Pluggable optical connection structure

Abstract

The invention discloses a pluggable optical connection structure, which comprises a first connector fixedly arranged on one side of an optical chip module, the first connector comprises a first light-transmitting connection part and a first super-structure lens group, the first light-transmitting connection part comprises a first surface and a second surface, the first surface is provided with the first super-structure lens group, and the second surface is provided with a second super-structure lens group; the first super-structure lens group is configured to perform wavefront correction and collimation processing on an emergent light beam of the optical chip module; the second connector comprises a movable connector main body and a second super-structure lens group, the movable connector main body comprises a first end and a second end, the first end is connected with the optical fiber assembly, the second end is provided with the second super-structure lens group, and the second end is arranged to be in pluggable connection with the second surface; and the second super-structure lens group is configured to perform collimation and beam expansion processing on the emergent light beam of the second surface so as to be coupled to the optical fiber. According to the technical scheme, the coupling tolerance of the pluggable optical connection structure can be greatly expanded, so that the plugging and butting difficulty of the pluggable optical connection structure is reduced.

Description

Technical Field

[0001] This application relates to the field of optical connectivity technology, and more particularly to a pluggable optical connectivity structure. Background Technology

[0002] With the explosive growth of data traffic, Co-packaged Optics (CPO) has become a core technology for next-generation data center interconnects due to its advantages of low power consumption and high bandwidth achieved by co-packaging optical engines and switch chips. Pluggable optical interconnect structures, as a key component of CPO, serve as the connection between the optical chip module and external fiber optic links, and their performance directly determines the feasibility and reliability of mass production of CPO.

[0003] In related technologies, existing pluggable optical connection structures mainly include fixed connectors and movable connectors. The fixed connector is fixedly mounted on one side of the optical chip module to receive the emitted light beam from the optical port area of ​​the optical chip module. The movable connector is mainly a physical contact type connector based on traditional ceramic ferrules (such as LC fiber optic connectors and MT fiber optic connectors). The core of this technology lies in using a precision ferrule made of zirconium dioxide (ZrO2) material. Through the tight mating of the ferrule end face of the movable connector and the ferrule end face of the fixed connector, low-loss transmission of optical signals is achieved.

[0004] However, this technology faces a fundamental bottleneck: to achieve low insertion loss and low return loss, the lateral (radial) alignment accuracy between the ferrule end face of the movable connector and the ferrule end face of the fixed connector in pluggable optical connectors is extremely stringent, typically requiring sub-micron level precision. This ultra-high precision alignment requirement means that efficient, low-cost passive alignment processes cannot be used during production and assembly; instead, high-precision active alignment equipment must be employed. During active alignment, real-time monitoring of optical power and dynamic adjustment of the fiber core position to the optimal state are necessary before fixing. This process significantly extends the assembly time for a single device, severely restricting production efficiency. Summary of the Invention

[0005] The purpose of this application is to provide a pluggable optical connection structure that aims to improve the problem of existing optical connection solutions having strict requirements for lateral (radial) alignment accuracy between fixed connectors and movable connectors and being highly dependent on active alignment equipment.

[0006] To achieve this objective, embodiments of this application provide a pluggable optical connection structure, which includes a first connector and a second connector, wherein... The first connector is fixedly disposed on one side of the optical chip module. The first connector includes a first light-transmitting connection part and a first meta-lens group. The first light-transmitting connection part includes a first surface and a second surface. The first surface is provided with the first meta-lens group. The first meta-lens group is configured to perform wavefront correction and collimation processing on the emitted beam of the optical chip module. The second connector includes a movable connector body and a second meta-lens group. The movable connector body includes a first end and a second end. The first end is connected to the optical fiber assembly, and the second end is equipped with the second meta-lens group. The second end is configured to be pluggably connected to the second surface. The second meta-lens group is configured to collimate and expand the beam emitted from the second surface to couple it to the optical fiber assembly.

[0007] Optionally, in some embodiments of this application, the side of the first meta-lens group facing away from the first surface is bonded to the optical port area of ​​the optical chip module.

[0008] Optionally, in some embodiments of this application, the side of the first meta-lens group facing away from the first surface is bonded to the optical port area of ​​the optical chip module by a low-temperature adhesive bonding structure. Optionally, in some embodiments of this application, the adhesive thickness between the side of the first meta-lens group facing away from the first surface and the optical port area of ​​the optical chip module is 1μm to 10μm.

