Radiator with embedded three-dimensional pulsating heat pipe and electric vertical take-off and landing aircraft comprising same

Abstract

In one embodiment, a heat sink includes: an evaporator plate having a heat receiving surface and a cooling surface; a plurality of fins extending from the heat receiving surface; a condenser plate, the condenser plate being transverse to the plurality of fins such that a gap is defined between the evaporator plate and the condenser plate; and pulsating heat pipe channels embedded within the evaporator plate, the plurality of fins, and the condenser plate.

Description

Technical Field

[0001] This disclosure relates to electric vertical takeoff and landing aircraft, and in particular their radiators. Background Technology

[0002] Thermal management of the motors and their power electronics components in electric vertical takeoff and landing (eVTOL) aircraft presents challenges because the all-electric propulsion system does not generate waste heat as exhaust gases, making heat removal difficult. Furthermore, materials surrounding heat sources prevent heat dissipation into the environment. Heat from heat-generating components such as power electronics must be removed to keep them within their operating temperature range and prevent catastrophic failures due to overheating. While single-phase (i.e., water or oil) pumping circuits commonly used in automobiles are effective cooling methods, they generally require relatively large mass, complex system configurations, and regular maintenance, which is not ideal for eVTOL aircraft.

[0003] Because the heat source is located within the motor and occupies only a small area of ​​less than a few square centimeters, efficient heat dissipation in the radiator is crucial for keeping the temperature of the heat-generating components within their operating range. Traditionally, radiators are made of bulk metals with high thermal conductivity, such as copper or aluminum. While aluminum is less conductive than copper, it is preferred in terms of weight; however, bulk aluminum radiators can still be heavy for vehicles like eVTOLs, where weight reduction is important. As long as thermal conduction is responsible for heat dissipation in the radiator, reducing mass and achieving high thermal performance are conflicting requirements: achieving high thermal performance requires thick fins, which increases mass.

[0004] Therefore, alternative heatsinks may be expected for applications such as eVTOL applications. Summary of the Invention

[0005] In one embodiment, a radiator includes: an evaporator plate having a heat-receiving surface and a cooling surface; a plurality of fins extending from the heat-receiving surface; a condenser plate transverse to the plurality of fins such that a gap is defined between the evaporator plate and the condenser plate; and a pulsating heat pipe channel embedded within the evaporator plate, the plurality of fins, and the condenser plate.

[0006] In another embodiment, an electronic component includes an electronic device. The electronic component also includes a heat sink comprising: an evaporator plate having a heat-receiving surface and a cooling surface, wherein the electronic device is coupled to the heat-receiving surface; a plurality of fins extending from the heat-receiving surface; a condenser plate transverse to the plurality of fins such that a gap is defined between the evaporator plate and the condenser plate; and a pulsating heat pipe channel embedded within the evaporator plate, the plurality of fins, and the condenser plate.

[0007] In another embodiment, an electric vertical takeoff and landing (eVTOL) aircraft includes: a body; a propeller coupled to the body; an electric motor operable to rotate the propeller; and electronic devices operable to control the electric motor. The eVTOL also includes a heat sink comprising: an evaporator plate having a heat-receiving surface and a cooling surface, wherein the electronic devices are coupled to the heat-receiving surface; a plurality of fins extending from the heat-receiving surface; a condenser plate transverse to the plurality of fins, such that a gap is defined between the evaporator plate and the condenser plate; and a pulsating heat pipe channel embedded within the evaporator plate, the plurality of fins, and the condenser plate. Attached Figure Description

[0008] To facilitate easy identification of any particular element or action being discussed, the most prominent number in the reference numerals refers to the drawing number in which the element was first introduced.

[0009] Figure 1 A pulsating heat pipe system according to one or more embodiments described and illustrated herein is shown.

[0010] Figure 2 An exemplary heat sink with an embedded PHP channel is shown according to one or more embodiments described and illustrated herein.

