Display panel, preparation method and display device

Abstract

The invention provides a display panel, a preparation method and a display device. The display panel comprises a substrate, an isolation structure, a plurality of light emitting devices, a filling layer and a packaging layer. The isolation structure is located on the substrate and encloses a plurality of first openings, and at least part of the light-emitting device is exposed out of the first openings. The packaging layer is located on the side, away from the substrate, of the light-emitting devices and comprises a plurality of packaging units arranged corresponding to the light-emitting devices, each packaging unit comprises a shielding part, the shielding parts are located on the side, away from the substrate, of the isolation structure, and the shielding parts and the isolation structure are arranged at intervals. The filling layer is located on the side, away from the substrate, of the isolation structure, the filling layer makes contact with the isolation structure and is spaced from the shielding part, and the orthographic projection of the filling layer on the substrate is located in the orthographic projection of the packaging unit on the substrate. According to the invention, water vapor is prevented from permeating into the light-emitting device by retaining part of the filling layer.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display panel, its manufacturing method, and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) are organic thin-film electroluminescent devices. They have attracted great attention and are widely used in electronic display products due to their advantages such as low power consumption, high brightness, wide viewing angle, high contrast, and the ability to realize flexible displays.

[0003] However, current electronic display products are limited by their structural design, and their performance needs further improvement. Summary of the Invention

[0004] The purpose of this invention is to provide a display panel, a method for manufacturing the panel, and a display device to solve the problems mentioned above.

[0005] To achieve the above objectives, this application adopts the following technical solution:

[0006] A display panel includes a substrate, an isolation structure, a plurality of light-emitting devices, a filling layer, and an encapsulation layer. The isolation structure is located on the substrate and forms a plurality of first openings. The light-emitting devices are located on the substrate, with at least a portion of each light-emitting device exposed through one of the first openings. The encapsulation layer is located on the side of the light-emitting devices facing away from the substrate. The encapsulation layer includes a plurality of encapsulation units, each corresponding to a light-emitting device. Each encapsulation unit covers the light-emitting device and extends to the side of the isolation structure facing away from the substrate. Each encapsulation unit includes a shielding portion located on the side of the isolation structure facing away from the substrate and spaced apart from the isolation structure. The filling layer is located on the side of the isolation structure facing away from the substrate, contacting the isolation structure and spaced apart from the shielding portion. The orthographic projection of the filling layer onto the substrate lies within the orthographic projection of the encapsulation unit onto the substrate.

[0007] Further, the light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode. The first electrode is disposed on one side of the substrate. The light-emitting functional layer is disposed on the side of the first electrode facing away from the substrate. The second electrode is disposed on the side of the light-emitting functional layer facing away from the substrate and overlaps with the isolation structure. Preferably, the material of the filling layer is the same as the material of the light-emitting functional layer. Preferably, the filling layer and the light-emitting functional layer are disposed in the same layer.

[0008] Furthermore, the encapsulation unit further includes a main body portion that extends from the surface of the light-emitting device away from the substrate, covers the sidewall of the first opening, and connects to the shielding portion. Preferably, a first gap exists between two adjacent encapsulation units. Preferably, the filling layer includes a plurality of filling portions that surround the corresponding light-emitting device, and the first gap is located between two adjacent filling portions.

[0009] Further, the light-emitting device includes a first light-emitting device, a second light-emitting device, and a third light-emitting device that emit light of different colors, wherein the materials of the light-emitting functional layers in the first light-emitting device, the second light-emitting device, and the third light-emitting device are at least partially different. Preferably, the filling portion includes a first filling portion, a second filling portion, and a third filling portion. The first filling portion is disposed around the first light-emitting device, and the material of the first filling portion is the same as the material of the light-emitting functional layer in the first light-emitting device. The second filling portion is disposed around the second light-emitting device, and the material of the second filling portion is the same as the material of the light-emitting functional layer in the second light-emitting device. The third filling portion is disposed around the third light-emitting device, and the material of the third filling portion is the same as the material of the light-emitting functional layer in the third light-emitting device.

[0010] Furthermore, the display panel further includes a pixel defining layer disposed on one side of the substrate and enclosing a plurality of second openings, the second openings communicating with corresponding first openings. A portion of the first electrode is located between the pixel defining layer and the substrate, and another portion is exposed through a corresponding second opening. Preferably, the orthographic projection of the filling layer on the substrate lies within the orthographic projection of the pixel defining layer on the substrate.

[0011] Further, the isolation structure includes a partition portion and a crown portion. The partition portion is disposed on one side of the substrate. The crown portion is disposed on the side of the partition portion opposite to the substrate, and the filling portion is located on the side of the crown portion opposite to the substrate. Preferably, the materials of the partition portion and the crown portion include a metallic material. Preferably, a second gap is formed between the blocking portion and the crown portion, and the filling layer is located in the second gap.

[0012] Further, the orthographic projection of the partition portion on the substrate lies within the orthographic projection of the crown portion on the substrate. The edge of the orthographic projection of the second electrode on the substrate lies within the orthographic projection of the partition portion on the substrate. Preferably, the crown portion protrudes from the partition portion on the side facing the first opening. Preferably, the second electrode extends from the surface of the light-emitting functional layer away from the substrate to the surface of the partition portion facing the first opening.

