Anti-bending barrel plating device for axial thin guide pin type diode

By setting up a chamber partition and a star disk cathode plate in the barrel plating apparatus, the problems of easy bending and uneven electric field of fine-conducting needle diodes during barrel plating are solved, realizing stable rolling and uniform electroplating of the device, and improving the quality and consistency of electroplating.

CN122039191APending Publication Date: 2026-05-15CHANGZHOUSR SEA ELECTRONICS
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
CHANGZHOUSR SEA ELECTRONICS
Filing Date
2025-12-22
Publication Date
2026-05-15

AI Technical Summary

Technical Problem

When using existing barrel plating equipment to electroplate fine-conducting pin-shaped diodes, collisions between devices can easily occur, leading to bending and uneven electric field distribution, which affects the consistency and pass rate of the electroplated products.

Method used

An axial fine-conducting needle-type diode anti-bending barrel plating device is adopted. The space is divided into independent compartments by setting a compartment partition inside the barrel, and a star disk cathode plate is installed in the center of the compartment to provide a multi-directional electric field, avoid device collision and improve the uniformity of the electric field.

Benefits of technology

This technology enables fine-needle diodes to roll individually within a separate compartment, reducing the risk of bending, improving electroplating quality and yield, and achieving uniform plating thickness.

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Abstract

The invention discloses an anti-bending barrel plating device for an axial thin guide pin type diode. The anti-bending barrel plating device comprises a roller shell, a cabin partition plate, an astrolabe cathode plate, a penetrating rotating shaft, an end cover, a thin guide pin diode and a rotating shaft middle section. The cabin partition plates are arranged in the axial direction of the roller and divide the inner space into a plurality of independent cabins. The astrolabe cathode piece is fixed to the center position of the cabin partition plate, penetrates through the rotating shaft and the middle section of the rotating shaft to be connected with the electroplating power source and is used for forming a multi-direction uniform electric field in the cabin. The thin guide pin diodes are arranged in the independent cabins and roll at the bottoms of the cabins along with rotation of the roller, so that collision with other devices is avoided, the bending risk is reduced, and the coating consistency is improved. The device realizes combination of device isolation rolling and electric field uniform action, and is suitable for electroplating processing of high-precision fine guide pin diodes.
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Description

Technical Field

[0001] This invention relates to the field of electroplating technology for electronic components, specifically to an anti-bending barrel plating device for axial fine-conducting pin-type diodes. Background Technology

[0002] Thin-lead diodes are electronic devices with small lead diameters and long lengths. During electroplating, their mechanical strength is limited, making them highly susceptible to bending or collisions. Existing barrel plating equipment often employs a large-capacity drum structure, concentrating a large number of thin-lead diodes into the same drum cavity for rolling plating. Due to the lack of effective separation structures inside the drum, the thin-lead diodes undergo continuous tumbling, stacking, and impact during rolling. Frequent hard collisions between the device leads result in bent leads, plating damage, and even device failure, affecting the consistency and yield of electroplated products.

[0003] Furthermore, traditional barrel plating equipment typically employs a single plate or strip cathode structure. The cathode can only supply current to the device surface from a localized direction, making it difficult to form a uniform multidirectional electric field during the rolling process. This results in uneven current density distribution on the device surface, easily leading to localized areas of excessively thick or thin plating. For long, small-section fine-guide needle-like devices, this uneven plating phenomenon is particularly pronounced, severely impacting the device's performance stability.

[0004] Existing barrel plating devices typically feature either a single, unpartitioned cavity or a multi-cavity structure simply separated by a coarse mesh partition. Such structures struggle to achieve individual device isolation, resulting in multiple devices rolling together within the same area. During high-speed or long-duration barrel plating processes, the rolling posture of the fine-needle diodes is difficult to control, leading to unstable device trajectories within the cavity and consequently uneven stress distribution and fatigue bending of the needles. Therefore, designing an axial fine-needle diode anti-bending barrel plating device is essential. Summary of the Invention

[0005] The purpose of this invention is to provide an anti-bending barrel plating device for axial fine-conducting pin-type diodes to solve the problems mentioned in the background art.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution: an axial fine-needle diode anti-bending barrel plating device, comprising a barrel shell, which is a hollow cylindrical structure; a compartment partition disposed inside the barrel shell and spaced apart along its axial direction, for dividing the internal space into multiple independent compartments; a star disk cathode plate fixedly installed at the center of the compartment partition, the star disk cathode plate having a multi-pointed structure and extending into the compartment; a through-rotor shaft penetrating the barrel shell and disposed along its axis, the two ends of the through-rotor shaft passing through end caps respectively and forming a middle section of the shaft outside the end caps, for connecting an external drive mechanism and an electroplating power supply; and fine-needle diodes placed in each independent compartment, the fine-needle diodes being arranged along the axial direction of the barrel and rolling within the compartment as the barrel rotates.

