Display panel, manufacturing method thereof and display device

Abstract

The invention discloses a display panel and a manufacturing method thereof and a display device.The display panel comprises a first area, a second area, a third area, a plurality of sub-pixels, a substrate, an inorganic layer, a first partition structure and a second partition structure, the inorganic layer, the first partition structure and the second partition structure are located on the substrate, and the first partition structure comprises a first partition part and a second partition part which are arranged in a stacked mode; the first isolation part comprises a first protruding part protruding relative to the edge of the second isolation part; the second partition structure comprises a first separator and a second separator which are arranged in a stacked mode, and the first separator comprises a second protruding part protruding relative to at least part of the edge of the second separator; the first partition structure and the second partition structure are configured to partition at least one layer of the light-emitting functional layer, at least part of the inorganic layer located in the first region is used as a first partition part, and at least part of the inorganic layer located in the third region is used as a first separator; the first partition structure and the second partition structure of the display panel are simple in structure and easy to manufacture.

Description

[0001] This application is a divisional application of Chinese Invention Patent Application No. 202380010991.9, filed on September 28, 2023, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0002] Embodiments of this disclosure relate to a display panel, a method for manufacturing the same, and a display device. Background Technology

[0003] Organic light-emitting diode (OLED) displays offer advantages such as rich colors, fast response times, and foldability, and are gradually replacing liquid crystal displays (LCDs). Consequently, the market is placing increasingly higher demands on OLED displays regarding lifespan, power consumption, and high-brightness modes. OLED display devices include tandem devices. By adding at least one light-emitting layer and a charge-generating layer to the tandem device, the lifespan and brightness of the light-emitting device can be improved, while power consumption can be reduced, thus meeting users' requirements for the lifespan and power consumption of display devices. Summary of the Invention

[0004] The embodiments of this disclosure provide a display panel, a method for manufacturing the same, and a display device.

[0005] The display panel provided in the embodiments of this disclosure includes: a first region, a second region, a third region, a plurality of sub-pixels, a substrate, and an inorganic layer, a first partition structure, and a second partition structure located on the substrate. The first region is configured to display; the second region is configured to transmit light, and the first region is located on at least one side of the second region; the third region is located between the first region and the second region; the plurality of sub-pixels are located in the first region, and each sub-pixel at least some of the sub-pixels includes a light-emitting functional layer, the light-emitting functional layer including a plurality of film layers; the first partition structure is located on the substrate and between adjacent sub-pixels in the first region, the first partition structure including a first isolation portion and a second isolation portion stacked thereon, the first isolation portion being located on the substrate. The second isolation portion is located on the side of the substrate away from the first isolation portion, and the first isolation portion includes a first protrusion protruding relative to the edge of the second isolation portion; the second isolation structure is located on the substrate and in the third region, and the second isolation structure includes a first isolation member and a second isolation member stacked together, the first isolation member being located on the side of the second isolation member away from the substrate, and the first isolation member including a second protrusion protruding relative to at least a portion of the edge of the second isolation member; wherein, both the first isolation structure and the second isolation structure are configured to isolate at least one layer of the light-emitting functional layer, at least a portion of the inorganic layer in the first region serves as the first isolation portion, and at least a portion of the inorganic layer in the third region serves as the first isolation member.

[0006] For example, in a display panel provided according to an embodiment of the present disclosure, the display panel further includes an organic layer located on the substrate, the inorganic layer being located on the side of the organic layer away from the substrate, wherein at least a portion of the organic layer in the first region serves as a second isolation portion, and at least a portion of the organic layer in the third region serves as at least a portion of the second isolation member.

[0007] For example, in a display panel provided according to an embodiment of the present disclosure, the orthographic projection of the first protrusion of the first isolation portion onto the substrate is a first ring, and the orthographic projection of the second protrusion of the first isolation member onto the substrate is a second ring, wherein the average ring width of the first ring is smaller than the average ring width of the second ring.

[0008] For example, in a display panel provided according to an embodiment of the present disclosure, the average ring width of the second ring is 1.2 to 3 times the average ring width of the first ring.

[0009] For example, in the display panel provided according to an embodiment of the present disclosure, the thickness of the first isolation portion is substantially equal to the thickness of the first isolation member in a direction perpendicular to the substrate.

[0010] For example, in a display panel provided according to an embodiment of the present disclosure, in a direction perpendicular to the substrate, the maximum thickness of the portion of the organic layer located in the first region is greater than or equal to the maximum thickness of the portion of the organic layer located in the third region.

[0011] For example, in a display panel provided according to an embodiment of the present disclosure, the orthographic projection of the first isolation member of the second partition structure on the substrate falls into the orthographic projection of the second isolation member of the second partition structure on the substrate.

[0012] For example, in a display panel provided according to an embodiment of the present disclosure, the second isolation member includes a first sub-isolation portion and a second sub-isolation portion, the first sub-isolation portion being located on the side of the second sub-isolation portion away from the substrate, the edge of the first isolation member protruding relative to the edge of the first sub-isolation portion, and the edge of the second sub-isolation portion protruding relative to the edge of the first isolation member or flush with the edge of the first isolation member.

[0013] For example, in a display panel provided according to an embodiment of the present disclosure, the second isolator includes at least one metal structure, and at least a portion of the organic layer located in the third region covers the surface of the at least one metal structure.

[0014] For example, in the display panel provided according to an embodiment of the present disclosure, the at least one metal structure includes a first metal structure and a second metal structure sequentially stacked along a direction perpendicular to the substrate, wherein the first metal structure is closer to the first spacer than the second metal structure, and the edge of the second metal structure protrudes relative to the edge of the first metal structure.

[0015] For example, in a display panel provided according to an embodiment of the present disclosure, the first metal structure is in contact with the first isolator, and the orthographic projection of the first metal structure on the substrate falls into the orthographic projection of the first isolator on the substrate.

[0016] For example, in a display panel provided according to an embodiment of the present disclosure, the thickness of the portion of the organic layer covering the surface of the first metal structure is less than the thickness of the portion of the organic layer covering the surface of the second metal structure.

[0017] For example, in a display panel provided according to an embodiment of the present disclosure, the second isolator further includes an insulating structure located between the first metal structure and the second metal structure, such that the first metal structure and the second metal structure are insulated from each other, the insulating structure comprising an inorganic material.

[0018] For example, in a display panel provided according to an embodiment of the present disclosure, the maximum thickness of the second insulating member in a direction perpendicular to the substrate is 1 / 3 to 1 / 3 of the maximum thickness of the portion of the organic layer located in the first region.

[0019] For example, a display panel provided according to an embodiment of this disclosure further includes a pixel defining pattern located in the first region and on the substrate. The pixel defining pattern includes a plurality of first openings to define the light-emitting areas of the at least some sub-pixels. A first partition structure is located between the light-emitting functional layer and the substrate. The first partition structure includes a portion surrounding the light-emitting area of ​​each of the at least some sub-pixels. The pixel defining pattern further includes a second opening. The portions of at least one layer of the light-emitting functional layer located in the first openings are continuous, and at least some portions are partitioned in at least one second opening. The portion of a partition structure exposed by the second opening is configured to partition at least one layer of the light-emitting functional layer; each sub-pixel of the at least portion of the sub-pixels further includes: a first electrode and a second electrode located on both sides of the light-emitting functional layer along a direction perpendicular to the substrate, the first electrode being located between the light-emitting functional layer and the substrate, the pixel defining pattern being located on the side of the first electrode away from the substrate, the first partition structure being located between the first electrode and the substrate, the display panel further including a pixel circuit located on the side of the first partition structure closer to the substrate, the pixel circuit being electrically connected to the first electrode.

[0020] For example, according to an embodiment of the present disclosure, the display panel further includes data lines and gate lines, the data lines and the gate lines being located on the substrate and in the first region, the data lines and the gate lines being electrically connected to the pixel circuit, the data lines being configured to provide data signals to the pixel circuit, and the gate lines being configured to provide scan signals to the pixel circuit, wherein the first metal structure is disposed on the same layer as the data lines, and the second metal structure is disposed on the same layer as the gate lines.

[0021] For example, in the display panel provided according to an embodiment of the present disclosure, the thickness of the first sub-isolation portion is 1 / 4 to 1 / 3 of the thickness of the second sub-isolation portion in a direction perpendicular to the substrate.

[0022] At least one embodiment of this disclosure also provides a display device including the display panel described in any of the preceding claims.

[0023] At least one embodiment of this disclosure also provides a method for manufacturing a display panel, the display panel including a first region, a second region, and a third region located between the first region and the second region, the first region being configured for display, the second region being configured for light transmission, and the first region being located on at least one side of the second region; the manufacturing method includes: forming an organic material layer on a substrate, patterning the organic material layer to form an organic layer pattern in the third region; forming an inorganic material layer on the organic layer pattern, patterning the inorganic material layer to form a first partition structure in the first region, and forming a second partition structure in the third region, wherein the first partition structure includes a first isolation portion and a second isolation portion stacked together. The first isolation portion is located on the side of the second isolation portion away from the substrate. The first isolation portion includes a first protrusion that protrudes relative to the edge of the second isolation portion. The second isolation structure includes a first isolation member and a second isolation member stacked together. The first isolation member is located on the side of the second isolation member away from the substrate. The first isolation member includes a second protrusion that protrudes relative to at least a portion of the edge of the second isolation member. Both the first isolation structure and the second isolation structure are configured to isolate at least one layer of the light-emitting functional layer. At least a portion of the inorganic material layer in the first region is patterned to form the first isolation portion. At least a portion of the inorganic material layer in the third region is patterned to form the first isolation member.

[0024] For example, a method for manufacturing a display panel according to at least one embodiment of the present disclosure, comprising forming an inorganic material layer on the organic layer pattern, patterning the inorganic material layer to form a first partition structure in a first region, and forming a second partition structure in a third region, comprising: patterning the inorganic material layer to form the first partition structure in the first region, and forming an initial partition structure in the third region, wherein the initial partition structure includes a first isolation member and a second initial isolation member, the first isolation member and the second initial isolation member being stacked, and the edge of the first isolation member protruding relative to at least a portion of the edge of the second initial isolation member; and further etching the second initial isolation member in the third region to form the second partition structure. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings of the embodiments will be briefly described below. Obviously, the drawings described below only relate to some embodiments of this disclosure and are not intended to limit this disclosure.

[0026] Figure 1This is a plan view of a display panel provided for at least one embodiment of the present disclosure.

[0027] Figure 2 For along Figure 1 A schematic diagram of a partial cross-section cut by line W1-W1'.

