Liquid cooling system and control method thereof

Abstract

The invention relates to the technical field of heat dissipation, in particular to a liquid cooling system and a control method thereof. The liquid cooling system comprises an open type liquid storage structure which is communicated with the environment; the liquid cooling load structure comprises a contact type liquid cooling heat exchange assembly, a first liquid inlet of the liquid cooling load structure communicates with the open type liquid storage structure and is configured to receive first cooling liquid from the open type liquid storage structure, and a first liquid outlet of the liquid cooling load structure is located at a first height position; the cooling liquid distribution unit comprises a circulating pump and a heat exchanger, a first liquid return opening of the cooling liquid distribution unit is configured to receive first cooling liquid from the first liquid outlet, and the circulating pump is configured to drive the first cooling liquid to pass through a first flow channel of the heat exchanger and flow out of a first liquid supply opening of the cooling liquid distribution unit; when reaching the open type liquid storage structure, the circulating pump is located at a second height position, and the second height position is lower than the first height position.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a liquid cooling system and its control method. Background Technology

[0002] With the increasing use of high-power components, traditional air cooling technology has reached its economical and effective heat dissipation limit, and liquid cooling technology with higher energy efficiency has emerged and has developed rapidly in recent years.

[0003] Currently, commonly used liquid cooling technologies include plate-type liquid cooling. Plate-type liquid cooling uses a pump to drive the cooling liquid to flow through the channels of the load such as the chip. The cooling liquid exchanges heat with the load through the plate wall in the channel, carrying away the heat on the load to achieve the purpose of heat dissipation. This technology has advantages such as mature technology, energy saving and noise reduction, and is widely used. Summary of the Invention

[0004] This application provides a liquid cooling system and its control method, which achieves a negative pressure environment through an open liquid storage device and uses height difference pressurization to prevent cavitation, thus solving the leakage problem of positive pressure systems and reducing costs and enhancing stability.

[0005] According to some embodiments of this application, a liquid cooling system is provided, comprising: an open liquid storage structure in communication with the environment; a liquid-cooled load structure including a contact liquid-cooled heat exchange component, wherein a first inlet of the liquid-cooled load structure is connected to the open liquid storage structure and configured to receive a first cooling liquid from the open liquid storage structure, and a first outlet of the liquid-cooled load structure is located at a first height position; a cooling liquid distribution unit including a circulating pump and a heat exchanger, wherein a first return port of the cooling liquid distribution unit is configured to receive the first cooling liquid from the first outlet, the circulating pump is configured to drive the first cooling liquid through a first flow channel of the heat exchanger, flow out from a first supply port of the cooling liquid distribution unit, and reach the open liquid storage structure, and the circulating pump is located at a second height position, the second height position being lower than the first height position.

[0006] According to some other embodiments of this application, a control method is provided, which is applied to the liquid cooling system described in any embodiment of this application.

[0007] Other features, aspects, and advantages of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0008] The accompanying drawings, which form part of this specification, illustrate embodiments of this application and, together with the specification, serve to explain the principles of this application.

[0009] This application can be more clearly understood with reference to the accompanying drawings and the following detailed description, wherein:

[0010] Figure 1 This is a schematic diagram illustrating a liquid cooling system according to some embodiments of this application;

[0011] Figure 2 This is a schematic diagram illustrating a liquid cooling system according to other embodiments of this application;

[0012] Figure 3 This is a schematic diagram illustrating a liquid cooling system according to some embodiments of the present application;

[0013] Figure 4 This is a flowchart illustrating a control method according to some embodiments of this application;

[0014] Figure 5 This is a flowchart illustrating a control method according to other embodiments of this application;

[0015] Figure 6 This is a flowchart illustrating a control method according to some embodiments of the present application;

[0016] Figure 7 This is a flowchart illustrating a control method according to some embodiments of the present disclosure.

[0017] It should be understood that the dimensions of the various parts shown in the accompanying drawings are not drawn to actual scale. Furthermore, the same or similar reference numerals denote the same or similar components. Detailed Implementation

[0018] Various exemplary embodiments of this application will now be described in detail with reference to the accompanying drawings. The descriptions of the exemplary embodiments are merely illustrative and are in no way intended to limit the scope of this application or its application or use. This application may be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are provided to make the application thorough and complete, and to fully express the scope of the application to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, the composition of materials, numerical expressions, and values ​​set forth in these embodiments should be interpreted as merely exemplary and not as limiting.

