Double-frequency electronic identifier

Abstract

The invention provides a double-frequency electronic identifier, and aims to solve the problems that an existing identifier is unstable in performance, single in function and insufficient in safety in a complex environment, and metal and non-metal surface applications are difficult to consider at the same time. The dual-frequency chip is arranged on the substrate, and a high-frequency communication module, an ultrahigh-frequency communication module and a storage area for common access of the high-frequency communication module and the ultrahigh-frequency communication module are integrated in the dual-frequency chip; the high-frequency antenna is arranged on the substrate and is electrically connected with the high-frequency communication module of the dual-frequency chip; the ultrahigh frequency antenna is arranged on the substrate and is electrically connected with the ultrahigh frequency communication module of the dual-frequency chip; and the shell covers the substrate, the dual-frequency chip, the high-frequency antenna and the ultrahigh-frequency antenna.

Description

Technical Field

[0001] This application relates to the field of automatic identification technology, specifically to a dual-frequency electronic tag. Background Technology

[0002] Radio Frequency Identification (RFID), as a contactless automatic identification technology, has been widely used in many fields such as logistics, retail, asset management, and identity verification. RFID acquires relevant data about objects through radio frequency signals and identifies them. RFID technology can complete the input and processing of object information without direct contact with the object being identified, and has advantages such as fast identification speed, multi-target identification capability, and adaptability to harsh environments, making it one of the key data sensing technologies in the Internet of Things (IoT) field.

[0003] However, currently used RFID electronic tags still face a series of technical bottlenecks in practical industrial applications. First, single-frequency tags (such as those using only high frequency or only ultra-high frequency) cannot simultaneously meet the demands of complex scenarios such as precise short-range interaction and rapid long-range inventory checks. Second, traditional tags suffer significant performance degradation when working on metal surfaces and are susceptible to temperature, humidity, and physical wear in complex outdoor environments, resulting in insufficient reliability and lifespan. Furthermore, ordinary tags generally lack proactive security mechanisms, and data is at risk of being tampered with or forged during transmission and storage, making it difficult to meet the asset management needs of high-security industries such as power and finance.

[0004] Therefore, in view of the above problems, this application proposes a dual-frequency electronic tag. Summary of the Invention

[0005] This application provides a dual-frequency electronic tag that integrates high-frequency and ultra-high-frequency antennas, adopts an integrated injection-molded sealed shell, and incorporates a national cryptographic security chip. This solves the problems of existing tags having unstable performance, limited functionality, insufficient security, and difficulty in accommodating both metallic and non-metallic surfaces in complex environments.

[0006] To achieve the above objectives, this application adopts the following technical solution: In a first aspect, this application provides a dual-frequency electronic identifier, comprising: substrate; The dual-frequency chip is mounted on a substrate and integrates a high-frequency communication module, an ultra-high-frequency communication module, and a storage area accessible by both the high-frequency and ultra-high-frequency communication modules. A high-frequency antenna is mounted on the substrate and electrically connected to the high-frequency communication module of the dual-frequency chip. An ultra-high frequency antenna is mounted on a substrate and electrically connected to the ultra-high frequency communication module of a dual-frequency chip. The outer casing covers the substrate, dual-band chip, high-frequency antenna, and ultra-high-frequency antenna.

[0007] In one alternative approach, the thickness of the substrate is no greater than 0.4 mm.

[0008] In one alternative approach, the high-frequency antenna is an etched double-layer rectangular spiral coil, wherein the double-layer rectangular spiral coil includes a first coil trace and a second coil trace located on different layers, and the first coil trace and the second coil trace are connected through metallized vias.

[0009] In one alternative approach, the UHF antenna is a microstrip two-element array antenna.

[0010] In one alternative approach, the housing is made of engineering plastic and formed by a one-piece injection molding process, with laser marking on the outer surface of the housing.

[0011] In one alternative approach, the injection molding process is a two-stage injection molding process, in which compatible plastic materials are used in the two injections to form a molecular-level fusion at the interface.

[0012] In one alternative approach, the overall thickness of the dual-frequency electronic sign shall not exceed 3.5 mm.

[0013] In one alternative approach, the dual-frequency chip's UHF communication module integrates a security protection unit that supports security authentication and data encryption functions based on national cryptographic algorithms.

[0014] In one alternative approach, the national cryptographic algorithm is either the SM1 algorithm or the SM7 algorithm.

