Loudspeaker including support structure and electronic device including same

Abstract

An electronic device according to an embodiment may include: a housing including a fastening portion; and a speaker assembly disposed inside the housing and outputting audio. The speaker assembly may include a support structure that forms a magnetic field. The speaker assembly may include: a coil configured to vibrate due to a magnetic field; and a diaphragm attached to the coil. The support structure may be secured to the securing portion to couple the speaker assembly to the housing.

Description

Technical Field

[0001] The following embodiments relate to a loudspeaker including a support structure and an electronic device including the loudspeaker. Background Technology

[0002] Small electronic devices such as smartphones, tablet PCs, or smartwatches may include speakers for outputting audio. Such speakers can be miniaturized for installation within the electronic device. The speakers may require support structures to mitigate functional degradation (e.g., sound quality degradation) caused by external impacts to the electronic device.

[0003] The above information is presented as background information only to aid in understanding this disclosure. There is no determination or assertion as to whether any of the above content can be used as prior art with respect to this disclosure. Summary of the Invention

[0004] Technical solution

[0005] According to an embodiment, an electronic device may include a housing comprising a fastening portion. The electronic device may include a speaker assembly disposed within the housing and configured to output audio. The speaker assembly may include a support structure that forms a magnetic field and includes a first plate, a magnet attached to the first plate, and a second plate coupled to the first plate and at least partially disposed on the magnet. The speaker assembly may include a coil configured to vibrate via the magnetic field and a diaphragm attached to the coil. The support structure may be fastened to the fastening portion for attaching the speaker assembly to the housing.

[0006] According to an embodiment, an electronic device may include a housing comprising a fastening portion. The electronic device may include a speaker assembly disposed within the housing and configured to output audio. The speaker assembly may include a support structure and a fastening structure, the support structure forming a magnetic field and including a first plate, a magnet attached to the first plate, and a second plate coupled to the first plate and at least partially disposed on the magnet; the fastening structure is supported by the fastening portion and used to fasten the speaker assembly to the fastening portion. The speaker assembly may include a diaphragm configured to vibrate via the magnetic field. The fastening structure may be formed at least partially of at least one of the first plate and the second plate. Attached Figure Description

[0007] Figure 1 This is a block diagram of an electronic device in a network environment according to various embodiments.

[0008] Figure 2a This is a front perspective view of an electronic device according to an embodiment.

[0009] Figure 2b yes Figure 2a Rear perspective view of the electronic device.

[0010] Figure 3 yes Figure 2a An exploded perspective view of an electronic device.

[0011] Figure 4a A portion of an example electronic device is shown.

[0012] Figure 4b Example electronic device along Figure 4a A partial cross-sectional view taken from line A-A'.

[0013] Figure 5a This is an exploded perspective view of the speaker assembly of the example electronic device.

[0014] Figure 5b This is a partial exploded perspective view of the speaker assembly of the example electronic device.

[0015] Figure 5c This is a perspective view of the speaker assembly of an example electronic device.

[0016] Figure 6a This is a partial exploded perspective view of the speaker assembly of the example electronic device.

[0017] Figure 6b This is a perspective view of the speaker assembly of an example electronic device.

[0018] Figure 7a , Figure 7b , Figure 7c , Figure 7d and Figure 7e This is a perspective view of the speaker assembly of an example electronic device.

[0019] Figure 8a A portion of an example electronic device is shown.

[0020] Figure 8b Example electronic device along Figure 8a A partial cross-sectional view taken from line B-B'. Detailed Implementation

[0021] Figure 1 This is a block diagram of an electronic device in a network environment according to an embodiment.

[0022] Reference Figure 1In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In an embodiment, at least one of the components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In an embodiment, some of the components (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single component (e.g., display module 160).

[0023] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to embodiments, as at least part of the data processing or calculation, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the result data in non-volatile memory 134. According to embodiments, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 can be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 can be implemented separately from the main processor 121, or as part of the main processor 121.

[0024] For example, when the main processor 121 is inactive (e.g., in sleep) state, the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) can be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) can include hardware architectures dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm can include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model can include multiple layers of artificial neural networks. The artificial neural network can be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of these, but is not limited thereto. Additionally or optionally, the artificial intelligence model can include software structures in addition to hardware structures.

[0025] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0026] The program 140 can be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0027] Input module 150 can receive commands or data from outside electronic device 101 (e.g., a user) that will be used by another component of electronic device 101 (e.g., processor 120). Input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0028] The audio output module 155 can output audio signals to the outside of the electronic device 101. The audio output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to embodiments, the receiver can be implemented separately from the speaker, or as part of the speaker.

[0029] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display module 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0030] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or an external electronic device (e.g., electronic device 102) (e.g., a speaker or headphones) that is directly or wirelessly connected to the electronic device 101.

[0031] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0032] Interface 177 may support one or more specific protocols used to enable direct or wireless connection between electronic device 101 and external electronic device (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, or an audio interface.

[0033] Connection 178 may include a connector via which electronic device 101 can be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0034] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to embodiments, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0035] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0036] The power management module 188 can manage the power supply to the electronic device 101. According to an embodiment, the power management module 188 can be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0037] Battery 189 can power at least one component of electronic device 101. According to embodiments, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0038] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and supporting direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). A corresponding one of these communication modules can communicate via a first network 198 (e.g., a short-range communication network, such as Bluetooth). TMThe wireless communication module 192 can communicate with external electronic devices via a Wi-Fi Direct or Infrared Data Association (IrDA) network or a second network 199 (e.g., a long-range communication network, such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components (e.g., multiple chips) that are separate from each other. The wireless communication module 192 can use user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196 to identify and verify the electronic device 101 in the communication network (such as a first network 198 or a second network 199).

[0039] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (e.g., new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0040] Antenna module 197 can transmit or receive signals or power to or from the outside of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiating element composed of conductive material or conductive patterns formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of antenna module 197.

[0041] According to various embodiments, antenna module 197 can form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, an RFIC, and multiple antennas (e.g., an array antenna). The RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band). The multiple antennas are disposed on or adjacent to a second surface (e.g., a top or side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0042] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via inter-peripheral communication schemes (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0043] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic devices 102 or 104 can be the same as or a different type of device as electronic device 101. According to an embodiment, all or some operations that will be performed on electronic device 101 can be performed on one or more of external electronic devices 102, 104, or 108. For example, if electronic device 101 is required to automatically perform a function or service or to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, the one or more external electronic devices may perform the requested at least portion of the function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing can be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In an embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 can be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0044] Figure 2a This is a front perspective view of an electronic device according to an embodiment. Figure 2b yes Figure 2a Rear perspective view of the electronic device.

[0045] Reference Figure 2a and Figure 2bThe electronic device 200 according to an embodiment may include a housing 210 and fastening members 250 and 260. The housing 210 includes a front surface 210A, a rear surface 210B, and a side surface 210C surrounding a space between the front surface 210A and the rear surface 210B. The fastening members 250 and 260 are connected to at least a portion of the housing 210 and configured to detachably fasten the electronic device 200 to a part of a user's body (e.g., a wrist or ankle). In another embodiment (not shown), the housing may refer to a shape... Figure 1 The front surface 210A, rear surface 210B, and side surface 210C are structured in some of these. According to an embodiment, at least a portion of the front surface 210A may be formed with a substantially transparent front panel 201 (e.g., a glass or polymer panel including various coatings). The rear surface 210B may be formed with a substantially opaque rear panel 207. The rear panel 207 may be formed from, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side surface 210C may be connected to the front panel 201 and the rear panel 207, and may be formed with a side frame structure 206 including metallic and / or polymeric materials. In an embodiment, the rear panel 207 and the side frame structure 206 may be integrally formed and include the same material (e.g., a metallic material such as aluminum). Fastening members 250 and 260 may be formed from various materials and shapes. The fastening components may be formed of fabric, leather, rubber, polyurethane, metal, ceramic, or a combination of at least two of the above materials, such that the integral or multiple unit links are movable relative to each other.

[0046] According to an embodiment, the electronic device 200 may include a display 220 (see reference 220). Figure 3 The electronic device 200 may omit at least one of the following components: audio modules 205 and 208, sensor module 211, key input devices 202, 203 and 204, and connector hole 209. In embodiments, the electronic device 200 may omit at least one of those components (e.g., key input devices 202, 203 and 204, connector hole 209, or sensor module 211), or may further include any other components.

[0047] Display 220 may be visually exposed, for example, through a large portion of front panel 201. The shape of display 220 may correspond to the shape of front panel 201 and may be formed in various shapes, including circular, elliptical, or polygonal. Display 220 may be coupled to or placed adjacent to touch sensing circuitry, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a fingerprint sensor.