[0009] Optionally, in some embodiments of this application, the side of the first meta-lens group facing away from the first surface is bonded to the optical port area of ​​the optical chip module through a low-temperature bonding structure. Optionally, in some embodiments of this application, the first meta-lens group includes a first glass substrate and a plurality of first meta-lens units, wherein the plurality of first meta-lens units correspond one-to-one with the plurality of optical ports in the optical port region of the optical chip module; The first meta-lens unit includes two first nanopillar arrays, which are respectively fabricated on the two sides of the first glass substrate by photolithography and ion etching processes.

[0010] Optionally, in some embodiments of this application, the first nanopillar array includes a plurality of first nanopillars arranged in an array, the period of the first nanopillar array is 300 nm to 700 nm, the height of the first nanopillars is 300 nm to 790 nm, the diameter of the first nanopillars is 100 nm to 500 nm, and the first meta-lens unit is further configured to achieve wavefront correction and collimation of the corresponding beam by coordinating phase modulation between 0 to 2π through the diameter changes of each of the first nanopillars in the two first nanopillar arrays.

[0011] Optionally, in some embodiments of this application, the second end is a second light-transmitting connection portion, and the second meta-lens group is disposed on the side surface of the second light-transmitting connection portion facing away from the first end; The second light-transmitting connection part is provided with at least two positioning pins on the side surface facing away from the first end. The second surface is provided with at least two positioning grooves or at least two positioning holes. The second light-transmitting connection part achieves pluggable connection with the second surface through a one-to-one plugging and matching between at least two positioning pins and at least two positioning grooves or at least two positioning holes, and makes the second meta-lens group fit tightly against the second surface.

[0012] Optionally, in some embodiments of this application, the second meta-lens group includes a second glass substrate and a plurality of second meta-lens units, wherein the plurality of second meta-lens units correspond one-to-one with the plurality of first meta-lens units; The second meta-lens unit includes two second nanopillar arrays, and the second nanopillar arrays of the two second meta-lens units are respectively fabricated on the two sides of the second glass substrate by photolithography and ion etching processes.

[0013] Optionally, in some embodiments of this application, the second nanopillar array includes a plurality of second nanopillars arranged in an array, the period of the second nanopillar array is 300 nm to 700 nm, the height of the second nanopillars is 300 nm to 790 nm, and the diameter of the second nanopillars is 100 nm to 500 nm. The second meta-lens unit is further configured to achieve collimation and beam expansion of the corresponding beam by coordinating phase modulation between 0 to 2π through the diameter variations of the respective second nanopillars in the two second nanopillar arrays; and / or, The active connector body is an MT fiber optic connector or an LC fiber optic connector.

[0014] The pluggable optical connection structure provided in this application, through the above-mentioned structural configuration, on the one hand, performs wavefront correction and collimation processing on the emitted beam of the optical chip module by setting a first meta-lens group on the first light-transmitting connection part of the fixedly set first connector. In this way, not only can the aberration caused by the installation deviation between the optical chip module and the first connector be compensated by wavefront correction, so that the coupling loss between the optical chip module and the first connector (the measured coupling loss between the optical chip module and the first connector is only 0.3dB, which is much smaller than the coupling loss of the traditional evanescent wave (generally 1.5dB)) is greatly reduced, but also the divergence angle of the emitted beam of the optical chip module can be greatly compressed by collimation, so that the beam has high collimation before entering the second connector, thereby effectively reducing the sensitivity of the second connector to the lateral alignment accuracy during the plugging and unplugging process of the first connector, and thus greatly expanding its coupling tolerance. On the other hand, by setting a second meta-lens group at the second end of the movable connector body of the second connector, the emitted beam from the first connector is collimated and expanded, and coupled to the optical fiber assembly connected to the movable connector body. This not only increases the effective spot size (e.g., from the traditional 10μm to 50μm) through collimation and expansion, significantly reducing the coupling difficulty between the optical fiber assembly and the second connector, but also further reduces the sensitivity to lateral alignment accuracy during the insertion and removal of the second connector and the first connector by utilizing the large field-of-view receiving characteristics (field of view ±10°) of the second meta-lens group, thus further expanding its coupling tolerance. In summary, this pluggable optical connection structure, through the above structural settings, directly reduces the stringent mechanical precision requirements when the second connector and the first connector are inserted and removed. It not only reduces the difficulty of insertion and removal operations, but also enables the assembly process to be free from dependence on high-cost active alignment equipment, achieving high-performance coupling under passive alignment conditions. It is evident that the technical solution of this application can effectively improve the problem of existing optical connection solutions having stringent requirements for lateral (radial) alignment accuracy between fixed and movable connectors and being highly dependent on active alignment equipment. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] The structures, proportions, sizes, etc., shown in the accompanying drawings are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size should still fall within the scope of the technical content disclosed in this application, provided that they do not affect the effects and purposes that this application can produce.

