Display substrate, manufacturing method thereof and display device

Abstract

The embodiment of the invention provides a display substrate, a manufacturing method thereof and a display device, and belongs to the technical field of display. The display substrate comprises a substrate body; the driving circuit layer is positioned on the substrate; the light-emitting structure is positioned on one side, far away from the substrate, of the driving circuit layer; the touch functional layer is positioned on one side, far away from the substrate, of the light-emitting structure; the touch function layer comprises a touch substrate, a first touch wire, a touch insulating layer and a second touch wire which are stacked in sequence in the direction away from the substrate; wherein the substrate comprises a display area, a binding area located on the periphery of the display area and a wiring area located between the display area and the binding area, the first touch wire is disconnected in the wiring area and is divided into a first part located in the display area and a second part located in the binding area, and the first part and the second part are switched through a conductive connecting wire. The conductive connecting line is located on the side, away from the substrate, of the touch insulating layer. According to the embodiment of the invention, the problem of failure of the touch function layer can be avoided.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display substrate, a method for manufacturing the same, and a display device. Background Technology

[0002] OLED (Organic Light-Emitting Diode) display devices have been listed as a promising next-generation display technology due to their advantages such as being thin, light, having a wide viewing angle, being actively emitting light, having continuously adjustable emission colors, having low cost, fast response speed, low energy consumption, low driving voltage, wide operating temperature range, simple manufacturing process, high luminous efficiency, and being flexible in display. Summary of the Invention

[0003] This application provides a display substrate and its manufacturing method, as well as a display device, which can solve the problem of touch function layer failure.

[0004] To solve the above-mentioned technical problems, this application is implemented as follows:

[0005] A display substrate includes: a substrate; a driving circuit layer on the substrate; a light-emitting structure on the side of the driving circuit layer away from the substrate; a touch function layer on the side of the light-emitting structure away from the substrate; and the touch function layer includes a touch substrate, a first touch trace, a touch insulating layer, and a second touch trace stacked sequentially in a direction away from the substrate.

[0006] The substrate includes a display area, a bonding area surrounding the display area, and a wiring area between the display area and the bonding area. The first touch wiring is disconnected in the wiring area and is divided into a first part located in the display area and a second part located in the bonding area. The first part and the second part are connected by a conductive connection line, which is located on the side of the touch insulating layer away from the substrate.

[0007] In some embodiments, the orthographic projection of the first touch trace on the substrate does not overlap with the trace area.

[0008] In some embodiments, the conductive connection line is disposed in the same layer and made of the same material as the second touch trace.

[0009] In some embodiments, an inorganic insulating layer is disposed on the side of the touch functional layer near the substrate, the boundary of the inorganic insulating layer is located in the wiring area, and the boundary of the inorganic insulating layer is formed with an undercut structure.

[0010] In some embodiments, the light-emitting structure includes at least two light-emitting units stacked together, with the inorganic insulating layer located between adjacent light-emitting units.

[0011] In some embodiments, the display substrate further includes:

[0012] A planarization layer is located in the wiring area, between the touch function layer and the inorganic insulating layer, and the planarization layer covers the undercut structure.

[0013] In some embodiments, the planarization layer is formed after the pixel boundary layer or black matrix of the display area extends to the trace area.

[0014] This application also provides a display device, including the display substrate described above.

[0015] This application embodiment also provides a method for manufacturing a display substrate, the display substrate comprising: a substrate; a driving circuit layer on the substrate; a light-emitting structure located on the side of the driving circuit layer away from the substrate; a touch function layer located on the side of the light-emitting structure away from the substrate; the touch function layer comprising, along a direction away from the substrate, a touch substrate, a first touch trace, a touch insulating layer, and a second touch trace stacked sequentially; the substrate comprising a display area, a bonding area surrounding the display area, and a trace area between the display area and the bonding area; the manufacturing method comprising:

[0016] A disconnected first touch trace is formed in the trace area, dividing the first touch trace into a first part located in the display area and a second part located in the bonding area. The first part and the second part are connected by a conductive connection line located on the side of the touch insulating layer away from the substrate.

