Method for preparing nano array by plasma etching

Abstract

The invention aims to provide a method for preparing a nano array by adopting plasma etching. Specifically, the invention provides a micro-nano processing technology of a red-light nanocrystalline material, the diameter of polystyrene microspheres wrapped with nanocrystalline is accurately controlled through a plasma etching process, and then a nano array structure with a certain gap is constructed. The preparation method overcomes the defects in the prior art, simplifies the preparation process and reduces the production cost.

Description

Technical Field

[0001] This invention relates to a method for preparing a composite luminescent material array of polystyrene-encapsulated nanocrystals, belonging to the field of micro-nano fabrication technology. Background Technology

[0002] In the rapid development of modern science and technology, micro-nano fabrication technology of semiconductor materials has become a bridge connecting basic scientific research and high-end industrial applications. In particular, composite luminescent materials, as multifunctional materials integrating advanced optical, electrical, and materials science principles, have shown extraordinary application potential in recent years in fields such as displays, solid-state lighting, sensing and detection, and even bioimaging. Among them, polystyrene-encapsulated nanocrystal composite luminescent materials, with their excellent spectral characteristics, stable luminous efficiency, and tunable color performance, have become one of the most promising materials in this field.

[0003] Although polystyrene-encapsulated nanocrystals already exhibit impressive performance, many practical applications require arranging large numbers of polystyrene-encapsulated nanocrystals into periodic arrays to achieve better luminous efficiency, color purity, and spatial resolution. This array structure not only ensures the overall luminous efficiency of the material but also allows for optimized control of the emission modes by manipulating the interactions between nanocrystals, opening up a series of cutting-edge technologies based on photonic crystals and planar light sources. Therefore, developing a reliable, economical, and mass-producible arraying technology is crucial for advancing the practical application of composite luminescent materials. Summary of the Invention

[0004] This invention aims to provide a plasma etching method for arraying styrene-encapsulated nanocrystalline composite luminescent materials.

[0005] Optionally, firstly, polystyrene microspheres encapsulated with nanocrystals are arranged into a single-layer, tightly packed array of polystyrene microspheres using a gas-liquid interface self-assembly method. Then, the array is subjected to plasma etching to reduce the diameter of the polystyrene microspheres, resulting in an etched polystyrene microsphere nanoarray. The etched polystyrene microspheres in the nanoarray are regularly arranged with certain gaps between them. This preparation method is simple to operate, fills a gap in existing technology, and leads the field of luminescent materials to a new technological level.

[0006] Furthermore, the diameter of the polystyrene microspheres encapsulated with nanocrystals described in this invention is 100~500 nm.

[0007] Furthermore, the diameter of the etched polystyrene microspheres described in this invention is 50-450 nm, and the gap between adjacent etched polystyrene microspheres is 10-600 nm. In practical applications, the microsphere diameter is reduced by approximately 10%-45% through etching.

[0008] Furthermore, the plasma etching described in this invention has an etching power of 50~200W and an etching time of 1~10min.

[0009] Furthermore, in the plasma etching process described in this invention, the operating temperature is 30~60℃.

[0010] Furthermore, the gas component of the plasma etching described in this invention is oxygen or argon.

[0011] Furthermore, the nanocrystalline material encapsulated in the polystyrene microspheres of the present invention is quantum dots, metal nanoparticles, oxide nanocrystals, etc.

[0012] The steps of the gas-liquid interface self-assembly method are as follows: Step 1: Disperse the polystyrene material coated with nanocrystals in a solvent to form a stable and uniform suspension; for example, ethanol solvent can be used, and the polystyrene material coated with nanocrystals can be thoroughly mixed with ethanol solvent at a ratio of 1:1 to 5. Step 2: Slowly drop the mixed solution from Step 1 onto a hydrophilic substrate (e.g., a silicon wafer), immerse the substrate (e.g., a silicon wafer) with the added suspension into deionized water, and obtain an ordered monolayer self-assembled film on the water surface. Step 3: Use a substrate that has been treated with hydrophilicity to lift the monolayer self-assembled membrane obtained in step 2, and after drying, a monolayer tightly arranged polystyrene microsphere array is obtained.

[0013] Furthermore, in step 1 of the gas-liquid interface self-assembly method of the present invention, the solvent is ethanol, or water, or a mixed solvent obtained by mixing water and ethanol in any proportion.

[0014] Furthermore, in the gas-liquid interface self-assembly method of the present invention, the substrate material is one of ITO, glass, quartz and silicon wafer.

[0015] Furthermore, in the gas-liquid interface self-assembly method of the present invention, the surfactant used when performing hydrophilic treatment on the substrate includes at least one of sodium dodecyl sulfate, dodecylbenzenesulfonate, and hexadecyltrimethylammonium bromide.

[0016] Furthermore, in the gas-liquid interface self-assembly method of the present invention, the hydrophilicity of the substrate can be improved by methods such as plasma treatment or immersion in a piranha solution.

[0017] The unique advantages of this invention are: (1) By cleverly integrating gas-liquid interface self-assembly with plasma etching technology, the transformation of polystyrene-encapsulated nanocrystalline composite luminescent materials from disorder to highly ordered array has been realized, creating a new path for the arraying of luminescent materials. (2) Compared with the micro-nano fabrication process in related technologies, the present invention is simple to operate, low in cost, and low in technology intensity; it provides strong technical support for the development of high-performance light-emitting electronic devices. (3) The prepared nanoarrays exhibit excellent optical properties and can be widely used in high-precision displays, high-efficiency lighting, precision sensor devices and new energy systems in the future, demonstrating great commercial value and social benefits. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments or prior art of this specification, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a TEM image of the polystyrene-encapsulated nanocrystalline material used in this invention, showing the complete encapsulation of nanocrystalline materials by polystyrene.

