Improved full-color SMD light emitting diode composite material support

Abstract

The invention discloses an improved full-color SMD light emitting diode composite material support, and relates to the technical field of light emitting diode supports. An improved full-color SMD light emitting diode composite material support comprises a base mechanism, and the base mechanism comprises an LPC base material. The upper surface of the central part of the LPC base material is concavely provided with a disc groove; a tray supporting mechanism is arranged in the tray groove in a matched mode. A bracket mechanism is erected on the tray erecting mechanism; matched grooves are uniformly formed in the two transverse sides of the LPC base material at equal intervals, and first tooth grooves are formed in the inner end walls of the matched grooves; first extension grooves are symmetrically formed in the two sides of the matching groove correspondingly. Second extension grooves are formed in the middles of the upper and lower inner walls of the matching groove; nail columns fixedly connected to the LPC base material are arranged at the corners of the ports of the matching grooves respectively. Pin assemblies are correspondingly assembled in the matching grooves; the pin assembly comprises a pin mechanism and a buffer mechanism; the pin mechanism comprises a pin with a nickel-gold plating layer; and the pin mechanism adopts a composite structure formed by superposing the pins and the copper cores, so that the bonding strength between the base mechanism and the pin mechanism is improved.

Description

Technical Field

[0001] This invention relates to the field of light-emitting diode bracket technology, specifically to an improved full-color SMD light-emitting diode composite material bracket. Background Technology

[0002] With the rapid iteration of display technology and the lighting industry, full-color SMD (Surface Mount Device) light-emitting diodes (LEDs) have become widely used in high-end fields such as Mini / Micro LED displays, smart wearable devices (such as watch and bracelet backlights), automotive ambient lighting, and backlight modules due to their advantages such as small size, high integration (integrating three RGB chips), wide color gamut (NTSC color gamut ≥95%), and fast response speed (≤10ns). As the core carrier and functional component of full-color SMD LEDs, the bracket not only needs to provide mechanical support and circuit conduction path for the chip, but also needs to take into account multiple performance aspects such as heat dissipation, optical reflection, and insulation isolation. Its quality directly determines the luminous efficacy, color temperature stability, reliability, and lifespan of the LED device.

[0003] The integrated nature of full-color SMD LEDs places stringent requirements on the mounting system: long-term UV irradiation, high and low temperature cycling, and humid environments pose significant challenges to the mounting system's aging resistance, structural stability, and interfacial bonding reliability. However, traditional full-color SMD LED mounting systems suffer from significant bottlenecks in material selection and structural design, making them unsuitable for the performance demands of current high-end applications. To compensate for the shortcomings of single-material systems, the industry has gradually adopted a simple composite structure of metal leads and polymer substrates. However, the significant difference in the coefficients of thermal expansion (CTE) between metals and polymers, without effective transitional modification, leads to stress concentration at the interface during high-temperature operation, resulting in interlayer cracking. The bonding strength is generally below 25 MPa, failing to meet the reliability requirements of harsh environments.

[0004] In summary, the current technical bottleneck in material compatibility of full-color SMD LED brackets has become a core obstacle restricting the development of full-color SMD LEDs towards high integration, high reliability, and high image quality. Therefore, developing an improved full-color SMD LED composite material bracket is of great significance for promoting the application of full-color SMD LEDs in the display and lighting fields. Summary of the Invention

[0005] The purpose of this invention is to provide an improved full-color SMD LED composite material bracket to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: an improved full-color SMD light-emitting diode composite material bracket, comprising a base mechanism, wherein the base mechanism comprises an LPC substrate; The upper surface of the central portion of the LPC substrate has a recessed groove; a tray support mechanism is adapted to be provided in the groove; a bracket mechanism is mounted on the tray support mechanism. The LPC substrate has equidistant and uniformly spaced grooves on both sides of its transverse direction. A first toothed groove is formed on the inner end wall of each groove. First extension grooves are symmetrically formed on both sides of each groove. Second extension grooves are formed in the middle of the upper and lower inner walls of each groove. Pins fixed to the LPC substrate are provided at the corners of each groove's port. A pin assembly is correspondingly assembled within each groove. The pin assembly includes a pin mechanism and a buffer mechanism. The pin mechanism includes pins with a nickel-gold plating; a first tooth adapted to be inserted into a first tooth groove is fixedly connected to one end face of the pin; a second tooth is fixedly connected to both sides of one end of the pin; one end of the pin is adapted to be connected to a buffer mechanism and is assembled onto the base mechanism through the buffer mechanism.