[0048] Audio modules 205 and 208 may include a microphone hole 205 and a speaker hole 208. A microphone for receiving external sound may be disposed within the microphone hole 205, and in some embodiments, multiple microphones may be provided to sense the direction of sound. The speaker hole 208 may be used as an external speaker and a receiver for making calls. In some embodiments, the speaker hole 208 and microphone hole 205 may be implemented as a single hole, or a speaker (e.g., a piezoelectric speaker) without a speaker hole 208 may be included.

[0049] Sensor module 211 can generate electrical signals or data values ​​corresponding to the internal operating state or external environmental state of electronic device 200. Sensor module 211 may include, for example, a biometric sensor module 211 (e.g., an HRM sensor) disposed on the rear surface 210B of housing 210. Electronic device 200 may further include at least one of the following sensor modules (not shown): gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, color sensor, IR (infrared) sensor, biometric sensor, temperature sensor, humidity sensor, illuminance sensor, etc.

[0050] Key input devices 202, 203, and 204 may include a wheel key 202 disposed on the front surface 210A of the housing 210 and rotatable in at least one direction, and / or key buttons 203 and 204 disposed on the side surface 210C of the housing 210. The wheel key may have a shape corresponding to the shape of the front panel 201. In another embodiment, the electronic device 200 may not include some or all of the aforementioned key input devices 202, 203, and 204, and the un-included key input devices 202, 203, and 204 may be implemented in other forms, such as soft keys on the display 220.

[0051] Connector hole 209 may accommodate a connector (e.g., a USB connector) for sending and receiving power and / or data with an external electronic device, and may include another connector hole (not shown) capable of accommodating a connector for sending and receiving audio signals with an external electronic device. Electronic device 200 may further include, for example, a connector cover (not shown) that covers at least a portion of connector hole 209 and prevents external foreign matter from flowing into connector hole.

[0052] Fastening members 250 and 260 can be detachably fastened to at least a portion of the housing 210 using locking members 251 and 261. Fastening members 250 and 260 may include one or more of a retaining member 252, a retaining member fastening hole 253, a guide member 254, and a retaining ring 255.

[0053] The retaining member 252 can be configured to secure the housing 210 and fastening members 250 and 260 to a part of the user's body (e.g., wrist or ankle). The retaining member fastening hole 253, together with the retaining member 252, can secure the housing 210 and fastening members 250 and 260 to the user's body. The guide member 254 can be configured to restrict the range of motion of the retaining member 252 when it is fastened to the retaining member fastening hole 253, thereby allowing the fastening members 250 and 260 to be fastened into close contact with the user's body. The retaining ring 255 can restrict the range of motion of the fastening members 250 and 260 when the retaining member 252 and the retaining member fastening hole 253 are fastened.

[0054] Figure 3 yes Figure 2a An exploded perspective view of an electronic device.

[0055] Reference Figure 3 The electronic device 200 may include a side bezel structure 206, a wheel key 202, a front panel 201, a display 220, a first antenna 350, a second antenna 355, a support member 360 (e.g., a bracket), a battery 370, a printed circuit board 380, a sealing member 390, a rear panel 207, and / or fastening members 250 and 260. At least one component of the electronic device 200 may be coupled with... Figure 1 Electronic device 101 or Figure 2a At least one component of the electronic device 200 is identical or similar, and any redundant description will not be repeated below. The support member 360 may be disposed within the electronic device 200 and connected to the side bezel structure 206, or may be integrally formed with the side bezel structure 206. The support member 360 may be formed of, for example, a metallic and / or non-metallic material (e.g., a polymer). The support member 360 may be configured such that the display 220 is coupled to one of its surfaces and the printed circuit board 380 is coupled to its other surface. A processor, memory, and / or interface may be mounted on the printed circuit board 380. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit (GPU), a sensor processor, or a communication processor.

[0056] The memory may include, for example, volatile or non-volatile memory. The interface may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device 200 to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0057] The battery 370, serving as a means of powering at least one component of the electronic device 200, may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 370 may be disposed on, for example, a plane substantially the same as that of the printed circuit board 380. The battery 370 may be integrally disposed within the electronic device 200, or may be configured to be attached to / removably disposed from the electronic device 200.

[0058] The first antenna 350 may be disposed between the display 220 and the support member 360. The first antenna 350 may include, for example, a near-field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. The first antenna 350 may, for example, perform short-range communication with external devices, wirelessly transmit and receive power required for charging, and transmit magnetically based signals including short-range communication signals or payment data. In another embodiment, the antenna structure may be formed by a portion or combination of the side bezel structure 206 and / or the support member 360.

[0059] The second antenna 355 may be disposed between the circuit board 380 and the rear panel 207. The second antenna 355 may include, for example, a near-field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. The second antenna 355 may, for example, perform short-range communication with external devices, wirelessly transmit and receive power required for charging, and transmit magnetically based signals including short-range communication signals or payment data. In another embodiment, the antenna structure may be formed by a portion of the side frame structure 206 and / or the rear panel 207, or a combination thereof.

[0060] The sealing member 390 may be located between the side frame structure 206 and the rear panel 207. The sealing member 390 may be configured to prevent moisture and foreign matter from being introduced from the outside into the space surrounded by the side frame structure 206 and the rear panel 207.

[0061] Figure 4a A portion of an example electronic device is shown. Figure 4b Example electronic device along Figure 4a A partial cross-sectional view taken from line A-A'.

[0062] Reference Figure 4a and Figure 4b The electronic device 200 may include a housing 210 and a speaker assembly 400. The speaker assembly 400 may include a support structure 450, a coil 460, and a diaphragm 470.

[0063] According to an embodiment, the electronic device 200 may be referred to as a wearable device that can be worn on a part of a user's body (e.g., the wrist). For example, the front surface of the housing 210 of the electronic device 200 (e.g., Figure 2aThe front surface 200A) can be viewed through the display of the electronic device 200 (e.g., Figure 3 The display 220 provides visual information to the user. When the electronic device 200 is worn by the user, the rear surface 200B of the housing 210, opposite to the front surface 200A, can face a part of the user's body. The electronic device 200 can provide visual information to the user through a sensor module (e.g., [missing information]) disposed on the rear surface 210B. Figure 2b The sensor module 211 detects the user's biometric information. For example, the electronic device 200 can be connected to an external electronic device (e.g., Figure 1 The electronic device 200 can provide user-related information via the external electronic device 101. The electronic device 200 may be referred to as... Figure 1 The electronic device 102 or electronic device 104 can be connected to an external electronic device 101, but this disclosure is not limited thereto.

[0064] According to an embodiment, the housing 210 may include a front panel 201, a rear panel 207, and / or a side bezel structure 206. For example, the front panel 201 may be disposed on a display (e.g., Figure 3 The rear panel 207 is used to provide visual information to the user on the display 220. For example, when the electronic device 200 is worn by the user, the rear panel 207 may face a part of the user's body (e.g., the wrist). The rear panel 207 may include, for example, a speaker hole 208 for sound output from the speaker assembly 400. For example, a side bezel structure 206 may surround the space between the front panel 201 and the rear panel 207. The side bezel structure 206 may, for example, cover at least a portion of the front panel 201 and / or at least a portion of the rear panel 207.

[0065] According to an embodiment, the housing 210 may include a fastening portion 401. The fastening portion 401 may be a portion for fastening the speaker assembly 400 to the housing 210. For example, the fastening portion 401 may be fastened to the speaker assembly 400 to secure the speaker assembly 400 inside the housing 210. For example, the fastening portion 401 may be coupled to the speaker assembly 400 to fix the position of the speaker assembly 400 relative to the housing 210. For example, the fastening portion 401 to which the speaker assembly 400 is fastened may be formed in… Figure 2b The rear plate 207 of the housing 210 is used, but this disclosure is not limited thereto.

[0066] According to an embodiment, the speaker assembly 400 may be disposed within the housing 210. The speaker assembly 400 may be configured to output audio. For example, the speaker assembly 400 may be fastened to a fastening portion 401 of the housing 210. For example, the speaker assembly 400 may be disposed between a front surface 210A and a rear surface 210B opposite to the front surface 210A of the housing 210. For example, the speaker assembly 400 may be coupled to a rear plate 207 of the housing 210, but this disclosure is not limited thereto. For example, the speaker assembly 400 may be disposed within the housing 210 facing a speaker aperture 208 of the housing 210 so as to transmit audio output from the speaker assembly 400 to the outside of the electronic device 200. The speaker assembly 400 may be configured to output audio to the outside of the housing 210 to provide sound to a user.

[0067] According to an embodiment, the support structure 450 can generate a magnetic field. The support structure 450 may include a first plate 410, a second plate 420, and a magnet 430. For example, the support structure 450 may be configured to vibrate a diaphragm 470 of the speaker assembly 400 by generating a magnetic field. The support structure 450 may provide space for a coil 460 attached to the diaphragm 470 to vibrate the diaphragm 470. As the diaphragm 470 vibrates by the magnetic field generated within the support structure 450, audio can be output from the speaker assembly 400. For example, the support structure 450 may be supported by at least a portion of the housing 210 (e.g., a fastening portion 401). For example, the support structure 450 may form at least a portion of the exterior of the speaker assembly 400.