[0019] The terms "first," "second," and similar words used in this application do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. Words such as "including" or "contains" mean that the element preceding the word encompasses the element listed after it, and do not exclude the possibility of encompassing other elements as well. Terms such as "above," "below," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, this relative positional relationship may also change accordingly.

[0020] In this application, when a specific device is described as being located between a first device and a second device, an intermediary device may or may not be present between the specific device and the first or second device. When a specific device is described as being connected to other devices, the specific device may be directly connected to the other devices without an intermediary device, or it may not be directly connected to the other devices but may have an intermediary device.

[0021] All terms used in this application (including technical or scientific terms) have the same meaning as understood by one of ordinary skill in the art to which this application pertains, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and not as having an idealized or highly formalized meaning, unless expressly defined herein.

[0022] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0023] In related technologies, liquid cooling systems are typically closed-loop positive pressure systems. Any damage to the system will result in leakage, causing power outages or even damage to servers and other loads. To address the leakage risk of positive pressure liquid cooling systems, a closed-loop system combined with a negative pressure CDU (Coolant Distribution Unit) is commonly used. The principle is to use a vacuum pump to maintain negative pressure in the closed secondary piping, while a circulation pump provides the circulation power within the vacuum chamber. Compared to closed-loop positive pressure systems, closed-loop negative pressure systems add components such as a vacuum pump, increasing costs. Furthermore, the vacuum pump needs to operate continuously to maintain the negative pressure state, resulting in lower reliability.

[0024] To address the aforementioned issues, this application provides a liquid cooling system that achieves a negative pressure environment through a secondary side-opening system, thereby resolving the leakage problem while reducing costs.

[0025] The following is combined Figure 1 This application describes a liquid cooling system according to an embodiment. Figure 1 This is a schematic diagram illustrating a liquid cooling system according to some embodiments of this application.

[0026] like Figure 1As shown, the liquid cooling system 1 includes: an open liquid storage structure 11, which is in communication with the environment; a liquid-cooled load structure 12, including a contact liquid-cooled heat exchange component 121, wherein the first liquid inlet 12I of the liquid-cooled load structure 12 is connected to the open liquid storage structure 11 and is configured to receive the first cooling liquid from the open liquid storage structure 11, and the first liquid outlet 12O of the liquid-cooled load structure 12 is located at a first height position H1; a cooling liquid distribution unit 13, including a circulating pump 131 and a heat exchanger 132, wherein the first liquid return port 13I1 of the cooling liquid distribution unit 13 is configured to receive the first cooling liquid from the first liquid outlet 12O, the circulating pump 131 is configured to drive the first cooling liquid through the first flow channel 132F1 of the heat exchanger 132, and out from the first liquid supply port 13O1 of the cooling liquid distribution unit 13 to the open liquid storage structure 11, and the circulating pump 131 is located at a second height position H2, which is lower than the first height position H1.

[0027] The open-type liquid storage structure 11 may include an open-type liquid storage tank or open-type liquid storage container for storing spare working fluid. In some cases, the working fluid includes a first cooling liquid. The first cooling liquid, for example, includes water, which is the core medium for heat transfer. Compared with other common cooling liquids, water is low in cost, highly safe, and has good thermodynamic properties, which can reduce system energy consumption and operating costs.

[0028] The liquid-cooled load structure 12 may include a liquid-cooled cabinet that directly supports the load, such as a server or other heat-generating device, and exchanges heat with the load through a contact-type liquid-cooled heat exchange component 121. In some embodiments, the contact-type liquid-cooled heat exchange component 121 includes a cold plate, which includes a cold plate body and cold plate channels disposed on the cold plate body. It should be understood that the liquid-cooled heat exchange component 121 in this application is not limited to a cold plate; in addition to a cold plate, contact-type heat exchange components such as liquid-cooled heat sinks and liquid-cooled heat spreaders can also be used. The contact-type liquid-cooled heat exchange component 121 can be in close contact with heat-generating components in the load, such as chips, to achieve heat conduction.