[0013] This invention also provides a method for manufacturing a display panel, the method comprising: providing a substrate; forming an isolation functional film layer on one side of the substrate, performing a patterning process on the isolation functional film layer to form an isolation structure, the isolation structure enclosing a plurality of first openings; forming a light-emitting device on one side of the substrate, and forming a filling layer on the side of the isolation structure opposite to the substrate, at least a portion of the light-emitting device being located in a corresponding first opening; forming an encapsulation layer on the side of the light-emitting device and the filling layer opposite to the substrate; forming a photolithography layer on the encapsulation layer, and developing to retain corresponding areas. The photolithography layer in the image is removed; the encapsulation layer outside the corresponding area is removed to form a partial encapsulation unit, the encapsulation unit including a shielding portion located on the side of the isolation structure away from the substrate, the filling layer being disposed in contact with the isolation structure and spaced apart from the shielding portion, the orthographic projection of the filling layer on the substrate being located within the orthographic projection of the encapsulation unit on the substrate; the light-emitting device, the filling layer and the remaining photolithography layer outside the corresponding area are removed; the above steps are repeated to form the light-emitting device, the filling layer and the encapsulation unit at the position corresponding to the first opening where the light-emitting device is not formed.

[0014] Further, the step of forming a light-emitting device on one side of the substrate includes: forming a light-emitting functional layer on one side of the substrate; forming a second electrode on the side of the light-emitting functional layer opposite to the substrate; preferably, the materials of the light-emitting functional layer, the filling layer, and the photolithography layer include organic materials; preferably, the material of the photolithography layer includes photoresist; preferably, the material of the filling layer is the same as the material of the light-emitting functional layer; preferably, the filling layer and the light-emitting functional layer are formed by the same fabrication process.

[0015] Further, the step of removing the light-emitting device, the filling layer, and the residual photolithography layer outside the corresponding area includes: removing the second electrode outside the corresponding area and the second electrode located between the shielding portion and the filling layer using wet etching, forming a second gap between the shielding portion and the filling layer; removing the light-emitting functional layer, the filling layer, and the residual photolithography layer outside the corresponding area using dry etching, and forming a partial filling portion; preferably, removing the light-emitting functional layer, the filling layer, and the residual photolithography layer outside the corresponding area using oxygen dry etching; preferably, removing the light-emitting functional layer, the filling layer, and the residual photolithography layer outside the corresponding area using a combination of oxygen dry etching and ashing; preferably, the step of removing the light-emitting device, the filling layer, and the residual photolithography layer outside the corresponding area further includes removing the byproducts of oxygen dry etching by washing with pure water.

[0016] Furthermore, in the step of repeating the above steps to form the light-emitting device, the filling layer, and the encapsulation unit at the position corresponding to the first opening where the light-emitting device is not formed: the materials of the light-emitting functional layers formed in two adjacent cycle processes are at least partially different; preferably, in the same cycle process, the material of the filling portion is the same as the material of the light-emitting functional layer.

[0017] Further, the step of removing the encapsulation layer outside the corresponding area and forming a partial encapsulation unit includes: removing the encapsulation layer outside the corresponding area by dry etching, and forming an encapsulation unit in the corresponding area that covers the light-emitting device and extends to the side of the isolation structure away from the substrate; preferably, after removing the encapsulation layer outside the corresponding area by dry etching, a portion of the photolithography layer is removed by an ashing process; preferably, the encapsulation layer is dry etched using carbon tetrafluoride gas.

[0018] Furthermore, the method for manufacturing the display panel further includes: forming a pixel defining layer on one side of the substrate, and forming a plurality of second openings in the pixel defining layer after forming the first opening, wherein the second openings are connected to the corresponding first openings.

[0019] Further, the step of forming an isolation functional film layer on one side of the substrate includes: forming a first functional layer on the side of the pixel defining layer opposite to the substrate; forming a second functional layer on the side of the first functional layer opposite to the substrate; and performing a patterning process on the isolation functional film layer includes: patterning the first functional layer and the second functional layer by an etching process, and forming an isolation portion and a crown portion respectively, wherein the isolation portion and the crown portion together enclose the first opening.

[0020] The present invention also provides a display device, which includes a display panel as described above.

[0021] The advantage of this invention is that by retaining a partial filler layer between the packaging unit and the isolation structure, the suspension height between the packaging unit and the isolation structure is reduced, preventing moisture in subsequent wet processes from penetrating into the light-emitting device through the gap between the packaging unit and the isolation structure, thus preventing the failure of the first light-emitting device. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1This is a schematic diagram of the structure of a display panel according to an embodiment of this application.

[0024] Figure 1a for Figure 1 A schematic diagram of the cross-sectional structure of a light-emitting device.

[0025] Figure 2 This is a schematic diagram of a planarization layer disposed on a substrate according to an embodiment of this application.

[0026] Figure 3 This is a schematic diagram of a first electrode disposed on a planarization layer according to an embodiment of this application.

[0027] Figure 4 In order to be in Figure 3 A schematic diagram showing the formation of a pixel boundary layer.

[0028] Figure 5 In order to be in Figure 4 A schematic diagram showing the isolation structure formed above.