[0007] As a preferred embodiment of the present invention, the LPC substrate has an array of first material pits evenly spaced at the center, and the LPC substrate has a second material pit connected to the adjacent first material pits in the center; the first material pits are filled with aluminum nitride powder blocks, and the second material pits are filled with graphene nanosheets.

[0008] The LPC substrate has a longitudinally penetrating heat-conducting hole, which is filled with thermally conductive silicone.

[0009] The LPC substrate has a spiral-shaped moisture-proof channel embedded throughout it, and the moisture-proof channel is filled with a highly absorbent resin that adsorbs and penetrates trace amounts of water vapor. The moisture-proof and heat-conducting silicone is interwoven.

[0010] As a preferred embodiment of the present invention, the tray mechanism includes a tray with a fixed insertion slot, and radially arranged scales are fixedly connected to the inner wall of the tray.

[0011] As a preferred embodiment of the present invention, a copper core is fixedly embedded in the pin.

[0012] As a preferred embodiment of the present invention, the buffer mechanism includes a panel that is attached to the LPC substrate, and the surface corners of the panel are provided with nail holes adapted to insert nail posts. A sleeve block adapted for insertion slot is fixedly connected to the middle of one side of the panel. A socket adapted for insertion pin is opened through the middle of the sleeve block, and the socket extends through the panel. A protrusion adapted for insertion second extension slot is fixedly connected to the middle of the upper and lower surfaces of the sleeve block. The two sides of the sleeve block are respectively symmetrically provided with clamping pads fixed to the panel, and the clamping pads are adapted to be inserted into the first extension groove; a second tooth groove adapted to be inserted into the second tooth is opened on one side of the clamping pad.

[0013] As a preferred embodiment of the present invention, the bracket mechanism includes a support plate, and the corners of the support plate are fixedly connected to support legs assembled on the frame. A support groove is formed in the middle of the upper surface of the tray, and a through groove is formed in the middle of the support groove; a micro-groove array is formed at equal intervals and evenly in the bottom of the support groove; a chip board that fits the micro-groove array is adapted to be embedded in the support groove. The upper surface edge of the tray is fitted with a smooth-edged buffer silicone. The upper surface edge of the tray is fixedly connected to a limit dam.

[0014] Compared with the prior art, the beneficial effects of the present invention are: 1. An LPC substrate is modified by blending aluminum nitride powder blocks and graphene nanosheets to construct a high-density thermally conductive network, thereby improving the overall thermal conductivity of the base structure. The LPC substrate is longitudinally filled with thermally conductive silicone to further enhance the heat dissipation of local hot areas, reduce the chip's operating junction temperature, and further reduce the temperature of local hot areas in the base structure. This suppresses the problem of accelerated light decay caused by high temperature from the source, reduces the light decay rate after high-temperature aging, and significantly extends the device's lifespan.

[0015] 2. The pin mechanism adopts a composite structure of pins and copper core. The copper core ensures low resistivity and ensures current transmission efficiency; the nickel layer effectively isolates corrosive media, and the gold layer optimizes the solderability of the pads and avoids the problem of increased contact resistance caused by oxidation; it enhances the bonding strength between the base mechanism and the pin mechanism to meet the vibration and temperature cycling requirements of harsh environments.