[0028] Figure 3 A schematic diagram of another display panel provided for at least one embodiment of this disclosure.

[0029] Figure 4 A schematic diagram of yet another display panel provided for at least one embodiment of the present disclosure.

[0030] Figure 5A A schematic diagram of yet another display panel provided for at least one embodiment of the present disclosure.

[0031] Figure 5B A schematic diagram of yet another display panel provided for at least one embodiment of the present disclosure.

[0032] Figure 6A A schematic diagram of yet another display panel provided for at least one embodiment of the present disclosure.

[0033] Figure 6B This is a schematic diagram of a light-emitting element with a tandem structure.

[0034] Figure 7 for Figure 1 The diagram shows the structure of the first area of ​​the display panel in one example.

[0035] Figure 8 for Figure 7 A magnified view of region M in the diagram.

[0036] Figure 9 This is a schematic block diagram of a display device provided according to at least one embodiment of the present disclosure.

[0037] Figure 10 ~ Figure 14 A flowchart illustrating a method for manufacturing a display panel according to an embodiment of this disclosure. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. Based on the described embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0039] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that an element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects.

[0040] The features such as “parallel,” “perpendicular,” and “identical” used in at least one embodiment of this disclosure include the strictly defined meanings of “parallel,” “perpendicular,” and “identical,” as well as cases where “approximately parallel,” “approximately perpendicular,” and “approximately identical” include certain errors, taking into account measurement and errors associated with the measurement of a specific quantity (e.g., limitations of the measurement system), and represent the acceptable deviation range for a specific value as determined by a person skilled in the art. For example, “approximately” can mean within one or more standard deviations, or within 10% or 5% of said value. Unless otherwise specified in the embodiments of this disclosure, the quantity of a component is implied to mean that the component may be one or more, or can be understood as at least one. “At least one” means one or more, and “more” means at least two.

[0041] The term "same-layer arrangement" as used in this disclosure refers to a structure formed by two (or more) structures through the same deposition process and patterned through the same patterning process, wherein the materials used may be the same or different. The term "integrated arrangement structure" as used in this disclosure refers to a structure formed by two (or more) structures through the same deposition process and patterned through the same patterning process, wherein the materials used may be the same or different.

[0042] Typically, a display panel with a "pinhole screen" generally includes a display area for normal display and a cutout area for housing sensors (e.g., cameras). The display area typically includes light-emitting elements and pixel circuitry. The pixel circuitry is electrically connected to the light-emitting elements and drives them to emit light. The sensor is usually located in the cutout area, which is an area where material has been removed relative to the normal display area to allow the sensor to receive ambient light. Therefore, a display panel with a "pinhole screen" differs from a "full-screen" display panel; the cutout area of ​​a "pinhole screen" display panel has good light transmittance. Generally, the display panel also includes a third area located between the display area and the cutout area.

[0043] In their research, the inventors of this application discovered that tandem devices possess the characteristics of low power consumption and long lifespan. For tandem devices, the light-emitting functional layer in the light-emitting element can include multiple layers of film stacked together. However, since a charge generation layer (CGL) is disposed between at least two layers of the multiple layers in a tandem device, and the charge generation layer (CGL) has a high conductivity, when the charge generation layer (CGL) is a continuous film layer, the charge generation layers (CGL) of two adjacent light-emitting elements are continuous. Therefore, lateral charge migration is prone to occur, causing a shift in the monochromatic chromaticity of the display panel at low grayscale levels. This can easily lead to crosstalk between adjacent sub-pixels, resulting in color shift in the display panel.

[0044] To reduce the risk of crosstalk between sub-pixels of different colors, at least one layer of the light-emitting functional layer between sub-pixels of different colors needs to be separated. Furthermore, to ensure the effectiveness of the separation of the light-emitting functional layer and other film layers, it is necessary to further separate the light-emitting functional layer and other film layers in the edge region (e.g., the third region located between the display region and the cutout region) to further reduce crosstalk and ensure the display effect of the sub-pixels in the display region. In some display panels, the separation structure in the third region has a different morphology and structure than the separation structure in the display region. For example, the separation structure in the display region usually has a composite structure formed by inorganic and organic structural layers, while the separation structure in the third region usually has a multi-layer metal composite structure, such as Ti / Al / Ti. Therefore, the separation structure in the third region usually requires different manufacturing processes, making the manufacturing process cumbersome and prone to process deviations. Thus, the overall uniformity of the separation structures in the display region and the third region needs to be improved.

[0045] At least one embodiment of this disclosure provides a display panel, a method for manufacturing the same, and a display device.

[0046] At least one embodiment of this disclosure provides a display panel comprising: a first region, a second region, a third region, a plurality of sub-pixels, a substrate, and an inorganic layer, a first partition structure, and a second partition structure located on the substrate. The first region is configured for display; the second region is configured for light transmission, and the first region is located on at least one side of the second region; the third region is located between the first region and the second region; the plurality of sub-pixels are located in the first region, and each sub-pixel at least some of the sub-pixels includes a light-emitting functional layer, and the light-emitting functional layer includes a plurality of film layers; the first partition structure is located on the substrate and between adjacent sub-pixels in the first region, and the first partition structure includes a first isolation portion and a... The second isolation portion has a first isolation portion located on the side of the second isolation portion away from the substrate. The first isolation portion includes a first protrusion protruding relative to the edge of the second isolation portion. The second isolation structure is located on the substrate and in the third region. The second isolation structure includes a first isolation member and a second isolation member stacked together. The first isolation member is located on the side of the second isolation member away from the substrate. The first isolation member includes a second protrusion protruding relative to at least a portion of the edge of the second isolation member. Both the first isolation structure and the second isolation structure are configured to block at least one layer of the light-emitting functional layer. At least a portion of the inorganic layer in the first region serves as the first isolation portion, and at least a portion of the inorganic layer in the third region serves as the first isolation member.

[0047] In at least one embodiment of the display panel provided in this disclosure, the first isolation portion of the first partition structure located in the first display area and the first isolation member of the second partition structure located in the third area are disposed on the same layer, that is, formed by the same deposition process and patterned by the same patterning process. This is beneficial to simplify the manufacturing process of the first isolation portion and the first isolation member, so that the structure of the first partition structure and the second partition structure can be simplified and have good uniformity.

[0048] The display panel, its manufacturing method, and display device provided in the embodiments of this disclosure are described below with reference to the accompanying drawings.

[0049] Figure 1 A plan view of a display panel provided in at least one embodiment of this disclosure; Figure 2 For along Figure 1 A schematic diagram of a partial cross-section cut by line W1-W1'.

[0050] like Figure 1As shown, the display panel 01 includes a first region A1, a second region A2, and a third region A3. The first region A1 is a display area configured for display. The second region A2 is a cutout area configured to transmit light; for example, a photosensitive sensor or similar device can be disposed in the second region A2. For example, the first region A1 can be located on at least one side of the second region A2. For example, in some embodiments, the first region A1 surrounds the second region A2, meaning the second region A2 can be surrounded by the first region A1. For example, the second region A2 can also be disposed in other locations, depending on the specific requirements. For example, the second region A2 can be located at the top center of the substrate BS.

[0051] For example, such as Figure 1 As shown, the number of second regions A2 and third regions A3 is the same. For example, in some embodiments, the number of second regions A2 and third regions A3 may be greater than 1. For example, multiple second regions A2 may be set in different positions or have different shapes according to design requirements. For example, the shape of the second region A2 may be circular, elliptical, or polygonal. For example, the second region A2 and third region A3 may also be other shapes, such as runway-shaped or polygonal, etc., and the embodiments of this disclosure are not limited thereto.

[0052] For example, such as Figure 1 As shown, the display panel 01 includes a substrate BS and a plurality of sub-pixels 10 located on the substrate BS. The plurality of sub-pixels 10 are located in a first region A1, such that the first region A1 serves as a display area. Figure 1 and Figure 2 As shown, at least some of the sub-pixels 10 each include a light-emitting element 100, the light-emitting element 100 including a light-emitting functional layer 110, and along a direction perpendicular to the substrate BS (e.g., as shown in the figure). Figure 2 The first electrode 120 and the second electrode 130 (shown in the Z direction) are located on both sides of the light-emitting functional layer 110, with the first electrode 120 located between the light-emitting functional layer 110 and the substrate BS. For example, each sub-pixel 10 located in the first region A1 includes a light-emitting element 100, for example, the light-emitting element 100 can be an organic light-emitting element.

[0053] For example, such as Figure 2As shown, the light-emitting functional layer 110 in the light-emitting element 100 may include a first light-emitting layer (EML) 111, a charge-generating layer (CGL) 113, and a second light-emitting layer (EML) 112 stacked together, with the charge-generating layer 113 located between the first light-emitting layer 111 and the second light-emitting layer 112. The charge-generating layer 113 has strong conductivity, which enables the light-emitting functional layer 110 to have advantages such as long lifespan, low power consumption, and high brightness. For example, compared to a light-emitting functional layer 110 without a charge-generating layer 113, including the charge-generating layer 113 in the light-emitting functional layer 110 can nearly double the brightness of the light-emitting element 100. For example, the light-emitting element 100 of the sub-pixel 10 can be a tandem light-emitting element, such as a Tandem OLED. For example, the first light-emitting layer 111 and the second light-emitting layer 112 can be structures obtained through patterning, and the charge-generating layer 113 can be a structure formed as a single layer.

[0054] For example, such as Figure 2 As shown, the charge generation layer 113 may include an N-type charge generation layer and a P-type charge generation layer. For example, in each sub-pixel 10, the light-emitting functional layer 110 may also include a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL). For example, the hole injection layer (HIL), hole transport layer (HTL), electron transport layer (ETL), electron injection layer (EIL), and charge generation layer 113 are all common film layers of multiple sub-pixels 10, and can be referred to as common layers.

[0055] For example, such as Figure 2 As shown, the second light-emitting layer 112 can be located between the first light-emitting layer 111 and the second electrode 130, and the hole injection layer can be located between the first electrode 120 and the first light-emitting layer 111. For example, an electron transport layer can also be disposed between the charge generation layer 113 and the first light-emitting layer 111. For example, a hole transport layer can be disposed between the second light-emitting layer 112 and the charge generation layer 113. For example, an electron transport layer and an electron injection layer can be disposed between the second light-emitting layer 112 and the second electrode 130.

