Device and method for continuously preparing three-dimensional porous copper foil

Abstract

According to the device and method for continuously preparing the three-dimensional porous copper foil, on the basis of a copper foil roll-to-roll production structure, an annular porous template forms a transmission closed loop with tension based on a driving substrate and a template guide roller unit; a copper foil base material is continuously conveyed to the position between the annular porous template and the driving base plate through the copper foil multi-stage guide roller unit, the copper foil base material and the annular porous template can be tightly attached due to the tension effect of the annular porous template, etching liquid is sprayed to the surface of the attached annular porous template, and then the copper foil base material and the annular porous template are tightly attached. The annular porous template flows to the etching side of the copper foil base material for etching only through the through holes in the surface of the annular porous template, and under the guide action of the template guide roller unit and the copper foil multi-stage guide roller unit, the attachment and separation of the annular porous template and the copper foil base material can be controlled, and the transmission direction of the copper foil base material can be adjusted; the etching liquid is separated from the surface of the copper foil base material under the action of gravity, large-scale and continuous preparation of the three-dimensional porous copper foil can be achieved, and the industrial production requirement is met.

Description

Technical Field

[0001] This invention belongs to the field of metal material processing technology, and specifically relates to an apparatus and method for continuously preparing three-dimensional porous copper foil. Background Technology

[0002] Copper foil, due to its excellent conductivity, ductility, and chemical stability, is widely used as a current collector in electrochemical energy storage devices such as lithium-ion batteries and supercapacitors, as well as in electromagnetic shielding and catalysis. However, traditional electrolytic or rolled copper foil has a smooth, flat surface and limited specific surface area, leaving room for improvement in its mechanical bonding strength and electrochemical contact area with active materials.

[0003] To increase specific surface area and improve interfacial properties, porous copper foil has become an important area for improvement. Existing methods for preparing porous copper foil mainly include template methods, electrochemical deposition methods, and dealloying methods. Among these, chemical etching has attracted attention due to its relatively simple process and low cost. However, existing chemical etching techniques often employ photoresist patterning followed by etching, or use randomly distributed pore-forming agents. These methods suffer from complex processes requiring exposure and development steps, difficulty in precisely controlling the uniformity and consistency of the pore structure, and challenges in achieving continuous large-scale production. Especially for high-performance applications requiring uniform pore structure and narrow pore size distribution, existing methods have significant limitations. Summary of the Invention

[0004] To address the technical problems of complex processing and difficulty in large-scale production of three-dimensional porous copper foil in the prior art, this application provides an apparatus and method for continuous preparation of three-dimensional porous copper foil.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] An apparatus for continuously preparing three-dimensional porous copper foil includes an unwinding unit and a winding unit, as well as an etching groove and a post-processing unit arranged sequentially between the unwinding unit and the winding unit. The unwinding unit is used to provide copper foil substrate, and the winding unit is used to collect the three-dimensional porous copper foil formed during processing.

[0007] The etching tank is equipped with a circulating rolling attachment unit, an etching solution spraying device, and a copper foil multi-stage guide roller unit. The circulating rolling attachment unit includes a driving substrate, an annular porous template, and a template guide roller unit. The annular porous template forms a closed transmission loop based on the driving substrate and the template guide roller unit. The copper foil multi-stage guide roller unit includes a front transmission section, a middle transmission section, and a rear transmission section. In the middle transmission section, the copper foil substrate is located between the driving substrate and the annular porous template, and the copper foil substrate in the middle transmission section is bonded to the annular porous template. The etching solution spraying device is located on the etching side of the copper foil substrate in the middle transmission section.

[0008] Furthermore, the cross-sectional width of the annular porous template is greater than or equal to the cross-sectional width of the copper foil substrate.

[0009] Furthermore, the template guide roller unit includes a plurality of first guide rollers, the driving substrate is horizontally arranged, the plurality of first guide rollers are distributed around the driving substrate, and the first guide rollers located on the input side and output side of the driving substrate have a first height difference with the driving substrate, and the movement direction of the annular porous template located on the input side and output side of the driving substrate is at a first angle to the driving substrate.

[0010] The copper foil multi-stage guide roller unit includes multiple second guide rollers, which are distributed around the circulating rolling attachment unit. The second guide rollers located on the input side and output side of the driving substrate have a second height difference with the driving substrate. The movement direction of the copper foil substrate located on the input side and output side of the driving substrate is at a second angle to the driving substrate.

