CDSEM measurement monitoring method and monitoring system

Abstract

The invention provides a CDSEM measurement monitoring method and system, and the method comprises the steps: judging whether SA triggers are generated on a plurality of different measurement points or not and whether the SA triggers are consistent or not through receiving SA triggers generated by a receiver station and recording the trigger information of the SA triggers; according to the method and the device, whether consistent SA triggers exist on different programs of the same machine table or not and whether consistent SA triggers exist on the same programs of different machine tables or not are judged, and the SA triggers are monitored, so that corresponding clamping control can be performed, subsequent SA triggers can be reduced, the measurement time can be shortened, and the productivity of the machine table can be improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a CDSEM measurement and monitoring method and system. Background Technology

[0002] A CDSEM (Critical Dimension Scanning Electron Microscope) is a key piece of equipment in semiconductor manufacturing for high-precision measurement. It primarily uses a scanning electron beam to perform nanoscale imaging and dimensional analysis of micro- and nanostructures (such as linewidths, trenches, and contact holes) on the wafer surface. By scanning the sample surface with a high-resolution electron beam and combining it with image processing algorithms, it accurately measures the critical dimensions (CD), morphology, and overlay errors, providing real-time feedback data for processes such as photolithography and etching, ensuring process stability and product yield. CDSEMs offer advantages such as non-contact, high sensitivity, and automated measurement, making them a core tool for monitoring process fluctuations, optimizing process parameters, and preventing defects, and are crucial for ensuring chip performance and reliability.

[0003] However, in actual measurement, coordinate shifts can have multifaceted impacts on production processes and product quality, such as distorted measurement data, missed product defects, and losses in equipment and production efficiency. The effects of coordinate shifts permeate every stage from R&D to mass production; even micrometer-level shifts can lead to catastrophic consequences. Therefore, preventing and rapidly correcting coordinate shifts is a core aspect of semiconductor quality control.

[0004] CDSEM machines often have a large number of online recipes, making it difficult for engineers to perform one-to-one maintenance after creation. Furthermore, CDSEM machines frequently experience measurement coordinate offsets during measurement due to various factors. When this happens, the machine triggers Search Around (SA) operations around the current location, leading to excessively long measurement times and severely impacting machine throughput. Currently, mainstream machines lack measures to control this issue. Summary of the Invention

[0005] The purpose of this invention is to provide a CDSEM measurement and monitoring method and system to solve the problem in the prior art that there is no control over the SA triggering of the machine, which leads to excessive measurement time and seriously affects the machine's production capacity.

[0006] To address the aforementioned technical problems, this invention provides a CDSEM measurement and monitoring method, the CDSEM measurement and monitoring method comprising:

[0007] The receiver generates an SA trigger and records the trigger information of the SA trigger;

[0008] Determine whether SA triggers occur at multiple different measurement points and whether each SA trigger is consistent;

[0009] If so, determine whether there are consistent SA triggers on different programs of the same machine and whether there are consistent SA triggers on the same program of different machines; if there are consistent SA triggers on different programs of the same machine and inconsistent SA triggers on the same program of different machines, then it is determined to be a machine problem.

[0010] Optionally, in the CDSEM measurement and monitoring method, if there are inconsistent SA triggers generated on different programs of the same machine, but consistent SA triggers are generated on the same program of different machines, then it is judged to be a program problem.

[0011] Optionally, in the CDSEM measurement monitoring method, determining whether SA triggers occur at multiple different measurement points and whether each SA trigger is consistent includes:

[0012] Determine whether SA triggering occurs at multiple different measurement points;

[0013] If so, determine whether the offset direction and offset amount triggered by each SA at multiple different measurement points are the same.

[0014] Optionally, in the CDSEM measurement and monitoring method, determining whether there are consistent SA triggers on different programs of the same machine and whether there are consistent SA triggers on the same program of different machines includes:

[0015] Determine whether SA triggering occurs on different programs of the same machine;

[0016] If not, determine whether SA triggers are generated on the same program on different machines and whether each SA trigger is consistent.