[0007] According to the above technical solution, the compartment partition is a polygonal plate structure, and its peripheral edges are fixedly connected to the inner wall of the roller shell.

[0008] According to the above technical solution, the star disk cathode plate is electrically connected to an external electroplating power source through a through-rotation shaft and the middle section of the shaft, which is used to form a multi-directional uniform electric field inside the chamber.

[0009] According to the above technical solution, the cabin partition is a polygonal plate with concave edges, which is used to bring the fine needle diode closer to the center area of ​​the cabin when it rolls inside the cabin.

[0010] According to the above technical solution, the outer edge of the star disk cathode plate has an arc-shaped transition structure to improve the uniformity of the electric field distribution inside the cabin.

[0011] According to the above technical solution, the through-rotor is provided with an insulating coating near the cathode plate of the star disk to reduce the impact of the through-rotor on the electric field distribution inside the cabin.

[0012] According to the above technical solution, when the barrel plating device is working, the through shaft is driven by an external drive mechanism to rotate, so that the fine needle diodes roll along the bottom area of ​​each independent compartment.

[0013] Compared with the prior art, the beneficial effects achieved by the present invention are as follows: By setting a compartment partition arranged along the axial direction of the drum, the fine needle diode rolls independently in an independent compartment, avoiding collisions between multiple devices in the same space, thereby reducing the risk of needle bending; by setting a star disk cathode plate at the center of the compartment partition and supplying it with power from the through-rotating shaft and the middle section of the shaft, the current can enter the interior of the compartment from multiple directions, improving the uniformity of the electric field distribution inside the compartment; by driving the fine needle diode to roll stably in the bottom area of ​​the compartment through the drum shell, the device is subjected to more uniform force during the electroplating process, which is conducive to obtaining a plating thickness with better consistency and improving the electroplating quality and yield. Attached Figure Description

[0014] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the overall structure of an axial fine-conducting needle-type diode anti-bending barrel plating device proposed in this invention; Figure 2 This is a schematic diagram of the cross-sectional structure of the chamber in an axial fine-conducting needle-type diode anti-bending barrel plating device proposed in this invention; Figure 3 This is a cross-sectional view of the roller along the axial direction in an axial fine-conducting needle-type diode anti-bending barrel plating device proposed in this invention.

[0015] In the diagram: 1. Roller shell, 2. Chamber partition, 3. Star disk cathode plate, 4. Through shaft, 5. End cover, 6. Fine needle diode, 7. Middle section of shaft. Detailed Implementation

[0016] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0017] Example 1: Reference Figures 1-3 A roller plating device for preventing bending of axial fine-conducting needle diodes includes a roller shell 1, a chamber partition 2, a star disk cathode plate 3, a through shaft 4, an end cap 5, a fine-conducting needle diode 6, and a middle section of the shaft 7. The components cooperate with each other to achieve separation protection and uniform electroplating of the axial fine-conducting needle diodes.

[0018] like Figure 1 As shown, the drum outer shell 1 has a cylindrical structure, and its inner side is provided with multiple compartment partitions 2 arranged along the axial direction of the drum. The compartment partitions 2 are polygonal plates that divide the inside of the drum into several independent compartment spaces, so that the fine needle diodes 6 installed in them will not collide with each other between the compartments during the rolling process. The two side edges of the compartment partitions 2 are fixedly connected to the inner wall of the drum outer shell 1 to form a stable partition structure.

[0019] The through-shaft 4 runs through the entire drum along the axial direction of the drum shell 1, with both ends extending beyond the end caps 5. It is connected to the external drive device and the electroplating power supply through the middle section 7 of the shaft. The end caps 5 are disc-shaped structures, respectively installed at the left and right ends of the drum shell 1. They cooperate with the through-shaft 4 to form a rotatable structure, which is used to seal the internal space of the drum and support the rotation of the through-shaft 4.

