Display device and method for manufacturing display device

Abstract

A display device (100) according to the present disclosure includes: a thin film substrate (FS); a light-emitting element layer (ED) which is located on an upper layer of the thin film substrate (FS) and includes a plurality of light-emitting elements; an inorganic sealing film (K1) that covers the light-emitting element layer (ED); a plurality of pairs of banks (B1, B2) which are positioned between the outer periphery of the inorganic sealing film (K1) and the outer periphery of the thin film substrate (FS) in a plan view, and which face each other with a gap therebetween; and a filler (FM) that is positioned between at least one of the plurality of pairs of banks (B1, B2) in plan view and that contracts or expands due to curing.

Description

Technical Field

[0001] This disclosure relates to a display device and a method for manufacturing the display device. Background Technology

[0002] Patent document 1 discloses the following configuration: an organic EL element is formed on a substrate obtained by laminating a stress-relieving sheet sandwiched between a gas barrier film and a heat-resistant film.

[0003] Existing technical documents Patent documents Patent Document 1: Japanese Patent Application Publication No. 2015-88246 Invention Summary The technical problem to be solved by the present invention The requirement is to reduce the warping of the display device.

[0004] Solution to the problem The display device disclosed herein includes: a thin film substrate; a light-emitting element layer located above the thin film substrate and comprising a plurality of light-emitting elements; an inorganic sealing film covering the light-emitting element layer; a plurality of pairs of dikes located, in plan view, between the outer periphery of the inorganic sealing film and the outer periphery of the thin film substrate, and opposed to each other in a spaced-apart manner; and a filler material located, in plan view, between at least one pair of dikes, and shrinking or expanding due to curing.

[0005] The method for manufacturing a display device disclosed herein includes: a step of forming or fixing a thin film substrate on a layer above a rigid substrate; a step of forming a light-emitting element layer on a layer above the thin film substrate, the light-emitting element layer comprising a plurality of light-emitting elements; a step of forming a plurality of pairs of dikes on a layer above the thin film substrate, the plurality of pairs of dikes being opposed to each other in a spaced-apart manner; a step of forming an inorganic sealing film covering the light-emitting element layer, such that the plurality of pairs of dikes are located between the outer periphery of the inorganic sealing film and the outer periphery of the thin film substrate in plan view; a step of injecting a filler material that shrinks or expands due to curing between at least one pair of dikes; a step of curing the filler material; and a step of peeling the thin film substrate off the rigid substrate.

[0006] Invention Effects According to one aspect of this disclosure, warping of the display device can be reduced. Attached Figure Description

[0007] Figure 1 This is a top view illustrating an example of the configuration of a display device according to one embodiment of the present disclosure.

[0008] Figure 2This is a cross-sectional view illustrating an example of the configuration of a display device according to one embodiment of this disclosure, equivalent to... Figure 1 AB section view.

[0009] Figure 3 This is a cross-sectional view illustrating an example of a method for manufacturing a display device according to an embodiment of the present disclosure.

[0010] Figure 4 This is a top view illustrating an example of the configuration of a display device according to one embodiment of the present disclosure.

[0011] Figure 5 This is a cross-sectional view illustrating an example of the configuration of a display device according to one embodiment of this disclosure.

[0012] Figure 6 This is a cross-sectional view illustrating an example of a method for manufacturing a display device according to an embodiment of the present disclosure.

[0013] Figure 7 This is a cross-sectional view illustrating an example of the configuration of a display device according to one embodiment of this disclosure.

[0014] Figure 8 This is a cross-sectional view illustrating another example of the configuration of a display device according to one embodiment of this disclosure.

[0015] Figure 9 This is a top view illustrating an example of the configuration of a display device according to one embodiment of the present disclosure.

[0016] Figure 10 This is a partial top view illustrating another example of the configuration of a display device according to one embodiment of the present disclosure. Detailed Implementation

[0017] [Implementation Method 1] Figure 1 This is a top view illustrating an example of the configuration of a display device according to one embodiment of the present disclosure. Figure 2 This is a cross-sectional view illustrating an example of the configuration of a display device according to one embodiment of this disclosure, equivalent to... Figure 1 AB sectional view. To aid in understanding the invention, the fill material FM is shaded in the top view. (See diagram below.) Figure 1 as well as Figure 2As shown, the display device 100 disclosed herein includes: a thin film substrate FS; a light-emitting element layer ED located on the upper layer of the thin film substrate FS and including a plurality of light-emitting elements; an inorganic sealing film K1 covering the light-emitting element layer ED; a plurality of pairs of dikes B1, B2 located between the outer periphery of the inorganic sealing film K1 and the outer periphery of the thin film substrate FS and facing each other at a distance from each other in plan view; and a filling material FM located between at least one pair of dikes B1, B2 among the plurality of dikes B1, B2, which shrinks or expands due to curing in plan view.