[0017] Optionally, in the CDSEM measurement and monitoring method, it is determined whether an SA trigger occurs on different programs of the same machine.

[0018] If so, determine whether the SA triggers on different programs of the same machine are consistent; if they are not consistent, determine whether SA triggers are generated on the same program of different machines and whether the SA triggers are consistent.

[0019] Optionally, in the CDSEM measurement and monitoring method, it is determined whether the SA triggers on different programs of the same machine are consistent; if they are consistent, it is determined whether SA triggers are generated on the same program of different machines and whether the SA triggers are consistent.

[0020] Optionally, in the CDSEM measurement monitoring method, it is determined whether SA triggers occur at multiple different measurement points and whether each SA trigger is consistent; if not, it is determined to be a wafer problem.

[0021] Optionally, in the CDSEM measurement and monitoring method, when a wafer problem is identified, the triggering information of the SA trigger is output in the form of an offset map.

[0022] The present invention also provides a CDSEM measurement and monitoring system, the CDSEM measurement and monitoring system comprising:

[0023] The data unit is used to receive SA triggers generated by the machine and record the trigger information of the SA triggers; determine whether SA triggers are generated at multiple different measurement points and whether each SA trigger is consistent; if so, determine whether there are consistent SA triggers on different programs of the same machine and whether there are consistent SA triggers on the same program of different machines; if there are consistent SA triggers generated on different programs of the same machine and inconsistent SA triggers generated on the same program of different machines, then it is determined to be a machine problem.

[0024] Optionally, in the CDSEM measurement and monitoring system, if different programs on the same machine do not generate consistent SA triggers, while the same program on different machines generates consistent SA triggers, then it is determined to be a program problem.

[0025] Optionally, in the CDSEM measurement and monitoring system, the CDSEM measurement and monitoring system further includes:

[0026] The display unit is used to display the judgment result.

[0027] In the CDSEM measurement monitoring method and system provided by this invention, by receiving SA triggers generated by the machine and recording the trigger information of the SA triggers, it is determined whether SA triggers are generated at multiple different measurement points and whether each SA trigger is consistent. It is also determined whether there are consistent SA triggers on different programs of the same machine and whether there are consistent SA triggers on the same program of different machines. By monitoring the SA triggers, corresponding control can be performed, thereby reducing subsequent SA triggers, reducing measurement time, and improving machine productivity. Attached Figure Description

[0028] Figure 1 This is a flowchart illustrating the CDSEM measurement and monitoring method according to an embodiment of the present invention.

[0029] Figure 2This is a schematic diagram of the CDSEM measurement and monitoring system according to an embodiment of the present invention.

[0030] Figure 3 This is a schematic diagram of measurement points on a wafer according to an embodiment of the present invention.

[0031] The reference numerals in the attached figures are explained as follows:

[0032] 10 - Data unit; 20 - Display unit; 31 - First machine; 32 - Second machine.

[0033] 100 - Wafer; 101, 102, 103, 104, 105 - Measurement points. Detailed Implementation

[0034] The CDSEM measurement and monitoring method and system proposed in this invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of this invention will become clearer from the following description. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of this invention.

