Redundant array of independent disks (RAID) card over-current and over-temperature detection and protection circuit and method

Abstract

The invention discloses an over-current and over-temperature detection and protection circuit and method for an RAID (redundant array of independent disks) card, and the circuit comprises a ripple detection circuit which is connected to a power supply loop of the RAID card, and is used for collecting a working current signal and extracting a characteristic ripple signal in the working current signal; the temperature signal acquisition module is provided with a plurality of temperature sensors, is arranged at preset positions of the RAID card and is used for acquiring temperature distribution signals; the control unit is connected with the ripple detection circuit and the temperature signal acquisition module and is used for receiving and processing the characteristic ripple signal and the temperature distribution signal; the protection action execution unit is connected with the protection instruction output end of the control unit and is connected to a controlled node of the RAID card; and the control unit evaluates the working state of the RAID card by analyzing the characteristic ripple signal and the temperature distribution signal, and outputs a protection instruction to the protection action execution unit. According to the over-current and over-temperature protection circuit, over-speed response to over-current and over-temperature is realized, and protection delay is effectively avoided.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit technology, and in particular to a circuit and method for overcurrent and overtemperature detection and protection of a RAID card. Background Technology

[0002] As server data throughput continues to increase, the workload and power consumption of RAID cards are constantly rising, leading to frequent overcurrent and overtemperature failures, which seriously affect server operational stability and data security. Traditional RAID card protection devices use a fixed threshold triggering mechanism, activating protection when the current or temperature exceeds a preset threshold. However, the operating state of RAID cards changes dynamically, and fixed thresholds are prone to false triggering under instantaneous high loads, or protection delays due to heat accumulation caused by slow temperature rises. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of existing RAID card overcurrent and overtemperature detection and protection technologies, which use fixed thresholds for protection, resulting in poor adaptability and easy protection delays. This invention provides a RAID card overcurrent and overtemperature detection and protection circuit and method.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: In a first aspect, the present invention provides a RAID card overcurrent and overtemperature detection and protection device, comprising: The ripple detection circuit, whose input is connected to the power supply circuit of the RAID card, is used to collect the working current signal and extract the characteristic ripple signal from it. The temperature signal acquisition module is equipped with multiple temperature sensors, which are arranged in predetermined positions on the RAID card to collect temperature distribution signals. The control unit has its signal input terminal connected to the output terminal of the ripple detection circuit and the signal output terminal of the temperature signal acquisition module, respectively, and is used to receive and process the characteristic ripple signal and the temperature distribution signal. The protection action execution unit has its control input terminal connected to the protection command output terminal of the control unit, and its power output terminal connected to the controlled node of the RAID card. The control unit is configured to evaluate the RAID card's operating status by analyzing the characteristic ripple signal and temperature distribution signal, and output corresponding level protection commands to the protection action execution unit based on the evaluation results.

[0005] In one embodiment, the ripple detection circuit includes a bandpass filter module and a signal rectification module; the input terminal of the bandpass filter module is connected to the power supply circuit of the RAID card, and the output terminal of the bandpass filter module is connected to the input terminal of the signal rectification module; the output terminal of the signal rectification module is connected to the control unit.

[0006] In one embodiment, the temperature signal acquisition module includes three temperature sensors arranged in a triangle on the RAID card with a spacing of 10-15 mm.

[0007] In one embodiment, the protection action execution unit includes a hardware fuse circuit. The power supply input terminal of the hardware fuse circuit is used to connect to the power supply circuit of the RAID card, the control input terminal is connected to the protection command output terminal of the control unit, and the power output terminal is connected to the controlled node of the RAID card.

[0008] Secondly, the present invention also provides a method for overcurrent and overtemperature detection and protection of a RAID card, which is executed using the RAID card overcurrent and overtemperature detection and protection device described above, and includes the following steps: The operating current signal of the RAID card is acquired by a ripple detection circuit, the characteristic ripple signal is extracted, and the characteristic ripple signal is transmitted to the control unit. The temperature signal acquisition module acquires the real-time temperature distribution signal on the RAID card and transmits the real-time temperature distribution signal to the control unit. The control unit extracts ripple power characteristic values ​​representing the characteristics of current ripple based on the characteristic ripple signal, and calculates temperature distribution characteristic values ​​based on the real-time temperature distribution signal and the pre-acquired historical temperature distribution information; The control unit compares the ripple power characteristic value with a preset power threshold and the temperature distribution characteristic value with a preset temperature threshold, and determines the fault level of the RAID card based on the comparison results. The control unit generates a corresponding level of protection command based on the determined fault level, and drives the protection action execution unit to perform the corresponding protection operation based on the protection command.

[0009] In one embodiment, the step of acquiring the operating current signal of the RAID card through the ripple detection circuit, extracting the characteristic ripple signal therein, and transmitting the characteristic ripple signal to the control unit includes: The operating current signal in the RAID card power supply circuit is acquired through the input terminal of the ripple detection circuit. The ripple detection circuit extracts the ripple component that conforms to the preset frequency band from the operating current signal and converts the ripple component into a DC voltage signal. The DC voltage signal is transmitted to the control unit as the characteristic ripple signal.

[0010] In one embodiment, the temperature distribution characteristic values ​​include the region's highest temperature, the rate of temperature change, and the temperature distribution gradient; The step of having the control unit extract ripple power characteristic values ​​representing the characteristics of the current ripple based on the characteristic ripple signal, and calculate temperature distribution characteristic values ​​based on the real-time temperature distribution signal and pre-acquired historical temperature distribution information, includes: The control unit performs power calculation on the characteristic ripple signal to obtain the ripple power characteristic value; The control unit constructs a temperature distribution model of the RAID card based on the real-time temperature distribution signal using a planar interpolation algorithm, and calculates the estimated current temperature of the specified target location based on the temperature distribution model. The control unit confirms the highest temperature in the region based on the real-time temperature distribution signal and the estimated current temperature. The control unit calculates the rate of temperature change per unit time based on the real-time temperature distribution signal and the historical temperature distribution signal within multiple consecutive sampling periods. The control unit calculates the temperature distribution gradient within a unit spatial distance based on the temperature distribution model.

[0011] In one embodiment, the preset temperature threshold includes a maximum temperature threshold, a temperature rise rate threshold, and a temperature gradient threshold; The steps of comparing the ripple power characteristic value with a preset power threshold and comparing the temperature distribution characteristic value with a preset temperature threshold through the control unit, and determining the fault level of the RAID card based on the comparison results, include: The control unit is instructed to compare the calculated ripple power characteristic value with a preset power threshold. When the ripple power characteristic value exceeds the preset power threshold, a power anomaly is marked. The control unit is instructed to compare the highest temperature in the region with the highest temperature threshold, compare the temperature change with the temperature rise rate threshold, and compare the temperature distribution gradient with the temperature gradient threshold. A temperature anomaly is marked when the highest temperature in the region is greater than or equal to the highest temperature threshold, and / or the rate of temperature change is greater than the rate of temperature rise threshold, and / or the temperature distribution gradient is greater than the temperature gradient threshold; The control unit determines the fault level based on the flags indicating abnormal power and abnormal temperature.