[0015] In one alternative approach, the dual-band chip is mounted on a substrate using surface mount technology; both the high-frequency antenna and the ultra-high-frequency antenna are made of copper and are formed on the substrate surface through an etching process.

[0016] In this embodiment, by optimizing the design and coordinating the configuration of high-frequency and ultra-high-frequency antennas, the tag can operate stably on both metallic and non-metallic surfaces, effectively expanding its application scenarios. Employing an ultra-thin substrate and integrated injection molding process, a compact overall structure (thickness ≤ 3.5mm) is achieved while constructing a hermetically sealed package that meets IP68 protection standards and is resistant to high temperatures (≥125℃), ensuring a service life of over 20 years in harsh outdoor environments. Furthermore, laser marking is used on the outer shell surface to form a permanent, wear-resistant mark, improving long-term recognizability and tamper resistance. A dual-frequency chip integrates high-frequency and ultra-high-frequency communication interfaces and shares a storage area, enabling a single tag to support both long-distance batch reading and short-distance secure data exchange, achieving unified functionality and data synchronization. In addition, the chip integrates a security protection module based on national cryptographic algorithms (such as SM1 / SM7), providing two-way authentication and data stream encryption, fundamentally solving the risks of information leakage and illegal tampering. This tag ultimately becomes a comprehensive solution suitable for demanding fields such as power assets, possessing excellent environmental adaptability, high reliability, and high security.

[0017] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the overall structure of the dual-frequency electronic tag provided in the embodiments of this application; Figure 2 This is a schematic diagram of the structure of the dual-frequency chip, ultra-high frequency antenna, and high frequency antenna in the dual-frequency electronic tag provided in the embodiments of this application. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments in this specification clearer, the technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this specification, and not all embodiments. The components of the embodiments of this specification described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of this specification provided in the accompanying drawings is not intended to limit the scope of the claimed specification, but merely to illustrate selected embodiments of this specification. All other embodiments obtained by those skilled in the art based on the embodiments in this specification without inventive effort are within the scope of protection of this specification.

[0022] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0023] In the description of the embodiments in this specification, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings, or the orientation or positional relationships commonly used when the product is in use. These are merely for the convenience of describing this specification and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this specification. Furthermore, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0024] Furthermore, the use of terms such as "horizontal," "vertical," and "sag" does not imply that the component must be absolutely horizontal or suspended, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0025] In the description of the embodiments in this specification, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this specification according to the specific circumstances.

[0026] The following section will provide a detailed description of a dual-frequency electronic identifier based on this application.

[0027] Figure 1 This is a schematic diagram of the overall structure of the dual-frequency electronic tag provided in the embodiments of this application. Figure 2 This is a schematic diagram of the structure of the dual-frequency chip, ultra-high frequency antenna, and high frequency antenna in the dual-frequency electronic tag provided in the embodiments of this application, as shown below. Figure 1 and Figure 2As shown, the dual-frequency electronic tag includes: substrate; The dual-frequency chip is mounted on a substrate and integrates a high-frequency communication module, an ultra-high-frequency communication module, and a storage area accessible by both the high-frequency and ultra-high-frequency communication modules. A high-frequency antenna is mounted on the substrate and electrically connected to the high-frequency communication module of the dual-frequency chip. An ultra-high frequency antenna is mounted on a substrate and electrically connected to the ultra-high frequency communication module of a dual-frequency chip. The outer casing covers the substrate, dual-band chip, high-frequency antenna, and ultra-high-frequency antenna.

[0028] It should be noted that the high-frequency antenna and the ultra-high-frequency antenna are configured in a coordinated manner, enabling the device to maintain effective communication whether it is attached to a metal surface or a non-metal surface.

[0029] That is, the high-frequency antenna is located on one side of the dual-frequency chip, the ultra-high-frequency antenna is located on the other side of the dual-frequency chip, the dual-frequency chip is electrically connected to the high-frequency antenna and the ultra-high-frequency antenna, and the dual-frequency chip is mounted on the substrate.

[0030] Optionally, the thickness of the substrate is no more than 0.4 mm.

[0031] For example, the substrate can be a Shengyi S1141 double-sided board with 1 ounce copper thickness and 0.4 mm board thickness.

[0032] Optionally, the high-frequency antenna is a double-layer rectangular spiral coil formed by etching, wherein the double-layer rectangular spiral coil includes a first coil trace and a second coil trace located on different layers, and the first coil trace and the second coil trace are connected through metallized vias.

