Inspection system, semiconductor manufacturing apparatus, and inspection method

Abstract

The inspection system includes a table, a camera, a first movement mechanism, a second movement mechanism, and a control unit. The control unit controls the camera, the first moving mechanism, and the second moving mechanism, respectively, to generate a plurality of first partial image data representing mutually different portions of the electronic component, respectively. The control unit executes a first process of performing, for each of the plurality of pieces of first partial image data, a correction taking into account an inclination of the camera with respect to the first axis and a correction taking into account a difference between an angle formed by the first axis and the second axis and a reference angle. A second process of generating composite image data by compositing the corrected plurality of first partial image data; and a third process of inspecting the electronic component based on the composite image data.

Description

Technical Field

[0001] This invention relates to inspection systems, semiconductor manufacturing apparatus, and inspection methods. Background Technology

[0002] Japanese Patent Application Publication No. 2023-076250 (Patent Document 1) discloses an inspection system for inspecting objects based on photographed images of the objects to be inspected. In this inspection system, for example, four objects to be inspected are included in a single photographed image (see Patent Document 1).

[0003] Existing technical documents Patent documents Patent Document 1: Japanese Patent Application Publication No. 2023-076250 When the electronic component being inspected is large, it may be impossible to capture the entire component within the camera's field of view. Patent Document 1 does not disclose a method for inspecting electronic components that cannot be fully captured by the camera. Summary of the Invention

[0004] The present invention was made to solve such a problem, and its purpose is to provide an inspection system, semiconductor manufacturing apparatus and inspection method that can inspect electronic components of a size that cannot be fully captured in the field of view of a camera with relatively high precision.

[0005] An inspection system according to one aspect of the present invention includes a worktable, a camera, a first moving mechanism, a second moving mechanism, and a control unit. The worktable holds an electronic component. The camera captures a portion of the electronic component, generating first partial image data. The first moving mechanism moves at least one of the worktable and the camera to change the relative positional relationship between the electronic component and the camera on a first axis. The second moving mechanism moves at least one of the worktable and the camera to change the relative positional relationship between the electronic component and the camera on a second axis. The control unit controls the camera, the first moving mechanism, and the second moving mechanism respectively to generate a plurality of first partial image data, each representing a different portion of the electronic component. The control unit performs the following processes: a first process considering corrections for the tilt of the camera relative to the first axis and corrections considering the difference between the angle formed by the first axis and the second axis and a reference angle for each of the plurality of first partial image data; a second process generating composite image data by synthesizing the corrected plurality of first partial image data; and a third process inspecting the electronic component based on the composite image data.

[0006] According to another aspect of the present invention, a semiconductor manufacturing apparatus includes the aforementioned inspection system and manufacturing system. The manufacturing system manufactures electronic components. The electronic components are semiconductor devices. The inspection system inspects the electronic components manufactured by the manufacturing system.

[0007] According to another aspect of the invention, an inspection method utilizes an inspection system. The inspection system includes a worktable, a camera, a first moving mechanism, and a second moving mechanism. The worktable holds an electronic component. The camera captures a portion of the electronic component, generating first partial image data. The first moving mechanism moves at least one of the worktable and the camera to change the relative positional relationship between the electronic component and the camera on a first axis. The second moving mechanism moves at least one of the worktable and the camera to change the relative positional relationship between the electronic component and the camera on a second axis. The inspection method includes: generating a plurality of partial image data representing mutually different portions of the electronic component; performing a correction on each of the plurality of partial image data that takes into account the camera's tilt relative to the first axis and the difference between the angle formed by the first axis and the second axis and a reference angle; generating composite image data by synthesizing the corrected plurality of partial image data; and inspecting the electronic component based on the composite image data.

[0008] Invention Effects According to the present invention, an inspection system, semiconductor manufacturing apparatus, and inspection method are provided that can inspect electronic components of a size that cannot be fully captured by a camera with relatively high precision. Attached Figure Description

[0009] Figure 1 It is a schematic top view of the cutting device.

[0010] Figure 2 It is a schematic diagram showing a cross-section including the lighting section.

[0011] Figure 3 It is a diagram that schematically represents the hardware structure of a computer.

[0012] Figure 4 This diagram illustrates the problem arising from synthesizing unprocessed partial image data when the second optical inspection camera is tilted about the Z-axis relative to the inspection stage.

[0013] Figure 5 This diagram illustrates the problem arising from synthesizing unprocessed partial image data when a rectangular subject is photographed as a trapezoid.

[0014] Figure 6 This diagram illustrates the problem arising from the synthesis of unprocessed partial image data when the movement direction of the second optical inspection camera deviates from the Y-axis.

[0015] Figure 7 This is a flowchart showing the calibration sequence in the cutting device.

[0016] Figure 8 This is a diagram used to illustrate tilting about the X-axis.

[0017] Figure 9 It is a schematic diagram representing the plane of the calibration plate.

[0018] Figure 10 This is a diagram illustrating the general outline of the adjustment for tilting around the X-axis.

[0019] Figure 11 It is shown in Figure 7 The flowchart shows the process performed in step S100.

[0020] Figure 12 This is a diagram used to illustrate the distance between small dots in the captured images of the calibration plate.

[0021] Figure 13 It is a graph containing an example of a table showing the distances between points in five captured images.

[0022] Figure 14 It is a diagram used to illustrate the outline of an imaginary plane.

[0023] Figure 15 It is a diagram used to illustrate the generation sequence of an imaginary plane.

[0024] Figure 16 It is shown in Figure 7 The flowchart shows the process performed in step S110.

[0025] Figure 17 It is shown in Figure 7 The flowchart shows the process performed in step S120.

[0026] Figure 18 This is a diagram used to illustrate the summary of the correction of distortion aberrations.

[0027] Figure 19 It is shown in Figure 17 The flowchart shows the process performed in step S400.

[0028] Figure 20 This is a diagram illustrating the general principles of rotational correction when a portion of an image is tilted relative to the X-axis.

[0029] Figure 21 This is a diagram used to illustrate the calculation sequence of the tilt of the second optical inspection camera relative to the X-axis and about the Z-axis.

[0030] Figure 22 It is shown in Figure 17 The flowchart shows the process performed in step S410.

[0031] Figure 23 This is a diagram illustrating the trapezoidal correction when a rectangular subject is photographed as a trapezoid.

[0032] Figure 24 It is shown in Figure 17 The flowchart shows the process performed in step S420.

[0033] Figure 25 This is a diagram illustrating the outline of axis angle correction when the movement direction of the second optical inspection camera deviates from the Y-axis.

[0034] Figure 26 This is a diagram illustrating the calculation sequence of the tilt of the movement direction of the second optical inspection camera relative to the Y-axis.

[0035] Figure 27 It is shown in Figure 17 The flowchart shows the process performed in step S430.

[0036] Figure 28 This is a flowchart illustrating the inspection sequence for electronic components that cannot be fully captured within the field of view of the second optical inspection camera. Detailed Implementation

[0037] Hereinafter, an embodiment of one aspect of the present invention (hereinafter also referred to as "this embodiment") will be described in detail using the accompanying drawings. Furthermore, the same or equivalent parts in the drawings will be labeled with the same symbols, and their descriptions will not be repeated. Additionally, for ease of understanding, objects are appropriately omitted or exaggerated in the drawings, and depicted schematically. In the drawings, the X-axis and Y-axis are orthogonal to each other, the X-axis and Z-axis are orthogonal to each other, and the Y-axis and Z-axis are orthogonal to each other.

[0038] [1. Structure] <1-1. Overall Structure of the Cutting Device> Figure 1 This is a schematic top view of the cutting apparatus 1 according to this embodiment. The cutting apparatus 1 is configured to monolithize a packaging substrate (the object to be cut) into multiple electronic components (packaging components) by cutting the packaging substrate. In the packaging substrate, a substrate or lead frame on which a semiconductor chip is mounted is sealed with resin. In addition, the object to be cut is not necessarily the packaging substrate; for example, it may be a substrate that is not sealed with resin (including a wafer). The substrate monolithized by cutting the substrate that is not sealed with resin is also included in the "electronic components".