[0011] The first height difference is less than the second height difference, and the first included angle is greater than the second included angle.

[0012] Furthermore, the annular porous template is provided with multiple through holes, which are arranged in a periodic and orderly manner or distributed uniformly and randomly in a statistical sense. The diameter of the through holes is 5-15μm and the porosity is 5%-60%.

[0013] Furthermore, the thickness of the annular porous template is 10-100 μm, and the material of the annular porous template is one of polyethylene terephthalate, polyimide, polytetrafluoroethylene, polypropylene, or polyethylene.

[0014] Furthermore, the etching solution in the etching solution spraying device is an acidic etching solution, including ammonium persulfate solution, ferric chloride solution, sulfuric acid-hydrogen peroxide system or copper chloride-hydrochloric acid system.

[0015] Furthermore, the post-processing unit includes an acid washing unit, a water washing unit, a passivation unit, and a drying unit, which are sequentially arranged on the output side of the etching tank.

[0016] A method for continuously preparing three-dimensional porous copper foil includes the following steps:

[0017] Step S1: The copper foil substrate is driven by the unwinding unit and the winding unit to move at a constant speed and enter the etching tank. The driving substrate drives the annular porous template to rotate at the same speed as the copper foil substrate in the transmission closed loop. The etching solution spraying device sprays etching solution onto the annular porous template located on the driving substrate.

[0018] Step S2: After the copper foil substrate in the front section of the transmission is adjusted by the copper foil multi-stage guide roller unit to enter the circulating rolling attachment unit, it is horizontally attached to the annular porous template in the middle section of the transmission. The etching liquid stays on the exposed area of ​​the etching side of the copper foil substrate through the annular porous template and performs selective etching.

[0019] Step S3: When the copper foil substrate enters the later stage of the transmission, the copper foil substrate and the annular porous template are peeled off by the copper foil multi-stage guide roller unit and the template guide roller unit, respectively. At the same time, the etching liquid on the etching side surface of the copper foil substrate is removed from the copper foil substrate by gravity.

[0020] Step S4: The etched copper foil substrate is cleaned, passivated and dried in the post-processing unit to obtain a three-dimensional porous copper foil.

[0021] Furthermore, when the annular porous template is bonded to the copper foil substrate, the annular porous template exerts downward pressure on the copper foil substrate based on its own tension.

[0022] Furthermore, the temperature of the etching solution is 35-50°C, and the etching time is 30 seconds to 5 minutes.

[0023] Compared with the prior art, the present invention has the following beneficial technical effects:

[0024] This application provides an apparatus for the continuous fabrication of three-dimensional porous copper foil. Based on a roll-to-roll copper foil production structure, this apparatus uses an annular porous template to form a tensioned closed-loop transmission circuit using a driving substrate and a template guide roller unit. The copper foil substrate is continuously conveyed between the annular porous template and the driving substrate via a multi-stage copper foil guide roller unit. Due to the tension of the annular porous template, the copper foil substrate is tightly bonded to it. An etching solution spraying device sprays etching solution onto the surface of the bonded annular porous template, allowing the solution to flow only through the through-holes on the surface of the annular porous template to the etching side of the copper foil substrate for etching. The etching process is completed by the template guide roller unit. The multi-stage guide roller unit of Yuanhe copper foil controls the bonding and separation of the annular porous template and the copper foil substrate, and adjusts the transport direction of the copper foil substrate, so that the etching solution is lifted off the surface of the copper foil substrate by gravity. This is used to control the etching time. The post-processing unit can process the etched copper foil substrate into a three-dimensional porous copper foil that can be directly collected. This device is suitable for roll-to-roll production processes and can realize the large-scale and continuous preparation of three-dimensional porous copper foil, meeting the needs of industrial production. It realizes the industrial process of bonding, etching and peeling, eliminating the complex photolithography patterning steps and greatly improving production efficiency.

[0025] This application provides a method for continuously preparing three-dimensional porous copper foil. This method uses a pre-fabricated porous template to precisely control the pore size, shape, distribution, and porosity of the three-dimensional porous copper foil. By controlling the spray volume of the etching solution spraying device and the bonding time between the annular porous template and the copper foil substrate, the etching reaction process can be controlled, thereby improving product consistency and uniformity. Similarly, by adjusting the etching process, three-dimensional porous structures with different aspect ratios and sidewall morphologies can be obtained to meet the needs of different application scenarios. This method is simple, efficient, low-cost, and easy to scale up for continuous production. Attached Figure Description

[0026] Figure 1 A production line process diagram of an apparatus for continuously preparing three-dimensional porous copper foil according to an embodiment of this disclosure is shown.

