Gas-liquid synergistic dynamic targeted cooling two-phase immersion liquid cooling system and control method

Abstract

The present application relates to the technical field of immersion liquid cooling, and discloses a gas-liquid coordinated dynamic targeted cooling two-phase immersion liquid cooling system and a control method, which comprises a liquid cooling cabinet, a controller and a server assembly, a fan cluster, a micro-pump nozzle array and a sensor array arranged in the liquid cooling cabinet respectively; the server assembly is provided with a heating chip immersed in the immersion liquid pool of the liquid cooling cabinet; the sensor array is used for detecting the temperature of the heating chip; the controller controls the fan cluster to perform two-dimensional translation and pitch adjustment above the immersion liquid pool according to the temperature of the heating chip, so as to regulate the air flow field, controls the micro-pump nozzle array to ascend and descend, and impacts the heating chip with directional jet flow, and physically destroys the gas film covering the surface of the heating chip. The present application can perform hierarchical control according to temperature feedback; by constructing a three-dimensional adjustment matrix, the gas-liquid bilateral coordination is realized, the global heat dissipation and local heat source are considered, and the problem of critical heat flux limiting heat dissipation existing in the two-phase immersion liquid cooling technology is solved.

Description

Technical Field

[0001] This invention relates to the field of immersion liquid cooling technology, and more particularly to a gas-liquid synergistic dynamic targeted cooling two-phase immersion liquid cooling system and a control method for the gas-liquid synergistic dynamic targeted cooling two-phase immersion liquid cooling system. Background Technology

[0002] As electronic information equipment evolves towards higher computing power and higher integration, the heat flux density of chips is rising sharply. Traditional air-cooling methods are becoming increasingly difficult to meet the challenges of modern data centers due to their high noise and energy consumption, and their inability to meet the heat dissipation needs of high-density, high-power devices.

[0003] Immersion liquid cooling technology, as an emerging heat dissipation method, effectively solves the heat dissipation problem of high-power equipment by immersing electronic components in a coolant, leveraging the coolant's high heat transfer performance. Specifically, immersion liquid cooling technology involves directly immersing the heat-generating element in a non-conductive, inert fluid medium (i.e., coolant). Heat dissipation is achieved through the circulating heat absorption and release of the coolant. Based on the phase change of the coolant during heat dissipation, immersion liquid cooling is divided into two types: single-phase immersion liquid cooling and two-phase immersion liquid cooling. Single-phase immersion liquid cooling technology has become insufficient for handling extremely high heat flux heat dissipation requirements; two-phase immersion liquid cooling technology utilizes the latent heat of boiling phase change of the insulating cooling medium, possessing an extremely high heat transfer coefficient, and is considered a key technology for solving the bottleneck of high-density heat dissipation.

[0004] Critical heat flux (CHF), also known as critical heat flux density, refers to the critical heat flux density at which a liquid transitions from nucleus boiling to film boiling. It is used to indicate that during the boiling heat transfer process, when the heat flux on the heating surface increases to a certain limit, the boiling mechanism changes abruptly, resulting in a sharp decrease in the heat transfer coefficient and a sudden increase in the wall temperature.

[0005] Under extremely high heat load conditions, the two-phase heat exchange process is easily limited by the upper limit of the critical heat flux, so the heat transfer capacity reaches a bottleneck.

[0006] The existing two-phase immersion liquid cooling technology has a critical heat flux limit, which creates a heat dissipation bottleneck for data centers and leads to the risk of overheating. Summary of the Invention

[0007] The main objective of this invention is to provide a dynamic targeted cooling two-phase immersion liquid cooling system and control method with gas-liquid synergy, which aims to solve the technical problem that the existing two-phase immersion liquid cooling technology has a critical heat flux limit, thus forming a heat dissipation bottleneck for data centers and causing overheating risks in data centers.

[0008] To achieve the above objectives, the present invention provides a gas-liquid synergistic dynamic targeted cooling two-phase immersion liquid cooling system, including a liquid cooling cabinet, a controller, and server components, a three-dimensional adjustment matrix, and a sensor array respectively disposed within the liquid cooling cabinet;

[0009] The liquid-cooled cabinet includes an immersion tank and a vapor space above the immersion tank;

[0010] The server components are equipped with heating chips that are immersed in coolant in a pool of immersion liquid;

[0011] The three-dimensional control matrix includes a fan cluster set in the gas phase space and a micro-pump nozzle array that can be raised and lowered integrated at the bottom of the immersion tank;

[0012] The sensor array includes temperature sensors, each disposed on a heat-generating chip;

[0013] The controller is used to control the fan cluster to perform two-dimensional translation and pitch adjustment in the gas phase space based on the temperature of the heating chip detected by the temperature sensor, so as to regulate the airflow field on the liquid surface and accelerate the bursting and detachment of bubbles and the steam condensation cycle on the surface of the heating chip.

[0014] The controller is also used to control the raising and lowering of the micropump nozzle array based on the heat flux density area detected by the temperature sensor, to perform directional jet impact on the surface of the heating chip, and to use forced convection physics to destroy the gas film covering the surface of the heating chip and suppress film boiling.

[0015] Optionally, the server component includes a server bracket and servers; the server bracket is located at the bottom of the liquid-cooled cabinet; the servers include at least two, with multiple servers vertically inserted into the server bracket at intervals, and each server is provided with a corresponding heat-generating chip.

[0016] Optionally, the micropump nozzle array includes several micropump nozzle units; each server is provided with a corresponding micropump nozzle unit; the micropump nozzle unit includes an electric rotor, a micropump nozzle, a lifting assembly, and a position feedback device; wherein, the lifting assembly includes a stepper motor, a lifting guide column, and a guide column limiting component; wherein, the lifting guide column is spaced apart from the server, and the stepper motor and the guide column limiting component are respectively disposed on the lifting guide column; the micropump nozzle is movably connected to the lifting guide column, driven by the stepper motor to move up and down along the lifting guide column, and the lifting stroke is limited by the guide column limiting component; the position feedback device is disposed on the micropump nozzle to provide real-time feedback on the height of the micropump nozzle along the lifting guide column; the electric rotor is connected to the micropump nozzle to drive the micropump nozzle to swing, thereby expanding the spray range.

[0017] Optionally, the fan cluster includes crossbars, fans, a drive mechanism, and fan brackets; wherein, there is at least one crossbar, which is disposed in the gas phase space and slidably connected to the liquid-cooled cabinet so that the crossbar can move along its width direction; the crossbar has a slide rail along its length direction, and each crossbar is provided with a fan bracket, which is slidably connected to the slide rail of the crossbar so that the fan bracket can move along the length direction of the crossbar; each fan bracket is provided with an electric actuator, and each fan bracket is correspondingly connected to a fan; the fan is driven to translate by the crossbar and the fan bracket to move in two dimensions in the plane of the gas phase space, and is driven by the electric actuator to adjust the pitch angle; the drive mechanism includes a first drive component for driving the crossbar to move and a second drive component for driving the fan bracket to move.