[0029] The open-type liquid storage structure 11 can be located at or below the first height position H1. For example, the outlet 11O of the open-type liquid storage structure 11 is located at the same height as the first inlet 12I of the liquid-cooled load structure 12, so that the pressure at the first inlet 12I of the liquid-cooled load structure 12 is the ambient air pressure. When the first cooling liquid flows through the liquid-cooled load structure 12, due to frictional resistance and local resistance such as flow channel bends, the pressure at the first outlet 12O of the liquid-cooled load structure 12 drops to a negative pressure, thus creating a natural negative pressure environment inside the liquid-cooled load structure 12. This negative pressure environment can be formed without the need for a vacuum pump, avoiding positive pressure leakage problems, reducing costs, and improving reliability.

[0030] The cooling liquid distribution unit 13 connects the primary side and the secondary side. As mentioned above, the cooling liquid distribution unit 13 includes a circulating pump 131 and a heat exchanger 132. The circulating pump 131 can be a water pump, such as a fixed-frequency pump, variable-frequency pump, single pump, dual pump, etc., used to provide power for the circulation of the first cooling liquid. The heat exchanger 132 can include a plate heat exchanger, etc., used to achieve heat isolation transfer between the primary side and the secondary side.

[0031] The first cooling liquid flows from the open liquid storage structure 11 through the liquid-cooled load structure 12 and the cooling liquid distribution unit 13, and finally returns to the open liquid storage structure 11. The overall flow direction is as follows: Figure 1 As indicated by the middle arrow.

[0032] To ensure the normal operation of the circulating pump 131, the pressure can be increased by using the height difference between the first height position H1 and the second height position H2, so that the inlet of the circulating pump 131 is under positive pressure, and a certain net positive suction head (NPSH) is reserved to prevent cavitation.

[0033] The height difference between the first height position H1 and the second height position H2 can be determined based on the pressure difference between the pressure at the first liquid outlet 12O and the ambient air pressure, and the net positive suction head (NPSH) of the circulating pump 131.

[0034] As the first cooling liquid falls from a first height position H1 to a second height position H2, its pressure increases linearly due to gravity. Therefore, to achieve positive pressure at the inlet of the circulating pump 131, a certain height difference can be set between the first height position H1 and the second height position H2, causing the pressure at the inlet of the circulating pump 131 to increase to positive pressure. The greater the pressure difference between the pressure at the first outlet 12O of the liquid-cooled load structure 12 and the ambient air pressure, the greater the height difference required to increase the pressure at the inlet of the circulating pump 131 to positive pressure. Therefore, the height difference is positively correlated with the pressure difference.

[0035] The net positive suction head (NPSH) is the necessary NPSH for the circulating pump 131, referring to the minimum net positive suction head that the circulating pump 131 must have at its inlet to prevent cavitation. When the pressure at the inlet of the circulating pump 131 is greater than the NPSH, that is, when the effective NPSH provided by the liquid cooling system is greater than the necessary NPSH of the circulating pump, cavitation can be prevented from occurring in the circulating pump 131. A larger NPSH requires a greater increase in pressure to meet the NPSH requirement, necessitating a larger height difference for pressurization. Therefore, the height difference is positively correlated with the NPSH.

[0036] To simultaneously ensure positive pressure at the inlet of the circulating pump 131 and prevent cavitation, the height difference is greater than the sum of the pressure head corresponding to the pressure difference and the net positive suction head (NPSH). The pressure head is the pressure energy per unit weight of fluid converted into the corresponding liquid column height, which can be calculated based on the fluid density of the first cooling liquid.

[0037] In the above scenario, the secondary side of the liquid cooling system adopts an open liquid storage structure, which can form a negative pressure environment without the need for a vacuum pump. Furthermore, the first cooling liquid is pressurized by the height difference between the liquid cooling load structure and the circulating pump. Without the need for components such as a pressure stabilizing tank, the negative pressure environment can be maintained while meeting the net positive suction head (NPSH), thus solving the problem of positive pressure leakage, reducing costs, and improving reliability.

[0038] The pressure difference between the outlet 12O of the liquid-cooled load structure 12 and the ambient air pressure is positively correlated with the flow resistance and flow rate within the flow channel. The magnitude of the flow resistance depends on the material and flow channel structure of the contact-type liquid-cooled heat exchange components, as well as parameters such as the viscosity and density of the liquid within the flow channel. The flow channel can be selected according to actual needs to set an appropriate flow resistance. The flow rate can be adjusted using a circulating pump or a flow regulating unit. Of course, the pressure difference is also related to the flow state of the cooling liquid within the flow channel.