[0012] In one embodiment, the step of having the control unit determine the fault level based on the flags indicating power and temperature anomalies includes: When the marked status shows power abnormality but no temperature abnormality, the fault level is determined to be a level one fault. When the marked status shows an abnormal temperature but no abnormal power, the fault level is determined to be a level two fault. When both power and temperature abnormalities are detected in the marked status, the fault level is determined to be a level three fault.

[0013] In one embodiment, the step of instructing the control unit to generate a protection command of a corresponding level based on the determined fault level, and driving the protection action execution unit to perform corresponding protection operations based on the protection command, includes: When a level one fault is determined, the control unit generates a frequency reduction control command and sends the frequency reduction control command to the main control chip of the RAID card through the protection action execution unit, thereby driving the main control chip of the RAID card to perform a frequency reduction operation. When a level 2 fault is determined, the control unit generates a forced cooling command and sends the forced cooling command to the main control chip of the RAID card through the protection action execution unit. The main control chip of the RAID card drives the cooling system of the RAID card to operate at full speed. When a level 3 fault is determined, the control unit generates a hardware power-off command and drives the protection action execution unit to perform a power-off operation based on the hardware power-off command. At the same time, the ripple power characteristic value, temperature distribution characteristic value and sampling time of this fault are recorded in a non-volatile memory.

[0014] The RAID card overcurrent and overtemperature detection and protection circuit and method of the present invention have the following advantages compared with the prior art: By modularly splitting the detection and protection functions, a complete protection link of "signal acquisition - signal processing - command output - action execution" is constructed. Among them, the ripple detection circuit acquires the working current signal of the power supply circuit and extracts the characteristic ripple signal, the temperature signal acquisition module acquires the temperature distribution signal through multiple temperature sensors, the control unit performs comprehensive analysis of the two types of signals to evaluate the working status of the RAID card, and the protection action execution unit executes the corresponding protection operation at the controlled node of the RAID card according to the different levels of protection commands output by the control unit, realizing full-process collaborative protection. This multi-module collaborative work breaks the limitations of traditional single threshold protection. The dual-dimensional detection of characteristic ripple signal and temperature distribution signal can comprehensively capture the abnormal state of the RAID card. The accurate output of different levels of protection commands can adapt to different fault scenarios, which not only avoids false triggering affecting normal operation, but also prevents protection delay from causing the fault to expand, significantly improving the operational stability of the RAID card and reducing fault losses.

[0015] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of the RAID card overcurrent and overtemperature detection and protection device provided in an embodiment of the present invention; Figure 2 A circuit diagram of the ripple detection circuit provided in an embodiment of the present invention; Figure 3 This is a flowchart illustrating the RAID card overcurrent and overtemperature detection and protection method provided in an embodiment of the present invention. Figure 4 This is a flowchart illustrating step S1 provided in an embodiment of the present invention; Figure 5 This is a flowchart illustrating step S3 provided in an embodiment of the present invention; Figure 6 This is a flowchart illustrating step S32 provided in an embodiment of the present invention; Figure 7 This is a flowchart illustrating step S35 provided in an embodiment of the present invention; Figure 8 This is a flowchart illustrating step S4 provided in an embodiment of the present invention.

[0018] Figure Labels 111. Ripple detection circuit; 112. Bandpass filter module; 113. Signal rectification module; 12. Temperature signal acquisition module; 124. Temperature sensor; 13. Control unit; 14. Protection action execution unit; 2. RAID card; 21. Main control chip. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0022] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0023] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0024] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0025] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0026] See Figures 1 to 2 As shown, this invention provides an embodiment of a RAID card overcurrent and overtemperature detection and protection device, comprising: The ripple detection circuit 11 has its input terminal connected to the power supply circuit of the RAID card 2, and is used to collect the working current signal and extract the characteristic ripple signal therein; The temperature signal acquisition module 12 is equipped with multiple temperature sensors 122, which are arranged at predetermined positions on the RAID card 2 for acquiring temperature distribution signals. The control unit 13 has its signal input terminal connected to the output terminal of the ripple detection circuit 11 and the signal output terminal of the temperature signal acquisition module 12, respectively, and is used to receive and process the characteristic ripple signal and the temperature distribution signal. The protection action execution unit 14 has its control input terminal connected to the protection command output terminal of the control unit 13, and its power output terminal connected to the controlled node of the RAID card 2. The control unit 13 is configured to evaluate the working status of the RAID card 2 by analyzing the characteristic ripple signal and temperature distribution signal, and output protection instructions of the corresponding level to the protection action execution unit 14 according to the evaluation results.

[0027] Specifically, this application constructs a complete protection chain of "signal acquisition - signal processing - command output - action execution" by modularly separating detection and protection functions. The ripple detection circuit 11 acquires the operating current signal of the power supply circuit and extracts the characteristic ripple signal. The temperature signal acquisition module 12 obtains the temperature distribution signal through multiple temperature sensors 122. The control unit 13 performs comprehensive analysis on the two types of signals to evaluate the working status of the RAID card 2. The protection action execution unit 14 executes the corresponding protection operation on the controlled node of the RAID card 2 according to the different levels of protection commands output by the control unit 13, realizing full-process collaborative protection.

[0028] This embodiment breaks through the limitations of traditional single threshold protection by working in concert with multiple modules. The dual-dimensional detection of characteristic ripple signals and temperature distribution signals can comprehensively capture the abnormal state of RAID card 2. The precise output of protection commands of different levels can adapt to different fault scenarios, which not only avoids false triggering affecting normal operation, but also prevents protection delay from causing the fault to expand, significantly improving the operational stability of RAID card 2 and reducing fault losses.

[0029] In one specific embodiment, the ripple detection circuit 11 includes a bandpass filter module 111 and a signal rectification module 112; the input terminal of the bandpass filter module 111 is used to connect to the power supply circuit of the RAID card 2, and the output terminal of the bandpass filter module 111 is connected to the input terminal of the signal rectification module 112; the output terminal of the signal rectification module 112 is connected to the control unit 13.

[0030] Specifically, the ripple detection circuit 11 needs to accurately extract the effective characteristic ripple signal from the complex operating current signal, the bandpass filter module 111 is responsible for screening out the ripple component of the preset frequency band and filtering out irrelevant interference signals, and the signal rectification module 112 converts the filtered AC ripple component into a stable DC signal to ensure that the control unit 13 can accurately receive and process the characteristic ripple signal. The two are connected in series to form a "screening-conversion" signal processing flow.

[0031] This embodiment, through the combined use of the bandpass filter module 111 and the signal rectification module 112, significantly improves the extraction accuracy and stability of the characteristic ripple signal, avoids detection errors caused by interference signals, and the converted DC signal is more suitable for the sampling requirements of the control unit 13, providing reliable data support for subsequent fault level judgment, significantly improving the detection accuracy of overcurrent faults and effectively reducing the false alarm rate.

[0032] In one specific embodiment, the bandpass filter module 111 includes an excitation voltage source V1, resistors R1, R2, and R3, capacitors C2 and C3, and an operational amplifier U2. One end of the excitation voltage source V1 is connected to the power supply circuit of the RAID card 2, and the other end is connected to GND. One end of the resistor R1 is connected to the power supply circuit of the RAID card 2, and the other end is connected to one end of capacitors C2 and C3 and resistor R3. The other end of capacitor C2 and one end of resistor R2 are connected to the inverting input terminal of the operational amplifier U2. The other end of capacitor C3 is connected to the other end of resistor R2 and the output terminal of the operational amplifier U2. The other end of resistor R3 and the non-inverting input terminal of the operational amplifier U2 are grounded together. The output terminal of the operational amplifier U2 is also connected to the signal rectification module 112.