[0068] According to an embodiment, the first plate 410 may support at least some of the components included in the speaker assembly 400. For example, the first plate 410 may form a magnetic circuit within the speaker assembly 400 together with the magnet 430. For example, when the speaker assembly 400 is fastened to the housing 210, the first plate 410 may face the interior of the housing 210. The first plate 410 may be referred to as the yoke of the speaker assembly 400, but this disclosure is not limited thereto.

[0069] According to an embodiment, the second plate 420 may be connected to the first plate 410. The second plate 420 may be at least partially disposed on the magnet 430. For example, the second plate 420 may be supported by the magnet 430. By attaching to the magnet 430, the second plate 420 may be configured such that the magnetic flux of the magnetic field formed by the magnet 430 is concentrated in the support structure 450. The second plate 420 may be referred to as the top plate of the speaker assembly 400, but this disclosure is not limited thereto.

[0070] According to an embodiment, magnet 430 may be attached to first plate 410. Magnet 430 may be at least partially disposed between first plate 410 and second plate 420. For example, magnet 430 may be coupled to first plate 410 and second plate 420. Magnet 430 may be at least partially inserted between first plate 410 and second plate 420. Magnet 430 may form a magnetic field together with first plate 410 and second plate 420.

[0071] For example, the second plate 420 may partially contact the first plate 410. For example, the second plate 420 may be coupled to the first plate 410. For example, because the second plate 420 and the first plate 410 are coupled, at least a portion of the first plate 410 and / or the second plate 420 may at least partially surround the magnet 430. Since the support structure 450 is configured to secure the first plate 410 and the second plate 420, the coupling of the first plate 410 and the second plate 420 can prevent the magnet 430 from contacting the coil 460 due to external impact. Furthermore, due to the coupled configuration of the first plate 410 and the second plate 420, the support structure 450 can improve the sound quality of the audio output from the speaker assembly 400. The structure for coupling the first plate 410 and the second plate 420 will be referred to below. Figure 5a And its subsequent accompanying figures and descriptions.

[0072] For example, magnet 430 may include a first magnet 431, a second magnet 432 spaced apart from the first magnet 431, and / or a third magnet 433 between the first magnet 431 and the second magnet 432. For example, support structure 450 may form a magnetic field through a first plate 410, a first magnet 431, a second plate 420, and a third magnet 433. For example, support structure 450 may form a magnetic field through a first plate 410, a second magnet 432, a second plate 420, and a third magnet 433. Forming a magnetic field in support structure 450 may cause coil 460 to vibrate through the magnetic field.

[0073] According to an embodiment, coil 460 may be configured to vibrate by a magnetic field formed by support structure 450. For example, coil 460 may pass through second plate 420. Coil 460 may be at least partially surrounded by magnet 430. For example, coil 460 may be at least partially disposed within support structure 450. For example, magnet 430 may include first magnet 431, second magnet 432, and third magnet 433. Coil 460 may be configured to generate sound waves passing through diaphragm 470 by interacting with magnet 430 via current in coil 460. For example, coil 460 may include conductive material. When alternating current (AC) flows through coil 460, coil 460 may vibrate by a magnetic field formed within support structure 450.

[0074] According to an embodiment, the diaphragm 470 may be attached to the coil 460. For example, the diaphragm 470 may be configured to vibrate based on the vibration of the coil 460 via a magnetic field formed in the support structure 450. For example, as the diaphragm 470 vibrates via the coil 460, the pressure of the air surrounding the diaphragm 470 may change. The diaphragm 470 may be configured to output audio by changing the air pressure.

[0075] According to an embodiment, the housing 210 may include a speaker aperture 208 and a sound conduit 403 for audio output from the speaker assembly 400, the sound conduit 403 extending from the speaker aperture 208 to a diaphragm 470 of the speaker assembly 400 fastened to a fastening portion 401. For example, the speaker aperture 208 may be formed on a side surface of the housing 210 (e.g., Figure 2a On the side surface 210C). For example, the speaker hole 208 may be disposed adjacent to the fastening portion 401 to which the speaker assembly 400 is fastened, so as to transmit audio output from the speaker assembly 400 to the outside of the electronic device 200. For example, the acoustic conduit 403 may be the path through which the audio output from the speaker assembly 400 is transmitted to the outside of the electronic device 200. For example, the acoustic conduit 403 may be connected from the speaker hole 208 to the interior space of the housing 210. For example, one end of the acoustic conduit 403 may be connected to the speaker hole 208. The other end opposite to said one end of the acoustic conduit 403 may be connected to the diaphragm 470 of the speaker assembly 400 fastened to the fastening portion 401. The housing 210 may include the speaker hole 208 and the acoustic conduit 403 to provide a path for the audio output from the speaker assembly 400.

[0076] According to an embodiment, the housing 210 may include a support portion 402 for supporting the speaker assembly 400. The diaphragm 470 may include a first elastic member 471 and a second elastic member 472, the first elastic member 471 being attached to the coil 460, and the second elastic member 472 extending from the first elastic member 471 and configured to be at least partially pressed by the support portion 402 to reduce the inflow of foreign matter from outside the electronic device 200 into the magnet 430. For example, the first elastic member 471 may be a deformable portion of the diaphragm 470 by vibration of the coil 460. The first elastic member 471 may be a portion that outputs audio by vibration of the coil 460. For example, the support portion 402 of the housing 210 may be a portion that contacts the diaphragm 470 of the speaker assembly 400 fastened to the fastening portion 401. The support portion 402 may be a portion forming a sound duct 403 for audio output from the speaker assembly 400.

[0077] For example, the second elastic member 472 may be coupled to the first elastic member 471 to support the first elastic member 471. The second elastic member 472 may at least partially contact the support portion 402 of the housing 210. For example, by pressing the support portion 402, the second elastic member 472 may reduce foreign matter introduced from the outside of the electronic device 200 into the internal space of the housing 210 through the speaker hole 208 and the acoustic duct 403. The second elastic member 472 may improve the sound quality of the speaker assembly 400 by reducing the inflow of foreign matter from the outside into the support structure 450 that forms the magnetic field of the speaker assembly 400. The second elastic member 472 may be referred to as a waterproof structure because it reduces the inflow of foreign matter from the outside of the electronic device 200 into the electronic device 200, but this disclosure is not limited thereto.

[0078] According to an embodiment, the electronic device 200 may include a support member 480 that supports a first plate 410 of a speaker assembly 400 and is fastened to a fastening portion 401. For example, the support member 480 may cover at least a portion of the speaker assembly 400 fastened to the fastening portion 401. For example, the support member 480 may be fastened together with the speaker assembly 400 to the fastening portion 401. For example, a portion of the support member 480 may contact the speaker assembly 400. For example, a portion of the support member 480 may face the first plate 410 of the speaker assembly 400. For example, the housing 210 may include a protruding structure 405 spaced apart from the fastening portion 401. A portion of the support member 480 for supporting the speaker assembly 400 may be coupled to the protruding structure 405 to support the speaker assembly 400. By including the support member 480, the electronic device 200 may reduce the separation of the speaker assembly 400 from the housing 210 due to external impacts.

[0079] According to an embodiment, the speaker assembly 400 may include a fastening structure 440 that is fastened to a fastening portion 401 of the housing 210. For example, the fastening structure 440 may protrude from the speaker assembly 400. For example, the fastening structure 440 may extend from a component of the speaker assembly 400. For example, the fastening structure 440 may be supported by the fastening portion 401. By including the fastening structure 440 fastened to the fastening portion 401 of the housing 210, the speaker assembly 400 may reduce separation of the speaker assembly 400 from the housing 210.

[0080] According to an embodiment, the speaker assembly 400 can be pressed by a foreign object introduced from outside the electronic device 200. For example, the diaphragm 470 of the speaker assembly 400 can be pressed against the internal space of the housing 210 by a foreign object introduced from outside the electronic device 200 through the speaker hole 208 and the acoustic duct 403. Due to the pressure exerted by the foreign object, the fastening structure 440 of the speaker assembly 400 can deform with the speaker assembly 400. The fastening structure 440 may require a structure to reduce the degradation of the sound quality of the speaker assembly 400 due to deformation of the fastening structure 440 and to reduce the inflow of foreign objects into the internal space of the housing 210. Such a structure for improving the fastening of the speaker assembly 400 to the housing 210 will be referred to below. Figure 5a And its subsequent accompanying figures and descriptions.