[0035] The terminology used in this invention is for the purpose of describing particular embodiments only and is not intended to limit the invention. Unless otherwise defined in this application, the technical or scientific terms used in this invention should be understood in their ordinary sense by one of ordinary skill in the art to which this invention pertains. The terms "first," "second," and similar terms used in this specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, "a" or "one," and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. "A plurality" or "several" indicates two or more. Unless otherwise indicated, terms such as "upper / upper layer," "lower / lower layer," and similar terms are for ease of description only and are not limited to a location or spatial orientation. Terms such as "comprising" or "including" mean that the element or object preceding "comprising" covers the element or object listed following "comprising" or "including" and its equivalents, and does not exclude other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections and can include electrical connections, whether direct or indirect. The singular forms “a,” “the,” and “the” used in this specification and appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0036] During measurement, CDSEM equipment frequently experiences coordinate offset issues due to various factors. When this occurs, the equipment triggers a Search Around (SA) operation, performing a search around the current location to locate the measurement target and continue measurement. This process is automatically completed within the CDSEM equipment and usually requires no external intervention; therefore, current technology lacks control measures for this type of problem. However, performing SA around the current location leads to excessively long measurement times, severely impacting equipment throughput. In particular, SA triggers caused by certain reasons can occur repeatedly, resulting in a significant deterioration in both measurement time and equipment throughput.

[0037] The core idea of ​​this application is to provide a CDSEM measurement monitoring method and system. By receiving SA triggers generated by the machine and recording the trigger information of the SA triggers, it can determine whether SA triggers are generated at multiple different measurement points and whether each SA trigger is consistent. It can also determine whether there are consistent SA triggers on different programs of the same machine and whether there are consistent SA triggers on the same program of different machines, so as to monitor the SA triggers and perform corresponding control. This can reduce subsequent SA triggers, thereby reducing measurement time and improving machine productivity.

[0038] In some embodiments of this application, it is determined whether SA triggers are generated at multiple different measurement points and whether each SA trigger is consistent; if so, it is determined whether there are consistent SA triggers on different programs of the same machine and whether there are consistent SA triggers on the same program of different machines; if there are consistent SA triggers generated on different programs of the same machine and inconsistent SA triggers are not generated on the same program of different machines, it is determined to be a machine problem.

[0039] Correspondingly, adjustments can be made to the machines identified as having problems, such as adjusting the machine's movement stage to match the CDSEM measurement program, thereby preventing subsequent SA-like triggering and reducing measurement time, thus increasing machine productivity.

[0040] In some embodiments of this application, it is determined whether SA triggers are generated at multiple different measurement points and whether each SA trigger is consistent; if so, it is determined whether there are consistent SA triggers on different programs of the same machine and whether there are consistent SA triggers on the same program of different machines; if there are inconsistent SA triggers generated on different programs of the same machine and consistent SA triggers generated on the same program of different machines, it is determined to be a program problem.

[0041] Correspondingly, programs identified as problematic can be adjusted to prevent similar SA triggers from occurring in the future, thereby reducing measurement time and increasing machine capacity.

[0042] Please refer to Figure 1 This is a flowchart illustrating a CDSEM measurement and monitoring method according to an embodiment of the present invention. Figure 1 As shown, in one embodiment of this application, the CDSEM measurement and monitoring method includes:

[0043] Execute step S10: Receive the SA trigger generated by the receiver and record the trigger information of the SA trigger;

[0044] Execute step S20: Determine whether SA triggers are generated at multiple different measurement points and whether each SA trigger is consistent;

[0045] If so, proceed to step S30: determine whether there is a consistent SA trigger on different programs of the same machine and whether there is a consistent SA trigger on the same program of different machines.

[0046] If consistent SA triggers are generated on different programs of the same machine, but inconsistent SA triggers are not generated on the same programs of different machines, proceed to step S40: determine that it is a machine problem.

[0047] If different programs on the same machine do not generate consistent SA triggers, while the same programs on different machines generate consistent SA triggers, proceed to step S50: determine it as a program problem.

[0048] Accordingly, this application also provides a CDSEM measurement and monitoring system, please refer to... Figure 2 This is a schematic diagram of the structure of a CDSEM measurement and monitoring system according to an embodiment of the present invention. Figure 2 As shown, the CDSEM measurement and monitoring system includes:

[0049] Data unit 10 is used to receive SA triggers generated by the equipment and record the trigger information of the SA triggers; determine whether SA triggers are generated at multiple different measurement points and whether each SA trigger is consistent; if so, determine whether there are consistent SA triggers on different programs of the same equipment and whether there are consistent SA triggers on the same program of different equipment; if there are consistent SA triggers generated on different programs of the same equipment but not on the same program of different equipment, then it is determined to be a equipment problem. If there are not consistent SA triggers generated on different programs of the same equipment but consistent SA triggers generated on the same program of different equipment, then it is determined to be a program problem.