[0039] Examples of packaging substrates include BGA (Ball Grid Array) packaging substrates, LGA (Land Grid Array) packaging substrates, CSP (Chip Size Package) packaging substrates, LED (Light Emitting Diode) packaging substrates, and QFN (Quad Flat No-leaded) packaging substrates.

[0040] Furthermore, the cutting device 1 is configured to inspect multiple monolithically mounted electronic components separately. In the cutting device 1, images of each electronic component are captured, and inspections are performed based on these images. Inspection data is generated from this inspection, classifying each electronic component as either "good" or "defective." The cutting device 1 is particularly effective in inspecting electronic components that cannot be fully captured in a single image. The specific inspection sequence will be explained later.

[0041] In this example, a packaging substrate P1 is used as the object to be cut, and the cutting device 1 monolithically divides the packaging substrate P1 into multiple electronic components S1. Hereinafter, the surface of the packaging substrate P1 that is sealed with resin is referred to as the molding surface, and the surface opposite to the molding surface is referred to as the ball / lead surface. In addition, when the object to be cut is a substrate that is not sealed with resin, the surface facing upward during cutting (the cutting surface) corresponds to the ball / lead surface in this embodiment, and the surface opposite to the cutting surface corresponds to the molding surface in this embodiment.

[0042] like Figure 1 As shown, the cutting device 1 includes a cutting module A1 and an inspection / storage module B1 as components. The cutting module A1 is configured to manufacture multiple electronic components S1 by cutting the packaging substrate P1. The inspection / storage module B1 is configured to inspect each of the manufactured electronic components S1 and then store the electronic components S1 in a tray. In the cutting device 1, each component is detachable and replaceable relative to the other components.

[0043] The cutting module A1 mainly includes a substrate supply unit 3, a positioning unit 4, a cutting worktable 5, a spindle unit 6, and a conveying unit 7.

[0044] The substrate supply unit 3 supplies the packaging substrates P1 one by one to the positioning unit 4 by ejecting the packaging substrates P1 one by one from the cassette M1 that contains multiple packaging substrates P1. At this time, the packaging substrates P1 are configured with the ball / lead surface facing upward.

[0045] The positioning unit 4 positions the packaging substrate P1, which is pushed out from the substrate supply unit 3, on the track unit 4a. Afterward, the positioning unit 4 transports the positioned packaging substrate P1 to the cutting table 5.

[0046] The cutting stage 5 holds the packaged substrate P to be cut. In this example, a cutting device 1 with a double cutting stage structure having two cutting stages 5 is illustrated. The cutting stage 5 includes a holding member 5a, a rotating mechanism 5b, and a moving mechanism 5c. The holding member 5a holds the packaged substrate P1 by adsorbing it from below, which is conveyed by the positioning part 4. The rotating mechanism 5b enables the holding member 5a to rotate in the θ1 direction shown in the figure (i.e., in...). Figure 1 (Rotation on the horizontal plane of XY). The moving mechanism 5c enables the holding component 5a to move along the Y-axis in the figure.

[0047] The spindle portion 6 cuts through the package substrate P1, monolithically dividing the package substrate P1 into multiple electronic components S1. In this example, a cutting device 1 with a dual-spindle structure having two spindle portions 6 is illustrated. The spindle portions 6 are movable along the X-axis and Z-axis shown in the figure. Alternatively, the cutting device 1 can also be a single-spindle structure having one spindle portion 6.

[0048] The spindle portion 6 includes a blade 6a and a rotating shaft 6c. The blade 6a, through high-speed rotation, cuts the packaging substrate P1, monolithically dividing the packaging substrate P1 into multiple electronic components S1. The blade 6a is mounted on the rotating shaft 6c in a state where it is held by a first flange and a second flange (not shown). The first flange and the second flange are fixed to the rotating shaft 6c by fastening components (not shown) such as nuts. The first flange is also referred to as the inner flange, and the second flange is also referred to as the outer flange.

[0049] The spindle section 6 is equipped with nozzles for cutting water, cooling water, and cleaning water (none shown). The cutting water nozzles spray cutting water onto the high-speed rotating cutting tool 6a. The cooling water nozzles spray cooling water. The cleaning water nozzles spray cleaning water to remove chips and other debris.

[0050] After the cutting stage 5 picks up the packaging substrate P1, the first position confirmation camera 5d photographs the packaging substrate P1 to confirm its position. The confirmation using the first position confirmation camera 5d is, for example, confirming the position of a mark provided on the packaging substrate P1. This mark is, for example, a mark used to determine the cutting position of the packaging substrate P1.

[0051] Next, the cutting stage 5 moves along the Y-axis of the spindle portion 6 as shown in the figure. After the cutting stage 5 moves below the spindle portion 6, alignment is performed, and then the packaging substrate P1 is cut by moving the cutting stage 5 and the spindle portion 6 relative to each other. Each time the packaging substrate P1 is cut by the blade 6a of the spindle portion 6, the second position confirmation camera 6b provided with the spindle portion 6 captures and confirms the position of the package substrate P1 being cut. The confirmation using the second position confirmation camera 6b is, for example, the confirmation of the cut position and the width of the cut on the package substrate P1.

[0052] After the packaging substrate P1 is cut, the cutting stage 5 moves away from the mandrel portion 6 along the Y-axis in the figure, while adsorbing multiple monolithized electronic components S1. During this movement, the upper surface (ball / lead surface) of the electronic components S1 is cleaned and dried by the first cleaner 5e.

[0053] The conveying unit 7 picks up the electronic component S1 held by the cutting worktable 5 from above and transports the electronic component S1 to the inspection worktable 11 of the inspection / storage module B1. During this transport process, the lower surface (molded surface) of the electronic component S1 is cleaned and dried by the second cleaner 7a.

[0054] The inspection / storage module B1 mainly includes an inspection workbench 11, a first optical inspection camera 12, a second optical inspection camera 13, an illumination unit 16, an illumination unit 17, a placement unit 14, and an extraction unit 15. Alternatively, the first optical inspection camera 12 can also be mounted on the cutting module A1.

[0055] The inspection table 11 holds the electronic component S1 for optical inspection. The inspection table 11 is movable along the X-axis shown in the figure. Furthermore, the inspection table 11 is tiltable. A holding member is provided on the inspection table 11 to hold the electronic component S1 by adsorbing it. The surface of the inspection table 11 that holds the electronic component S1 is, for example, made of black rubber. However, the color of the rubber does not need to be black; for example, it could be white.

[0056] The first optical inspection camera 12 and the second optical inspection camera 13 respectively capture images of the molded surface and the ball / pin surface of the electronic component S1. Various inspections of the electronic component S1 are performed based on the images (image data) generated by the first optical inspection camera 12 and the second optical inspection camera 13. The first optical inspection camera 12 and the second optical inspection camera 13 are respectively configured to capture images from above near the inspection worktable 11. Each of the first optical inspection camera 12 and the second optical inspection camera 13 can move along the Y-axis in the figure. Details will be described later; the direction of movement of the first optical inspection camera 12 and the second optical inspection camera 13 is sometimes not exactly parallel to the Y-axis. The images generated by the first optical inspection camera 12 and the second optical inspection camera 13 are, for example, grayscale (256 gray levels) images.

[0057] The first optical inspection camera 12 captures the molded surface of the electronic component S1, which is conveyed from the transport unit 7 to the inspection table 11. Then, the transport unit 7 places the electronic component S1 onto the holding member of the inspection table 11. The inspection table 11 flips up and down after holding the electronic component S1. The inspection table 11 moves upwards towards the second optical inspection camera 13, which captures the ball / pin surface of the electronic component S1.