[0056] For example, the materials for the electron transport layer can include aromatic heterocyclic compounds, such as imidazole derivatives, benzimidazole derivatives, imidazopyridine derivatives, benzimidazolephenanthridine derivatives, and other imidazole derivatives; pyrimidine derivatives, triazine derivatives, and other azine derivatives; quinoline derivatives, isoquinoline derivatives, phenanthreneroline derivatives, and other compounds containing a nitrogen-containing six-membered ring structure (including compounds with phosphine oxide substituents on the heterocycle), etc. For example, such as Figure 2As shown, the material of the charge generation layer 113 can be a material containing phosphoroyl groups or a material containing triazine. For example, the ratio of the electron mobility of the charge generation layer 113 material to the electron mobility of the electron transport layer is 10. -2 ~ 10 2 .

[0057] For example, such as Figure 2 As shown, the first electrode 120 can be an anode, and the second electrode 130 can be a cathode. For example, the cathode can be formed of a material with high conductivity and low work function; for example, the cathode can be made of a metallic material. For example, the anode can be formed of a transparent conductive material with a high work function.

[0058] For example, such as Figure 2 As shown, the orthographic projection of the second electrode 130 in at least a portion of the sub-pixels 10 onto the substrate BS is a full-surface structure. For example, the second electrode 130 can be a common electrode shared by multiple sub-pixels 10.

[0059] For example, such as Figure 2 As shown, an insulating layer 020 is disposed between the first electrode 120 and the substrate BS. For example, film layers 021 and 022 are also disposed between the insulating layer 020 and the substrate BS to provide insulation. Figure 2 Some structures between the insulating layer 020 and the substrate BS are omitted, such as the film layer where data lines and other signal lines are located, as well as other insulating layers.

[0060] like Figure 2 As shown, the display panel 01 also includes an inorganic layer 010 located on the substrate BS. For example, the inorganic layer 010 is located on the side of the insulating layer 020 away from the substrate BS and is in contact with the insulating layer 020.

[0061] like Figure 2 As shown, the display panel 01 also includes a first partition structure 200 and a second partition structure 300 located on the substrate BS. The first partition structure 200 is located between adjacent sub-pixels 10 in the first region A1 and includes a first partition portion 210 and a second partition portion 220 stacked together. The first partition portion 210 is located on the side of the second partition portion 220 away from the substrate BS and includes a first protrusion 201 protruding relative to the edge of the second partition portion 220. The second partition structure 300 is located in the third region A3 and includes a first partition member 310 and a second partition member 320 stacked together. The first partition member 310 is located on the side of the second partition member 320 away from the substrate BS and includes a second protrusion 301 protruding relative to at least a portion of the edge of the second partition member 320.

[0062] like Figure 2 As shown, both the first partition structure 200 and the second partition structure 300 are configured to isolate at least one film layer of the light-emitting functional layer 100. For example, the first protrusion 201 of the first partition structure 200 can isolate at least one film layer in the light-emitting functional layer 100, thereby reducing the risk of crosstalk between adjacent sub-pixels 10. The second protrusion 301 of the second partition structure 300 can isolate at least one film layer in the light-emitting functional layer 100, thereby further reducing the risk of crosstalk.

[0063] like Figure 2 As shown, at least a portion of the inorganic layer 010 located in the first region A1 serves as the first isolation portion 210, and at least a portion of the inorganic layer 010 located in the third region A3 serves as the first isolation element 310. That is, the first isolation portion 210 and the first isolation element 310 are disposed in the same layer, formed by the same deposition process, and patterned by the same patterning process. For example, the first isolation portion 210 and the first isolation element 310 are made of the same material. Therefore, the first isolation portion 210 and the first isolation element 310 can be patterned using the same mask, thereby simplifying the manufacturing process and making the structures of the first partition structure 200 and the second partition structure 300 simple, easy to manufacture, and easy to control process deviations. This results in good structural uniformity between the first partition structure 200 in the first display area A1 and the second partition structure 300 in the third region A3.

[0064] For example, such as Figure 2 As shown, the display panel 01 also includes an organic layer 020 (i.e., the aforementioned insulating layer 020) located on the substrate BS, an inorganic layer 010 located on the side of the organic layer 020 away from the substrate BS, at least a portion of the organic layer 020 located in the first region A1 serves as a second isolation portion 220, and at least a portion of the organic layer 020 located in the third region A3 serves as at least a portion of a second isolation member 320.

[0065] For example, refer to Figure 2 The second isolation portion 220 in the first partition structure 200 and the second isolation element 320 in the second partition structure 300 can also be disposed in the same layer. They can be formed by the same deposition process and patterned by the same patterning process. For example, the second isolation portion 220 and the second isolation element 320 are made of the same material. Thus, the second isolation portion 220 and the second isolation element 320 can be patterned using the same mask, thereby simplifying the manufacturing process and making it easier to control process deviations. This results in good structural uniformity between the first partition structure 200 located in the first display area A1 and the second partition structure 300 located in the third area A3.

[0066] Of course, for reference Figure 2 When the thicknesses of the light-emitting functional layer 110 to be isolated are different, the thickness of the second isolation member 320 can be set according to design requirements in the direction perpendicular to the substrate BS. For example, when the thickness of the light-emitting functional layer 110 to be isolated is large, the thickness of the second isolation member 320 can be correspondingly large to enhance the isolation capability of the second isolation structure 300. For example, when the thickness of the light-emitting functional layer 110 to be isolated is small, the thickness of the second isolation member 320 can be small, as long as the second isolation structure 300 can perform its isolation function. For example, in some embodiments of this disclosure, the first light-emitting layer 111 and the second light-emitting layer 112 may not be disposed in the third region A3, so that the second isolation structure 300 can be used to isolate at least one film layer in the light-emitting functional layer 110 other than the first light-emitting layer 111 and the second light-emitting layer 112.

[0067] For example, such as Figure 2 As shown, when the thickness of the light-emitting functional layer 110 is small, the thickness of the second isolation member 320 is less than the maximum thickness of the portion of the organic layer 020 located in the first region A1 in the direction perpendicular to the substrate BS. For example, the thickness of the second isolation member 320 is less than the thickness of the second isolation portion 220, but it is not limited thereto. For example, when the thickness of the second isolation member 320 is small, the second isolation member 320 can be a structure obtained by thinning at least a portion of the organic layer 020. For example, the second isolation portion 220 located in the first region A1 and the second isolation member 320 located in the third region A3 can be formed using a halftone mask.

[0068] For example, such as Figure 2 As shown, the number of second partition structures 300 can be 5 to 10, for example, 5 to 8, such as 7 or 8. The embodiments of this disclosure do not limit this.

[0069] For example, such as Figure 2 As shown, the inorganic layer 010 may include inorganic materials, such as silicon nitride, silicon oxide, or silicon oxynitride. For example, the organic layer 020 may include organic materials, such as polyimide.

[0070] For example, such as Figure 2As shown, the orthographic projection of the first protrusion 201 of the first isolation portion 210 onto the substrate BS forms a first ring, and the orthographic projection of the second protrusion 301 of the first isolation member 310 onto the substrate BS forms a second ring, with the average ring width P1 of the first ring being smaller than the average ring width P2 of the second ring. For example, the first isolation structure 200 can form an "undercut" structure through the first protrusion 201 in the first isolation portion 210 to isolate at least one film layer in the light-emitting functional layer 100, thereby reducing the risk of crosstalk between adjacent sub-pixels 10. For example, the second isolation structure 300 can form an "undercut" structure through the second protrusion 301 in the first isolation member 310 to further enhance its isolation function. By setting the average ring width P2 of the second ring to be greater than the average ring width P1 of the first ring, the second protrusion 301 of the first isolation member 310 can protrude more than the second isolation member 320, thereby making the isolation capability of the second isolation structure 300 stronger. For example, in the third region A3, the second partition structure 300 can isolate all the film layers in the light-emitting functional layer 100. For example, in the third region A3, the second partition structure 300 can isolate all the film layers in the light-emitting functional layer 100 and simultaneously isolate the second electrode 130.

[0071] For example, such as Figure 2 As shown, the average width of the second ring is 1.2 to 3 times the average width of the first ring, for example, it can be at least one of 1.2 to 1.5 times, 1.6 to 1.8 times, 1.7 to 2 times, 2.2 to 2.5 times, and 2.6 to 3 times. For example, it can be 1.5 times, 1.8 times, 2 times, 2.5 times, 2.8 times, or 3 times, and the embodiments of this disclosure are not limited in this respect.

[0072] For example, such as Figure 2 As shown (and as follows) Figure 7 As shown, the first ring corresponding to the first protrusion 201 in the first partition structure 200 surrounds the light-emitting area of ​​the sub-pixel 10, and the second ring corresponding to the second protrusion 301 in the second partition structure 300 surrounds the third region A3, i.e., the non-display area. For example, the first ring is a non-closed ring, and the second ring is a closed ring. For example, the first ring and the second ring may have approximately the same shape, or they may have different shapes. For example, the first ring may be circular or a rectangle with rounded corners. For example, the second ring may be circular or a rectangle with rounded corners.

[0073] For example, such as Figure 2 As shown (and as follows) Figure 7As shown, the outer perimeter of the first annulus corresponding to the first protrusion 201 in the first partition structure 200 is 10 to 90 micrometers, for example, it can be at least one of 10 to 20 micrometers, 25 to 35 micrometers, 40 to 50 micrometers, 55 to 65 micrometers, 70 to 80 micrometers, 75 to 85 micrometers, and 80 to 90 micrometers, but is not limited thereto. For example, the outer perimeter of the second annulus corresponding to the second protrusion 301 in the second partition structure 300 is 100 to 800 micrometers, for example, it can be at least one of 100 to 300 micrometers, 200 to 400 micrometers, 350 to 450 micrometers, 450 to 600 micrometers, 500 to 650 micrometers, and 700 to 800 micrometers, and the embodiments of this disclosure do not limit this.

[0074] For example, such as Figure 2 As shown (and as follows) Figure 7 As shown, the light-emitting area of ​​a sub-pixel 10 can be surrounded by a continuous first ring as described above. For example, the first ring surrounding the light-emitting area of ​​a sub-pixel 10 may also include multiple first sub-rings, and the multiple first sub-rings are spaced apart. For example, the shapes of the multiple first sub-rings surrounding the light-emitting area of ​​the same sub-pixel 10 may be substantially the same or different. For example, the outer perimeters of the multiple first sub-rings surrounding the light-emitting area of ​​the same sub-pixel 10 may also be unequal, and the embodiments of this disclosure do not limit this.

[0075] For example, such as Figure 1 and Figure 2 As shown, the number of the second rings surrounding the third region A3 can be 1 to 5, for example, at least one of 1 to 3, 2 to 4, 3 to 5, 1 to 4, and 4 to 5. For example, when there are multiple second rings surrounding the third region A3, the multiple second rings can have substantially the same shape, for example, they can all be at least one of circular, elliptical, and rectangular with rounded corners, and the embodiments of this disclosure do not limit this.