[0050] In some embodiments of this application, the CDSEM measurement and monitoring system further includes a display unit 20, which is used to display the judgment result. For example, when the judgment is a machine problem, the display unit 20 can display the corresponding machine problem; when the judgment is a program problem, the display unit 20 can display the corresponding program problem.

[0051] In some embodiments of this application, a semiconductor manufacturing plant has multiple CDSEM machines. For example, there may be two CDSEM machines, namely a first machine 31 and a second machine 32, both of which are signal-connected to the data unit 10. The first machine 31 and the second machine 32 can be wired or wirelessly connected to the data unit 10. When the first machine 31 and / or the second machine 32 generates an SA trigger, the trigger information of the SA trigger can be provided to the data unit 10. The data unit 10 receives the SA trigger and records the trigger information.

[0052] In this embodiment, each CDSEM instrument typically has multiple programs executing CDSEM measurements. For example, both the first instrument 31 and the second instrument 32 can run a first program and a second program. When a CDSEM instrument generates an SA trigger and finds the measurement target through surrounding search, it sends the SA trigger and corresponding trigger information to the data unit 10. This may include the instrument that generated the SA trigger, the program, and the offset direction and offset amount of the SA trigger.

[0053] For example, the first program of the first machine 31 generates an SA trigger and obtains the corresponding offset direction and offset amount. The first machine 31 sends the SA trigger and its trigger information to the data unit 10. The data unit 10 records the trigger information of the SA trigger, including the fact that the SA trigger was generated by the first program of the first machine 31 and its offset direction and offset amount.

[0054] In some embodiments of this application, after receiving an SA trigger, the data unit 10 determines whether an SA trigger occurs at multiple different measurement points and whether each SA trigger is consistent. Please refer to... Figure 3 This is a schematic diagram of measurement points on a wafer according to an embodiment of the present invention. Figure 3 As shown, five measurement points are schematically shown on wafer 100, namely measurement point 101, measurement point 102, measurement point 103, measurement point 104 and measurement point 105.

[0055] In this embodiment, after receiving the SA trigger, the data unit 10 executes step S21: determining whether an SA trigger occurred at all measurement points, i.e., whether a trigger occurred at measurement points 101, 102, 103, 104, and 105. If an SA trigger occurred at all measurement points, step S22 is further executed: determining whether the SA triggers at each measurement point are consistent. In this embodiment, determining whether the SA triggers at each measurement point are consistent includes determining whether the offset direction and offset amount of each SA trigger are the same. Wherein, the same offset direction means that multiple offset directions are within the same offset direction range, i.e., they are considered to have the same offset direction. The same offset direction range can be the measurement accuracy of the CDSEM instrument; for example, an offset direction within ±3° is considered to be within the same offset direction range. The same offset amount means that multiple offset amounts are within the same offset amount range, i.e., they are considered to have the same offset amount. The same offset amount range can be the measurement accuracy of the CDSEM instrument; for example, an offset amount within ±5nm is considered to be within the same offset range.

[0056] In this embodiment, each time the data unit 10 receives an SA trigger, it can determine whether the newly received SA trigger occurs at multiple different measurement points and whether the SA triggers are consistent, and record the corresponding determination results. This facilitates subsequent determination and processing when receiving SA triggers in the future.

[0057] In some embodiments of this application, the data unit 10 may include, for example, a storage unit and a processing unit, to record the received SA trigger information and to determine whether the SA trigger is consistent at different measurement points.