[0018] According to the above configuration, due to the shrinkage or expansion of the filler material FM, stress is generated that attempts to reduce or increase the distance between at least one pair of dikes B1, B2 in which the filler material FM is disposed. By controlling (combining) the positions of the dikes B1, B2 filled with the filler material FM, the amount of filler material FM at each position, and the amount of shrinkage or expansion of the filler material FM, local stress adjustment can be performed, thereby reducing the warpage of the thin film substrate FS. In this disclosure, "top view" means viewing from the thickness direction (z direction in the figure) of the thin film substrate FS.

[0019] The filler material FM may contain a curing shrinkage resin. The curing shrinkage resin may be, for example, an acrylic resin, an epoxy resin, or a silicone resin. The shrinkage rate of the filler material FM may be less than 20%, more than 5% but less than 15%, or more than 9% but less than 12%.

[0020] Due to the shrinkage of the filler material FM, stresses are generated that attempt to reduce the distance between the dikes B1 and B2 corresponding to the filler material FM. That is, stresses that attempt to cause the thin film substrate FS to convexly bend downwards (from the filler material FM towards the thin film substrate FS) in the direction traversing the corresponding dikes B1 and B2. This stress counteracts the stress that attempts to cause the thin film substrate FS to convexly bend upwards (from the thin film substrate FS towards the filler material FM) in the transverse direction, thereby reducing the bending of the thin film substrate FS in the transverse direction.

[0021] Furthermore, the stress generated by the filling material FM can also reduce the bending of the thin film substrate FS in the direction that is approximately parallel to the corresponding dikes B1 and B2 by bending the thin film substrate FS in the direction that crosses the corresponding dikes B1 and B2.

[0022] The filler material FM can be differentiated based on the expected warpage of the thin film substrate FS. Compared to acrylic resins, epoxy resins tend to have a smaller shrinkage rate. Therefore, for example, acrylic resin can be injected between dikes B1 and B2 where a larger shrinkage stress is expected to reduce the bending of the thin film substrate FS, while epoxy resin can be injected between dikes B1 and B2 where a smaller shrinkage stress is expected.

[0023] Furthermore / or, the injection amount of filler material FM can be adjusted according to the expected warpage of the thin film substrate FS. The more filler material FM injected, the greater the stress generated by the filler material FM. Furthermore / or, the number of injection sites of filler material FM can be adjusted according to the expected warpage of the thin film substrate FS. The more injection sites of filler material FM within a certain location range, the greater the sum of stress generated by the filler material FM within that location range.

[0024] When the filler material FM is curing and expanding, due to the expansion, stress will be generated that attempts to cause the thin film substrate FS to bend upward in a convex direction in the direction that crosses the corresponding dikes B1 and B2.

[0025] Each pair of dikes B1 and B2 can be composed of a first dike B1 extending substantially parallel to the nearest edge of the outer periphery of the thin film substrate FS, and a second dike B2 located between the first dike B1 and the nearest edge and extending substantially parallel to the nearest edge. The second dike B2 can be located directly opposite the corresponding first dike B1.

[0026] The display device 100 may include an organic sealing film K2 located above the inorganic sealing film K1, and an inorganic sealing film K3 covering the organic sealing film K2. The display device 100 may include a thin-film sealing layer TFE comprising the inorganic sealing films K1 and K3 and the organic sealing film K2. The thin-film sealing layer TFE can reduce the intrusion of oxygen and water into the light-emitting element layer ED, thereby mitigating the degradation of the light-emitting element layer ED. Multiple pairs of embankments B1 and B2 may be located between the outer periphery of the thin-film sealing layer TFE and the outer periphery of the thin-film substrate FS in top view. The filler material FM may be made of the same material as the organic sealing film K2.

[0027] The display device 100 may include a barrier DB for blocking the organic sealing film K2. The barrier DB may be made of the same material as the multiple pairs of barriers B1, B2. The barrier DB overlaps with the inorganic sealing films K1, K3 in a top view and is positioned to surround the light-emitting element layer ED.