[0018] Optionally, the liquid-cooled cabinet has a cooling liquid suction hole at the bottom for replenishing the coolant; a condenser is provided in the gas phase space for condensing the coolant vapor; an external heat exchange mechanism connected to the condenser is provided outside the liquid-cooled cabinet; the external heat exchange mechanism includes a heat exchange pump and a plate heat exchanger.

[0019] To achieve the above objectives, this invention also proposes a control method for a gas-liquid synergistic dynamic targeted cooling two-phase immersion liquid cooling system, which employs a gas-liquid synergistic dynamic targeted cooling two-phase immersion liquid cooling system for targeted cooling; the method includes the following steps:

[0020] Obtain the three-dimensional coordinate position of each heating chip in the liquid cooling cabinet; obtain the temperature of each heating chip collected by the temperature sensor; preset the micro pump start-up threshold, fan coordination threshold and safety temperature threshold from low to high;

[0021] Based on the temperature of the heating chip detected by the temperature sensor, the fan cluster is controlled to perform two-dimensional translation and pitch adjustment in the gas phase space to regulate the airflow field on the liquid surface, accelerate the rupture and detachment of bubbles and the steam condensation cycle on the surface of the heating chip, and control the micro-pump nozzle array to rise and fall according to the heat flux density area detected by the temperature sensor to perform directional jet impact on the surface of the heating chip, using forced convection physics to destroy the gas film covering the surface of the heating chip and suppress film boiling.

[0022] Optionally, the step of controlling the fan cluster to perform two-dimensional translation and pitch adjustment in the gas phase space based on the temperature of the heating chip detected by the temperature sensor, so as to regulate the airflow field on the liquid surface, accelerate the bursting and detachment of bubbles and the steam condensation cycle on the surface of the heating chip, and controlling the micro-pump nozzle array to rise and fall according to the heat flux density area detected by the temperature sensor to perform directional jet impact on the surface of the heating chip, thereby using forced convection physics to destroy the gas film covering the surface of the heating chip and suppress film boiling, includes:

[0023] Based on the temperature of the heating chip detected by the temperature sensor, the initial targeted cooling mode of the three-dimensional adjustment matrix is ​​determined; and based on the three-dimensional coordinate position of the heating chip in the liquid cooling cabinet, the three-dimensional action position of the three-dimensional adjustment matrix is ​​determined; among them, the targeted cooling modes include standby mode, liquid phase mode, gas-liquid synergy mode and emergency mode.

[0024] Optionally, the step of determining the initial targeted cooling mode of the three-dimensional adjustment matrix based on the temperature of the heat-generating chip detected by the temperature sensor includes:

[0025] When the temperature of the heat-generating chip is lower than the micro-pump start-up threshold, the targeted cooling mode is set to standby mode.

[0026] When the temperature of the heat-generating chip reaches the micro-pump start-up threshold but is less than the fan coordination threshold, the targeted cooling mode is determined to be liquid phase mode.

[0027] When the temperature of the heat-generating chip reaches the fan-assisted threshold but is below the safe temperature threshold, the targeted cooling mode is determined to be the gas-liquid assisted mode.

[0028] When the temperature of the heat-generating chip reaches the safe temperature threshold, the targeted cooling mode is set to emergency mode.

[0029] Optionally, the step of controlling the fan cluster to perform two-dimensional translation and pitch adjustment in the gas phase space based on the temperature of the heating chip detected by the temperature sensor, so as to regulate the airflow field on the liquid surface, accelerate the bursting and detachment of bubbles and the steam condensation cycle on the surface of the heating chip, and controlling the micro-pump nozzle array to rise and fall according to the heat flux density area detected by the temperature sensor to perform directional jet impact on the surface of the heating chip, thereby using forced convection physics to destroy the gas film covering the surface of the heating chip and suppress film boiling, further includes:

[0030] A preset hysteresis temperature difference is used to prevent the targeted cooling control mode from frequently switching modes based on preset micro-pump start threshold, fan coordination threshold, and safe temperature threshold.

[0031] When the targeted cooling mode is in emergency mode, if the difference between the safe temperature threshold and the temperature of the heating chip does not exceed the hysteresis temperature difference, the emergency mode is maintained; if the difference between the safe temperature threshold and the temperature of the heating chip exceeds the hysteresis temperature difference, the mode is switched to gas-liquid synergy mode.

[0032] When the targeted cooling mode is in the gas-liquid synergy mode, if the difference between the fan synergy threshold and the temperature of the heat-generating chip does not exceed the hysteresis temperature difference, the gas-liquid synergy mode is maintained; if the difference between the fan synergy threshold and the temperature of the heat-generating chip exceeds the hysteresis temperature difference, the mode is switched to liquid phase mode.

[0033] When the targeted cooling mode is in liquid phase mode, if the difference between the micro-pump start threshold and the temperature of the heating chip does not exceed the hysteresis temperature difference, the liquid phase mode is maintained; if the difference between the micro-pump start threshold and the temperature of the heating chip exceeds the hysteresis temperature difference, the mode is switched to standby mode.

[0034] Optionally, the method further includes:

[0035] When the targeted cooling mode enters standby mode, the fan cluster enters low power mode, and the micro-pump nozzle array descends to the bottom of the immersion liquid pool for standby.

[0036] When the targeted cooling mode enters the liquid phase mode, the micro-pump nozzle array rises to the heat-generating chip and sprays it onto the surface of the heat-generating chip in a directional manner.

[0037] When the targeted cooling mode enters the gas-liquid synergy mode, the fan cluster is driven to move to the heat-generating chip and adjust the pitch angle based on the liquid phase mode. The speed of the fan cluster increases linearly with the temperature of the heat-generating chip.

[0038] When the targeted cooling mode enters the emergency mode, based on the gas-liquid synergy mode, the micro-pump nozzle array swings and sprays at full speed, the fan cluster runs at the highest speed, and the controller sends an emergency alarm signal to the server.