[0039] In some cases, the circulation pump is further configured to regulate the liquid flow rate at the first inlet, thereby regulating the pressure difference.

[0040] Circulating pumps can regulate the total flow rate of a liquid cooling system by adjusting operating parameters such as rotation speed, but they are typically not used directly for precise adjustment of the inlet flow rate of individual contact-type liquid cooling heat exchange components. Circulating pumps can be used in conjunction with flow control units to achieve precise flow distribution. The following will combine... Figure 2 Describe the flow control unit in a liquid cooling system.

[0041] Figure 2 This is a schematic diagram illustrating a liquid cooling system according to other embodiments of this application. Figure 2 and Figure 1 The difference in its liquid cooling system lies in the inclusion of a flow regulation unit. Only a detailed description will follow below. Figure 2 and Figure 1The differences are minor, while the similarities will not be elaborated upon.

[0042] like Figure 2 As shown, the liquid cooling system 1' also includes a flow regulation unit 14, which is disposed at the first liquid inlet 12I and configured to regulate the liquid flow rate of the first liquid inlet 12I, thereby regulating the pressure difference.

[0043] The flow regulation unit 14 may include flow control components such as a throttle valve to achieve precise control of the flow rate in the flow channel of the contact liquid-cooled heat exchange component.

[0044] In the above embodiments, the flow rate within the contact liquid-cooled heat exchange component is precisely controlled by a circulating pump and a flow control unit. This adjusts the pressure difference between the outlet pressure of the liquid-cooled load structure and the ambient air pressure, thereby controlling the negative pressure inside the liquid-cooled load structure and consequently controlling the phase change temperature of the first cooling liquid. For example, if the pressure inside the liquid-cooled load structure decreases, the boiling point of the first cooling liquid will decrease. During the process of cooling the load with the first cooling liquid, the first cooling liquid will absorb heat and heat up, potentially undergoing a boiling phase change, further enhancing the heat exchange effect.

[0045] The above embodiments describe the setup of the secondary side of the liquid cooling system. The following, in conjunction with... Figure 3 The description also includes a liquid cooling system located on the primary side.

[0046] Figure 3 This is a schematic diagram illustrating a liquid cooling system according to some embodiments of the present application.

[0047] like Figure 3 As shown, the liquid cooling system 1'' further includes a first loop L1, wherein the first loop L1 includes a first return port 13I1, a first flow channel 132F1 of the heat exchanger 132, a first supply port 13O1, a circulation pump 131, a liquid cooling load structure 12, and an open liquid storage structure 11.

[0048] The first circuit L1 is the secondary side circuit in the liquid cooling system, which directly contacts the heat-generating loads such as servers to absorb heat and then transfer the heat to the primary side.

[0049] In addition to the first loop L1, the liquid cooling system 1'' may also include a second loop L2, wherein the second loop L2 includes the second liquid supply port 13O2 of the cooling liquid distribution unit 13, the second flow channel 132F2 of the heat exchanger 132, the second liquid return port 13I2 of the cooling liquid distribution unit 13, and a cold source 15. The second liquid supply port 13O2 is configured to receive the second cooling liquid from the cold source 15, and the second liquid return port 13I2 is configured to return the second cooling liquid flowing through the second flow channel 132F2 to the cold source 15. The second flow channel 132F2 is isolated from the first flow channel 132F1 but thermally coupled.

[0050] The second loop L2 is a primary-side loop in the liquid cooling system. It does not directly contact heat-generating loads such as servers; it is only responsible for transferring heat from intermediate heat exchange equipment to the cold source 15. Except... Figure 3 In addition to the components shown, components such as a circulation pump can be selectively installed in the second loop L2 to provide circulation power for the second loop L2.

[0051] The first flow channel 132F1 and the second flow channel 132F2 of the heat exchanger 132 do not directly contact each other, but only indirectly transfer heat through the common heat transfer wall 132W. The flow direction of the first cooling liquid in the first flow channel 132F1 and the flow direction of the second cooling liquid in the second flow channel 132F2 can adopt a counter-current heat exchange arrangement, which has a higher heat transfer coefficient and can transfer more heat with the same heat exchange area compared with co-current heat exchange.