[0027] Figure 2 A schematic diagram of the etching tank in an embodiment of this disclosure is shown;

[0028] Figure 3 An embodiment of this disclosure is shown. Figure 2 A magnified view of a portion of point I;

[0029] Figure 4 A schematic diagram of the apparatus for continuously preparing three-dimensional porous copper foil in an embodiment of this disclosure is shown;

[0030] Figure 5 A schematic diagram of the transmission closed loop in an embodiment of this disclosure is shown;

[0031] Figure 6 A schematic diagram of an annular porous template with periodically ordered through holes is shown in an embodiment of this disclosure;

[0032] Figure 7 This illustration shows a schematic diagram of an annular porous template with a statistically uniformly disordered distribution of through holes in an embodiment of the present disclosure;

[0033] Figure 8 A scanning electron microscope (SEM) image of the copper foil substrate in an embodiment of this disclosure is shown.

[0034] Figure 9 A scanning electron microscope (SEM) image of a three-dimensional porous copper foil according to an embodiment of this disclosure is shown.

[0035] In the figure: 1-unwinding unit; 2-copper foil substrate; 3-first guide roller; 4-second guide roller; 5-etching groove; 6-driving substrate; 7-annular porous template; 8-etching solution spraying device; 9-acid washing unit; 10-water washing unit; 11-passivation unit; 12-drying unit; 13-three-dimensional porous copper foil; 14-winding unit. Detailed Implementation

[0036] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0037] Figure 4 A schematic diagram of an apparatus for continuously preparing three-dimensional porous copper foil according to an embodiment of this disclosure is shown, as follows: Figure 4 As shown, it includes an unwinding unit 1 and a winding unit 14, as well as an etching tank 5 and a post-processing unit sequentially arranged between the unwinding unit 1 and the winding unit 14. The unwinding unit 1 is used to provide the copper foil substrate 2, and the winding unit 14 is used to collect the three-dimensional porous copper foil 13 formed by processing. The post-processing unit includes an acid pickling unit 9, a water washing unit 10, a passivation unit 11 and a drying unit 12 sequentially arranged on the output side of the etching tank 5. The acid pickling unit 13 is used to activate the metal surface to remove inorganic impurities, the water washing unit 10 is used to remove residual acid and soluble impurities, and the passivation unit 11 is used for surface roughening treatment or surface functional modification.

[0038] like Figure 2 and Figure 3 As shown, the etching tank 5 is equipped with a circulating rolling attachment unit, an etching solution spraying device 8, and a copper foil multi-stage guide roller unit. The circulating rolling attachment unit includes a driving substrate 6, an annular porous template 7, and a template guide roller unit. The annular porous template 7 forms a tensioned transmission closed loop based on the driving substrate 6 and the template guide roller unit. The copper foil multi-stage guide roller unit includes a front transmission section, a middle transmission section, and a rear transmission section. The copper foil substrate 2 in the middle transmission section is located between the driving substrate 6 and the annular porous template 7, and the copper foil substrate 2 in the middle transmission section is bonded to the annular porous template 7. The etching solution spraying device 8 is located on the etching side of the copper foil substrate 2 in the middle transmission section.

[0039] It should be noted that the transmission section includes a bonding side and a separation side. The etching solution spraying device 8 is located on the bonding side of the transmission section, so that the etching solution is sprayed onto the annular porous template 7 only after the copper foil substrate 2 is bonded to the annular porous template 7. At the same time, a waste liquid collection device is provided at the bottom of the etching tank 5 to collect the waste liquid after etching.

[0040] like Figure 4 and Figure 5 As shown, in this embodiment, the template guide roller unit includes a plurality of first guide rollers 3, the driving substrate 6 is horizontally arranged, the plurality of first guide rollers 3 are distributed around the driving substrate 6, and the first guide rollers 3 located on the input side and the output side of the driving substrate 6 have a first height difference with the driving substrate 6. The movement direction of the annular porous template 7 located on the input side and the output side of the driving substrate 6 is at a first angle to the driving substrate 6.