[0039] The technical solution of this invention can monitor the temperature of the heating chip in real time through a sensor array, obtain the temperature distribution of the heating chip in the immersion liquid pool, and perform hierarchical control based on temperature feedback; and utilize a fan cluster capable of two-dimensional translation and pitch adjustment and a micro-pump nozzle array capable of height adjustment to construct a three-dimensional adjustment matrix, achieving synergistic effect of gas and liquid on both sides, thus addressing both global heat dissipation and local heat sources. Specifically, this invention has the following advantages:

[0040] First, this invention uses a micro-pump nozzle array that can rise and fall to deliver a high-intensity jet impact to the heating chip at close range, actively destroying the insulating vapor film generated by film boiling on the surface of the heating chip, thus significantly delaying the occurrence of critical heat flux. At the same time, it combines a fan cluster that can perform two-dimensional translation and pitch adjustment in the gas phase space to accelerate the detachment of bubbles and the transport and condensation of vapor. By synergistically enhancing the heat transfer mechanism through active gas phase disturbance and directional liquid phase jet, this invention effectively solves the bottleneck of limited heat dissipation capacity of traditional passive two-phase immersion liquid cooling when dealing with extremely high heat flux density.

[0041] Secondly, this invention utilizes a fan cluster capable of two-dimensional translation and pitch adjustment to locate the target position in a two-dimensional plane and the lifting and lowering of the micro-pump nozzle unit, thus constructing a three-dimensional heat dissipation adjustment capability. Based on the real-time sensing of the temperature distribution of the heat-generating chip, it can physically locate the high-density heat flow area of ​​the heat-generating chip for targeted enhanced cooling. Unlike the global uniform cooling of traditional liquid cooling systems, this invention achieves precise response to the dynamic thermal load of the server and targeted elimination of local hot spots. It avoids over-cooling of non-hot spot areas and ensures the safety of critical heat sources, greatly improving the spatial adaptability of the system and ensuring the safe and stable operation of high-power electronic equipment.

[0042] Third, this invention employs a graded response closed-loop control method based on temperature thresholds. From low to high, it sets a micro-pump start-up threshold, a fan coordination threshold, and a safety temperature threshold. Based on the temperature hierarchy of the heat-generating chips, it sequentially triggers micro-pump jet, fan coordination, and full-power operation modes (emergency mode). Under low-load conditions, it relies solely on the low-power operation of the micro-pump nozzle unit or natural heat dissipation. High-energy-consuming components such as the micro-pump nozzle unit and fan clusters are only activated when necessary, significantly improving the system's energy efficiency ratio. This on-demand allocation of cooling effectively avoids energy waste and achieves the optimal balance between heat dissipation performance and operating energy consumption.

[0043] Fourth, this invention has excellent flow field optimization capabilities and broad application prospects. The fan cluster is not only used for targeted heat dissipation, but the pitching and free translation scanning motion of the fan cluster in the two-dimensional plane effectively breaks the vapor covering layer above the liquid surface, promotes the flow of gaseous working fluid to the condenser, and optimizes the overall temperature uniformity in the sealed tank. Attached Figure Description

[0044] Figure 1 This is one of the structural schematic diagrams of the dynamic targeted cooling two-phase immersion liquid cooling system of the present invention;

[0045] Figure 2 This is the second schematic diagram of the dynamic targeted cooling two-phase immersion liquid cooling system of the present invention;

[0046] Figure 3 This is the third schematic diagram of the dynamic targeted cooling two-phase immersion liquid cooling system of the present invention;

[0047] Figure 4 This is a flowchart of a specific embodiment of the control method of the present invention;

[0048] Figure 5 This is a flowchart of a first embodiment of the control method of the present invention;

[0049] In the diagram: 1-Liquid cooling cabinet, 2-Crossbar, 3-Fan, 4-Drive mechanism, 5-Server, 6-Heating chip, 7-Temperature sensor, 8-Electric rotor, 9-Micro pump nozzle, 10-Stepper motor, 11-Lifting guide column, 12-Condenser, 13-Position feedback device, 14-Heat pump, 15-Plate heat exchanger, 16-Server bracket, 17-Cold liquid suction port, 18-Fan bracket, 19-Guide column limiting component, 20-External heat exchange mechanism. Detailed Implementation

[0050] It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the invention.

[0051] In the following description, the use of suffixes such as "unit," "component," or "element" to denote elements is solely for the purpose of illustrative purposes and has no specific meaning in itself. Therefore, "unit," "component," or "element" may be used interchangeably.

[0052] Please see Figures 1 to 5 The present invention provides a gas-liquid synergistic dynamic targeted cooling two-phase immersion liquid cooling system, including a liquid cooling cabinet 1, a controller, and server components, a three-dimensional adjustment matrix, and a sensor array respectively disposed in the liquid cooling cabinet 1;

[0053] The liquid-cooled cabinet 1 includes an immersion liquid tank and a gas phase space above the immersion liquid tank;

[0054] The server component is equipped with a heating chip 6 that is immersed in a coolant in an immersion tank;

[0055] The three-dimensional control matrix includes a fan cluster set in the gas phase space and a micro-pump nozzle array that can be raised and lowered integrated at the bottom of the immersion tank;

[0056] The sensor array includes temperature sensors 7 respectively disposed on each of the heating chips 6;

[0057] The controller is used to control the fan cluster to perform two-dimensional translation and pitch adjustment in the gas phase space based on the temperature of the heating chip 6 detected by the temperature sensor 7, so as to regulate the airflow field on the liquid surface and accelerate the bursting and detachment of bubbles and the condensation and circulation of steam on the surface of the heating chip 6.

[0058] The controller is also used to control the raising and lowering of the micropump nozzle array based on the heat flux density area detected by the temperature sensor 7, to perform directional jet impact on the surface of the heating chip 6, and to use forced convection physics to destroy the gas film covering the surface of the heating chip 6 and suppress film boiling.

[0059] The technical solution of this invention is based on the research conducted by our research team on two-phase heat transfer flow and immersion liquid cooling. Under the influence of critical heat flux, when the liquid transitions from nucleation boiling to film boiling, the heat flux on the heating surface of the chip increases to a certain limit, causing a sudden change in the boiling mechanism, resulting in a sharp decrease in the heat transfer coefficient and a sudden increase in the wall temperature. At this time, bubbles are generated on the heating surface of the heating chip 6. When the bubble generation rate is greater than the detachment rate, a continuous insulating vapor film is formed on the surface of the heating chip 6. This is the main reason for the sharp decrease in heat transfer coefficient, which in turn leads to overheating and damage to the device. Therefore, if the formation of the gas film covering the surface of the heating chip 6 can be intervened or destroyed in advance, film boiling can be suppressed. At the same time, by controlling the flow field of the immersion liquid pool, it is beneficial to accelerate the bursting and detachment of bubbles on the surface of the heating chip 6, and achieve a faster vapor condensation cycle. This is the theoretical basis for the proposed dynamic targeted cooling two-phase immersion liquid cooling system.