[0017] In some embodiments, an inorganic insulating layer is disposed on the side of the touch functional layer near the substrate, the boundary of the inorganic insulating layer is located in the wiring area, and the boundary of the inorganic insulating layer forms an undercut structure. The fabrication method further includes:

[0018] A planarization layer is formed in the wiring area, the planarization layer is located between the touch function layer and the inorganic insulating layer, and the planarization layer covers the undercut structure.

[0019] In this embodiment, the first touch trace is disconnected in the trace area and divided into a first part located in the display area and a second part located in the bonding area. In this way, even if there is etching residue in the trace area, the different first touch traces will not be short-circuited, thereby avoiding the failure of the touch function layer. Attached Figure Description

[0020] Figure 1 This is a plan view of the display substrate according to an embodiment of this application;

[0021] Figure 2 This is a schematic cross-sectional view of the display substrate along the AA direction;

[0022] Figure 3 This is a schematic diagram of the wiring area on the display substrate;

[0023] Figure 4 This is a schematic cross-sectional view of the display substrate in the AA direction according to an embodiment of this application;

[0024] Figure 5 and Figure 6 This is a schematic diagram of the wiring area of ​​the display substrate in an embodiment of this application.

[0025] Figure Labels

[0026] 01 Substrate; 02 Planarization layer; 03 Inorganic insulating layer;

[0027] 04 Touch substrate; 05 First touch trace; 06 Touch insulation layer;

[0028] 07 Second touch trace; 08 Planarization layer; 09 Conductive connection line;

[0029] 10 Adapter hole; 051 Part 1; 052 Part 2. Detailed Implementation

[0030] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0031] Unless otherwise defined, the technical or scientific terms used in this application shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms "a" or "one," and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms "connected" or "linked," and similar terms, are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right," etc., are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship also changes accordingly.

[0032] It should be noted that, in the embodiments of the present invention, "same layer" can refer to film layers located on the same structural layer. Alternatively, for example, film layers located on the same layer can be layer structures formed by using the same film deposition process to form a specific pattern, and then patterning the film layer using the same photomask through a single patterning process. Depending on the specific pattern, the single patterning process may include multiple exposure, development, or etching processes, and the specific pattern in the formed layer structure can be continuous or discontinuous. These specific patterns may also be at different heights or have different thicknesses.

[0033] In OLED display technology, the tandem structure is a solution that vertically stacks multiple independent OLED light-emitting units. It is popular with manufacturers and consumers due to its advantages such as long lifespan, high brightness, and low power consumption. The tandem structure can significantly improve the performance and lifespan of OLED devices. Under the same current, multiple light-emitting layers working simultaneously can achieve a total brightness several times that of a single-layer structure; at the same time, less current is required to achieve the same brightness, resulting in higher efficiency and energy savings. The lifespan of OLED materials is closely related to brightness and current density. Because the tandem structure can achieve high brightness with a smaller current, it greatly reduces the workload of each light-emitting layer, resulting in a multiplied extension of the overall device lifespan.

[0034] The tandem structure vertically stacks at least two OLED light-emitting units. During the evaporation process, issues with the fine metal mask (FMM) can exacerbate crosstalk, affecting the low-grayscale display performance of the tandem structure. To reduce crosstalk, an inorganic insulating layer, such as a silicon nitride layer, is added between adjacent light-emitting units to block the light-emitting layers of adjacent units. Figure 1 As shown, the display substrate includes a display area S1, a wiring area S2, and a bonding area S3; Figure 2As shown, a substrate 01, a planarization layer 02, an inorganic insulating layer 03, a touch substrate 04, a first touch trace 05, a touch insulating layer 06, and a second touch trace 07 are disposed in the wiring area S2. The touch substrate 04, the first touch trace 05, the touch insulating layer 06, and the second touch trace 07 constitute the touch functional layer. The boundary of the inorganic insulating layer 03 is located in the wiring area S2. When etching the inorganic insulating layer 03, it is easy to etch the planarization layer 02 underneath, resulting in… Figure 2 The dashed box A shows an undercut structure. Later, during the fabrication of the first touch trace 05, a touch substrate 04 was formed on the undercut structure, followed by a conductive layer. This conductive layer was then etched to form the first touch trace 05. Because the touch substrate 04 is relatively thin, it cannot fill the film layer difference at the undercut structure. This makes it easy to cause problems during the etching of the conductive layer. Figure 2 Etching residue is present at location B within the dashed box shown; as Figure 3 As shown, the etching residue within the dashed box will form overlapping traces between the first touch traces 05, causing adjacent first touch traces 05 to connect together. Since the etching residue will be continuous at the boundary of the inorganic insulating layer 03, multiple first touch traces 05 will be short-circuited, resulting in the failure of the touch function layer.