[0017] Figure 1 This is a schematic diagram of the pluggable optical connection structure according to an embodiment of this application.

[0018] Figure 2 for Figure 1 The diagram shown is a bottom view of the pluggable optical connection structure.

[0019] Figure 3 for Figure 1 The diagram shows an exploded view of the pluggable optical connection structure.

[0020] Figure 4 for Figure 3 This is a schematic diagram of another angle of the pluggable optical connection structure shown.

[0021] Illustrations: 10. Pluggable optical connection structure; 11. First connector; 111. First light-transmitting connection part; 112. First meta-lens group; 113. Positioning groove; 12. Second connector; 121. Movable connector body; 1211. First end; 1212. Second end; 122. Second meta-lens group; 123. Positioning pin; 20. Optical chip module; 30. Fiber optic assembly. Detailed Implementation To make the inventive objectives, features, and advantages of this application more apparent and understandable, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0022] In the description of this application, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component centrally located at the same time.

[0023] The technical solution of this application will be further described below with reference to the accompanying drawings and specific embodiments.

[0024] Please see Figures 1 to 4 As shown, in one embodiment, this application provides a pluggable optical connection structure 10, which includes a first connector 11 and a second connector 12. The first connector 11 is fixedly disposed on one side of the optical chip module 20. The first connector 11 includes a first light-transmitting connection portion 111 and a first meta-lens group 112. The first light-transmitting connection portion 111 includes a first surface (not shown in the figure) and a second surface (not shown in the figure). The first surface is provided with the first meta-lens group 112, which is configured to perform wavefront correction and collimation processing on the emitted beam of the optical chip module 20. The second connector 12 includes a movable connector body 121 and a second meta-lens group 122. The movable connector body 121 includes a first end 1211 and a second end 1212. The first end 1211 is connected to the optical fiber assembly 30, and the second end 1212 is equipped with the second meta-lens group 122. The second end 1212 is configured to be pluggably connected to the second surface. The second meta-lens group 122 is configured to collimate and expand the beam emitted from the second surface to couple it to the optical fiber assembly 30.

[0025] It should be noted that the pluggable optical connection structure 10 in this embodiment is mainly used for optical path docking between the optical chip module 20 and the optical fiber assembly 30. That is, the pluggable connection on one side of the optical fiber assembly 30 enables the optical fiber assembly 30 to connect to the optical chip module 20. Specifically, the optical fiber assembly 30 can be as follows: Figure 1The fiber array shown can also be a single multi-core fiber. The first metalens group 112 and the second metalens group 122 mentioned above are mainly silicon-based Metalens groups. They achieve precise shaping of the light field through a nanopillar array. The principle is based on the concept of phase discontinuity. When light shines on a nanopillar (generally, the diameter of the nanopillar is smaller than the wavelength of the beam to be controlled), a sudden phase difference is generated. By controlling the size and arrangement of each nanopillar, wavefront shaping is achieved, thereby realizing wavefront correction and collimation or collimation and beam expansion of the beam. For example, the divergence angle of the emitted beam of the optical chip module 20 is greatly compressed to achieve wavefront correction and collimation of the emitted beam of the optical chip module 20, or the emitted beam of the second surface is greatly expanded (e.g., from the traditional 10μm to 50μm) to achieve collimation and beam expansion of the emitted beam of the second surface.

[0026] Furthermore, the aforementioned optical chip module 20 generally includes an optical chip (such as a PIC chip) and a glass substrate. The glass substrate acts as an interconnect framework, with its surface etched with optical waveguides through precision processes, forming an "optical highway" connecting different optical components. The optical chip (such as a PIC chip) serves as the functional core, integrating multiple miniature optical devices such as lasers, modulators, and detectors to generate, process, and receive optical signals. Ultimately, the optical chip module 20 achieves efficient optical signal interfacing with the external fiber optic assembly 30 by precisely coupling the optical signal to the optical port area, forming a complete, compact, and high-performance optical subsystem.