[0081] According to an embodiment, the electronic device 200 may include a fastening member 490 for securing the speaker assembly 400 to the housing 210. For example, the fastening member 490 may secure a fastening structure 440 of the speaker assembly 400 to a fastening portion 401. For example, the fastening member 490 may be coupled to at least a portion of the fastening structure 440 and the fastening portion 401. The fastening member 490 may pass through at least a portion of the fastening structure 440 and the fastening portion 401. For example, the electronic device 200 may include a support member 480, which is fastened to the fastening portion 401 and configured to support the speaker assembly 400. The fastening member 490 may be coupled to the fastening portion 401, the fastening structure 440 of the speaker assembly 400, and the support member 480 to secure the speaker assembly 400 and the support member 480 to the fastening portion 401.

[0082] According to the above embodiments, the electronic device 200 may include a speaker assembly 400 for providing sound to a user of the electronic device 200. The speaker assembly 400 may include a support structure 450 and a diaphragm 470, the diaphragm 470 being configured to vibrate through the support structure 450 to output audio. A first plate 410 of the support structure 450 may be coupled to a second plate 420 to improve the sound quality of the audio output from the speaker assembly 400.

[0083] Figure 5a This is an exploded perspective view of the speaker assembly of the example electronic device. Figure 5b This is a partial exploded perspective view of the speaker assembly of the example electronic device. Figure 5c This is a perspective view of the speaker assembly of an example electronic device.

[0084] Reference Figure 5a , Figure 5b and Figure 5c Electronic devices (e.g.) Figure 2a Electronic device 200) may include fastening parts (e.g., Figure 4a The housing (e.g., fastening part 401) of the fastening part 401 Figure 2a The loudspeaker assembly 400 includes a housing 210 and a speaker assembly 400 disposed within the housing 210 and configured to output audio. The loudspeaker assembly 400 may include a support structure 450 that forms a magnetic field and includes a first plate 410, a magnet 430 attached to the first plate 410, and a second plate 420 coupled to the first plate 410 and at least partially disposed on the magnet 430. The loudspeaker assembly 400 may include a coil 460 configured to vibrate via the magnetic field and a diaphragm 470 attached to the coil 460.

[0085] In the following text, the similarities to those previously mentioned will not be repeated. Figure 4a and Figure 4b The accompanying drawings contain redundant descriptions of parts with the same reference numerals.

[0086] According to an embodiment, the support structure 450 can be fastened to the fastening portion 401 of the housing 210 to connect the speaker assembly 400 to the housing 210. For example, the support structure 450 can be coupled to the housing 210. For example, at least a portion of the support structure 450 can be fastened to the fastening portion 401 to fix the position of the speaker assembly 400 relative to the housing 210. For example, at least a portion of the first plate 410 and / or the second plate 420 of the support structure 450 can be fastened to the fastening portion 401 of the housing 210. The support structure 450 can be configured to be fastened to the fastening portion 401 of the housing 210 to improve the fastening integrity of the speaker assembly 400 relative to the housing 210.

[0087] According to an embodiment, the support structure 450 may further include a fastening structure 440, which is supported by the fastening portion 401 and configured to fasten the speaker assembly 400 to the fastening portion 401. The fastening structure 440 may be formed at least partially from at least one of the first plate 410 and the second plate 420. For example, refer to... Figure 5a and Figure 5b The fastening structure 440 can be formed on the second plate 420 of the support structure 450. Because the second plate 420 is connected to the first plate 410 to which the magnet 430 is attached, the fastening structure 440 can be connected to both the first plate 410 and the magnet 430. The fastening structure 440 can be formed on the second plate 420 to improve the fastening integrity of the speaker assembly 400 to the housing 210 when the fastening structure 440 is fastened to the fastening portion 401 of the housing 210. For example, see reference... Figure 5c ,and Figure 5a and Figure 5bConversely, as shown, a fastening structure 440 can be formed on the first plate 410 of the support structure 450. Because the first plate 410, to which the magnet 430 is attached, is connected to the second plate 420, the fastening structure 440 can be connected to the second plate 420. The fastening structure 440 can be formed on the first plate 410, thereby improving the fastening integrity of the speaker assembly 400 to the housing 210 when the fastening structure 440 is fastened to the fastening portion 401 of the housing 210.

[0088] Although the first plate 410 or the second plate 420 has been described as including a fastening structure 440, this disclosure is not limited thereto. Although not shown, the fastening structure 440 may be formed by joining a portion of the first plate 410 and a portion of the second plate 420. Since the fastening structure 440 is formed within the support structure 450, such that the support structure 450 is fastened to the housing 210, the fastening structure 440 can simplify the structure of the speaker assembly 400 and improve the fastening integrity of the speaker assembly 400 to the housing 210 when the speaker assembly 400 is fastened to the housing 210.

[0089] According to an embodiment, the first plate 410 and the second plate 420 may include metal. For example, the first plate 410 and the second plate 420 may each include metal, thereby forming a magnetic field within the support structure 450 together with the magnet 430. Since the first plate 410 and the second plate 420 each include metal, the support structure 450 fastened to the fastening portion 401 of the housing 210 can improve the fastening integrity of the speaker assembly 400 to the housing 210.

[0090] Reference Figure 5a and Figure 5b The second plate 420 may include a first portion 421 and a second portion 422. The first portion 421 includes a hole 421a for the coil 460 to pass through and is located on the magnet 430. The second portion 422 is connected to the first portion 421 and configured to fasten the support structure 450 to the fastening portion 401.

[0091] For example, the first portion 421 may be a portion disposed on the magnet 430. The first portion 421 may be a portion that, together with the magnet 430, forms the magnetic field of the support structure 450. For example, the first portion 421 may allow a coil 460 to pass through via a hole 421a, such that the coil 460 at least partially faces the magnet 430. For example, the magnet 430 may include a first magnet 431, a second magnet 432 spaced apart from the first magnet 431, and a third magnet between the first magnet 431 and the second magnet 432. For example, the first portion 421 may be located on the first magnet 431 and the second magnet 432. The hole 421a of the first portion 421 may be located on the third magnet 433, such that the coil 460 passing through the hole 421a is at least partially disposed within the gap between the first magnet 431 and the third magnet 433 and within the gap between the second magnet 432 and the third magnet 433. The coil 460 may partially surround the third magnet 433. The coil 460 can partially surround the third magnet 433, so the coil 460 can be configured to vibrate through the magnetic field formed by the support structure 450.

[0092] For example, the second portion 422 may be referred to as a fastening structure 440 for fastening to the fastening portion 401 of the housing 210. For example, the second portion 422 may extend from the first portion 421 to protrude from the speaker assembly 400. For example, the second portion 422 may include a structure for coupling with the first plate 410.

[0093] According to an embodiment, the electronic device 200 may include fastening members for securing the speaker assembly 400 to the housing 210 (e.g., Figure 4a The second portion 422 may include a first fastening hole 441 for fastening the second plate 420 to the fastening portion 401 by passing the fastening member 490 through it. For example, the fastening member 490 may pass through the first fastening hole 441 to connect the second portion 422 to the fastening portion 401 of the housing 210. The second portion 422 can be fastened to the fastening portion 401 of the housing 210 by means of the fastening member 490. With the second portion 422 of the second plate 420 fastened to the housing 210, the support structure 450 can improve the fastening integrity of the speaker assembly 400 to the housing 210.

[0094] Reference Figure 5c The first plate 410 may include a first region 411 and a second region 412, a magnet 430 is disposed on the first region 411, and the second region 412 extends from the first region 411 and is configured to fasten the support structure 450 to the fastening portion 401.

[0095] For example, the first region 411 may be the region attached to the magnet 430. The first region 411 may also be the region supporting the magnet 430. For example, the first region 411 may be the region facing the coil 460 through the hole 421a of the second plate 420. For example, the second region 412 may be referred to as a fastening structure 440 for fastening to the fastening portion 401 of the housing 210. For example, the second region 412 may protrude from the speaker assembly 400. For example, the second region 412 may include structures for coupling with the first plate 410.

[0096] According to an embodiment, the electronic device 200 may include a fastening member 490 for securing the speaker assembly 400 to the housing 210. The housing 210 may include protruding structures spaced apart from the fastening portion 401 (e.g., Figure 4a The protruding structure 405). The second region 412 may be a region including a structure for connection with the second plate 420. The second region 412 may include a second fastening hole 442 for fastening the first plate 410 to the fastening portion 401 by passing a fastening member 490 through it, and a structure for fastening the first plate 410 to the second plate 420 (e.g., the protruding structure 405). Figure 5b The first plate 410 may include a third region 413 extending from the first region 411 and spaced apart from the second region 412, the third region 413 including a connection hole 443 into which the protruding structure 405 is inserted. For example, a fastening member 490 may pass through a second fastening hole 442 to connect the second region 412 to the fastening portion 401 of the housing 210. The second region 412 can be fastened to the fastening portion 401 of the housing 210 by means of the fastening member 490.