[0076] For example, such as Figure 2 As shown, in the direction perpendicular to the substrate BS, the thickness of the first isolation portion 210 is substantially equal to the thickness of the first isolation member 310. That is, during the formation of the first isolation portion 210 and the first isolation member 310, the inorganic layer 010 is not locally thinned, and its thickness is substantially uniform, thus enabling the first isolation portion 210 and the first isolation member 310 to be disposed in the same layer. The above-mentioned "substantially equal to" can mean that the thicknesses of the two are equal, or that the ratio of the thickness difference between the two to the thickness of one of them is not greater than 3%.

[0077] For example, such as Figure 2As shown, in the direction perpendicular to the substrate BS, the maximum thickness of the portion of the organic layer 020 located in the first region A1 is greater than or equal to the maximum thickness of the portion of the organic layer 020 located in the third region A3. For example, the maximum thickness of the portion of the organic layer 020 located in the first region A1 is Figure 2 the dimension P0 shown. For example, the maximum thickness of the portion of the organic layer 020 located in the third region A3 is the thickness of the second spacer 320.

[0078] For example, as Figure 2 shown, the maximum thickness of the portion of the organic layer 020 located in the first region A1 is 3 to 5 μm, and for example, it can be at least one of 3 to 3.5 μm, 3.5 to 4 μm, 4 to 4.5 μm, and 4.5 to 5 μm. For example, the maximum thickness of the portion of the organic layer 020 located in the third region A3 is 0.5 to 1.5 μm, and for example, it can be at least one of 0.5 to 0.8 μm, 1.0 to 1.2 μm, and 1.3 to 1.5 μm.

[0079] For example, as Figure 2 shown, a third partition structure R is further provided in the third region A3, and the third partition structure R is also configured to partition at least one layer in the light-emitting functional layer 110. For example, the orthographic projection of the third partition structure R on the substrate BS is a closed ring. For example, the number of the third partition structures R can be 1 to 5, and for example, it can be at least one of 2 to 4, 3 to 5, and 1 to 2. The embodiments of the present disclosure are not limited thereto.

[0080] It should be noted that the drawings in the embodiments of the present disclosure are only schematic illustrations of the film layer structures included in the first partition structure 200, the second partition structure 300, and the third partition structure R, rather than restrictive. For example, the display panel in the embodiments of the present disclosure may have other structures between the first partition structure 200 and the third partition structure R, and may also have other structures between the second partition structure 300 and the third partition structure R. The embodiments of the present disclosure do not limit this. Figure 3 It is a schematic diagram of another display panel provided by at least one embodiment of the present disclosure.

[0081] For example, as Figure 3 shown, at least one embodiment of the present disclosure further provides another display panel 02. Compared with the display panel 01 in Figure 2 , the thickness of the second spacer 320 in the display panel 02 in the direction perpendicular to the substrate BS is greater, and the remaining structures are the same. Specifically, reference can be made to the relevant descriptions about Figure 2 in the above embodiments, and details are not described herein again.

[0082] For example, as Figure 3 shown, in the direction perpendicular to the substrate BS, the thickness of the second isolation member 320 in the second partition structure 300 is substantially equal to the maximum thickness of the portion of the organic layer 020 located in the first region A1. Thus, the second partition structure 300 has a strong partitioning ability. For example, it can partition all the film layers of the light-emitting functional layer 110 with a relatively large thickness, and also partition the second electrode 130 together.

[0083] For example, as Figure 2 and Figure 3 shown, the orthographic projection of the second isolation member 320 on the substrate BS is completely located within the orthographic projection of the first isolation member 310 on the substrate BS.

[0084] Figure 4 Schematic diagram of another display panel provided by at least one embodiment of the present disclosure.

[0085] For example, as Figure 4 shown, at least one embodiment of the present disclosure further provides another display panel 03. Compared with the display panel 01 in Figure 2 , the second isolation member 320 in the second partition structure 300 in the display panel 03 is different, and the rest of the structures are the same. Specifically, reference can be made to the relevant descriptions about Figure 2 in the above embodiments, which will not be elaborated here.

[0086] For example, as Figure 4 shown, the orthographic projection of the first isolation member 310 of the second partition structure 300 falls into the orthographic projection of the second isolation member 320 of the second partition structure 300 on the substrate BS. For example, the area of the orthographic projection of the second isolation member 320 of the second partition structure 300 on the substrate BS is larger than the area of the orthographic projection of the first isolation member 310 of the second partition structure 300 on the substrate BS.

[0087] For example, as Figure 4 shown, in the display panel 03, the second isolation member 320 includes a first sub-isolation portion 3201 and a second sub-isolation portion 3202. The first sub-isolation portion 3201 is located on the side of the second sub-isolation portion 3202 away from the substrate BS. The edge of the first isolation member 310 protrudes relative to the edge of the first sub-isolation portion 3201, and the edge of the second sub-isolation portion 3202 protrudes relative to the edge of the first isolation member 310.

[0088] Of course, in some embodiments, the edge of the first isolation member 310 protrudes relative to the edge of the first sub-isolation portion 3201, and the edge of the second sub-isolation portion 3202 can also be flush with the edge of the first isolation member 310.

[0089] For example, as Figure 4As shown, the first sub-isolation part 3201 and the second sub-isolation part 3202 are integrally formed structures, and they are made of the same material. For example, the orthographic projection area of the first sub-isolation part 3201 on the substrate substrate BS is smaller than the orthographic projection area of the second sub-isolation part 3202 in the substrate substrate BS. The orthographic projection of the first sub-isolation part 3201 on the substrate substrate BS falls within the orthographic projection of the second sub-isolation part 3202 in the substrate substrate BS, and the second sub-isolation part 3202 has a third protrusion 3211. For example, the second partition structure 300 can partition at least one layer of the light-emitting functional layer 110 through the second protrusion 301 to reduce the risk of crosstalk. For example, a packaging layer is further provided on the side of the second electrode 130 away from the substrate substrate BS. By making the second sub-isolation part 3202 have a third protrusion 3211, it is beneficial for the packaging layer to be lapped on the second isolation member 320 through the third protrusion 3211 and facilitate the "ramping" of the packaging layer, thereby reducing the risk of the packaging layer breaking and ensuring the continuity of the packaging layer. In addition, with such a setting, the second partition structure 300 can also have good stability, so that the second partition structure 300 is not prone to phenomena such as tilting and misalignment.

[0090] For example, as Figure 4 shown, in the direction perpendicular to the substrate substrate BS, the thickness of the first sub-isolation part 3201 is smaller than the thickness of the second sub-isolation part 3202. For example, the thickness of the first sub-isolation part 3201 is 1 / 4 to 1 / 3 of the thickness of the second sub-isolation part 3202, such as 1 / 4, 7 / 24 or 1 / 3. For example, the dimension L1 of the first sub-isolation part 3201 in the direction perpendicular to the substrate substrate BS can be 0.2 to 0.3 microns, for example, it can be 0.2 microns, 0.25 microns, 0.28 microns or 0.3 microns. For example, the dimension L2 of the second sub-isolation part 3202 in the direction perpendicular to the substrate substrate BS can be 0.6 to 0.8 microns, for example, it can be 0.6 microns, 0.65 microns, 0.7 microns, 0.75 microns or 0.8 microns, and the embodiments of the present disclosure do not limit this. For example, in the direction perpendicular to the substrate substrate BS, the maximum thickness of the second isolation member 320 is basically equal to the maximum thickness of the part of the organic layer 020 located in the first display area A1, but is not limited thereto.

[0091] Figure 5A Schematic diagram of another display panel provided by at least one embodiment of the present disclosure; Figure 5B Schematic diagram of another display panel provided by at least one embodiment of the present disclosure.

[0092] For example, as Figure 5A shown, at least one embodiment of the present disclosure further provides another display panel 04. And Figure 2Compared to display panel 01, the second spacer 320 in the second partition structure 300 of display panel 04 is different, but the rest of the structure is the same. For details, please refer to the above embodiments regarding... Figure 2 The relevant descriptions will not be repeated here.

[0093] For example, such as Figure 5A As shown, the second partition structure 300 includes a first partition 310 and a second partition 320, with the first partition 310 located on the side of the second partition 320 away from the substrate BS. The second partition 320 includes at least one metal structure 3200, and at least a portion of the organic layer 020 located in the third region A3 covers the surface of the at least one metal structure 3200.

[0094] For example, such as Figure 5A As shown, at least one metal structure 3200 may include one or more metal structures. For example, the metal structure furthest from the substrate BS in the at least one metal structure 3200 is in contact with the first spacer 310. The at least one metal structure 3200 can "push up" the first spacer 310 to allow the second protrusion 301 in the first spacer 310 to block at least one film layer in the light-emitting functional layer 110. For example, at least a portion of the organic layer 020 located in the third region A3 covers the surface of the at least one metal structure 3200, preventing the metal structure 3200 from being exposed, thereby preventing the blocked light-emitting functional layer 110 from being electrically connected to the metal structure 3200, thus reducing the risk of crosstalk.

[0095] For example, such as Figure 5A As shown, at least one metal structure 3200 may include a first metal structure 3210 and a second metal structure 3220 sequentially stacked along a direction perpendicular to the substrate BS. The first metal structure 3210 is closer to the first spacer 310 than the second metal structure 3220. The first metal structure 3210 and the first spacer 310 are in contact with each other, and the orthographic projection of the first metal structure 3210 on the substrate BS falls within the orthographic projection of the first spacer 310 on the substrate BS.

[0096] For example, such as Figure 5A As shown, the projected area of ​​the first metal structure 3210 on the first spacer 310 is smaller than the projected area of ​​the second metal structure 3220 on the first spacer 310. The edge of the first spacer 310 protrudes relative to the edge of the first metal structure 3210, and the edge of the second metal structure 3220 protrudes relative to the edge of the first metal structure 3210. This arrangement facilitates the formation of an "undercut" structure, thereby enabling the second partition structure 300 to have a good partitioning function.

