 45dBc across the entire 0.8-18GHz frequency band.

[0023] The foregoing has only described certain exemplary embodiments of the present invention by way of illustration. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the foregoing drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A miniaturized ultra-wideband receiver frequency conversion SiP module, characterized in that, The module includes an RF unit, a local oscillator frequency multiplier and filter unit, and a frequency converter unit. The RF unit includes a first limiter, a first amplifier, a first digitally controlled attenuator, a first equalizer, a second amplifier, a first switching filter multifunction, and a first temperature-compensated attenuator. The local oscillator frequency multiplier and filter unit includes a first mixer amplifier filter multifunction, a second switching filter multifunction, and a frequency multiplier. The frequency converter unit includes a third amplifier, a second bandpass filter, a mixer amplifier multifunction, a first low-pass filter, a fourth amplifier, a second temperature-compensated attenuator, a second equalizer, a second digitally controlled attenuator, a first single-pole double-throw switch, a second low-pass filter, a second bandpass filter, a second single-pole double-throw switch, a fifth amplifier, and a third bandpass filter. The module internally employs a board-level stacking process, including a bottom HTCC housing and an upper printed circuit board, and includes the first limiter, first amplifier, first digitally controlled attenuator, first equalizer, second amplifier, first temperature-compensated attenuator, and first mixer amplifier. The filter multifunction, the second switching filter multifunction, the frequency multiplier, the third amplifier, the second bandpass filter, and the mixer amplifier multifunction are disposed on the bottom HTCC housing; the first switching filter multifunction, the first low-pass filter, the fourth amplifier, the second temperature-compensated attenuator, the second equalizer, the second digitally controlled attenuator, the first single-pole double-throw switch, the second low-pass filter, the second bandpass filter, the second single-pole double-throw switch, the fifth amplifier, and the third bandpass filter are disposed on the upper printed circuit board; the bottom HTCC housing and the upper printed circuit board are connected by a ball grid array; the first limiter, the first amplifier, the first digitally controlled attenuator, the first equalizer, and the second amplifier form an RF amplification area through the ball grid array; the first temperature-compensated attenuator, the first mixer amplifier filter multifunction, the second switching filter multifunction, and the frequency multiplier form a local oscillator mixing area through the ball grid array; the third amplifier, the second bandpass filter, and the mixer amplifier multifunction form a dual local oscillator mixing area through the ball grid array.

2. The miniaturized ultra-wideband receiver frequency conversion SiP module as described in claim 1, characterized in that, The first limiter is used to limit the received input signal. The first amplifier is used to amplify the received small signal. The first digitally controlled attenuator is used to adjust the RF link gain by switching the attenuation amount. The first equalizer is used to adjust the flatness of the RF link and reduce the power of low-frequency signals entering the second amplifier. The second amplifier is used to further amplify the received signal and is an amplifier with high harmonic suppression. The first switching filter multifunction is used to filter out spurious signals and signal harmonics generated in various frequency bands. The first temperature-compensated attenuator is used to equalize the gain of the RF link under high and low temperature operating conditions.

3. The miniaturized ultra-wideband receiver frequency conversion SiP module as described in claim 2, characterized in that, The first multi-functional switching filter includes eight single-pole triple-throw switches and eight bandpass filters with different frequency bands. The single-pole triple-throw switches are used to switch channels to select the corresponding bandpass filters. The frequencies of the bandpass filters are 0.8-1.4GHz, 1.2-2.2GHz, 2-3.6GHz, 2.6-4.6GHz, 3.6-6.2GHz, 5.2-9.2GHz, 8.2-13.2GHz, and 12.2-18GHz.

4. The miniaturized ultra-wideband receiver frequency conversion SiP module as described in any one of claims 1-3, characterized in that, The first multi-functional mixer amplification and filtering system includes an RF low-pass filter, a local oscillator amplifier, a mixer, and a band-pass filter. The RF low-pass filter is used to suppress spurious signals and signal harmonics. The local oscillator amplifier is used to ensure that the local oscillator signal entering the mixer effectively drives the mixer. The mixer is used to upconvert the RF signal to a single-frequency signal. The band-pass filter is used to suppress spurious signals generated during the first mixing. The second multi-functional switch filtering system includes two single-pole double-throw switches and filters for two frequency bands. It is used to filter out the fundamental frequency and third harmonic generated by the frequency multiplier to reduce spurious signals. The frequency multiplier is used to multiply the frequency of the input local oscillator signal to the frequency required for mixing.

5. The miniaturized ultra-wideband receiver frequency conversion SiP module as described in any one of claims 1-3, characterized in that, The third amplifier amplifies the first intermediate frequency (IF) signal. The second bandpass filter further suppresses spurious signals generated during the first mixing. The mixing amplifier multifunction is used for the second mixing of the two local oscillator signals. The first low-pass filter suppresses spurious signals generated during the second mixing. The fourth amplifier amplifies the IF signal. The second temperature-compensated attenuator balances the gain of the IF link under high and low temperature operating conditions. The second equalizer balances the IF flatness. The second digitally controlled attenuator adjusts the link gain. The first single-pole double-throw switch switches between IF wideband and narrowband operating modes. The second low-pass filter is the IF wideband mode selector, used to suppress spurious signals generated during the second mixing. The second bandpass filter is the IF narrowband mode selector, used to suppress spurious signals generated during the second mixing. The second single-pole double-throw switch switches between IF wideband and narrowband operating modes. The fifth amplifier further amplifies the IF signal. The third bandpass filter filters out harmonics generated by the fifth amplifier and outputs the IF signal.

6. The miniaturized ultra-wideband receiver frequency conversion SiP module as described in any one of claims 1-3, characterized in that, The bottom HTCC housing receives the RF input signal through a coaxial-microstrip vertical transition structure, and transmits the signal vertically to the upper printed circuit board through the microstrip-coaxial-microstrip vertical transition structure. The upper printed circuit board achieves horizontal signal transmission through a microstrip-strip-microstrip horizontal transition structure.

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