[0035] This application provides a display substrate and its manufacturing method, as well as a display device, which can solve the problem of touch function layer failure.

[0036] This application provides a display substrate, including: a substrate; a driving circuit layer on the substrate; a light-emitting structure on the side of the driving circuit layer away from the substrate; a touch function layer on the side of the light-emitting structure away from the substrate; and the touch function layer includes a touch substrate, a first touch trace, a touch insulating layer, and a second touch trace stacked sequentially along the direction away from the substrate.

[0037] The substrate includes a display area, a bonding area surrounding the display area, and a wiring area between the display area and the bonding area. The first touch wiring is disconnected in the wiring area and is divided into a first part located in the display area and a second part located in the bonding area. The first part and the second part are connected by a conductive connection line, which is located on the side of the touch insulating layer away from the substrate.

[0038] In this embodiment, the first touch trace is disconnected in the trace area and divided into a first part located in the display area and a second part located in the bonding area. In this way, even if there is etching residue in the trace area, the different first touch traces will not be short-circuited, thereby avoiding the failure of the touch function layer.

[0039] In this embodiment, the first touch trace is disconnected in the trace area, meaning the first touch trace is discontinuous in the trace area. A portion of the first touch trace can be retained in the trace area, or the first touch trace can be completely removed from the trace area. The orthographic projection of the first touch trace on the substrate does not overlap with the trace area. Thus, even if etching residue appears on the first touch trace in the trace area, it will not cause short circuits between different first touch traces, thereby preventing the touch function layer from failing.

[0040] In the embodiments of this application, such as Figure 1 As shown, the display substrate includes a display area S1, a wiring area S2, and a bonding area S3. The display substrate includes a light-emitting structure and a touch functional layer disposed on a substrate 01. The touch functional layer includes a touch substrate 04, a first touch wiring 05, a touch insulating layer 06, and a second touch wiring 07. The first touch wiring 05 can be one of a touch sensing electrode and a touch emitting electrode, and the second touch wiring 07 can be the other of a touch sensing electrode and a touch emitting electrode. The first touch wiring 05 extends from the display area S1 through the wiring area S2 to the bonding area S3, where it is bonded to a flexible printed circuit board (FPC).

[0041] In this embodiment, the display substrate can adopt a tandem structure, that is, the light-emitting structure includes multiple light-emitting units stacked vertically together. In this way, multiple light-emitting layers work simultaneously under the same current, which can improve the brightness of the display substrate. At the same time, to achieve the target brightness, the required current is smaller, which can achieve high brightness with a smaller current, thereby greatly reducing the workload of each light-emitting layer and extending the overall life of the device by several times.

[0042] To reduce crosstalk between adjacent light-emitting units, an inorganic insulating layer 03 is provided between them in this embodiment. The inorganic insulating layer 03 can block the light-emitting layer of adjacent light-emitting units. Specifically, the inorganic insulating layer 03 can be made of silicon nitride, which has good density and can effectively block the light-emitting layer of adjacent light-emitting units. The boundary of the inorganic insulating layer 03 is located in the wiring area S2. When etching the inorganic insulating layer 03, it is easy to etch the underlying planarization layer 02, leading to... Figure 4 The dotted box indicates an undercut structure. Later, during the fabrication of the first touch trace 05, a touch substrate 04 was formed on the undercut structure, followed by a conductive layer. The conductive layer was then etched to form the first touch trace 05. However, the touch substrate 04 is relatively thin and cannot fill the film layer gap at the undercut structure. This makes it easy to cause problems during the etching of the conductive layer. Figure 2 Etching residue is present at location B within the dashed box shown.