[0011] Figure 3 Another exemplary heat sink with an embedded PHP channel is shown, according to one or more embodiments described and illustrated herein.

[0012] Figure 4A One or more embodiments described and illustrated herein are shown. Figure 3 The heatsink shown has an embedded PHP channel.

[0013] Figure 4B An embedded PHP channel is shown, designed to cool multiple hot spots, according to one or more embodiments described and illustrated herein.

[0014] Figure 5An electric motor of an eVTOL according to one or more embodiments described and illustrated herein is shown.

[0015] Figure 6 The graphs showing the relationship between thermal conductivity per unit mass and air volumetric flow rate for heat sinks with and without PHP channels are presented.

[0016] Figure 7 The graphs showing the relationship between heat transfer coefficients and heat input for heatsinks with filled PHP channels, heatsinks with unfilled PHP channels, and heatsinks without PHP channels are shown. Detailed Implementation

[0017] Embodiments of this disclosure improve the heat dissipation of heat sinks for various applications such as eVTOL power electronic devices by embedding a three-dimensional pulsating heat pipe (PHP) inside it, while reducing mass compared to conventional heat sinks.

[0018] More specifically, embodiments of this disclosure address the aforementioned disadvantages and conflicts of radiators made of bulk metal by enabling the PHP (Potentially Oscillating Heat Pipe) to perform heat transfer. The PHP, also known as an oscillating heat pipe, is a two-phase passive heat transfer device comprising a capillary or channel that repeatedly bends between a heating section and a cooling section. A working fluid is filled into the PHP, typically to about half its internal volume. The inner diameter of the tube or the hydraulic diameter of the channel should be small enough that even in gravity-induced environments (including tilting and vehicle acceleration), a mixture of liquid slug and vapor plug exists within the working fluid throughout the operating temperature range. The working fluid repeatedly evaporates at the heating section (i.e., the evaporator) and condenses at the cooling section (i.e., the condenser), thereby inducing an oscillating flow between the evaporator and the condenser. This self-excited oscillation of the liquid / vapor plug flow is responsible for heat transfer between the two sections.

[0019] In this embodiment, a 3D flow path is created within the finned radiator, and fluid is filled into the interior of the clamping filler tubes, forming an embedded PHP radiator. Unlike conventional PHP devices, the PHP channels of this disclosure are concentrated in the evaporator and diffuse to each fin. This not only improves heat diffusion through two-phase flow but also reduces the radiator's mass even when filled with fluid due to the presence of the PHP channels, as the fluid density is typically less than half that of materials such as aluminum. The device is completely passive because the driving force for fluid oscillation is not an external force such as a mechanical pump, but rather the pressure difference between the evaporator and condenser, making it as reliable as a conventional bulk metal radiator. This operating principle also makes the device less sensitive to the location of the radiator installation, unlike thermosiphons, which are ineffective in top-heated orientations and microgravity conditions (where location may be important for eVTOL applications). The wall thickness between the evaporator channels is also optimized to allow conductive localized heat transfer directly to the fins. Therefore, the enhanced radiator of this disclosure has a degraded operating mode in the event of PHP failure.

[0020] Now for reference Figure 1 An exemplary PHP system 102 is schematically illustrated. The PHP system 102 includes an evaporator section 106, a condenser section 104, and a central section 108 located between them. The evaporator section 106 is thermally coupled to a heat-generating component, such as an electronic device. The condenser section 104 is thermally coupled to a cooling component, such as a radiator. The central section 108 located between the evaporator section 106 and the condenser section 104 can serve as an insulating region where no heat is gained or lost.

