Circuit board assembly and communication equipment
By employing a layered circuit board design and optical module connectors in communication equipment, the problem of low circuit board deployment efficiency is solved, achieving more efficient signal transmission and electromagnetic shielding, and reducing costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- NEW H3C TECH CO LTD
- Filing Date
- 2026-03-23
- Publication Date
- 2026-05-15
AI Technical Summary
The deployment efficiency of circuit boards in communication equipment is low, especially the concentrated deployment of high-speed signal lines, which leads to increased wiring density and number of layers, affecting signal quality.
The design employs a layered approach, using a first circuit board as a high-speed signal board and a second circuit board as a low-speed signal board. The two are connected via an optical module connector. The second circuit board supports the optical module connector, reducing the need for a high-speed signal board and achieving a stable connection through the use of connector holes and pins.
It improves the deployment efficiency of circuit boards, reduces the cost of circuit boards, and enhances electromagnetic shielding and signal transmission reliability.
Smart Images
Figure CN122054450A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present specification relates to the technical field of electronics, and in particular to a circuit board assembly and a communication device. BACKGROUND
[0002] With the development of communication technology, communication devices develop towards high-speed transmission, and the requirement for signal quality is also increasingly high. Correspondingly, the wiring density and the number of layers of the circuit board, which carries signal transmission, are also gradually increased. However, in the circuit board of the communication device, the deployment of the high-speed signal line is relatively concentrated, and the deployment efficiency of the circuit board is low. Therefore, how to improve the deployment efficiency of the circuit board in the communication device is a problem to be solved by those skilled in the art. SUMMARY
[0003] In order to overcome the problems in the related art, the present specification provides a circuit board assembly and a communication device.
[0004] According to a first aspect of an embodiment of the present specification, a circuit board assembly is provided, comprising: a first circuit board, wherein the first circuit board is a high-speed signal board, a high-speed signal line and a signal pad are deployed in the first circuit board, and the signal pad is electrically connected with the high-speed signal line; a second circuit board, wherein the second circuit board is a low-speed signal board, and a plug-in hole is deployed on the surface of the second circuit board; an optical module connector; The optical module connector comprises: an optical module cage, a lower surface of a front side of the optical module cage is formed with a pin, and the pin is plugged into the plug-in hole on the second circuit board; a connector provided on the rear side of the optical module cage, a high-speed signal pin of the connector extends from the lower surface of the optical module cage, and is electrically connected with the signal pad provided on the first circuit board on the rear side of the optical module connector.
[0005] Optionally, the first circuit board further comprises: an indicator light; a light guide strip, one end of the light guide strip corresponds to the indicator light, and the other end of the light guide strip extends along the upper surface of the optical module cage to the front side of the optical module connector.
[0006] Optionally, the first circuit board and the second circuit board are connected through a fixing member.
[0007] Optionally, the first circuit board and the second circuit board are bonded.
[0008] Optionally, the number of the second circuit boards is the same as the number of the optical module connectors. Each of the second circuit boards corresponds to one optical module connector.
[0009] Optionally, the insertion holes of the second circuit board are metallized holes, and a first ground layer is deployed in the second circuit board, wherein the insertion holes are electrically connected to the first ground layer.
[0010] Optionally, a second ground layer is also formed in the first circuit board, and the first ground layer and the second ground layer are electrically connected.
[0011] Optionally, the number of optical module connectors is two sets; The high-speed signal pins of the connectors in the first group of optical module connectors are inserted from above into the signal pads located on the first surface of the first circuit board; The high-speed signal pins of the connectors in the second set of optical module connectors are inserted from below into the signal pads located on the second surface of the first circuit board; The pins of the first set of optical module connectors are inserted into the insertion holes on the third surface of the second circuit board from above, and the pins of the second set of optical module connectors are inserted into the insertion holes on the fourth surface of the second circuit board from above.
[0012] Optionally, the first circuit board further includes: Indicator lights are respectively disposed on the first surface and the second surface of the first circuit board; Two sets of light guide strips, wherein one end of the first set of light guide strips corresponds to the indicator light located on the first surface, and the other end of the first set of light guide strips extends along the upper surface of the optical module cage of the first set of optical module connectors to the front side of the first set of optical module connectors; one end of the second set of light guide strips corresponds to the indicator light located on the second surface, and the other end of the second set of light guide strips extends along the upper surface of the optical module cage of the second set of optical module connectors to the front side of the second set of optical module connectors.
[0013] According to a second aspect of the embodiments of this specification, a communication device is provided, comprising: The circuit board assembly described in any of the preceding claims; and, Optical module; The optical module is plugged into the optical module connector in the circuit board assembly.