[0058] After generating SA triggers at multiple different measurement points and ensuring consistency among the SA triggers, step S30 is then executed: determining whether there are consistent SA triggers on different programs of the same machine and whether there are consistent SA triggers on the same program of different machines.

[0059] In this embodiment, step S31 is executed first: determining whether there are consistent SA triggers on different programs of the same machine. In some embodiments of this application, specifically, step S310 is executed first: determining whether SA triggers are generated on different programs of the same machine; if so, step S311 is executed: determining whether the SA triggers on different programs of the same machine are consistent.

[0060] Here, it is determined whether an SA trigger is generated in the second program of the first machine tool 31. If so, it is further determined whether the SA trigger in the second program of the first machine tool 31 is consistent with the SA trigger in the first program of the first machine tool 31. This includes determining whether the offset direction and offset amount are the same. The concept of whether the offset direction and offset amount are the same is described above. Here, they can be considered the same if they are within the same offset range.

[0061] In some embodiments of this application, after determining that consistent SA triggers exist on different programs of the same machine, step S32 is then executed: determining whether SA triggers are generated on the same program of different machines and whether each SA trigger is consistent. In this embodiment, it is determined whether an SA trigger is generated on the first program of the second machine 32 and whether each SA trigger is consistent. If not, that is, there are consistent SA triggers generated on different programs of the same machine and inconsistent SA triggers are not generated on the same program of different machines, in this embodiment, it is determined to be a machine problem, and step S40 is executed: determining that it is a machine problem. The display unit 20 can display that the first machine 31 has a problem, so that technicians can perform corresponding repairs and handling.

[0062] In some embodiments of this application, if the first program of the second machine 32 generates an SA trigger and obtains the corresponding offset direction and offset amount, the second machine 32 sends the SA trigger and its trigger information to the data unit 10. The data unit 10 records the trigger information of the SA trigger, including the fact that the SA trigger was generated by the first program of the second machine 32 and its offset direction and offset amount.

[0063] In this embodiment, after receiving and recording the SA trigger and its trigger information generated by the second instrument 32, the data unit 10 determines whether an SA trigger occurs at multiple different measurement points and whether each SA trigger is consistent. That is, similar to receiving the SA trigger generated by the first instrument 31, it determines whether an SA trigger occurs at all measurement points, and if an SA trigger occurs at all measurement points, it further determines whether the SA triggers at each measurement point are consistent. Here, it still uses... Figure 3 Taking the wafer 100 shown as an example, it is determined whether triggering occurred at measurement points 101, 102, 103, 104, and 105. If SA triggering occurred at all measurement points, it is determined whether the offset direction and offset amount of each SA trigger are the same. In this embodiment, after receiving and recording the SA triggering and its triggering information generated by the second instrument 32, it is first determined whether there is consistency at multiple different measurement points.

[0064] After determining that SA triggers are generated at multiple different measurement points and that each SA trigger is consistent, the next step is to determine whether there are consistent SA triggers on different programs of the same machine and whether there are consistent SA triggers on the same program of different machines.

[0065] Similar to the previous steps, first execute step S31: determine whether there are consistent SA triggers on different programs of the same machine. Specifically, first execute step S310: determine whether SA triggers are generated on different programs of the same machine; if so, execute step S311: determine whether the SA triggers on different programs of the same machine are consistent. Here, determine whether there are SA triggers generated on the second program of the second machine 32; if so, further determine whether the SA triggers on the second program of the second machine 32 are consistent with the SA triggers on the first program of the second machine 32, including determining whether the offset direction and offset amount are the same.

[0066] If not, meaning there are no consistent SA triggers on different programs of the same machine, in this embodiment, step S32 is executed: determining whether SA triggers are generated on the same program of different machines and whether each SA trigger is consistent. Specifically, in this embodiment, step S310 is executed: determining whether SA triggers are generated on different programs of the same machine; if not, step S32 is executed: determining whether SA triggers are generated on the same program of different machines and whether each SA trigger is consistent. Step S311 is executed: determining whether each SA trigger on different programs of the same machine is consistent; if not, it also proceeds to step S32: determining whether SA triggers are generated on the same program of different machines and whether each SA trigger is consistent.