[0052] The cold source 15 may include a cooling tower for transferring heat from the second cooling liquid to the air through evaporative heat dissipation and convective heat transfer, thereby reducing the temperature of the second cooling liquid. The second cooling liquid may be different from the first cooling liquid; for example, it may include softened water with added special agents. This application does not limit the height of the cold source 15 and it can be adjusted according to actual needs.

[0053] It should be understood that the various components of a liquid cooling system can be connected through corresponding piping. For example... Figure 3 As shown, the first liquid inlet 12I is connected to the open liquid storage structure 11 through the first pipeline PL1; the first liquid outlet 12O is connected to the first liquid return port 13I1 through the second pipeline PL2; and the first liquid supply port 13O1 is connected to the open liquid storage structure 11 through the third pipeline PL3.

[0054] In addition to the components mentioned above, the liquid cooling system may also include other components, such as flow sensors and / or pressure sensors, for accurate measurement of the flow rate and / or pressure of the cooling liquid in each loop of the system.

[0055] In the above embodiment, a complete liquid cooling system including a primary side and a secondary side is described. The first cooling liquid flows through the heat-generating load in the secondary side circuit, exchanges heat with the heat-generating load, absorbs heat and then flows into the cooling liquid distribution unit. Inside the cooling liquid distribution unit, it exchanges heat with the second cooling liquid in the primary side circuit, transferring the heat it carries to the second cooling liquid. The first cooling liquid, having completed the heat release, is driven by the secondary side circulation pump to flow back to the heat-generating load and enter the next heat absorption cycle.

[0056] In the primary circuit, the second cooling liquid absorbs heat from the first cooling liquid in the cooling liquid distribution unit and is then transported to the cold source. Through the heat exchange function of the cold source equipment, the heat is finally released to the external environment. The second cooling liquid, having completed heat discharge, flows back to the cooling liquid distribution unit to enter the next heat receiving cycle.

[0057] The above combination Figures 1 to 3 This application introduces liquid cooling systems according to various embodiments, which achieve a negative pressure environment through an open liquid storage structure and use height difference pressurization to prevent cavitation, thus solving the leakage problem of positive pressure systems and reducing costs and enhancing stability.

[0058] In addition to the liquid cooling system, this application also provides a control method applied to the aforementioned liquid cooling system.

[0059] The following is based on Figure 3 Taking a liquid cooling system as an example, combined with Figures 4 to 7 The control method applied to the above-mentioned liquid cooling system is described in detail.

[0060] Figure 4 This is a flowchart illustrating a control method according to some embodiments of this application.

[0061] like Figure 4 As shown, the control method includes: step S1, receiving a first cooling liquid from the open liquid storage structure through the first inlet of the liquid-cooled load structure; step S3, cooling the load in the liquid-cooled load structure using the contact liquid-cooled heat exchange component and the first cooling liquid, wherein the first cooling liquid absorbs heat and rises in temperature; step S5, causing the heated first cooling liquid to fall from the first outlet of the liquid-cooled load structure to the first return port of the cooling liquid distribution unit; step S7, using the circulating pump to drive the heated first cooling liquid to flow through the first flow channel of the heat exchanger to complete the cooling; step S9, delivering the cooled first cooling liquid to the open liquid storage structure through the first supply port of the cooling liquid distribution unit.

[0062] In step S1, the first cooling liquid is received from the outlet 11O of the open liquid storage structure 11 through the first inlet 12I of the liquid-cooled load structure 12. Since the open liquid storage structure 11 is in communication with the environment, and the outlet 11O of the open liquid storage structure 11 and the first inlet 12I of the liquid-cooled load structure 12 are located at the same height on the horizontal plane, it can be assumed that the pressure of the first inlet 12I of the liquid-cooled load structure 12 is equal to the ambient air pressure.

