Estimation method of two-dimensional plane numerical value of semiconductor device and related device

Abstract

The invention discloses an estimation method of a two-dimensional plane numerical value of a semiconductor device and a related device. The estimation method comprises the following steps: constructing a cutting straight line segment penetrating through a two-dimensional grid; calculating position information of intersection points of the cut straight line segments and the two-dimensional grid; estimating physical information of the intersection points; based on the position information and the physical information of the intersection point, a function model for cutting the straight line segment is constructed, and the function model is used for describing the relation between the physical information and the position information of any point on the cut straight line segment; and estimating physical information of any point on the cut straight line segment based on the function model. According to the method, the numerical value of the specific point on the data grid of the semiconductor device can be estimated more quickly under the same grid density, and a user can be helped to quickly obtain the numerical value of the specific data point in performance analysis and defect detection of the semiconductor device.

Description

Technical Field

[0001] This application relates to the field of semiconductor device simulation technology, and in particular to a method and related apparatus for estimating two-dimensional planar numerical values ​​of semiconductor devices. Background Technology

[0002] Obtaining physical information about specific data points in semiconductor devices is crucial for applications requiring in-depth data understanding, such as semiconductor device performance analysis and fault diagnosis. In the field of grid data processing for semiconductor devices, contour plots are typically used to represent the general distribution of the data. However, contour plots have a significant drawback: they cannot provide a high-precision, rapid estimate of the values ​​at specific data points.

[0003] Specifically, for semiconductor mesh data, existing technologies can quickly estimate the physical information of any point on the line connecting two adjacent mesh nodes based on their physical information. Then, contour maps can be drawn based on the physical information of each point on the mesh edge. However, while the physical information of any point within the mesh can be estimated using three adjacent mesh nodes, this requires significantly more computing power and time. Therefore, a method is needed to quickly estimate the physical information of a point within the mesh.

[0004] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this application and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Summary of the Invention

[0005] The purpose of this application is to provide a method and related apparatus for estimating the two-dimensional planar values ​​of semiconductor devices, so as to solve the technical problem in the prior art that it is impossible to quickly estimate the physical information of any point inside the grid of a semiconductor device.

[0006] To achieve the above objectives, one technical solution adopted in this application is:

[0007] A method for estimating two-dimensional planar values ​​of semiconductor devices is provided, including:

[0008] Construct a cutting straight line segment that runs through the two-dimensional mesh, wherein the two-dimensional mesh is a two-dimensional mesh obtained by solving the two-dimensional surface model of the target semiconductor device using finite element method, and the position information and physical information of the nodes of the two-dimensional mesh are known;

[0009] Calculate the position information of the intersection point between the cutting straight line segment and the two-dimensional grid;

[0010] Based on the position and physical information of the nodes in the two-dimensional grid and the position information of the intersection points, the physical information of the intersection points is estimated;

[0011] Based on the location and physical information of the intersection point, a function model of the cutting straight line segment is constructed. The function model is used to describe the relationship between the physical and location information of any point on the cutting straight line segment.

[0012] Based on the function model, the physical information of any point on the cutting straight line segment is estimated.

[0013] In one or more embodiments, the physical information of the nodes of the two-dimensional network includes at least one of electric potential, electron concentration, and hole concentration.

[0014] In one or more embodiments, the step of estimating the physical information of the intersection point based on the positional and physical information of the nodes in the two-dimensional mesh and the positional information of the intersection point includes:

[0015] Obtain the position and physical information of the nodes at both ends of the grid line where the intersection point is located;

[0016] An interpolation function is constructed based on the position and physical information of the nodes at both ends of the grid line;

[0017] Substitute the location information of the intersection point into the interpolation function to obtain the physical information of the intersection point.

[0018] In one or more embodiments, the interpolation function is a linear function or a nonlinear function.