[0021] The PHP system 102 also includes a closed-loop PHP channel 110 having multiple loops traversing the evaporator section 106, central section 108, and condenser section 104 in a serpentine pattern. It should be understood that in other embodiments, the PHP channel 110 may be an open loop. The PHP channel 110 is filled with a working fluid (e.g., water, an alcohol-based fluid, a hydrocarbon-based fluid, a refrigerant, etc.) that provides multiple liquid plugs 112 and vapor plugs 114. The working fluid in the loop at the evaporator section 106 receives heat from the heat-generating components, while the working fluid in the loop at the condenser section 104 cools the working fluid. The temperature difference causes a saturation pressure difference between the liquid plugs 112 and vapor plugs 114 to oscillate back and forth between the evaporator section 106 and the condenser section 104, transferring heat from the evaporator section 106 to the condenser section 104. This pulsation of the working fluid within the PHP channel 110 cools the heat-generating components.

[0022] In embodiments of this disclosure, a single closed-loop, three-dimensional PHP channel passes through multiple fins of a heat sink. More specifically, embodiments of this disclosure provide a heat sink including an evaporator plate that receives heat from a heat-generating component and a condenser plate having multiple fins extending therethrough, the condenser plate providing a structure for a cooling loop or pathway to return to the evaporator plate through the multiple fins. Unlike previous PHP systems, embodiments of this disclosure provide a three-dimensional PHP channel that is wired to pass through multiple fins instead of a single fin.

[0023] Figure 2 A simplified example of a radiator incorporating features of this disclosure is shown. The radiator 202 generally includes an evaporator plate 204, a plurality of fins 206, a condenser plate 208, and a closed-loop PHP channel 212 filled with working fluid having liquid and vapor plugs. The evaporator plate 204, the plurality of fins 206, and the condenser plate 208 are shown as dashed lines to illustrate the PHP channel 212 drawn in solid lines. In this embodiment, the connections between the loops also occur within the condenser plate 208. The condenser plate 208 and the plurality of fins 206 serve as a condenser. The radiator can be made of any suitable heat-conducting material, such as, but not limited to, aluminum, copper, steel, and composite materials.

[0024] The evaporator plate 204 is sized and shaped to receive a heat-generating component 226, such as a power electronic device, at a heat-receiving surface 222. As a non-limiting example, the heat-generating component 226 can be a power electronic device used in an inverter circuit to convert direct current (DC) power from a battery into alternating current (AC) power to drive an electric motor. Exemplary power electronic devices include, but are not limited to, insulated-gate bipolar transistors (IGBTs), power metal-oxide-semiconductor field-effect transistors (MOSFETs), power transistors, power diodes, power silicon-coated rectifiers (SCRs), gallium nitride (GaN), and the like. In some embodiments, the power electronic device may be made of silicon carbide (SiC).

[0025] The embodiments described herein can be components of any type of electric or hybrid vehicle, such as eVTOLs, cars, trucks, boats, and aircraft. However, the embodiments are not limited to vehicles. The embodiments described herein can be used in any application where heat is desired to be removed from heat-generating components. Another non-limiting example includes heat sinks for central processing units (CPUs), graphics processing units (GPUs), server racks, blockchain mining equipment, and the like.

[0026] Multiple fins 206 extend from the cooling surface 224 of the evaporator plate 204. Any number of fins 206 can be used depending on the size of the radiator 202 and the application. Although the fins 206 are shown as straight fins 206, the fins 206 can take other shapes and configurations.

[0027] Multiple fins 206 extend through a condenser plate 208, which is offset from the cooling surface 224 of the evaporator plate 204, such that a gap 210 exists between the evaporator plate 204 and the condenser plate 208. Therefore, the condenser plate 208 is configured to extend through the multiple fins 206. The multiple fins 206 extend beyond the top surface of the condenser plate 208. The condenser plate 208 is transverse to the multiple fins 206. In the illustrated embodiment, the condenser plate 208 lies in a plane parallel to the evaporator plate 204 and perpendicular to the plate defined by the multiple fins 206. However, in other embodiments, the condenser plate 208 is a plane that is not parallel to the evaporator plate 204 and / or not perpendicular to the plane of the multiple fins 206. In some embodiments, the condenser plate 208 is located at the midpoint of the multiple fins to maximize thermal performance. It should be understood that the number, thickness, and orientation of the multiple fins 206 can be optimized with a minimum number of loops.