[0033] Specifically, the bandpass filter module 111 uses operational amplifier U2 as the core processing element, and excitation voltage source V1 provides the basic conditions for signal acquisition in the power supply circuit. Resistors R1, R2, and R3, along with capacitors C2 and C3, form a feedback filter network. Resistor R1 connects the power supply circuit and the filter network. Capacitor C2 and resistor R2 form a high-pass response path, and capacitor C3 and resistor R2 form a low-pass response path. Resistor R3 is grounded to the non-inverting input terminal of operational amplifier U2 to ensure circuit stability. Precise selection of signals in specific frequency bands is achieved through component parameter matching.

[0034] The bandpass filter module 111 provided in this embodiment has targeted frequency band screening capabilities, which can accurately capture characteristic ripple signals related to RAID card 2 faults. The reasonable design of the filter network makes the signal attenuation small and the anti-interference capability strong. The application of the operational amplifier improves the signal amplification effect, provides high-quality raw data for subsequent signal processing, and further optimizes the accuracy and timeliness of overcurrent detection.

[0035] In one specific embodiment, the parameters of the bandpass filter module 111 are as follows: C2=C3=C=100pF, R1=1kΩ, R2=39.2kΩ, R3=2.43kΩ, =302kHz; The maximum gain at the center frequency is ; The power factor is Q ; bandwidth .

[0036] Specifically, based on circuit characteristics and the fault signal features of RAID card 2, this embodiment precisely sets the component parameters of the bandpass filter module 111 to achieve preset center frequency, gain, power factor, and bandwidth specifications. Capacitors C2 and C3 are both 100pF, resistors R1 is 1kΩ, R2 is 39.2kΩ, and R3 is 2.43kΩ. This combination of parameters stabilizes the center frequency at 302kHz, achieves a maximum gain of 19.6, a power factor of 3.717, and a bandwidth of 81kHz, perfectly matching the frequency range of the fault characteristic ripple of RAID card 2.

[0037] This embodiment provides specific parameter settings that ensure the performance of the bandpass filter module 111 is highly compatible with the fault detection requirements of the RAID card 2. The precise matching of the center frequency ensures that no characteristic ripple signals are missed. The appropriate gain and bandwidth result in low distortion and high integrity during signal transmission. The optimization of the power factor improves the circuit efficiency, providing hardware support for the accurate extraction of characteristic ripple signals and further reducing detection errors.

[0038] In one specific embodiment, the signal rectification module 112 includes resistors R4, R5, R6, R7, R8, and R9, capacitor C4, diodes D1 and D2, operational amplifier U1, and operational amplifier U3. One end of resistors R5 and R8 is connected to the output terminal of the bandpass filter module 111. The other end of resistor R5, one end of resistor R4, and the cathode of diode D1 are all connected to the inverting input terminal of operational amplifier U1. The non-inverting input terminal of operational amplifier U1 is grounded. The cathode of diode D2 is connected to the diode... The anode of diode D1 is connected to the output terminal of operational amplifier U1; the anode of diode D2 is connected to the other end of resistor R4 and one end of resistor R6; the other end of resistor R6, the other end of resistor R8, and one end of resistor R9 are all connected to the inverting input terminal of operational amplifier U3, the non-inverting input terminal of operational amplifier U3 is grounded, the output terminal of operational amplifier U3 is connected to the other end of resistor R9 and one end of resistor R7; the other end of resistor R7 is connected to one end of capacitor C4 and control unit 13; the other end of capacitor C4 is grounded.

[0039] Specifically, the signal rectification module 112 needs to convert the AC ripple signal after bandpass filtering into a DC signal. Resistors R5 and R8 receive the AC signal output by the bandpass filter module 111. Operational amplifier U1, diodes D1 and D2 form a half-wave rectifier circuit to perform preliminary rectification of the AC signal. Operational amplifier U3, resistors R6 and R9 form a summing amplifier to further process the signal after preliminary rectification. Resistor R7 and capacitor C4 form a low-pass filter circuit to make the output signal more stable and meet the sampling requirements of control unit 13.

[0040] The signal rectification module 112 provided in this embodiment realizes efficient conversion of AC signal to DC signal. The combination of half-wave rectification and summation amplification improves the rectification accuracy. The low-pass filter circuit effectively suppresses high-frequency noise in the signal. The stable DC output signal enables the control unit 13 to accurately obtain key information of characteristic ripples, providing reliable data support for fault level judgment and ensuring the accuracy of overcurrent detection.

[0041] In one specific embodiment, R6 = 3.4kΩ, R9 = 6.81kΩ, and the gain of the operational amplifier U3 is 2.

[0042] Specifically, the gain of the summing amplifier in the signal rectification module 112 directly affects the amplitude accuracy of the rectified signal. Based on the sampling range of the control unit 13 and the amplitude characteristics of the characteristic ripple signal, resistor R6 is set to 3.4kΩ and resistor R9 to 6.81kΩ. Through the resistor ratio design, the gain of the operational amplifier U3 is made to reach 2 times, ensuring that the amplitude of the rectified DC signal is in the optimal sampling range of the control unit 13. This avoids insufficient detection accuracy due to excessively small signal amplitude, and also prevents circuit damage due to excessively large signal amplitude.

[0043] This embodiment achieves a stable 2x gain for the summing amplifier by setting specific resistance parameters. The amplitude of the rectified DC signal is precisely matched with the sampling requirements of the control unit 13, significantly improving the signal's recognizability and measurability. The control unit 13 can more accurately extract the power characteristic value of the characteristic ripple, thereby improving the accuracy of overcurrent fault judgment and avoiding detection errors or circuit faults caused by improper signal amplitude.

[0044] It is understood that the parameters of the circuit elements involved in this application can also be set to other values ​​as needed.

[0045] In one specific embodiment, the control unit 13 is an MCU with a built-in analog-to-digital converter.

[0046] Specifically, the control unit 13, as the core of the entire device, needs to possess the capabilities of fast signal processing, logic judgment, instruction output, and analog signal conversion. The MCU (microcontroller unit 13) with built-in analog-to-digital converter integrates signal sampling and data processing functions, eliminating the need for an additional independent analog-to-digital converter module. It can directly receive the analog characteristic ripple signal output by the ripple detection circuit 11 and the analog temperature distribution signal from the temperature signal acquisition module 12. After converting the analog signals into digital signals through the built-in analog-to-digital converter, the two types of signals are analyzed and processed through the built-in algorithm to evaluate the working status of the RAID card 2 and generate corresponding protection instructions, accurately driving the protection action execution unit 14 to work.

[0047] This embodiment eliminates the need for an additional analog-to-digital converter module by using an MCU with a built-in analog-to-digital converter, simplifying the circuit structure, reducing signal transmission links, and lowering the size, power consumption, and cost of the device. It also avoids signal distortion and delay during inter-module transmission. Its rapid response capability ensures the timeliness of fault detection and protection command output, its stable logic judgment capability guarantees the accuracy of protection commands, and the built-in conversion function improves signal processing efficiency and accuracy. This further enhances the overall reliability, response speed, and detection accuracy of the device, effectively reducing false alarm rates and strengthening the protection effect of the RAID card 2.