[0060] Specifically, a sealed tank is formed inside the liquid-cooled cabinet 1, and the sealed tank is filled with insulating coolant to form an immersion liquid pool. The liquid surface of the immersion liquid pool and the upper part of the liquid-cooled cabinet 1 form a gas phase space; the heating chip 6 can be a CPU chip or a GPU chip.

[0061] Specifically, in addition to each heating chip 6 being equipped with a temperature sensor 7, temperature sensors 7 can also be installed in key areas of the immersion pool.

[0062] Specifically, the controller is electrically connected to the sensor array, fan cluster, and micropump nozzle array respectively; the sensor array monitors the surface temperature of the heating chip 6 in real time and obtains the temperature distribution of each heating chip 6 in the immersion liquid pool; the controller controls the fan cluster and micropump nozzle array according to the temperature feedback to execute a graded targeted cooling mode.

[0063] Furthermore, the server components include a server bracket 16 and a server 5; the server bracket 16 is located at the bottom of the liquid-cooled cabinet 1; the server 5 includes at least two servers, and multiple servers 5 are vertically inserted into the server bracket 16 at intervals, and each server 5 is provided with a heat-generating chip 6.

[0064] Specifically, each server 5 is equipped with at least one heat-generating chip 6. The height of the heat-generating chips 6 on each server 5 may be the same or different, and the temperature of each heat-generating chip 6 may be the same or different depending on the actual power consumption. Thus, a certain heat-generating chip on some servers 5 may have an over-temperature situation, while the heat-generating chips on other servers may not have an over-temperature situation. The location of the heat-generating chip 6 with an over-temperature situation is used to form a target point.

[0065] Optionally, the micropump nozzle array includes several micropump nozzle units; each server 5 is provided with a corresponding micropump nozzle unit; the micropump nozzle unit includes an electric rotor 8, a micropump nozzle 9, a lifting assembly, and a position feedback device 13; wherein, the lifting assembly includes a stepper motor 10, a lifting guide column 11, and a guide column limiting component 19; wherein, the lifting guide column 11 is spaced apart from the server 5, and the stepper motor 10 and the guide column limiting component 19 are respectively disposed on the lifting guide column 11; the micropump nozzle 9 is movably connected to the lifting guide column 11, driven by the stepper motor 10 to move up and down along the lifting guide column 11, and the lifting stroke is limited by the guide column limiting component 19; the position feedback device 13 is disposed on the micropump nozzle 9, used to provide real-time feedback on the height of the micropump nozzle 9 along the lifting guide column 11; the electric rotor 8 is connected to the micropump nozzle 9, used to drive the micropump nozzle 9 to swing, so as to expand the spray range.

[0066] Specifically, the lifting guide column 11 is located at the bottom of the flow channel gap between adjacent servers 5, the guide column limiting component 19 is located at the lower part of the lifting guide column 11, and the stepper motor 10 can be located at the upper part of the lifting guide column 11; the spray port of the micro pump nozzle 9 can be aligned with the side heating chip 6 area by a variable swing angle or a fixed angle; the position feedback device 13 can be a linear grating ruler or an encoder.

[0067] Preferably, the fan cluster includes a crossbar 2, a fan 3, a drive mechanism 4, and a fan bracket 18; wherein, there is at least one crossbar 2, which is disposed in the gas phase space and slidably connected to the liquid-cooled cabinet 1 so that the crossbar 2 can move along its width direction; the crossbar 2 has a slide rail along its length direction, and each crossbar 2 is provided with a fan bracket 18, which is slidably connected to the slide rail of the crossbar 2 so that the fan bracket 18 can move along the length direction of the crossbar 2; each fan bracket 18 is provided with an electric actuator, and each fan bracket 18 is correspondingly connected to a fan 3; the fan 3 is driven to translate by the crossbar 2 and the fan bracket 18 to move in two dimensions in the plane of the gas phase space, and is driven by the electric actuator to adjust the pitch angle; the drive mechanism 4 includes a first drive component for driving the crossbar 2 to move and a second drive component for driving the fan bracket 18 to move.

[0068] Specifically, the drive mechanism 4 can be a commonly used linear module combination. The diagram only indicates partial positional relationships and does not represent the specific structure and all positional relationships. The first and second drive components are not shown in detail, but both can be implemented using conventional drive methods in the field. The first drive component of the drive mechanism 4 can be slidably connected to the upper side wall of the liquid-cooled cabinet 1 as a moving end. When the first drive component moves, it drives the crossbar 2 to translate. The second drive component of the drive mechanism 4 can also be connected to the fan bracket 18 as an output end, driving the fan bracket 18 to translate along the slide rail opened on the crossbar 2. The fan 3 moves through the coupling between the crossbar 2 and the fan bracket 18. The movement is two-dimensional within a plane (i.e., it can move both along the length and width of the crossbar 2), and the range of movement can cover the entire length and width of the sealed groove inside the liquid-cooled cabinet 1, with no blind spots. The electric actuator can be a commonly used mechanism for controlling the oscillation of the fan head, such as a swing motor (not shown in the figure). Driven by the electric actuator, the fan bracket 18 adjusts its pitch angle, so that the blowing direction of all the fans 3 mounted on the fan bracket 18 changes synchronously, generating an oblique or horizontal airflow in the same direction, which is used to guide the vapor on the evaporation surface to the condenser 12, wherein the condenser 12 is located in the gas phase space. Specifically, the specific structure of the first drive component driving the crossbar 2 to move, and the specific structure of the second drive component driving the fan bracket 18 to move, can be implemented using structures commonly used in the art, and are not limited here.

[0069] Furthermore, the liquid-cooled cabinet 1 is provided with a cold liquid suction hole 17 at the bottom for replenishing the coolant; a condenser 12 is provided in the gas phase space for condensing the coolant vapor; an external heat exchange mechanism 20 connected to the condenser 12 is provided outside the liquid-cooled cabinet 1; the external heat exchange mechanism 20 includes a heat exchange pump 14 and a plate heat exchanger 15.

[0070] Specifically, the condenser 12 is connected to the side wall of the liquid-cooled cabinet 1 and integrated into the gas phase space, used to condense and reflux the high-temperature gas phase working fluid; the external heat exchange mechanism 20 is used to drive the refrigerant circulation to remove the heat absorbed by the condenser 12, and the heat exchange pump 14 can be a water pump.