[0097] For example, such as Figure 5A As shown, at least one metal structure 3200 further includes a third metal structure 3230. The third metal structure 3230 is located on the side of the second metal structure 3220 closer to the substrate BS, and the orthographic projection area of ​​the third metal structure 3230 on the substrate BS is larger than the orthographic projection area of ​​the second metal structure 3220 on the substrate BS. Therefore, the orthographic projection areas of the first metal structure 3210, the second metal structure 3220, and the third metal structure 3230 on the substrate BS gradually increase. Consequently, the orthographic projection area of ​​the portion of the first spacer 310 protruding relative to the first metal structure 3210 on the substrate BS is larger, thus facilitating the formation of an "undercut" structure. For example, in some embodiments, at least one metal structure 3200 may also include other metal structures, such as at least one metal structure 3200 including 4 to 8 metal structures, thereby making the second isolation member 320 thicker on the substrate BS perpendicular to the substrate, so as to facilitate the second isolation structure 300 to isolate the thicker light-emitting functional layer 110. The embodiments of this disclosure do not limit the number of metal structures in the second isolation member 320.

[0098] For example, such as Figure 5A As shown, the thickness H1 of the portion of the organic layer 020 covering the surface of the first metal structure 3210 is less than the thickness H2 of the portion of the organic layer 020 covering the surface of the second metal structure 3220. For example, during the formation of the first spacer 310, the portion of the organic layer 020 covering the surface of the first metal structure 3210 is simultaneously etched, reducing the thickness of that portion of the organic layer 020, thereby making the "undercut" structure of the second partition structure 300 more prominent.

[0099] For example, such as Figure 5B As shown, the display panel also includes data lines 850 and gate lines 750, and the data lines 850 and gate lines 710 are respectively connected to the pixel circuit (e.g., as shown in the image). Figure 5A The pixel circuit 500 shown is electrically connected. Data line 850 is configured to provide data signals to the pixel circuit. Gate line 750 is electrically connected to the gate 710 in the pixel circuit, and gate line 750 is configured to provide scan signals, such as gate signals, to the pixel circuit. For example, the first metal structure 3210 can be disposed on the same layer as the data line 850, and the second metal structure 3220 can be disposed on the same layer as the gate line 750. This simplifies the manufacturing process of the first metal structure 3210 and the second metal structure 3220, and facilitates control over the manufacturing precision of the first metal structure 3210 and the second metal structure 3220.

[0100] Figure 6A A schematic diagram of another display panel provided for at least one embodiment of the present disclosure.

[0101] For example, as Figure 6A shown, at least one embodiment of the present disclosure further provides another display panel 05. Compared with Figure 5A the display panel 04 in Figure 5A , the second isolation member 320 in the second partition structure 300 of the display panel 05 is different, and the remaining structures are the same. For specific details, reference can be made to the relevant descriptions regarding

[0102] in the above embodiments, which will not be elaborated here. Figure 6A shown, the second isolation member 320 further includes an insulating structure 3001. The insulating structure 3001 is located between the first metal structure 3210 and the second metal structure 3220 to insulate the first metal structure 3210 from the second metal structure 3220, and the insulating structure 3001 includes an inorganic material. For example, the first metal structure 3210 and the second metal structure 3220 are spaced apart from each other by the insulating structure 3001, and the material of the insulating structure 3001 is different from the material of the organic layer 020 to reduce the influence on the organic layer 020. For example, the orthographic projection of the insulating structure 3001 on the substrate substrate BS is not less than the orthographic projection of the first metal structure 3210 on the substrate substrate BS. For example, the orthographic projection of the insulating structure 3001 on the substrate substrate BS may substantially coincide with the orthographic projection of the first metal structure 3210 on the substrate substrate BS. For example, the insulating structure 3001 may be provided in the same layer as the insulating structure located on the substrate substrate BS in the first region A1 to facilitate the simplification of the manufacturing process.

[0103] For example, as Figure 6A shown, in the direction perpendicular to the substrate substrate BS, the maximum thickness of the second isolation member 320 is 1 / 3 to 1 of the maximum thickness of the part of the organic layer 020 in the first region A1. For example, it may be 1 / 3 to 2 / 3 or 1 / 3 to 3 / 4. The embodiments of the present disclosure do not limit this.

[0104] For example, as Figure 6A shown, the display panel 05 further includes a pixel defining pattern 400. The pixel defining pattern 400 is located in the first region A1 and on the substrate substrate BS. The pixel defining pattern 400 includes a plurality of first openings 410 to define the light emitting regions of at least some sub-pixels 10. For example, one sub-pixel 10 corresponds to at least one first opening 410, at least a part of the light emitting element 100 of the sub-pixel 10 is located in the first opening 410 corresponding to the sub-pixel 10, and the first opening 410 is configured to expose the first electrode 120 of the sub-pixel 10. For example, the first opening 410 exposes a part of the first electrode 120. For example, one sub-pixel 10 may correspond to one first opening 410.

[0105] For example, such as Figure 6A As shown, the pixel-defining pattern 400 is located on the side of the first electrode 120 away from the substrate BS, and the first partition structure 200 is located between the first electrode 120 and the substrate BS. When the light-emitting functional layer 110 is formed in the first opening 410 of the pixel-defining pattern 400, the first electrode 120 and the second electrode 130 located on both sides of the light-emitting functional layer 110 can drive the light-emitting functional layer 110 in the first opening 410 to emit light. For example, the light-emitting area can refer to the effective light-emitting area of ​​the sub-pixel, and the shape of the light-emitting area refers to a two-dimensional shape. For example, the shape of the light-emitting area can be the same as the shape of the first opening 410 of the pixel-defining pattern 400.

[0106] For example, such as Figure 6A As shown, the first partition structure 200 is located in the first region A1 and between the light-emitting functional layer 110 and the substrate BS. The first partition structure 200 includes a portion surrounding the light-emitting area of ​​at least a portion of each sub-pixel 10. For example, the first partition structure 200 is located between the first electrode 120 and the substrate BS, and the orthographic projection of the first opening 410 on the substrate BS falls within the orthographic projection of the first partition structure 200 on the substrate BS. For example, the orthographic projection of the first electrode 120 on the substrate BS falls within the orthographic projection of the first partition structure 200 on the substrate BS.

[0107] For example, such as Figure 6A As shown, the display panel 01 also includes a pixel circuit 500. The pixel circuit 500 is located on the side of the first partition structure 200 near the substrate BS, and is electrically connected to the first electrode 120. For example, the pixel circuit 500 is configured to drive the light-emitting element 100 to emit light. For example, the pixel circuit 500 is configured to provide a driving current to drive the light-emitting element 100 to emit light. For example, the pixel circuit 500 may include multiple transistors and at least one capacitor (not shown), and the first electrode 120 can be electrically connected to the pixel circuit 500 via a connection via N1. For example, the pixel circuit may employ a 2T1C, 3T1C, or 7T1C design.

[0108] Figure 6B This is a schematic diagram of a light-emitting element with a tandem structure.

[0109] For example, such as Figure 6B As shown, the charge generation layers (CGLs) between different light-emitting elements with a Tandem structure are interconnected. Figure 6BThe diagram shows a first electrode E1, a second electrode E2, an optical coupling layer CPL, a hole transport layer HTL, a hole injection layer HIL, an electron transport layer ETL, an electron injection layer EIL, a hole blocking layer HBL, a P-type doped charge generation layer P-CGL, an N-type doped charge generation layer N-CGL, a light-emitting layer R, a light-emitting layer G, and a light-emitting layer B. Figure 6B As shown, the hole transport layer HTL includes hole transport layer HTL-1 and hole transport layer HTL-2. The electron transport layer ETL includes electron transport layer ETL-1 and electron transport layer ETL-2. The hole blocking layer HBL includes hole blocking layer HBL-1 and hole blocking layer HBL-2. For example, the hole transport layer HTL, hole injection layer HIL, electron transport layer ETL, electron injection layer EIL, hole blocking layer HBL, P-type doped charge generation layer P-CGL, and N-type doped charge generation layer N-CGL can serve as common layers for the light-emitting functional layers.

[0110] For example, such as Figure 6B As shown, the light-emitting layer R includes a first sub-light-emitting layer R1 and a first auxiliary light-emitting layer R2, the light-emitting layer G includes a second sub-light-emitting layer G1 and a second auxiliary light-emitting layer G2, and the light-emitting layer B includes a third sub-light-emitting layer B1 and a third auxiliary light-emitting layer B2. For example, the thickness of the first auxiliary light-emitting layer R2, the second auxiliary light-emitting layer G2, and the third auxiliary light-emitting layer B2 can be adjusted to regulate the carrier transport rate, so that excitons can recombine and emit light in the light-emitting layer.

[0111] Figure 7 for Figure 1 The diagram shows the structure of the first area of ​​the display panel in one example. Figure 8 for Figure 7 A magnified view of region M in the diagram.

[0112] For example, such as Figure 6A and Figure 7 As shown, the pixel-defined pattern 400 also includes a second opening 420, at least one layer of the light-emitting functional layer 110 having a continuous portion located in the first opening 410, and at least a portion located in at least one second opening 420 being spaced out, the portion of the first partition structure 200 exposed by the second opening 420 being configured to block at least one layer of the light-emitting functional layer 110.

[0113] For example, such as Figure 6A and Figure 7As shown, the portion of the first partition structure 200 exposed by the second opening 420 includes a partition portion 415. A partition portion 415 is provided between at least two adjacent sub-pixels 10, and at least one film layer in the light-emitting functional layer 110 is broken at the edge of the partition portion 415. By providing a partition portion 415 between adjacent sub-pixels 10 to isolate at least one film layer in the light-emitting functional layer 110, the probability of crosstalk between adjacent sub-pixels 10 is reduced. For example, the partition portion 415 refers to the structure in the first partition structure 200 exposed by the second opening 420.

[0114] In any embodiment of this disclosure, "adjacent sub-pixels" refers to two sub-pixels that are not separated from each other by other sub-pixels. These adjacent sub-pixels can be two sub-pixels of the same color or two sub-pixels of different colors.

[0115] For example, such as Figure 6A and Figure 7 As shown, at least a portion of the second electrode 120 is disconnected at the edge of the partition 415.

[0116] For example, such as Figure 7 As shown, the display panel 01 includes a first sub-pixel 11, a second sub-pixel 12, and a third sub-pixel 13. For example, the first sub-pixel 11, the second sub-pixel 12, and the third sub-pixel 13 may be configured to emit light of different colors, but are not limited thereto. For example, any two of the first sub-pixel 11, the second sub-pixel 12, and the third sub-pixel 13 may also be configured to emit light of the same color. For example, the area of ​​the light-emitting region of one first sub-pixel 11 is larger than the area of ​​the light-emitting region of one second sub-pixel 12, and the area of ​​the light-emitting region of one first sub-pixel 11 is larger than the area of ​​the light-emitting region of one third sub-pixel 13. For example, the area of ​​the light-emitting region of one second sub-pixel 12 is larger than the area of ​​the light-emitting region of one third sub-pixel 13.