[0029] Figure 6 In order to be in Figure 5 A schematic diagram showing the formation of a light-emitting functional layer, a second conductive layer, and a second deposited insulating material film layer for the first sub-pixel.

[0030] Figure 7 In order to be in Figure 6 A schematic diagram of the photoresist forming the first sub-pixel region.

[0031] Figure 8 In order to be in Figure 7 This is a schematic diagram of the second deposited insulating material film layer in the first sub-pixel region based on the etching method.

[0032] Figure 9 In order to be in Figure 8 A schematic diagram of removing the cathode based on the above.

[0033] Figure 10 In order to be in Figure 9 A schematic diagram showing the removal of the light-emitting functional layer and residual photoresist outside the first sub-pixel region.

[0034] Figure 11 for Figure 10 A magnified schematic diagram of part b in the middle. Detailed Implementation

[0035] The following description, with reference to the accompanying drawings, illustrates preferred embodiments of the present invention, demonstrating its implementability. These embodiments provide a complete overview of the invention for those skilled in the art, making its technical content clearer and easier to understand. The present invention can be embodied in many different forms of embodiments, and the scope of protection of the present invention is not limited to the embodiments mentioned herein.

[0036] In the accompanying drawings, components with the same structure are indicated by the same numerical designation, and components with similar structures or functions are indicated by similar numerical designations. The dimensions and thicknesses of each component shown in the drawings are arbitrary, and the present invention does not limit the dimensions and thicknesses of each component. To make the illustrations clearer, the thickness of components is appropriately exaggerated in some places in the drawings.

[0037] Furthermore, the following descriptions of the embodiments of the invention are made with reference to the accompanying illustrations, illustrating specific embodiments in which the invention can be implemented. Directional terms used in this invention, such as "upper," "lower," "front," "rear," "left," "right," "inner," "outer," and "side," are merely directional references to the accompanying drawings. Therefore, the use of directional terms is for better and clearer explanation and understanding of the invention, and does not indicate or imply that the referred device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0038] When a component is described as being "on" another component, the component may be placed directly on the other component; alternatively, there may be an intermediate component on which the component is placed, and the intermediate component is placed on the other component. When a component is described as being "installed to" or "connected to" another component, both can be understood as being directly "installed" or "connected" to, or as being indirectly "installed to" or "connected to" another component via an intermediate component.

[0039] In related display technologies, in order to achieve high resolution and color in OLED (Organic Light-Emitting Diode), and to better solve the problems of low resolution of OLED cathode film and low device yield, an isolation structure is introduced. The isolation structure encloses a predetermined area, and then the light-emitting device is fabricated. In the process of fabricating the light-emitting device, no metal mask is used. Instead, an organic light-emitting film is deposited on the entire surface, and a cathode is deposited on the light-emitting film (the light-emitting film and cathode cover the end of the isolation structure). Then, the light-emitting device is fabricated by etching.

[0040] The inventors discovered in actual production that, in order to avoid damage to the light-emitting film layer (organic material) during the etching process of the light-emitting device, an encapsulation layer (also known as a CVD film or protective film) is set on the cathode. When the light-emitting device is prepared, the protective film is etched (the encapsulation layer is retained at the end of the isolation structure surrounding the light-emitting device). After etching the cathode and stripping to remove the evaporated EL and photoresist (PR), the encapsulation layer will exhibit a bullhorn phenomenon (also known as a CVD bullhorn, where there is a gap between the encapsulation layer at the end of the isolation structure and the end of the isolation structure). This is equivalent to the protective film at the end of the isolation structure being suspended. In subsequent wet processes, moisture will penetrate through this gap, causing the light-emitting device to fail.

[0041] To address this issue, the applicant proposes a display panel, a method for fabricating it, and a display device. The display panel obtained by this fabrication method avoids the problem of subpixel failure.

[0042] like Figure 1 The diagram shown is a schematic representation of the structure of a display panel according to an embodiment of this application. Figure 1a for Figure 1 A schematic diagram of the cross-sectional structure of a light-emitting device.

[0043] The display panel 100 includes a display area 110 and a non-display area 120 (also called a border area) located outside the display area 110.

[0044] The display area 110 includes regularly arranged light-emitting units, each of which includes multiple light-emitting devices capable of emitting different colors of light. In this embodiment, the light-emitting devices include a first light-emitting device, a second light-emitting device, and a third light-emitting device emitting different colors of light. These devices are fabricated by vapor deposition on the entire substrate combined with etching. In practice, the width of each light-emitting device and / or the gap between adjacent light-emitting devices can be further reduced, thereby increasing the pixel density to greater than 400 PPI (e.g., 403 PPI, where Pixels Per Inch is also called pixel density unit). This overcomes the current limitation of difficulty in further increasing pixel density in OLED display panels and avoids the problems of poor product quality and high mask usage costs caused by repeated mask stretching and fixing, mask sagging in the middle, etc., in mask-based solutions.

[0045] In the non-display area of ​​the display panel, a binding area (not shown) is set up. This binding area is used to mount binding components in subsequent processes.

[0046] The display panel includes a substrate 130, a display functional layer, and an isolation structure. The composition and fabrication of the isolation structure 40 mentioned below are detailed in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, and PCT / CN2024 / 099072. Further descriptions are provided in CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A for reference.