[0058] An illumination unit 16 is provided above the first optical inspection camera 12, and an illumination unit 17 is provided above the second optical inspection camera 13. Each illumination unit 16 and illumination unit 17 is, for example, composed of so-called coaxial illumination and / or dome-shaped illumination. The illumination unit 16 is configured to illuminate the electronic components S1 on the inspection table 11 when inspection is performed using the first optical inspection camera 12. The illumination unit 17 is configured to illuminate the electronic components S1 on the inspection table 11 when inspection is performed using the second optical inspection camera 13. The illumination units 16 and 17 have, for example, the same structure; therefore, the structure of the illumination unit 17 will be described representatively below.

[0059] Figure 2 This is a schematic cross-sectional view including the lighting section 17. (See diagram below.) Figure 2 As shown, during inspection by the second optical inspection camera 13, light emitted from the illumination unit 17 illuminates the electronic component S1. While the electronic component S1 is illuminated, the second optical inspection camera 13 generates an image of the electronic component S1. Based on this image, inspection of the electronic component S1 is performed.

[0060] The lighting unit 17 is a dome-shaped lighting structure, including a dome 17a and a plurality of LEDs 17b. Alternatively, the dome-shaped lighting can be a so-called dome-shaped lighting structure, but it is not necessarily required to be a dome-shaped lighting structure, as long as it includes a dome-shaped (umbrella-shaped) component and a plurality of light-emitting components (e.g., LEDs) disposed within that component. The dome 17a has a dome shape, and its shape is circular when viewed from above. Furthermore, a plurality of LEDs 17b are disposed on the inner surface of the dome 17a. In the lighting unit 17, a plurality of sections (Ch01 to Ch08) are formed from the radially inner side to the outer side of the dome 17a. The lighting unit 17 is a so-called multi-channel lighting structure capable of dimming each section individually. In each of the plurality of sections, a plurality of LEDs 17b are disposed at predetermined intervals along the circumference of the dome 17a.

[0061] Refer again Figure 1 The inspected electronic component S1 is placed in the placement unit 14. The placement unit 14 is movable along the Y-axis shown in the figure. The inspection worktable 11 places the inspected electronic component S1 in the placement unit 14.

[0062] The extraction unit 15 transfers the electronic components S1 disposed in the placement unit 14 to the tray. The electronic components S1 are classified as "good" or "defective" based on the inspection results using the first optical inspection camera 12 and the second optical inspection camera 13. Based on the classification results, the extraction unit 15 transfers each electronic component S1 to either a good product tray 15a or a defective product tray 15b. That is, good products are stored in the good product tray 15a, and defective products are stored in the defective product tray 15b. Each good product tray 15a and defective product tray 15b is replaced with a new tray when it is full of electronic components S1.

[0063] The cutting device 1 also includes a computer 50 and a monitor 20. The monitor 20 is configured to display images. The monitor 20 is, for example, a display device such as a liquid crystal monitor or an organic EL (Electro Luminescence) monitor.

[0064] Computer 50 controls the operation of various parts of cutting module A1 and inspection / storage module B1, for example. Computer 50 controls the operation of, for example, substrate supply unit 3, positioning unit 4, cutting worktable 5, spindle unit 6, conveying unit 7, inspection worktable 11, first optical inspection camera 12, second optical inspection camera 13, illumination unit 16, illumination unit 17, configuration unit 14, extraction unit 15, and monitor 20.

[0065] Furthermore, the computer 50 performs various inspections of the electronic component S1, for example, based on image data generated by the first optical inspection camera 12 and the second optical inspection camera 13. Next, the computer 50 will be described in detail.

[0066] <1-2. Computer Hardware Structure> Figure 3 This is a schematic diagram illustrating the hardware structure of computer 50. For example... Figure 3 As shown, the computer 50 includes a control unit 70, an input / output (I / F) interface 90, a receiving unit 95, and a storage unit 80, all of which are electrically connected via a bus.

[0067] The control unit 70 includes a CPU (Central Processing Unit) 72, RAM (Random Access Memory) 74, and ROM (Read-Only Memory) 76, etc. The control unit 70 is configured to control the various components within the computer 50 and the various components within the cutting device 1 in response to information processing.

[0068] The input / output (I / F) 90 is configured to communicate with the various components included in the cutting device 1 via signal lines. The I / F 90 is used to send data from the computer 50 to the various components within the cutting device 1 and to receive data sent from the various components within the cutting device 1 to the computer 50. The receiving unit 95 is configured to receive instructions from the user. The receiving unit 95 may be, for example, part or all of a touch panel, keyboard, mouse, and microphone.

[0069] The storage unit 80 is, for example, an auxiliary storage device such as a hard disk drive or a solid-state drive. The storage unit 80 is configured, for example, as a storage control program 81. The control program 81 is executed by the control unit 70, thereby implementing various actions in the cutting-off device 1. When the control unit 70 executes the control program 81, the control program 81 is expanded in the RAM 74. Then, the control unit 70 controls each component by having the CPU 72 interpret and execute the control program 81 expanded in the RAM 74.

[0070] [2. Inspection of electronic components that cannot be fully captured by the camera] As described above, the electronic components are inspected in the cutting device 1. Specifically, various inspections of the electronic components S1 are performed based on the images (image data) generated by the first optical inspection camera 12 and the second optical inspection camera 13. Hereinafter, the inspection using the second optical inspection camera 13 will be described as representative. In addition, the same process is performed in the inspection using the first optical inspection camera 12.

[0071] Consider the following situation: the electronic components S1 held on the inspection table 11 are relatively large, and not all of them can be fully captured within the field of view (angle of view) of the second optical inspection camera 13. In this case, in the cutting device 1, the second optical inspection camera 13 generates multiple partial image data representing different parts of the electronic components S1, and then synthesizes these partial image data. By synthesizing the partial image data, a composite image data is generated. The composite image data represents an image of the electronic component S1 as a whole. In the cutting device 1, the electronic component S1 is inspected based on the composite image data.

[0072] Assuming that if unprocessed partial image data is synthesized, the image deviation at the boundary (seam) of the partial images may become larger. Examples of causes for this deviation include: distortion aberrations of the lens included in the second optical inspection camera 13; the tilt of the second optical inspection camera 13 relative to the inspection stage 11 (relative to the X-axis) about the Z-axis; the phenomenon that even after correcting for lens distortion aberrations and deviations caused by the tilt of the second optical inspection camera 13, the rectangular electronic component S1 is still photographed as trapezoidal; and the deviation of the movement direction of the second optical inspection camera 13 from the Y-axis.

[0073] Figure 4 This diagram illustrates a problem arising from the synthesis of unprocessed partial image data when the second optical inspection camera 13 is tilted about the Z-axis relative to the inspection stage 11. (Refer to...) Figure 4 With the second optical inspection camera 13 tilted relative to the inspection stage 11 about the Z-axis, it captures partial images tilted relative to the X-axis. Each of the partial images PI1, PI2, and PI3 represents, for example, a different part of the object being photographed. When the partial images PI1, PI2, and PI3 are combined, a composite image IM1 is generated. For example, in the composite image IM1, a line that originally extended along a straight line parallel to the X-axis becomes discontinuous at the boundary of the partial image.

[0074] Figure 5 This diagram illustrates the problem arising from synthesizing unprocessed partial image data when a rectangular subject is photographed as a trapezoid. (See reference...) Figure 5For example, even after correcting distortions caused by lens aberrations in the second optical inspection camera 13, a rectangular subject may still be captured as a trapezoid. In a partial image PI4, for example, a 100mm area is captured on the left and a 105mm area on the right. As a result, the rectangular subject is captured as a trapezoid. In this case, for example, when a partial image representing the left half of the subject and a partial image representing the right half of the subject are combined, a composite image IM2 is generated. In the composite image IM2, for example, a line that originally extended along a straight line becomes discontinuous at the boundary of the partial image.

[0075] Figure 6 This diagram illustrates a problem arising from the synthesis of unprocessed partial image data when the movement direction of the second optical inspection camera 13 deviates from the Y-axis. (See reference...) Figure 6 As described above, the direction of movement of the second optical inspection camera 13 is sometimes not perfectly parallel to the Y-axis. In such cases, for example, suppose partial images PI5, PI6, PI7, PI8, and PI9 are captured sequentially. Partial images PI5, PI6, PI7, PI8, and PI9 represent, for example, different parts of the photographed object. When partial images PI5, PI6, PI7, PI8, and PI9 are composited, a composite image IM3 is generated. In the composite image IM3, for example, a line that originally extended diagonally upward along a straight line becomes discontinuous at the boundary of the partial images.