[0117] In some examples, such as Figure 7 As shown, the first sub-pixel 11 is a blue sub-pixel, one of the second sub-pixel 12 and the third sub-pixel 13 is a red sub-pixel, and the other of the second sub-pixel 12 and the third sub-pixel 13 is a green sub-pixel. Figure 7 The illustration shows the second sub-pixel 12 as a red sub-pixel and the third sub-pixel 13 as a green sub-pixel, but it is not limited to this. For example, the second sub-pixel 12 could also be a green sub-pixel and the third sub-pixel 13 a red sub-pixel.

[0118] For example, such as Figure 6A and Figure 7As shown, in a direction perpendicular to the substrate BS, the first partition structure 200 includes a portion overlapping with the pixel defining pattern 400, a portion overlapping with the first opening 410, and a portion overlapping with the second opening 420. The portion of the first partition structure 200 exposed by the second opening 420 is configured to partition at least one layer of the light-emitting functional layer 110. For example, the display panel 01 includes a first partition portion 1101, a second partition portion 1102, and a third partition portion 1103. For example, the first partition portion 1101 includes a portion overlapping with the light-emitting area of ​​the first sub-pixel 11 and a portion surrounding the light-emitting area of ​​the first sub-pixel 11; the second partition portion 1102 includes a portion overlapping with the light-emitting area of ​​the second sub-pixel 12 and a portion surrounding the light-emitting area of ​​the second sub-pixel 12; and the third partition portion 1103 includes a portion overlapping with the light-emitting area of ​​the third sub-pixel 13 and a portion surrounding the light-emitting area of ​​the third sub-pixel 13.

[0119] For example, such as Figure 7 As shown, the portion of the first partition 1101 exposed by the second opening 420 is the first limiting partition 11011, and the portion of the second partition 1102 exposed by the second opening 420 is the second limiting partition 11021. For example, the light-emitting functional layer 110 and the second electrode 130 of the first sub-pixel 11 are disconnected at the edge of the first limiting partition 11011. The light-emitting functional layer 110 and the second electrode 130 of the second sub-pixel 12 are disconnected at the edge of the second limiting partition 11021.

[0120] For example, such as Figure 7 As shown, only one first limiting partition 11011 or one second limiting partition 11021 is provided between two adjacent sub-pixels arranged along the U direction, and only one first limiting partition 11011 or one second limiting partition 11021 is provided between two adjacent sub-pixels arranged along the V direction, thereby facilitating the balance of crosstalk and power consumption between adjacent sub-pixels. For example, both the U direction and the V direction are parallel to the substrate, and the U direction is perpendicular to the V direction.

[0121] For example, such as Figure 7 As shown, the portions of the first partition 1101 corresponding to the first sub-pixel 11 exposed by the second opening 420 are spaced apart, and the portions of the second partition 1102 corresponding to the second sub-pixel 12 exposed by the second opening 420 are also spaced apart. The orthographic projections of the first partition 11011 and the second partition 11021 onto the substrate are both non-closed annular shapes. The third partition 1103 corresponding to the third sub-pixel 13 is not exposed by the second opening 420.

[0122] For example, such as Figure 7As shown, the first sub-pixel 11 includes a first corner 011 formed by connecting two adjacent sides of its light-emitting area, a second corner 012 formed by connecting two adjacent sides of its light-emitting area, a third corner 013 formed by connecting two adjacent sides of its light-emitting area, and a fourth corner 014 formed by connecting two adjacent sides of its light-emitting area. The portion of the first partition portion 1101 corresponding to the first sub-pixel 11 exposed by the second opening 420 surrounds only the portions of the two adjacent sides of its light-emitting area excluding the first corner 011, the portions of the two adjacent sides of its light-emitting area excluding the second corner 012, the portions of the two adjacent sides of its light-emitting area excluding the third corner 013, and the portions of the two adjacent sides of its light-emitting area excluding the fourth corner 014, thereby facilitating the improvement of the second electrode 130 (e.g., Figure 6A (as shown) to improve continuity and reduce power consumption of the display panel.

[0123] For example, such as Figure 7 As shown, the second sub-pixel 12 includes a fifth corner 015 formed by connecting two adjacent sides of its light-emitting area, a sixth corner 016 formed by connecting two adjacent sides of its light-emitting area, a seventh corner 017 formed by connecting two adjacent sides of its light-emitting area, and an eighth corner 018 formed by connecting two adjacent sides of its light-emitting area. The portion of the second partition portion 1102 corresponding to the second sub-pixel 12 exposed by the second opening 420 surrounds only the portions of the two adjacent sides of its light-emitting area excluding the fifth corner 015, the portions of the two adjacent sides of its light-emitting area excluding the sixth corner 016, the portions of the two adjacent sides of its light-emitting area excluding the seventh corner 017, and the portions of the two adjacent sides of its light-emitting area excluding the eighth corner 018, thereby improving the second electrode 130 (e.g., Figure 6A (as shown) to improve continuity and reduce power consumption of the display panel.

[0124] For example, such as Figure 8As shown, the display panel includes multiple first connecting portions 2101 extending along direction X and multiple second connecting portions 2102 extending along direction Y. Both the first connecting portions 2101 and the second connecting portions 2102 are integrally formed with the first isolation portion 210. The first isolation portion 1101 is connected to the second isolation portion 1102 via the second connecting portions 2102, and the third isolation portion 1103 is connected to the second connecting portions 2101 via the first connecting portions 2101 and the second connecting portions 2102. The second connecting portions 2102 extend along direction Y and are generally "strip-shaped" to reduce the risk of peeling and facilitate the outgassing of the organic layer 020 located on the side of the first isolation portion 210 closest to the substrate BS. For example, both directions X and Y are parallel to the substrate BS, and direction X is perpendicular to direction Y. For example, direction X intersects direction U, and direction Y intersects direction V. For example, the angle between direction X and direction U is 45°, and the angle between direction Y and direction V is 45°.

[0125] For example, such as Figure 8 As shown, the minimum distance between the orthographic projection of the second opening 420 corresponding to the first sub-pixel 11 or the second sub-pixel 12 on the substrate and the orthographic projection of the second connecting portion 2102 on the substrate is d1, and d1 is greater than 2 micrometers, for example, it can be 3 micrometers or 4 micrometers, so that, under the condition of meeting the process tolerance, the portion of the first partition portion 1101 corresponding to the first sub-pixel 11 exposed by the second opening 420 can effectively block at least one film layer in the light-emitting functional layer, or the portion of the second partition portion 1102 corresponding to the second sub-pixel 12 exposed by the second opening 420 can effectively block at least one film layer in the light-emitting functional layer.

[0126] For example, such as Figure 8 As shown, the minimum distance between the orthographic projection of the second opening 420 corresponding to the first sub-pixel 11 or the second sub-pixel 12 on the substrate and the orthographic projection of the second connecting portion 2102 on the substrate is d2, and d2 is greater than 2 micrometers, for example, it can be 3 micrometers or 4 micrometers, so that, under the condition of meeting the process tolerance, the portion of the first partition portion 1101 corresponding to the first sub-pixel 11 exposed by the second opening 420 can effectively block at least one film layer in the light-emitting functional layer, or the portion of the second partition portion 1102 corresponding to the second sub-pixel 12 exposed by the second opening 420 can effectively block at least one film layer in the light-emitting functional layer.

[0127] For example, such as Figure 8As shown, the portion of the first partition 1101 corresponding to the first sub-pixel 11 exposed by the second opening 420 forms an open first partition ring, and the portion of the second partition 1102 corresponding to the second sub-pixel 12 exposed by the second opening 420 forms an open second partition ring. The average ring width of the first partition ring and the average ring width of the second partition ring are both d3, and d3 is greater than 3 micrometers, for example, it can be 4 micrometers or 5 micrometers, so that the orthogonal projection area of ​​the portions of the first partition 1101 and the second partition 1102 exposed by the second opening 420 on the substrate is large enough to meet the requirement of blocking at least one film layer in the light-emitting functional layer.

[0128] For example, such as Figure 8 As shown, the orthographic projection of the second opening 420 corresponding to the first sub-pixel 11 onto the substrate is an open ring, and the difference between the average ring width of this ring and the average ring width d3 of the first partition ring is d4, and d4 is greater than 3 micrometers, for example, it can be 4 micrometers or 5 micrometers. For example, the orthographic projection of the second opening 420 corresponding to the second sub-pixel 12 onto the substrate is an open ring, and the difference between the average ring width of this ring and the average ring width d3 of the second partition ring is also d4. For example, the orthographic projection of the second opening 420 onto the substrate is an open ring, and the ring width of this ring is d3+d4, and is greater than 10 micrometers, for example, it can be 11 micrometers, 12 micrometers or 13 micrometers.

[0129] This configuration allows the second opening 420 to have a sufficiently large opening area, which is beneficial for the portion of the first partition 1101 exposed by the second opening 420 to separate at least one film layer in the light-emitting functional layer, and also beneficial for the portion of the second partition 1102 exposed by the second opening 420 to separate at least one film layer in the light-emitting functional layer.

[0130] For example, such as Figure 8 As shown, the third partition portion 1103 corresponding to the third sub-pixel 13 is not exposed by the second opening 420, and the orthographic projection of the portion of the third partition portion 1103 extending beyond the first electrode 120 of the third sub-pixel 13 onto the substrate is approximately annular. The average ring width of this ring is d5, and d5 is not greater than 3 micrometers, for example, it can be 2 micrometers, 1 micrometer, or 0.5 micrometers, to facilitate the improvement of the second electrode 130 (e.g., Figure 6A (as shown in the figure) continuity.

[0131] For example, such as Figure 7 and Figure 8As shown, the portion of the first partition 1101 corresponding to the first sub-pixel 11 exposed by the second opening 420 includes multiple sub-parts spaced apart, such as the first sub-part 1001, the second sub-part 1002, the third sub-part 1003, and the fourth sub-part 1004. The minimum distance between the second openings 420 corresponding to adjacent sub-parts (e.g., the first sub-part 1001 and the second sub-part 1002) is d6, and d6 is not less than 20 micrometers, such as 22 micrometers, 24 micrometers, or 25 micrometers. For example, the portion of the second partition 1102 corresponding to the second sub-pixel 12 exposed by the second opening 420 also includes multiple sub-parts spaced apart, and the minimum distance between the second openings 420 corresponding to adjacent sub-parts is also d6. This arrangement helps to ensure that the second electrode 130 (e.g., Figure 6A The continuity shown allows the second electrodes 130 of adjacent sub-pixels 10 to overlap well, thereby reducing power consumption.