[0033] It is understandable that the high-frequency antenna is a double-layer coil antenna with etching process. One layer is a rectangular disc coil wound layer by layer from the inside to the outside (the length of the rectangular disc coil is 53mm and the width is 11.5mm). Compared with coils wound with ordinary circular cross-section wires, the planar disc marking has very obvious advantages such as simple structure, easy processing, low cost, and low profile. The other layer is a bridge trace. The two ends of the bridge are connected to the other coil winding through metallized vias. The feed port of the high-frequency antenna is at the opening at the top of the coil antenna.

[0034] In practical applications, changing the number of coil turns, as well as the length and width of the coil, will alter the frequency of the electronic marker coil.

[0035] Optionally, the ultra-high frequency antenna is a microstrip two-element array antenna.

[0036] It is understandable that ultra-high frequency antennas are microstrip two-element antenna arrays, which have good radiation gain and a wide bandwidth, while reducing their sensitivity to the environment.

[0037] Furthermore, the dual-frequency chip covers both high-frequency and ultra-high-frequency bands, giving it the advantages of both: strong penetration capability, long recognition distance, and high-speed recognition. It also shares a common storage area, allowing for data sharing.

[0038] Optionally, the outer shell is made of engineering plastic and is formed by an integrated injection molding process, with laser marking on the outer surface of the shell.

[0039] For example, laser marking is used on the injection-molded shell of the metering box. The marked content is wear-resistant, weather-resistant, and corrosion-resistant, and can be clearly displayed for a long time, improving the product's appearance quality and making it suitable for harsh industrial environments such as outdoor, humid, and high-temperature environments. The marking cannot be easily erased or tampered with, and the durability of the marking is conducive to the long-term management of electrical materials such as metering boxes.

[0040] Optionally, the injection molding process is a two-stage injection molding process, in which compatible plastic materials are used in the two injections to form a molecular-level fusion at the interface.

[0041] It is understandable that the electronic tag is made using a one-time injection molding process. Compared with the tag made using the traditional ultrasonic process, the reliability and weather resistance of the tag are greatly improved. The one-time injection molding process, through a special process design, completely seals the antenna in the shell material, achieving an airtightness rating of IP68 while also withstanding high temperatures above 125°C, allowing the product to be used for more than 20 years in harsh outdoor environments.

[0042] Optionally, the overall thickness of the dual-frequency electronic sign shall not exceed 3.5mm.

[0043] Optionally, the dual-frequency chip's ultra-high frequency communication module integrates a security protection unit, which supports security authentication and data encryption functions based on national cryptographic algorithms.

[0044] Optionally, the national cryptographic algorithm is either the SM1 algorithm or the SM7 algorithm.

[0045] In other words, the UHF communication interface of this electronic tag has a security protection mechanism to protect the item identification area and user data area in necessary applications, preventing unauthorized writing, tampering, and identification, and ensuring that the tag has security and anti-counterfeiting functions. This electronic tag is a passive electronic tag, compatible with both metallic and non-metallic environments, requires no external power supply, is ultra-thin and small in size, and the laser marking is durable and highly reliable.

[0046] Specifically, the electronic identifier has a two-way authentication function based on the SM1 or SM7 national cryptographic algorithm, uses a challenge-response mechanism to negotiate the stream encryption key, and employs stream encryption to ensure the confidentiality and integrity of transmitted data, thus achieving secure data management. This includes: The UHF security protection mechanism includes functions such as access password locking, unlocking, and deactivation; the UHF security protection mechanism has a challenge-response two-way identity authentication mechanism, and the challenge-response two-way identity authentication process should use true random numbers; the UHF security protection mechanism provides correct and effective transmission confidentiality services for sensitive information that is allowed to be transmitted, etc.

[0047] Optionally, the dual-band chip is mounted on the substrate using surface mount technology; both the high-frequency antenna and the ultra-high-frequency antenna are made of copper and are formed on the substrate surface through an etching process.

[0048] It should also be noted that the aforementioned dual-frequency chip has 8 PAD points, two connected to high frequency, two connected to ultra-high frequency, and the other four floating. The chip contains a large-capacity storage area that can store information related to the stored items. High frequency and ultra-high frequency share the same storage area to achieve data sharing. It can be applied to situations that involve both high frequency and ultra-high frequency, as well as situations that combine short-distance and long-distance distances, such as transportation cards, where short-distance deduction and long-distance identification are possible, and other situations where short-distance payment and long-distance identification are possible, such as car toll collection.

