Curing control method for micro-optical element of optoelectronic device

Abstract

The invention belongs to the technical field of ultraviolet light curing, and particularly provides a photoelectronic device micro-optical element curing control method which comprises the following steps: configuring processing parameters; low-power starting is carried out, and a stress safety threshold value is set; carrying out reverse solution to obtain initial starting power meeting security constraints; starting irradiation at the initial starting power; step-type boosting is carried out; high power maintenance: completing boosting, and maintaining irradiation at high power; and step-type voltage reduction: reducing the power to 0, and ending the process. The core key point of the method is that the optical power is converted into a dynamic control variable from a fixed process parameter, and predictable and adjustable online management of the curing process is realized by establishing a power-internal stress quantitative relation model; and in consideration of nonlinear characteristics of material curing dynamics, a staged and multi-scale control strategy is adopted in the process, so that complete curing is ensured.

Description

Technical Field

[0001] This invention belongs to the field of ultraviolet curing technology and relates to a curing control method for micro-optical elements of optoelectronic devices, and particularly to a low-stress, high-formability ultraviolet curing method for manufacturing micro-nano optical elements and precision optical devices. Background Technology

[0002] Currently, UV curing technology is widely used in the bonding and molding of optoelectronic device packaging. However, the mainstream process uses a constant-power continuous UV irradiation mode, i.e., constant-power curing. After applying the UV-curable adhesive to the surface of the workpiece, it is continuously irradiated with a fixed-power UV light source until the adhesive is completely cured. Curing shrinkage of the UV-curable adhesive is the main cause of dispensing misalignment, which will further affect the alignment and coupling accuracy of the optical devices. The main defects are as follows: (1) Lack of effective stress control model: Existing studies have not established a quantitative relationship model between curing condition parameters and stress, making it difficult to actively control the light source parameters to suppress the generation of internal stress and forming defects, resulting in poor process stability; (2) Severe distortion of light spot: The uneven stress caused by thermal expansion leads to the flow of adhesive liquid and loss of shape control. The refractive index and surface flatness of the cured adhesive layer deviate from the design value, and the light spot produces shape distortion. (3) Curing stress concentration: With constant power continuous irradiation, the curing rate difference between the inner and outer surfaces of the adhesive is significant, resulting in concentrated stress inside, which causes the components to shrink and shift.

[0003] The aforementioned drawbacks severely restrict the application of photopolymerization technology in high-precision optical manufacturing. Therefore, UV adhesives are currently used for fixation.

[0004] UV adhesives are mainly composed of monomers, oligomers, photoinitiators, and other materials, and are generally in a liquid state before irradiation. The UV curing process is essentially the process by which the photoinitiator in the UV adhesive absorbs ultraviolet light, and the bonds absorb energy and break, generating active free radicals that excite the monomers or oligomers to undergo rapid chain polymerization or cross-linking chemical reactions. At this time, the liquid molecules rapidly transform into solid polymers, the van der Waals distance between molecules transforms into covalent bond distance, and the volume shrinks significantly.

[0005] Currently, the mainstream curing methods employ constant power or single high-intensity pulse direct irradiation, causing the surface layer of the adhesive in the irradiated area to gel and solidify instantly, forming a hard "shell." However, the penetration depth of ultraviolet light is limited, and the surface layer of the adhesive blocks light, causing the reaction rate and curing degree of the internal adhesive to lag significantly behind the surface. This extreme curing gradient and "surface-first, interior-later" process generates enormous uneven stress, leading to uneven volume shrinkage and dispensing displacement. Simultaneously, the outer cured structure also shrinks and deforms due to the uneven internal stress, and the stress "locked" inside the material further forms harmful residual internal stress. Summary of the Invention

[0006] To address the shortcomings of existing technologies, this invention provides a curing control method for optoelectronic micro-optical elements that takes into account the nonlinear characteristics of material curing kinetics, ensuring complete curing while effectively controlling the micro-displacement of the adhesive during the curing process.