[0132] For example, such as Figure 6A and Figure 7 As shown, a spacer 800 can also be provided on the side of the pixel-defined pattern 400 away from the substrate BS. The spacer 800 can serve as a support layer and is configured to support the vapor deposition mask, such as an FMM (high-precision mask), used to fabricate the light-emitting functional layer 110. For example, the orthographic projection of the spacer 800 on the substrate BS falls within the orthographic projection of the second connection portion 2102 on the substrate BS, and the spacer 800 is spaced apart from the connection via N1. For example, the minimum distance between the spacer 800 and the connection via N1 is greater than 3 micrometers, and can be 3.5 micrometers, 4 micrometers, or 5 micrometers to reduce the impact on the pixel circuit 500.

[0133] Figure 9 This is a schematic block diagram of a display device provided according to at least one embodiment of the present disclosure.

[0134] like Figure 9 As shown, the display device 1000 includes a display panel 001. The display panel 001 can be the display panel in any of the above embodiments.

[0135] For example, the display device 1000 can be an organic light-emitting diode display device.

[0136] For example, the display device 1000 may also include a cover plate located on the light-emitting side of the display panel 1001.

[0137] For example, the display device 1000 can be any product or component with display function, such as a television, digital camera, mobile phone, watch, tablet computer, laptop computer, or navigator; this embodiment is not limited to this.

[0138] For example, the display device 1000 can be a medium-to-large-sized smart handheld display device (NB) or a touch display device (TPC), and it also has broad application potential in the field of foldable products.

[0139] Figure 10 ~ Figure 14 A flowchart illustrating a method for manufacturing a display panel according to an embodiment of this disclosure.

[0140] At least one embodiment of this disclosure also provides a method for manufacturing a display panel. For example, this manufacturing method is applicable to the display panel described in any of the above embodiments.

[0141] like Figure 10 As shown, the display panel 0001 includes a first region A1, a second region A2, and a third region A3 located between the first region A1 and the second region A2. The first region A1 is configured for display, and the second region A2 is configured for light transmission. The first region A1 is located on at least one side of the second region A2. For example, the first region A1 is a display area configured for display. The second region A2 is a cutout area configured for light transmission; for example, hardware such as a photosensor can be disposed in the second region A2.

[0142] like Figure 10 and Figure 11 As shown, the manufacturing method of display panel 0001 includes:

[0143] An organic material layer 020 is formed on a substrate BS, and the organic material layer 020 is patterned to form an organic layer pattern 0200 in a third region A3.

[0144] Then, as Figure 12 and Figure 13 As shown, an inorganic material layer 010 is formed on an organic layer pattern 0200. The inorganic material layer 010 is patterned to form a first partition structure 200 in a first region A1 and a second partition structure 300 in a third region A3. For example, as... Figure 14 As shown, after the inorganic material layer 010 is patterned, a first isolation portion 210 is formed in the first region A1, and a first isolation member 310 is formed in the third region A3. Thus, at least a portion of the inorganic material layer 010 located in the first region A1 is patterned to form the first isolation portion 210, and at least a portion of the inorganic material layer 010 located in the third region A3 is patterned to form the first isolation member 310.

[0145] like Figure 13As shown, both the first isolation structure 200 and the second isolation structure 300 are configured to block at least one layer of the light-emitting functional layer 110. The first isolation structure 200 includes a first isolation portion 210 and a second isolation portion 220 stacked together. The first isolation portion 210 is located on the side of the second isolation portion 220 away from the substrate BS. The first isolation portion 210 includes a first protrusion 201 that protrudes relative to the edge of the second isolation portion 220. The second isolation structure 300 includes a first isolation member 310 and a second isolation member 320 stacked together. The first isolation member 310 is located on the side of the second isolation member 320 away from the substrate BS. The first isolation member 310 includes a second protrusion 301 that protrudes relative to at least a portion of the edge of the second isolation member 320. For example, the second protrusion 301 protrudes relative to the edge of the portion of the second isolation member 320 that is close to and in contact with the first isolation member 310.

[0146] The display panel manufacturing method proposed in the embodiments of this disclosure is simple and easy to implement. It allows the first isolation portion 210 and the first isolation member 310 to be patterned and formed through the same mask, thereby simplifying the manufacturing process and making it easier to control process deviations. At the same time, it also simplifies the structure of the first partition structure 200 and the second partition structure 300, so that the first partition structure 200 located in the first display area A1 and the second partition structure 300 located in the third area A3 have good structural uniformity.

[0147] For example, such as Figure 12 ~ Figure 14 As shown, an inorganic material layer 010 is formed on an organic layer pattern 0200, and the inorganic material layer 010 is patterned to form a first partition structure 200 in a first region A1 and a second partition structure 300 in a third region A3, including:

[0148] First, such as Figure 12 and Figure 14 As shown, the inorganic material layer 010 is patterned to form a first partition structure 200 in a first region A1 and an initial partition structure 3000 in a third region A3. The initial partition structure 3000 includes a first partition 310 and an initial partition 3200, which are stacked together. The edge of the first partition 310 protrudes relative to at least a portion of the edge of the initial partition 3200. For example, the portion of the first partition 310 that protrudes relative to at least a portion of the edge of the initial partition 3200 is an initial protrusion 3010, and the projection of the initial protrusion 3010 onto the substrate BS is annular, with an average ring width of D1.

[0149] Then, as Figure 13 and Figure 14 As shown, for Figure 14 The initial isolator 3200 in the third region A3 is further etched to form Figure 13 The second partition structure 300 is shown. For example, the initial spacer 3200 can be etched by additionally providing a mask layer in the third region A3, such that at least a portion of the initial spacer 3200 located directly below the first spacer 310 is etched. For example, the portion of the first spacer 310 that protrudes relative to at least a portion of the edge of the second spacer 320 is a second protrusion 301, the orthographic projection of the second protrusion 301 on the substrate BS is annular, and the average ring width of the annulus is D2. Figure 13 and Figure 14 As shown, D2 is greater than D1. Therefore, by further etching the initial separator 3200 in the third region A3, the second isolation structure 300 can have a distinct "undercut" structure to enhance its isolation capability. For example, in some embodiments, in the first region A1, the first isolation structure 200 only isolates a portion of the film layers in the light-emitting functional layer, without isolating the second electrode. In the third region A3, the second isolation structure 300 isolates all the film layers in the light-emitting functional layer and also isolates the second electrode, thus the second isolation structure 300 can have a stronger isolation capability.

[0150] For example, such as Figure 10 As shown, the method for manufacturing a display panel provided in the embodiments of this disclosure may include: preparing a substrate BS on a glass carrier. For example, the substrate BS may be a flexible substrate. For example, forming the substrate BS may include sequentially forming a first flexible material layer, a first inorganic material layer, a semiconductor layer, a second flexible material layer, and a second inorganic material layer on the glass carrier. The materials of the first flexible material layer and the second flexible material layer are polyimide (PI), polyethylene terephthalate (PET), or surface-treated polymer soft film, etc. The materials of the first inorganic material layer and the second inorganic material layer are silicon nitride (SiNx) or silicon oxide (SiOx), etc., to improve the substrate's resistance to water and oxygen; the first inorganic material layer and the second inorganic material layer are also referred to as barrier layers.

[0151] For example, such as Figure 10As shown, the method for manufacturing a display panel provided in the embodiments of this disclosure may further include: forming a driving structure layer for pixel circuits on a substrate BS. The driving structure layer includes a plurality of pixel circuits 500, each pixel circuit 500 including a plurality of transistors and at least one storage capacitor. For example, the pixel circuits 500 may adopt a 2T1C, 3T1C, or 7T1C design. For example, in some embodiments, forming the driving structure layer may include: sequentially depositing a first insulating film and an active layer film on the substrate BS, patterning the active layer film through a patterning process to form a first insulating layer covering the entire substrate BS, and an active layer pattern disposed on the first insulating layer, the active layer pattern including at least an active layer. For example, sequentially depositing a second insulating film and a first metal film, patterning the first metal film through a patterning process to form a second insulating layer covering the active layer pattern, and a first gate metal layer pattern disposed on the second insulating layer, the first gate metal layer pattern including at least a gate electrode and a first capacitor electrode. For example, a third insulating film and a second metal film are deposited sequentially. The second metal film is patterned using a patterning process to form a third insulating layer covering the first gate metal layer, and a second gate metal layer pattern disposed on the third insulating layer. The second gate metal layer pattern includes at least a second capacitor electrode, the position of which corresponds to the position of the first capacitor electrode. Subsequently, a fourth insulating film is deposited and patterned using a patterning process to form a fourth insulating layer covering the second gate metal layer. At least two vias are formed on the fourth insulating layer, and the fourth, third, and second insulating layers within the two vias are etched away to expose the surface of the active layer of the active layer pattern. Subsequently, a third metal film is deposited and patterned using a patterning process to form a source / drain metal layer pattern on the fourth insulating layer. The source / drain metal layer pattern includes at least a source electrode and a drain electrode located in the display area. The source electrode and drain electrode can be connected to the active layer in the active layer pattern through vias, respectively.

[0152] For example, the first, second, third, and fourth insulating layers can be any one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and can be single-layer, multi-layer, or composite layers. For example, the first insulating layer can be a buffer layer to improve the water and oxygen resistance of the substrate BS. For example, the second and third insulating layers can be gate insulator (GI) layers. For example, the fourth insulating layer can be an interlayer dielectric (ILD) layer. For example, the first, second, and third metal thin films are made of metallic materials, such as any one or more of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo), or alloys of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb), and can be single-layer structures or multi-layer composite structures, such as Ti / Al / Ti, etc. For example, the active layer thin film uses one or more materials such as amorphous indium gallium zinc oxide (a-IGZO), zinc oxynitride (ZnON), indium zinc tin oxide (IZTO), amorphous silicon (a-Si), polycrystalline silicon (p-Si), hexathiophene, and polythiophene. That is, this disclosure is applicable to transistors manufactured based on oxide technology, silicon technology, and organic technology.

[0153] For example, such as Figure 2 As shown, after forming the first partition structure 200 and the second partition structure 300, the method for manufacturing the display panel provided in the embodiments of this disclosure further includes: patterning a first electrode 120 on the first partition structure 200. For example, the first electrode 120 can be made of a metallic material, such as any one or more of magnesium (Mg), silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo), or an alloy of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb). It can be a single-layer structure or a multi-layer composite structure, such as Ti / Al / Ti, or a stacked structure formed of metal and transparent conductive material, such as reflective materials like ITO / Ag / ITO, Mo / AlNd / ITO, etc. For example, the first electrode 120 is electrically connected to the pixel circuit 500 through a connecting via N1.