[0063] In step S3, the first cooling liquid in the flow channel of the contact liquid-cooled heat exchange component 121 flows through the load in the liquid-cooled load structure 12, absorbing the heat dissipated by the load and thus heating up. The load in the liquid-cooled load structure 12 may include heat-generating devices such as servers, whose heat is transferred to the surface through the chip and then to the contact liquid-cooled heat exchange component 121. When the first cooling liquid flows through the contact liquid-cooled heat exchange component 121, it comes into direct contact with its inner wall and absorbs heat. During this process, due to frictional resistance and local resistance such as flow channel bends, the interior of the liquid-cooled load structure 12 is a negative pressure environment, and the first cooling liquid may or may not undergo a phase change, depending on the current boiling point of the first cooling liquid.

[0064] In step S5, after heating, the first cooling liquid falls from the position of the first outlet 12O of the liquid-cooled load structure 12 to the position of the first return port 13I1 of the cooling liquid distribution unit 13. The first outlet 12O of the liquid-cooled load structure 12 is located at a first height position H1. The first return port 13I1 of the cooling liquid distribution unit 13 is located at a second height position H2. The height difference between the first height position H1 and the second height position H2 can be determined based on the pressure difference between the pressure at the first outlet 12O of the liquid-cooled load structure 12 and the ambient pressure, and the net positive suction head (NPSH) of the circulating pump 131.

[0065] The pressure at the first outlet 12O of the liquid-cooled load structure 12 is a first value, and the pressure at the first return outlet 13I1 of the cooling liquid distribution unit 13 is a second value. Due to the frictional resistance and local resistance such as flow channel bends when the first cooling liquid flows through the liquid-cooled load structure 12, the first value is less than the ambient air pressure, and the specific value depends on the flow resistance and flow rate. Due to the gravity effect during the fall of the first cooling liquid, the second value is greater than the first value, and the difference between the second value and the first value is positively correlated with the height difference between the first height position H1 and the second height position H2.

[0066] As mentioned earlier, the pressure at the inlet of the circulating pump 131 can be considered equivalent to the pressure at the first return port 13I1 of the cooling liquid distribution unit 13, i.e., the second value. To prevent cavitation, the pressure at the inlet of the circulating pump 131 can be increased to positive pressure.

[0067] For example, assuming the pressure difference between the first outlet 12O of the liquid-cooled load structure 12 and the ambient pressure is 50 kPa, and the first cooling liquid is water, the pressure head corresponding to the 50 kPa pressure difference is approximately 5 meters. Therefore, a height difference of 5 meters can ensure positive pressure at the inlet of the circulating pump 131. Considering the necessary net positive suction head (NPSH) of the circulating pump 131 is 2 meters, the total height difference is approximately 7 meters. In practical scenarios, the cooling liquid distribution unit 13 can be placed at least 7 meters below the horizontal plane of the liquid-cooled load structure 12.

[0068] In step S7, the circulating pump 131 drives the heated first cooling liquid to flow through the first flow channel 132F1 of the heat exchanger 132, and the cooling is completed in the first flow channel 132F1 of the heat exchanger 132 through heat exchange with the second cooling liquid.

[0069] In step S9, the cooled first cooling liquid is delivered to the inlet 11I of the open liquid storage structure 11 through the first supply port 13O1 of the cooling liquid distribution unit 13. The first supply port 13O1 of the cooling liquid distribution unit 13 is located at the second height H2. The inlet 11I of the open liquid storage structure 11 is located at the first height H1. During this process, the circulating pump 131 can be used to pressurize and provide power to overcome pipeline resistance and the gravitational potential energy generated by the height difference between the first height position H1 and the second height position H2.

[0070] In the above embodiments, a negative pressure environment is achieved through an open liquid storage structure, and cavitation is prevented by pressurizing based on height difference, which solves the leakage problem of the positive pressure system, reduces costs, and enhances stability.

[0071] Figure 5 This is a flowchart illustrating a control method according to some other embodiments of this application. Figure 5 Control methods and Figure 4 The control method differs in that it also includes step S2. The following will only describe the differences; the similarities will not be repeated. The following will combine... Figure 1-3 The liquid cooling system in step S2 is described in detail.

[0072] like Figure 5 As shown, the control method further includes: step S2, adjusting the liquid flow rate of the first liquid inlet 12I, thereby adjusting the pressure difference between the pressure of the first liquid outlet 12O and the ambient air pressure. The pressure difference between the pressure of the first liquid outlet 12O and the ambient air pressure is positively correlated with the liquid flow rate of the first liquid inlet 12I. The liquid flow rate of the first liquid inlet 12I can be adjusted according to actual needs by means of a circulating pump or flow regulating unit to obtain a suitable pressure difference.