[0048] In one specific embodiment, the temperature signal acquisition module 12 includes three temperature sensors 122, which are arranged in a triangle on the RAID card 2 with a spacing of 10-15mm.

[0049] Specifically, the temperature signal acquisition module 12 needs to comprehensively and accurately acquire the temperature distribution of the RAID card 2. The arrangement of the three temperature sensors 122 can cover the key areas of the RAID card 2. The 10-15mm spacing design ensures that the temperature sampling density meets the distribution detection requirements. The triangular arrangement allows the temperature sensors 122 to capture temperature changes from different angles, avoiding temperature blind spots caused by unreasonable layout of the temperature sensors 122, and ensuring the comprehensiveness and representativeness of the temperature distribution signal.

[0050] This embodiment effectively expands the temperature detection range and eliminates temperature blind spots by arranging three temperature sensors 122 in a triangle. The 10-15mm spacing makes the sampling accuracy of temperature distribution data higher, which can accurately reflect the temperature differences in different areas of the RAID card 2. This provides comprehensive and reliable raw data for the control unit 13 to calculate the temperature distribution characteristic value, making the detection of over-temperature faults more accurate and avoiding the problem of local over-temperature not being detected in time.

[0051] More specifically, based on the heat dissipation characteristics of RAID card 2, a temperature sensor 122 is positioned close to the main control chip of RAID card 2. The main control chip serves as the primary heat source, and this temperature sensor 122 can accurately capture temperature changes in the core heat-generating area. Another temperature sensor 122 is positioned at the edge of RAID card 2, where the temperature is relatively lower, serving as a temperature reference. A third temperature sensor 122 is positioned in the middle of RAID card 2 to connect the temperature data from the core and edge areas. These three sensors work together to achieve comprehensive monitoring of the temperature distribution. The specific placement of the temperature sensors 122 makes temperature sampling more targeted. Temperature changes in the core area can be quickly captured, temperature data from the edge area provides a reference for calculating the temperature distribution gradient, and sampling data from the middle area supplements information about the temperature transition area. The combination of these three sensors makes the temperature distribution signal more comprehensive and accurate, enabling the control unit 13 to more accurately determine the location and severity of over-temperature faults, thus improving the targeted nature of the protection.

[0052] In one specific embodiment, the protection action execution unit 14 includes a hardware fuse circuit. The power supply input terminal of the hardware fuse circuit is used to connect to the power supply circuit of the RAID card 2, the control input terminal is connected to the protection command output terminal of the control unit 13, and the power output terminal is connected to the controlled node of the RAID card 2.

[0053] Specifically, the protection action execution unit 14 needs to take into account both signal transmission and fault protection functions. The hardware fuse circuit is the core component. Its power supply input terminal is connected to the power supply circuit of the RAID card 2 to ensure the stability of power transmission. The control input terminal receives the protection command from the control unit 13. In the non-disconnection state, the control signal is stably transmitted to the controlled node of the RAID card 2 through the internal signal transmission channel to ensure the transmission of the normal operation command of the RAID card 2. When a serious fault is detected and disconnection is required, the hardware fuse circuit quickly responds to cut off the power supply circuit and terminates the fault expansion.

[0054] More specifically, the hardware fuse circuit uses electronic fuse elements as its core, achieving an ultra-fast response of ≤8μs, far faster than software solutions, which can quickly cut off power supply to prevent the fault from escalating; it works independently of the main system and is not affected by main system failures, making the protection more reliable; it also has signal transmission function in non-fault situations, requiring no additional modules and simplifying the circuit structure; it can also be used to store fault logs to assist in subsequent troubleshooting, and the false alarm rate is <1%, ensuring the stable operation of the RAID card 2.

[0055] The hardware fuse circuit enables stable transmission of control signals without interrupting power supply, eliminating the need for additional signal transmission components, simplifying the circuit structure and reducing device complexity. In the event of a severe fault, it quickly cuts off the power supply circuit, preventing irreversible damage to the RAID card 2 due to a serious malfunction. This dual-function integration ensures reliable signal transmission during normal operation of the RAID card 2 and enhances the timeliness of protection in fault conditions, further expanding the practicality and stability of the device.

[0056] See Figures 3 to 8 As shown, the present invention also provides an embodiment of a RAID card overcurrent and overtemperature detection and protection method, which is implemented using the RAID card overcurrent and overtemperature detection and protection device described above, and includes the following steps: S1. The operating current signal of the RAID card is acquired through the ripple detection circuit, the characteristic ripple signal is extracted, and the characteristic ripple signal is transmitted to the control unit.

[0057] Overcurrent faults will generate specific frequency band ripples in the power supply circuit current. Through the process of "acquisition-screening-conversion-transmission", effective feature signals are separated from complex current signals, providing reliable data for overcurrent judgment and avoiding interference signals from affecting detection accuracy.

[0058] Specifically, step S1 includes: S11. Acquire the operating current signal in the RAID card power supply circuit through the input terminal of the ripple detection circuit.

[0059] S12. The ripple detection circuit extracts the ripple component that conforms to the preset frequency band from the working current signal and converts the ripple component into a DC voltage signal.

[0060] In this embodiment, step S12 specifically involves: filtering out ripple components in a preset frequency band of 300kHz±40kHz through the bandpass filter module in the ripple detection circuit to remove irrelevant frequency interference; and converting the filtered AC ripple components into a stable DC voltage signal through the signal rectification module.

[0061] S13. The DC voltage signal is transmitted to the control unit as the characteristic ripple signal.

[0062] Step S1 provides high-quality raw data for subsequent ripple power characteristic value calculation and is the foundation of overcurrent fault detection. It is a three-step process that progresses step by step. The preset frequency band screening ensures that no fault-related signals are missed, and the DC-DC conversion adapts to the sampling requirements of the control unit, reducing signal transmission distortion and significantly improving the accuracy of overcurrent detection.

[0063] S2. Acquire the real-time temperature distribution signal on the RAID card through the temperature signal acquisition module, and transmit the real-time temperature distribution signal to the control unit.

[0064] Temperature sensors are arranged in a specific layout to collect temperature data from different areas of the RAID card. Combined with coordinate and time information, they form a complete temperature distribution signal, comprehensively capturing temperature changes and avoiding blind spots caused by temperature measurement at a single location.

[0065] In this embodiment, step S2 specifically involves using three temperature sensors arranged in a triangle (10-15mm apart) to collect real-time temperatures near the main control chip of the RAID card, at the edge of the RAID card, and at the center of the RAID card, respectively. Simultaneously, the coordinate position and sampling time of each temperature sensor are recorded to form a real-time temperature distribution signal, which is then transmitted to the control unit. The triangular layout of the multiple temperature sensors expands the temperature detection range, and the coordinate and time information provides dimensional support for subsequent temperature analysis, ensuring the comprehensiveness and traceability of the temperature data.

[0066] Step S2 aims to provide basic data for calculating temperature distribution characteristic values ​​and is the core data source for over-temperature fault detection.

[0067] S3. The control unit extracts the ripple power characteristic value representing the current ripple characteristics based on the characteristic ripple signal, and calculates the temperature distribution characteristic value based on the real-time temperature distribution signal and the pre-acquired historical temperature distribution information.