[0027] In this way, the pluggable optical connection structure of this application embodiment, through the above-described structural configuration, on the one hand, performs wavefront correction and collimation processing on the emitted beam of the optical chip module 20 by setting a first meta-lens group 112 on the first light-transmitting connection portion 111 of the fixedly set first connector 11. This not only compensates for the aberrations caused by the installation deviation between the optical chip module 20 and the first connector 11 through wavefront correction, thus significantly reducing the coupling loss between the optical chip module 20 and the first connector 11 (the measured coupling loss between the optical chip module 20 and the first connector 11 is only 0.3dB, which is much smaller than the coupling loss of the traditional evanescent wave (generally 1.5dB)), but also significantly compresses the divergence angle of the emitted beam of the optical chip module 20 through collimation, so that the beam has high collimation before entering the second connector 12, thereby effectively reducing the sensitivity of the second connector 12 to the lateral alignment accuracy during the plugging and unplugging process of the first connector 11 and greatly expanding its coupling tolerance. On the other hand, by setting a second meta-lens group 122 at the second end 1212 of the movable connector body 121 of the second connector 12, the emitted beam from the first connector 11 is collimated and expanded, and coupled to the optical fiber assembly 30 connected to the movable connector body 121. This not only increases the effective spot size (e.g., from the traditional 10μm to 50μm) through collimation and expansion, significantly reducing the coupling difficulty between the optical fiber assembly 30 and the second connector 12, but also further reduces the sensitivity to lateral alignment accuracy during the insertion and removal of the second connector 12 and the first connector 11 by utilizing the large field-of-view receiving characteristics (field of view ±10°) of the second meta-lens group 122, thereby further expanding its coupling tolerance. In summary, this pluggable optical connection structure 10, through the above structural settings, directly reduces the stringent mechanical precision requirements when the second connector 12 and the first connector 11 are inserted and removed, not only reducing the difficulty of insertion and removal operations, but also enabling the assembly process to break free from dependence on high-cost active alignment equipment, achieving high-performance coupling under passive alignment conditions.

[0028] In some examples, such as Figure 1 , Figure 2 and Figure 3As shown, the side of the first meta-lens group 112 facing away from the first surface is bonded to the optical port area of ​​the optical chip module 20. Thus, through this structural arrangement, the first meta-lens group 112 is integrated into the optical port area of ​​the optical chip module 20, allowing the emitted light beam from the optical port area of ​​the optical chip module 20 to directly enter the first meta-lens group 112 without loss. This further reduces the coupling loss between the optical chip module 20 and the first connector 11, while also enabling the first meta-lens to better collimate the emitted light beam from the optical chip module 20.

[0029] In some examples, such as Figure 1 As shown, the side of the first meta-lens group 112 facing away from the first surface is bonded to the optical port area of ​​the optical chip module 20 using a low-temperature adhesive bonding structure. Thus, through this structural configuration, stable integration between the first meta-lens group 112 and the optical chip module 20 is achieved in a low-temperature environment using low-temperature adhesive bonding. This effectively avoids thermal stress damage to the optical chip module 20 that is easily caused by high-temperature environments, while also optimizing interface optical matching, thereby improving the reliability and efficiency of optical coupling.

[0030] It should be noted that the low-temperature adhesive in this example is a special type of adhesive that can cure (change from liquid to solid) and form a strong bond at relatively low temperatures (usually room temperature or below 150°C). The low-temperature adhesive in this example is preferably an ultraviolet (UV) curing optical adhesive. This utilizes the high light transmittance and extremely low curing shrinkage of UV-curing optical adhesives to minimize the impact of the low-temperature adhesive bonding on the optical coupling between the optical aperture area and the first meta-lens group 112, while also minimizing the curing stress of the low-temperature adhesive to avoid lens deformation.

[0031] In some examples, such as Figure 1 As shown, the adhesive thickness between the side of the first meta-lens group 112 facing away from the first surface and the optical port area of ​​the optical chip module 20 is 1μm to 10μm. Thus, by setting the above parameters, the need to simultaneously improve the connection reliability between the first meta-lens group 112 and the optical chip module 20 and reduce the impact of low-temperature adhesive bonding on the optical coupling between the optical port area and the first meta-lens group 112 can be met.