[0154] For example, such as Figure 2 As shown, after forming the first electrode 120, a pixel-defining pattern 400 can be formed. For example, a pixel-defining film is coated on the substrate BS on which the aforementioned pattern is formed, and the pixel-defining pattern 400 is formed by a masking, exposure, and development process. For example, the pixel-defining pattern 400 of the first region A1 includes a first opening 410 and a second opening 420 (e.g., ...). Figure 7As shown), the pixel-defining film within the first opening 410 and the second opening 420 is developed away. The first opening 410 exposes at least a portion of the surface of the first electrode 120 of the plurality of sub-pixels 10, and the second opening 420 exposes the first partition structure 200.

[0155] For example, such as Figure 2 and Figure 7 As shown, after forming the pixel-defined pattern 400, spacers 800 can be formed on the pixel-defined pattern 400. For example, an organic material thin film is coated on the substrate BS on which the aforementioned pattern is formed, and the spacers are formed by masking, exposure, and development processes. The spacers can serve as a support layer and are configured to support the FMM (high-precision mask) during the evaporation process.

[0156] For example, such as Figure 2 and Figure 7 As shown, after the spacer 800 is formed, the light-emitting functional layer 110 and the second electrode 130 are formed sequentially. For example, the second electrode 130 can be a transparent cathode. The light-emitting functional layer 110 can emit light from the side away from the substrate BS through the transparent cathode, achieving top emission. For example, the second electrode 130 can be any one or more of magnesium (Mg), silver (Ag), and aluminum (Al), or an alloy made of any one or more of the above metals, or a transparent conductive material, such as indium tin oxide (ITO), or a multilayer composite structure of metal and transparent conductive material.

[0157] For example, such as Figure 2 As shown, forming the light-emitting functional layer 110 may include: sequentially depositing a hole injection layer and a hole transport layer using an open mask; sequentially depositing a first light-emitting layer 111 emitting different colors of light, such as a blue light-emitting layer, a green light-emitting layer, or a red light-emitting layer, using an open mask; sequentially depositing an electron transport layer, a charge generation layer 113, and a hole transport layer using an open mask; sequentially depositing a second light-emitting layer 112 emitting different colors of light, such as a blue light-emitting layer, a green light-emitting layer, or a red light-emitting layer, using an open mask; and sequentially depositing an electron transport layer, a second electrode 130, and an optical coupling layer using an open mask. For example, the hole injection layer, the hole transport layer, the electron transport layer, the charge generation layer, the second electrode 130, and the optical coupling layer are all common layers of multiple sub-pixels.

[0158] For example, such as Figure 2 and Figure 7As shown, in the first region A1, the light-emitting functional layer 110 is broken at the edge of the first partition structure 200, thereby reducing the risk of crosstalk between adjacent sub-pixels 10. In the third region A3, the light-emitting functional layer 110 is broken at the edge of the second partition structure 300, thereby further reducing the risk of crosstalk between sub-pixels 10 located near the edge of the first region A1.

[0159] For example, after forming the second electrode, the method for manufacturing the display panel further includes forming an encapsulation layer, which may include a first encapsulation layer, a second encapsulation layer, and a third encapsulation layer stacked together. The first encapsulation layer uses an inorganic material and covers the second electrode in the display area. The second encapsulation layer uses an organic material. The third encapsulation layer uses an inorganic material and covers the first and second encapsulation layers. However, this embodiment is not limited to this. For example, the encapsulation layer may also adopt a five-layer structure of inorganic / organic / inorganic / organic / inorganic.

[0160] The following points need to be explained:

[0161] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure, and other structures can be referred to the general design.

[0162] (2) Where there is no conflict, features of the same embodiment and different embodiments of this disclosure may be combined with each other.

[0163] The above description is merely an exemplary embodiment of this disclosure and is not intended to limit the scope of protection of this disclosure, which is determined by the appended claims.

Claims

1. A display panel, comprising: The first area is configured for display. Multiple sub-pixels are located in the first region, and each sub-pixel in at least a portion of the sub-pixels includes a light-emitting functional layer, the light-emitting functional layer including multiple film layers; A substrate, and an inorganic layer located on the substrate; A pixel-defining pattern is located in the first region and on the substrate, the pixel-defining pattern including a plurality of first openings to define the light-emitting areas of at least a portion of the sub-pixels. A first isolation structure is located on the substrate and between adjacent sub-pixels in the first region. The first isolation structure includes a first isolation portion and a second isolation portion stacked together. The first isolation portion is located on the side of the second isolation portion away from the substrate. The first isolation portion includes a first protrusion that protrudes relative to the edge of the second isolation portion. At least a portion of the inorganic layer in the first region serves as the first isolation portion. The first isolation structure is configured to isolate at least one layer of the light-emitting functional layer. Wherein, the at least some sub-pixels include a first sub-pixel and a third sub-pixel, the area of ​​the light-emitting region of the first sub-pixel is larger than the area of ​​the light-emitting region of the third sub-pixel, a first partition structure is provided between adjacent first sub-pixels and third sub-pixels, and the minimum distance between the first partition structure and the light-emitting region of the first sub-pixel is smaller than the minimum distance between the first partition structure and the light-emitting region of the third sub-pixel.

2. The display panel according to claim 1, wherein, The at least some sub-pixels also include a second sub-pixel, and the first sub-pixel, the second sub-pixel, and the third sub-pixel are sub-pixels of different colors. The area of ​​the light-emitting region of the second sub-pixel is larger than the area of ​​the light-emitting region of the third sub-pixel. A first separation structure is provided between adjacent second sub-pixels and third sub-pixels, and the minimum distance between the first separation structure and the light-emitting region of the second sub-pixel is less than the minimum distance between the first separation structure and the light-emitting region of the third sub-pixel.

3. The display panel according to claim 2, wherein, The first partition structure is located between the light-emitting functional layer and the substrate, and the first partition structure includes a portion of the light-emitting region surrounding each of the at least some of the sub-pixels. The pixel-defined pattern further includes a second opening, wherein at least one layer of the light-emitting functional layer has a continuous portion located in the first opening, and at least a portion located in at least one second opening is separated, wherein the first separation structure includes at least one defined separation portion exposed by the second opening, and each defined separation portion is configured to separate the at least one layer of the light-emitting functional layer.

4. The display panel according to claim 3, wherein, At least a portion of the defined partition portions have at least a portion of their edges away from the light-emitting area they surround, and their orthogonal projections on the substrate are arc-shaped.

5. The display panel according to claim 3, wherein, The at least some sub-pixels include a corner formed by connecting two adjacent sides of their light-emitting regions. In the circumferential direction of the light-emitting area of ​​the same sub-pixel in at least some of the sub-pixels, the orthographic projection of the defining partition portion of the first partition structure on the substrate does not overlap with the orthographic projection of the corner portion of the sub-pixel on the substrate.

6. The display panel according to any one of claims 1 to 5, wherein, The corners of adjacent sub-pixels in at least some of the sub-pixels are arranged opposite each other.

7. The display panel according to claim 5, wherein, The at least some sub-pixels are arranged as a plurality of first sub-pixel groups and a plurality of second sub-pixel groups alternately arranged along a first direction. The first sub-pixel groups include a plurality of third sub-pixels arranged along a second direction. The second sub-pixel groups include first sub-pixels and second sub-pixels alternately arranged along the second direction. The first direction intersects the second direction and is parallel to the substrate. The first sub-pixel group and the second sub-pixel group are staggered in the second direction, and at least some of the first sub-pixels are surrounded by eight sub-pixels, and the eight sub-pixels include alternately arranged second sub-pixels and third sub-pixels.

8. The display panel according to claim 7, wherein, The portion of the first partition structure surrounding the light-emitting area of ​​the first sub-pixel exposed by the second opening includes a plurality of first defining partition portions. These first defining partition portions are configured to partition at least one layer of the light-emitting functional layer of the first sub-pixel. Adjacent first defining partition portions are located on either side of a corner of the first sub-pixel. The minimum distance between adjacent first defining partition portions in the first direction is a first distance, and the minimum distance between adjacent first defining partition portions in the second direction is a second distance. The portion of the first partition structure surrounding the light-emitting area of ​​the second sub-pixel exposed by the second opening includes a plurality of second defining partition portions. These second defining partition portions are configured to partition at least one layer of the light-emitting functional layer of the second sub-pixel. Adjacent second defining partition portions are located on either side of the corner of the second sub-pixel. The minimum distance between adjacent second defining partition portions in the first direction is a third distance, and the minimum distance between adjacent second defining partition portions in the second direction is a fourth distance. In either the first direction or the second direction, the corners of adjacent first and second sub-pixels are positioned opposite each other, and either the first distance or the third distance is greater than the second distance or the fourth distance.

9. The display panel according to claim 3, wherein, The plurality of sub-pixels are arranged in a first direction and a second direction as a plurality of sub-pixel rows and a plurality of sub-pixel columns. The plurality of sub-pixel rows are arranged along the second direction and each of the sub-pixel rows extends along the first direction. The plurality of sub-pixel columns are arranged along the first direction and each of the sub-pixel columns extends along the second direction. The center line connecting the light-emitting areas of adjacent sub-pixels in the sub-pixel row is spaced apart from the defined partition portion in the first partition structure.

10. The display panel according to claim 9, wherein, The center line connecting the light-emitting areas of adjacent sub-pixels in the sub-pixel column is spaced apart from the partition portion defined in the first partition structure.

11. The display panel according to claim 3, wherein, An edge located between adjacent corners in the light-emitting area of ​​one of the adjacent sub-pixels is disposed opposite to and spaced from an edge located between adjacent corners in the light-emitting area of ​​the other adjacent sub-pixel, and at least one of the first partition structures is located in the gap.

12. The display panel according to claim 11, wherein the first side of the light-emitting area of ​​the first sub-pixel located between adjacent corners has a first length in its extending direction, and the second side of the light-emitting area of ​​the second sub-pixel located between adjacent corners has a second length in its extending direction, wherein the first length is greater than the second length. The plurality of defined partitions include a first defined partition surrounding the first side and a second defined partition surrounding the second side, wherein the length of the first defined partition in its extending direction is greater than the length of the second defined partition in its extending direction.

13. The display panel according to claim 3, wherein, The edge of the first isolation portion of the first partition structure away from the light-emitting area of ​​the first sub-pixel has a fifth distance from the light-emitting area of ​​the first sub-pixel. The first isolation portion of the first partition structure has a sixth distance between the edge of the light-emitting area of ​​the second sub-pixel and the light-emitting area of ​​the second sub-pixel, and the fifth distance is greater than the sixth distance.

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