[0097] For example, the third region 413 may extend in a direction different from that of the second region 412 extending from the first region 411. The connection hole 443 in the third region 413 may be fastened to the protruding structure 405 of the housing 210, while the second region 412 is fastened to the fastening portion 401 of the housing 210. The third region 413 may be coupled to the protruding structure 405 to, together with the second region 412, fasten the first plate 410 to the housing 210. By fastening the second region 412 and the third region 413 to the housing 210, the support structure 450 can improve the fastening integrity of the speaker assembly 400 to the housing 210.

[0098] Return to reference Figure 5a , Figure 5b and Figure 5c The first plate 410 may include a first connecting structure 530, which includes first connecting grooves 531 and 532 for connecting with the second plate 420.

[0099] The second plate 420 may include a second connecting structure 540, which includes first protrusions 541 and 542 respectively fastened to the first connecting slots 531 and 532. For example, the first plate 410 may include a first region 411 to which the magnet 430 is attached and a second region 412 extending from the first region 411. The second plate 420 may include a first portion 421 located on the magnet 430 and a second portion 422 extending from the first portion 421. The first connecting structure 530 may be formed within the second region 412 for connection to the second connecting structure 540. For example, the second connecting structure 540 may be formed within the second portion 422.

[0100] For example, the first protrusions 541 and 542 may be at least partially located within the first connecting grooves 531 and 532, respectively, thereby securing the second plate 420 and the first plate 410. For example, the first protrusions 541 and 542 may each have a shape corresponding to the first connecting grooves 531 and 532. For example, the first protrusions 541 and 542 may be connected to the first connecting grooves 531 and 532 by welding. However, this disclosure is not limited thereto.

[0101] Although the first connection structure 530 and the second connection structure 540 have been described as structures for connecting the first plate 410 and the second plate 420, this disclosure is not limited thereto. The first plate 410 and the second plate 420 may each include multiple connection structures for connecting to each other. By connecting the first plate 410 and the second plate 420, the support structure 450 can improve the fastening integrity of the speaker assembly 400 to the housing 210 and enhance the sound quality of the audio output from the speaker assembly 400.

[0102] According to an embodiment, the speaker assembly 400 may include a frame 510 supporting a diaphragm 470 and connected to a second plate 420. The second plate 420 may include a third coupling structure 550, which includes second protrusions 551, 552, 553, and 554 for coupling with the frame 510. The frame 510 may include a fourth coupling structure 560, which includes second coupling slots 561, 562, 563, and 564 respectively fastened to the second protrusions 551, 552, 553, and 554.

[0103] For example, frame 510 may be coupled to diaphragm 470. Frame 510 may be disposed between diaphragm 470 and support structure 450. For example, frame 510 may be configured to press diaphragm 470 against support portion of housing 210 when speaker assembly 400 is fastened to fastening portion 401 of housing 210 (e.g., Figure 4a(Support portion 402). For example, a frame 510 may be disposed on a support structure 450. The frame 510 may contact a second plate 420 and / or a magnet 430 of the support structure 450. The frame 510 may be coupled to the support structure 450 to form at least a portion of the appearance of the speaker assembly 400 and to support the diaphragm 470.

[0104] For example, the second plate 420 may include a first portion 421 located on the magnet 430 and a second portion 422 extending from the first portion 421. In an embodiment, a third coupling structure 550 may be formed within the first portion 421 to couple to the frame 510. The second portion 422 may be a portion of a fastening portion 401 for fastening the speaker assembly 400 to the housing 210. For example, second protrusions 551, 552, 553, and 554 may be accommodated within second coupling slots 561, 562, 563, and 564, respectively, thereby coupling the second plate 420 and the frame 510. For example, the second protrusions 551, 552, 553, and 554 may have shapes corresponding to the shapes of the second coupling slots 561, 562, 563, and 564. For example, the second protrusions 551, 552, 553, and 554 may be coupled to the second coupling slots 561, 562, 563, and 564 by welding, respectively. However, this disclosure is not limited thereto.

[0105] Although the third connection structure 550 and the fourth connection structure 560 have been described as structures for connecting the support structure 450 and the frame 510, this disclosure is not limited thereto. The support structure 450 and the frame 510 may each include multiple connection structures for connecting to each other. By connecting the support structure 450 and the frame 510, the speaker assembly 400 can improve the fastening integrity of the speaker assembly 400 to the housing 210 and improve the sound quality of the audio output from the speaker assembly 400.

[0106] According to the above embodiment, the speaker assembly 400 of the electronic device 200 is configured such that the support structure 450 forming the magnetic field is fastened to the housing 210, thereby improving the fastening integrity of the speaker assembly 400 to the housing 210. Due to the structure including the first plate 410 and the second plate 420 being connected, the support structure 450 can improve the sound quality of the audio output from the speaker assembly 400.

[0107] Figure 6a This is a partial exploded perspective view of the speaker assembly of the example electronic device. Figure 6b This is a perspective view of the speaker assembly of an example electronic device.

[0108] Reference Figure 6a and Figure 6b Electronic devices (e.g.) Figure 2a Electronic device 200) may include fastening parts (e.g., Figure 4a The housing (e.g., fastening part 401) of the fastening part 401 Figure 2a The speaker assembly 400 includes a housing 210 and a speaker assembly 400 disposed within the housing 210 and configured to output audio. The speaker assembly 400 may include a support structure 450 that forms a magnetic field and includes a first plate 410, a magnet 430 attached to the first plate 410, and a second plate 420 coupled to the first plate 410 and at least partially disposed on the magnet 430. The speaker assembly 400 may include a coil (e.g., [unclear text - possibly a reference to a magnetic field]) configured to vibrate via the magnetic field. Figure 4b The speaker assembly 400 includes a coil 460 and a diaphragm 470 attached to the coil 460. A support structure 450 can be fastened to a fastening portion 401 to connect the speaker assembly 400 to the housing 210. According to an embodiment, the first plate 410 may include a first connection structure 530 for connection to a second plate 420. The second plate 420 may include a second connection structure 540 connected to the first connection structure 530. According to an embodiment, the speaker assembly 400 may include a frame 510 supporting the diaphragm 470 and connected to the second plate 420. The second plate 420 may include a third connection structure 550 for connection to the frame 510. The frame 510 may include a fourth connection structure 560 connected to the third connection structure 550.

[0109] According to an embodiment, the speaker assembly 400 may include a connecting member 610, which is fastened to a frame 510, a first plate 410, and a second plate 420 to connect a support structure 450 to the frame 510. For example, the connecting member 610 may contact the support structure 450 and the frame 510. For example, the connecting member 610 may connect the frame 510 to the second plate 420. The connecting member 610 may connect the second plate 420 to the first plate 410 to which a magnet 430 is attached. For example, the first plate 410 may include a first region 411 to which the magnet 430 is attached and a second region 412 extending from the first region 411. The second plate 420 may include a first portion 421 located on the magnet 430 and a second portion 422 extending from the first portion 421. The connecting member 610 may fasten the second portion 422 to the second region 412. The connecting member 610 may fasten the second portion 422 to the frame 510. However, this disclosure is not limited thereto. The speaker assembly 400 may include a connecting member 610 for fastening the frame 510, the first plate 410 and the second plate 420, thereby improving the connection force between the components of the speaker assembly 400 and enhancing the sound quality of the audio output from the speaker assembly 400.

[0110] According to an embodiment, the connecting member 610 may include at least one of plastic or metal materials to fasten the frame 510, the first plate 410, and / or the second plate 420 to each other, but this disclosure is not limited thereto. By including the connecting member 610, the speaker assembly 400 can reduce the separation of each component of the speaker assembly 400 from the speaker assembly 400.

[0111] According to an embodiment, the support structure 450 may further include a fastening structure 440 supported by the fastening portion 401 and configured to fasten the speaker assembly 400 to the fastening portion 401. The fastening structure 440 may be formed at least partially from at least one of a first plate 410 or a second plate 420. The support structure 450 may include a shielding member 620 attached to the fastening structure 440 to electrically disconnect the housing 210 and the speaker assembly 400. For example, the shielding member 620 may include a non-conductive material. When the fastening structure 440 is fastened to the fastening portion 401 of the housing 210, the shielding member 620 may be disposed on a surface of the fastening structure 440 facing the fastening portion 401. For example, when the speaker assembly 400 is fastened to the fastening portion 401, the shielding member 620 may be configured to be interposed between the fastening structure 440 and the fastening portion 401. The support structure 450 may include a shielding member 620 to electrically disconnect the housing 210 from the conductive first plate 410 and / or second plate 420. By electrically disconnecting the housing 210 from the first plate 410 and / or second plate 420, the shielding member 620 may further enhance the sound quality of the audio output from the speaker assembly 400.