[0028] As mentioned above and as Figure 2 As shown, PHP channels 212 are arranged within evaporator plate 204, multiple fins 206, and condenser plate 208. PHP channels 212 are closed-loop hollow channels filled with working fluid having liquid and vapor plugs. In some embodiments, the radiator 202 is manufactured using an additive manufacturing process (e.g., 3D printing). In this way, PHP channels 212 can be formed within the heat-conducting material of the radiator 202.

[0029] The PHP channel 212 has multiple evaporator passages 214 within the evaporator plate 204. The evaporator passages 214 provide areas for the working fluid within the PHP channel 212 to receive heat from the heating elements at the heat receiving surface 222, thereby heating the working fluid. Therefore, the evaporator plate 204 is positioned similarly to... Figure 1 The evaporator section 106 shown functions in the manner described.

[0030] Each fin 206 has at least one fin passage 218 extending from an independent evaporator passage 214. The fin passage 218 is arranged within each of the plurality of fins 206. It should be understood that each fin may have one or more fin passages 218.

[0031] The condenser plate 208 provides an area for the PHP channel 212 to act as a turning point for the condenser passage 216, to route the fin passage 218 between the evaporator passage 214 and the condenser plate 208. Therefore, the condenser plate 208, together with multiple fins, is arranged in a manner similar to... Figure 1 The condenser section 104 shown acts as a condenser.

[0032] Starting from the lower left corner of PHP channel 212, PHP channel 212 extends upward along the leftmost fin in the first fin passage 218, crosses the condenser plate 208 in the first condenser passage 216, extends to the right along the condenser plate 208, and then extends downward along the middle second fin in the second fin passage 218. PHP channel 212 continues along the evaporator plate 204 in the middle evaporator passage 214, extends upward along the middle second fin 206 in the third fin passage 218, and crosses the condenser plate 208 in the second condenser passage 216. Then, PHP channel 212 turns right across the condenser plate 208, extends downward along the third fin in the fourth fin passage 218, travels across the evaporator plate 204 in the third evaporator passage 214, and then extends upward along the third fin 206 in the fifth fin passage 218. Next, PHP channel 212 extends across condenser plate 208 in third condenser passage 216, downwards along third fin 206 in sixth fin passage 218, extends across evaporator plate 204 in return passage 220, and finally returns to the starting point of closed-loop PHP channel 212 through first evaporator passage 214 in evaporator plate 204. Return passage 220 is a feature of embodiments that increase PHP performance, but it may be omitted due to design or cost constraints.

[0033] It should be pointed out that, although Figure 2 The condenser plate is shown as a solid block, but in other embodiments, the condenser plate 208 has material only in its internal vicinity to the condenser passage 216.

[0034] During operation, the working fluid receives and absorbs heat from the heat-generating component 226. Liquid and vapor plugs pulsate back and forth or circulate in one direction, transferring the liquid plug from the evaporator plate 204 to the condenser plate 208. The condenser plate 208 is cooled by the presence of multiple fins 206 and the air passing through them. For example, airflow generated by an aircraft propeller can be forced through the multiple fins 206, removing heat from them and thus from the working fluid within the condenser passages 216 of the condenser plate 208. The cooling of the working fluid in the condenser plate 208 and the heating of the working fluid in the evaporator plate 204 cause the liquid and vapor plugs to pulsate back and forth to remove heat from the heat-generating component 226.

[0035] Now for reference Figure 3 Another exemplary radiator 302 is shown. This radiator includes an evaporator plate 304, a plurality of fins 306, and a condenser plate 308. The evaporator plate 304 has a cooling surface 324 and is operable to receive heat-generating components (not shown in the image). Figure 3(Shown in the diagram) A heat-receiving surface 322 is provided, from which multiple fins 306 extend. A condenser plate 308 is disposed through the multiple fins 306, such that a gap 310 exists between the evaporator plate 304 and the condenser plate 308. A single closed-loop PHP channel 312 is routed through the evaporator plate 304, the multiple fins 306, and the condenser plate 308. In this embodiment, the connections between loops are primarily made within the evaporator plate 304. Figure 2 Like the heat sink 202 shown, heat sink 302 is made using a thermally conductive material (e.g., aluminum, copper, steel, or a thermally conductive composite material). Heat sink 302 can be manufactured, for example, using an additive manufacturing process.