[0043] like Figures 4-6 As shown, in this embodiment of the application, a substrate 01, a planarization layer 02, an inorganic insulating layer 03, a touch substrate 04, a touch insulating layer 06, and a second touch trace 07 are provided in the wiring area S2. That is, the first touch trace 05 is not provided in the wiring area S2. Thus, even if... Figure 5 As shown, there is etching residue in the routing area S2. Since no first touch trace 05 is set in the routing area S2, the etching residue will not cause the adjacent first touch trace 05 to short-circuit, and thus will not cause the touch function layer to fail.

[0044] Since the first touch trace 05 needs to be bonded to the flexible circuit board in the bonding area S3, this embodiment requires the fabrication of a conductive connection line 09 in the trace area S2. The first part 051 of the first touch trace 05 in the display area and the second part 052 of the first touch trace 05 in the bonding area are connected by the conductive connection line 09 located in the trace area. In order to avoid etching residue when fabricating the conductive connection line 09, the conductive connection line 09 needs to be fabricated on a flat surface. Therefore, the conductive connection line 09 can be fabricated on the side of the touch insulating layer 06 away from the substrate. In this way, at least the touch substrate 04 and the touch insulating layer 06 are also covered on the undercut structure at the boundary of the inorganic insulating layer 03. The two film layers can fill the undercut structure at the boundary of the inorganic insulating layer 03, which can provide a flat surface for fabricating the conductive connection line 09 and avoid etching residue when fabricating the conductive connection line 09.

[0045] In this embodiment, as Figure 6 As shown, in the display area, the first part 051 of the first touch trace 05 can be connected to the conductive connection line 09 through the adapter hole 10 penetrating the touch insulating layer 06; in the bonding area, the second part 052 of the first touch trace 05 can be connected to the conductive connection line 09 through the adapter hole 10 penetrating the touch insulating layer 06, and the connection between the first part 051 and the second part 052 is realized through the conductive connection line 09.

[0046] In this embodiment of the application, in order to simplify the fabrication process and structure of the display substrate, the conductive connection line 09 can be fabricated using the same material used to fabricate the second touch trace. The conductive connection line 09 and the second touch trace 07 are set in the same layer and with the same material. In this way, the conductive connection line 09 and the second touch trace 07 can be fabricated simultaneously using the same patterning process, without the need for additional fabrication processes and equipment to fabricate the conductive connection line 09, which can reduce the fabrication cost of the display substrate.

[0047] In the embodiments of this application, such as Figure 4As shown, a planarization layer 08 can also be provided in the trace area S2. The planarization layer 08 is located between the touch function layer and the inorganic insulating layer 03. The planarization layer 08 covers the undercut structure shown in the dashed box, filling the film layer step difference that appears at the undercut structure. This provides a flat surface for the fabrication of subsequent film layers, such as the first touch trace and conductive connection line, avoiding etching residue during the fabrication of subsequent film layers. To ensure that the planarization layer 08 can fill the film layer step difference that appears at the undercut structure, the thickness of the planarization layer 08 can be greater than 1 micrometer.

[0048] In this embodiment, a new film layer can be added to the display substrate as a planarization layer, or the film layer in the display area can be used to form the planarization layer. In related technologies, the pixel defining layer is only provided in the display area and not in the wiring area. In this embodiment, the pixel defining layer in the display area can be extended to the wiring area as a planarization layer; or, the black matrix in the display area can be extended to the wiring area as a planarization layer. This eliminates the need for additional film layer fabrication, simplifies the display substrate fabrication process, and reduces the manufacturing cost of the display substrate.

[0049] This application also provides a display device, including the display substrate described above.

[0050] The display device includes, but is not limited to, components such as: a radio frequency unit, a network module, an audio output unit, an input unit, a sensor, a display unit, a user input unit, an interface unit, a memory, a processor, and a power supply. Those skilled in the art will understand that the above-described structure of the display device does not constitute a limitation on the display device; the display device may include more or fewer of the aforementioned components, or combine certain components, or arrange different components. In embodiments of the present invention, the display device includes, but is not limited to, a monitor, a mobile phone, a tablet computer, a television set, a wearable electronic device, a navigation display device, etc.

[0051] The display device can be any product or component with display function, such as a television, monitor, digital photo frame, mobile phone, or tablet computer. The display device also includes a flexible circuit board, a printed circuit board, and a backplate.