[0019] In one or more embodiments, the step of constructing the function model for cutting the straight line segment based on the location information and physical information of the intersection point includes:

[0020] Calculate the reference distance of each intersection point, wherein the reference distance is the distance of the intersection point relative to the reference endpoint of the cutting line segment;

[0021] Data points are constructed using the reference distance and corresponding physical information of the intersection points, respectively;

[0022] A function model is fitted to the cutting straight line segment based on the data points, wherein the function model is used to describe the relationship between the physical information of any point on the cutting straight line segment and the distance relative to the reference endpoint.

[0023] In one or more embodiments, the step of constructing the function model for cutting the straight line segment based on the location information and physical information of the intersection point includes:

[0024] Data points are constructed using the physical information of the intersection points and their coordinate values ​​on a reference coordinate axis, where the reference coordinate axis is either the X-axis or the Y-axis of a specified coordinate system.

[0025] A function model is fitted to the cutting straight line segment based on the data points, wherein the function model is used to describe the relationship between the physical information of any point on the cutting straight line segment and the coordinate value on the reference coordinate axis.

[0026] To achieve the above objectives, another technical solution adopted in this application is:

[0027] A device for estimating the numerical values ​​of a two-dimensional semiconductor device is provided, comprising:

[0028] The cutting line construction module is used to construct cutting straight line segments that penetrate a two-dimensional mesh, wherein the two-dimensional mesh is a two-dimensional mesh obtained by finite element analysis of a two-dimensional surface model of the target semiconductor device, and the position information and physical information of the nodes of the two-dimensional mesh are known.

[0029] The intersection calculation module is used to calculate the position information of the intersection point between the cutting straight line segment and the two-dimensional grid;

[0030] An estimation module is used to estimate the physical information of the intersection points based on the position and physical information of the nodes in the two-dimensional grid and the position information of the intersection points.

[0031] The function construction module is used to construct a function model of the cutting straight line segment based on the positional and physical information of the intersection point. The function model is used to describe the relationship between the physical and positional information of any point on the cutting straight line segment.

[0032] The information calculation module estimates the physical information of any point on the cutting straight line segment based on the function model.

[0033] To achieve the above objectives, another technical solution adopted in this application is:

[0034] An electronic device is provided, comprising:

[0035] At least one processor; and

[0036] A memory storing instructions that, when executed by the at least one processor, cause the at least one processor to perform a method for estimating two-dimensional planar values ​​of a semiconductor device as described in any of the above embodiments.

[0037] To achieve the above objectives, another technical solution adopted in this application is:

[0038] A machine-readable storage medium is provided that stores executable instructions, which, when executed, cause the machine to perform a method for estimating two-dimensional planar values ​​of a semiconductor device as described in any of the above embodiments.

[0039] The advantages of this application, which differ from existing technologies, are:

[0040] The method for estimating two-dimensional planar values ​​of semiconductor devices in this application is based on the positional information of the intersection points of the cutting straight line segments, as well as the positional and physical information of the nodes. It estimates the physical information of the intersection points and, based on the physical and positional information of multiple intersection points on the cutting straight line segments, fits a function model of the cutting straight line segments. Under the same grid density, it can estimate the values ​​of specific points on the semiconductor device data grid more quickly, which helps users to quickly obtain specific data point values ​​in semiconductor device performance analysis and defect detection. Attached Figure Description

[0041] Figure 1 This is a schematic diagram of a scenario illustrating the method and apparatus for estimating two-dimensional planar values ​​of semiconductor devices according to this application;

[0042] Figure 2 This is the method for estimating the two-dimensional planar values ​​of semiconductor devices in this application;

[0043] Figure 3 This is a schematic diagram of the structure of one embodiment of the two-dimensional mesh of this application;

[0044] Figure 4 yes Figure 2 A schematic diagram of a state corresponding to step S100;

[0045] Figure 5 This application Figure 2 A flowchart of one embodiment corresponding to step S300;

[0046] Figure 6 yes Figure 2 A flowchart of one embodiment corresponding to step S400;