[0007] This invention provides a method for controlling the curing of micro-optical elements in optoelectronic devices, comprising the following steps: Step 1: Configure processing parameters, including optical parameters of the adhesive material, curing kinetic parameters, thermodynamic and mechanical parameters, geometric parameters, and constraint parameters; Step 2: Perform low-power startup based on processing parameters and set a stress safety threshold. ; A mathematical model was established to quantitatively describe the relationship between ultraviolet light power distribution, adhesive curing degree, and internal stress. Based on this data model, the application peak value during the entire curing process was simulated. To apply peak Approaching infinitely close to but less than the application peak As the optimization objective, the initial starting power that satisfies the safety constraints is obtained by inverse solution. ; With initial startup power Begin irradiation; Step 3, Stepped Voltage Increase: Calculate the internal stress of the material under different curing states to reach the safety threshold. Irradiation power and the corresponding curing duration ;in, The number of pulse variable power irradiations during the stepped voltage boosting phase; Based on irradiation power and the corresponding curing duration Generate a power-time variation table and a power-time variation graph for the stepped voltage boosting stage; Power changes are controlled according to the power-time variation table and power-time variation graph of the stepped voltage boosting stage, and solidification processing is carried out. Step 4, High Power Maintenance: After completing the voltage boost, maintain high power irradiation; Step 5, Step-by-Step Voltage Reduction: Reduce power to 0, and the process ends.

[0008] Furthermore, the optical parameters of the adhesive material are determined by its absorption coefficient. Determine the attenuation law of light intensity with irradiation depth; Curing kinetic parameters include reaction rate constant Power response index and curing self-resistance effect coefficient ; Thermodynamic and mechanical parameters include those based on stress relaxation time constants. Determined photocuring reaction rate constant and volume shrinkage rate Based on the elastic modulus of the cured adhesive Determined stress proportionality coefficient And the geometric parameters and constraint parameters determined by process geometry and boundary conditions.

[0009] Furthermore, the geometric and constraint parameters include the adhesive layer thickness. Clamping force And the distance of illumination.

[0010] Furthermore, stress safety threshold The expression is as follows: ; in, This is expressed as a safety factor. This represents the contact area between the adhesive and the clamping component.

[0011] Furthermore, the mathematical model that quantitatively describes the relationship between ultraviolet light power distribution, adhesive curing degree, and internal stress is expressed as follows: ; in, Instantaneous internal stress refers to the stress at a specific moment. and light power Stress generated inside the UV-cured adhesive layer; This is the stress proportionality factor. The rules for determining the value are as follows: ,in, Expressed as the adhesive layer modulus, Expressed as volume shrinkage rate; To determine the curing depth, the adhesive supplier provides the absorption coefficient of the adhesive at the target wavelength. pass Calculated; and All are expressed as photocuring reaction rate constants; Expressed as the power response index; This is expressed as the self-resistance coefficient during curing, provided by the adhesive supplier. Represented as local ultraviolet power density; This is expressed as the degree of localized curing. This is expressed as irradiation time; Represented as the natural constant Euler number; Represented as from the surface To maximum depth The previous infinitesimal thickness element.

[0012] Furthermore, initial startup power The expression is as follows: .

[0013] Furthermore, the irradiation power is obtained. and the corresponding curing duration The specific process is as follows: The surface temperature of the adhesive layer is measured non-contactly using an infrared thermometer. And using an ultraviolet power meter to monitor incident light intensity Real-time fluctuations; A partial differential equation model describing the curing process is established, and the surface temperature of the adhesive layer is calculated based on this model. and the curing degree of the adhesive layer ; By comparing the actual measured surface temperature of the adhesive layer with the calculated surface temperature, the calculated degree of curing of the adhesive layer can be determined. Corrections were made to restore the local curing degree along the entire thickness direction of the adhesive layer. ; Local curing degree Introduction The model was used to calculate the irradiation power. and the corresponding curing duration .

[0014] Furthermore, the expression for the partial differential equation model describing the curing process is as follows: ; in, This represents the local ultraviolet light power density. The initial incident light power density; The absorption coefficient of the material; The curing reaction rate, It is in a solidified state; The density of the material; Specific heat capacity of the material; The thermal conductivity of the material; The curvature of the temperature distribution; It is exothermic during curing, and , This is the total enthalpy of the reaction.

[0015] Furthermore, the specific process of controlling power changes according to the power-time variation table and power-time variation graph of the stepped voltage boosting stage is as follows: When the incident power is Continuous irradiation Within seconds, the stress reached the system's preset safety threshold. Immediately stop irradiation and enter The stress relaxation phase of varying duration; With incident power as Continuous irradiation Re-enter after seconds The stress relaxation phase of varying duration; Repeat the above steps until the incident power is... Continuous irradiation Re-enter after seconds The stress relaxation phase lasts for a certain duration, completing the curing process of the stepped pressure increase phase.