[0052] This application embodiment also provides a method for manufacturing a display substrate, the display substrate comprising: a substrate; a driving circuit layer on the substrate; a light-emitting structure located on the side of the driving circuit layer away from the substrate; a touch function layer located on the side of the light-emitting structure away from the substrate; the touch function layer comprising, along a direction away from the substrate, a touch substrate, a first touch trace, a touch insulating layer, and a second touch trace stacked sequentially; the substrate comprising a display area, a bonding area surrounding the display area, and a trace area between the display area and the bonding area; the manufacturing method comprising:

[0053] A disconnected first touch trace is formed in the trace area, dividing the first touch trace into a first part located in the display area and a second part located in the bonding area. The first part and the second part are connected by a conductive connection line located on the side of the touch insulating layer away from the substrate.

[0054] In this embodiment, the first touch trace is disconnected in the trace area and divided into a first part located in the display area and a second part located in the bonding area. In this way, even if there is etching residue in the trace area, the different first touch traces will not be short-circuited, thereby avoiding the failure of the touch function layer.

[0055] In this embodiment, the first touch trace is disconnected in the trace area, meaning the first touch trace is discontinuous in the trace area. A portion of the first touch trace can be retained in the trace area, or the first touch trace can be completely removed from the trace area. The orthographic projection of the first touch trace on the substrate does not overlap with the trace area. Thus, even if etching residue appears on the first touch trace in the trace area, it will not cause short circuits between different first touch traces, thereby preventing the touch function layer from failing.

[0056] In the embodiments of this application, such as Figure 1 As shown, the display substrate includes a display area S1, a wiring area S2, and a bonding area S3. The display substrate includes a light-emitting structure and a touch functional layer disposed on a substrate 01. The touch functional layer includes a touch substrate 04, a first touch wiring 05, a touch insulating layer 06, and a second touch wiring 07. The first touch wiring 05 can be one of a touch sensing electrode and a touch emitting electrode, and the second touch wiring 07 can be the other of a touch sensing electrode and a touch emitting electrode. The first touch wiring 05 extends from the display area S1 through the wiring area S2 to the bonding area S3, where it is bonded to a flexible printed circuit board (FPC).

[0057] In this embodiment of the application, when preparing the first touch trace 05, a portion of the first touch trace 05 located in the trace area is removed, or the first touch trace 05 in the trace area is completely removed, that is, the first touch trace 05 is not provided in the trace area S2. This way, even if... Figure 5 As shown, when the first touch trace 05 is fabricated, there is etching residue in the trace area S2. Since the first touch trace 05 is not set in the trace area S2, the etching residue will not cause the adjacent first touch trace 05 to short-circuit, and thus will not cause the touch function layer to fail.

[0058] Since the first touch trace 05 needs to be bonded to the flexible circuit board in the bonding area S3, this embodiment requires the fabrication of a conductive connection line 09 in the trace area S2. The first part 051 of the first touch trace 05 in the display area and the second part 052 of the first touch trace 05 in the bonding area are connected by the conductive connection line 09 located in the trace area. In order to avoid etching residue when fabricating the conductive connection line 09, the conductive connection line 09 needs to be fabricated on a flat surface. Therefore, the conductive connection line 09 can be fabricated on the side of the touch insulating layer 06 away from the substrate. In this way, at least the touch substrate 04 and the touch insulating layer 06 are also covered on the undercut structure at the boundary of the inorganic insulating layer 03. The two film layers can fill the undercut structure at the boundary of the inorganic insulating layer 03, which can provide a flat surface for fabricating the conductive connection line 09 and avoid etching residue when fabricating the conductive connection line 09.

[0059] In this embodiment of the application, in order to simplify the fabrication process and structure of the display substrate, the conductive connection line 09 and the second touch trace 07 can be fabricated simultaneously using the same patterning process. This eliminates the need for additional fabrication processes and equipment to fabricate the conductive connection line 09, thereby reducing the fabrication cost of the display substrate.