[0067] In this embodiment of the application, after performing step S31: determining whether there are consistent SA triggers on different programs of the same machine, step S32: determining whether SA triggers are generated on the same program of different machines and whether each SA trigger is consistent.

[0068] If consistent SA triggers are generated on different programs of the same machine, but inconsistent SA triggers are not generated on the same program of different machines, then it is determined to be a machine problem, i.e., step S40 is executed: determined to be a machine problem; if inconsistent SA triggers are not generated on different programs of the same machine, but consistent SA triggers are generated on the same program of different machines, then it is determined to be a program problem, i.e., step S50 is executed: determined to be a program problem.

[0069] For example, in some embodiments of this application, step S31 is executed: determining whether there are consistent SA triggers on different programs of the same machine; if not, step S32 is executed: determining whether SA triggers are generated on the same program of different machines and whether each SA trigger is consistent. Here, the data unit 10 compares the received SA triggers generated by the first program of the second machine 32 and their trigger information with the recorded SA triggers generated by the first program of the first machine 31 and their trigger information. If the two are consistent, that is, the offset direction and offset amount of the SA triggers generated by the first program of the second machine 32 are the same as the offset direction and offset amount of the SA triggers generated by the first program of the first machine 31, then it is determined to be a program problem. The display unit 20 can display that the first program has a problem so that technicians can handle it accordingly. For example, the settings of the first program can be directly adjusted to better suit the operation of each CDSEM machine, thereby reducing subsequent SA triggers, thus reducing measurement time and increasing machine productivity. In some embodiments of this application, when displaying the judgment result, including machine problems or program problems, the display unit 20 can also display corresponding trigger information, including offset direction and / or offset amount, so that technicians can perform corresponding processing more quickly and accurately.

[0070] In some embodiments of this application, step S20 is executed: determining whether SA triggers occur at multiple different measurement points and whether each SA trigger is consistent; if not, step S60 is executed: determining it is a wafer problem. In this embodiment of the application, step S21 is first executed: determining whether SA triggers occur at all measurement points; if not, step S60 is executed: determining it is a wafer problem. If yes, that is, SA triggers occur at all measurement points, step S22 is further executed: determining whether the SA triggers at each measurement point are consistent; if not, step S60 is executed: determining it is a wafer problem. The display unit 20 can display the determination result: wafer problem. In some embodiments of this application, the display unit 20 can also output the trigger information of the SA trigger in the form of an offset map. The SA triggers caused by wafer problems often have more chaotic offset directions and offset amounts. In this embodiment of the application, outputting the trigger information of the SA trigger in the form of an offset map can more clearly show the trigger information of the SA trigger, including the offset direction and / or offset amount, so that technicians can understand the situation of the SA trigger and handle it more quickly and accurately.

[0071] In other embodiments of this application, there may be more CDSEM machines in the factory, and each CDSEM machine may have more programs. The core remains the same: after receiving SA triggers generated by the machine and recording the trigger information of the SA triggers, it is determined whether SA triggers occur at multiple different measurement points and whether each SA trigger is consistent. If so, it is determined whether there are consistent SA triggers on different programs of the same machine and whether there are consistent SA triggers on the same program of different machines. If there are consistent SA triggers on different programs of the same machine but not on the same program of different machines, it is determined to be a machine problem. If there are not consistent SA triggers on different programs of the same machine but consistent SA triggers on the same program of different machines, it is determined to be a program problem. Therefore, consistent SA triggers on the machine or in the program can be detected in a timely manner, allowing for corresponding control measures, thereby reducing subsequent SA triggers, reducing measurement time, and increasing machine productivity.