[0016] 3. A biomimetic scale-like composite texture is formed inside the frame to improve the reflectivity of visible light; the radial arrangement of the frame matches the light emission angle of the chip, effectively reducing diffuse reflection and scattering. Combined with precise control of the chip offset, it reduces the color temperature deviation of the mixed light, improves the light efficiency, and significantly improves the accuracy of the mixed light.

[0017] 4. The first tooth and the first groove are serrated to form a transition joint surface, which greatly alleviates the interlayer stress between the base mechanism and the pin mechanism; solves the problem of interlayer cracking of traditional brackets, improves the interface bonding strength retention rate, and reduces the overall warpage of the bracket.

[0018] 5. Reduces the water vapor transmission rate of the base mechanism and improves the moisture resistance level; at the same time, the spiral moisture-proof channel extends the water vapor penetration path, reduces the probability of chip failure due to moisture, adapts to a variety of humid and dusty application scenarios, and improves the suitability for complex working environments.

[0019] 6. A limiting dam is fixedly connected to the upper surface edge of the tray; the limiting dam on the bracket mechanism is used to isolate adjacent chips to form an anti-overflow protection, effectively limiting the flow range of silver paste and insulating paste, reducing the overflow rate, avoiding cross-contamination and short circuit problems, improving the yield of full-color SMD LED production lines, and significantly reducing cost losses during mass production. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 For the present invention Figure 1 Enlarged view of point B; Figure 3 This is a schematic diagram of the base mechanism of the present invention; Figure 4 This is a schematic diagram of the LCP substrate of the present invention; Figure 5 For the present invention Figure 3 Enlarged view of point A; Figure 6 This is a schematic diagram of the moisture-proof and flow-guiding channel of the present invention; Figure 7 This is a schematic diagram of the groove configuration of the present invention; Figure 8 This is a schematic diagram of the tray mechanism of the present invention; Figure 9 This is a planar schematic diagram of the scale positions of the present invention; Figure 10 This is a schematic diagram of the pin assembly of the present invention; Figure 11 This is a schematic diagram of the buffer mechanism of the present invention; Figure 12 This is a schematic diagram of the pin mechanism of the present invention; Figure 13 This is a schematic diagram of the bracket mechanism of the present invention.

[0021] In the diagram: 1. Base mechanism; 101. LCP substrate; 102. First material pit; 103. Second material pit; 104. Aluminum nitride powder block; 105. Graphene nanosheets; 106. Disk groove; 107. Thermal conductive hole; 108. Thermally conductive silicone; 109. Fitting groove; 110. First toothed groove; 111. First extension groove; 112. Second extension groove; 113. Nail post; 114. Moisture-proof guide channel; 115. Superabsorbent resin; 2. Frame mechanism; 201. Frame; 202. Scales 3. Pin Mechanism; 301. Pin; 302. Copper Core; 303. First Tooth; 304. Second Tooth; 4. Buffer Mechanism; 401. Panel; 402. Pin Hole; 403. Sleeve Block; 404. Insert; 405. Protrusion; 406. Clamping Pad; 407. Second Tooth Groove; 5. Bracket Mechanism; 501. Bracket Plate; 502. Support Leg; 503. Bracket Groove; 504. Through Groove; 505. Microgroove Array; 506. Chip Board; 507. Buffer Silicone; 508. Limiting Dam. Detailed Implementation

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] Example: Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 7 , Figure 10 , Figure 12 An improved full-color SMD light-emitting diode composite material bracket includes a base mechanism 1, and the base mechanism 1 includes an LPC substrate 101; The upper surface of the central portion of the LPC substrate 101 has a recessed groove 106; a tray support mechanism 2 is adapted to be provided in the groove 106; a bracket mechanism 5 is mounted on the tray support mechanism 2. The LPC substrate 101 has equally spaced and uniformly spaced grooves 109 on both sides of its transverse direction. The inner end wall of the groove 109 has a first toothed groove 110. The two sides of the groove 109 have symmetrically spaced first extension grooves 111. The middle of the upper and lower inner walls of the groove 109 has a second extension groove 112. The groove 109, the first extension groove 111 and the second extension groove 112 together form a cross-shaped groove. The corners of the groove 109 are provided with nail posts 113 fixed to the LPC substrate 101. The groove 109 is equipped with corresponding pin assemblies. The pin assembly includes a pin mechanism 3 and a buffer mechanism 4. The pin mechanism 3 includes a pin 301 with a nickel-gold plating layer; a first tooth 303 adapted to be inserted into the first tooth groove 110 is fixedly connected to one end face of the pin 301; a second tooth 304 is fixedly connected to both sides of one end of the pin 301; one end of the pin 301 is adapted to be connected to the buffer mechanism 4 and is assembled onto the base mechanism 1 through the buffer mechanism 4.