[0071] To achieve the above objectives, the first embodiment of the present invention provides a control method for a gas-liquid synergistic dynamic targeted cooling two-phase immersion liquid cooling system, which employs a gas-liquid synergistic dynamic targeted cooling two-phase immersion liquid cooling system for targeted cooling; the method includes the following steps:

[0072] Step S10: Obtain the three-dimensional coordinate position of each heating chip 6 in the liquid cooling cabinet 1; obtain the temperature of each heating chip 6 collected by the temperature sensor 7; preset the micro pump start threshold, fan coordination threshold and safe temperature threshold from low to high.

[0073] In step S20, based on the temperature of the heating chip 6 detected by the temperature sensor 7, the fan cluster is controlled to perform two-dimensional translation and pitch adjustment in the gas phase space to regulate the airflow field on the liquid surface, accelerate the bursting and detachment of bubbles and the condensation and circulation of steam on the surface of the heating chip 6, and based on the heat flux density area detected by the temperature sensor 7, the micro-pump nozzle array is controlled to rise and fall to perform directional jet impact on the surface of the heating chip 6, using forced convection physics to destroy the gas film covering the surface of the heating chip 6 and suppress film boiling.

[0074] Specifically, the micro-pump start-up threshold, fan coordination threshold, and safe temperature threshold can be preset to different thresholds according to different heating chips 6, so as to handle heating chips 6 with different performance and adjust the temperature of heating chips 6 more precisely.

[0075] In the first embodiment of the control method for the gas-liquid synergistic dynamic targeted cooling two-phase immersion liquid cooling system of the present invention, and in the second embodiment of the control method for the gas-liquid synergistic dynamic targeted cooling two-phase immersion liquid cooling system of the present invention, step S20 includes:

[0076] Step S21: Based on the temperature of the heating chip 6 detected by the temperature sensor 7, determine the initial targeted cooling mode of the three-dimensional adjustment matrix; and based on the three-dimensional coordinate position of the heating chip 6 in the liquid cooling cabinet 1, determine the three-dimensional action position of the three-dimensional adjustment matrix; wherein, the targeted cooling mode includes standby mode, liquid phase mode, gas-liquid synergy mode and emergency mode.

[0077] Specifically, the control system determines the targeted cooling mode corresponding to each heating chip 6 based on the temperature of each heating chip 6. The three-dimensional adjustment matrix adjusts the temperature of each heating chip 6 to different degrees according to different targeted cooling modes. It can activate only the micro-pump nozzle array, or it can activate the micro-pump nozzle array and the fan cluster to cool down in tandem. The micro-pump nozzle array can be raised and lowered according to the position of the heating chip 6, and the fan cluster can be translated two-dimensionally according to the position of the heating chip 6.

[0078] In the second embodiment of the control method for the gas-liquid synergistic dynamic targeted cooling two-phase immersion liquid cooling system of the present invention, and in the third embodiment of the control method for the gas-liquid synergistic dynamic targeted cooling two-phase immersion liquid cooling system of the present invention, the step S21 of controlling the targeted cooling mode based on the temperature of the heating chip 6 detected by the temperature sensor 7 includes:

[0079] Step S211: When the temperature of the heating chip 6 is less than the micro-pump start threshold, the targeted cooling mode is determined to be standby mode.

[0080] Step S212: When the temperature of the heating chip 6 reaches the micro-pump start threshold and is less than the fan coordination threshold, the targeted cooling mode is determined to be liquid phase mode.

[0081] Step S213: When the temperature of the heating chip 6 reaches the fan coordination threshold and is less than the safe temperature threshold, the targeted cooling mode is determined to be the gas-liquid coordination mode.

[0082] Step S214: When the temperature of the heating chip 6 reaches the safe temperature threshold, the targeted cooling mode is determined to be the emergency mode.

[0083] Specifically, the standby mode is an independent mode; the liquid phase mode starts the micro-pump nozzle array; the gas-liquid synergistic mode starts the micro-pump nozzle array and the fan cluster; the emergency mode starts the micro-pump nozzle array and the fan cluster, with the micro-pump nozzle array swinging and spraying at full speed, the fan cluster running at the highest speed, and the controller sending an emergency alarm signal to the server.

[0084] In the third embodiment of the control method for the gas-liquid synergistic dynamic targeted cooling two-phase immersion liquid cooling system of the present invention, and in the fourth embodiment of the control method for the gas-liquid synergistic dynamic targeted cooling two-phase immersion liquid cooling system of the present invention, step S20 further includes:

[0085] Step S22, preset hysteresis temperature difference, wherein the hysteresis temperature difference is used to avoid the targeted cooling control mode from frequently switching modes based on preset micro-pump start threshold, fan coordination threshold and safe temperature threshold;

[0086] Step S23: When the targeted cooling mode is in emergency mode, if the difference between the safe temperature threshold and the temperature of the heating chip 6 does not exceed the hysteresis temperature difference, the emergency mode is maintained; if the difference between the safe temperature threshold and the temperature of the heating chip 6 exceeds the hysteresis temperature difference, the mode is switched to gas-liquid synergy mode.

[0087] Step S24: When the targeted cooling mode is in the gas-liquid synergy mode, if the difference between the fan synergy threshold and the temperature of the heating chip 6 does not exceed the hysteresis temperature difference, the gas-liquid synergy mode is maintained; if the difference between the fan synergy threshold and the temperature of the heating chip 6 exceeds the hysteresis temperature difference, the mode is switched to liquid phase mode.

[0088] Step S25: When the targeted cooling mode is in liquid phase mode, if the difference between the micro-pump start threshold and the temperature of the heating chip 6 does not exceed the hysteresis temperature difference, the liquid phase mode is maintained; if the difference between the micro-pump start threshold and the temperature of the heating chip 6 exceeds the hysteresis temperature difference, the mode is switched to standby mode.

[0089] Specifically, when the temperature of the heating chip 6 begins to drop and falls below the previous threshold (i.e., the start threshold of the current targeted cooling mode), a hysteresis temperature difference is introduced. The preset hysteresis temperature difference is used to prevent the heating chip 6 from frequently reaching the preset micro-pump start threshold, fan coordination threshold, and safe temperature threshold during the heating and cooling process, which would cause the corresponding targeted cooling mode to switch frequently.

[0090] In any of the second to fourth embodiments of the control method for the gas-liquid synergistic dynamic targeted cooling two-phase immersion liquid cooling system of the present invention, and in the fifth embodiment of the control method for the gas-liquid synergistic dynamic targeted cooling two-phase immersion liquid cooling system of the present invention, the method further includes:

[0091] In step S30, when the targeted cooling mode enters standby mode, the fan cluster enters low power mode, and the micro-pump nozzle array descends to the bottom of the immersion liquid pool to standby.