[0047] Figure 7 yes Figure 6 A schematic diagram of a state corresponding to step S403a;

[0048] Figure 8 yes Figure 2 A flowchart illustrating another embodiment corresponding to step S400;

[0049] Figure 9 This is a structural block diagram of one embodiment of the semiconductor device two-dimensional planar numerical estimation device of this application;

[0050] Figure 10 This is a schematic diagram of one embodiment of the electronic device of this application. Detailed Implementation

[0051] The specific embodiments of this application will be described in detail below with reference to the accompanying drawings, but it should be understood that the scope of protection of this application is not limited to the specific embodiments.

[0052] In applications such as semiconductor device performance analysis and fault diagnosis, it is crucial to make accurate and rapid estimations of values ​​such as electric field strength and carrier concentration at specific data points of semiconductor devices.

[0053] In existing technologies, the mesh data obtained using the finite element method is discrete. While interpolation based on two adjacent nodes can yield data for points on the grid lines connecting those nodes, data for points within the grid itself is more complex. On one hand, more sophisticated estimation methods based on three adjacent grid points, such as the key coordinate method or even more complex algorithms, can be used, but these require significantly more computing power and time. On the other hand, denser meshes can be designed for semiconductor devices, but this results in a proportional increase in the number of equations to be solved with the number of grid points. This not only consumes more computing power but also ultimately only increases the possibility of solving some data points, not the possibility of solving any data points.

[0054] To address the aforementioned issues, the applicant has developed a method for estimating the numerical values ​​of two-dimensional planes in semiconductor devices. This method is based on tangent-line fitting and can quickly estimate the values ​​of specific points on the semiconductor device data grid under the same grid density. This helps users quickly obtain specific data point values ​​in semiconductor device performance analysis and defect detection.

[0055] Specifically, please refer to Figure 1 , Figure 1 This is a schematic diagram of a scenario illustrating the method and apparatus for estimating two-dimensional planar values ​​of semiconductor devices according to this application. Figure 1 As shown, users can transmit specific semiconductor device information to the server via the client. The server analyzes the uploaded information, obtains the numerical values ​​of specific points on the semiconductor device, and feeds them back to the client, thus helping users quickly obtain the specific data point values ​​on the semiconductor device. It should be understood that the server and client in this scenario can be two independent devices or integrated into the same system; this is not limited here.

[0056] The estimation method of this application is described in detail below. Please refer to [link / reference]. Figure 2 , Figure 2 This is the method for estimating the two-dimensional planar values ​​of semiconductor devices in this application.

[0057] like Figure 2 As shown, the estimation method includes:

[0058] S100, Construct a cutting line segment that runs through a two-dimensional grid.

[0059] The two-dimensional mesh can be a two-dimensional mesh obtained by solving the two-dimensional surface model of the target semiconductor device using finite element method, where the position and physical information of its nodes are known.

[0060] Specifically, firstly, users can send the specific parameters of the target semiconductor device to the server. These parameters include shape, length, width, height, semiconductor material, doping concentration, and so on.

[0061] Based on the parameters provided by the user, the server can construct a two-dimensional surface model of one surface of the target semiconductor device.

[0062] After constructing a two-dimensional surface model, the model can be meshed, thus dividing the two-dimensional surface into individual meshes. For example... Figure 3 As shown, Figure 3 This is a schematic diagram of a two-dimensional mesh implementation of this application, which includes 18 nodes in total, AQ.

[0063] Specifically, the meshing process can be performed using a finite element analysis algorithm. In one implementation, the finite element analysis algorithm can describe a mesh point based on the following set of differential equations:

[0064] ∈▽ 2 ψ=q(n-p+N A )

[0065]

[0066]

[0067] In the formula, ∈ is the permittivity of the material, ψ represents the electric potential, q is the elementary charge, n represents the electron concentration, p represents the hole concentration, and N A The doping concentration of a semiconductor device is represented by t, time is represented by G, the amount of charge carriers (including electrons and holes) generated is represented by G, and the recombination rate of charge carriers is represented by R.