[0020] like Figure 2 As shown, a star disk cathode plate 3 is fixedly installed at the center of each compartment bulkhead 2. The star disk cathode plate 3 has a multi-pointed star-shaped structure and extends radially into the compartment. During the barrel plating process, the star disk cathode plate 3 is connected to the negative terminal of the electroplating power supply and forms an electrical connection with the middle section 7 of the rotating shaft 4, enabling the star disk cathode plate 3 to provide a multi-directional electric field to the fine needle diode 6 inside the compartment. The fine needle diode 6... Figure 2 The diagram is drawn with a horizontal line, which is arranged parallel to the axis of rotation and performs low-impact rolling in the bottom area of ​​the compartment.

[0021] like Figure 3 As shown, the compartment partitions 2 are arranged at equal intervals along the axial direction inside the drum, dividing the internal space of the drum into continuous independent compartments. Each compartment is equipped with a star-disc cathode plate 3, ensuring that each compartment receives an independent and uniform electroplating environment when the drum rotates. The through-shaft 4 passes through the center of the compartment and is adjacent to but does not contact each star-disc cathode plate 3, allowing the fine needle diode 6 to roll around the periphery of the through-shaft 4 within the compartment. During the drum's rotation, the fine needle diode 6 moves only within a single compartment, avoiding the collision problem between devices in traditional large drum structures.

[0022] During the barrel plating operation, fine-pin diodes 6 are evenly fed into each chamber in batches. An external drive mechanism rotates the through-shaft 4, causing the drum shell 1 and the internal chamber partitions 2 to rotate around the shaft. The fine-pin diodes 6 form a smooth rolling trajectory along the bottom of their respective chambers. The plating power supply is delivered to the star disk cathode plate 3 via the middle section 7 of the shaft, causing the current to radiate evenly from the star disk cathode plate 3 into the chamber, thus forming a uniform current density on the outer surface of the fine-pin diodes 6. By adjusting the rotation speed, current density, and plating time, the fine-pin diodes 6 can achieve a highly consistent plating thickness and significantly reduce pin bending caused by impacts.

[0023] Through the above structural configuration, the present invention can effectively isolate the components within the chamber, avoiding mechanical collisions between the fine-needle diodes 6, while utilizing the star disk cathode plate 3 to provide a multi-directional electric field, improving the uniformity of the current density within the chamber. This embodiment can ensure that the fine-needle diodes 6 maintain a straight shape during the barrel plating process and obtain a uniform plating thickness, improving plating quality and device yield.

[0024] Example 2: Based on Embodiment 1, this embodiment provides an optional axial fine-needle diode anti-bending barrel plating device configuration. Its basic structure still includes a drum shell 1, a chamber partition 2, a star disk cathode plate 3, a through-shaft 4, an end cap 5, a fine-needle diode 6, and a middle section of the shaft 7. The installation method between the components is the same as in Embodiment 1 and will not be repeated. This embodiment further optimizes the structural form of the chamber partition 2 and the star disk cathode plate 3, as well as the electroplating parameters, to accommodate fine-needle diodes of different sizes and electroplating thicknesses.

[0025] In this embodiment, the compartment partitions 2 are still spaced along the axial direction of the roller shell 1, but the compartment partitions 2 are replaced by polygonal plates with concave edges, instead of the hexagonal plates in Embodiment 1. Specifically, the inner edge of the compartment partition 2 adopts a slightly inward-converging structure, making the compartment partition 2 form an "octagonal with a notch" profile. This structure allows the fine-needle diodes 6 to be more concentrated in the central area of ​​the compartment when rolling within the compartment, thereby reducing the radial displacement of the device and improving the stability of the rolling path. The edges of the compartment partitions 2 are still fixedly connected to the roller shell 1, forming a stable partition structure.

[0026] In this embodiment, the star-shaped cathode plate 3 has a multi-layer composite structure, that is, a thin conductive sheet is added to the outside of the original star-shaped metal sheet to increase the effective cathode area. The multi-pointed structure of the star-shaped cathode plate 3 remains unchanged, but a small arc transition is added to the outer edge of the points to make the electric field distribution smoother and reduce local current density peaks. The star-shaped cathode plate 3 is still installed at the center of the compartment bulkhead 2 and is connected to the external electroplating power supply through the through-shaft 4 and the middle section 7 of the shaft.