[0072] In this application, references to "one embodiment" or "some embodiments" mean that a feature, structure, or characteristic described in connection with that embodiment is included in at least one embodiment or at least some embodiments of this application. Therefore, the appearance of the phrases "in one embodiment" or "in some embodiments" throughout this application does not necessarily refer to the same or the same embodiments. Furthermore, in one or more embodiments, features, structures, or characteristics can be combined in any suitable combination and / or sub-combination.

[0073] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and not for limiting the scope of this application. The embodiments of this application can be combined in any way without departing from the spirit and scope of this application. Those skilled in the art should also understand that various modifications can be made to the embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.

Claims

1. A CDSEM measurement and monitoring method, characterized in that, The CDSEM measurement and monitoring method includes: The receiver generates an SA trigger and records the trigger information of the SA trigger; Determine whether SA triggers occur at multiple different measurement points and whether each SA trigger is consistent; If so, determine whether there are consistent SA triggers on different programs of the same machine and whether there are consistent SA triggers on the same program of different machines; if there are consistent SA triggers on different programs of the same machine and inconsistent SA triggers on the same program of different machines, then it is determined to be a machine problem.

2. The CDSEM measurement and monitoring method as described in claim 1, characterized in that, If different programs on the same machine do not generate consistent SA triggers, while the same program on different machines generates consistent SA triggers, then it is determined to be a program problem.

3. The CDSEM measurement and monitoring method as described in claim 1, characterized in that, Determining whether SA triggers occur at multiple different measurement points and whether the SA triggers are consistent includes: Determine whether SA triggering occurs at multiple different measurement points; If so, determine whether the offset direction and offset amount triggered by each SA at multiple different measurement points are the same.

4. The CDSEM measurement and monitoring method as described in any one of claims 1 to 3, characterized in that, Determining whether there are consistent SA triggers on different programs of the same machine and whether there are consistent SA triggers on the same program of different machines includes: Determine whether SA triggering occurs on different programs of the same machine; If not, determine whether SA triggers are generated on the same program on different machines and whether each SA trigger is consistent.

5. The CDSEM measurement and monitoring method as described in claim 4, characterized in that, Determine whether SA triggering occurs on different programs of the same machine; If so, determine whether the SA triggers on different programs of the same machine are consistent; if they are not consistent, determine whether SA triggers are generated on the same program of different machines and whether the SA triggers are consistent.

6. The CDSEM measurement and monitoring method as described in claim 5, characterized in that, Determine whether the SA triggers on different programs of the same machine are consistent; if they are consistent, determine whether SA triggers are generated on the same program of different machines and whether the SA triggers are consistent.

7. The CDSEM measurement and monitoring method as described in any one of claims 1 to 3, characterized in that, Determine whether SA triggers occur at multiple different measurement points and whether each SA trigger is consistent; if not, then it is determined to be a wafer problem.

8. The CDSEM measurement and monitoring method as described in claim 7, characterized in that, When the problem is determined to be a wafer issue, the triggering information of the SA is output in the form of an offset map.

9. A CDSEM measurement and monitoring system, characterized in that, The CDSEM measurement and monitoring system includes: The data unit is used to receive SA triggers generated by the machine and record the trigger information of the SA triggers; determine whether SA triggers are generated at multiple different measurement points and whether each SA trigger is consistent; if so, determine whether there are consistent SA triggers on different programs of the same machine and whether there are consistent SA triggers on the same program of different machines; if there are consistent SA triggers generated on different programs of the same machine and inconsistent SA triggers generated on the same program of different machines, then it is determined to be a machine problem.

10. The CDSEM measurement and monitoring system as described in claim 9, characterized in that, If different programs on the same machine do not generate consistent SA triggers, while the same program on different machines generates consistent SA triggers, then it is determined to be a program problem.

11. The CDSEM measurement and monitoring system as described in claim 9 or 10, characterized in that, The CDSEM measurement and monitoring system also includes: The display unit is used to display the judgment result.

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