[0047] A driving layer is disposed on the substrate, covering the display area and the non-display area. The driving layer includes multiple pixel driving circuits located in the display area, and a display function layer is located on this driving circuit layer. For example, the pixel driving circuit may include multiple transistors (TFTs), capacitors, etc., configured as a 7T1C circuit, 7T2C circuit, 8T1C circuit, 8T2C circuit, etc., without limitation, as long as it drives the light-emitting device. The pixel driving circuit is connected to the light-emitting device to control the switching state and brightness of the light-emitting device. The substrate may be a flexible substrate, and its material may be selected from polyimide (PI), polyethylene naphthalate (PEN), or polyethylene terephthalate (PET), or a mixture of these materials. The substrate may also be a rigid substrate formed from materials such as glass.

[0048] The isolation structure includes a partition portion 161 located on a substrate 130. A crown portion 162 is provided on the side of the partition portion 161 away from the substrate 130. The partition portion 161 and the crown portion 162 together enclose a plurality of first openings 171, and at least a portion of the light-emitting device is located in the corresponding first opening 171. The materials of the partition portion 161 and the crown portion 162 include metals. Preferably, the material of the partition portion 161 is aluminum, and the material of the crown portion 162 is titanium. The second electrode 180 of the light-emitting device is electrically connected to the partition portion 161. The overall structure of the partition portion is mesh-like, and the first opening is the mesh opening.

[0049] The display functional layer includes multiple light-emitting devices. Each light-emitting device includes a first electrode 141, a light-emitting functional layer (170a / 170b / 170c, e.g., light-emitting functional layer 170a emits red light, light-emitting functional layer 170b emits green light, and light-emitting functional layer 170c emits blue light), and a second electrode 180 stacked on a substrate 130. The first electrode can be an anode, and the second electrode can be a cathode. The light-emitting functional layer includes at least one or more of the following layers: a hole injection layer, a hole transport layer, an electron blocking layer, a light-emitting layer, a hole blocking layer, an electron transport layer, and an electron injection layer. In this embodiment, a planarization layer 140 is stacked on the substrate 130, and the first electrode 141 is stacked on the planarization layer 140. In some embodiments of this disclosure, some film layers in the light-emitting functional layer, such as the light-emitting layer, can be prepared using non-evaporation methods, such as inkjet printing. The specific method can be selected based on the material of these film layers. For example, if these film layers are made of polymer materials and evaporation is not applicable, inkjet printing can be used to prepare them.

[0050] The display panel includes a pixel defining layer 151 located between an isolation structure (e.g., a partition 161) and the layer containing the first electrode 141, to cover the gap between adjacent first electrodes 141. The pixel defining layer defines a second opening 151a, which is covered by a light-emitting functional layer. The second opening 151a corresponds to and communicates with the first opening 171.

[0051] The display panel also includes an encapsulation layer 190, which has multiple encapsulation units. Each light-emitting device has a corresponding encapsulation unit. The encapsulation unit covers the light-emitting device and extends to the side of the isolation structure away from the substrate. Each encapsulation unit includes a main body and a shielding portion 191. The main body extends from the surface of the light-emitting device away from the substrate and covers the sidewall of the first opening 171. The shielding portion 191 is located on the side of the isolation structure away from the substrate, and the main body is connected to the shielding portion 191. A second gap a is formed between the shielding portion 191 and the surface 191 of the crown 162 away from the substrate. The lower side of the shielding portion 191 has a filling layer 170a1 / 170b1 / 170c1 made of the same material as the light-emitting functional layer of the matching light-emitting device. The orthographic projection of the filling layer onto the substrate is within the orthographic projection of the encapsulation unit onto the substrate. That is, the orthographic projection of the shielding portion onto the crown 162 covers the orthographic projection of the filling layer 170a1 / 170b1 / 170c1 onto the crown 162. That is, in the x-direction (first direction), the filling layer 170a1 / 170b1 / 170c1 does not protrude beyond the shielding portion 191. Preferably, in the first direction, the length of the shielding portion 191 is less than half of the crown portion 162, resulting in a first gap between two adjacent packaging units. Preferably, in the first direction, the shielding portion 191 does not contact the crown portion 162. Preferably, in the y-direction, the filling layer...

[0052] The plane where the end faces of 170a1 / 170b1 / 170c1 are located coincides with or is parallel to the plane where the end face of the shielding portion 191 is located. Through this structural design, during the wet process, moisture entering the second gap a below the shielding portion 191 is blocked by the filling layer 170a1 / 170b1 / 170c1 (partially covering the interface between the surface of the crown 162 facing away from the substrate and the encapsulation layer), preventing moisture penetration into the light-emitting device and thus preventing device failure. It should be noted that while the light-emitting devices emitting different light are fabricated independently, the film layers in each light-emitting device are deposited on the entire display panel during vapor deposition. For example, during the fabrication process, light-emitting devices R / G / B are fabricated sequentially (in other embodiments, light-emitting devices B / R / G or G / B / R may be fabricated sequentially).

[0053] The following is combined Figures 2 to 10 right Figure 1a The fabrication process of the light-emitting device in the display panel shown is described.