[0041] The copper foil multi-stage guide roller unit includes multiple second guide rollers 4, which are distributed around the circulating rolling attachment unit. The second guide rollers 4 located on the input side and output side of the driving substrate 6 have a second height difference with the driving substrate 6. The movement direction of the copper foil substrate 2 located on the input side and output side of the driving substrate 6 is at a second angle to the driving substrate 6.

[0042] The first height difference is less than the second height difference, and the first included angle is greater than the second included angle. It should be noted that the first height difference and the second height difference are used to prevent motion interference between the copper foil substrate 2 and the annular porous template 7 during transmission, and the first included angle and the second included angle are used to separate the copper foil substrate 2 and the annular porous template 7.

[0043] In this embodiment, the cross-sectional width of the annular porous template 7 is greater than or equal to the cross-sectional width of the copper foil substrate 2, ensuring that the annular porous template 7 can cover the surface of the copper foil substrate 2, so that the etching solution only contacts the surface of the copper foil substrate 2 through the through holes of the annular porous template 7.

[0044] In some embodiments, the driving substrate 6 is provided with a vacuum adsorption device for adsorbing the copper foil substrate 2 onto the surface of the driving substrate 6 in a flat and stable manner. Specifically, the vacuum adsorption device is set in the area where the annular porous template 7 and the copper foil substrate 2 are about to be bonded, that is, inside the input side of the driving substrate 6, thereby improving the flatness and stability of the copper foil substrate 2 before bonding.

[0045] In this embodiment, the annular porous template 7 is provided with multiple through holes. The shape of the holes can be circular, elliptical, square, rhomboid, or other regular geometric shapes. The through holes are arranged in a periodic and orderly manner or distributed uniformly and randomly in a statistical sense, such as... Figure 6 and Figure 7 As shown. The pore size is 5-15 μm, and the porosity is 5%-60%. The thickness of the annular porous template 7 is 10-100 μm, and the material of the annular porous template 7 is one of polyethylene terephthalate, polyimide, polytetrafluoroethylene, polypropylene, or polyethylene. The annular porous template 7 can be obtained by laser drilling, precision mold imprinting, or by using commercially available porous polymer membranes.

[0046] This embodiment also discloses a method for continuously preparing three-dimensional porous copper foil, such as... Figure 1 As shown, it includes the following steps:

[0047] Step S1: The copper foil substrate 2 is driven by the unwinding unit 1 and the winding unit 14 to move at a constant speed and enter the etching tank 5. The driving substrate 6 drives the annular porous template 7 to rotate at the same speed as the copper foil substrate 2 in the transmission closed loop. The etching solution spraying device 8 sprays etching solution onto the annular porous template 7 located on the driving substrate 6.

[0048] Step S2: After the copper foil substrate 2 in the front section of the transmission is adjusted by the copper foil multi-stage guide roller unit to enter the circulating rolling attachment unit, it is horizontally attached to the annular porous template 7 in the middle section of the transmission. The etching liquid stays in the exposed area of ​​the etching side of the copper foil substrate 2 through the annular porous template 7 and performs selective etching.

[0049] Step S3: When the copper foil substrate 2 enters the transmission section, the copper foil substrate 2 and the annular porous template 7 are peeled off under the action of the copper foil multi-stage guide roller unit and the template guide roller unit, respectively. At the same time, the etching liquid on the etching side surface of the copper foil substrate 2 is removed from the copper foil substrate 2 by gravity.

[0050] Step S4: The etched copper foil substrate 2 is cleaned, passivated and dried in the post-processing unit to obtain a three-dimensional porous copper foil 13.

[0051] Specifically, when the annular porous template 7 is bonded to the copper foil substrate 2, the annular porous template 7 exerts downward pressure on the copper foil substrate 2 based on its own tension, making the two bond more tightly.

[0052] In this embodiment, the etching solution in the etching solution spraying device 8 is an acidic etching solution, including ammonium persulfate solution, ferric chloride solution, sulfuric acid-hydrogen peroxide system, or copper chloride-hydrochloric acid system. The temperature of the etching solution is 35-50℃, and the etching time is 30 seconds to 5 minutes. By controlling the time of the copper foil substrate 2 in the middle of the transmission, the etching time can be controlled. Specifically, it can be adjusted by changing the transmission speed of the copper foil substrate 2 or the distance of the middle of the transmission. By controlling the etching conditions, such as the etching solution concentration, temperature, and time, etching can be carried out not only in the copper foil thickness direction but also moderately in the horizontal direction. That is, during the gradual etching process of the copper foil in the etching template hole area, the etching solution enters the hole, causing a certain amount of etching along the hole diameter direction on the hole wall, thereby forming a three-dimensional pit or porous structure with an opening larger than the diameter of the template through hole and sidewalls with inclined angles or curved transitions, rather than a simple straight-walled through hole.