[0060] In some embodiments, such as Figure 4 As shown, the manufacturing method further includes:

[0061] A planarization layer 08 is formed in the trace area. The planarization layer 08 is located between the touch function layer and the inorganic insulating layer 03. The planarization layer 08 covers the undercut structure shown in the dashed box and fills the film layer step difference that appears at the undercut structure. This provides a flat surface for the preparation of subsequent film layers, such as the first touch trace and conductive connection line, and avoids etching residue when preparing subsequent film layers.

[0062] In this embodiment, a new film layer can be added to the display substrate as a planarization layer, or a planarization layer can be formed using the film layer in the display area.

[0063] In some embodiments, when fabricating the pixel defining layer of the display substrate, a pixel defining layer located in the wiring area can be retained in addition to the pixel defining layer in the display area, and the pixel defining layer extending to the wiring area can be used as a planarization layer; or, when a black matrix is ​​provided on the display substrate, a black matrix located in the wiring area can be retained in addition to the black matrix in the display area, and the black matrix extending to the wiring area can be used as a planarization layer. This eliminates the need for additional film layers, simplifying the fabrication process of the display substrate and reducing its fabrication cost.

[0064] It should be noted that the various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, since the embodiments are basically similar to the product embodiments, the descriptions are relatively simple, and the relevant parts can be referred to the descriptions of the product embodiments.

[0065] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0066] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A display substrate, characterized in that, include: Substrate; The driving circuit layer is located on the substrate. The light-emitting structure located on the side of the driving circuit layer away from the substrate; A touch function layer located on the side of the light-emitting structure away from the substrate; Along a direction away from the substrate, the touch functional layer includes a touch substrate, a first touch trace, a touch insulating layer, and a second touch trace stacked sequentially. The substrate includes a display area, a bonding area surrounding the display area, and a wiring area between the display area and the bonding area. The first touch wiring is disconnected in the wiring area and is divided into a first part located in the display area and a second part located in the bonding area. The first part and the second part are connected by a conductive connection line, which is located on the side of the touch insulating layer away from the substrate.

2. The display substrate according to claim 1, characterized in that, The orthographic projection of the first touch trace on the substrate does not overlap with the trace area.

3. The display substrate according to claim 1, characterized in that, The conductive connection line is made of the same layer and material as the second touch trace.

4. The display substrate according to any one of claims 1-3, characterized in that, An inorganic insulating layer is provided on the side of the touch function layer near the substrate. The boundary of the inorganic insulating layer is located in the wiring area, and the boundary of the inorganic insulating layer has an undercut structure.

5. The display substrate according to claim 4, characterized in that, The light-emitting structure includes at least two light-emitting units stacked together, and the inorganic insulating layer is located between adjacent light-emitting units.

6. The display substrate according to claim 4, characterized in that, The display substrate further includes: A planarization layer is located in the wiring area, between the touch function layer and the inorganic insulating layer, and the planarization layer covers the undercut structure.

7. The display substrate according to claim 6, characterized in that, The planarization layer is formed after the pixel boundary layer or black matrix of the display area extends to the wiring area.

8. A display device, characterized in that, Includes the display substrate as described in any one of claims 1-7.

9. A method for manufacturing a display substrate, characterized in that, The display substrate includes: a substrate; a driving circuit layer on the substrate; a light-emitting structure located on the side of the driving circuit layer away from the substrate; a touch function layer located on the side of the light-emitting structure away from the substrate; the touch function layer includes, along a direction away from the substrate, a touch substrate, a first touch trace, a touch insulating layer, and a second touch trace stacked sequentially; the substrate includes a display area, a bonding area surrounding the display area, and a trace area between the display area and the bonding area; the manufacturing method includes: A disconnected first touch trace is formed in the trace area, dividing the first touch trace into a first part located in the display area and a second part located in the bonding area. The first part and the second part are connected by a conductive connection line located on the side of the touch insulating layer away from the substrate.

10. The method for manufacturing a display substrate according to claim 9, characterized in that, An inorganic insulating layer is disposed on the side of the touch functional layer near the substrate. The boundary of the inorganic insulating layer is located in the wiring area, and the boundary of the inorganic insulating layer forms an undercut structure. The fabrication method further includes: A planarization layer is formed in the wiring area, the planarization layer is located between the touch function layer and the inorganic insulating layer, and the planarization layer covers the undercut structure.

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