[0076] Thus, if unprocessed partial image data is synthesized, the image deviation at the boundary portions between the partial images may become larger. In the cutting device 1, corrections are performed on each partial image data before synthesis. Specifically, after considering the correction for the tilt of the second optical inspection camera 13 relative to the X-axis and the correction for the difference between the angle formed by the axis corresponding to the direction of movement of the second optical inspection camera 13 and the X-axis and the reference angle (e.g., 90°) in each of the multiple partial image data, the multiple partial image data are synthesized. Since the synthesis of multiple partial image data is performed after various corrections are implemented, deviations that may occur at the boundary portions between the partial image data are suppressed in the synthesized image data. Therefore, according to the cutting device 1, the inspection of the electronic component S1 based on the synthesized image data can be performed with relatively high precision.

[0077] In the cutting device 1, partial image correction is performed using various correction data. These correction data are generated in advance through the calibration of the cutting device 1. In the cutting device 1, the electronic component S1 is inspected using the pre-generated correction data. The calibration and inspection operations will be described sequentially below.

[0078] [3. Action] <3-1. Calibration Action> Figure 7 This is a flowchart illustrating the calibration sequence in the cutting device 1. (Refer to...) Figure 7 The operator adjusts the tilt of the second optical inspection camera 13 (step S100). For example, the tilt of the second optical inspection camera 13 is adjusted so that the tilt of the second optical inspection camera 13 relative to the inspection table 11 about the X-axis (hereinafter also referred to as "tilt about the X-axis") and the tilt of the second optical inspection camera 13 relative to the inspection table 11 about the Y-axis (hereinafter also referred to as "tilt about the Y-axis") are close to 0° respectively.

[0079] Figure 8 This is a diagram used to illustrate tilting about the X-axis. (See reference...) Figure 8 In this example, the second optical inspection camera 13 is tilted about the X-axis relative to the inspection stage 11 by an angle θ1. A calibration plate is placed on the inspection stage 11 during tilt adjustment of the second optical inspection camera 13.

[0080] Figure 9 This is a schematic diagram showing the plane of calibration plate PL1. (e.g.) Figure 9 As shown, multiple small dots of the same size are arranged at equal intervals along the top, bottom, left, and right sides of the calibration plate PL1. In the cutting device 1, calibration is performed based on the shape of the small dots in the captured image.

[0081] Refer again Figure 8 In this example, the inspection table 11 is slightly warped rather than completely flat. In this case, the tilt about the X-axis changes as the second optical inspection camera 13 moves along the XY direction.

[0082] Figure 10 This is a diagram illustrating an overview of the adjustment for tilting around the X-axis. (Refer to...) Figure 10The left-hand diagram shows the tilt information AN1 for each shooting position before the X-axis tilt adjustment, and the right-hand diagram shows the tilt information AN1 for each shooting position after the X-axis tilt adjustment. Each tilt information AN1 represents the X-axis tilt at each shooting position. Each tilt information AN1 is calculated, for example, using various known methods based on the captured images. The X-axis tilt adjustment is performed by manually adjusting the tilt of the second optical inspection camera 13. For example, the tilt information AN1 for each shooting position is displayed on the monitor 20, and the operator adjusts the tilt of the second optical inspection camera 13 while checking the monitor 20. If it is determined that the X-axis tilt for each shooting position converges within the desired range, the operator ends the X-axis tilt adjustment. The operator may, for example, perform the Y-axis tilt adjustment in the same order as the X-axis tilt adjustment after the X-axis tilt adjustment is completed, or perform the Y-axis tilt adjustment in the same order as the X-axis tilt adjustment in parallel with the X-axis tilt adjustment.

[0083] Figure 11 It is shown in Figure 7 The flowchart describes the process performed in step S100. In the cutting device 1, multiple shooting positions (shooting locations) are predetermined for calibration. The shooting position (shooting location) refers to the position of the second optical inspection camera 13 on the XY plane. In this example, the tilt around the X-axis is adjusted first, and then the tilt around the Y-axis is adjusted. Since the adjustment steps for the tilt around the X-axis are largely the same as those for the tilt around the Y-axis, only the adjustment steps for the tilt around the X-axis will be described here.

[0084] Reference Figure 11 The control unit 70 controls the second optical inspection camera 13 to begin photographing the calibration plate PL1 held on the inspection table 11 (step S200). The control unit 70 controls at least one of the inspection table 11 and the second optical inspection camera 13 to move to a predetermined multiple photographing area that has not yet been photographed (step S210). The control unit 70 controls the second optical inspection camera 13 to perform autofocus (AF) (step S220). Autofocus is performed by adjusting the position of the second optical inspection camera 13 on the Z-axis. When the second optical inspection camera 13 is in focus, the control unit 70 obtains the coordinate information of the second optical inspection camera 13 on the Z-axis (step S230).

[0085] The control unit 70 determines whether the shooting of all predetermined shooting areas has ended (step S240). If it is determined that the shooting of all predetermined shooting areas has not ended ("No" in step S240), the control unit 70 executes the processing of step S210 again.

[0086] On the other hand, if it is determined that the shooting of all the predetermined shooting parts has ended ("Yes" in step S240), the control unit 70 determines whether the shooting of all shooting parts has been performed a predetermined number of times (step S250). When it is determined that the shooting of all shooting parts has not been performed a predetermined number of times ("No" in step S250), the control unit 70 executes the processing of step S200 again.

[0087] On the other hand, when it is determined that all shooting parts have been shot a predetermined number of times ("Yes" in step S250), the control unit 70 extracts the average shooting image of each shooting part and calculates the tilt of each shooting part around the X-axis based on the average shooting image (step S260). The calculation result is displayed on the monitor 20, for example.

[0088] Even when the calibration plate PL1 is photographed at the same shooting location, the positions of small dots in the captured images will slightly shift due to the structural accuracy of the inspection table 11 and the image processing accuracy of the second optical inspection camera 13. Taking this into account, a predetermined number of shots are taken at all shooting locations, and the tilt around the X-axis is calculated based on the average captured image. Furthermore, the distance between small dots in the captured images is used to determine which captured image corresponds to the average captured image.

[0089] Figure 12 This diagram illustrates the distances between small dots in the images captured by the calibration board PL1. (Refer to...) Figure 12 The distances between small points include the distance AD1 between small points DO1 in the X-axis direction and the distance BD1 between small points DO1 in the Y-axis direction. For example, the captured images whose distances AD1 and BD1 are closest to the average value are extracted as the average captured image.

[0090] Figure 13 This is a graph containing an example table showing the distances between points in five captured images. (See also...) Figure 13 In this example, among the images captured when n=3, the distances to AD1 and BD1 are closest to the average value. Therefore, the images captured when n=3 are extracted as the average captured images.

[0091] Refer again Figure 11 After the processing of step S260 is performed, the operator confirms the tilt around the X-axis of each shooting part displayed on the monitor 20 and determines whether the tilt around the X-axis of each shooting part meets the specified reference (step S270). When it is determined that the tilt around the X-axis of each shooting part meets the specified reference ("Yes" in step S270), the tilt adjustment of the second optical inspection camera 13 is completed.

[0092] On the other hand, if it is determined that the tilt around the X-axis of each imaging point does not meet the specified reference ("No" in step S270), the operator, for example, issues a readjustment instruction for the tilt of the second optical inspection camera 13 via the receiving unit 95 of the computer 50. When the readjustment instruction is issued, the control unit 70 controls the second optical inspection camera 13 to move to the point where the tilt around the X-axis is average among the multiple imaging points (step S280). Then, the operator manually adjusts the tilt around the X-axis of the second optical inspection camera 13 (step S290). After the manual adjustment is completed, the process of step S200 is executed again.