[0053] Example 1

[0054] Step S1: Select an electrolytic copper foil with a thickness of 6μm as the copper foil substrate 2, such as... Figure 8 As shown, the annular porous template 7 is made of commercially available polyimide PI with a thickness of 25μm. The polyimide PI is processed by laser drilling to obtain an annular porous template 7 with a porous structure. The through holes of the annular porous template 7 are about 10μm in diameter and about 15μm in spacing, and the through holes are randomly distributed.

[0055] Step S2: The annular porous template 7 is fitted onto the driving substrate 6 and the template guide roller unit to form a tension-controlled closed-loop transmission circuit. Simultaneously, the unwinding unit 1 and the winding unit 14, as well as the driving substrate 6, are driven, so that the relative movement speed between the copper foil substrate 2 and the annular porous template 7 is equal. After multiple changes of direction by the copper foil multi-stage guide roller unit, in the middle section of the transmission, the annular porous template 7 flatly covers the surface of the copper foil substrate 2, and the two are tightly bonded without visible air bubbles. It should be noted that, in order to maintain the tension of the copper foil substrate 2 during the processing, the rotation speeds of the unwinding unit 1 and the winding unit 2 are not the same. Generally speaking, the rotation speed of the unwinding unit 1 is less than that of the winding unit 2 in order to maintain the tension and flatness of the copper foil substrate 2.

[0056] Step S3: Spray a saturated ammonium persulfate etching solution at 35°C onto the surface of the bonded annular porous template 7. The etching solution contacts the surface of the copper foil substrate 2 through the through holes on the surface of the annular porous template 7 and performs etching. By controlling the bonding time between the annular porous template 7 and the copper foil substrate 2, the etching time is ensured to meet 50 seconds. It should be noted that during the etching process, the annular porous template 7 and the copper foil substrate 2 need to remain in contact to ensure that the etching reaction points correspond one-to-one with the positions of the through holes in the annular porous template 7, thereby achieving selective etching of the surface of the copper foil substrate 2. After the annular porous template 7 and the copper foil substrate 2 separate, that is, after the etching is completed, the movement direction of the annular porous template 7 and the copper foil substrate 2 changes, at least tilting downwards and the upper and lower surfaces are inverted. At this time, the liquid remaining on the surface of the annular porous template 7 and the copper foil substrate 2 is detached by gravity and inertia, falls into the bottom of the etching tank 5 and is collected.

[0057] Step S4: After etching, the copper foil substrate 2 is cleaned in the pickling unit 9, which contains a 10% sulfuric acid solution. It is then rinsed with deionized water in the water washing unit 10, followed by passivation treatment in the passivation unit 11 to improve the oxidation resistance of the three-dimensional porous copper foil. Finally, it is dried with hot air at 80°C in the drying unit 12. After drying, a three-dimensional porous copper foil 13 is obtained. The three-dimensional porous copper foil 13 is collected by the winding unit 14, completing the large-scale production of the three-dimensional porous copper foil 13. The obtained three-dimensional porous copper foil 13 is shown below. Figure 9 As shown in the figure, the holes of the three-dimensional porous copper foil 13 are circular with clear edges, and the surface exhibits a uniformly and randomly distributed three-dimensional porous morphology.

Claims

1. An apparatus for continuously preparing three-dimensional porous copper foil, characterized in that, It includes an unwinding unit (1) and a winding unit (14), as well as an etching groove (5) and a post-processing unit arranged sequentially between the unwinding unit (1) and the winding unit (14). The unwinding unit (1) is used to provide copper foil substrate (2), and the winding unit (14) is used to collect the three-dimensional porous copper foil (13) formed by the process. The etching tank (5) is provided with a circulating rolling attachment unit, an etching solution spraying device (8) and a copper foil multi-stage guide roller unit. The circulating rolling attachment unit includes a driving substrate (6), an annular porous template (7) and a template guide roller unit. The annular porous template (7) forms a closed transmission loop based on the driving substrate (6) and the template guide roller unit. The copper foil multi-stage guide roller unit includes a front transmission section, a middle transmission section and a rear transmission section. The copper foil substrate (2) in the middle transmission section is located between the driving substrate (6) and the annular porous template (7), and the copper foil substrate (2) in the middle transmission section is bonded to the annular porous template (7). The etching solution spraying device (8) is located on the etching side of the copper foil substrate (2) in the middle transmission section.