[0068] Because of the conservation of total charge, the amount of electrons and holes generated and recombine must be equal.

[0069] J N and J P μ represents the current density of electrons and holes. n and μ p D is the mobility of electrons and holes in the material. n and D P It is the diffusion rate of electrons and holes in the material.

[0070] When the device reaches steady state, the partial derivative with respect to time t is 0. x = (ψ, n, p) represents the independent variable to be solved, and the other parameters are constants determined by the material properties of the device. Finally, the solution is obtained for the three physical quantities (ψ, n, p) of the mesh nodes.

[0071] In summary, based on meshing, a two-dimensional mesh containing the location and physical information of known nodes can be obtained.

[0072] In one implementation, the physical information may include electric potential, electron concentration, and hole concentration.

[0073] For a two-dimensional grid, arbitrary cutting line segments can be randomly constructed, and the slope, endpoint coordinates, etc., of these cutting line segments can be arbitrarily selected. For example... Figure 4 As shown, Figure 4 yes Figure 2 A schematic diagram of the state corresponding to step S100 shows that the cutting straight line segment and the two-dimensional grid have a total of 9 intersection points.

[0074] In one implementation, the two endpoints of a cut straight line segment can be randomly selected to construct a line segment that runs through the cut straight line segment.

[0075] It is worth noting that, to improve the accuracy of subsequent fitting, the estimation of physical information for any point can prioritize selecting the cutting line segment that passes through that point and has the most intersections with the 2D grid, for example... Figure 4 Cutting straight line segments in the middle.

[0076] S200: Calculate the position information of the intersection point between the cutting straight line segment and the two-dimensional grid.

[0077] Since the equation for the cutting line segment is known, and the position information of any node in the two-dimensional mesh is known, the positions of the intersection points of the cutting line segment and all grid lines of the two-dimensional mesh can be calculated, i.e. Figure 4 The coordinates of points 1, 2...9 in the diagram.

[0078] S300: Based on the location and physical information of nodes in a two-dimensional mesh and the location information of intersections, estimate the physical information of intersections.

[0079] After obtaining the location information of the intersection point, the physical information of the intersection point can be estimated based on the location and physical information of the nodes at both ends of the grid line where the intersection point is located, using an interpolation method.

[0080] Specifically, please refer to Figure 5 , Figure 5 This application Figure 2 A flowchart of one embodiment corresponding to step S300.

[0081] Methods for estimating the physical information of intersection points may include:

[0082] S301. Obtain the position and physical information of the nodes at both ends of the grid line where the intersection point is located.

[0083] S302. Based on the positional and physical information of the nodes at both ends of the grid line, construct the interpolation function.

[0084] S303. Substitute the location information of the intersection point into the interpolation function to obtain the physical information of the intersection point.

[0085] Since the location and physical information of the nodes of the grid line are known, an interpolation function for the grid line can be constructed. The interpolation function is used to describe the relationship between the physical and location information of any point on the grid line.

[0086] The interpolation function can be a predefined function of a certain type. For example, in one implementation, the interpolation function can be a linear function. When the position information and physical information of the nodes at both ends of the grid line are known, the equation of the linear function can be calculated. The equation can describe the relationship between the distance of any point on the grid line from one end node and its physical information.

[0087] Then, based on the location information of the intersection point, the distance between the intersection point and one end node can be calculated, and substituted into the above linear function, the physical information of the intersection point can be estimated.

[0088] For example, when the interpolation function is a linear function, given two nodes A(x) a y a B(x) b y b ) and the intersection point C(x) c y c The location information of the two nodes A and B, and the potential ψ of the two nodes A and B. a ψ b The electric potential ψ at the intersection point C can be calculated using the following formula. c .

[0089]

[0090] In another implementation, the interpolation function can also be a nonlinear function, such as the Asinh function or the Signed log function, which can well describe the changes in physical quantities within a semiconductor device.

