Camera device

Abstract

A camera device includes: a first printed circuit board (PCB) section provided with a first ground contact surface; a second PCB segment provided with an opening defined by a portion of the second PCB segment forming the second ground contact surface; the base is made of a conductive material; a clip made of a conductive material and snapped to the base; wherein the base is configured to support the image sensor and a first PCB segment and a second PCB segment, where the first PCB segment is disposed between the chassis and the second PCB segment, where the clip includes: a first contact portion abutting a first ground contact surface of the first PCB segment; and a second contact portion extending through the opening of the second PCB segment and engaging a second ground contact surface of the second PCB segment.

Description

Technical Field

[0001] This invention relates to camera devices. Background Technology

[0002] Camera devices are commonly used for surveillance and can be used in a variety of locations. They can be placed both indoors and outdoors, such as in ATMs, banks, shops, and hotels. They can also be placed on different types of vehicles, such as public transportation, police cars, ambulances, and race cars. These types of installation locations are typically in confined spaces and require the camera devices to be compact and inconspicuous.

[0003] However, a compact camera setup will influence the construction of different components to fit into a small camera housing. This may limit which components can be used, and consequently, impose limitations on the camera's resolution. Therefore, a compact camera setup may compromise image quality and resolution.

[0004] Therefore, there is a need for improved camera devices. Summary of the Invention

[0005] To achieve at least one of the above objectives and also other objectives that will become apparent from the following description, according to the invention, an apparatus having the features defined in claim 1 is provided. Preferred embodiments will become apparent from the dependent claims.

[0006] More specifically, according to a first aspect of the invention, a camera device is provided, comprising: a first printed circuit board (PCB) segment having a first ground contact surface; a second PCB segment having an opening defined by a portion of the second PCB segment forming a second ground contact surface; a base made of a conductive material; and a clip made of a conductive material and snapped onto the base; wherein the base is configured to support an image sensor and the first and second PCB segments, wherein the first PCB segment is disposed between the base and the second PCB segment, and wherein the clip includes: a first contact portion adjacent to the first ground contact portion of the first PCB segment; and a second contact portion extending through the opening of the second PCB segment and engaging the second ground contact surface of the second PCB segment.

[0007] During assembly and use of both, clips are used to hold the first and second PCB segments in place.

[0008] Because the clip is conductive, it is also used for grounding the first and second PCB segments. By engaging the first and second grounding contact surfaces of the first and second PCB segments while being snapped onto the conductive base, any power spikes can be diverted through the clip instead of the connected PCB segments. This protects the electronic components on the first and second PCB segments from damage caused by such power spikes.

[0009] The clip is made of a conductive material. For example, the clip can be stamped from a sheet of steel or any other suitable material and then bent into its shape. However, the clip can include a variety of materials, some of which may not be conductive.

[0010] Conductive materials should be understood as materials that have high electrical conductivity compared to other materials. For example, materials such as copper or aluminum are considered to have high electrical conductivity.

[0011] The camera device's construction allows PCB segments to be stacked on top of each other, resulting in greater space efficiency. The PCB segments can be connected via flexible cables or flexible printed circuit (FPC) film layers in each PCB segment. Alternatively, board-to-board connectors can be used. In other words, the first and second PCB segments can be two separate PCBs connected to each other via flexible cables. Alternatively, the first and second PCB segments can be parts of a single PCB. A single PCB can be divided into first and second PCB segments by removing a hard layer from the single PCB between the first and second PCB segments, allowing the first and second PCB segments to be flexibly connected via FPC film. Alternatively, a single PCB can be manufactured so that no hard layer exists between the PCB segments.

[0012] The clip may include at least two legs extending parallel to the longitudinal axis of the camera assembly. The at least two legs may straddle the first PCB segment, and each of the at least two legs may have a distal end configured for snap-attaching to the base.

[0013] For example, at least two legs can extend along the longitudinal axis on opposite sides of the first PCB segment.

[0014] The clip may include a bridging portion extending perpendicular to the longitudinal axis and connecting at least two legs. The bridging portion may include a first contact portion.