[0032] It should be noted that, in this example, the adhesive thickness between the side of the first meta-lens group 112 facing away from the first surface and the optical port area of ​​the optical chip module 20 can be further preferably 4μm to 6μm. Thus, due to the wavefront compensation capability of the first meta-lens group 112, even with a parallelism error of ±5μm, the coupling loss fluctuation between the optical port area and the first meta-lens group 112 can still be <0.1dB after setting the parameters in this example, thereby solving the stringent requirements for bonding accuracy in traditional solutions.

[0033] In some examples, such as Figure 1 As shown, the side of the first meta-lens group 112 facing away from the first surface is bonded to the optical port area of ​​the optical chip module 20 via a low-temperature bonding structure. Thus, through this structural configuration, stable integration between the first meta-lens group 112 and the optical chip module 20 is achieved in a low-temperature environment via low-temperature bonding, effectively avoiding thermal stress damage to the optical chip module 20 that is easily caused by high-temperature environments. Simultaneously, it optimizes interface optical matching, thereby improving the reliability and efficiency of optical coupling.

[0034] It should be noted that the low-temperature bonding structure in this example is an advanced wafer or chip-to-chip integration technology. It involves forming a strong, permanent bond at the atomic or molecular scale between two clean, flat surfaces (such as silicon wafers or glass sheets) at relatively low temperatures (typically <400°C). More specifically, the low-temperature bonding structure in this example can be a plasma-activated bonding structure. The low-temperature bonding process of this plasma-activated bonding structure is as follows: 1. Activation: In a vacuum chamber, the two surfaces to be bonded are treated with oxygen, nitrogen, or argon plasma, respectively. The plasma cleans and activates the surfaces, enriching them with dangling bonds and hydrophilic -OH hydroxyl groups. 2. Pre-bonding: In an atmospheric environment, the two activated hydrophilic surfaces are aligned and gently brought into contact. Due to the water molecule layer and hydrogen bonding on the surfaces, an initial, relatively weak bonding force is generated. 3. Annealing and hardening: Subsequently, low-temperature annealing (e.g., 200-300°C) is performed. During the heat treatment process, the hydrogen bonds at the interface gradually transform into stronger covalent bonds (Si-O-Si), thereby achieving a strong bond.

[0035] In some examples, such as Figure 3As shown, the first meta-lens group 112 includes a first glass substrate and multiple first meta-lens units, with each first meta-lens unit corresponding one-to-one with a multiple optical port in the optical port region of the optical chip module 20. Each first meta-lens unit includes two first nanopillar arrays, which are fabricated on opposite sides of the first glass substrate using photolithography and ion etching processes, respectively. Thus, through this structural arrangement, the emitted beams from each optical port in the optical port region of the optical chip module 20 can undergo corresponding wavefront correction and collimation processing via the corresponding first meta-lens unit. Furthermore, it integrates multiple first meta-lens units with the first glass substrate, reducing intermediate steps such as adhesive bonding and thereby improving overall manufacturing efficiency.

[0036] In some examples, such as Figure 3 As shown, the first nanopillar array includes multiple first nanopillars arranged in an array. The period of the first nanopillar array is 300 nm to 700 nm, the height of the first nanopillars is 300 nm to 790 nm, and the diameter of the first nanopillars is 100 nm to 500 nm. The first metalens unit is further configured to achieve wavefront correction and collimation of the corresponding beam by coordinating phase modulation between 0 and 2π through the diameter changes of each first nanopillar in the two first nanopillar arrays. Thus, through the above structural configuration, the parameter design of each first metalens unit can well meet the requirements for wavefront correction and collimation of the emitted beam of the optical chip module 20, significantly reducing the divergence angle of the emitted beam of the optical chip module 20. This reduces the coupling loss between the optical chip module 20 and the first connector 11, while also significantly reducing the difficulty of subsequent coupling alignment.

[0037] It should be noted that the period of the first nanopillar array in this example, ranging from 300 nm to 700 nm, specifically refers to a fixed distance of 300 nm to 700 nm between the center of any one nanopillar and the center of its adjacent nanopillar. Furthermore, when designing the relevant parameters of the first nanopillar array in this example, the rationality of its nanostructure parameters can be verified through FDTD simulation (Lumerical FDTD Solutions software) and experimental testing.