[0016] Furthermore, The setup method is as follows: .

[0017] Furthermore, the specific methods for maintaining high power are as follows: With constant high power Irradiate for 5-10 seconds, ensuring that the external clamping device provides sufficient constraint, until the material is fully cured deep inside.

[0018] Furthermore, constant high power The expression is as follows: .

[0019] Furthermore, the specific method of step-down voltage reduction is as follows: Let the reduction The power value after that is ,and ; The first time with each Reduce by 20% Perform sequential pressure reduction; Starting from the second adjustment, gradually increase the adjustment range until the power reaches zero and the process ends; the method for each adjustment range is: every Reduced by 40% .

[0020] Compared with the prior art, the present invention has the following beneficial effects: (1) The core point of this invention is to transform optical power from a fixed process parameter into a dynamic control variable. By establishing a quantitative relationship model of "power-internal stress", the curing process can be predictably and controllably managed online. Considering the nonlinear characteristics of material curing dynamics, the process adopts a staged, multi-scale control strategy to ensure complete curing, while effectively controlling the micro-displacement of the adhesive during the curing process. This provides a reliable technical solution for ultraviolet curing processes in fields such as high-precision microelectronic packaging and precision optical manufacturing.

[0021] (2) Breaking through the existing constant power curing or simple switching pulse curing methods, it pioneered a closed-loop power dynamic control logic of "weak first, then strong, then weak again". By adjusting the power, it achieves periodic and step-by-step changes, realizing the coordinated control of curing speed and stress release: In the initial curing stage, low power irradiation ensures the uniformity of the adhesive and avoids the surface curing too fast to form a "hard shell"; gradually increasing the pressure to match different curing stages of the adhesive, ensuring curing efficiency while controlling the degree of curing; in the high power maintenance stage, continuous high power irradiation ensures complete curing of the adhesive; in the later stage, step-by-step pressure reduction actively guides the release of residual stress in stages, breaking through the limitations of the single orientation of curing speed or stress control in traditional processes, forming a complete power dynamic control closed loop, which links the curing process with the curing characteristics of the adhesive and the magnitude of stress release, solving the technical pain point that fixed power irradiation in traditional curing processes leads to the inability to take into account both curing speed and stress control. It is an innovative design at the level of curing process principle.

[0022] (3) A mathematical model was established to quantitatively describe the relationship between ultraviolet light power distribution, adhesive curing degree and internal stress, providing a theoretical basis for dynamic power control. The shrinkage and displacement characteristics of the curing process and their correlation with ultraviolet light irradiation parameters, such as light power, irradiation time and distance, were revealed. Through systematic experiments, the quantitative description of internal stress and core irradiation parameters during the curing process of photocurable adhesive was clarified.

[0023] (4) Based on model prediction and dynamic feedback, a four-stage pulse variable power ultraviolet curing control process of “low power start-up → step-by-step voltage increase → high power maintenance → step-by-step voltage decrease” was first created. The process modeling and real-time control were combined to achieve precise management of curing stress, providing an innovative solution to the problem of internal stress concentration caused by uneven shrinkage in the traditional constant power curing process.

[0024] In addition to the objectives, features, and advantages described above, the present invention has other objectives, features, and advantages. The invention will now be described in further detail with reference to the figures. Attached Figure Description

[0025] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings: Figure 1 This is a schematic flowchart of a method for controlling the curing of micro-optical elements in optoelectronic devices according to an embodiment of the present invention. Detailed Implementation

[0026] To make the above-mentioned objects, features, and advantages of the present invention clearer and easier to understand, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that the accompanying drawings of the present invention are all in a simplified form and use non-precise proportions, and are only used to facilitate and clearly illustrate the implementation of the present invention.

[0027] Example 1: See Figure 1 As shown, the present invention provides a method for controlling the curing of micro-optical elements in optoelectronic devices, comprising the following steps: Step 1, Parameter Configuration: Configure the processing parameters, which include optical parameters of the adhesive material, curing kinetic parameters, thermodynamic and mechanical parameters, geometric parameters, and constraint parameters.

[0028] Preferably, the parameter configuration method is as follows: select the adhesive material and determine the material's inherent parameters. Specifically, the inherent material parameters include the optical parameters, curing kinetic parameters, thermodynamic and mechanical parameters, and the number of pulse variable power irradiations of the adhesive material provided by the adhesive supplier. .