[0015] In other words, the clamp can hold the first PCB segment in place through the clamping force between the bridging portion of the clamp and the base. Because the bridging portion applies clamping force to the clamp, it ensures that the first contact portion of the clamp is always in electrical contact with the first ground contact surface of the first PCB segment. This ensures that the first PCB segment always has a ground connection when the camera assembly is assembled.

[0016] The clip may include a retainer portion extending parallel to the longitudinal axis of the camera assembly. The retainer portion may have a distal portion configured to be inserted into an opening in a second PCB segment to establish a spring-biased engagement between the retainer portion and the second PCB segment. The distal portion may include a second contact portion.

[0017] The spring-biased engagement between the retainer section and the second PCB segment holds the second PCB segment in place by preventing displacement in the transverse longitudinal axis direction. However, the spring-biased engagement still allows some movement of the second PCB segment in the longitudinal axis direction. This allows the camera assembly to be manufactured with larger tolerances, which facilitates production and reduces the manufacturing cost of the camera assembly.

[0018] The spring-biased engagement also ensures that the second PCB segment always has a ground connection when the camera assembly is in place.

[0019] The retainer portion can extend from the bridging portion.

[0020] For example, the retainer portion may extend in a direction parallel to the longitudinal axis of the camera assembly or in a direction transverse to the longitudinal axis of the camera assembly.

[0021] The retainer section can be extended with an offset relative to the vertical axis.

[0022] In other words, the retainer portion can extend from the bridging portion, such that the extended portion of the retainer portion is separated from the longitudinal axis.

[0023] The distal portion can be roughly U-shaped.

[0024] In other words, the distal portion of the retainer part of the clip can be bent so that a spring-like force can be applied between the two points of the distal portion that contact the second PCB segment.

[0025] The distal portion may include a retaining edge configured such that the retainer portion is restricted from being inserted into the opening of the second PCB segment beyond the retaining edge.

[0026] In other words, the edge is kept in place to ensure that the second PCB segment is not pushed beyond the retainer portion, thereby losing the spring bias engagement between the second PCB segment and the retainer portion.

[0027] A retaining edge can be formed by bending the distal portion to create an edge. However, various variations of the retaining edge are possible. For example, the retaining edge can be a protrusion extending from the distal portion. This protrusion can be integrally formed with a clip. Alternatively, this protrusion can be a separate portion that is secured to the distal portion by any suitable fastening device.

[0028] The clip can be configured to slide engage with the base when snapped onto it.

[0029] In other words, the clip is detachably attached to the base, preventing it from moving along the longitudinal axis of the camera assembly. However, when assembling the camera assembly, the clip can slide along the base until it reaches its end position and snaps into place within the base.

[0030] The camera assembly may further include a third PCB segment providing an image sensor. The third PCB segment may be arranged between the base and the first PCB segment.

[0031] The third PCB segment can be connected to the first PCB segment via an FPC film or a flexible cable. Several different combinations of connections between the PCB segments are possible. For example, the first, second, and third PCB segments can be three separate PCBs connected by a flexible cable. Alternatively, the first, second, and third PCB segments can be portions of a single PCB divided into three PCB segments. The rigid layer of the individual PCBs between the three PCB segments may be absent, allowing the three PCB segments to be flexibly connected via an FPC film. Alternatively, the first and second PCB segments can be connected via an FPC film, while the third PCB segment is connected to the first PCB segment via a flexible cable, and vice versa.

[0032] When assembling the camera unit, the third PCB segment, which provides the image sensor, can initially float when placed on the base.

[0033] This enables active alignment of the image sensor. Consequently, camera sensors requiring active alignment can be used in camera devices. Such camera sensors typically have higher resolution than those requiring only passive alignment. After the active alignment of the image sensor, the third PCB segment is secured to the mounting base.

[0034] In addition, the third PCB can be connected to the base ground.

[0035] The camera device may further include a heat dissipation component disposed between the third PCB segment and the first PCB segment.

[0036] Heat sinks can dissipate heat from the image sensor that could otherwise affect image quality.

[0037] The camera device may further include a housing surrounding the first PCB segment and the second PCB segment.