[0028] The display device 100 may further include a backplane BP located between the thin film substrate FS and the light-emitting element layer ED. The backplane BP may include a barrier layer, wiring, a semiconductor layer, an interlayer insulating film, and a planarization film. The backplane BP may include circuit elements, including pixel circuitry for controlling the light-emitting elements contained in the light-emitting element layer ED. The light-emitting elements contained in the light-emitting element layer ED may be organic light-emitting diodes (OLEDs) or quantum dot light-emitting diodes (QLEDs).

[0029] (Manufacturing method) Figure 3This is a cross-sectional view illustrating an example of a method for manufacturing a display device according to an embodiment of this disclosure. (See diagram below.) Figure 3 As shown, first, a rigid substrate RP is prepared (step S10), a thin film substrate FS is formed or fixed on the upper layer of the rigid substrate RP (step S20), and a backplate BP is formed on the thin film substrate FS (step S30).

[0030] Next, on the backplane BP, a light-emitting element layer ED containing multiple light-emitting elements is formed on the upper layer of the thin film substrate FS (step S40), and a barrier dam DB is formed to surround the light-emitting element layer ED (step S50). Part or all of the barrier dam DB may be made of the same material as the constituent elements of the light-emitting element layer ED, and may be formed simultaneously with the constituent elements of the light-emitting element layer ED.

[0031] Then, on a layer above the thin film substrate FS, multiple pairs of dikes B1 and B2 are formed, spaced apart from each other (step S60). Each pair of dikes B1 and B2 may be partially or entirely made of the same material as the constituent elements of the light-emitting element layer ED, and may be formed simultaneously with the constituent elements of the light-emitting element layer ED. Part or all of step S60 may be performed simultaneously with step S40, and / or simultaneously with step S50.

[0032] Then, a thin-film sealing layer TFE is formed (step S70). In step S70, firstly, an inorganic sealing film K1 covering the light-emitting element layer ED is formed (step S72), an organic sealing film K2 is formed on the inorganic sealing film K1 (step S74), and an inorganic sealing film K3 covering the organic sealing film K2 is formed (step S76). In step S72, the inorganic sealing film K1 is formed such that multiple pairs of embankments B1 and B2 are located between the outer periphery of the inorganic sealing film K1 and the outer periphery of the thin-film substrate FS when viewed from above. In other words, in step S60, multiple pairs of embankments B1 and B2 can be formed between a predetermined line on the outer periphery of the inorganic sealing film K1 and the outer periphery of the thin-film substrate FS.

[0033] Next, a filler material FM, which shrinks or expands due to curing, is injected between at least one pair of dikes B1, B2 (step S80), allowing the filler material FM to cure (step S82). After curing, a protective film PF is adhered to the upper layer of the thin film sealing layer TFE (step S90), and the thin film substrate FS is peeled off from the rigid substrate RP (step S92). Part or all of the filler material FM can be made of the same material as the organic sealing film K2, and can be formed simultaneously with the organic sealing film K2. In step S80, the filler material FM can be injected (or not injected) between each pair of dikes individually, and the injection amount can be determined individually. Therefore, when it is predicted that the warpage of the thin film substrate FS will be unevenly distributed in location, the unevenness of warpage can be reduced by determining the injection amount based on this prediction.

[0034] Then, the peeled thin film substrate FS, along with the backing plate BP and the protective film PF, is separated along the dividing line DL (step S100, the so-called "dicing"). Furthermore, in step S60, multiple pairs of embankments B1 and B2 can be formed between the outer periphery of the inorganic sealing film K1 and the dividing line DL in a top view. Thus, the multiple pairs of embankments B1 and B2 can be located between the outer periphery of the inorganic sealing film K1 and the outer periphery of the separated thin film substrate FS.

[0035] (Comparative example) The display device involved in the comparative example was manufactured as follows.

[0036] First, a thin-film substrate is attached to a glass substrate, and a backplane is formed on the thin-film substrate. As the backplane, a base coating, a semiconductor layer, an interlayer insulating film, a wiring layer containing a gate electrode, an interlayer insulating film, a wiring layer containing source and drain electrodes, an interlayer insulating film, and a third wiring layer are formed, and a planarization film is further formed. Silicon nitride is used in each interlayer insulating film.