[0068] Specifically, the temperature distribution characteristic values ​​include the region's highest temperature, the rate of temperature change, and the temperature distribution gradient; Step S3 includes: S31. The control unit is instructed to perform power calculation on the characteristic ripple signal to obtain the ripple power characteristic value.

[0069] In this embodiment, the control unit is an MCU with a built-in analog-to-digital converter (MCU). Figure 2 In step S31, the control unit (MCU with built-in analog-to-digital converter) receives the characteristic ripple signal (stable DC voltage signal), converts the characteristic ripple signal into a digital signal through the built-in analog-to-digital converter, calculates the power of the digital signal, that is, obtains the ripple power characteristic value, and removes abnormal values ​​caused by transient interference to ensure data validity.

[0070] S32. The control unit constructs a temperature distribution model of the RAID card based on the real-time temperature distribution signal using a planar interpolation algorithm, and calculates the estimated current temperature of the specified target location based on the temperature distribution model. Step S32 includes: S321. The control unit is instructed to obtain the coordinate positions of each of the multiple temperature sensors and their corresponding real-time temperature measurement values.

[0071] In this embodiment, step S321 specifically involves the control unit (MCU) establishing a data connection with the three temperature sensors via an I2C or SPI communication interface. The coordinate positions of each temperature sensor are read (Temp1: 4,4; Temp2: 8,10; Temp3: 14,2), and the real-time temperature measurements of each sensor are simultaneously acquired (e.g., T1=40℃, T2=42℃, T3=46℃ at full load). The coordinates and temperature data are stored according to the temperature sensor number, forming a "coordinate-temperature" dataset. This step aims to obtain the basic data for constructing a temperature distribution model, which is a prerequisite for achieving full-board temperature estimation and avoids temperature model distortion due to insufficient data.

[0072] S322. The control unit substitutes the coordinate position and real-time temperature measurement value into the planar temperature model T(x,y)=ax+by+c, and solves for the model coefficients a, b, and c, thereby constructing a two-dimensional temperature distribution model of the RAID card at the current moment.

[0073] Specifically, planar interpolation is a mathematical algorithm that estimates the value at any point by constructing a continuous planar function based on finite discrete point data. The planar temperature model is a two-dimensional temperature field model constructed using the linear equation T(x,y)=ax+by+c, where x and y are coordinate positions, a, b, and c are model coefficients, and T(x,y) is the temperature at the corresponding coordinate position. In practice, discrete temperature data from only three temperature sensors cannot reflect the overall temperature distribution of a RAID card. By substituting the "coordinate-temperature" data into the linear planar model T(x,y)=ax+by+c and solving for the coefficients a, b, and c, a two-dimensional temperature distribution model covering the entire board can be constructed, enabling the estimation of temperature at any location.

[0074] In this embodiment, step S322 specifically involves the control unit (MCU) substituting the three "coordinate-temperature" data (e.g., Temp1: (4,4,40℃), Temp2: (8,10,42℃), Temp3: (14,2,46℃)) obtained in S321 into the planar temperature model T(x,y)=ax+by+c, forming a system of three linear equations. The system of equations is solved using a built-in algorithm, yielding coefficients a=0.588, b=-0.059, and c=37.883, thus determining the two-dimensional temperature distribution model as T(x,y)=0.588x-0.059y+37.883.

[0075] Step S322 aims to transform discrete temperature data into a continuous temperature distribution model, enabling full-plate temperature visualization. It is the core foundation for estimating the temperature at the target location and calculating the temperature distribution gradient.

[0076] S323. The control unit substitutes the coordinates of the specified target location on the RAID card into the temperature distribution model T(x,y)=ax+by+c to calculate the estimated current temperature of the specified target location.

[0077] Specifically, key components such as the RAID card's main control chip are the main heat sources, but it is difficult to directly place temperature sensors in their locations. It is necessary to use the established temperature distribution model, substitute the target location coordinates, and estimate the real-time temperature to ensure that the core heat source temperature can be monitored and avoid over-temperature omissions due to lack of temperature sensor coverage.

[0078] In this embodiment, step S323 specifically involves determining the coordinates of the RAID card's main controller chip (specified target location) (e.g., x=8, y=6). The control unit (MCU) substitutes these coordinates into the temperature distribution model T(x,y)=0.588x-0.059y+37.883 constructed in S322, and calculates T_r=0.588×8-0.059×6+37.883=42.233℃. This value is the estimated current temperature at the location of the main controller chip.

[0079] Step S323 aims to achieve accurate estimation of the core heat source temperature without the need for additional temperature sensors, thereby reducing hardware costs. The estimation error is less than 0.5℃, ensuring the accuracy of temperature monitoring in the core area and avoiding missed detection of over-temperature faults in the main control chip due to limitations in temperature sensor layout. This provides crucial data for over-temperature fault diagnosis.

[0080] S33. The control unit confirms the highest temperature in the region based on the real-time temperature distribution signal and the estimated current temperature.

[0081] Specifically, the highest temperature in the area is the core indicator for judging the severity of overheating faults. It is necessary to combine the actual temperature measured by the temperature sensor with the temperature estimated at the target location to ensure that the highest temperature point of the entire RAID card is captured, and to avoid missing the highest temperature due to relying solely on the actual measured temperature.

[0082] Step S33 includes: The real-time temperature measurement value corresponding to each temperature sensor is compared with the estimated current temperature, and the maximum value is taken as the highest temperature in the area.

[0083] In this embodiment, step S33 specifically involves the control unit (MCU) retrieving the real-time temperature measurement values ​​(T1=40℃, T2=42℃, T3=46℃) from the three temperature sensors in S321 and the estimated current temperature (e.g., 42.233℃) at the specified target location in S323. All temperature data are compared one by one, and the maximum value (e.g., 46℃) is selected and determined as the highest temperature in the RAID card area.

[0084] Step S33 aims to combine measured and estimated temperatures to ensure that the highest temperature in the area is not missed, and to avoid misjudging the severity of overheating due to the temperature sensor not covering the highest temperature area. The comparison and screening method is simple and efficient, ensuring the timeliness of the determination of the highest temperature and providing an accurate basis for subsequent comparison with the highest temperature threshold.

[0085] S34. The control unit calculates the rate of temperature change per unit time based on the real-time temperature distribution signal and the historical temperature distribution signal in multiple consecutive sampling periods. Specifically, the real-time temperature distribution signal includes the real-time coordinate positions of multiple temperature sensors, their corresponding real-time temperature measurements, and real-time sampling times; the historical temperature distribution signal includes the historical coordinate positions of multiple temperature sensors, their corresponding historical temperature measurements, and historical sampling times; wherein the real-time coordinate position of each temperature sensor is consistent with its historical coordinate position.

[0086] Step S34 includes: Based on the real-time temperature measurement and sampling time of the i-th temperature sensor, and the historical temperature measurement and sampling time over multiple consecutive sampling periods corresponding to the i-th temperature sensor, a linear regression algorithm is used to calculate the slope of the temperature change over time at the location of the i-th temperature sensor, i.e., the rate of temperature change per unit time based on the i-th temperature sensor. This step S34 is performed for each temperature sensor until the rate of temperature change for each temperature sensor has been calculated.