[0112] According to the above embodiment, the speaker assembly 400 of the electronic device 200 includes a connecting member 610 for connecting the support structure 450 and the frame 510, thereby improving the connection force between the components of the speaker assembly 400 and enhancing the sound quality of the audio output from the speaker assembly 400. The support structure 450 can further improve the sound quality of the audio output from the speaker assembly 400 by including a shielding member 620 attached to the fastening structure 440 to fasten to the housing 210.

[0113] Figure 7a , Figure 7b , Figure 7c , Figure 7d and Figure 7e This is a perspective view of the speaker assembly of an example electronic device.

[0114] Reference Figure 7a , Figure 7b , Figure 7c , Figure 7d and Figure 7e Electronic devices (e.g.) Figure 2aElectronic device 200) may include fastening parts (e.g., Figure 2a The housing (e.g., fastening part 401) of the fastening part 401 Figure 2a The speaker assembly 400 includes a housing 210 and a speaker assembly 400 disposed within the housing 210 and configured to output audio. The speaker assembly 400 may include a support structure 450 that forms a magnetic field and includes a first plate 410, a magnet 430 attached to the first plate 410, and a second plate 420 coupled to the first plate 410 and at least partially disposed on the magnet 430. The speaker assembly 400 may include a coil (e.g., [unclear text - possibly a reference to a magnetic field]) configured to vibrate via the magnetic field. Figure 4b The speaker assembly 400 may include a coil 460 and a diaphragm 470 attached to the coil 460. The speaker assembly 400 may include a frame 510 that supports the diaphragm 470 and is coupled to a second plate 420. A support structure 450 may be fastened to a fastening portion 401 to couple the speaker assembly 400 to the housing 210. The support structure 450 may include a fastening structure 440 supported by the fastening portion 401 and configured to fasten the speaker assembly 400 to the fastening portion 401. The fastening structure 440 may be formed at least partially from at least one of the first plate 410 or the second plate 420. The speaker assembly 400 may include a coupling member 610 that couples the support structure 450 to the frame 510 by fastening it to the frame 510, the first plate 410, and the second plate 420.

[0115] Reference Figure 7a , Figure 7b and Figure 7c The connecting member 610 may include an assembly structure 611 for supporting the fastening structure 440. For example, the assembly structure 611 may protrude from the speaker assembly 400 to engage with the fastening structure 440. For example, the assembly structure 611 may contact the fastening structure 440. For example, the assembly structure 611 may be fastened together with the fastening structure 440 to a fastening portion 401 of the housing 210.

[0116] Reference Figure 7b The fastening structure 440 may include a first fastening region 440a and a second fastening region 440b spaced apart from the first fastening region 440a. The assembly structure 611 of the connecting member 610 can reinforce the fastening structure 440 by being inserted between the first fastening region 440a and the second fastening region 440b.

[0117] Reference Figure 7cThe assembly structure 611 may include a first assembly portion 611a and a second assembly portion 611b spaced apart from the first assembly portion 611a. A fastening structure 440 may be disposed between the first assembly portion 611a and the second assembly portion 611b. The first assembly portion 611a and the second assembly portion 611b may support the fastening structure 440 to reinforce it.

[0118] Reference Figure 7d A portion of the fastening structure 440 may be formed by the assembly structure 611. In this case, the remainder of the fastening structure 440 may be formed by the first plate 410 and / or the second plate 420 of the support structure 450. The assembly structure 611 may reinforce or replace the fastening structure 440 by forming at least a portion of the fastening structure 440.

[0119] Reference Figure 7e The angle α of the fastening structure 440 relative to the speaker assembly 400 can be adjusted. In embodiments, the fastening structure 440 can form various angles α relative to the speaker assembly 400 to improve the fastening integrity of the speaker assembly 400 to the housing 210.

[0120] According to an embodiment, the fastening structure 440 may be configured to be rotatable relative to the speaker assembly 400. By being rotatable relative to the speaker assembly 400, the fastening structure 440 may have various angles α relative to the speaker assembly 400. For example, the speaker assembly 400 may include a bearing (not shown) or a wheel structure (not shown) coupled to the fastening structure 440 and configured to rotate the fastening structure 440 relative to the speaker assembly 400. The structure configured to rotate the fastening structure 440 may be formed within, for example, the connecting member 610. The fastening structure 440 may be configured such that angle α is adjustable to further improve the fastening integrity of the fastening structure 440 relative to the housing 210.

[0121] According to the above embodiments, the speaker assembly 400 of the electronic device 200 may include an assembly structure 611 configured to form at least a portion of a fastening structure 440 fastened to a fastening portion 401 of the housing 210 or to support the fastening structure 440, thereby reducing damage to the fastening structure 440 from external impacts and improving the fastening integrity of the fastening structure 440 relative to the housing 210.

[0122] Figure 8a A portion of an example electronic device is shown. Figure 8b Example electronic device along Figure 8a A partial cross-sectional view taken from line B-B'.

[0123] Reference Figure 8a and Figure 8bThe electronic device 101 may include a housing 810 including a fastening portion 811 and a speaker assembly 400 disposed within the housing 810 and configured to output audio. The speaker assembly 400 may include a support structure 450 that forms a magnetic field and includes a first plate 410, a magnet 430 attached to the first plate 410, and a second plate 420 coupled to the first plate 410 and at least partially disposed on the magnet 430. The speaker assembly 400 may include a coil 460 configured to vibrate via the magnetic field and a diaphragm 470 attached to the coil 460. The support structure 450 may be fastened to the fastening portion 811 to connect the speaker assembly 400 to the housing 810. According to an embodiment, the housing 810 may include a support portion 812. The support portion 812 may support the diaphragm 470 of the speaker assembly 400. According to an embodiment, the housing 810 may include a speaker aperture 813 and a sound duct 814.

[0124] According to an embodiment, the electronic device 101 may be connected to... Figures 2a to 7b The electronic devices shown are 200 different electronic devices. For example, electronic device 101 can be referred to as... Figure 1 The electronic device 101, which can be connected to Figures 2a to 7b The electronic device 200 shown.

[0125] According to an embodiment, the support structure 450 may include a fastening structure 440 for fastening to the fastening portion 811 of the housing 810. The fastening structure 440 may, for example, be formed on a first plate 410 or a second plate 420 of the support structure 450. As the support structure 450 is fastened to the housing 810, it can further improve the fastening integrity of the speaker assembly 400 relative to the housing 810.

[0126] For example, a speaker assembly 400 may be disposed on a sound duct 814 connected to a speaker aperture 813. A diaphragm 470 of the speaker assembly 400 may be disposed facing the sound duct 814 to output sound through the speaker aperture 813. A fastening structure 440 of the speaker assembly 400 may secure the speaker assembly 400 to the housing 810 by fastening a fastening portion 811 to the housing 810 such that the diaphragm 470 faces the sound duct 814. For example, the fastening structure 440 may be configured to protrude from a second plate 420 of a support structure 450 to engage with the fastening portion 811 of the housing 810. For example, although not shown here, the fastening structure 440 may be configured to protrude from a first plate 410 of a support structure 450 to engage with the fastening portion 811 of the housing 810. For example, the fastening structure 440 may be disposed by fastening members (e.g., Figure 4aThe fastening member 490 is connected to the fastening portion 811 of the housing 810. For example, a frame 510, connected to the support structure 450 and configured to support the diaphragm 470, can be mounted on the support portion 812 of the housing 810. The speaker assembly 400 can be connected to the housing 810 such that the fastening structure 440 is fastened to the fastening portion 811 of the housing 810, and the frame 510 is supported on the support portion 812 of the housing 810, thereby improving the fastening integrity of the housing 810. However, this disclosure is not limited thereto.

[0127] The loudspeaker assembly 400 can be disposed within various electronic devices including electronic device 101 and electronic device 200. The magnetic field-generating support structure 450 of the loudspeaker assembly 400 can be configured to be fastened to the housing of the various electronic devices, thereby improving the fastening integrity of the loudspeaker assembly 400 within the various electronic devices.

[0128] According to the above embodiments, the speaker assembly 400 of the electronic device 101 may include a support structure 450 that is fastened to the fastening portion 811 of the housing 810 of the electronic device 101 and forms a magnetic field, thereby improving the fastening integrity of the speaker assembly 400 relative to the housing 810.