[0036] and Figure 2 Compared to the three fins 206 of the heatsink 202 shown, the exemplary heatsink 302 has an array of six fins 306. However, any number of fins can be provided in any fin configuration. The number, thickness, and orientation of the fins take into account both the thermal resistance and pressure drop of the air exchanger, as well as the minimum number of PHP loops.

[0037] Figure 4A An isolated Figure 3 The PHP channel 312 has multiple evaporator passages 314 within the evaporator plate 304, multiple finned passages 318 within multiple fins 306, and multiple condenser passages 316 within the condenser plate 308. The outermost finned passages are fluidly connected via a return passage 320. Some of the finned passages 318 may be tilted relative to the vertical Z-axis of the system, and some of the evaporator passages 314 and condenser passages 316 may be fanned out such that the distance between adjacent evaporator passages 314 is less than the distance between adjacent condenser passages 316. For example, it may be desirable to position the evaporator passages 314 closely such that they are directly aligned with the heat-generating components in the vertical Z-axis direction of the system. In this way, the maximum amount of heat flux can be transferred to the working fluid within the evaporator passages 314. In an embodiment, the total fin surface area of ​​the multiple fins is at least twice the evaporator plate surface area of ​​the evaporator plate.

[0038] Furthermore, by maximizing the separation of condenser passages 316, the surface area through which PHP channels 312 travel is increased, thereby increasing the cooling surface area used to remove heat. As shown in Figure 4, the outermost fin passage 318 can be tilted at a greater angle than the innermost fin passage. In addition, the outermost evaporator passage 314 is fan-shaped to increase the distance between condenser passages 316 compared to the distance between evaporator passages 314.

[0039] The heat sink described herein can operate in any orientation. At different orientation angles, the global thermal resistance between the evaporator plate and fins varies minimally. This characteristic makes the heat sink of this disclosure ideal for aircraft such as eVTOL.

[0040] Fin arrays and fin channel arrays can be designed to remove heat from multiple hot spots. Figure 4B An array of PHP channels 400 is shown, defined by an array of first PHP channels 312A for cooling a first hot spot and an array of second PHP channels 312B for cooling a second hot spot. The arrays of the first PHP channels 312A and the second PHP channels 312B are arranged in conjunction with... Figure 4A The array of PHP channels 312 shown is configured in the same manner. The array of the first PHP channel 312A and the array of the second PHP channel 312B are fluidly connected together via two return paths 402. It should be understood that any number of PHP channel arrays can be provided in different configurations and arrangements.

[0041] Figure 5 An exemplary propeller assembly 502 of an exemplary eVTOL is shown. The propeller assembly 502 generally includes an electric motor 508 that rotates a shaft 506 to drive a rotating propeller 504, which generates lift for the eVTOL 500, enabling it to fly. The propeller assembly 502 also includes a housing 510 that internally holds electronic components (not shown) that control the operation of the electric motor 508. As a non-limiting example, the electronic components could be power electronics of an inverter circuit that converts DC power from a battery into AC power to rotate the shaft 506 and control the eVTOL.

[0042] Electronic component 518 is thermally coupled to heat sink 514 as described in this disclosure. Electronic component 518 and heat sink 514 are collectively referred to herein as "electronic assembly". Each heat sink 514 includes an embedded closed-loop PHP channel having a working fluid therein. As described above and as... Figure 2 As shown in Figure 4, the PHP channel is wired through the evaporator plate, multiple fins, and condenser plate. The heat flux generated by the electronic component 518 is transferred to the working fluid, thereby heating it. Vapor and liquid plugs in the working fluid pulsate within the PHP channel, transferring heat from the evaporator plate to the condenser plate within the fins 516. Airflow generated by the propeller 504 passes through the fins 516, thereby removing the heat flux into the environment.