[0092] In step S40, when the targeted cooling mode enters the liquid phase mode, the micro-pump nozzle array rises to the heating chip 6 and sprays it onto the surface of the heating chip 6 in a directional manner.

[0093] In step S50, when the targeted cooling mode enters the gas-liquid synergy mode, the fan cluster is driven to move to the heat-generating chip 6 and adjust the pitch angle based on the liquid phase mode. The speed of the fan cluster increases linearly with the temperature of the heat-generating chip 6.

[0094] In step S60, when the targeted cooling mode enters the emergency mode, based on the gas-liquid synergy mode, the micro-pump nozzle array swings and sprays at full speed, the fan cluster runs at the highest speed, and the controller sends an emergency alarm signal to the server.

[0095] Specifically, when the targeted cooling mode enters the liquid phase mode, based on the number of heat-generating chips 6 whose temperature reaches the micro-pump start-up threshold and the corresponding server 5, the micro-pump nozzle unit corresponding to the server 5 is controlled to start. Thus, the micro-pump nozzle array can be activated by one or more micro-pump nozzle units to target and cool the corresponding heat-generating chip 6. When the targeted cooling mode enters the gas-liquid synergy mode, based on the number of heat-generating chips 6 whose temperature reaches the fan synergy threshold, the fan cluster can be activated by one or more fans 3 to target and cool the corresponding heat-generating chip 6, so that the fans 3 are two-dimensionally translated above the corresponding heat-generating chip 6.

[0096] The following provides a specific embodiment of the control method for the gas-liquid synergistic dynamic targeted cooling two-phase immersion liquid cooling system of the present invention:

[0097] Step S1: The controller monitors the real-time temperature of each heat-generating chip 6 using the temperature sensor 7. and the three-dimensional coordinate position of the heating chip 6 within the liquid-cooled cabinet 1 The system presets the micro-pump start threshold. Fan coordination threshold and chip safety temperature threshold ,and ,in, The settings are based on the thermal design temperature of the heating chip 6 and the operation and maintenance requirements. The X-axis is the width direction of the horizontal bar 2, the Y-axis is the length direction of the horizontal bar 2, and the Z-axis is the lifting direction of the micro-pump nozzle array.

[0098] Step S2, if < The targeted cooling mode enters a low-power standby mode. The controller controls the fan cluster to return to its original position and start running at initial speed. All micro-pump nozzle units descend to the bottom of the lifting guide column 11 and standby, maintaining only the minimum flow rate to maintain the uniform temperature of the immersion liquid pool. The system mainly operates with natural convection. The plate heat exchanger 15 of the external heat exchange mechanism 20 operates at a low load to match the low heat exchange requirements of the system.

[0099] Step S3, if The liquid phase mode is triggered for active heat dissipation. The controller controls the micropump nozzle unit to rise along the Z-axis until the central axis of the micropump nozzle 9 is horizontally aligned with the center of the heating chip 6. The heat exchange pump 14 is started, and the output power of the heat exchange pump 14 increases linearly with the temperature of the heating chip 6. The electric rotor 8 finely adjusts the spray direction of the micropump nozzle 9 to perform close-range directional spraying on the surface of the heating chip 6. The fan cluster remains in standby or cruising at low speed. The plate heat exchanger 15 of the external heat exchange mechanism 20 appropriately increases the refrigerant circulation efficiency according to the heat exchange load of the condenser 12.

[0100] Step S4, if This triggers the gas-liquid synergistic mode. While maintaining the operation of the micro-pump nozzle unit in step S3, the controller drives the crossbar 2 to translate along the X-axis to the hot spot (where the temperature exceeds...). At the corresponding position of the heating chip 6, the drive fan bracket 18 moves the fan 3 to the Y-axis position above the corresponding hot spot. The pitch angle of the fan 3 is adjusted by the electric actuator. The speed of the fan 3 increases linearly with the temperature of the heating chip 6. The plate heat exchanger 15 of the external heat exchange mechanism 20 switches to medium-high load operation, enhances the heat exchange between the refrigerant and the condenser 12, and quickly removes the accumulated steam heat.

[0101] Step S5, if The emergency mode is triggered. The controller controls the micro-pump nozzle unit to lock the optimal alignment height, the electric rotor 8 swings at full speed, and the output power of the heat exchange pump 14 is adjusted to the maximum value. The fan cluster is locked directly above the heat source by the crossbar 2 and the fan bracket 18. The speed of the fan 3 is adjusted to the maximum value. At the same time, an alarm signal is sent to the server 5 to reduce the main frequency load of the heating chip 6. The plate heat exchanger 15 of the external heat exchange mechanism 20 starts the full load operation mode to maximize the refrigerant heat exchange efficiency and work with the condenser 12 to quickly remove the system's maximum heat.

[0102] Step S6, when When the temperature drops below the previous threshold (i.e., the activation threshold of the current targeted cooling mode), a hysteresis temperature difference is introduced. Calculate the threshold of the previous level and The difference between them depends on whether the difference exceeds the hysteresis temperature difference. The controller determines whether the targeted cooling mode has fallen back to the previous level (it only falls back if it exceeds the previous level). If the targeted cooling mode gradually falls back, the controller will gradually reduce the speed of the fan 3 in reverse order from step S5, control the fan 3 to reset through the crossbar 2 and the fan bracket 18, reduce the power of the micro pump nozzle 9 and control the micro pump nozzle 9 to fall and reset. The plate heat exchanger 15 of the external heat exchange mechanism 20 will simultaneously reduce its operating efficiency according to the load gradient until the standby mode of step S2 is reached.

[0103] Furthermore, when the temperature sensor 7 fails to monitor the temperature of the heating chip 6, or the position feedback unit 13 fails to provide feedback on the lifting and lowering position of the micropump nozzle unit, or the communication between the controller and the fan cluster and the micropump nozzle array is interrupted, the output power of the heat exchange pump 14 is immediately adjusted to the maximum value, the electric rotor 8 drives the micropump nozzle 9 to swing and cover at full speed, the fan 3 moves to the entire area through the fan bracket 18 and runs at the highest speed, and the plate heat exchanger 15 of the external heat exchange mechanism 20 directly switches to the emergency full-load operation state to maximize the refrigerant circulation heat exchange capacity and work with the condenser 12 to quickly remove the large amount of heat accumulated in the system; at the same time, an emergency alarm signal is sent to the monitoring system associated with the server 5 and the server bracket 16 to remind the staff to troubleshoot the fault in time.