[0093] Refer again Figure 7 After the tilt adjustment of the second optical inspection camera 13 is completed, the control unit 70 of the computer 50 generates an imaginary plane based on the multiple partial image data generated by the second optical inspection camera 13 (step S110). The imaginary plane refers to the plane used to estimate the focus position (z) for each shooting position (x, y). The focus position refers to the position of the second optical inspection camera 13 on the Z-axis in the focused state.

[0094] Figure 14 This is a diagram used to illustrate the outline of an imaginary plane. (See reference...) Figure 14 For example, when the inspection table 11 is slightly tilted, the focus position of the second optical inspection camera 13 will differ depending on the shooting position. For example, the focus position of the second optical inspection camera 13 at both ends is actually detected, and the focus position of the second optical inspection camera 13 at the center is estimated based on the imaginary plane VP1.

[0095] Figure 15 This is a diagram used to illustrate the steps involved in generating an imaginary plane. (Refer to...) Figure 15 The upper left figure shows points D1, D2, D3, and D4 on the XY plane. Points D1, D2, D3, and D4 correspond to the shooting positions of the second optical inspection camera 13. A calibration plate PL1 is set on the inspection stage 11 when generating the hypothetical plane. For example, assuming the inspection stage 11 is slightly warped, the focus positions (positions on the Z-axis) of points D1, D2, D3, and D4 are all different. First, the focus positions of each point D1, D2, D3, and D4 are detected.

[0096] The diagram in the upper right corner, viewed from a slightly upward angle, shows points D1, D2, D3, and D4 in XYZ space. The (x, y) coordinates of each point D1, D2, D3, and D4 represent their coordinate positions in the XY plane, and their (z) coordinates represent their focal positions. A tetrahedron is formed by connecting points D1, D2, D3, and D4 to each other. In this case, consider an imaginary plane used to estimate the focal position of point DX1(x, y). When viewed from directly above, point DX1 intersects two faces of the tetrahedron.

[0097] That is, point DX1 intersects plane FA1 as shown in the lower left figure, and intersects plane FA3 as shown in the middle bottom figure. Thus, the focal point of point DX1 is likely located in the middle plane between planes FA1 and FA3.

[0098] The lower right diagram illustrates the method for deriving the intermediate plane between planes FA1 and FA3. The intermediate plane between planes FA1 and FA3 is the plane connecting points D1, D2, and D5. The coordinates of point D5 are the average of the coordinates of points D1, D2, D3, and D4. The expression representing the intermediate plane between planes FA1 and FA3 is derived, for example, using various known methods based on the respective coordinates of points D1, D2, and D5. The focus position at point DX1 is estimated by substituting the (x, y) of point DX1 into the expression representing the intermediate plane. That is, this intermediate plane is used as an imaginary plane. However, the method for deriving the imaginary plane is not limited to this. For example, the imaginary plane can be derived based on the (x, y, z) of four or more points surrounding the shooting position.

[0099] Figure 16 It is shown in Figure 7 The flowchart shows the process performed in step S110. (Refer to...) Figure 16 The processes in steps S300 to S340 are respectively related to Figure 11 The processes from steps S200 to S240 are the same, so they will not be described again.

[0100] In step S340, if it is determined that the shooting of all predetermined shooting locations has ended ("Yes" in step S340), the control unit 70 generates an imaginary plane based on each shooting location and focus position (step S350). Furthermore, the imaginary plane does not necessarily need to be generated in advance; it is also possible to simply store the (x, y, z) values ​​of each shooting location in the storage unit 80. When inspecting the electronic component S1, the imaginary plane can be generated each time based on the (x, y, z) values ​​of at least three points surrounding the shooting position of the second optical inspection camera 13.

[0101] Refer again Figure 7After the imaginary plane is generated, the control unit 70 uses the generated imaginary plane to acquire various correction data (step S120). Examples of the acquired correction data include distortion correction data, rotation correction data, trapezoidal correction data, and axis angle correction data.

[0102] Figure 17 It is shown in Figure 7 The flowchart shows the process performed in step S120. (Refer to...) Figure 17 The control unit 70 performs processing for acquiring distortion correction data (step S400).

[0103] Figure 18 This is a diagram illustrating the general principles of distortion correction. (See reference...) Figure 18 In this example, pincushion-shaped distortion aberrations were corrected. Alternatively, barrel-shaped distortion aberrations could also be corrected. Distortion correction data is data used to correct distortion aberrations. Distortion correction data is obtained, for example, using various known methods based on images captured by the second optical inspection camera 13.

[0104] Figure 19 It is shown in Figure 17 The flowchart shows the process performed in step S400. (Refer to...) Figure 19 The processing in steps S500, S510, S540, and S550 is respectively related to... Figure 11 The processes of steps S200, S210, S240 and S250 are the same, so they will not be described again.

[0105] In step S510, after the movement to the pre-determined multiple shooting locations that have not yet been photographed is completed, the control unit 70 controls the second optical inspection camera 13 to adjust the Z-axis coordinate position based on the imaginary plane (step S520). After the Z-axis coordinate position adjustment is completed, the control unit 70 controls the second optical inspection camera 13 to photograph a partial image of the calibration plate PL1 (step S530).

[0106] If it is determined that all shooting locations have been shot a predetermined number of times ("Yes" in step S550), then the control unit 70 extracts the average shooting image of each shooting location (step S560). The control unit 70 generates distortion correction data based on the extracted average shooting image (step S570).

[0107] Refer again Figure 17 After acquiring distortion correction data, the control unit 70 performs processing for acquiring rotation correction data (step S410).

[0108] Figure 20This is a diagram illustrating the general principles of rotation correction when a portion of the image is tilted relative to the X-axis. (See reference...) Figure 20 In this example, partial images PI10 and PI11 are tilted by an angle θ2 relative to the X-axis. In the cutting device 1, rotation correction is performed on each partial image by cropping a region parallel to the X-axis. Due to this rotation correction, adjacent partial images PI10 and PI11 partially overlap. A composite image IM4 is generated by synthesizing the rotation-corrected partial images PI10 and PI11. To perform this rotation correction, the tilt of the second optical inspection camera 13 about the Z-axis relative to the X-axis (angle θ2: rotation correction data) needs to be calculated.

[0109] Figure 21 This is a diagram illustrating the calculation sequence of the tilt of the second optical inspection camera 13 relative to the X-axis and about the Z-axis. (Refer to...) Figure 21 The axis AX1 is, for example, the column of small point DO1 shown on the calibration plate PL1. Regarding the shooting positions of partial images PI12 and PI13, the X coordinates are different from each other, while the Y coordinates are the same. The factors that cause the small point DO1 in each partial image PI12 and PI13 to be shot at an angle can be cited as: (1) the tilt of the second optical inspection camera 13 relative to the X-axis and about the Z-axis, and (2) the tilt of the calibration plate PL1 on the inspection table 11. That is, the angle of axis AX1 in each partial image PI12 and PI13 is the sum of (1) and (2) above.

[0110] On the other hand, in this example, when focusing on a specific small point DO1, the position of the shooting point DO1 is moved by X1 on the X-axis and by Y1 on the Y-axis. The resulting tilt (angle θ3) is due to (2) above. Therefore, (1) above can be calculated by subtracting the angle θ3 from the angle of axis AX1 in each partial image PI12 and partial image PI13.

[0111] Figure 22 It is shown in Figure 17 The flowchart shows the process performed in step S410. (Refer to...) Figure 22 The processes in steps S600, S610, S620, S630, S650, S660, and S670 are respectively related to... Figure 19 The processes of steps S500, S510, S520, S530, S540, S550 and S560 are the same, so they will not be described again.

[0112] After capturing a portion of the image in step S630, the control unit 70 performs distortion correction on the portion of the image data using distortion correction data (step S640). After extracting the average captured image of each captured part in step S670, the control unit 70 generates rotation correction data based on the extracted average captured image (step S680).