[0049] The aforementioned PADs are tiny exposed metal contact points on the surface of integrated circuits (chips). They serve as "bridges" or "ports" connecting the complex internal circuitry of the chip to the external world (such as antennas or circuit boards). In RFID chips, these PADs are precisely connected to corresponding traces on the antenna (coil or radiating patch) via conductive adhesive, solder, or other connecting materials.

[0050] In addition, the electronic tag adopts a dual-frequency card electronic tag design, which does not require batteries and can be repeatedly erased and rewritten more than 100,000 times, meeting the requirements of high reliability and weather resistance in outdoor environments.

[0051] In summary, this embodiment optimizes the design and coordinates the configuration of high-frequency and ultra-high-frequency antennas, enabling the tag to operate stably on both metallic and non-metallic surfaces, effectively expanding its application scenarios. Employing an ultra-thin substrate and integrated injection molding process, a compact overall structure (thickness ≤ 3.5mm) is achieved while constructing a hermetically sealed package that meets IP68 protection standards and withstands high temperatures (≥125℃), ensuring a service life of over 20 years in harsh outdoor environments. Furthermore, laser marking on the outer shell creates a permanent, wear-resistant mark, enhancing long-term recognizability and tamper resistance. A dual-frequency chip integrates high-frequency and ultra-high-frequency communication interfaces and shares a storage area, enabling unified functionality and data synchronization for long-distance batch reading and short-distance secure data exchange with a single tag. In addition, the chip integrates a security protection module based on national cryptographic algorithms (such as SM1 / SM7), providing two-way authentication and data stream encryption, fundamentally solving the risks of information leakage and illegal tampering. This tag ultimately becomes a comprehensive solution suitable for demanding fields such as power assets, possessing excellent environmental adaptability, high reliability, and high security.

[0052] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this disclosure is limited to these examples; within the framework of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of the different aspects of this application as described above, which are not provided in detail for the sake of brevity.

[0053] The embodiments of this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A dual-frequency electronic tag, characterized in that, include: substrate; A dual-frequency chip is disposed on the substrate. The dual-frequency chip integrates a high-frequency communication module, an ultra-high-frequency communication module, and a storage area that can be accessed by both the high-frequency communication module and the ultra-high-frequency communication module. A high-frequency antenna is disposed on the substrate and electrically connected to the high-frequency communication module of the dual-frequency chip; An ultra-high frequency antenna is disposed on the substrate and electrically connected to the ultra-high frequency communication module of the dual-frequency chip; The outer casing covers the substrate, the dual-frequency chip, the high-frequency antenna, and the ultra-high-frequency antenna.

2. The dual-frequency electronic tag according to claim 1, characterized in that, The thickness of the substrate is no greater than 0.4 mm.

3. The dual-frequency electronic tag according to claim 1, characterized in that, The high-frequency antenna is a double-layer rectangular spiral coil formed by etching. The double-layer rectangular spiral coil includes a first coil trace and a second coil trace located on different layers. The first coil trace and the second coil trace are connected by metallized vias.

4. The dual-frequency electronic tag according to claim 1, characterized in that, The ultra-high frequency antenna is a microstrip two-element array antenna.

5. The dual-frequency electronic tag according to claim 1, characterized in that, The outer shell is made of engineering plastic and is formed by an integrated injection molding process. The outer surface of the outer shell is laser-marked.

6. The manufacturing method according to claim 5, characterized in that, The injection molding process is a two-stage injection molding process, in which compatible plastic materials are used in the two injections to form a molecular-level fusion at the interface.

7. The dual-frequency electronic tag according to claim 1, characterized in that, The overall thickness of the dual-frequency electronic tag is no more than 3.5 mm.

8. The dual-frequency electronic tag according to claim 1, characterized in that, The dual-frequency chip's ultra-high frequency communication module integrates a security protection unit, which supports security authentication and data encryption functions based on national cryptographic algorithms.

9. The dual-frequency electronic tag according to claim 8, characterized in that, The national cryptographic algorithm is either the SM1 algorithm or the SM7 algorithm.

10. The dual-frequency electronic tag according to claim 1, characterized in that, The dual-frequency chip is mounted on the substrate using surface mount technology; both the high-frequency antenna and the ultra-high-frequency antenna are made of copper and are formed on the surface of the substrate through an etching process.

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