[0054] The following describes a method for manufacturing a display panel according to embodiments of this application. Taking a pixel unit comprising three light-emitting devices capable of emitting different colors of light—namely, a first light-emitting device, a second light-emitting device, and a third light-emitting device—that emit red, green, and blue light respectively, as an example, the order of the first, second, and third light-emitting devices is not limited in other embodiments. In other embodiments, each pixel unit may include four light-emitting devices: a first light-emitting device, a second light-emitting device, and a third light-emitting device for emitting red, green, and blue light respectively, and a fourth light-emitting device for emitting white light.

[0055] The preparation method includes the following steps:

[0056] A planarization layer is deposited on the substrate, such as Figure 2 As shown, the planarization layer 140 is stacked on the substrate 130, covering the display area for emitting light and the border area surrounding the display area. The substrate can be a flexible substrate (such as a flexible substrate) or a rigid substrate (such as glass).

[0057] A first conductive layer is formed on the planarization layer, and a first electrode is formed by patterning. For example... Figure 3 As shown, this step includes depositing a first conductive layer on the side of the planarization layer 140 away from the substrate 130 by means of deposition, sputtering, or evaporation, and then etching to obtain a first electrode 141. The first electrode covers the display area and is an anode.

[0058] A pixel defining layer is formed on one side of the substrate. See also Figure 4In this step, an insulating material, such as at least one of organic and inorganic materials, is deposited on the side of the planarization layer 140 facing away from the substrate on the side of the first electrode 141 to form a pixel defining layer 151. This pixel defining layer 151 covers the display area for light emission and the border area surrounding the display area, and its thickness is between 100 nm and 1000 nm (the thickness in the display area and the border area can be different or the same), for example, the thickness of the pixel defining layer can be 200 nm, 500 nm, or 800 nm. In the border area, the pixel defining layer can serve as a protective layer.

[0059] An isolation functional film layer is formed on one side of the substrate. A patterning process is performed on the isolation functional film layer to form an isolation structure, which encloses multiple first openings. Specifically, this step includes: depositing a metal material on the side of the pixel defining layer facing away from the substrate to form a first functional layer; depositing a metal material on the side of the first functional layer facing away from the substrate to form a second functional layer; and patterning the first and second functional layers using an etching process to form an isolation portion 161 and a crown portion 162, respectively. The isolation structure formed in this step is as follows: Figure 5 As shown, the partition portion 161 and the crown portion 162 together form a plurality of first openings 171.

[0060] After forming multiple first openings 171, multiple second openings 151a are formed in the pixel defining layer 151. This step includes: patterning the pixel defining layer 151 by a dry etching process, forming second openings 151a in the pixel defining layer 151 that communicate with the first openings 171, causing the planar shape of the pixel defining layer 151 to be grid-like, and exposing the first electrode 141 through the second openings 151a.

[0061] A first light-emitting device is formed on one side of a substrate, and a filling layer is formed on the side of the isolation structure facing away from the substrate. This step includes: depositing a light-emitting functional layer 170a of the first light-emitting device onto the entire surface of the substrate; simultaneously depositing the light-emitting functional layer 170a of the first light-emitting device onto the surface of the crown 162 facing away from the substrate, i.e., the filling layer and the light-emitting functional layer 170a are formed in the same deposition process, so the filling layer and the light-emitting functional layer 170a in the first light-emitting device are disposed in the same layer and are made of the same material; and depositing a conductive material onto the entire surface of the light-emitting functional layer 170a and the filling layer facing away from the substrate to form a second electrode. The deposited light-emitting functional layer, the filling layer, and the second electrode are located in the first opening and the second opening, and at the end of the partition portion away from the first electrode.

[0062] An encapsulation layer is formed on the side of the first light-emitting device facing away from the substrate. This step includes depositing an insulating material (e.g., by vapor deposition) on the side of the second electrode facing away from the substrate to form the encapsulation layer. The resulting panel structure is as follows: Figure 6 As shown.

[0063] A photolithography layer is formed in the encapsulation layer, and the photolithography layer in the corresponding area is retained after development. This step includes: Figure 7 As shown, an organic material, such as photoresist, is coated onto the encapsulation layer, and the photoresist in the first light-emitting device region is retained by development to form a photolithography layer 200. This step involves coating the encapsulation layer with liquid photoresist, which can then be retained in the first light-emitting device region by photolithography.

[0064] The encapsulation layer outside the corresponding area is removed to form a partial encapsulation unit. This step includes: patterning the encapsulation layer using dry etching, and removing the encapsulation layer outside the first light-emitting device region (i.e., located in the second and third light-emitting device regions), forming an encapsulation unit covering the first light-emitting device and extending to the side of the isolation structure away from the substrate. During etching, a portion of the photolithography layer in the first light-emitting device region is removed (i.e., a portion of the photolithography layer remains within the second opening of the first light-emitting device region after etching). The structure formed by this step is as follows: Figure 8 As shown, the encapsulation layer of the first light-emitting device region includes a continuous main body portion 192 and a shielding portion 191 located within a second opening, and a portion of the photolithography layer 200 remains within the second opening. In one embodiment, dry etching can be performed using carbon tetrafluoride (CF4) gas. In another embodiment, after removing the encapsulation layer outside the first light-emitting device region by dry etching, a portion of the photolithography layer 200 can be removed by an ashing process.