[0029] More preferably, the optical parameters of the adhesive material refer to the absorption coefficient. Determine the attenuation law of light intensity with irradiation depth; Curing kinetic parameters include reaction rate constant Power response index and curing self-resistance effect coefficient ; Thermodynamic and mechanical parameters include those based on stress relaxation time constants. Determined photocuring reaction rate constant and volume shrinkage rate Based on the elastic modulus of the cured adhesive Determined stress proportionality coefficient And the geometric parameters and constraint parameters determined by process geometry and boundary conditions.

[0030] More preferably, the geometric parameters and constraint parameters include the adhesive layer thickness. Clamping force And the distance of illumination.

[0031] Step 2: Low-power startup, setting the stress safety threshold. ; A mathematical model was established to quantitatively describe the relationship between ultraviolet light power distribution, adhesive curing degree, and internal stress. Based on this data model, the application peak value during the entire curing process was simulated. To apply peak Approaching infinitely close to but less than the safety threshold As the optimization objective, that is: The initial starting power that satisfies the safety constraints is obtained by inverse solution. In the initial instant, Ignoring thermal effects and stress relaxation ( ), simplify the model, and solve ; With initial startup power Begin irradiation.

[0032] Further preferred, stress safety threshold The expression is as follows: ; in, This is expressed as a safety factor (specifically, in this embodiment, Set to 0.7-0.8). This represents the contact area between the adhesive and the clamping component.

[0033] A further preferred mathematical model, which quantitatively describes the relationship between ultraviolet light power distribution, adhesive curing degree, and internal stress, is expressed as follows: ; in, Instantaneous internal stress refers to the stress at a specific moment. and light power The stress (i.e. stress tendency) generated inside the UV-cured adhesive layer. This is the stress proportionality factor. The rules for determining the value are as follows: ,in, Expressed as the adhesive layer modulus, Expressed as volume shrinkage rate; To determine the curing depth, the adhesive supplier provides the absorption coefficient of the adhesive at the target wavelength. pass Calculated; and All are expressed as photocuring reaction rate constants; Expressed as the power response index; This is expressed as the self-resistance coefficient during curing, provided by the adhesive supplier; specifically, in this embodiment, , , The selection of each option needs to be considered collaboratively. For example, in situations requiring high precision, then... The selection range is 0.01-0.1. The selection range is ≈1 and The selection range is 2-5; for applications requiring high efficiency, then... The selection range is greater than 0.5. The selection range is greater than 1.2 and... The selection range value is less than 2; It is the reciprocal of the stress relaxation time constant, i.e. ; Represented as local ultraviolet power density; This is expressed as the degree of localized curing. This is expressed as irradiation time; Represented as the natural constant Euler number; Represented as from the surface To maximum depth The previous infinitesimal thickness element.

[0034] Further preferred, initial start-up power The expression is as follows: .

[0035] Step 3, Stepped Voltage Increase: S3.1 Calculate the internal stress of the material under different curing states to reach the safety threshold. Irradiation power and the corresponding curing duration ; S3.2, Based on irradiation power and the corresponding curing duration Generate a power-time variation table and a power-time variation graph for the stepped voltage boosting stage; S3.3 Control the power change according to the power-time change table and power-time change graph of the stepped voltage increase stage, and carry out solidification processing.

[0036] Preferably, the specific process of S3.1 is as follows: The surface temperature of the adhesive layer is measured non-contactly using an infrared thermometer. And using an ultraviolet power meter to monitor incident light intensity Real-time fluctuations; A partial differential equation model describing the curing process is established, and the surface temperature of the adhesive layer is calculated based on this model. Glue curing degree distribution ; Comparing the actual measured surface temperature of the adhesive layer with the calculated surface temperature, the calculated degree of cure distribution was analyzed. Make corrections to approximate the curing distribution along the entire thickness direction of the adhesive layer. ; Curing degree distribution Introduction The model was used to calculate the irradiation power. and the corresponding curing duration This ensures that the shrinkage and deformation of each newly cured layer are released within a controllable range. Among other things, This refers to the number of pulse variable power irradiations during the stepped voltage boost phase. It can be set according to the product manufacturing requirements. Specifically, in this embodiment... This refers to the number of pulsed variable power irradiations during the stepped voltage boost phase. It can be set according to product manufacturing requirements, generally... The value range is set to 3-6.