[0037] Next, a light-emitting layer and a thin-film sealing layer are formed on the backplate, and a protective film is adhered to the thin-film sealing layer. Then, a laser is irradiated onto the lower surface of the thin-film substrate to peel the thin-film substrate from the glass substrate. The peeled-off thin-film substrate and the backplate are separated together to obtain the display device according to the comparative example.

[0038] Most of the segmented display devices warped, and the rate of appearance defects was high when the warping exceeded the reference value. Warping is the height difference between the lowest and highest points of the upper surface of the display device, measured when the display device is placed on a flat surface without any external force applied.

[0039] The warping of the display device was believed to be primarily caused by stress in the interlayer insulating film. Therefore, the thickness of the interlayer insulating film was adjusted to reduce warping, and the display device was remanufactured, but the appearance defect rate remained high. Repeated adjustments and manufacturing of the interlayer insulating film were performed, but the appearance defect rate remained high.

[0040] (Example) The following is a display device 100 relating to an embodiment of the present disclosure.

[0041] Using a glass substrate as the rigid substrate RP, a backplate BP is formed on a thin film substrate FS, similar to the display device described in the comparative example. Then, a light-emitting element layer ED and multiple pairs of seams B1 and B2 are formed on the backplate BP, and a thin film sealing layer TFE is formed to cover the light-emitting element layer ED. Afterwards, approximately equal amounts of filler material FM are injected between the multiple pairs of seams B1 and B2, and a protective film PF is attached, thus separating the glass substrate and the thin film substrate FS and the laminates on the thin film substrate FS.

[0042] In the embodiments described, most of the segmented display devices also experienced warping, with a high rate of appearance defects due to warping exceeding a baseline value. Therefore, based on the warping distribution, the injection position and amount of the filler material FM were adjusted to reduce warping, and the display device was manufactured again. As a result, the appearance defect rate was reduced. Subsequently, the injection position and amount of the filler material FM were repeatedly adjusted and manufactured, further reducing the appearance defect rate.

[0043] From the initial formation of the backplate (step S30) to the separation of the thin-film substrate (step S100), it can sometimes take several days. Therefore, it is believed that the warpage state changes due to the surrounding environment during these days, making it difficult to reduce the appearance defect rate by adjusting the interlayer insulating film. In addition, since the interlayer insulating film is formed throughout the entire display device by chemical vapor deposition (CVD) or similar methods, it is difficult to partially correct local warpage. In contrast, the process from injecting the filler material FM (step S80) to separating the thin-film substrate (step S100) is mostly completed within 10 hours, so the changes in the warpage state caused by the surrounding environment are less, which is considered beneficial for reducing the appearance defect rate. Furthermore, since the filler material FM is injected separately between multiple pairs of banks B1 and B2 by inkjet printing or similar methods, local warpage can be partially corrected.

[0044] [Implementation Method 2] Figure 4 This is a top view illustrating an example of the configuration of a display device according to one embodiment of this disclosure. Figure 4As shown, dams B1 and B2 can also be staggered. A first dam B1 can be positioned opposite half of a second dam B2, and vice versa. The second dam B2 can be located diagonally opposite its corresponding first dam B1. Filler material FM can be injected between one first dam B1 and the two second dams B2. Filler material FM can comprise a first filler material FM1 and a second filler material FM2, which has a different material and / or injection amount than the first filler material FM1.

[0045] According to the configuration of this embodiment 2, the warpage of the thin film substrate FS can be reduced in the same way as the configuration of the aforementioned embodiment 1.

[0046] [Implementation Method 3] Figure 5 This is a cross-sectional view illustrating an example of the configuration of a display device according to one embodiment of this disclosure. For example... Figure 5 As shown, the display device 100 of this disclosure may have a recess RS located between at least one pair of dikes B1, B2 among a plurality of pairs of dikes B1, B2 when viewed from above. According to this configuration, the filling material FM injected into the recess RS is located between the corresponding pairs of dikes B1, B2 when viewed from above (from the z-direction in the figure). When viewing the display device 100 from above, the lengths of dikes B1, B2 and the length of the recess RS may be the same, or the length of the recess RS may be shorter than the lengths of dikes B1, B2. That is, the recess RS only needs to be formed in a portion of the area between dikes B1, B2.

[0047] By forming the recess RS in this way, the maximum volume of the filler material FM that can be injected between the dikes B1 and B2 can be increased, thereby increasing the volume of the recess RS. The larger the volume of the filler material FM, the greater the stress generated by the filler material FM. Therefore, greater stress can be generated, and the warpage of the thin film substrate FS can be further reduced. The depth of the recess RS is preferably 5 μm or more, more preferably 10 μm or more. Recess RS can be formed at all positions between multiple pairs of dikes B1 and B2.