[0065] Remove the light-emitting device, filler layer, and residual photolithography layer outside the corresponding area. This step includes: Figure 9 As shown, the second electrode outside the first light-emitting device region (i.e., located in the second and third light-emitting device regions) and the second electrode located between the shielding portion 191 and the filling layer are removed by wet etching, forming a second gap between the shielding portion 191 and the filling layer; as shown Figure 10 and Figure 11 As shown, the light-emitting functional layer, filling layer, and residual photolithography layer outside the first light-emitting device region (i.e., located in the second and third light-emitting device regions) are removed by oxygen (O2) dry etching. The remaining portion of the filling layer forms the first filling portion 170a1. Due to the anisotropy of dry etching, the filling layer below the shielding portion 191 is preserved by oxygen dry etching, forming the first filling portion 170a1. This reduces the suspension height of the second gap a below the shielding portion 191. The first filling portion 170a1 covers the interface between the surface of the crown portion 162 facing away from the substrate and the main body portion 192 and the shielding portion 191, thus preventing moisture from penetrating into the first light-emitting device during subsequent wet processing and preventing the first light-emitting device from failing.

[0066] In one embodiment, after removing the light-emitting functional layer and residual photolithography layer outside the first light-emitting device region by etching, the process further includes cleaning, which is performed by washing with pure water to remove etching byproducts.

[0067] The above process is repeated to form a light-emitting device, a filling layer, and an encapsulation unit at the first opening where no light-emitting device is formed. That is, the second and third light-emitting devices are prepared using the same or similar processes as those used to prepare the first light-emitting device, the first filling portion 170a1, and the corresponding encapsulation unit. The only difference is that the materials used for the light-emitting functional layers formed in adjacent cycles are at least partially different. Specifically, the materials used for the light-emitting functional layers in the first, second, and third light-emitting devices are at least partially different, thereby enabling the first, second, and third light-emitting devices to emit light of different colors. The specific steps are as follows:

[0068] The light-emitting functional layer of the second light-emitting device, the second electrode, and the encapsulation layer are deposited on the entire surface of the substrate by vapor deposition. Simultaneously with the vapor deposition of the light-emitting functional layer of the second light-emitting device, a filler layer is vapor deposited on the surface of the crown facing away from the substrate. That is, the filler layer and the light-emitting functional layer of the second light-emitting device are formed in the same vapor deposition process. Therefore, the filler layer and the light-emitting functional layer in the second light-emitting device are disposed in the same layer and are made of the same material.

[0069] A photolithography layer is formed on the encapsulation layer, and the photolithography layer in the region of the second light-emitting device is retained after development.

[0070] The encapsulation layer in the second light-emitting device region is patterned to obtain a continuous main body portion located in the second light-emitting device region with a first opening and a blocking portion located above the crown portion.

[0071] The second electrode outside the second light-emitting device area and the second electrode located between the shielding part and the filling layer are removed by wet etching, forming a second gap between the shielding part and the filling layer.

[0072] The light-emitting functional layer, filling layer, and residual photolithography layer outside the second light-emitting device area are removed by etching. In this step, the portion of the filling layer located below the shielding portion is retained (reducing the overhang height of the second gap below the shielding portion), forming a second filling portion 170b1. This second filling portion 170b1 covers the junction between the surface of the crown facing away from the substrate and the main body and the shielding portion, thus preventing moisture from penetrating into the second light-emitting device during subsequent wet processing and preventing the second light-emitting device from failing.

[0073] The light-emitting functional layer of the third light-emitting device, the second electrode, and the encapsulation layer are deposited on the entire surface of the substrate by vapor deposition. At the same time as the light-emitting functional layer of the third light-emitting device is vapor deposited on the surface of the crown facing away from the substrate, that is, the filler layer and the light-emitting functional layer of the third light-emitting device are formed in the same vapor deposition process. Therefore, the filler layer and the light-emitting functional layer in the third light-emitting device are disposed in the same layer and are made of the same material.

[0074] A photolithography layer is formed on the encapsulation layer, and the photolithography layer in the region of the third light-emitting device is retained after development.

[0075] The encapsulation layer in the third light-emitting device region is patterned to obtain a continuous main body portion with a first opening in the second light-emitting device region and a blocking portion above the crown portion.

[0076] The second electrode outside the third light-emitting device area and the second electrode located between the shielding part and the filling layer are removed by wet etching, forming a second gap between the shielding part and the filling layer.

[0077] The light-emitting functional layer, filling layer, and residual photolithography layer outside the third light-emitting device area are removed by etching. In this step, the portion of the filling layer located below the shielding portion is retained (reducing the overhang height of the second gap a below the shielding portion), forming the third filling portion 170c1. The third filling portion 170c1 covers the junction between the surface of the crown portion away from the substrate and the main body portion and the shielding portion. This prevents moisture from penetrating into the third light-emitting device during subsequent wet processing, thus preventing the third light-emitting device from failing.