[0113] Refer again Figure 17 After acquiring the rotation correction data, the control unit 70 performs the processing for acquiring the trapezoidal correction data (step S420).

[0114] Figure 23 This is a diagram illustrating the trapezoidal correction process when a rectangular subject is photographed as a trapezoid. (See reference...) Figure 23 As described above, even after correcting distortions caused by lens aberrations in the second optical inspection camera 13, a rectangular subject may still be captured as a trapezoid. In a partial image PI14, for example, a 100mm area is captured on the left and a 105mm area on the right. As a result, the rectangular subject is captured as a trapezoid. In trapezoid correction, for example, the partial image PI14 is corrected by making the left and right shooting areas the same, and making the top and bottom shooting areas the same. As a result, in the corrected partial image PI15, the rectangular subject becomes the correct shape. The trapezoid correction data required for such correction can be obtained, for example, by using various known methods such as affine transformation.

[0115] Figure 24 It is shown in Figure 17 The flowchart shows the process performed in step S420. (Refer to...) Figure 24 70 pairs of control units Figure 22 In step S670, the average captured images of each captured part are rotated and corrected (step S700). The control unit 70 generates trapezoidal correction data in the rotated and corrected captured image so that the left and right captured ranges are the same, and the top and bottom captured ranges are the same (step S710).

[0116] Refer again Figure 17 After acquiring the trapezoidal correction data, the control unit 70 performs the processing for acquiring the axis angle correction data (step S430).

[0117] Figure 25 This is a diagram illustrating the outline of axis angle correction when the movement direction of the second optical inspection camera 13 deviates from the Y-axis. (See reference...) Figure 25When the movement direction of the second optical inspection camera 13 deviates from the Y-axis, partial images are corrected by adjusting (offsetting) the cropping position of the images in each partial image PI16 and partial image PI17. A composite image IM5 is generated by compositing the corrected partial images.

[0118] Figure 26 This diagram illustrates the calculation sequence of the tilt of the moving direction of the second optical inspection camera 13 relative to the Y-axis. The offset of the cropping position is determined based on the tilt of the moving direction of the second optical inspection camera 13 relative to the Y-axis.

[0119] Reference Figure 26 The axis AX2 is, for example, the column of point DO1 shown on the calibration plate PL1. Regarding the shooting positions of partial images PI18 and PI19, the X coordinates are the same, while the Y coordinates are different. Factors contributing to the oblique shooting of point DO1 in each partial image PI18 and PI19 include: (A) the tilt of the movement direction of the second optical inspection camera 13 relative to the Y-axis (axis angle correction data), and (B) the tilt of the calibration plate PL1 on the inspection table 11. That is, the angle of axis AX2 in each partial image PI18 and PI19 is the sum of (A) and (B) above.

[0120] On the other hand, in this example, when focusing on a specific small point DO1, the corresponding shooting position is moved by Y2 on the Y-axis and the position of the specific small point DO1 on the X-axis is moved by X2. The resulting tilt (angle θ4) is due to (B) above. Therefore, (A) above can be calculated by subtracting angle θ4 from the angle of axis AX2 in each partial image PI18 and partial image PI19.

[0121] Figure 27 It is shown in Figure 17 The flowchart shows the process performed in step S430. (Refer to...) Figure 27 The processing steps S800, S810, S820, S830, S850, S860, and S870 are respectively related to... Figure 22 The processes of steps S600, S610, S620, S630, S650, S660 and S670 are the same, so they will not be described again.

[0122] After capturing a portion of the image in step S830, the control unit 70 sequentially performs distortion correction using distortion correction data, rotation correction using rotation correction data, and trapezoidal correction using trapezoidal correction data on the portion of the image data (step S840). After extracting the average captured image at each captured location in step S870, the control unit 70 generates axis angle correction data based on the extracted average captured image (step S880). In this way, through calibration, an imaginary plane and various correction data are generated.

[0123] <3-2. Investigation Actions> Figure 28 This is a flowchart illustrating the inspection sequence of electronic components S1 that cannot be fully captured by the field of view of the second optical inspection camera 13. The process shown in this flowchart is executed by the control unit 70 of the computer 50 at predetermined intervals.

[0124] Reference Figure 28 The control unit 70 determines multiple shooting positions (shooting areas) based on the configuration information of the electronic component S1 to be inspected (step S900). The control unit 70 controls the second optical inspection camera 13 to begin shooting the electronic component S1 held on the inspection worktable 11 (step S910). The control unit 70 controls at least one of the inspection worktable 11 and the second optical inspection camera 13 to move to a shooting area among the predetermined multiple shooting areas that has not yet been shot (step S920).

[0125] The control unit 70 calculates the Z-axis coordinate position based on an imaginary plane and controls the second optical inspection camera 13 to move to the calculated Z-axis coordinate position (step S930). When the Z-axis coordinate position adjustment is completed, the control unit 70 controls the second optical inspection camera 13 to capture a partial image of the electronic component S1 (step S940). Thus, in the cutting device 1, when generating partial image data, the focus position of the second optical inspection camera 13 along the Z-axis is adjusted respectively. The control unit 70 sequentially performs distortion correction using distortion correction data, rotation correction using rotation correction data, and trapezoidal correction using trapezoidal correction data on the partial image data (step S950).

[0126] The control unit 70 determines whether the shooting of all predetermined shooting areas has ended (step S960). If it is determined that the shooting of all predetermined shooting areas has not ended ("No" in step S960), the control unit 70 executes the processing of step S920 again.

[0127] On the other hand, if it is determined that the shooting of all predetermined shooting areas has ended ("Yes" in step S960), the control unit 70 performs offset (axis correction) of partial image data using axis correction data (step S970). The control unit 70 generates composite image data by synthesizing the partial image data that has undergone various corrections (step S980). The control unit 70 performs inspection and measurement of electronic component S1 based on the composite image data (step S990). As an example of inspecting electronic component S1, an appearance inspection of electronic component S1 can be performed, and as an example of measuring electronic component S1, the length of each part of electronic component S1 can be measured.

[0128] [4.Features] As described above, in the cutting device 1, after considering the correction for the camera's tilt relative to the X-axis and the correction for the difference between the angle formed by the axis along the moving direction of the second optical inspection camera 13 and the X-axis and the reference angle (90°) in each of the multiple partial image data, the multiple partial image data are synthesized. Since the multiple partial image data are synthesized after implementing various corrections, deviations that may occur at the boundary portions between the partial image data are suppressed in the synthesized image data. Therefore, according to the cutting device 1, the inspection of the electronic component S1 based on the synthesized image data can be performed with relatively high precision.

[0129] Furthermore, in the cutting device 1, the focus position is adjusted individually when generating each of the multiple partial image data. Therefore, according to the cutting device 1, each of the multiple partial image data can be generated by using the second optical inspection camera 13 set at an appropriate focus position. As a result, according to the cutting device 1, the inspection of the electronic component S1 can be performed with relatively high precision.

[0130] In the cutting device 1, for each of the multiple partial image data, a correction considering the tilt of the second optical inspection camera 13 relative to the X-axis and a correction considering the difference between the angle formed by the movement direction of the second optical inspection camera 13 and the X-axis and the reference angle (90°) (the tilt of the movement direction of the second optical inspection camera 13 relative to the Y-axis) are sequentially performed. The reason for performing the corrections in this order is as follows. As described above, even without performing the correction considering the tilt of the movement direction of the second optical inspection camera 13 relative to the Y-axis, the tilt of the second optical inspection camera 13 relative to the X-axis can be calculated based on the image captured by the second optical inspection camera 13. On the other hand, without performing the correction considering the tilt of the second optical inspection camera 13 relative to the X-axis, it is impossible to calculate the tilt of the movement direction of the second optical inspection camera 13 relative to the Y-axis based on the image captured by the second optical inspection camera 13. This is because images captured without considering the tilt of the second optical inspection camera 13 relative to the X-axis are affected by both the tilt of the second optical inspection camera 13 relative to the X-axis and the tilt of the movement direction of the second optical inspection camera 13 relative to the Y-axis. Therefore, in the cutting device 1, a correction considering the camera's tilt relative to the X-axis is performed first. Since multiple partial image data are synthesized after the correction is performed in an appropriate order, deviations that may occur at the boundary portions between the partial image data are suppressed in the synthesized image data. Therefore, according to the cutting device 1, the inspection of the electronic component S1 based on the synthesized image data can be performed with relatively high precision.