[0048] If the display device 100 further includes a back plate BP located between the thin film substrate FS and the light-emitting element layer ED, a recess RS can be provided in the back plate BP, and the recess RS can penetrate the back plate BP. The recess RS can also be further formed in the thin film substrate FS.

[0049] (Manufacturing method) Figure 6 This is a cross-sectional view illustrating an example of a method for manufacturing a display device according to an embodiment of this disclosure. (See diagram below.) Figure 6As shown, after forming a backplate BP on the upper layer of the thin film substrate FS (step S30), a recess RS can be formed in the backplate BP between at least one pair of dikes B1, B2 (step S110). In step S70, multiple pairs of dikes B1, B2 are formed on the upper layer of the backplate BP. The recess RS can be formed simultaneously with the formation of the backplate BP (step S30). Here, the recess RS can also be formed in the thin film substrate FS without penetrating it. The process of forming the recess RS can involve forming a through hole in the backplate BP and forming a recess in the thin film substrate FS that communicates with the through hole. In the injection of the filler material FM (step S80), the filler material FM injected between a pair of dikes B1, B2 flows into the recess RS.

[0050] [Implementation Method 4] Figure 7 This is a cross-sectional view illustrating an example of the configuration of a display device according to one embodiment of this disclosure. For example... Figure 7 As shown, an inorganic bonding membrane G1 may be provided, covering at least a portion of the opposing sides C1, C2 of at least one pair of dikes B1, B2 and the region C3 located between the at least one pair of dikes B1, B2. The inorganic bonding membrane G1 can improve the bonding strength between the filler material FM and the dikes B1, B2. Preferably, the bonding strength between the filler material FM and the dikes B1, B2 is greater than the shrinkage stress exerted by the filler material FM on the opposing sides C1, C2 of the dikes B1, B2.

[0051] The inorganic bonding membrane G1 can be made of the same material as any one of the inorganic sealing membranes K1 and K3, preferably the same material as the inorganic sealing membrane K1 located below the organic sealing membrane K2. The inorganic bonding membrane G1 can be formed simultaneously with the inorganic sealing membrane K1. The inorganic bonding membrane G1 can be formed as an island in top view, corresponding to each of the multiple pairs of dikes B1 and B2.

[0052] Figure 8 This is a cross-sectional view illustrating another example of the configuration of a display device according to one embodiment of this disclosure. (See also...) Figure 8 As shown, this embodiment 4 can be combined with the aforementioned embodiment 3. The display device 100 of this disclosure has a recess RS, and the region C3 located between the embankments B1 and B2 may include the inner surface of the recess RS. An inorganic bonding film G1 covers at least a portion of the opposing side surfaces C1 and C2 of the corresponding pair of embankments B1 and B2 and the inner surface of the recess RS located between the corresponding pair of embankments B1 and B2.

[0053] In this case, the inorganic bonding membrane G1 can improve the bonding strength between the filler material FM and the embankments B1 and B2, and / or can improve the bonding strength between the filler material FM and the recess RS. The bonding strength between the filler material FM and the backing plate BP can be greater than the shrinkage stress exerted by the filler material FM on the opposing inner wall surfaces of the recess RS.

[0054] [Implementation Method 5] Figure 9 This is a top view illustrating an example of the configuration of a display device according to one embodiment of this disclosure. Figure 9 As shown, at least one pair of dikes B1 and B2, together with additional dikes B3 and B4, can form a surrounding structure BS in top view. The infill material FM should not overflow beyond the outside of the surrounding structure BS. The surrounding structure BS can be polygonal, square, or rectangular in top view.

[0055] Two or more pairs of dikes B1 and B2 can each constitute a surrounding structure BS. Multiple surrounding structures BS can exist between the outer periphery of the inorganic sealing film K1 and the outer periphery of the thin film substrate FS. At least a portion of the multiple surrounding structures can be arranged in a row.

[0056] Figure 10 This is a partial top view illustrating another example of the configuration of a display device according to one embodiment of this disclosure. (See attached image.) Figure 10 As shown, at least a portion of the multiple structures surrounding the BS can be staggered.