[0087] Absolute temperature values ​​alone cannot predict sudden over-temperature faults. The rate of temperature change (dT / dt) reflects the speed of temperature rise. Even if the temperature does not reach the threshold, an excessively rapid rate of temperature rise may still cause a fault. Therefore, a linear regression algorithm is needed to fit multi-cycle temperature-time data from the same temperature sensor to calculate the rate of temperature rise and achieve over-temperature prediction. Step S34 aims to supplement over-temperature detection from the dimension of "temperature-time change trend," thereby enabling the prediction of over-temperature faults. It is an important component of temperature distribution characteristic values ​​and improves the dimensions for judging over-temperature faults.

[0088] S35. The control unit calculates the temperature distribution gradient within a unit spatial distance based on the temperature distribution model.

[0089] Specifically, the temperature distribution gradient reflects the temperature differences in different areas of a RAID card. Even if the absolute temperature value does not reach the threshold, an excessively large temperature gradient (such as local overheating) may still cause a failure. The temperature gradient vector is calculated based on the temperature distribution model, and its magnitude is the temperature distribution gradient, which can quantify the degree of non-uniformity in temperature distribution.

[0090] Step S35 includes: S351. The control unit calculates the temperature gradient vector based on the temperature distribution model T(x,y)=ax+by+c.

[0091] In this embodiment, step S351 specifically involves the control unit calculating the temperature gradient vector (∂T / ∂x,∂T / ∂y) based on the temperature distribution model T(x,y)=0.588x-0.059y+37.883 constructed in S322, where ∂T / ∂x=a=0.588℃ / unit x, and ∂T / ∂y=b=-0.059℃ / unit y.

[0092] S352. The control unit calculates the magnitude of the temperature gradient vector, which is the temperature distribution gradient.

[0093] In this embodiment, step S352 specifically involves having the control unit use the vector magnitude formula (√[(∂T / ∂x)). 2 +(∂T / ∂y) 2 The temperature gradient was calculated to be approximately √(0.588). 2 +(-0.059) 2 )≈0.591℃ / unit distance, which can be converted to ℃ / cm based on the actual coordinate units.

[0094] Step S35 aims to supplement overheat detection from the perspective of "temperature spatial distribution," identifying local overheating risks. It is a key component of temperature distribution characteristic values, enhancing the comprehensiveness of overheat fault diagnosis. The quantified temperature distribution gradient can accurately capture local overheating areas (e.g., 1 cm). 2 (Level) to avoid missed fault detection due to normal absolute temperature values ​​but uneven distribution; the model-based calculation method ensures the consistency and accuracy of gradient value calculation, providing a reliable indicator for subsequent comparison with temperature gradient thresholds, and improving the over-temperature detection dimension.

[0095] S4. The control unit compares the ripple power characteristic value with the preset power threshold and the temperature distribution characteristic value with the preset temperature threshold, and determines the fault level of the RAID card based on the comparison results.

[0096] Specifically, the preset temperature threshold includes a maximum temperature threshold, a temperature rise rate threshold, and a temperature gradient threshold.

[0097] Step S4 includes: S41. The control unit is instructed to compare the calculated ripple power characteristic value with a preset power threshold.

[0098] Specifically, the ripple power characteristic value quantifies the degree of abnormality of the current ripple. It needs to be compared with the preset power threshold (based on the current ripple power setting during normal operation of the RAID card) to determine whether the current ripple exceeds the normal range, thus providing a basis for power abnormality marking.

[0099] In this embodiment, step S41 specifically involves the control unit (MCU) retrieving the ripple power characteristic value (e.g., 20mW) calculated in S31, and simultaneously reading the preset power threshold (e.g., 18mW, based on the maximum ripple power setting when the RAID card is working normally). The two values ​​are then compared using built-in comparison logic to determine whether the ripple power characteristic value exceeds the preset power threshold.

[0100] Step S41 aims to make a preliminary judgment on the overcurrent status and is the core step in marking power anomalies. It directly affects the subsequent classification of fault levels and provides an overcurrent dimension basis for two-dimensional fault judgment. The direct numerical comparison method ensures the intuitiveness and accuracy of the judgment results; the preset power threshold is set based on the actual working characteristics of the RAID card to avoid overcurrent omissions caused by excessively high thresholds or misjudgments caused by excessively low thresholds, providing a scientific benchmark for power anomaly marking.

[0101] S42. When the ripple power characteristic value exceeds the preset power threshold, mark the power as abnormal.

[0102] Specifically, when the ripple power characteristic value exceeds the preset power threshold, it indicates that the RAID card has an overcurrent risk. This state needs to be recorded by marking it as "power abnormal" to provide a clear overcurrent dimension identifier for subsequent classification of fault levels in conjunction with temperature abnormality, and to avoid confusion of fault states.

[0103] In this embodiment, step S42 specifically involves the following steps: if the ripple power characteristic value (e.g., 20mW) in S41 exceeds the preset power threshold (e.g., 18mW), the control unit (MCU) sets the "power abnormality" flag bit (e.g., set to 1) in the internal register to record the current overcurrent risk status; if it does not exceed the threshold, the flag bit remains in its initial state (e.g., set to 0), indicating that the current current ripple is normal.

[0104] Step S42 aims to transform the overcurrent state into a logically verifiable identifier, serving as a bridge between overcurrent assessment and fault level classification, ensuring that fault information from the overcurrent dimension can be effectively utilized. The explicit flag setting allows the overcurrent state to be quickly identified by subsequent fault level assessment steps, avoiding information loss during state transmission; the binary state (0 / 1) of the flag is simple and easy to understand, ensuring the simplicity and reliability of the fault assessment logic and improving fault handling efficiency.

[0105] S43. The control unit is instructed to compare the highest temperature in the region with the highest temperature threshold, compare the temperature change with the temperature rise rate threshold, and compare the temperature distribution gradient with the temperature gradient threshold.

[0106] Specifically, temperature distribution characteristic values ​​(regional maximum temperature, temperature change rate, and temperature distribution gradient) reflect the overheating state from different dimensions. They need to be compared with the corresponding preset temperature thresholds (maximum temperature threshold, temperature rise rate threshold, and temperature gradient threshold) to comprehensively determine whether the temperature is abnormal and avoid misjudgment or omission of overheating caused by a single temperature index.

[0107] In this embodiment, step S43 specifically involves the control unit (MCU) retrieving the highest regional temperature (e.g., 46°C) obtained in S33, the temperature change rate corresponding to each temperature sensor (e.g., 5°C / s) obtained in S34, and the temperature distribution gradient (e.g., 10°C / cm) obtained in S35, and comparing these values ​​with preset maximum temperature thresholds (e.g., 50°C), preset temperature rise rate thresholds (e.g., 5°C / s), and preset temperature gradient thresholds (e.g., 10°C / cm), respectively, to determine whether each temperature indicator exceeds the threshold range.

[0108] Step S43 aims to complete a multi-dimensional assessment of over-temperature conditions and is the core step in marking temperature anomalies. It provides over-temperature dimensional evidence for dual-dimensional fault judgment, improving the comprehensiveness of fault assessment. The comparison of multi-dimensional temperature indicators with corresponding thresholds comprehensively covers temperature peaks, rates of change, and distribution uniformity, avoiding missed over-temperature detections due to a single indicator (e.g., temperature not reaching the peak but with excessively large gradients). Each threshold is set based on the RAID card's heat resistance characteristics, ensuring the scientific nature of the judgment criteria and providing a comprehensive basis for marking temperature anomalies.