[0038] The housing may completely surround the first and second PCB segments. Alternatively, the housing may be interrupted, such that it partially surrounds the first and second PCB segments. The base and housing are separate components and are formed as separate units that are not electrically connected to each other.

[0039] The camera device may further include a lens unit.

[0040] According to a second aspect of the invention, a camera system is provided, comprising: a processing unit; and at least one camera device according to a first aspect of the invention, the at least one camera device being connected to the processing unit.

[0041] In other words, the camera system may include a plurality of camera devices according to the first aspect of the invention, each camera being connected to the processing unit.

[0042] According to a third aspect of the invention, a method for assembling a camera device is provided, the camera device comprising:

[0043] A first PCB segment is provided with a first ground contact surface; a second PCB segment is provided with an opening defined by a portion of the second PCB segment forming a second ground contact surface; a third PCB segment is provided with an image sensor; a heat dissipation member; a base made of a conductive material; and a clip made of a conductive material, including a first contact portion and a second contact portion, and configured to snap onto the base. The method includes: attaching the third PCB segment to the base; arranging the heat dissipation member on the third PCB segment; arranging the first PCB segment on the heat dissipation member; snapping the clip onto the base such that the clip surrounds the first PCB segment and the first contact portion of the clip abuts the first ground contact surface of the first PCB segment; arranging the second PCB segment on the clip such that the second contact portion of the clip extends through the opening of the second PCB segment and engages the second ground contact surface of the second PCB segment, thereby restricting movement of the first PCB segment and the second PCB segment in a direction transverse to the longitudinal axis of the camera device.

[0044] Any benefits or technical effects already discussed with respect to the first aspect of the invention or any variation thereof may be applied to the second and third aspects of the invention or any variation thereof, and will not be repeated to avoid undue repetition.

[0045] Generally, unless expressly defined herein, all terms used in the claims should be interpreted according to their ordinary meaning in the art. Unless otherwise expressly stated, all references to “a / an / the [element, device, component, apparatus, step, etc.]” ​​should be openly interpreted as referring to at least one instance of said element, device, component, apparatus, step, etc. Unless expressly stated otherwise, the steps of any method disclosed herein need not be performed in the order disclosed. Attached Figure Description

[0046] The above and additional objects, features and advantages of the invention will be better understood from the following illustrative and non-limiting detailed description of preferred embodiments of the invention with reference to the accompanying drawings, in which the same reference numerals will be used for similar elements, wherein:

[0047] Figure 1 It is a perspective view of the camera setup;

[0048] Figure 2 This is a perspective view of a section of the PCB.

[0049] Figure 3a This is a perspective view of the clip;

[0050] Figure 3b This is the front view of the clip;

[0051] Figure 3c This is a side view of the clip; and

[0052] Figure 4 This is an exploded view of the camera setup; Detailed Implementation

[0053] The invention will now be described more fully with reference to the accompanying drawings, in which presently preferred embodiments of the invention are illustrated. However, the invention may be implemented in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided for thoroughness and completeness and to fully convey the scope of the invention to those skilled in the art.

[0054] Figure 1 This is a perspective view of a camera device 1 according to a first aspect of the present invention. The camera device 1 includes a first PCB segment 10. The first PCB segment 10 is provided with a first ground contact surface 12. The camera device 1 further includes a second PCB segment 20. The second PCB segment 20 is provided with an opening 21. The opening 21 is defined by a portion of the second PCB segment 20 forming a second ground contact surface 22.

[0055] The camera device 1 further includes a base 40 made of a conductive material. The camera device 1 also includes a clip 50 made of a conductive material. It should be understood that the base 40 and clip 50 may also comprise other materials that are conductive or non-conductive. The clip 50 is snapped onto the base 40.

[0056] The base 40 is configured to support the image sensor, the first PCB segment 10, and the second PCB segment 20. The first PCB segment 10 is arranged between the base 40 and the second PCB segment 20.

[0057] The clip 50 includes a first contact portion 51 adjacent to a first ground contact surface 12 of the first PCB segment 10. The clip 50 further includes a second contact portion 52 extending through an opening 21 of the second PCB segment 20. The second contact portion 52 engages with a second ground contact surface 22 of the second PCB segment 20.