[0104] The technical solution of the present invention can monitor the temperature of the heating chip 6 in real time through a sensor array, obtain the temperature distribution of the heating chip 6 in the immersion liquid pool, and perform hierarchical control based on temperature feedback; and use a fan cluster capable of two-dimensional translation and pitch adjustment and a micro-pump nozzle array capable of lifting and lowering to construct a three-dimensional adjustment matrix to achieve gas-liquid dual-side synergistic effect, taking into account both global heat dissipation and local heat sources.

[0105] During operation, the controller, based on the hotspot coordinates fed back by the temperature sensor 7, drives the micro-pump nozzle unit to rise to the height of the hotspot and deliver a close-range lateral jet impact to the heating chip 6, actively disrupting the gas film boundary layer. Simultaneously, the controller schedules the fan cluster to create an adaptive airflow field above the hotspot, accelerating the steam flow towards the condenser 12. This invention achieves precise three-dimensional pinch-and-swap heat dissipation for local hotspots through spatial coordination and active control on both gas and liquid sides, improving the system's critical heat flux and temperature uniformity.

[0106] Specifically, the present invention has the following advantages:

[0107] First, this invention uses a micro-pump nozzle array that can rise and fall to deliver a high-intensity jet impact to the heating chip 6 at close range, actively destroying the insulating vapor film generated by film boiling on the surface of the heating chip 6, thus significantly delaying the occurrence of critical heat flux. At the same time, combined with a fan cluster capable of two-dimensional translation and pitch adjustment in the gas phase space, it accelerates the detachment of bubbles and the transport and condensation of vapor. By synergistically enhancing the heat transfer mechanism through active gas phase disturbance and directional liquid phase jet, this invention effectively solves the bottleneck of limited heat dissipation capacity of traditional passive two-phase immersion liquid cooling when dealing with extremely high heat flux density.

[0108] Secondly, this invention utilizes a fan cluster capable of two-dimensional translation and pitch adjustment to locate the target position in a two-dimensional plane and the lifting and lowering of the micro-pump nozzle unit, thus constructing a three-dimensional heat dissipation adjustment capability. Based on the real-time sensing of the temperature distribution of the heat-generating chip 6, it can physically locate the high-density heat flow area of ​​the heat-generating chip 6 for targeted enhanced cooling. Unlike the global uniform cooling of traditional liquid cooling systems, this invention achieves precise response to the dynamic thermal load of the server 5 and targeted elimination of local hot spots. It avoids over-cooling of non-hot spot areas and ensures the safety of critical heat sources, greatly improving the spatial adaptability of the system and ensuring the safe and stable operation of high-power electronic equipment.

[0109] Third, this invention employs a graded response closed-loop control method based on temperature thresholds. From low to high, it sets a micro-pump start-up threshold, a fan coordination threshold, and a safety temperature threshold. Based on the temperature gradient of the heating chip 6, it sequentially triggers the micro-pump jet, fan coordination, and full-power operation modes (emergency mode). Under low-load conditions, it relies solely on the low-power operation of the micro-pump nozzle unit or natural heat dissipation. High-energy-consuming components such as the micro-pump nozzle unit and fan clusters are only activated when necessary, significantly improving the system's energy efficiency ratio. This on-demand allocation of cooling effectively avoids energy waste and achieves the optimal balance between heat dissipation performance and operating energy consumption.

[0110] Fourth, the present invention has excellent flow field optimization capabilities and broad application prospects. The fan cluster is not only used for targeted heat dissipation, but the scanning action of the fan cluster pitching and freely translating in the two-dimensional plane effectively breaks the vapor covering layer above the liquid surface, promotes the flow of gaseous working fluid to the condenser 12, and optimizes the overall temperature uniformity in the sealed tank.

[0111] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a computer-readable storage medium (such as ROM / RAM, magnetic disk, optical disk) as described above, and includes several instructions to cause a terminal device to enter the methods of the various embodiments of the present invention.

[0112] In the description of this specification, references to terms such as "one embodiment," "another embodiment," "other embodiments," or "first embodiment to Xth embodiment," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, method steps, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0113] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or system. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or system that includes that element.

[0114] The sequence numbers of the above embodiments of the present invention are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0115] The above are merely preferred embodiments of the present invention and do not limit the scope of the patent. Any equivalent structural or procedural transformations made based on the description and drawings of the present invention, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of the present invention.

Claims

1. A gas-liquid synergistic dynamic targeted cooling two-phase immersion liquid cooling system, characterized in that, It includes a liquid-cooled cabinet (1), a controller, and server components, a three-dimensional adjustment matrix, and a sensor array respectively installed in the liquid-cooled cabinet (1); The liquid-cooled cabinet (1) includes an immersion liquid tank and a gas phase space above the immersion liquid tank; The server component is equipped with a heat-generating chip (6) immersed in a coolant in a immersion tank. The three-dimensional control matrix includes a fan cluster set in the gas phase space and a micro-pump nozzle array that can be raised and lowered integrated at the bottom of the immersion tank; The sensor array includes temperature sensors (7) respectively disposed on each heating chip (6); The controller is used to control the fan cluster to perform two-dimensional translation and pitch adjustment in the gas phase space based on the temperature of the heating chip (6) detected by the temperature sensor (7), so as to regulate the airflow field on the liquid surface and accelerate the rupture and detachment of bubbles and the steam condensation cycle on the surface of the heating chip (6). The controller is also used to control the micropump nozzle array to rise and fall according to the heat flux density area detected by the temperature sensor (7), to perform directional jet impact on the surface of the heating chip (6), and to use forced convection physics to destroy the gas film covering the surface of the heating chip (6) and suppress film boiling. The micropump nozzle array includes several micropump nozzle units; each server (5) is provided with a corresponding micropump nozzle unit; the micropump nozzle unit includes an electric rotor (8), a micropump nozzle (9), a lifting assembly, and a position feedback device (13); wherein, the lifting assembly includes a stepper motor (10), a lifting guide column (11), and a guide column limiting component (19); wherein, the lifting guide column (11) is spaced apart from the server (5), and the stepper motor (10) and the guide column limiting component (19) are respectively located on the lifting guide column (11); the micropump nozzle (9) is movably connected to the lifting guide column (11), and is driven to rise and fall along the lifting guide column (11) by the stepper motor (10), and the lifting stroke is limited by the guide column limiting component (19); the position feedback device (13) is located on the micropump nozzle (9) and is used to provide real-time feedback on the height of the micropump nozzle (9) along the lifting guide column (11); the electric rotor (8) is connected to the micropump nozzle (9) and is used to drive the micropump nozzle (9) to swing to expand the spray range; The fan cluster includes a crossbar (2), a fan (3), a drive mechanism (4), and a fan bracket (18). The crossbar (2) is at least one in number. The crossbar (2) is set in the gas phase space and is slidably connected to the liquid cooling cabinet (1) so that the crossbar (2) can move along its width direction. The crossbar (2) has a slide rail along its length direction. Each crossbar (2) is provided with a fan bracket (18). The fan bracket (18) is slidably connected to the slide rail of the crossbar (2) so that the fan bracket (18) can move along the length direction of the crossbar (2). Each fan bracket (18) is provided with an electric actuator, and each fan bracket (18) is connected to a fan (3). The fan (3) is driven to translate by the crossbar (2) and the fan bracket (18) to move in two dimensions in the plane of the gas phase space, and is driven by the electric actuator to adjust the pitch angle. The drive mechanism (4) includes a first drive component for driving the crossbar (2) to move and a second drive component for driving the fan bracket (18) to move.