[0109] S44. When the highest temperature in the region is greater than or equal to the highest temperature threshold, and / or the rate of temperature change is greater than the rate of temperature rise threshold, and / or the temperature distribution gradient is greater than the temperature gradient threshold, a temperature anomaly is marked.

[0110] Specifically, when any one of the highest temperature in the area, the rate of temperature change, or the temperature distribution gradient exceeds the corresponding preset threshold, it indicates that the RAID card is at risk of overheating. This state needs to be recorded by marking it as "temperature abnormal" to provide a clear overheating dimension for subsequent classification of fault levels in conjunction with power abnormality status, ensuring that overheating risks are not overlooked.

[0111] In this embodiment, step S44 specifically involves the following: when any one of the highest temperature in the area, the rate of temperature change, or the temperature distribution gradient exceeds the corresponding preset threshold, it indicates that the RAID card is at risk of overheating. This state needs to be recorded by marking it as "temperature abnormality" to provide a clear overheating dimension identifier for subsequent classification of fault levels based on power abnormality status, ensuring that the risk of overheating is not overlooked.

[0112] Step S44 aims to transform the over-temperature state into a logically verifiable identifier, serving as a bridge between over-temperature assessment and fault level classification, ensuring that fault information related to over-temperature can be effectively utilized. The "OR logic" marking method ensures that any temperature anomaly can be detected, avoiding missed over-temperature detections caused by multiple indicators exceeding limits simultaneously. Clearly defined marking bits allow for rapid identification of the over-temperature state in subsequent fault level assessment stages, improving the timeliness of fault handling.

[0113] S45. The control unit is instructed to determine the fault level based on the marked status of power abnormality and temperature abnormality.

[0114] Specifically, the fault level needs to be classified in combination with the combined state of power abnormality and temperature abnormality. Different combinations correspond to different fault severity: power abnormality alone (level 1 fault) has a small impact range, temperature abnormality alone (level 2 fault) has a medium risk, and both abnormalities (level 3 fault) have an extremely high risk. By combining the judgments, the fault level can be accurately classified, providing a basis for differentiated protection.

[0115] Further, step S45 includes: When the marked status shows power abnormality but no temperature abnormality, the fault level is determined to be a level one fault. When the marked status shows an abnormal temperature but no abnormal power, the fault level is determined to be a level two fault. When both power and temperature abnormalities are detected in the marked status, the fault level is determined to be a level three fault.

[0116] This step aims to clarify the severity of the fault and is a crucial link between fault diagnosis and protection execution. It directly determines the intensity and type of subsequent protection operations, ensuring the protection is targeted.

[0117] S5. The control unit generates a corresponding level of protection instruction based on the determined fault level, and drives the protection action execution unit to perform the corresponding protection operation based on the protection instruction.

[0118] Step S5 includes: When a level 1 fault is determined, the control unit generates a frequency reduction control command and sends the frequency reduction control command to the main control chip of the RAID card through the protection action execution unit, thereby driving the main control chip of the RAID card to perform a frequency reduction operation.

[0119] Specifically, a level 1 fault only poses an overcurrent risk (abnormal current ripple) and does not require power disconnection. By reducing the operating frequency of the RAID card's main control chip, the power consumption and operating current of the main control chip can be reduced, thereby eliminating the abnormal current ripple and achieving "burden-reducing" protection, thus avoiding the impact of excessive protection on the normal operation of the RAID card.

[0120] In this embodiment, specifically, when a Level 1 fault is determined, the control unit (MCU) generates a frequency reduction control command (containing a 30% frequency reduction parameter), transmits the command to the protection action execution unit via the SPI communication interface, and then the protection action execution unit sends it to the RAID card's main control chip. Upon receiving the command, the main control chip executes the 30% frequency reduction operation to reduce workload. This step provides targeted protection against mild overcurrent faults, preventing the fault from escalating while ensuring the RAID card's continued operation; it is the lightest level of protection in the three-level protection mechanism.

[0121] When a level 2 fault is determined, the control unit generates a forced cooling command and sends the forced cooling command to the main control chip of the RAID card through the protection action execution unit. The main control chip of the RAID card drives the cooling system of the RAID card to operate at full speed.

[0122] Specifically, a level 2 fault only poses a risk of overheating (abnormal temperature). It is necessary to quickly reduce the temperature of the RAID card by strengthening heat dissipation. Driving the cooling system (fan) to run at full speed can maximize heat dissipation efficiency, alleviate the temperature rise trend in time, and prevent the temperature from rising further and causing more serious faults.

[0123] In this embodiment, the specific step involves the control unit (MCU) generating a forced cooling command when a level 2 fault is detected. This command is then sent to the RAID card's main control chip via the signal transmission channel of the protection action execution unit. Upon receiving the command, the main control chip sends a full-speed control signal to the cooling system (fan). The fan immediately operates at its highest speed, accelerating heat dissipation from the RAID card. Full-speed fan operation can improve cooling efficiency by over 50%, rapidly reducing the RAID card temperature (typically a 5-8°C drop within 5-10 seconds), effectively mitigating overheating risks. Protection is achieved solely through enhanced cooling, without altering the RAID card's operating state, thus avoiding disruption to business operations and balancing protection effectiveness with operational continuity. This step aims to provide efficient cooling protection for minor overheating faults, quickly curbing temperature rises and preventing escalation of the overheating fault. It is a dedicated overheating measure within the level 3 protection mechanism.

[0124] When a level 3 fault is determined, the control unit generates a hardware power-off command and drives the protection action execution unit to perform a power-off operation based on the hardware power-off command. At the same time, the ripple power characteristic value, temperature distribution characteristic value and sampling time of this fault are recorded in a non-volatile memory.

[0125] Specifically, a level 3 fault is a dual abnormality of overcurrent and overtemperature, which is extremely risky. The power supply to the RAID card must be cut off immediately to stop the fault from escalating. The hardware fuse circuit can achieve a power cut-off of ≤8μs. At the same time, the fault data is recorded to provide a basis for subsequent fault investigation, realizing the integration of "emergency protection + fault tracing".

[0126] In this embodiment, this step specifically involves the following steps: When a level 3 fault is determined, the control unit (MCU) generates a hardware power-off command, driving the hardware fuse circuit in the protection action execution unit to quickly cut off the RAID card's power supply circuit (response ≤ 8μs). Simultaneously, the MCU reads the current ripple power characteristic value, temperature distribution characteristic value, and sampling time, and writes this data into a non-volatile memory (such as Flash) for storage, facilitating subsequent reading and analysis using debugging tools. The extremely fast response (≤ 8μs) of the hardware fuse circuit is much faster than the response of the software power-off scheme, cutting off the power supply before the fault escalates and preventing damage to the RAID card hardware. The recording of fault data provides direct evidence for subsequent troubleshooting of the fault cause (such as the root cause of overcurrent or the location of overtemperature), reducing maintenance time and costs and improving fault handling efficiency. This step performs emergency protection against severe dual faults, stopping the fault escalation to protect hardware safety, and simultaneously enabling fault data traceability; it is the highest level of protection measure in the three-level protection mechanism.