[0014] The technical solutions provided in the embodiments of this specification may include the following beneficial effects: In the embodiments described in this specification, the structure of the circuit board assembly described above allows the first circuit board for transmitting high-speed signals to be disposed on the rear side of the optical module connector. The front side of the optical module connector achieves holding force through the pins formed on the lower surface of the optical module cage and the action of the second circuit board, thereby reducing the amount of the first circuit board required as a high-speed signal board in the communication equipment and improving the deployment efficiency of the circuit board in the communication equipment.
[0015] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this specification. Attached Figure Description
[0016] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this specification and, together with the description, serve to explain the principles of this specification.
[0017] Figure 1 This is a schematic diagram of the structure of a circuit board assembly involved in this application; Figure 2 This is a schematic diagram of the structure of a communication device involved in this application; Figure 3 This is a schematic diagram of the structure of a circuit board assembly according to an embodiment of this application; Figure 4 This is a schematic diagram of the structure of a communication device according to an embodiment of this application. Detailed Implementation
[0018] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this specification. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this specification as detailed in the appended claims.
[0019] The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of this specification. The singular forms “a,” “the,” and “the” as used in this specification and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.
[0020] It should be understood that although the terms first, second, third, etc., may be used in this specification to describe various information, this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another.
[0021] This application provides a circuit board assembly 100, such as Figure 1 As shown, it includes: A first circuit board 1, wherein the first circuit board 1 is a high-speed signal board, and high-speed signal lines 10 and signal pads 11 are deployed in the first circuit board 1. The signal pads 11 are electrically connected to the high-speed signal lines 10. The first circuit board 1 may include a multi-layer structure, which is divided into a signal layer, a power supply layer and a ground layer. The signal layer is used to deploy high-speed signal lines, the power supply layer is led out to the surface of the first circuit board 1 through power lines, and the ground layer is led out to the surface of the first circuit board 1 through ground lines. The second circuit board 3 is a low-speed signal board, and a connector hole 31 is provided on the surface 30 of the second circuit board 3. Optical module connector 2; The optical module connector 2 includes: The optical module cage 20 has pins 21 formed on the lower surface 200 of its front side. The pins 21 are inserted into the insertion holes 31 on the second circuit board 3. For the optical module connector 2 or the optical module cage 20, the front side refers to the side where the optical module slot is provided, and the rear side refers to the side away from the optical module slot. It should be noted that the first circuit board 1 can also be provided with insertion holes, and the lower surface 200 of the rear side of the optical module cage 20 is also provided with pins 21 for insertion at the corresponding position. Connector 22 is disposed on the rear side of the optical module cage 20. The high-speed signal pin 220 of connector 22 extends from the lower surface 200 of the optical module cage 20 and is electrically connected to the signal pad 11 disposed on the first circuit board 1 on the rear side of the optical module connector 2.
[0022] In addition, power pins and ground pins are provided on connector 22. The power pins are electrically connected to the power lines on the first circuit board 1, and the ground pins are electrically connected to the ground lines on the first circuit board 1.
[0023] In the circuit board assembly 100, in order to support the front side of the optical module connector 2, in addition to setting pin 21, it can also be achieved by cooperating with the corresponding insertion hole 31 of pin 21.
[0024] The second circuit board 3 can be installed separately from the first circuit board 1, or it can be connected to the first circuit board 1. When installed separately, the electrical connection between the connector 22 and the first circuit board 1, and the connection between the pin 21 and the insertion hole 31 are installed separately. The two will not have misalignment problems due to mutual tolerances, thereby improving the reliability of the structural connection in the communication equipment.
[0025] Specifically, the pin 21 can be configured as a fisheye hole or similar form, which is compressed by pressing it into the plug hole 31, and the elasticity of the fisheye hole locks the side wall of the plug hole 31 to form a holding force, thereby improving the holding effect of the second circuit board 3 on the optical module cage 20.
[0026] Preferably, the thickness of the second circuit board 3 is less than the thickness of the first circuit board 1.
[0027] Since the second circuit board 3 does not need to transmit signals and has no requirements for wiring density or number of layers, the size of the second circuit board 3 can be reduced by implementing the plug hole 31, thereby further improving the deployment efficiency of the circuit board in the communication equipment and reducing the cost of the circuit board.
[0028] Optionally, the first circuit board 1, such as Figure 1 As shown, it also includes: The indicator light 23 may also be equipped with a low-speed signal line for control on the first circuit board 1. The indicator light 23 can be controlled through the low-speed signal line. A light guide strip 24, one end 240 of which corresponds to the indicator light 23, and the other end 241 of which extends along the upper surface 201 of the optical module cage 20 to the front side of the optical module connector 2.