[0129] According to the above embodiments, electronic devices (e.g., Figure 1 Electronic device 101 or Figure 2a Electronic device 200) may include fastening parts (e.g., Figure 2a Fastening part 401 Figure 8a The housing of the fastening part 811) (e.g., Figure 2a 210 shell Figure 8a The housing 810). The electronic device may include a speaker assembly disposed within the housing and configured to output audio (e.g., Figure 4a The speaker assembly 400 may include a support structure (e.g., Figure 4b The supporting structure 450), the supporting structure forms a magnetic field and includes a first plate (e.g., Figure 4b The first plate 4100), and the magnet attached to the first plate (e.g., Figure 4b The magnet 430), and the second plate (e.g., connected to the first plate and at least partially disposed on the magnet), are connected to the first plate and disposed on the magnet. Figure 4b The second plate 420). The speaker assembly may include a coil configured to vibrate via a magnetic field (e.g., Figure 4b The coil 460) and the diaphragm attached to the coil (e.g., Figure 4b(Diaphragm 470). The support structure can be fastened to the fastening portion to connect the speaker assembly to the housing. According to the foregoing embodiment, the speaker assembly can be configured such that the support structure forming the magnetic field is fastened to the housing, thereby improving the fastening integrity of the speaker assembly to the housing and enhancing the sound quality of the audio output from the speaker assembly. The above embodiments can provide various effects including the effects described above.

[0130] According to an embodiment, the second plate may include a first portion (e.g., Figure 5a Part 421) and Part 2 (e.g., Figure 5a The second part 422), the first part includes a hole for the coil to pass through (e.g., Figure 5a The second portion is connected to the first portion and configured to secure the support structure to the fastening portion. According to the above embodiment, the speaker assembly can be configured such that the second plate is fastened to the housing, thereby improving the fastening integrity of the speaker assembly to the housing and enhancing the sound quality of the audio output from the speaker assembly.

[0131] According to embodiments, the electronic device may further include fastening members for securing the speaker assembly to the housing (e.g., Figure 4a The fastening member 490). The second part may include a fastening hole (e.g., fastening member 490). Figure 5a The first fastening hole 441 is used to fasten the second plate to the fastening portion by passing a fastening member through it. According to the above embodiment, the speaker assembly can be configured such that the second plate is fastened to the housing, thereby improving the fastening integrity of the speaker assembly to the housing and enhancing the sound quality of the audio output from the speaker assembly. The above embodiments can provide various effects including the aforementioned effects.

[0132] According to an embodiment, the first plate may include a first region (e.g., Figure 5c The first region 411) and the second region (e.g., Figure 5c The second region 412), with a magnet disposed on the first region, extends from the first region and is configured to secure the support structure to the fastening portion. According to the above embodiment, the speaker assembly can be configured such that the first plate is fastened to the housing, thereby improving the fastening integrity of the speaker assembly to the housing and enhancing the sound quality of the audio output from the speaker assembly. The above embodiments can provide various effects including the aforementioned effects.

[0133] According to an embodiment, the electronic device may further include a fastening member for securing the speaker assembly to the housing. The housing may further include protruding structures spaced apart from the fastening portion (e.g., Figure 4a The prominent structure 405). The first plate may further include a third region spaced apart from the second region (e.g., Figure 5cThe third region 414), extends from the first region and includes a connection hole into which a protruding structure will be inserted (e.g., Figure 5c The connecting hole 443). The second region may include a fastening hole (e.g., Figure 5c The second fastening hole 442 is used to fasten the first plate to the fastening portion by passing a fastening member through it. According to the above embodiment, the speaker assembly can be configured such that the first plate is fastened to the housing, thereby improving the fastening integrity of the speaker assembly to the housing and enhancing the sound quality of the audio output from the speaker assembly. The above embodiments can provide various effects including the aforementioned effects.

[0134] According to an embodiment, the first plate may include a first connection structure (e.g., Figure 5b The first connection structure 530 includes a first connection groove for connection with the second plate (e.g., ...). Figure 5b The first connecting slots 531 and 532). The second plate may include a second connecting structure (e.g., the first connecting slots 531 and 532). Figure 5b The second connection structure 540 includes first protrusions (e.g., fastened to the first connection groove) respectively. Figure 5b (First protrusions 541 and 542). According to the above embodiments, the speaker assembly may include a structure in which the first plate is coupled to the second plate, thereby improving the fastening integrity of the speaker assembly to the housing and enhancing the sound quality of the audio output from the speaker assembly. The above embodiments can provide various effects including the aforementioned effects.

[0135] According to an embodiment, the speaker assembly may further include a frame that supports the diaphragm and is coupled to the second plate (e.g., Figure 5a Frame 510). The second plate may include a third connection structure (e.g., Figure 5a The third connection structure 550 includes a second protrusion for connection with the frame (e.g., Figure 5a The second protrusions 551, 552, 553, and 554). The frame may include a fourth connection structure (e.g., Figure 5a The fourth connection structure 560 includes second connection grooves (e.g., fastened to the second protrusion respectively) Figure 5a (Second connecting slots 561, 562, 563, and 564). According to the above embodiments, the speaker assembly may include a support structure connected to the frame, thereby improving the fastening integrity of the speaker assembly to the housing and further enhancing the sound quality of the audio output from the speaker assembly. The above embodiments can provide various effects including the aforementioned effects.

[0136] According to an embodiment, the speaker assembly may further include a connecting member (e.g., fastened to the frame, the first plate, and the second plate to connect the support structure to the frame). Figure 6a(Connecting member 610). According to the above embodiments, the speaker assembly may include a connecting member, thereby improving the fastening integrity of the speaker assembly to the housing and enhancing the sound quality of the audio output from the speaker assembly. The above embodiments can provide various effects including the aforementioned effects.

[0137] According to an embodiment, the housing may further include a support portion for supporting the speaker assembly (e.g., Figure 4b The support portion 402). The diaphragm may include a first elastic member (e.g., Figure 4b The first elastic member 471) and the second elastic member (e.g., Figure 4b The second elastic member 472 is attached to the coil, and the first elastic member extends from the first elastic member and is configured to reduce the ingress of foreign matter from outside the electronic device into the magnet by being pressed at least partially by a supported portion. According to the aforementioned embodiment, by including the first and second elastic members, the diaphragm can provide sound to the user and reduce the introduction of foreign matter from the outside into the electronic device. The foregoing embodiments can provide various effects including those described above.

[0138] According to an embodiment, the magnet may include a first magnet attached to the second plate (e.g., Figure 4b The first magnet 431), and the second magnet attached to the second plate and spaced apart from the first magnet (e.g., the first magnet 431), and the second magnet (e.g., the second magnet 431) are attached to the second plate and spaced apart from the first magnet. Figure 4b The second magnet 432), and the third magnet between the first magnet and the second magnet (e.g., Figure 4b (The third magnet 433). The coil can be configured to partially surround the third magnet. According to the mentioned embodiment, by partially surrounding the third magnet, the coil can be configured to oscillate under a magnetic field generated by the coil. The foregoing embodiments can provide various effects including those described above.

[0139] According to an embodiment, the support structure may further include a fastening structure (e.g., Figure 4a The fastening structure 440 is supported by a fastening portion and configured to fasten the speaker assembly to the fastening portion. The fastening structure may be formed at least partially from at least one of a first plate or a second plate. According to the above embodiments, the speaker assembly can be configured such that the support structure forming the magnetic field is fastened to the housing, thereby improving the fastening integrity of the speaker assembly to the housing and enhancing the sound quality of the audio output from the speaker assembly. The foregoing embodiments can provide various effects including the above-described effects.

[0140] According to an embodiment, the support structure may further include a shielding member attached to the fastening structure to electrically disconnect the housing and speaker assembly (e.g., Figure 6b(Shielding member 620). According to the foregoing embodiments, by including the shielding member, the support structure can enhance the sound quality of the audio output from the speaker assembly. The foregoing embodiments can provide various effects including the effects described above.

[0141] According to an embodiment, the housing may further include a speaker hole (e.g., Figure 4a Speaker hole 208 or Figure 8a The speaker hole 813) and the acoustic conduit for audio (e.g., Figure 4b Acoustic duct 403 or Figure 8b The acoustic conduit 814 extends from the speaker bore to a diaphragm of the speaker assembly fastened to a fastening portion. According to the foregoing embodiments, the housing may include a speaker bore and an acoustic conduit, thereby providing a path for audio output from the speaker assembly. The foregoing embodiments can provide various effects including those described above.

[0142] According to embodiments, the electronic device may further include a support member (e.g., Figure 4a The support member 480 is fastened to the fastening portion and supports the first plate of the speaker assembly fastened to the fastening portion. According to the foregoing embodiment, by including the support member, the electronic device can prevent the speaker assembly from detaching from the housing. The foregoing embodiment can provide various effects including those described above.

[0143] According to an embodiment, the first plate and the second plate may each comprise metal. According to the above embodiment, the first plate and the second plate may each comprise metal to form a magnetic field together with the magnet and improve the fastening integrity of the speaker assembly relative to the housing. The foregoing embodiments can provide various effects including those described above.