[0038] In some examples, such as Figure 3 and Figure 4As shown, the second end 1212 is the second light-transmitting connection portion, and the second meta-lens group 122 is disposed on the side surface of the second light-transmitting connection portion facing away from the first end 1211. At least two positioning pins 123 are also protruding from the side surface of the second light-transmitting connection portion facing away from the first end 1211, and at least two positioning grooves 113 are recessed on the second surface. The second light-transmitting connection portion achieves a pluggable connection with the second surface through a one-to-one pluggable engagement between the at least two positioning pins 123 and the at least two positioning grooves 113, and ensures that the second meta-lens group 122 is tightly attached to the second surface. Thus, through the above structural arrangement, a pluggable connection between the second end of the second connector 12 and the second surface of the first connector 11 can be effectively achieved, while the tight attachment between the second meta-lens group 122 and the second surface ensures that the emitted light beam from the second surface can directly enter the second meta-lens group 122 without loss. Further, the second meta-lens group includes a second glass substrate and multiple second meta-lens units, with each of the multiple second meta-lens units corresponding to a multiple of the first meta-lens units. The second metalens unit includes two second nanopillar arrays, which are fabricated on opposite sides of the second glass substrate using photolithography and ion etching processes, respectively. This structural arrangement allows the emitted beams from each first metalens unit exiting the second surface to undergo collimation and beam expansion via the corresponding second metalens unit. Furthermore, it enables an integrated design of multiple second metalens units and the second glass substrate, reducing intermediate steps such as adhesive bonding and thus improving overall manufacturing efficiency.

[0039] It should be noted that when the second metalens group 122 is disposed close to the second surface in this example, the second metalens group 122 is also disposed directly opposite the first metalens group 112, so that the multiple second metalens units of the second metalens group 122 correspond one-to-one with the multiple first metalens units of the first metalens group 112. In addition, since each nanopillar array of the metalens group also has a large field of view receiving characteristic (field of view ±10°), each second nanopillar array (i.e., the second metalens unit) does not need to be completely aligned with the corresponding first nanopillar array (i.e., the first metalens unit) to accurately receive the beam transmitted from the corresponding first nanopillar array (i.e., the first metalens unit). In this way, the influence of lateral offset and axial gap on coupling efficiency can be further significantly weakened, thereby further realizing a significant expansion of coupling tolerance.

[0040] For those skilled in the art, the positioning groove 113 in this example can be replaced with a positioning hole, so that the second end can be pluggably connected to the second surface through a one-to-one plug-in engagement between at least two positioning pins 124 and at least two positioning holes, and the second meta-lens group 122 is set in close contact with the second surface.

[0041] In some examples, such as Figure 3 and Figure 4 As shown, the second nanopillar array includes multiple second nanopillars arranged in an array. The period of the second nanopillar array is 300 nm to 700 nm, the height of the second nanopillars is 300 nm to 790 nm, and the diameter of the second nanopillars is 100 nm to 500 nm. The second metalens unit is further configured to achieve collimation and beam expansion of the corresponding beam by coordinating phase modulation between 0 and 2π through the diameter variations of each second nanopillar in the two second nanopillar arrays. Thus, through the above structural configuration, the parameter design of the second nanopillar array can well meet the collimation and beam expansion requirements of the emitted beam from the second surface.

[0042] It should be noted that the period of the second nanopillar array in this example, ranging from 300 nm to 700 nm, specifically refers to a fixed distance of 300 nm to 700 nm between the center of any one of the second nanopillars and the center of the adjacent second nanopillar. Furthermore, when designing the relevant parameters of the second nanopillar array in this example, the rationality of its nanostructure parameters can also be verified through FDTD simulation (Lumerical FDTD Solutions software) and experimental testing. Furthermore, the functional difference between the second metalens unit in this example and the first metalens unit in the previous example stems from the difference in their phase distribution patterns. Specifically, the second phase distribution pattern formed by the second metalens unit through adjusting the diameter changes of each of the two second nanopillars in the two second nanopillar arrays is different from the first phase distribution pattern formed by the first metalens unit through adjusting the diameter changes of each of the two first nanopillars in the two first nanopillar arrays. This allows the first metalens unit to achieve wavefront correction and collimation of the corresponding beam through the first phase distribution pattern formed by each of the two first nanopillars in the two first nanopillar arrays, while the second metalens unit can achieve collimation and beam expansion of the corresponding beam through the second phase distribution pattern formed by each of the two second nanopillars in the two second nanopillar arrays.