[0029] Optional, such as Figure 2 As shown, the number of the second circuit boards 3 is the same as the number of the optical module connectors 2. For example, four optical module connectors 2 can be deployed in one layer of the communication device 300, and correspondingly, the number of the second circuit boards 3 can also be set to four. Each of the second circuit boards 3 corresponds to one optical module connector 2.
[0030] By setting up the second circuit board 3, each second circuit board 3 can independently support one optical module connector 2. Moreover, compared to setting up one second circuit board 3 for multiple optical module connectors 2, it can better cope with the tolerances between multiple optical module connectors 2, so that the second circuit board 3 has a better support effect on the optical module connector 2.
[0031] Optionally, the insertion hole 31 of the second circuit board 3 is a metallized hole, and a first ground layer 32 is deployed in the second circuit board 3, wherein the insertion hole 31 is electrically connected to the first ground layer 32.
[0032] Through the electrical connection between the plug hole 31 and the pin 21 and the electrical connection between the plug hole 31 and the first ground layer 32, the optical module cage 20 has better electromagnetic shielding performance, thereby improving the electromagnetic shielding effect of the optical module connector in the communication equipment.
[0033] Optionally, the first circuit board 1 and the second circuit board 3 are connected by a fastener.
[0034] During fixation, an adjustable fixing member can be slid in between the first circuit board 1 and the second circuit board 3, and the first circuit board 1 and the second circuit board 3 are clamped by tightening the fixing member.
[0035] Optionally, the first circuit board 1 and the second circuit board 3 are bonded together.
[0036] Adhesive is applied to the side of the first circuit board 1 or the second circuit board 3 to fix them together.
[0037] Optional, such as Figure 1 As shown, a second ground layer 12 is also formed in the first circuit board 1, and the first ground layer 32 and the second ground layer 12 are electrically connected.
[0038] By connecting the first grounding layer 32 and the second grounding layer 12, the first circuit board 1 and the second circuit board 3 can achieve integrated grounding, further improving the electromagnetic shielding effect of the optical module connector in the communication equipment.
[0039] The electrical connection between the first grounding layer 32 and the second grounding layer 12 can be achieved through a flexible plate or through the abutment between the grounding layers of the first circuit board 1 and the second circuit board 3. It can be set according to actual needs and there are no restrictions.
[0040] Optional, such as Figure 3 As shown, the number of optical module connectors 2 is two sets; The high-speed signal pin 220A of connector 22A in the first group of optical module connectors 2A is inserted from above into the signal pad 11A of the first circuit board 1 located on the first surface 1A. The high-speed signal pin 220B of connector 22B in the second group of optical module connector 2B is inserted from below into the signal pad 11B of the first circuit board 1 located on the second surface 1B. The pins 21A of the first group of optical module connectors 2A are inserted from above into the insertion holes 31A of the third surface 30A of the second circuit board 3, and the pins 21B of the second group of optical module connectors 2B are inserted from above into the insertion holes 31B of the fourth surface 30B of the second circuit board 3.
[0041] By using the insertion holes 31A and 31B on both sides of the second circuit board 3 (the third surface 30A and the fourth surface 30B) to correspond to the pins 21A and 21B, support is provided for the optical module connectors 2A and 2B on both sides of the second circuit board 3. Furthermore, in some cases, the insertion holes 31A and 31B on both sides can be formed by drilling in a single step, improving the manufacturing efficiency of the second circuit board.
[0042] Furthermore, the first circuit board 1, as Figure 2 As shown, it also includes: Indicator lights 23A and 23B are respectively disposed on the first surface 1A and the second surface 1B of the first circuit board 1. Indicator light 23A corresponds to the status indication of the first group of optical module connectors 2A, and indicator light 23B corresponds to the status indication of the second group of optical module connectors 2B. Two sets of light guide strips 24A and 24B are provided. One end 240A of the first set of light guide strips 24A corresponds to the indicator light 23A located on the first surface 1A. The other end 240B of the first set of light guide strips 24A extends along the upper surface 200B of the optical module cage 20A of the first set of optical module connectors 2A to the front side of the first set of optical module connectors 2A. One end 240B of the second set of light guide strips 24B corresponds to the indicator light 24B located on the second surface 1B. The other end 240B of the second set of light guide strips 24B extends along the upper surface 200B of the optical module cage 20B of the second set of optical module connectors 2B to the front side of the second set of optical module connectors 2B.
[0043] By setting different indicator lights 24A and 24B for the first group of optical module connectors 2A and the second group of optical module connectors 2B respectively, the status indication of different optical module connectors can be achieved. Correspondingly, this application also provides a communication device 300, such as... Figure 4 As shown, it includes: The circuit board assembly 100 described in any of the preceding claims; and, Optical module 302; The optical module 302 is plugged into the optical module connector 2 in the circuit board assembly 100.