[0131] According to the cutting device 1, the calibration plate PL1 is photographed multiple times at the same shooting location, and correction data is obtained based on the average shooting image. Therefore, image synthesis can be performed based on the correction data with higher accuracy. In addition, depending on the shooting object, it is also possible to use the shooting image that is closest to the median value of the differences among the multiple shooting images as the basis instead of the average value of the multiple shooting images.

[0132] According to the cutting device 1, a composite image can be formed after correcting multiple captured images. Therefore, in order to inspect electronic components that are not fully within the field of view of the camera, even if the existing device would require a camera capable of capturing a wider field of view, it can be handled by the existing device's camera.

[0133] Furthermore, the inspection worktable 11 is an example of a "worktable" in this invention, and the first optical inspection camera 12 and the second optical inspection camera 13 are examples of "cameras" in this invention. The mechanism that moves the inspection worktable 11 along the X-axis is an example of a "first moving mechanism" in this invention, and the mechanism that moves the first optical inspection camera 12 and the second optical inspection camera 13 along the Y-axis is an example of a "second moving mechanism" in this invention. The control unit 70 is an example of a "control unit" in this invention, and the mechanism that moves the first optical inspection camera 12 and the second optical inspection camera 13 along the Z-axis is an example of a "third moving mechanism" in this invention.

[0134] [5. Other implementation methods] The ideas behind the above embodiments are not limited to those described above. Hereinafter, an example of another embodiment to which the ideas of the above embodiments can be applied will be described.

[0135] In the above embodiments, a technique for inspecting objects that cannot be fully captured by a camera is applied in the cutting device. However, the scope of application of this technique is not limited to this. For example, this technique can also be applied to resin molding apparatuses for manufacturing resin molded articles. For example, this technique can also be applied to the inspection of resin molded articles that cannot be fully captured by a camera. This technique can be applied, for example, to semiconductor manufacturing apparatuses such as cutting devices and resin molding apparatuses.

[0136] Furthermore, in the above embodiment, the shooting positions of each camera are adjusted by moving the inspection table 11 along the X-axis and the first optical inspection camera 12 and the second optical inspection camera 13 along the Y-axis, respectively. However, the method for adjusting the shooting positions of each camera is not limited to this. For example, the shooting positions of each camera can be adjusted by moving each camera along both the X-axis and the Y-axis, or the shooting positions of each camera can be adjusted by moving the inspection table 11 along both the X-axis and the Y-axis.

[0137] The embodiments of the present invention have been described above as illustrative. Specifically, detailed descriptions and drawings have been provided for illustrative purposes. Therefore, the constituent elements described in the detailed description and drawings sometimes include elements that are necessary to solve the problem but are not essential. Therefore, although these non-essential constituent elements are described in detail in the drawings, they should not be immediately assumed to be essential.

[0138] Furthermore, the above embodiments are merely illustrative of the present invention in all respects. Various modifications or alterations can be made to the above embodiments within the scope of the present invention. For example, at least a portion of the structure of any one embodiment can be combined with at least a portion of the structure of any other embodiment. That is, in the implementation of the present invention, specific structures can be appropriately adopted according to the embodiments.

[0139] [6. Fu Ji] <Technology 1> (constitute) An inspection system, comprising: The workbench holds the electronic components. A camera captures a portion of the electronic component, generating a first portion of image data; A first moving mechanism moves at least one of the worktable and the camera to change the relative positional relationship between the electronic component and the camera on a first axis. The second moving mechanism moves at least one of the worktable and the camera to change the relative position of the electronic component and the camera on the second axis; and The control unit controls the camera, the first moving mechanism, and the second moving mechanism respectively to generate multiple first-part image data representing different parts of the electronic components. The control unit performs the following processes: a first process that considers the correction of the camera's tilt relative to the first axis and the correction of the difference between the angle formed by the first axis and the second axis and the reference angle for each of the plurality of first partial image data; a second process that generates synthetic image data by synthesizing the corrected plurality of first partial image data; and a third process that checks the electronic components based on the synthetic image data.

[0140] (Effects, etc.) In this inspection system, after considering corrections for the camera's tilt relative to the first axis and corrections for the difference between the angle formed by the first and second axes and the reference angle in each of the multiple first image data sets, the multiple first image data sets are synthesized. Because the multiple first image data sets are synthesized after implementing various corrections, deviations that may occur at the boundary portions between the first image data sets are suppressed in the synthesized image data. Therefore, according to this inspection system, the inspection of electronic components based on synthesized image data can be performed with relatively high precision.

[0141] <Technology 2> (constitute) According to the inspection system of technology 1, the reference angle is 90°.

[0142] (Effects, etc.) In this inspection system, when the angle formed by the first and second axes deviates from a right angle, corrections are applied to each of the multiple first-part image data. Since the multiple first-part image data are synthesized after correction, deviations that may occur at the boundary between the first-part image data are suppressed in the synthesized image data. Therefore, according to this inspection system, inspection of electronic components based on synthesized image data can be performed with relatively high precision.

[0143] <Technology 3> (constitute) According to the inspection system of technology 1 or technology 2, the camera includes a lens. In the first processing, each of the plurality of first portion image data is further subjected to a correction that takes into account the distortion of the lens.

[0144] (Effects, etc.) In this inspection system, after each further implementation of lens distortion corrections for multiple first-part image data, the multiple first-part image data are synthesized. Because the synthesis of the multiple first-part image data is performed after various corrections, deviations that may occur at the boundary portions between the first-part image data are suppressed in the synthesized image data. Therefore, according to this inspection system, the inspection of electronic components based on synthesized image data can be performed with relatively high precision.

[0145] <Technology 4> (constitute) The inspection system according to any one of techniques 1 to 3, wherein the inspection system further comprises a third moving mechanism that moves the camera along a third axis orthogonal to both the first axis and the second axis. The control unit controls the third moving mechanism such that, when generating each of the plurality of first portion image data, the focus position of the camera along the third axis is adjusted respectively.

[0146] (Effects, etc.) For example, when the worktable is not perfectly flat, the focus position may differ depending on the shooting position of the electronic component. In this inspection system, the focus position is adjusted individually when generating each of the multiple first-part image data sets. Therefore, according to this inspection system, each of the multiple first-part image data sets can be generated by using a camera set at an appropriate focus position. As a result, the inspection system enables the inspection of electronic components with relatively high precision.

[0147] <Technology 5> (constitute) According to the inspection system of technology 4, the control unit controls the third moving mechanism to adjust the focusing position by referring to an imaginary plane. The imaginary plane is generated based on the focal positions of at least three points surrounding the shooting position of the camera.

[0148] (Effects, etc.) In this inspection system, the camera's focus position is adjusted with high precision by referring to an imaginary plane. Therefore, according to this inspection system, it is possible to generate multiple first-part image data sets using a camera set at an appropriate focus position. As a result, this inspection system enables the inspection of electronic components with relatively high precision.

[0149] <Technology 6> (constitute) According to any one of the techniques 1 to 5, in the inspection system, in the first process, the control unit sequentially performs a correction that takes into account the tilt of the camera relative to the first axis and a correction that takes into account the difference between the angle formed by the first axis and the second axis and the reference angle for each of the plurality of first portion image data.

[0150] (Effects, etc.) In this inspection system, for each of the multiple first-part image data sets, corrections are sequentially performed considering the camera's tilt relative to the first axis and the difference between the angle formed by the first and second axes and a reference angle. That is, in this inspection system, corrections considering the camera's tilt relative to the first axis, unaffected by the difference between the angle formed by the first and second axes and the reference angle, are performed first. Because the multiple first-part image data sets are synthesized after corrections are performed in an appropriate order, deviations that may occur at the boundary portions between the first-part image data sets are suppressed in the synthesized image data. Therefore, according to this inspection system, inspection of electronic components based on synthesized image data can be performed with relatively high precision.