2. The apparatus for continuously preparing three-dimensional porous copper foil according to claim 1, characterized in that, The cross-sectional width of the annular porous template (7) is greater than or equal to the cross-sectional width of the copper foil substrate (2).

3. The apparatus for continuously preparing three-dimensional porous copper foil according to claim 1, characterized in that, The template guide roller unit includes multiple first guide rollers (3), the driving substrate (6) is horizontally arranged, the multiple first guide rollers (3) are distributed around the driving substrate (6), and the first guide rollers (3) located on the input side and output side of the driving substrate (6) have a first height difference with the driving substrate (6). The movement direction of the annular porous template (7) located on the input side and output side of the driving substrate (6) is at a first angle to the driving substrate (6). The copper foil multi-stage guide roller unit includes multiple second guide rollers (4), which are distributed around the circulating rolling attachment unit. The second guide rollers (4) located on the input side and output side of the driving substrate (6) have a second height difference with the driving substrate (6). The movement direction of the copper foil substrate (2) located on the input side and output side of the driving substrate (6) is at a second angle to the driving substrate (6). The first height difference is less than the second height difference, and the first included angle is greater than the second included angle.

4. The apparatus for continuously preparing three-dimensional porous copper foil according to claim 1, characterized in that, The annular porous template (7) is provided with multiple through holes, which are arranged in a periodic and orderly manner or distributed in a statistically uniform and disordered manner. The diameter of the through holes is 5-15μm and the porosity is 5%-60%.

5. The apparatus for continuously preparing three-dimensional porous copper foil according to claim 1, characterized in that, The thickness of the annular porous template (7) is 10-100 μm, and the material of the annular porous template (7) is one of polyethylene terephthalate, polyimide, polytetrafluoroethylene, polypropylene or polyethylene.

6. The apparatus for continuously preparing three-dimensional porous copper foil according to claim 1, characterized in that, The etching solution in the etching solution spraying device (8) is an acidic etching solution, which includes ammonium persulfate solution, ferric chloride solution, sulfuric acid-hydrogen peroxide system or copper chloride-hydrochloric acid system.

7. The apparatus for continuously preparing three-dimensional porous copper foil according to claim 1, characterized in that, The post-processing unit includes an acid washing unit (9), a water washing unit (10), a passivation unit (11), and a drying unit (12) arranged sequentially on the output side of the etching tank (5).

8. A method for continuously preparing three-dimensional porous copper foil, characterized in that, The apparatus for continuously preparing three-dimensional porous copper foil according to any one of claims 1-7 includes the following steps: Step S1: The copper foil substrate (2) is driven by the unwinding unit (1) and the winding unit (14) to move at a constant speed and enter the etching tank (5). The driving substrate (6) drives the annular porous template (7) to rotate at the same speed as the copper foil substrate (2) in the transmission closed loop. The etching solution spraying device (8) sprays etching solution onto the annular porous template (7) located on the driving substrate (6). Step S2: After the copper foil substrate (2) in the front section of the transmission is adjusted by the copper foil multi-stage guide roller unit to enter the circulating rolling attachment unit, it is horizontally attached to the annular porous template (7) in the middle section of the transmission. The etching liquid stays on the etched side exposed area of ​​the copper foil substrate (2) through the annular porous template (7) and performs selective etching. Step S3: When the copper foil substrate (2) enters the transmission section, the copper foil substrate (2) and the annular porous template (7) are peeled off under the action of the copper foil multi-stage guide roller unit and the template guide roller unit, respectively. At the same time, the etching liquid on the etching side surface of the copper foil substrate (2) is removed from the copper foil substrate (2) by gravity. Step S4: The etched copper foil substrate (2) is cleaned, passivated and dried in the post-processing unit to obtain a three-dimensional porous copper foil (13).

9. The method for continuously preparing three-dimensional porous copper foil according to claim 8, characterized in that, When the annular porous template (7) is bonded to the copper foil substrate (2), the annular porous template (7) exerts downward pressure on the copper foil substrate (2) based on its own tension.

10. The method for continuously preparing three-dimensional porous copper foil according to claim 8, characterized in that, The temperature of the etching solution is 35-50℃, and the etching time is 30 seconds to 5 minutes.

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