[0044] Additionally, it should be noted that an optical module cage 20 may contain multiple layers of optical module slots, typically two layers, with each layer's optical module slot corresponding to the insertion of one optical module.
[0045] When a set of optical module connectors 2 are inserted into each of the two sides of the first circuit board 1, each set of optical module connectors 2 can also be set as a multi-layer optical module slot. The choice can be made according to actual needs and there are no restrictions.
[0046] The technical solutions provided in the embodiments of this specification may include the following beneficial effects: In the embodiments described in this specification, the structure of the circuit board assembly described above allows the first circuit board for transmitting high-speed signals to be disposed on the rear side of the optical module connector. The front side of the optical module connector achieves holding force through the pins formed on the lower surface of the optical module cage and the action of the second circuit board, thereby reducing the amount of the first circuit board required as a high-speed signal board in the communication equipment and improving the deployment efficiency of the circuit board in the communication equipment.
[0047] Other embodiments of this specification will readily occur to those skilled in the art upon consideration of the specification and practice of the invention claimed herein. This specification is intended to cover any variations, uses, or adaptations that follow the general principles of this specification and include common knowledge or customary techniques in the art not claimed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this specification are indicated by the following claims.
[0048] It should be understood that this specification is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this specification is limited only by the appended claims.
[0049] The above description is merely a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this specification should be included within the scope of protection of this specification.
Claims
1. A circuit board assembly, characterized in that, include: A first circuit board, wherein the first circuit board is a high-speed signal board, and high-speed signal lines and signal pads are deployed in the first circuit board, the signal pads being electrically connected to the high-speed signal lines; The second circuit board is a low-speed signal board, and the surface of the second circuit board has insertion holes. Optical module connector; The optical module connector includes: An optical module cage, wherein pins are formed on the lower surface of the front side of the optical module cage, and the pins are inserted into the insertion holes on the second circuit board; A connector is disposed on the rear side of the optical module cage. The high-speed signal pins of the connector extend from the lower surface of the optical module cage and are electrically connected to the signal pads on the first circuit board disposed on the rear side of the optical module connector.
2. The circuit board assembly according to claim 1, characterized in that, The first circuit board further includes: Indicator lights; A light guide strip, one end of which corresponds to the indicator light, and the other end of which extends along the upper surface of the optical module cage to the front side of the optical module connector.
3. The circuit board assembly according to claim 1, characterized in that, The first circuit board and the second circuit board are connected by a fastener.
4. The circuit board assembly according to claim 1, characterized in that, The first circuit board and the second circuit board are bonded together.
5. The circuit board assembly according to claim 1, characterized in that, The number of the second circuit boards is the same as the number of the optical module connectors; Each of the second circuit boards corresponds to one optical module connector.
6. The circuit board assembly according to claim 1, characterized in that, The second circuit board has metallized holes for insertion, and a first ground layer is deployed inside the second circuit board. The insertion holes are electrically connected to the first ground layer.
7. The circuit board assembly according to claim 6, characterized in that, A second ground layer is also formed in the first circuit board, and the first ground layer and the second ground layer are electrically connected.
8. The circuit board assembly according to claim 1, characterized in that, The optical module connectors are in two sets; The high-speed signal pins of the connectors in the first group of optical module connectors are inserted from above into the signal pads located on the first surface of the first circuit board; The high-speed signal pins of the connectors in the second set of optical module connectors are inserted from below into the signal pads located on the second surface of the first circuit board; The pins of the first set of optical module connectors are inserted into the insertion holes on the third surface of the second circuit board from above, and the pins of the second set of optical module connectors are inserted into the insertion holes on the fourth surface of the second circuit board from above.
9. The circuit board assembly according to claim 8, characterized in that, The first circuit board further includes: Indicator lights are respectively disposed on the first surface and the second surface of the first circuit board; Two sets of light guide strips, wherein one end of the first set of light guide strips corresponds to the indicator light located on the first surface, and the other end of the first set of light guide strips extends along the upper surface of the optical module cage of the first set of optical module connectors to the front side of the first set of optical module connectors; one end of the second set of light guide strips corresponds to the indicator light located on the second surface, and the other end of the second set of light guide strips extends along the upper surface of the optical module cage of the second set of optical module connectors to the front side of the second set of optical module connectors.
10. A communication device, characterized in that, include: The circuit board assembly according to any one of claims 1-9; and, Optical module; The optical module is plugged into the optical module connector in the circuit board assembly.