[0073] Figure 6This is a flowchart illustrating a control method according to some embodiments of the present application. Figure 6 Control methods and Figure 4 The difference in the control method lies in the inclusion of step S2'. The following will only describe the differences; the similarities will not be repeated. The following will combine... Figure 1-3 The liquid cooling system in step S2' is described in detail.

[0074] like Figure 6 As shown, the control method further includes: step S2', adjusting the liquid flow rate of the first liquid inlet 12I to adjust the pressure inside the flow channel of the liquid-cooled load structure 12, causing the first cooling liquid inside the flow channel to boil. The greater the flow rate, the greater the pressure difference when flowing through the liquid-cooled load structure 12, and the lower the pressure inside the flow channel of the liquid-cooled load structure 12. Taking water as an example, when the pressure inside the flow channel decreases, the boiling point of water decreases. For example, when the pressure is -0.8 bar, the boiling point of water is approximately 50°C. At this time, the temperature of the heat-generating load may cause the water to undergo a boiling phase change, thereby enhancing the heat transfer effect.

[0075] In the above embodiments, the phase change of water under negative pressure is used to enhance heat exchange, which overcomes the problems of high cost, strong pollution, and need for larger volume heat exchangers of traditional low-boiling-point working fluids, thereby reducing costs and improving heat exchange performance.

[0076] Figures 4 to 6 The control method for the secondary side of the liquid cooling system shown below will be combined with... Figure 7 The control method for the primary side of the liquid cooling system is further described.

[0077] Figure 7 This is a flowchart illustrating a control method according to some embodiments of the present application. Figure 7 Control methods and Figure 4 The difference in the control method lies in the inclusion of steps S4, S6, and S8. The following will only describe the differences, and the similarities will not be repeated.

[0078] like Figure 7 As shown, the control method further includes: step S4, receiving a second cooling liquid from a cold source through the second supply port of the cooling liquid distribution unit; step S6, allowing the second cooling liquid to flow through the second flow channel of the heat exchanger to exchange heat with the first cooling liquid in the first flow channel, wherein the second flow channel is isolated from the first flow channel but thermally coupled, the first cooling liquid cools down, and the second cooling liquid heats up; step S8, returning the heated second cooling liquid to the cold source through the second return port of the cooling liquid distribution unit.

[0079] In step S4, the second cooling liquid from the cold source 15 flows into the cooling liquid distribution unit 13 through the second supply port 13O2. The cold source 15 may include a cooling tower. The second cooling liquid may be different from the first cooling liquid; for example, it may include softened water with added special agents.

[0080] In step S6, the second cooling liquid flows through the second flow channel 132F2 of the heat exchanger 132, exchanging heat with the first cooling liquid in the first flow channel 132F1 during this process. The first flow channel 132F1 and the second flow channel 132F2 of the heat exchanger 132 do not directly contact each other, and indirect heat transfer can be achieved only through a common heat transfer wall.

[0081] When the first cooling liquid flows through the first flow channel 132F1 of the heat exchanger 132, it first transfers heat to the internal metal plate wall of the heat exchanger 132. This wall is a shared heat transfer wall for both the first flow channel 132F1 and the second flow channel 132F2. Then, the heat is conducted through the wall from the first flow channel 132F1 to the second flow channel 132F2, and finally transferred to the second cooling liquid, thus achieving heat exchange. During this process, the liquid flow directions in the two channels can be counter-current to achieve higher heat exchange efficiency.

[0082] In step S8, a circulating pump can be set in the second loop L2 to allow the heated second cooling liquid to return from the second return port 13I2 of the cooling liquid distribution unit 13 to the cold source 15 and release heat through evaporation and other means, so as to realize the complete process of finally discharging the heat in the liquid-cooled load structure 12 to the atmosphere.

[0083] The above describes the control methods for liquid cooling systems according to various embodiments of this application. In these systems, an open liquid storage structure creates a negative pressure environment, and the height difference is used to pressurize and prevent cavitation, thus solving the leakage problem of positive pressure systems, reducing costs, and enhancing stability. Furthermore, the phase change of water under negative pressure can be further utilized to enhance heat transfer, overcoming the problems of high cost, strong pollution, and the need for larger volume heat exchangers associated with traditional low-boiling-point working fluids, thereby reducing costs while improving heat transfer performance.