[0043] Figure 6This is a graph comparing heatsinks with (curve 602) and those without (curve 604) PHP channels, with an input heat of 100W. The thermal conductivity per unit mass, Geff, is derived by dividing the overall thermal conductivity between the evaporator and ambient air by the mass of each heatsink. The conductivity is calculated using an empirical model based on test results. The horizontal axis of the graph represents the volumetric flow rate [dm] of the airflow through the heatsink. 3 / s]. Compared to heatsinks without PHP channels (curve 602), heatsinks with PHP channels (curve 604) show a typical 0-20% improvement.

[0044] Figure 7 The heat transfer coefficient (HTC) from the evaporator plate to the inlet air (i.e., ambient air) was plotted. sys The relationship between the input heat Q (in watts) and the following three types of radiators: 1) radiators with PHP channels filled with working fluid at a fill ratio (FR) of 55%; 2) radiators with empty PHP channels; and 3) radiators without PHP channels. Figure 7 The results show that heatsinks with filled PHP channels have a better heat transfer coefficient compared to heatsinks without PHP channels. (HTC) sys .

[0045] Compared to similar heatsinks without PHP channels, heatsinks with PHP channels not only offer better thermal performance but also have reduced mass due to the material porosity of the PHP channels. This reduction in mass and weight can be significant, for example, in aerospace applications.

[0046] It should now be understood that embodiments of this disclosure relate to a radiator having a single closed-loop PHP channel serving multiple fins. The radiator of this disclosure has an evaporator plate coupled to a heat-generating component, multiple fins, and a condenser plate passing through the multiple fins. The closed-loop PHP channel has multiple evaporator passages within the evaporator plate, multiple fin passages passing through the multiple fins, and multiple condenser passages passing through the condenser plate. A working fluid with liquid plugs and bubble plugs within the PHP channel evaporates and condenses within the radiator. Heat is transferred between the evaporator plate and the condenser plate through pulsating liquid plugs and bubble plugs within the PHP channel.

[0047] While specific embodiments have been described and illustrated herein, it should be understood that various other changes and modifications may be made without departing from the spirit and scope of the claimed subject matter. Furthermore, although various aspects of the claimed subject matter have been described herein, these aspects are not necessarily used in combination. Therefore, the appended claims are intended to cover all such changes and modifications falling within the scope of the claimed subject matter.

[0048] It will be apparent to those skilled in the art that various modifications and variations can be made to the embodiments described herein without departing from the scope of the claimed subject matter. Therefore, the specification is intended to cover modifications and variations of the various embodiments described herein, provided that such modifications and variations fall within the scope of the appended claims and their equivalents.

Claims

1. A radiator, comprising: An evaporator plate, the evaporator plate including a heat receiving surface and a cooling surface; Multiple fins extending from the heat-receiving surface; A condenser plate, which is transverse to the plurality of fins, thereby defining a gap between the evaporator plate and the condenser plate; as well as Pulsating heat pipe channels embedded in the evaporator plate, the plurality of fins, and the condenser plate.

2. The radiator according to claim 1, wherein, The total fin surface area of ​​the plurality of fins is at least twice the surface area of ​​the evaporator plate of the evaporator plate.

3. The radiator according to claim 1, wherein, The pulsating heat pipe channel includes multiple evaporator passages in the evaporator plate, a first passage and a second passage in each of the multiple fins, and multiple condenser passages in the condenser plate.

4. The radiator according to claim 3, wherein, The pulsating heat pipe channel is routed such that it crosses from an independent evaporator channel of the plurality of evaporator channels to a first channel of a first fin of the plurality of fins, crosses from the first channel to an independent condenser channel of the plurality of condenser channels, crosses from the independent condenser channel to a second channel of the first fin, and crosses from the second channel of the first fin to another evaporator channel of the plurality of evaporator channels.