[0037] A further preferred expression for the partial differential equation model describing the curing process is as follows: ; in, This represents the local ultraviolet light power density. The initial incident light power density; The absorption coefficient of the material; The curing reaction rate, It is in a solidified state; The density of the material; Specific heat capacity of the material; The thermal conductivity of the material; The curvature of the temperature distribution; It is exothermic during curing, and , This is the total enthalpy of the reaction.

[0038] Preferably, the specific process of S3.3 is as follows: S3.3.1, when the incident power is Continuous irradiation Within seconds, the stress reached the system's preset safety threshold. Immediately stop irradiation and enter The stress relaxation phase of varying duration; S3.3.2, with incident power as Continuous irradiation Re-enter after seconds The stress relaxation phase of varying duration; S3.3.3, Repeat steps S3.3.1 and S3.3.2.

[0039] This process can basically ensure that the shrinkage and deformation of each newly cured layer can be released within a controllable range.

[0040] Further preferred, The setup method is as follows: ; in, It is the reciprocal of the stress relaxation time constant. is the stress relaxation time constant.

[0041] Step 4, High Power Maintenance: After completing the voltage boost, maintain high power irradiation.

[0042] The specific process is as follows: With constant high power Irradiate for 5-10 seconds, ensuring that the external clamping device provides sufficient constraint, until the material is fully cured deep inside.

[0043] Preferred, constant high power The expression is as follows: .

[0044] Step 5, Step-by-Step Voltage Reduction: Reduce power to 0, and the process ends.

[0045] The stepped pressure reduction stage employs a gradual decrease scheme, and the specific process is as follows: Phase 1 ( , Indicates reduction The power value after each step is reduced by a smaller step size (each subsequent power value). Reduce by 20% ); The adjustment range was then gradually increased (per... Reduced by 40% ), to ensure curing efficiency; Ultimately, the power is reduced to zero, resulting in a low-stress, high-quality cured product.

[0046] Specifically, the reduction rate here can be adjusted according to processing requirements such as processing quality and processing efficiency.

[0047] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A method for controlling the curing of micro-optical elements in optoelectronic devices, characterized in that, Includes the following steps: Step 1: Configure processing parameters, including optical parameters of the adhesive material, curing kinetic parameters, thermodynamic and mechanical parameters, geometric parameters, and constraint parameters; Step 2: Perform low-power startup based on processing parameters and set a stress safety threshold. ; A mathematical model was established to quantitatively describe the relationship between ultraviolet light power distribution, adhesive curing degree, and internal stress. Based on the data model, the application peak value during the entire curing process was simulated. To apply peak Approaching infinitely close to but less than the application peak As the optimization objective, the initial starting power that satisfies the safety constraints is obtained by inverse solution. ; With initial startup power Begin irradiation; Step 3, Stepped Voltage Increase: Calculate the internal stress of the material under different curing states to reach the safety threshold. Irradiation power and the corresponding curing duration ;in, The number of pulse variable power irradiations during the stepped voltage boosting phase; Based on irradiation power and the corresponding curing duration Generate a power-time variation table and a power-time variation graph for the stepped voltage boosting stage; Power changes are controlled according to the power-time variation table and power-time variation graph of the stepped voltage boosting stage, and solidification processing is carried out. Step 4, High Power Maintenance: After completing the voltage boost, maintain high power irradiation; Step 5, Step-by-Step Voltage Reduction: Reduce power to 0, and the process ends.

2. The method for controlling the curing of micro-optical elements in optoelectronic devices according to claim 1, characterized in that, The optical parameters of adhesive materials refer to the absorption coefficient. Determine the attenuation law of light intensity with irradiation depth; Curing kinetic parameters include reaction rate constant Power response index and curing self-resistance effect coefficient ; Thermodynamic and mechanical parameters include those based on stress relaxation time constants. Determined photocuring reaction rate constant and volume shrinkage rate Based on the elastic modulus of the cured adhesive Determined stress proportionality coefficient And the geometric parameters and constraint parameters determined by process geometry and boundary conditions.

3. The method for controlling the curing of micro-optical elements in optoelectronic devices according to claim 2, characterized in that, Geometric parameters and constraint parameters include adhesive layer thickness. Clamping force And the distance of illumination.