[0024] Please see Figure 3 , Figure 4 , Figure 6 The LPC substrate 101 has an array of first pits 102 evenly spaced in the center portion, and a second pit 103 connected to the adjacent first pits 102 is formed in the center portion of the LPC substrate 101; the first pits 102 are filled with aluminum nitride powder blocks 104, and the second pits 103 are filled with graphene nanosheets 105.

[0025] A thermally conductive hole 107 is longitudinally opened in the LPC substrate 101, and the thermally conductive hole 107 is filled with thermally conductive silicone 108.

[0026] A spiral-shaped moisture-proof channel 114 is embedded through the LPC substrate 101, and the moisture-proof channel 114 is filled with a highly absorbent resin 115 that absorbs and penetrates a small amount of water vapor. Moisture-proof drainage channels 114 and thermally conductive silicone 108 are interwoven.

[0027] Please see Figure 8 , Figure 9 The tray mechanism 2 includes a tray 201 with a fixed mounting slot 106. Radially arranged scales 202 are fixedly connected to the inner wall of the tray 201. The degree of curvature of the scales 202 gradually increases from the top layer to the bottom layer to match the light emission angle of the chip.

[0028] Please see Figure 12 A copper core 302 is fixedly embedded inside pin 301.

[0029] Please see Figure 10 , Figure 11 The buffer mechanism 4 includes a panel 401 that is attached to the LPC substrate 101, and the surface corners of the panel 401 are provided with nail holes 402 adapted to insert nail posts 113. A sleeve block 403 adapted to the insertion slot 109 is fixedly connected to the middle of one side of the panel 401. A socket 404 adapted to the insertion pin 301 is opened through the middle of the sleeve block 403. The socket 404 extends through the panel 401. A protrusion 405 adapted to the second extension slot 112 is fixedly connected to the middle of the upper and lower surfaces of the sleeve block 403. The two sides of the sleeve block 403 are respectively symmetrically provided with clamping pads 406 fixed to the panel 401, and the clamping pads 406 are adapted to be inserted into the first extension groove 111; a second tooth groove 407 adapted to be inserted into the second tooth 304 is provided on one side of the clamping pads 406; the clamping pads 406 are made of silicone material.

[0030] Please see Figure 13 The bracket mechanism 5 includes a support plate 501, and the corners of the support plate 501 are fixedly connected to the support legs 502 assembled on the frame plate 201. A mounting groove 503 is provided in the middle of the upper surface of the tray 501, and a through groove 504 is provided in the middle of the mounting groove 503; a micro-groove array 505 is provided at equal intervals and evenly in the inner bottom of the mounting groove 503; a chip board 506 that fits the micro-groove array 505 is adapted and embedded in the mounting groove 503. The upper surface edge of the tray 501 is fitted with a smooth-edged buffer silicone 507; A limit dam 508 is fixedly connected to the upper surface edge of the pallet 501.