5. The radiator according to claim 3, wherein, The pulsating heat pipe channel also includes a return path within the evaporator plate.

6. The radiator according to claim 1, wherein, The pulsating heat pipe channel is filled with fluid, which includes multiple liquid plugs and multiple vapor plugs.

7. The radiator according to claim 1, wherein, The heat receiving surface is configured to receive heat-generating components.

8. An electronic component, comprising: Electronic devices; and Radiator, the radiator comprising: An evaporator plate, the evaporator plate including a heat receiving surface and a cooling surface, wherein the electronic device is connected to the heat receiving surface; Multiple fins extending from the heat-receiving surface; A condenser plate, the condenser plate being transverse to the plurality of fins, such that a gap is defined between the evaporator plate and the condenser plate; and Pulsating heat pipe channels embedded in the evaporator plate, the plurality of fins, and the condenser plate.

9. The electronic component according to claim 8, wherein, The total fin surface area of ​​the plurality of fins is at least twice the surface area of ​​the evaporator plate of the evaporator plate.

10. The electronic component according to claim 8, wherein, The pulsating heat pipe channel includes multiple evaporator passages in the evaporator plate, a first passage and a second passage in each of the multiple fins, and multiple condenser passages in the condenser plate.

11. The electronic component according to claim 10, wherein, The pulsating heat pipe channel is routed such that it crosses from an independent evaporator channel of the plurality of evaporator channels to a first channel of a first fin of the plurality of fins, crosses from the first channel to an independent condenser channel of the plurality of condenser channels, crosses from the independent condenser channel to a second channel of the first fin, and crosses from the second channel of the first fin to another evaporator channel of the plurality of evaporator channels.

12. The electronic component according to claim 10, wherein, The pulsating heat pipe channel also includes a return path within the evaporator plate.

13. The electronic component according to claim 8, wherein, The pulsating heat pipe channel is filled with fluid, which includes multiple liquid plugs and multiple vapor plugs.

14. An electric vertical takeoff and landing (eVTOL) aircraft, comprising: ontology; The propeller is connected to the main body; An electric motor operable to rotate the propeller; An electronic device operable to control the electric motor; and Radiator, the radiator comprising: An evaporator plate, the evaporator plate including a heat receiving surface and a cooling surface, wherein the electronic device is connected to the heat receiving surface; Multiple fins extending from the heat-receiving surface; A condenser plate, the condenser plate being transverse to the plurality of fins, such that a gap is defined between the evaporator plate and the condenser plate; and Pulsating heat pipe channels embedded in the evaporator plate, the plurality of fins, and the condenser plate.

15. The electric vertical takeoff and landing aircraft according to claim 14, wherein, The total fin surface area of ​​the plurality of fins is at least twice the surface area of ​​the evaporator plate of the evaporator plate.

16. The electric vertical takeoff and landing aircraft according to claim 14, wherein, The pulsating heat pipe channel includes multiple evaporator passages in the evaporator plate, a first passage and a second passage in each of the multiple fins, and multiple condenser passages in the condenser plate.

17. The electric vertical takeoff and landing aircraft according to claim 16, wherein, The pulsating heat pipe channel is routed such that it crosses from an independent evaporator channel of the plurality of evaporator channels to a first channel of a first fin of the plurality of fins, crosses from the first channel to an independent condenser channel of the plurality of condenser channels, crosses from the independent condenser channel to a second channel of the first fin, and crosses from the second channel of the first fin to another evaporator channel of the plurality of evaporator channels.

18. The electric vertical takeoff and landing aircraft according to claim 16, wherein, The pulsating heat pipe channel also includes a return path within the evaporator plate.

19. The electric vertical takeoff and landing aircraft according to claim 14, wherein, The pulsating heat pipe channel is filled with fluid, which includes multiple liquid plugs and multiple vapor plugs.

20. The electric vertical takeoff and landing aircraft according to claim 14, wherein, The plurality of fins extend beyond the surface of the body.

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