[0043] In some examples, such as Figure 2 As shown, the active connector body 121 can be either an MT fiber optic connector or an LC fiber optic connector. Thus, through the above structural arrangement, the second meta-lens group 122 can be matched with either the MT ferrule or the LC ferrule to adapt to different packaging requirements.

[0044] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A pluggable optical connection structure, characterized in that, The pluggable optical connection structure includes a first connector and a second connector, wherein... The first connector is fixedly disposed on one side of the optical chip module. The first connector includes a first light-transmitting connection part and a first meta-lens group. The first light-transmitting connection part includes a first surface and a second surface. The first surface is provided with the first meta-lens group. The first meta-lens group is configured to perform wavefront correction and collimation processing on the emitted beam of the optical chip module. The second connector includes a movable connector body and a second meta-lens group. The movable connector body includes a first end and a second end. The first end is connected to the optical fiber assembly, and the second end is equipped with the second meta-lens group. The second end is configured to be pluggably connected to the second surface. The second meta-lens group is configured to collimate and expand the beam emitted from the second surface to couple it to the optical fiber assembly.

2. The pluggable optical connection structure according to claim 1, characterized in that, The side of the first meta-lens group facing away from the first surface is bonded to the optical port area of ​​the optical chip module.

3. The pluggable optical connection structure according to claim 2, characterized in that, The side of the first meta-lens group facing away from the first surface is bonded to the optical port area of ​​the optical chip module using a low-temperature adhesive bonding structure.

4. The pluggable optical connection structure according to claim 3, characterized in that, The adhesive thickness between the side of the first meta-lens group facing away from the first surface and the optical port area of ​​the optical chip module is 1μm to 10μm.

5. The pluggable optical connection structure according to claim 2, characterized in that, The side of the first meta-lens group facing away from the first surface is bonded to the optical port area of ​​the optical chip module through a low-temperature bonding structure.

6. The pluggable optical connection structure according to claim 1, characterized in that, The first meta-lens group includes a first glass substrate and a plurality of first meta-lens units, wherein the plurality of first meta-lens units correspond one-to-one with the plurality of optical ports in the optical port region of the optical chip module; The first meta-lens unit includes two first nanopillar arrays, which are respectively fabricated on the two sides of the first glass substrate by photolithography and ion etching processes.

7. The pluggable optical connection structure according to claim 6, characterized in that, The first nanopillar array includes a plurality of first nanopillars arranged in an array. The period of the first nanopillar array is 300 nm to 700 nm, the height of the first nanopillar is 300 nm to 790 nm, and the diameter of the first nanopillar is 100 nm to 500 nm. The first meta-lens unit is further configured to achieve wavefront correction and collimation of the corresponding beam by coordinating phase modulation between 0 and 2π through the diameter changes of each of the first nanopillars in the two first nanopillar arrays.

8. The pluggable optical connection structure according to claim 6, characterized in that, The second end is a second light-transmitting connection part, and the second meta-lens group is disposed on the side surface of the second light-transmitting connection part facing away from the first end; The second light-transmitting connection part is provided with at least two positioning pins on the side surface facing away from the first end. The second surface is provided with at least two positioning grooves or at least two positioning holes. The second light-transmitting connection part achieves pluggable connection with the second surface through a one-to-one plugging and matching between at least two positioning pins and at least two positioning grooves or at least two positioning holes, and makes the second meta-lens group fit tightly against the second surface.

9. The pluggable optical connection structure according to claim 8, characterized in that, The second meta-lens group includes a second glass substrate and a plurality of second meta-lens units, wherein the plurality of second meta-lens units correspond one-to-one with the plurality of first meta-lens units; The second meta-lens unit includes two second nanopillar arrays, which are respectively fabricated on the two sides of the second glass substrate by photolithography and ion etching processes.

10. The pluggable optical connection structure according to claim 9, characterized in that, The second nanopillar array comprises a plurality of second nanopillars arranged in an array. The period of the second nanopillar array is 300 nm to 700 nm, the height of the second nanopillars is 300 nm to 790 nm, and the diameter of the second nanopillars is 100 nm to 500 nm. The second meta-lens unit is further configured to achieve collimation and beam expansion of the corresponding beam by coordinating phase modulation between 0 and 2π through the diameter variations of the individual second nanopillars in the two second nanopillar arrays; and / or, The active connector body is an MT fiber optic connector or an LC fiber optic connector.

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