[0058] The camera device 1 further includes a second PCB segment 30. A third PCB segment 30 is provided with an image sensor. The third PCB segment 30 is arranged between the base and the first PCB segment 10.

[0059] exist Figure 2 The PCB segments are shown in more detail below. Here, the first PCB segment 10 and the second PCB segment 20 are flexibly connected by an FPC film 11. The first PCB segment 10 and the third PCB segment 30 are connected in the same manner. Therefore, the first PCB segment 10, the second PCB segment 20, and the third PCB segment 30 are portions of a single PCB that are connected to each other by an FPC film 11 that is one or more layers for a single PCB. Here, there are no rigid layers between the PCB segments.

[0060] As Figure 2 As shown in the alternative, the PCB segment can be three separate PCBs connected to each other by a flexible cable.

[0061] Refer again Figure 1 The camera device 1 further includes a heat dissipation member 60. The heat dissipation member 60 is arranged between the third PCB segment 30 and the first PCB segment 10. The heat dissipation member 60 dissipates heat from the image sensor provided on the third PCB segment 30.

[0062] Figures 3a to 3c The clip 50 is shown in more detail. As can be seen here, the clip 50 includes two legs 53. When the camera assembly 1 is mounted, the two legs 53 extend in a direction parallel to the longitudinal axis of the camera assembly 1. Figure 1 As seen in the image, in the assembled state of the camera device, the two legs 53 are configured as straddles of the first PCB segment 10. (Reference) Figure 3b Each of the two legs 53 is provided with a distal end 54. The distal end 54 is configured for snap-fit ​​attachment to the base 40. Additionally, the clip 50 is configured for sliding engagement with the base 40 when snapped onto it. That is, the two legs 53 are flexibly resilient such that when the clip 50 is positioned to straddle the first PCB segment 10, the legs 53 will bend outward and slide along the side surfaces of the heat sink 60 and the base 40 until the two legs 53 reach their end positions and snap into the base 40.

[0063] The clip 50 further includes a bridging portion 55. When the camera assembly 1 is mounted, the bridging portion 55 extends in a direction perpendicular to the longitudinal axis of the camera assembly 1. Figures 3a to 3b As seen in the image, the bridging section 55 connects the two legs 53.

[0064] The bridging portion 55 also includes the first contact portion 51 of the clip 50. (As in...) Figure 1 As seen in the image, the first contact portion 51 of the clip 50 is adjacent to the first ground contact surface 12 of the first PCB segment 10. Thus, the first PCB segment 10 has a ground connection via the clip 50 connected to the conductive base 40.

[0065] The bridging portion 55 is not a perfectly flat surface. For example... Figure 3b As best illustrated, the bridging portion 55 includes a flexible portion 56, allowing a spring-biased engagement to be established between the clip 50 and the base 40. Thus, the first PCB segment 10 is held in place during and after the assembly of the camera assembly 1. The clamping force applied to the bridging portion 55 on the first PCB segment 10 ensures that the first PCB segment 10 always has a ground connection when the camera assembly 1 is assembled.

[0066] refer to Figure 3c The clip 50 includes a retainer portion 57. When the camera assembly 1 is mounted, the retainer portion 57 extends in a direction parallel to the longitudinal axis of the camera assembly 1. The retainer portion 57 extends from the bridging portion 55. Here, the retainer portion 57 extends with an offset relative to the longitudinal axis.

[0067] Furthermore, the retainer portion 57 has a distal portion 58. The distal portion 58 includes a second contact portion 52. Additionally, as... Figure 1 As shown, the distal portion 58 is configured to be inserted into the opening 21 of the second PCB segment 20. The opening 21 is shaped complementaryly to the distal portion 58, such that when the distal portion 58 is inserted, a spring-biased engagement is established between the retainer portion 57 and the second PCB segment 20. Thus, the second PCB segment 20 is held in place during and after the assembly of the camera assembly 1. Additionally, the distal portion 58 includes a second contact portion 52. Therefore, the spring-biased engagement between the retainer portion 57 and the second PCB segment 20 ensures that engagement between the second ground contact surface 22 and the second contact portion 52 of the clip is always present. In other words, the spring-biased engagement ensures the grounding connection of the second PCB segment 20.