[0091] Since the position and physical information of the nodes at both ends of the grid line are known, the physical information of the nodes at both ends can be substituted into the interpolation function as the y-axis to obtain the corresponding x-axis coordinates. The correlation equation between the x-axis coordinates and the position information of the nodes can then be obtained, thereby constructing the interpolation function.

[0092] Based on the above correlation equation, the x-axis coordinates corresponding to the location information of the intersection point can be calculated. Substituting these x-axis coordinates into the above interpolation function, the physical information of the intersection point can be estimated.

[0093] For example, the interpolation function is the Asinh function, and the two nodes A(x) a y a B(x) b y b ) and the intersection point C(x) c y c The location information of nodes A and B is known, and the potential ψ of the two nodes A and B is also known. a ψ b It is known that the electric potential ψ at the intersection point C can be calculated using the following formula. c .

[0094]

[0095] It is worth noting that the above embodiments only illustrate several methods for estimating the physical information of intersection points based on interpolation methods. In other embodiments, other interpolation methods and other preset interpolation functions can also be applied to the estimation of the physical information of intersection points in this application. The appropriate interpolation function can be selected based on the characteristics of the actual semiconductor device to improve the accuracy of interpolation, which will not be elaborated here.

[0096] S400: Based on the location and physical information of the intersection points, construct a function model for cutting straight line segments.

[0097] The function model is used to describe the relationship between the physical and positional information of any point on the line segment that cuts the line.

[0098] Through the above step S500, the positional and physical information of all intersection points on the cutting straight line segment can be obtained. Therefore, the relationship between the positional and physical information of any point on the cutting straight line segment can be constructed, i.e., a function model.

[0099] Specifically, in one implementation, please refer to Figure 6 , Figure 6 yes Figure 2 A flowchart of one embodiment corresponding to step S400.

[0100] Methods for constructing a functional model include:

[0101] S401a, Calculate the reference distances of the intersection points respectively.

[0102] The reference distance of the intersection point is the distance between the intersection point and the reference endpoint of the line segment that cuts the line.

[0103] Specifically, the position information of one endpoint (x0, y0) of the line segment being cut can be obtained, as well as the position information of the n intersection points, namely (x1, y1), (x2, y2)...(x...). n y n ).

[0104] Based on the above location information, the reference distances of the n intersection points can be calculated.

[0105] S402a. Construct data points using the reference distance and corresponding physical information of the intersection points respectively.

[0106] Specifically, based on the reference distances and physical information of the n intersection points, n data points can be obtained:

[0107]

[0108] Here, value is used to represent the physical information of the data point, which may include one of the electric potential ψ, electron concentration n, and hole concentration p.

[0109] S403a, Function model for cutting straight line segments based on data point fitting.

[0110] After obtaining n data points, a function model can be obtained based on fitting methods.

[0111] Please see Figure 7 , Figure 7 yes Figure 6 A schematic diagram of a state corresponding to step S403a. (See diagram below.) Figure 9 As shown, a fitting function can be constructed to connect n data points. This fitting function is used to describe the relationship between the distance of any point on the cutting straight line segment and the endpoint (x0, y0) and the physical information of that point.

[0112] The fitting method can be a curve fitting method commonly used in existing technologies, such as least squares method, spline interpolation method, and polynomial fitting method, or a learning model such as neural network and support vector machine, all of which can achieve the effect of this implementation method.

[0113] It should be noted that the function model is obtained by fitting n data points. Therefore, as the number of data points increases, the accuracy of the fitting will also increase. Thus, in estimating the physical information of a specific point, it is preferable to construct the cutting straight line segment that passes through the specific point and has the most intersections with the two-dimensional grid.

[0114] In another implementation, please refer to Figure 8 , Figure 8 yes Figure 2A flowchart illustrating another embodiment corresponding to step S400.