[0127] The above embodiments are preferred implementations of the present invention. In addition, the present invention can also be implemented in other ways. Any obvious substitutions without departing from the concept of the present technical solution are within the protection scope of the present invention.

Claims

1. A RAID card overcurrent and overtemperature detection and protection device, characterized in that, include: The ripple detection circuit, whose input is connected to the power supply circuit of the RAID card, is used to collect the working current signal and extract the characteristic ripple signal from it. The temperature signal acquisition module is equipped with multiple temperature sensors, which are arranged in predetermined positions on the RAID card to collect temperature distribution signals. The control unit has its signal input terminal connected to the output terminal of the ripple detection circuit and the signal output terminal of the temperature signal acquisition module, respectively, and is used to receive and process the characteristic ripple signal and the temperature distribution signal. The protection action execution unit has its control input terminal connected to the protection command output terminal of the control unit, and its power output terminal connected to the controlled node of the RAID card. The control unit is configured to evaluate the RAID card's operating status by analyzing the characteristic ripple signal and temperature distribution signal, and output corresponding level protection commands to the protection action execution unit based on the evaluation results.

2. The RAID card overcurrent and overtemperature detection and protection device according to claim 1, characterized in that, The ripple detection circuit includes a bandpass filter module and a signal rectification module; the input terminal of the bandpass filter module is connected to the power supply circuit of the RAID card, and the output terminal of the bandpass filter module is connected to the input terminal of the signal rectification module; the output terminal of the signal rectification module is connected to the control unit.

3. The RAID card overcurrent and overtemperature detection and protection device according to claim 1, characterized in that, The temperature signal acquisition module includes three temperature sensors, which are arranged in a triangle on the RAID card with a spacing of 10-15mm.

4. The RAID card overcurrent and overtemperature detection and protection device according to claim 1, characterized in that, The protection action execution unit includes a hardware fuse circuit. The power supply input terminal of the hardware fuse circuit is used to connect to the power supply circuit of the RAID card, the control input terminal is connected to the protection command output terminal of the control unit, and the power output terminal is connected to the controlled node of the RAID card.

5. A method for overcurrent and overtemperature detection and protection of a RAID card, characterized in that, The process is performed using the RAID card overcurrent and overtemperature detection and protection device as described in any one of claims 1 to 4, and includes the following steps: The operating current signal of the RAID card is acquired by a ripple detection circuit, the characteristic ripple signal is extracted, and the characteristic ripple signal is transmitted to the control unit. The temperature signal acquisition module acquires the real-time temperature distribution signal on the RAID card and transmits the real-time temperature distribution signal to the control unit. The control unit extracts ripple power characteristic values ​​representing the characteristics of current ripple based on the characteristic ripple signal, and calculates temperature distribution characteristic values ​​based on the real-time temperature distribution signal and the pre-acquired historical temperature distribution information; The control unit compares the ripple power characteristic value with a preset power threshold and the temperature distribution characteristic value with a preset temperature threshold, and determines the fault level of the RAID card based on the comparison results. The control unit generates a corresponding level of protection command based on the determined fault level, and drives the protection action execution unit to perform the corresponding protection operation based on the protection command.

6. The RAID card overcurrent and overtemperature detection and protection method according to claim 5, characterized in that, The step of acquiring the operating current signal of the RAID card through the ripple detection circuit, extracting the characteristic ripple signal therein, and transmitting the characteristic ripple signal to the control unit includes: The operating current signal in the RAID card power supply circuit is acquired through the input terminal of the ripple detection circuit. The ripple detection circuit extracts the ripple component that conforms to the preset frequency band from the operating current signal and converts the ripple component into a DC voltage signal. The DC voltage signal is transmitted to the control unit as the characteristic ripple signal.

7. The RAID card overcurrent and overtemperature detection and protection method according to claim 5, characterized in that, The temperature distribution characteristic values ​​include the region's highest temperature, the rate of temperature change, and the temperature distribution gradient; The step of having the control unit extract ripple power characteristic values ​​representing the characteristics of the current ripple based on the characteristic ripple signal, and calculate temperature distribution characteristic values ​​based on the real-time temperature distribution signal and pre-acquired historical temperature distribution information, includes: The control unit performs power calculation on the characteristic ripple signal to obtain the ripple power characteristic value; The control unit constructs a temperature distribution model of the RAID card based on the real-time temperature distribution signal using a planar interpolation algorithm, and calculates the estimated current temperature of the specified target location based on the temperature distribution model. The control unit confirms the highest temperature in the region based on the real-time temperature distribution signal and the estimated current temperature. The control unit calculates the rate of temperature change per unit time based on the real-time temperature distribution signal and the historical temperature distribution signal within multiple consecutive sampling periods. The control unit calculates the temperature distribution gradient within a unit spatial distance based on the temperature distribution model.

8. The RAID card overcurrent and overtemperature detection and protection method according to claim 5, characterized in that, The preset temperature threshold includes a maximum temperature threshold, a temperature rise rate threshold, and a temperature gradient threshold. The steps of comparing the ripple power characteristic value with a preset power threshold and comparing the temperature distribution characteristic value with a preset temperature threshold through the control unit, and determining the fault level of the RAID card based on the comparison results, include: The control unit is instructed to compare the calculated ripple power characteristic value with a preset power threshold. When the ripple power characteristic value exceeds the preset power threshold, a power anomaly is marked. The control unit is instructed to compare the highest temperature in the region with the highest temperature threshold, compare the temperature change with the temperature rise rate threshold, and compare the temperature distribution gradient with the temperature gradient threshold. A temperature anomaly is marked when the highest temperature in the region is greater than or equal to the highest temperature threshold, and / or the rate of temperature change is greater than the rate of temperature rise threshold, and / or the temperature distribution gradient is greater than the temperature gradient threshold; The control unit determines the fault level based on the flags indicating abnormal power and abnormal temperature.

9. The RAID card overcurrent and overtemperature detection and protection method according to claim 8, characterized in that, The step of instructing the control unit to determine the fault level based on the marked states of power anomaly and temperature anomaly includes: When the marked status shows power abnormality but no temperature abnormality, the fault level is determined to be a level one fault. When the marked status shows an abnormal temperature but no abnormal power, the fault level is determined to be a level two fault. When both power and temperature abnormalities are detected in the marked status, the fault level is determined to be a level three fault.

10. The RAID card overcurrent and overtemperature detection and protection method according to claim 9, characterized in that, The step of instructing the control unit to generate a corresponding level of protection command based on the determined fault level, and driving the protection action execution unit to perform corresponding protection operations based on the protection command, includes: When a level one fault is determined, the control unit generates a frequency reduction control command and sends the frequency reduction control command to the main control chip of the RAID card through the protection action execution unit, thereby driving the main control chip of the RAID card to perform a frequency reduction operation. When a level 2 fault is determined, the control unit generates a forced cooling command and sends the forced cooling command to the main control chip of the RAID card through the protection action execution unit. The main control chip of the RAID card drives the cooling system of the RAID card to operate at full speed. When a level 3 fault is determined, the control unit generates a hardware power-off command and drives the protection action execution unit to perform a power-off operation based on the hardware power-off command. At the same time, the ripple power characteristic value, temperature distribution characteristic value and sampling time of this fault are recorded in a non-volatile memory.

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