[0084] It should be understood that the control method steps of this application can be executed in the order described above, or the execution order of the steps can be adjusted according to actual needs. The steps may be executed sequentially or simultaneously. This application does not limit this, as long as the technical effect of this application can be achieved.

[0085] The embodiments of this application have now been described in detail. To avoid obscuring the concept of this application, some details known in the art have not been described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein based on the above description.

[0086] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments or equivalent substitutions can be made to some technical features without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.

Claims

1. A liquid cooling system, comprising: Open-type liquid storage structure, allowing it to be in contact with the environment; A liquid-cooled load structure includes a contact-type liquid-cooled heat exchange component, wherein the first liquid inlet of the liquid-cooled load structure is connected to the open liquid storage structure and is configured to receive the first cooling liquid from the open liquid storage structure, and the first liquid outlet of the liquid-cooled load structure is located at a first height position. A cooling liquid distribution unit includes a circulating pump and a heat exchanger. The first return port of the cooling liquid distribution unit is configured to receive the first cooling liquid from the first outlet port. The circulating pump is configured to drive the first cooling liquid through the first flow channel of the heat exchanger, outflow from the first supply port of the cooling liquid distribution unit, and reach the open liquid storage structure. The circulating pump is located at a second height position, which is lower than the first height position.

2. The liquid cooling system according to claim 1, wherein: The open-type liquid storage structure is located at or below the first height position.

3. The liquid cooling system according to claim 1, wherein, The first cooling liquid includes water.

4. The liquid cooling system according to claim 1, wherein: The liquid-cooled load structure includes a liquid-cooled cabinet; The contact-type liquid-cooled heat exchange assembly includes a cold plate, which includes a cold plate body and a cold plate flow channel disposed on the cold plate body.

5. The liquid cooling system according to claim 1, wherein: The first liquid inlet is connected to the open liquid storage structure through a first pipeline; The first outlet is connected to the first return outlet via a second pipeline; The first liquid supply port is connected to the open liquid storage structure through a third pipeline.

6. The liquid cooling system according to claim 1, wherein: The liquid cooling system further includes a first loop, wherein the first loop includes a first return port, a first flow channel of the heat exchanger, a first supply port, a circulating pump, a liquid cooling load structure, and an open liquid storage structure; The liquid cooling system further includes a second loop, wherein the second loop includes a second liquid supply port of the cooling liquid distribution unit, a second flow channel of the heat exchanger, a second liquid return port of the cooling liquid distribution unit, and a cold source. The second liquid supply port is configured to receive a second cooling liquid from the cold source, and the second liquid return port is configured to return the second cooling liquid flowing through the second flow channel to the cold source. The second flow channel is isolated from the first flow channel but thermally coupled.

7. The liquid cooling system according to any one of claims 1 to 6, wherein, The height difference between the first height position and the second height position is determined based on the pressure difference between the pressure at the first liquid outlet and the ambient air pressure, and the net positive suction head (NPSH) of the circulating pump.

8. The liquid cooling system according to claim 7, wherein: The height difference is positively correlated with the pressure difference; The height difference is positively correlated with the net positive suction head (NPSH).

9. The liquid cooling system according to claim 8, wherein, The height difference is greater than the sum of the pressure head corresponding to the pressure difference and the net positive suction head (NPSH).

10. The liquid cooling system according to claim 7, further comprising: A flow rate regulating unit is disposed at the first liquid inlet and configured to regulate the liquid flow rate at the first liquid inlet, thereby regulating the pressure difference.

11. The liquid cooling system according to claim 8, wherein, The circulating pump is further configured to adjust the liquid flow rate at the first inlet, thereby adjusting the pressure difference.

12. A control method applied to a liquid cooling system according to any one of claims 1 to 11.

13. The control method according to claim 12, further comprising: Adjust the liquid flow rate at the first inlet to adjust the pressure difference between the pressure at the first outlet and the ambient air pressure.

14. The control method according to claim 12, further comprising: Adjust the liquid flow rate at the first inlet to regulate the pressure within the flow channel of the liquid-cooled load structure, causing the first cooling liquid within the flow channel to boil.

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