[0068] The distal portion 58 is substantially U-shaped. Furthermore, the distal portion 58 includes a retaining edge 59. The retaining edge 59 is configured such that the retainer portion 57 is restricted from extending beyond the retaining edge 59 when inserted into the opening 21 of the second PCB segment 20. Here, the retaining edge 59 is the bent end of the retainer portion and is therefore integrally formed with the clip 50. The retaining edge 59 prevents movement of the second PCB segment 20 in the direction transverse to the longitudinal axis of the camera device 1. However, some movement along the longitudinal axis is still permitted.

[0069] Figure 4 An exploded view of camera assembly 1 is shown. Figure 4 The camera assembly further includes a housing 70. The housing 70 surrounds three PCB segments. In the assembled state of the camera assembly 1, the housing 70 is connected to the base 40. However, the housing 70 is not electrically connected to the base 40.

[0070] The camera assembly 1 further includes a lens unit 80. The lens unit 80 is detachably connected to the base 40. Here, the lens unit 80 and the base 40 are connected to each other by a threaded connection. However, it should be understood that several different variations of the connection between the base 40 and the lens unit 80 are possible.

[0071] The camera assembly 1 further includes components such as a base backplate 90, a sensor pad 91, a wave spring 92, an O-ring 93, a nut SMA connector 94, a cap 95, and a screw 96.

[0072] According to a second aspect of the invention, a camera system is provided. (See reference...) Figures 1 to 4 The camera system includes a processing unit and at least one camera device 1 according to a first aspect of the invention. The at least one camera device 1 is connected to the processing unit.

[0073] The method for assembling a camera device according to the third aspect of the present invention will be described in more detail below. Here, the camera device 1 to be assembled is the one described above. Figures 1 to 4 The same camera device 1 is described. Therefore, some details about camera device 1 will be omitted to avoid undue repetition.

[0074] refer to Figure 4The camera device 1 includes a first PCB segment 10. The first PCB segment is provided with a first ground contact surface 12. The camera device 1 further includes a second PCB segment 20 provided with an opening 21. The opening 21 is defined by a portion of the second PCB segment 20 forming a second ground contact surface 22. The camera device 1 further includes a third PCB segment 30. The third PCB segment 30 is provided with an image sensor. The camera device 1 further includes a heat dissipation member 60. The camera device 1 further includes a base 40. The base 40 is made of a conductive material. The camera device 1 further includes a clip 50 made of a conductive material. The clip 50 includes a first contact portion 51 and a second contact portion 52. The clip 50 is further configured to snap onto the base. Here, the camera device 1 further includes a lens unit 80.

[0075] The method of assembling the camera device 1 includes attaching the lens unit 80 to the base 40. Subsequently, after providing active alignment of the image sensor on the third PCB segment 30, the third PCB segment 30 is attached to the base 40. Then, a heat dissipation member 60 is arranged on the third PCB segment 30. Next, a first PCB segment 10 is arranged on the heat dissipation member 60. This is followed by snapping a clip 50 onto the base 40 such that the clip surrounds the first PCB segment 10, and the first contact portion 51 of the clip 50 abuts against the first ground contact surface 12 of the first PCB segment 10. Then, a second PCB segment 20 is arranged on the clip 50 such that the second contact portion 52 of the clip extends through the opening 21 of the second PCB segment 20 and engages the second ground contact surface 22 of the second PCB segment 20. Thus, the clip restricts the movement of the first PCB segment 10 and the second PCB segment 20 in the direction transverse to the longitudinal axis of the camera device 1.

[0076] It will be understood that the invention is not limited to the embodiments shown. Therefore, several modifications and variations are conceived within the scope of the invention as specifically defined by the appended claims.