[0057] This embodiment 5 can be combined with the aforementioned embodiments 3 and 4. For example, at least one surrounding structure BS can surround the recess RS in a top view. For example, at least a portion of at least one opposing side of the surrounding structure BS can be covered by an inorganic bonding film G1. For example, at least one surrounding structure BS can surround the recess RS in a top view, and at least a portion of the opposing side of the surrounding structure and the inner surface of the recess RS can be covered by an inorganic bonding film G1.

[0058] This disclosure is not limited to the embodiments described above. Various modifications can be made within the scope of the claims. Embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included within the technical scope of this disclosure. Furthermore, new technical features can be formed by combining the technical means disclosed in each embodiment.

[0059] Explanation of reference numerals in the attached figures 100 display devices B1 and B2 dikes BP backplate BS surrounds the structure C1 and C2 opposite sides C3 area DL dividing line ED light-emitting element layer FM filler material FS thin film substrate G1 Inorganic Bonding Membrane K1 Inorganic Sealing Membrane RP rigid substrate RS recess.

Claims

1. A display device, characterized in that, include: Thin film substrate; A light-emitting element layer, which is located on top of the thin film substrate and contains a plurality of light-emitting elements; An inorganic sealing film covers the light-emitting element layer; Multiple pairs of dikes, which, when viewed from above, are located between the outer periphery of the inorganic sealing film and the outer periphery of the thin film substrate, and are positioned opposite each other in a spaced manner. as well as The filling material, when viewed from above, is located between at least one pair of the plurality of dikes and shrinks or expands due to curing.

2. The display device according to claim 1, characterized in that, There is a recess between at least one pair of the multiple pairs of dikes.

3. The display device according to claim 1 or 2, characterized in that, The filler material comprises a curing shrinkable resin.

4. The display device according to claim 3, characterized in that, The curing shrinkage resin is an acrylic resin, epoxy resin, or silicone resin.

5. The display device according to claim 3 or 4, characterized in that, The shrinkage rate of the filler material is 5.0% or more and 15% or less.

6. The display device according to any one of claims 1 to 5, characterized in that, Also includes: An inorganic bonding membrane covers the opposing sides of at least one of the plurality of pairs of dikes and at least a portion of the area between the at least one pair of dikes, and is made of the same material as the inorganic sealing membrane.

7. The display device according to any one of claims 1 to 6, characterized in that, At least one of the multiple pairs of dikes forms a surrounding structure when viewed from above.

8. The display device according to claim 7, characterized in that, The surrounding structure exists in multiple forms between the outer periphery of the inorganic sealing film and the outer periphery of the thin film substrate.

9. The display device according to claim 8, characterized in that, The plurality of structures are arranged in a column, with at least a portion of the structure being arranged in a column.

10. The display device according to claim 9, characterized in that, Multiple columns surrounding the structure are configured.

11. The display device according to any one of claims 8 to 10, characterized in that, The plurality of the surrounding structures are arranged in an alternating configuration, with at least a portion thereof.

12. The display device according to claim 2, characterized in that, Also includes: A backplate is located between the thin-film substrate and the light-emitting element layer. The recess extends through the back plate.

13. A method for manufacturing a display device, characterized in that, include: The process of forming or fixing a thin film substrate on top of a rigid substrate; In the process of forming a light-emitting element layer on top of the thin film substrate, the light-emitting element layer includes a plurality of light-emitting elements; In the process of forming multiple pairs of dikes on the upper layer of the thin film substrate, the multiple pairs of dikes are placed opposite each other in a spaced manner. The process of forming an inorganic sealing film covering the light-emitting element layer is such that the plurality of pairs of dams are located between the outer periphery of the inorganic sealing film and the outer periphery of the thin film substrate when viewed from above; The process of injecting a filling material that shrinks or expands due to solidification between at least one pair of the plurality of dikes; The process of curing the filler material; and The process of peeling the thin film substrate from the rigid substrate.

14. The method for manufacturing a display device according to claim 13, characterized in that, It also includes the process of slicing the thin film substrate along the dividing line. Viewed from above, the plurality of dikes are formed between the outer periphery of the inorganic sealing membrane and the dividing line.

15. The method of manufacturing a display device according to claim 13 or 14, characterized in that, Also includes: The process of forming a back sheet on the upper layer of the thin film substrate; as well as The process of forming a recess between at least one pair of the plurality of dikes in the back plate.

16. The method for manufacturing a display device according to claim 15, characterized in that, The process of forming the recess includes: forming a through hole in the back plate and forming a recess in the thin film substrate that communicates with the through hole.

Images