[0031] The working principle of this invention is as follows: The LPC substrate 101 has an array of first pits 102 evenly spaced at the center, and a second pit 103 connecting adjacent first pits 102 is also formed in the center of the LPC substrate 101. The first pits 102 are filled with aluminum nitride powder blocks 104, and the second pits 103 are filled with graphene nanosheets 105. The LPC substrate 101 is modified by blending aluminum nitride powder blocks 104 and graphene nanosheets 105 to construct a high-density thermally conductive network and improve the overall thermal conductivity of the base structure 1. In addition, thermally conductive holes 107 are formed longitudinally through the LPC substrate 101 and filled with thermally conductive silicone 108 to further enhance the heat dissipation of local hot areas, reduce the chip operating junction temperature, further reduce the temperature of local hot areas of the base structure 1, suppress the problem of accelerated light decay caused by high temperature from the source, reduce the light decay rate after high temperature aging, and significantly extend the service life of the device.

[0032] Pin 301 is nickel-gold plated, and a copper core 302 is fixedly embedded inside pin 301; pin mechanism 3 adopts a composite structure of pin 301 and copper core 302 superimposed. The copper core 302 ensures low resistivity and ensures current transmission efficiency; the nickel layer effectively isolates corrosive media, and the gold layer optimizes the solderability of the pads and avoids the problem of increased contact resistance caused by oxidation; it improves the bonding strength between base mechanism 1 and pin mechanism 3 and meets the vibration and temperature cycling requirements of harsh environments.

[0033] The tray mechanism 2 includes a tray 201 with a fixed mounting slot 106. Radially arranged scales 202 are fixedly connected to the inner wall of the tray 201. The degree of curvature of the scales 202 gradually increases from the top layer to the bottom layer to match the light emission angle of the chip. A biomimetic scale-like composite texture is formed inside the tray 201 to improve the reflectivity of 450-650nm visible light. The radial arrangement of the tray 201 matches the light emission angle of the chip, effectively reducing diffuse reflection and scattering. With the precise control of the chip offset, the color temperature deviation of the mixed light is reduced, the light efficiency is improved, and the mixing accuracy is greatly improved.

[0034] At the junction of LPC substrate 101 and pin 301, a cross-shaped micro-stress relief groove is formed by a groove 109, a first extension groove 111, and a second extension groove 112. One end of pin 301 is adapted to be connected to a buffer mechanism 4 and is assembled to the base mechanism 1 through the buffer mechanism 4. One end face of pin 301 is fixedly connected to a first tooth 303 adapted to be inserted into the first tooth groove 110. The serrated first tooth 303 and the first tooth groove 110 form a transition joint surface, which greatly alleviates the interlayer stress between the base mechanism 1 and the pin mechanism 3; solves the problem of interlayer cracking of traditional brackets, improves the interface bonding strength retention rate, and reduces the overall warpage of the bracket.

[0035] The LPC substrate 101 has a spiral-shaped moisture-proof channel 114 embedded throughout it. The moisture-proof channel 114 is filled with a highly absorbent resin 115 that absorbs trace amounts of moisture. This, along with the rounded edge of the buffer silicone 507 embedded on the upper surface of the tray 501, creates a double moisture barrier. This reduces the moisture permeability of the base mechanism 1 and improves the moisture resistance. At the same time, the spiral-shaped moisture-proof channel 114 extends the moisture penetration path, reducing the probability of chip failure due to moisture. This makes it suitable for various humid and dusty application scenarios and improves its suitability for complex working environments.

[0036] A limiting dam 508 is fixedly connected to the upper surface edge of the tray 501; the limiting dam 508 on the bracket mechanism 5 is used to isolate adjacent chips to form an anti-overflow protection, effectively limiting the flow range of silver paste and insulating paste, reducing the overflow rate, avoiding cross-contamination and short circuit problems, improving the yield of full-color SMD LED production line, and significantly reducing cost losses in the mass production process.