Claims

1. A camera device (1), comprising: The first printed circuit board (PCB) segment (10) is provided with a first ground contact surface (12); The second PCB segment (20) is provided with an opening (21) defined by a portion of the second PCB segment (20) forming a second ground contact surface (22); The base (40) is made of conductive material; The clip (50) is made of conductive material and is snapped onto the base (40); The base (40) is configured to support the image sensor and the first PCB segment (10) and the second PCB segment (20). The first PCB segment (10) is arranged between the base (40) and the second PCB segment (20). The clip (50) includes: a first contact portion (51) adjacent to the first ground contact surface (12) of the first PCB segment (10); and a second contact portion (52) extending through the opening (21) of the second PCB segment (20) and engaging the second ground contact surface (22) of the second PCB segment (20). The clip includes at least two legs (53) extending parallel to the longitudinal axis of the camera device (1), wherein the at least two legs (53) straddle the first PCB segment (10), and wherein each of the at least two legs (53) is provided with a distal end (54) configured for snap-attaching to the base (40).

2. The camera device (1) according to claim 1, wherein, The clip (50) includes a bridging portion (55) extending perpendicular to the longitudinal axis and connecting the at least two legs (53), wherein the bridging portion (55) includes the first contact portion (52).

3. The camera device (1) according to claim 1, wherein, The clip (50) includes a retainer portion (57) extending parallel to the longitudinal axis of the camera device (1), the retainer portion (57) having a distal portion (58) configured to be inserted into the opening (21) of the second PCB segment (20) to establish a spring-biased engagement between the retainer portion (57) and the second PCB segment (20), wherein the distal portion (58) includes the second contact portion (52).

4. The camera device (1) according to claim 3, wherein, when subordinate to claim 3, The retainer portion (57) extends from the bridging portion (55).

5. The camera device (1) according to claim 4, wherein, The retainer portion (57) extends with an offset relative to the longitudinal axis.

6. The camera device (1) according to claim 3, wherein, The distal portion (58) is substantially U-shaped.

7. The camera device (1) according to claim 3, wherein, The distal portion (58) includes a retaining edge (59) configured such that the retainer portion (57) is restricted from being inserted into the opening (21) of the second PCB segment (20) beyond the retaining edge (59).

8. The camera device (1) according to claim 1, wherein, The clip (50) is configured to slide engage with the base (40) when snapped onto the base (40).

9. The camera device (1) according to claim 1, wherein, The camera device (1) further includes a third PCB segment (30) on which the image sensor is provided, the third PCB segment (30) being disposed between the base (40) and the first PCB segment (10).

10. The camera device (1) according to claim 9, wherein, The camera device (10) further includes a heat dissipation component (60) disposed between the third PCB segment (30) and the first PCB segment (10).

11. The camera device (1) according to claim 1, wherein, The camera device (1) further includes a housing (70) surrounding the first PCB segment (10) and the second PCB segment (20).

12. The camera device (1) according to claim 1, wherein, The camera device (1) further includes a lens unit (80).

13. A camera system comprising: Processing unit; At least one camera device (1) according to any one of claims 1 to 12 is connected to the processing unit.

14. A method for assembling a camera device (1), the camera device (1) comprising: The first PCB segment (10) is provided with a first grounding contact surface (12); The second PCB segment (20) is provided with an opening (21) defined by a portion of the second PCB segment (20) forming a second ground contact surface (22); The third PCB segment (30) is equipped with an image sensor; Heat dissipation component (60); The base (40) is made of conductive material; A clip (50), made of conductive material, includes a first contact portion (51) and a second contact portion (52), and is configured to snap onto the base (40), the method comprising: The third PCB segment (30) is attached to the base (40). The heat dissipation component (60) is arranged on the third PCB segment (30); The first PCB segment (10) is arranged on the heat dissipation component (60); The clip (50) is snapped onto the base (40) such that the clip (50) surrounds the first PCB segment (10) and the first contact portion (51) of the clip (50) is adjacent to the first ground contact surface (12) of the first PCB segment (10). The second PCB segment (20) is arranged on the clip (50) such that the second contact portion (52) of the clip (50) extends through the opening (21) of the second PCB segment (20) and engages the second ground contact surface (22) of the second PCB segment (20). Thus, the clamp (50) restricts the movement of the first PCB segment (10) and the second PCB segment (20) in the direction that crosses the longitudinal axis of the camera device (1).

Images