[0115] Another way to construct a functional model is:

[0116] S401b: Construct data points using the physical information of the intersection points and their coordinate values ​​on the reference coordinate axes, respectively.

[0117] Specifically, the position of the intersection point can be mapped onto the reference coordinate axis to obtain the coordinates of the intersection point on the reference coordinate axis.

[0118] The reference coordinate axis can be either the X-axis or the Y-axis of a specified coordinate system.

[0119] Then, by associating the coordinates of the intersection point on the reference coordinate axis with the physical information of the intersection point, the data point can be obtained.

[0120] S402b, a function model for fitting and cutting straight line segments based on data points.

[0121] Based on the data points obtained in step S401b above, a function model can be fitted. This function model is used to describe the relationship between the physical information of any point on the cutting straight line segment and the coordinate value on the reference coordinate axis.

[0122] S500 estimates the physical information of any point on a cut straight line segment based on a function model.

[0123] Based on the function model for cutting straight line segments constructed using the above steps, the position information of any point on the cutting straight line segment can be substituted into the function model to obtain the physical information of that point, thereby enabling accurate estimation of the physical information of specific points in semiconductor devices.

[0124] Specifically, in one implementation, when the function model is used to describe the relationship between the physical information of any point on the cutting straight line segment and the distance relative to the reference endpoint, the distance (x) of any point on the cutting straight line segment can be calculated. i y i Distance between (x0, y0) and endpoint (x0, y0) Then the distance Substituting this into the function model, we can obtain the point (x). i y i The physical information of ).

[0125] In another implementation, when the function model is used to describe the relationship between the physical information of any point on the cutting straight line segment and the coordinate value on the reference coordinate axis, any point (x) on the cutting straight line segment can be used as the reference coordinate axis. i y i Mapping this onto the reference coordinate axis yields (x) i y iThe coordinates of a point on the reference coordinate axis are used to input the coordinates into the function model, thus obtaining the coordinates of any point (x, y) on the line segment that cuts the line. i y i The physical information of ).

[0126] This application also provides a device for estimating two-dimensional planar numerical values ​​of semiconductor devices. Please refer to [link to relevant documentation]. Figure 9 , Figure 9 This is a structural block diagram of an embodiment of the semiconductor device two-dimensional planar numerical estimation device of this application.

[0127] like Figure 9 As shown, the estimation device includes a cutting line construction module 21, an intersection calculation module 22, an estimation module 23, a function construction module 24, and an information calculation module 25.

[0128] The cutting line construction module 21 is used to construct a cutting straight line segment that runs through a two-dimensional mesh. The two-dimensional mesh can be a two-dimensional mesh obtained by solving the two-dimensional surface model of the target semiconductor device using finite element method, and the position information and physical information of its nodes are known.

[0129] The intersection calculation module 22 is used to calculate the position information of the intersection point between the cutting straight line segment and the two-dimensional grid;

[0130] The estimation module 23 is used to estimate the physical information of the intersection points based on the positional and physical information of the nodes in the two-dimensional mesh and the positional information of the intersection points.

[0131] The function construction module 24 is used to construct a function model for cutting straight line segments based on the location and physical information of the intersection points. The function model is used to describe the relationship between the physical and location information of any point on the cutting straight line segment.

[0132] The information calculation module 25 is used to estimate the physical information of any point on the cut straight line segment based on the function model.

[0133] As referred above Figures 1 to 8 This specification describes a method for estimating two-dimensional planar values ​​of semiconductor devices according to embodiments thereof. The details mentioned in the above description of the method embodiments also apply to the apparatus for estimating two-dimensional planar values ​​of semiconductor devices according to embodiments thereof. The above-described apparatus for estimating two-dimensional planar values ​​of semiconductor devices can be implemented in hardware, software, or a combination of hardware and software.