[0027] In this embodiment, the surface of the through-rotating shaft 4 is further insulated, and an insulating coating is applied near the star disk cathode plate 3 so that the through-rotating shaft 4 does not participate in conduction inside the cabin, thereby reducing the impact on the electric field distribution and enabling the star disk cathode plate 3 to form a more uniform multi-directional electric field inside the cabin.

[0028] The mounting method of the fine needle diodes 6 is the same as in Embodiment 1, with several fine needle diodes 6 mounted in each compartment. In order to meet the requirements of higher electroplating thickness, the barrel plating process in this embodiment adopts a pulsed current mode, that is, the star disk cathode plate 3 is periodically applied with alternating high and low current pulse signals through the electroplating power supply, so that the ion deposition of the fine needle diodes 6 in the electroplating solution is more uniform, thereby further improving the adhesion and surface smoothness of the plating layer.

[0029] During the barrel plating process, the barrel shell 1 is driven by an external drive device to rotate through the shaft 4 at a constant speed. The multiple independent compartments formed by the compartment partitions 2 allow the fine needle diodes 6 to roll independently in their respective spaces, preventing them from colliding with each other. In this embodiment, the barrel rotation speed is slightly lower than in Embodiment 1, making the rolling motion of the fine needle diodes 6 inside the compartments smoother, thereby avoiding additional mechanical stress caused by high-speed tumbling.

[0030] Through the aforementioned optional structure, this embodiment can further improve the electric field distribution and enhance the plating quality while maintaining the device isolation and plating uniformity of Embodiment 1, and is suitable for fine-pin diode products with different plating requirements. This embodiment complements Embodiment 1 and is applicable to scenarios requiring higher consistency and higher plating adhesion.

[0031] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0032] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A device for preventing bending of axial fine-conducting pin-type diodes by barrel plating, characterized in that, include: The outer shell of the drum (1) is a hollow cylindrical structure; Cabin partitions (2) are disposed inside the drum housing (1) and spaced apart along its axial direction to divide the interior space into multiple independent compartments; A star disk cathode plate (3) is fixedly installed at the center of the cabin bulkhead (2). The star disk cathode plate (3) has a multi-pointed structure and extends into the cabin. A through-rotor (4) is provided through the outer shell of the drum (1) and along its axis. The two ends of the through-rotor (4) pass through the end cover (5) respectively and form the middle section (7) of the shaft on the outside of the end cover (5), which is used to connect the external drive mechanism and the electroplating power supply. Fine needle diodes (6) are placed in each independent compartment. The fine needle diodes (6) are arranged along the axial direction of the drum and roll in the compartment as the drum rotates.

2. The anti-bending barrel plating device for axial fine-conducting needle-type diodes according to claim 1, characterized in that: The compartment partition (2) is a polygonal plate structure, and its peripheral edge is fixedly connected to the inner wall of the roller shell (1).

3. The anti-bending barrel plating device for axial fine-conducting needle-type diodes according to claim 1, characterized in that: The star disk cathode plate (3) is electrically connected to an external electroplating power source through a through-rotating shaft (4) and the middle section (7) of the rotating shaft, in order to form a multi-directional uniform electric field in the cabin.

4. The anti-bending barrel plating device for axial fine-conducting needle-type diodes according to claim 1, characterized in that: The compartment partition (2) is a polygonal plate with concave edges, which is used to bring the fine needle diode (6) closer to the center area of ​​the compartment when it rolls inside the compartment.

5. The anti-bending barrel plating device for axial fine-conducting needle-type diodes according to claim 1, characterized in that: The outer edge of the star disk cathode plate (3) has an arc-shaped transition structure to improve the uniformity of the electric field distribution inside the cabin.

6. The anti-bending barrel plating device for axial fine-conducting needle-type diodes according to claim 1, characterized in that: The through-rotor (4) has an insulating coating near the star disk cathode plate (3) to reduce the influence of the through-rotor (4) on the electric field distribution inside the cabin.

7. The anti-bending barrel plating device for axial fine-conducting needle-type diodes according to claim 1, characterized in that: When the barrel plating device is in operation, the through shaft (4) is driven by an external drive mechanism to rotate, so that the fine needle diode (6) rolls along the bottom area of ​​each independent compartment.