[0020] Figure 2 The image shows a SEM image of a polystyrene-encapsulated nanocrystalline composite luminescent material array prepared by self-assembly at the gas-liquid interface according to the present invention, demonstrating that the present invention successfully prepared a highly ordered nanoarray. Figure 3 This is a SEM image of the polystyrene-encapsulated nanocrystalline composite luminescent material array prepared by plasma etching according to the present invention. It shows that plasma etching reduces the diameter of polystyrene microspheres, resulting in a nanoarray with a certain spacing.

[0021] Figure 4 The image shows a comparison of the PL (Photoluminescence) spectra of the polystyrene-encapsulated nanocrystalline composite luminescent material array prepared by self-assembly at the gas-liquid interface in this invention before and after plasma etching. It demonstrates that the array prepared in this invention can still maintain good luminescent properties and good color purity after plasma etching. Detailed Implementation

[0022] Many specific details are set forth in the following description to provide a full understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of this application; therefore, this application is not limited to the specific embodiments disclosed below.

[0023] The present invention will be further described below with reference to specific accompanying drawings and embodiments. However, the scope of protection of the present invention is not limited to the following embodiments.

[0024] Example: The arraying of polystyrene-encapsulated nanocrystalline microspheres prepared by gas-liquid interface self-assembly includes the following steps: Step 1: Disperse polystyrene microspheres coated with nanocrystals in a solvent (e.g., ethanol) to form a stable and uniform suspension; Step 2: Slowly drip the mixed solution from Step 1 onto the substrate treated with surfactant, immerse the substrate in deionized water, and obtain an ordered monolayer self-assembled film on the water surface; Step 3: Use a substrate that has been treated with hydrophilicity to lift the monolayer self-assembled membrane obtained in step 2, and after drying, a monolayer tightly arranged polystyrene microsphere array is obtained.

[0025] The array prepared in the above steps is etched using plasma etching. The etching gas is oxygen or argon, the etching power is 50~200W, and the etching time is 1~10min. This shrinks the polystyrene microspheres to 70~400nm, and finally a luminescent nanoarray with a certain spacing between the microspheres is obtained.

[0026] At an etching power of 100W and an etching time of 5 minutes, Figure 2 The array is subjected to plasma etching, such as... Figure 3 The polystyrene microspheres were reduced from about 300 nm to about 205 nm and were arranged in an orderly array.

[0027] The above description is merely an embodiment of this application and is not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

Claims

1. A method for fabricating nanoarrays using plasma etching, characterized in that, Using a gas-liquid interface self-assembly method, polystyrene microspheres coated with nanocrystals are arranged into a single-layer, tightly packed array of polystyrene microspheres. The array is subjected to plasma etching to reduce the diameter of the polystyrene microspheres in the array, resulting in an etched polystyrene microsphere nanoarray; the etched polystyrene microspheres in the nanoarray are regularly arranged and have certain gaps between each other.

2. The method for fabricating nanoarrays using plasma etching as described in claim 1, characterized in that, The nanocrystalline materials encapsulated in polystyrene microspheres are quantum dots, metal nanoparticles, or oxide nanocrystals.

3. The method for fabricating nanoarrays using plasma etching as described in claim 1, characterized in that, The diameter of the polystyrene microspheres encapsulated with nanocrystals is 100~500nm.

4. The method for fabricating nanoarrays using plasma etching as described in claim 1, characterized in that, The diameter of the etched polystyrene microspheres is 50~450nm, and the gap between adjacent etched polystyrene microspheres is 10~500nm.

5. The method for fabricating nanoarrays using plasma etching as described in claim 1, characterized in that, The etching power of plasma etching is 50~200W, and the etching time is 1~10min.

6. The method for fabricating nanoarrays using plasma etching as described in claim 1, characterized in that, The gas used in plasma etching is either oxygen or argon.

7. The method for fabricating nanoarrays using plasma etching as described in claim 1, characterized in that, In plasma etching, the operating temperature is 30~60℃.

8. The method for fabricating nanoarrays using plasma etching as described in claim 1, characterized in that, The specific steps of the gas-liquid interface self-assembly method are as follows: Step 1: Disperse the polystyrene material coated with nanocrystals in a solvent to form a stable and uniform suspension; Step 2: Slowly drop the suspension from Step 1 onto the hydrophilic substrate, immerse the substrate with the added suspension into deionized water, and obtain an ordered monolayer self-assembled film on the water surface. Step 3: Use a substrate that has been treated with hydrophilicity to lift the monolayer self-assembled film obtained in step 2, and after drying, a monolayer tightly arranged polystyrene microsphere array is obtained.

9. The method for fabricating nanoarrays using plasma etching as described in claim 8, characterized in that, The solvent used in step 1 is ethanol, or water, or a mixed solvent obtained by mixing water and ethanol in any proportion.

10. The method for fabricating nanoarrays using plasma etching as described in claim 8, characterized in that, In the gas-liquid interface self-assembly method, the substrate is one of ITO, glass, quartz and silicon wafer; the surfactant used to treat the substrate includes at least one of sodium dodecyl sulfate, dodecylbenzene sulfonic acid or hexadecyltrimethylammonium bromide; the method of treating the substrate includes at least one of plasma treatment or immersion in a piranha solution.

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