[0134] This application also provides an electronic device, please refer to... Figure 10 , Figure 10 This is a schematic diagram of one embodiment of the electronic device of this application. Figure 10As shown, in one embodiment, the electronic device 30 may include at least one processor 31, a memory 32 (e.g., non-volatile memory), a memory 33, and a communication interface 34, and the at least one processor 31, memory 32, memory 33, and communication interface 34 are connected together via a bus 35. The at least one processor 31 executes at least one computer-readable instruction stored or encoded in the memory 32.

[0135] It should be understood that the computer-executable instructions stored in memory 32, when executed, cause at least one processor 31 to perform the above-described combinations in the various embodiments of this specification. Figures 1-9 The description includes various operations and functions.

[0136] In the embodiments of this specification, electronic device 30 may include, but is not limited to: personal computer, server computer, workstation, desktop computer, laptop computer, notebook computer, mobile electronic device, smartphone, tablet computer, cellular phone, personal digital assistant (PDA), handheld device, messaging device, wearable electronic device, consumer electronic device, etc.

[0137] According to one embodiment, this application also provides a program product, such as a machine-readable medium. The machine-readable medium may have instructions (i.e., the elements implemented in software as described above), which, when executed by a machine, cause the machine to perform the above-described combinations of the various embodiments of this specification. Figures 1-10 The various operations and functions described. Specifically, a system or apparatus equipped with a readable storage medium storing software program code that implements the functions of any of the embodiments described above, and enabling the computer or processor of the system or apparatus to read and execute the instructions stored in the readable storage medium.

[0138] In this case, the program code read from the readable medium itself can perform the functions of any of the above embodiments, and therefore the machine-readable code and the readable storage medium storing the machine-readable code constitute a part of this specification.

[0139] Examples of readable storage media include floppy disks, hard disks, magneto-optical disks, optical disks (such as CD-ROM, CD-R, CD-RW, DVD-ROM, DVD-RAM, DVD-RW, DVD-RW), magnetic tapes, non-volatile memory cards, and ROMs. Alternatively, program code can be downloaded from a server computer or the cloud via a communication network.

[0140] Those skilled in the art will understand that the various embodiments disclosed above can be modified and varied without departing from the spirit of the invention. Therefore, the scope of protection of this specification should be defined by the appended claims.

[0141] It should be noted that not all steps and units in the above process and system structure diagrams are mandatory; some steps or units can be omitted according to actual needs. The execution order of each step is not fixed and can be determined as needed. The device structure described in the above embodiments can be a physical structure or a logical structure. That is, some units may be implemented by the same physical client, or some units may be implemented by multiple physical clients, or they may be jointly implemented by certain components in multiple independent devices.

[0142] In the above embodiments, the hardware units or modules can be implemented mechanically or electrically. For example, a hardware unit, module, or processor may include permanent dedicated circuitry or logic (such as a dedicated processor, FPGA, or ASIC) to perform the corresponding operation. The hardware unit or processor may also include programmable logic or circuitry (such as a general-purpose processor or other programmable processor), which can be temporarily configured by software to perform the corresponding operation. The specific implementation method (mechanical, dedicated permanent circuitry, or temporarily configured circuitry) can be determined based on cost and time considerations.

[0143] The specific embodiments described above with reference to the accompanying drawings are exemplary embodiments, but do not represent all embodiments that can be implemented or fall within the scope of the claims. The term "exemplary" as used throughout this specification means "serving as an example, instance, or illustration" and does not imply that it is "preferred" or "advantageous" compared to other embodiments. Specific details are included to provide an understanding of the described techniques. However, these techniques can be practiced without these specific details. In some instances, well-known structures and apparatuses are shown in block diagram form to avoid obscuring the concepts of the described embodiments.

[0144] The foregoing description of this disclosure is provided to enable any person skilled in the art to implement or use this disclosure. Various modifications to this disclosure will be apparent to those skilled in the art, and the general principles applicable herein can be applied to other variations without departing from the scope of this disclosure. Therefore, this disclosure is not limited to the examples and designs described herein, but is consistent with the widest scope of the principles and novel features disclosed herein.