[0144] According to an embodiment, the electronic device may include a housing containing a fastening portion. The electronic device may include a speaker assembly disposed within the housing and configured to output audio. The speaker assembly may include a support structure and a fastening structure. The support structure forms a magnetic field and includes a first plate, a magnet attached to the first plate, and a second plate coupled to the first plate and at least partially disposed on the magnet. The fastening structure is supported by a fastening portion and configured to fasten the speaker assembly to the fastening portion. The speaker assembly may include a diaphragm configured to vibrate via the magnetic field. The fastening structure may be formed at least partially of at least one of the first plate or the second plate. According to the foregoing embodiments, the speaker assembly may be configured such that the support structure forming the magnetic field is fastened to the housing, thereby improving the fastening integrity of the speaker assembly to the housing and enhancing the sound quality of the audio output from the speaker assembly. The foregoing embodiments can provide various effects including the aforementioned effects.

[0145] According to an embodiment, the first plate may include a first connecting structure, the first connecting structure including a first connecting groove for connecting with a second plate. The second plate may include a second connecting structure, the second connecting structure including first protrusions respectively fastened to the first connecting groove. According to the foregoing embodiment, the speaker assembly may include a structure connecting the first plate and the second plate, thereby improving the fastening integrity of the speaker assembly to the housing and enhancing the sound quality of the audio output from the speaker assembly. The above embodiments can provide various effects including those described above.

[0146] According to an embodiment, the speaker assembly may further include a frame that supports the diaphragm and is coupled to a second plate. The second plate may include a third coupling structure that includes a second protrusion for coupling with the frame. The frame may include a fourth coupling structure that includes second coupling slots that are respectively fastened to the second protrusions. According to the above embodiments, the speaker assembly may include a structure in which the support structure is coupled to the frame, thereby improving the fastening integrity of the speaker assembly to the housing and enhancing the sound quality of the audio output from the speaker assembly. The above embodiments can provide various effects including the effects described above.

[0147] According to an embodiment, the electronic device may further include a coil attached to the diaphragm and configured to vibrate the diaphragm through interaction with a magnetic field. The housing may further include a support portion for supporting a speaker assembly. The diaphragm may include a first elastic member and a second elastic member, the first elastic member being attached to the coil and the second elastic member extending from the first elastic member and configured to reduce the ingress of foreign matter from outside the electronic device into the magnet by being at least partially pressed by the support portion. According to the above embodiment, by including the first elastic member and the second elastic member, the diaphragm can provide sound to the user and reduce the introduction of foreign matter from outside the electronic device. The above embodiments can provide various effects including the effects described above.

[0148] According to an embodiment, the support structure may further include a shielding member attached to the fastening structure to electrically disconnect the housing and the speaker assembly. According to the foregoing embodiments, by including the shielding member, the support structure can enhance the sound quality of the audio output from the speaker assembly. The foregoing embodiments can provide various effects including those described above.

[0149] The electronic device according to various embodiments can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0150] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that nouns in the singular form corresponding to terms may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items enumerated together with the corresponding phrase in the phrase. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish one component from another and do not limit the components in other respects (e.g., importance or order). When the terms “operational ground” or “communication ground” are used, or when the terms “operational ground” or “communication ground” are not used, if an element (e.g., a first element) is referred to as being “connected” to, “linked to”, “connected to”, or “attached to” another element (e.g., a second element), it means that the element can be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0151] As used in connection with various embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to embodiments, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0152] The various embodiments set forth herein can be implemented as software (e.g., program 140) comprising one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) readable by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without one or more other components. This allows the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media may be provided in the form of non-transitory storage media. The term "non-transitory" means only that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0153] According to embodiments, methods according to various embodiments disclosed herein may be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be published online (e.g., downloaded or uploaded), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be temporarily stored in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0154] According to various embodiments, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions before integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

Claims

1. An electronic device (101, 200), comprising: The housing (210, 810) includes fastening parts (401, 811); as well as A speaker assembly (400) is disposed in the housing (210, 810) and configured to output audio; as well as The speaker assembly (400) includes: The support structure (450) forms a magnetic field and includes a first plate (410), a magnet (430) attached to the first plate (410), and a second plate (420) connected to the first plate (410) and at least partially disposed on the magnet (430). Coil (460), configured to vibrate by said magnetic field; and Diaphragm (470), attached to said coil (460); and The support structure (450) is fastened to the fastening portion (401, 811) for connecting the speaker assembly (400) to the housing (210, 810).

2. The electronic device (101, 200) according to claim 1. in, The second plate (420) includes: The first part (421) includes a hole (421a) for the coil (460) to pass through, and is attached to the magnet (430); and The second part (422) is connected to the first part (421) and is used to fasten the support structure (450) to the fastening part (401, 811).

3. The electronic device (101, 200) according to claim 1 or 2, further comprising: Fastening member (490) for fastening the speaker assembly (400) to the housing (210, 810), and The second part (422) includes a fastening hole (441) for fastening the second plate (420) to the fastening part (401, 811) by passing the fastening member (490) through it.

4. The electronic device (101, 200) according to any one of claims 1 to 3. in, The first plate (410) includes: A first region (411), wherein the magnet (430) is disposed in the first region (411); and The second region (412) extends from the first region (411) and is used to fasten the support structure (450) to the fastening portion (401, 811).

5. The electronic device (101, 200) according to claim 4, further comprising: Fastening member (490) for fastening the speaker assembly (400) to the housing (210, 810), and The housing (210, 810) further includes a protruding structure (405) spaced apart from the fastening portions (401, 811), and The first plate (410) further includes a third region (413) spaced apart from the second region (412) and extending from the first region (411), and includes a connecting hole (443) into which the protruding structure (405) is inserted. The second region (412) includes a fastening hole (441) for fastening the first plate (410) to the fastening portion (401, 811) by passing the fastening member (490) through it.

6. The electronic device (101, 200) according to any one of claims 1 to 5. in, The first plate (410) includes a first connecting structure (530), the first connecting structure (530) including a first connecting groove (531, 532) for connecting with the second plate (420), and The second plate (420) includes a second connecting structure (540), which includes first protrusions (541, 542) respectively fastened to the first connecting grooves (531, 532).

7. The electronic device (101, 200) according to any one of claims 1 to 6. in, The speaker assembly (400) further includes a frame (510) that supports the diaphragm (470) and is coupled to the second plate (420). The second plate (420) includes a third connecting structure (550), which includes second protrusions (551, 552, 553, 554) for connecting to the frame (510), and The frame (510) includes a fourth connecting structure (560), which includes second connecting grooves (561, 562, 563, 564) respectively fastened to the second protrusions (551, 552, 553, 554).

8. The electronic device (101, 200) according to claim 7. in, The speaker assembly (400) further includes a connecting member (610) that connects the support structure (450) to the frame (510) by fastening it to the frame (510), the first plate (410) and the second plate (420).

9. The electronic device (101, 200) according to any one of claims 1 to 8. in, The housing (210, 810) further includes support portions (402, 812) for supporting the speaker assembly (400), and The diaphragm (470) includes: A first elastic member (471) is attached to the coil (460); and A second elastic member (472) extends from the first elastic member (471) and is used to reduce the inflow of foreign matter from the outside of the electronic device (101, 200) into the magnet (430) by being at least partially pressurized by the support portion (402, 812).

10. The electronic device (101, 200) according to any one of claims 1 to 9. in, The magnet (430) includes: The first magnet (431) is attached to the second plate (420). A second magnet (432) is attached to the second plate (420) and spaced apart from the first magnet (431); and A third magnet (433) is located between the first magnet (431) and the second magnet (432); and The coil (460) partially surrounds the third magnet (433).

11. The electronic device (101, 200) according to any one of claims 1 to 10. in, The support structure (450) further includes a fastening structure (440) supported by the fastening portions (401, 811) and used to fasten the speaker assembly (400) to the fastening portions (401, 811). The fastening structure (440) is formed at least in part by at least one of the first plate (410) and the second plate (420).

12. The electronic device (101, 200) according to claim 11. in, The support structure (450) further includes a shielding member (620) attached to the fastening structure (440) for electrically disconnecting the housing (210, 810) and the speaker assembly (400).

13. The electronic device (101, 200) according to any one of claims 1 to 12. in, The housing (210, 810) further includes: Speaker holes (208, 813); and A sound conduit (403, 814) for the audio, the sound conduit extending from the speaker hole (208, 813) to the diaphragm (470) of the speaker assembly (400) fastened to the fastening portion (401, 811).

14. The electronic device (101, 200) according to any one of claims 1 to 13, further comprising: The support member (480) supports the first plate (410) of the speaker assembly (400) which is fastened to the fastening portions (401, 811) and is fastened to the fastening portions (401, 811).

15. The electronic device (101, 200) according to any one of claims 1 to 14. in, The first plate (410) and the second plate (420) each comprise metal.

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