4. The method for controlling the curing of micro-optical elements in optoelectronic devices according to any one of claims 1-3, characterized in that, Stress safety threshold The expression is as follows: ； in, This is expressed as a safety factor. This represents the contact area between the adhesive and the clamping component. It is expressed as clamping force.

5. The method for controlling the curing of micro-optical elements in optoelectronic devices according to claim 4, characterized in that, The mathematical model that quantitatively describes the relationship between ultraviolet light power distribution, adhesive curing degree, and internal stress is expressed as follows: ； in, Instantaneous internal stress refers to the stress at a specific moment. and light power Stress generated inside the UV-cured adhesive layer; This is the stress proportionality factor. The rules for determining the value are as follows: ,in, Expressed as the adhesive layer modulus, Expressed as volume shrinkage rate; To determine the curing depth, the adhesive supplier provides the absorption coefficient of the adhesive at the target wavelength. pass Calculated; and All are expressed as photocuring reaction rate constants; Expressed as the power response index; This is expressed as the self-resistance coefficient during curing, provided by the adhesive supplier. Represented as local ultraviolet power density; This is expressed as the degree of localized curing. This is expressed as irradiation time; Represented as the natural constant Euler number; Represented as from the surface To maximum depth The previous infinitesimal thickness element.

6. The method for controlling the curing of micro-optical elements in optoelectronic devices according to claim 5, characterized in that, Initial startup power The expression is as follows: 。 7. The method for controlling the curing of micro-optical elements in optoelectronic devices according to claim 5 or 6, characterized in that, Obtain irradiation power and the corresponding curing duration The specific process is as follows: The surface temperature of the adhesive layer is measured non-contactly using an infrared thermometer. And using an ultraviolet power meter to monitor incident light intensity Real-time fluctuations; A partial differential equation model describing the curing process is established, and the surface temperature of the adhesive layer is calculated based on this model. and the curing degree of the adhesive layer ; By comparing the actual measured surface temperature of the adhesive layer with the calculated surface temperature, the calculated degree of curing of the adhesive layer can be determined. Corrections were made to restore the local curing degree along the entire thickness direction of the adhesive layer. ; Local curing degree Introduction The model was used to calculate the irradiation power. and the corresponding curing duration .

8. The method for controlling the curing of micro-optical elements in optoelectronic devices according to claim 7, characterized in that, The partial differential equation model describing the curing process is expressed as follows: ； in, This represents the local ultraviolet light power density. The initial incident light power density; The absorption coefficient of the adhesive at the target wavelength; The curing reaction rate, It is in a solidified state; The density of the material; Specific heat capacity of the material; The thermal conductivity of the material; The curvature of the temperature distribution; It is exothermic during curing, and , This is the total enthalpy of the reaction.

9. The method for controlling the curing of micro-optical elements in optoelectronic devices according to claim 8, characterized in that, The specific process of controlling power changes according to the power-time variation table and power-time variation graph of the stepped voltage boosting stage is as follows: When the incident power is Continuous irradiation Within seconds, the stress reached the system's preset safety threshold. Immediately stop irradiation and enter The stress relaxation phase of varying duration; With incident power as Continuous irradiation Re-enter after seconds The stress relaxation phase of varying duration; Repeat the above steps until the incident power is... Continuous irradiation Re-enter after seconds The stress relaxation phase lasts for a certain duration, completing the curing process of the stepped pressure increase phase.

10. The method for controlling the curing of micro-optical elements in optoelectronic devices according to claim 9, characterized in that, The setup method is as follows: ； in, It is the reciprocal of the stress relaxation time constant. is the stress relaxation time constant.

11. The method for controlling the curing of micro-optical elements in optoelectronic devices according to claim 9 or 10, characterized in that, The specific methods for maintaining high power are as follows: With constant high power Irradiate for 5-10 seconds, ensuring that the external clamping device provides sufficient constraint, until the material is fully cured deep inside.

12. The method for controlling the curing of micro-optical elements in optoelectronic devices according to claim 11, characterized in that, Constant high power The expression is as follows: 。 13. The method for controlling the curing of micro-optical elements in optoelectronic devices according to claim 12, characterized in that, The specific method of step-down voltage reduction is as follows: Let the reduction The power value after that is ,and ; The first time with each Reduce by 20% Perform sequential pressure reduction; Starting from the second adjustment, gradually increase the adjustment range until the power reaches zero and the process ends; the method for each adjustment range is: every Reduced by 40% .

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