[0151] <Technology 7> (constitute) The inspection system according to any one of techniques 1 to 6, wherein first correction data is used to take into account corrections for the tilt of the camera relative to the first axis, and second correction data is used to take into account corrections for the difference between the angle formed by the first axis and the second axis and the reference angle. Each of the first and second corrected data is generated in advance. The camera captures images of the calibration board, generating a second portion of image data. The second correction data is generated based on the second portion of image data after correction using the first correction data.

[0152] (Effects, etc.) In this inspection system, second correction data is generated based on the second portion of image data after the camera's tilt relative to the first axis has been corrected. Therefore, in this inspection system, relatively high-precision second correction data is generated in advance. As a result, in this inspection system, after correction using the relatively high-precision second correction data is performed, multiple first portion image data are synthesized, thus suppressing deviations that may occur at the boundary portions between the first portion image data in the synthesized image data. Therefore, according to this inspection system, inspection of electronic components based on synthesized image data can be performed with relatively high precision.

[0153] <Technology 8> (constitute) A semiconductor manufacturing apparatus comprising: The inspection system according to any one of techniques 1 to 7; and The manufacturing system for manufacturing the electronic components. The electronic component is a semiconductor device. The inspection system inspects the electronic components manufactured by the manufacturing system.

[0154] (Effects, etc.) In this semiconductor manufacturing apparatus, after considering corrections for the camera's tilt relative to the first axis and corrections for the difference between the angle formed by the first and second axes and a reference angle in each of the multiple first partial image data, the multiple first partial image data are synthesized. Because the multiple first partial image data are synthesized after implementing various corrections, deviations that may occur at the boundary portions between the first partial image data are suppressed in the synthesized image data. Therefore, according to this semiconductor manufacturing apparatus, the inspection of electronic components based on synthesized image data can be performed with relatively high precision.

[0155] <Technology 9> (constitute) An inspection method that uses an inspection system. The inspection system includes: The workbench holds the electronic components. A camera captures a portion of the electronic component, generating partial image data. A first moving mechanism moves at least one of the worktable and the camera to change the relative positional relationship between the electronic component and the camera on a first axis; and The second moving mechanism moves at least one of the worktable and the camera to change the relative position of the electronic component and the camera on the second axis. The inspection method includes: The step of generating multiple part image data that respectively represent different parts of the electronic component; For each of the plurality of partial image data, the steps of considering the correction of the camera's tilt relative to the first axis and the correction of the difference between the angle formed by the first axis and the second axis and the reference angle are implemented; The step of generating synthetic image data by synthesizing the corrected partial image data; and The step of inspecting the electronic components based on the synthesized image data.

[0156] (Effects, etc.) In this inspection method, after considering corrections for the camera's tilt relative to the first axis and corrections for the difference between the angle formed by the first and second axes and a reference angle in each of the multiple first image data sets, the multiple first image data sets are synthesized. Because the multiple first image data sets are synthesized after implementing various corrections, deviations that may occur at the boundary portions between the first image data sets are suppressed in the synthesized image data. Therefore, according to this inspection method, the inspection of electronic components based on synthesized image data can be performed with relatively high precision.

[0157] Explanation of reference numerals in the attached figures 1. Cutting device; 3. Substrate supply unit; 4. Positioning unit; 4a. Track unit; 5. Cutting worktable; 5a. Holding component; 5b. Rotating mechanism; 5c. Moving mechanism; 5d. First position confirmation camera; 5e. First cleaner; 6. Spindle unit; 6a. Blade; 6b. Second position confirmation camera; 6c. Rotating shaft; 7. Conveying unit; 7a. Second cleaner; 11. Inspection worktable; 12. First optical inspection camera; 13. Second optical inspection camera; 14. Placement unit; 15. Extraction unit; 15a. Good product tray; 15b. Defective product tray; 16, 17. Illumination unit; 17a. Dome; 17b. LED; 20 Monitor; 50 Computer; 70 Control Unit; 72 CPU; 74 RAM; 76 ROM; 80 Storage Unit; 81 Control Program; 90 Input / Output (I / F); 95 Receiving Unit; A1 Cut-off Module; AN1 Tilt Information; AX1 Axis; B1 Inspection / Storage Module; D1-D5, DX1 Points; DO1 Small Point; FA1-FA4 Surfaces; M1 Material Box; P1 Packaging Substrate; PI1-PI19 Partial Images; IM1-IM5 Composite Images; PL1 Calibration Board; S1 Electronic Components; VP1 Imaginary Plane.

Claims

1. An inspection system, comprising: The workbench holds the electronic components. A camera captures a portion of the electronic component, generating a first portion of image data; A first moving mechanism moves at least one of the worktable and the camera to change the relative positional relationship between the electronic component and the camera on a first axis. The second moving mechanism moves at least one of the worktable and the camera to change the relative positional relationship between the electronic component and the camera on the second axis. and The control unit controls the camera, the first moving mechanism, and the second moving mechanism respectively to generate multiple first-part image data representing different parts of the electronic components. The control unit performs the following processes: a first process that takes into account the tilt of the camera relative to the first axis and the difference between the angle formed by the first axis and the second axis and the reference angle for each of the plurality of first partial image data; a second process that generates synthetic image data by synthesizing the plurality of first partial image data after synthesis; and a third process that checks the electronic components based on the synthetic image data.

2. The inspection system according to claim 1, wherein, The reference angle is 90°.

3. The inspection system according to claim 1 or 2, wherein, The camera includes a lens. In the first processing, each of the plurality of first portion image data is further subjected to a correction that takes into account the distortion of the lens.

4. The inspection system according to any one of claims 1 to 3, wherein, The inspection system also includes a third moving mechanism that moves the camera along a third axis orthogonal to both the first and second axes. The control unit controls the third moving mechanism such that, when generating each of the plurality of first portion image data, the focus position of the camera along the third axis is adjusted respectively.

5. The inspection system according to claim 4, wherein, The control unit controls the third moving mechanism to adjust the focusing position by referring to an imaginary plane. The imaginary plane is generated based on the focal positions of at least three points surrounding the shooting position of the camera.

6. The inspection system according to any one of claims 1 to 5, wherein, In the first process, the control unit sequentially performs corrections for each of the plurality of first portion image data, taking into account the tilt of the camera relative to the first axis and the difference between the angle formed by the first axis and the second axis and the reference angle.

7. The inspection system according to any one of claims 1 to 6, wherein, The first correction data is used to correct for the tilt of the camera relative to the first axis, and the second correction data is used to correct for the difference between the angle formed by the first axis and the second axis and the reference angle. Each of the first and second corrected data is generated in advance. The camera captures images of the calibration board, generating a second portion of image data. The second correction data is generated based on the second portion of image data after correction using the first correction data.

8. A semiconductor manufacturing apparatus, comprising: The inspection system according to any one of claims 1 to 7; and The manufacturing system for manufacturing the electronic components. The electronic component is a semiconductor device. The inspection system inspects the electronic components manufactured by the manufacturing system.

9. An inspection method that uses an inspection system. The inspection system includes: The workbench holds the electronic components. A camera captures a portion of the electronic component, generating partial image data. A first moving mechanism moves at least one of the worktable and the camera to change the relative positional relationship between the electronic component and the camera on a first axis. and The second moving mechanism moves at least one of the worktable and the camera to change the relative position of the electronic component and the camera on the second axis. The inspection method includes: The step of generating multiple part image data that respectively represent different parts of the electronic component; For each of the plurality of partial image data, the steps of considering the correction of the camera's tilt relative to the first axis and the correction of the difference between the angle formed by the first axis and the second axis and the reference angle are implemented; The step of generating synthetic image data by synthesizing the corrected partial image data; and The step of inspecting the electronic components based on the synthesized image data.

Images