[0037] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An improved full-color SMD light-emitting diode composite material bracket, comprising a base mechanism (1), wherein the base mechanism (1) comprises an LPC substrate (101). Its features are: The upper surface of the central portion of the LPC substrate (101) has a recessed groove (106); a tray support mechanism (2) is adapted to be provided in the groove (106); a bracket mechanism (5) is mounted on the tray support mechanism (2). The LPC substrate (101) has equidistant and uniformly spaced grooves (109) on both sides of its transverse direction. A first toothed groove (110) is formed on the inner end wall of the groove (109). A first extension groove (111) is symmetrically formed on both sides of the groove (109). A second extension groove (112) is formed in the middle of the upper and lower inner walls of the groove (109). A pin post (113) fixed to the LPC substrate (101) is provided at the corner of the end of the groove (109). A pin assembly is assembled in the groove (109). The pin assembly includes a pin mechanism (3) and a buffer mechanism (4). The pin mechanism (3) includes a pin (301) with a nickel-gold plating layer; a first tooth (303) adapted to be inserted into the first tooth groove (110) is fixedly connected to one end face of the pin (301); a second tooth (304) is fixedly connected to both sides of one end of the pin (301); one end of the pin (301) is adapted to be connected to the buffer mechanism (4) and is assembled onto the base mechanism (1) through the buffer mechanism (4).

2. The improved full-color SMD light-emitting diode composite material bracket according to claim 1, characterized in that: The LPC substrate (101) has an array of first pits (102) evenly spaced at the center, and the LPC substrate (101) has a second pit (103) connecting adjacent first pits (102); the first pits (102) are filled with aluminum nitride powder blocks (104), and the second pits (103) are filled with graphene nanosheets (105).

3. The improved full-color SMD light-emitting diode composite material bracket according to claim 2, characterized in that: The LPC substrate (101) has a longitudinally penetrating heat-conducting hole (107) and the heat-conducting hole (107) is filled with thermally conductive silicone (108).

4. The improved full-color SMD light-emitting diode composite material bracket according to claim 3, characterized in that: The LPC substrate (101) has a spiral-shaped moisture-proof channel (114) embedded in it, and the moisture-proof channel (114) is filled with a highly absorbent resin (115) that adsorbs and penetrates a small amount of water vapor. The moisture-proof guide channel (114) and the thermally conductive silicone (108) are interwoven.

5. The improved full-color SMD light-emitting diode composite material bracket according to claim 1, characterized in that: The tray mechanism (2) includes a tray (201) with a fixed insertion tray groove (106), and radially arranged scales (202) are fixedly connected to the inner wall of the tray (201).

6. The improved full-color SMD light-emitting diode composite material bracket according to claim 1, characterized in that: A copper core (302) is fixedly embedded in the pin (301).

7. The improved full-color SMD light-emitting diode composite material bracket according to claim 1, characterized in that: The buffer mechanism (4) includes a panel (401) that is attached to the LPC substrate (101), and the surface corners of the panel (401) are provided with nail holes (402) adapted to insert nail posts (113). A sleeve block (403) adapted to the insertion slot (109) is fixedly connected to the middle of one side of the panel (401). A socket (404) adapted to the insertion pin (301) is opened through the middle of the sleeve block (403). The socket (404) extends through the panel (401). A protrusion (405) adapted to the insertion second extension slot (112) is fixedly connected to the middle of the upper and lower surfaces of the sleeve block (403). The sleeve block (403) is symmetrically provided with clamping pads (406) fixed to the panel (401) on both sides. The clamping pads (406) are adapted to be inserted into the first extension groove (111). A second tooth groove (407) adapted to be inserted into the second tooth (304) is provided on one side of the clamping pads (406).

8. An improved full-color SMD light-emitting diode composite material bracket according to claim 5, characterized in that: The bracket mechanism (5) includes a tray (501), and the corners of the tray (501) are fixedly connected to the legs (502) assembled on the rack (201). The upper surface of the tray (501) has a support groove (503) in the middle, and a through groove (504) is formed through the middle of the support groove (503); the inner bottom of the support groove (503) has a micro-groove array (505) evenly spaced; a chip board (506) that fits the micro-groove array (505) is adapted to be embedded in the support groove (503). The upper surface edge of the tray (501) is fitted with a smooth-edged buffer silicone (507). The upper surface edge of the tray (501) is fixedly connected to a limiting dam (508).

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