[0078] It should be noted that after patterning the encapsulation layer of the second light-emitting device region using etching, the corresponding light-emitting functional layer of the second light-emitting device is protected by the encapsulation layer above it, remaining unetched or only partially etched, covering the interface between the partition and the encapsulation layer. This prevents direct moisture intrusion and ensures the second light-emitting device does not fail. Similarly, after patterning the encapsulation layer of the third light-emitting device region using etching, the corresponding light-emitting functional layer of the third light-emitting device is protected by the encapsulation layer above it, remaining unetched or only partially etched, covering the interface between the partition and the encapsulation layer. This prevents direct moisture intrusion and ensures the third light-emitting device does not fail. The removal of the light-emitting functional layer, filler layer, and residual photolithography layer using oxygen dry etching is protected from damage by the upper encapsulation layer, thus protecting the corresponding light-emitting device.

[0079] In one embodiment, after the light-emitting device is fabricated, a polarizing layer is stacked on the display functional layer. The structure of the polarizing layer can be an existing structure.

[0080] In one embodiment, a touch layer is further stacked on the polarizing layer. The touch layer may employ an existing structure.

[0081] It should be noted that the display panel can also include other functional structures. For example, the display panel can also include a touch structure to provide touch functionality. For example, the touch structure can be a touch panel or a touch layer. The touch panel can be bonded into the display panel, or the touch layer can be directly fabricated on the encapsulation layer of the display panel, which is beneficial for the thinner and lighter design of the display panel.

[0082] Other embodiments of this application provide a display device including the display panel described in the above embodiments. The pixel density of this display device ranges from 400 PPI to 7000 PPI, making it suitable for scenarios such as televisions and laptops, and also suitable for use in micro-display products (such as AR and VR). Furthermore, this display device can be any product or component with display functionality, such as a television, digital camera, mobile phone, watch, tablet computer, laptop computer, navigator, or console.

[0083] Although this application has been described in conjunction with specific embodiments thereof, many substitutions, modifications and variations of these embodiments will be apparent to those skilled in the art from the foregoing description.

[0084] It should be noted that the above description describes some embodiments of this application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in a different order than that shown in the above embodiments and still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0085] The embodiments of this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.

Claims

1. A display panel, characterized in that, include: substrate; An isolation structure is located on the substrate and encloses a plurality of first openings; Multiple light-emitting devices are located on the substrate, and at least a portion of the light-emitting devices are exposed through the first opening; An encapsulation layer is located on the side of the light-emitting device away from the substrate. The encapsulation layer includes multiple encapsulation units, each of which is corresponding to a light-emitting device. Each encapsulation unit covers the light-emitting device and extends to the side of the isolation structure away from the substrate. Each encapsulation unit includes a shielding portion, which is located on the side of the isolation structure away from the substrate and is spaced apart from the isolation structure. A filler layer is located on the side of the isolation structure opposite to the substrate. The filler layer is disposed in contact with the isolation structure and spaced apart from the shielding portion. The orthographic projection of the filler layer on the substrate is located within the orthographic projection of the packaging unit on the substrate.

2. The display panel as described in claim 1, characterized in that, The light-emitting device includes: The first electrode is disposed on one side of the substrate. A light-emitting functional layer is disposed on the side of the first electrode opposite to the substrate. The second electrode is disposed on the side of the light-emitting functional layer away from the substrate and overlaps with the isolation structure; Preferably, the material of the filling layer is the same as the material of the light-emitting functional layer; Preferably, the filling layer and the light-emitting functional layer are disposed in the same layer.

3. The display panel as described in claim 1, characterized in that, The packaging unit further includes a main body portion, which extends from the surface of the light-emitting device away from the substrate, covers the sidewall of the first opening, and is connected to the shielding portion; Preferably, there is a first gap between two adjacent packaging units; Preferably, the filling layer includes a plurality of filling portions, the filling portions being disposed around the corresponding light-emitting device, and the first gap being located between two adjacent filling portions.

4. The display panel as described in claim 3, characterized in that, The light-emitting device includes a first light-emitting device, a second light-emitting device, and a third light-emitting device that emit light of different colors, wherein the materials of the light-emitting functional layers in the first light-emitting device, the second light-emitting device, and the third light-emitting device are at least partially different; Preferably, the filling portion includes: A first filling portion is disposed around the first light-emitting device, and the material of the first filling portion is the same as the material of the light-emitting functional layer in the first light-emitting device; The second filling portion is disposed around the second light-emitting device, and the material of the second filling portion is the same as the material of the light-emitting functional layer in the second light-emitting device; A third filling portion is disposed around the third light-emitting device, and the material of the third filling portion is the same as the material of the light-emitting functional layer in the third light-emitting device.

5. The display panel as described in claim 2, characterized in that, Also includes: A pixel defining layer is disposed on one side of the substrate and encloses a plurality of second openings, wherein the second openings communicate with the corresponding first openings; A portion of the first electrode is located between the pixel defining layer and the substrate, and another portion is exposed from the corresponding second opening; Preferably, the orthographic projection of the filling layer on the substrate lies within the orthographic projection of the pixel defining layer on the substrate.