Claims

1. A method for estimating two-dimensional planar numerical values ​​of a semiconductor device, characterized in that, include: Construct a cutting straight line segment that runs through a two-dimensional mesh, wherein the two-dimensional mesh is obtained by solving the two-dimensional surface model of the target semiconductor device using finite element method, and the position information and physical information of the nodes of the two-dimensional mesh are known; Calculate the position information of the intersection point between the cutting straight line segment and the two-dimensional grid; Based on the position and physical information of the nodes in the two-dimensional grid and the position information of the intersection points, the physical information of the intersection points is estimated; Based on the location and physical information of the intersection point, a function model of the cutting straight line segment is constructed. The function model is used to describe the relationship between the physical and location information of any point on the cutting straight line segment. Based on the function model, the physical information of any point on the cutting straight line segment is estimated.

2. The estimation method according to claim 1, characterized in that, The physical information of the nodes in the two-dimensional network includes at least one of electric potential, electron concentration, and hole concentration.

3. The estimation method according to claim 1, characterized in that, The step of estimating the physical information of the intersection point based on the position and physical information of the nodes in the two-dimensional grid and the position information of the intersection point includes: Obtain the position and physical information of the nodes at both ends of the grid line where the intersection point is located; An interpolation function is constructed based on the position and physical information of the nodes at both ends of the grid line; Substitute the location information of the intersection point into the interpolation function to obtain the physical information of the intersection point.

4. The estimation method according to claim 3, characterized in that, The interpolation function can be a linear function or a nonlinear function.

5. The estimation method according to claim 1, characterized in that, The step of constructing the function model for cutting the straight line segment based on the location and physical information of the intersection point includes: Calculate the reference distance of each intersection point, wherein the reference distance is the distance of the intersection point relative to the reference endpoint of the cutting line segment; Data points are constructed using the reference distance and corresponding physical information of the intersection points, respectively; A function model is fitted to the cutting straight line segment based on the data points, wherein the function model is used to describe the relationship between the physical information of any point on the cutting straight line segment and the distance relative to the reference endpoint.

6. The estimation method according to claim 1, characterized in that, The step of constructing the function model for cutting the straight line segment based on the location and physical information of the intersection point includes: Data points are constructed using the physical information of the intersection points and their coordinate values ​​on a reference coordinate axis, where the reference coordinate axis is either the X-axis or the Y-axis of a specified coordinate system. A function model is fitted to the cutting straight line segment based on the data points, wherein the function model is used to describe the relationship between the physical information of any point on the cutting straight line segment and the coordinate value on the reference coordinate axis.

7. A device for estimating the two-dimensional planar values ​​of a semiconductor device, characterized in that, include: The cutting line construction module is used to construct cutting straight line segments that penetrate a two-dimensional mesh, wherein the two-dimensional mesh is a two-dimensional mesh obtained by finite element analysis of a two-dimensional surface model of the target semiconductor device, and the position information and physical information of the nodes of the two-dimensional mesh are known. The intersection calculation module is used to calculate the position information of the intersection point between the cutting straight line segment and the two-dimensional grid; An estimation module is used to estimate the physical information of the intersection points based on the position and physical information of the nodes in the two-dimensional grid and the position information of the intersection points. The function construction module is used to construct a function model of the cutting straight line segment based on the positional and physical information of the intersection point. The function model is used to describe the relationship between the physical and positional information of any point on the cutting straight line segment. The information calculation module estimates the physical information of any point on the cutting straight line segment based on the function model.

8. An electronic device, characterized in that, include: At least one processor; as well as A memory storing instructions that, when executed by the at least one processor, cause the at least one processor to perform the method for estimating two-dimensional planar values ​​of a semiconductor device as described in any one of claims 1 to 6.

9. A machine-readable storage medium, characterized in that, It stores executable instructions that, when executed, cause the machine to perform the estimation method for two-dimensional planar values ​​of a semiconductor device as described in any one of claims 1 to 6.

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