6. The display panel as described in claim 2, characterized in that, The isolation structure includes: A partition portion is provided on one side of the substrate; The crown portion is located on the side of the partition portion away from the substrate, and the filling portion is located on the side of the crown portion away from the substrate; Preferably, the materials of the partition and the crown include metallic materials; Preferably, a second gap exists between the shielding portion and the crown portion, and the filling layer is located in the second gap.

7. The display panel as described in claim 6, characterized in that, The orthographic projection of the partition portion on the substrate is located within the orthographic projection of the crown portion on the substrate; The edge of the orthographic projection of the second electrode on the substrate is located within the orthographic projection of the partition portion on the substrate; Preferably, the crown protrudes from the partition portion on the side facing the first opening; Preferably, the second electrode extends from the surface of the light-emitting functional layer away from the substrate to the surface of the partition portion facing the first opening.

8. A method for manufacturing a display panel, characterized in that, include: Provide substrate; An isolation functional film layer is formed on one side of the substrate, and a patterning process is performed on the isolation functional film layer to form an isolation structure, wherein the isolation structure encloses and forms a plurality of first openings; A light-emitting device is formed on one side of the substrate, and a filling layer is formed on the side of the isolation structure opposite to the substrate, wherein at least a portion of the light-emitting device is located in the corresponding first opening; An encapsulation layer is formed on the side of the light-emitting device and the filling layer that is away from the substrate; A photolithography layer is formed on the encapsulation layer, and the photolithography layer in the corresponding area is retained after development. The encapsulation layer outside the corresponding area is removed to form a partial encapsulation unit. The encapsulation unit includes a shielding portion located on the side of the isolation structure away from the substrate. The filling layer is disposed in contact with the isolation structure and spaced apart from the shielding portion. The orthographic projection of the filling layer on the substrate is located within the orthographic projection of the encapsulation unit on the substrate. Remove the light-emitting device, the filling layer, and the remaining photolithography layer outside the corresponding area; Repeat the above steps to form the light-emitting device, the filling layer, and the encapsulation unit at the location corresponding to the first opening where the light-emitting device is not formed.

9. The method for manufacturing a display panel as described in claim 8, characterized in that, The step of forming a light-emitting device on one side of the substrate includes: A light-emitting functional layer is formed on one side of the substrate; A second electrode is formed on the side of the light-emitting functional layer opposite to the substrate; Preferably, the materials of the light-emitting functional layer, the filling layer, and the photolithography layer include organic materials; Preferably, the material of the photolithography layer includes photoresist; Preferably, the material of the filling layer is the same as the material of the light-emitting functional layer; Preferably, the filling layer and the light-emitting functional layer are formed by the same preparation process.

10. The method for manufacturing a display panel as described in claim 9, characterized in that, The step of removing the light-emitting device, the filling layer, and the remaining photolithography layer outside the corresponding area includes: The second electrode outside the corresponding area and the second electrode located between the shielding portion and the filling layer are removed by wet etching, forming a second gap between the shielding portion and the filling layer; The light-emitting functional layer, the filling layer, and the residual photolithography layer outside the corresponding area are removed by dry etching, and a partial filling portion is formed. Preferably, the light-emitting functional layer, the filling layer, and the residual photolithography layer outside the corresponding area are removed by oxygen dry etching. Preferably, the light-emitting functional layer, the filling layer, and the residual photolithography layer outside the corresponding area are removed by a combination of oxygen dry etching and ashing. Preferably, the step of removing the light-emitting device, the filling layer and the residual photolithography layer outside the corresponding area further includes removing the byproducts of oxygen dry etching by washing with pure water.

11. The method for manufacturing a display panel as described in claim 10, characterized in that, In repeating the above steps to form the light-emitting device, the filling layer, and the encapsulation unit at the location corresponding to the first opening where the light-emitting device is not formed: The materials of the light-emitting functional layers formed in two adjacent cycle processes are at least partially different; Preferably, in the same cycle process, the material of the filling portion is the same as the material of the light-emitting functional layer.

12. The method for manufacturing a display panel as described in claim 8, characterized in that, The step of removing the encapsulation layer outside the corresponding area and forming a partial encapsulation unit includes: The encapsulation layer outside the corresponding area is removed by dry etching, and an encapsulation unit is formed in the corresponding area, covering the light-emitting device and extending to the side of the isolation structure away from the substrate. Preferably, after removing the encapsulation layer outside the corresponding area using dry etching, a portion of the photolithography layer is removed by an ashing process; Preferably, the encapsulation layer is dry etched using carbon tetrafluoride gas.

13. The method for manufacturing a display panel as described in claim 8, characterized in that, Also includes: A pixel defining layer is formed on one side of the substrate, and after the first opening is formed, a plurality of second openings are formed in the pixel defining layer, the second openings communicating with the corresponding first openings.

14. The method for manufacturing a display panel as described in claim 8, characterized in that, The step of forming an isolation functional film layer on one side of the substrate includes: A first functional layer is formed on the side of the pixel defining layer opposite to the substrate; A second functional layer is formed on the side of the first functional layer that is away from the substrate; The steps of patterning the insulating functional membrane layer include: The first functional layer and the second functional layer are patterned by etching process, and an isolation portion and a crown portion are formed respectively. The isolation portion and the crown portion together enclose the first opening.

15. A display device, characterized in that, Includes the display panel as described in any one of claims 1-7.

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