2. The gas-liquid synergistic dynamic targeted cooling two-phase immersion liquid cooling system according to claim 1, characterized in that, The server components include a server bracket (16) and a server (5); the server bracket (16) is located at the bottom of the liquid cooling cabinet (1); the server (5) includes at least two, and multiple servers (5) are vertically inserted on the server bracket (16) at intervals, and each server (5) is provided with a heat-generating chip (6).

3. The gas-liquid synergistic dynamic targeted cooling two-phase immersion liquid cooling system according to claim 1 or 2, characterized in that, The liquid-cooled cabinet (1) has a cooling liquid suction hole (17) at the bottom for replenishing the coolant; a condenser (12) is provided in the gas phase space for condensing the coolant vapor; an external heat exchange mechanism (20) connected to the condenser (12) is provided outside the liquid-cooled cabinet (1); the external heat exchange mechanism (20) includes a heat exchange pump (14) and a plate heat exchanger (15).

4. A control method for a gas-liquid synergistic dynamic targeted cooling two-phase immersion liquid cooling system, characterized in that, Targeted cooling is performed using a gas-liquid synergistic dynamic targeted cooling two-phase immersion liquid cooling system as described in any one of claims 1 to 3; the method includes the following steps: Obtain the three-dimensional coordinate position of each heating chip (6) in the liquid cooling cabinet (1); obtain the temperature of each heating chip (6) collected by the temperature sensor (7); preset the micro pump start threshold, fan coordination threshold and safety temperature threshold from low to high; Based on the temperature of the heating chip (6) detected by the temperature sensor (7), the fan cluster is controlled to perform two-dimensional translation and pitch adjustment in the gas phase space to regulate the airflow field on the liquid surface, accelerate the rupture and detachment of bubbles and the steam condensation cycle on the surface of the heating chip (6), and based on the heat flux density area detected by the temperature sensor (7), the micro pump nozzle array is controlled to rise and fall to perform directional jet impact on the surface of the heating chip (6), and the forced convection physical destruction of the gas film covering the surface of the heating chip (6) is used to suppress film boiling.

5. The control method for the gas-liquid synergistic dynamic targeted cooling two-phase immersion liquid cooling system according to claim 4, characterized in that, The steps of controlling the fan cluster to perform two-dimensional translation and pitch adjustment in the gas phase space based on the temperature of the heating chip (6) detected by the temperature sensor (7) to regulate the airflow field on the liquid surface, accelerate the rupture and detachment of bubbles and the steam condensation cycle on the surface of the heating chip (6), and controlling the micro-pump nozzle array to rise and fall according to the heat flux density area detected by the temperature sensor (7) to perform directional jet impact on the surface of the heating chip (6), and using forced convection physics to destroy the gas film covering the surface of the heating chip (6) and suppress film boiling include: Based on the temperature of the heating chip (6) detected by the temperature sensor (7), the initial target cooling mode of the three-dimensional adjustment matrix is ​​determined; and based on the three-dimensional coordinate position of the heating chip (6) in the liquid cooling cabinet (1), the three-dimensional action position of the three-dimensional adjustment matrix is ​​determined; wherein, the target cooling mode includes standby mode, liquid phase mode, gas-liquid synergy mode and emergency mode.

6. The control method for the gas-liquid synergistic dynamic targeted cooling two-phase immersion liquid cooling system according to claim 5, characterized in that, The step of determining the initial targeted cooling mode of the three-dimensional adjustment matrix based on the temperature of the heat-generating chip (6) detected by the temperature sensor (7) includes: When the temperature of the heat-generating chip (6) is less than the micro-pump start-up threshold, the targeted cooling mode is determined to be the standby mode; When the temperature of the heat-generating chip (6) reaches the micro-pump start-up threshold and is less than the fan coordination threshold, the targeted cooling mode is determined to be liquid phase mode; When the temperature of the heat-generating chip (6) reaches the fan-coordinated threshold and is less than the safe temperature threshold, the targeted cooling mode is determined to be the gas-liquid coordinated mode. When the temperature of the heat-generating chip (6) reaches the safe temperature threshold, the targeted cooling mode is determined to be the emergency mode.

7. The control method for the gas-liquid synergistic dynamic targeted cooling two-phase immersion liquid cooling system according to claim 6, characterized in that, The steps of controlling the fan cluster to perform two-dimensional translation and pitch adjustment in the gas phase space based on the temperature of the heating chip (6) detected by the temperature sensor (7) to regulate the airflow field on the liquid surface, accelerate the rupture and detachment of bubbles and the steam condensation cycle on the surface of the heating chip (6), and controlling the micro-pump nozzle array to rise and fall according to the heat flux density area detected by the temperature sensor (7) to perform directional jet impact on the surface of the heating chip (6), using forced convection to physically destroy the gas film covering the surface of the heating chip (6) and suppress film boiling, further include: A preset hysteresis temperature difference is used to prevent the targeted cooling control mode from frequently switching modes based on preset micro-pump start threshold, fan coordination threshold, and safe temperature threshold. When the targeted cooling mode is in emergency mode, if the difference between the safe temperature threshold and the temperature of the heating chip (6) does not exceed the hysteresis temperature difference, the emergency mode is maintained; if the difference between the safe temperature threshold and the temperature of the heating chip (6) exceeds the hysteresis temperature difference, the gas-liquid synergy mode is switched. When the targeted cooling mode is in the gas-liquid synergy mode, if the difference between the fan synergy threshold and the temperature of the heating chip (6) does not exceed the hysteresis temperature difference, the gas-liquid synergy mode is maintained; if the difference between the fan synergy threshold and the temperature of the heating chip (6) exceeds the hysteresis temperature difference, the mode is switched to liquid phase mode. When the targeted cooling mode is in liquid phase mode, if the difference between the micro-pump start threshold and the temperature of the heating chip (6) does not exceed the hysteresis temperature difference, the liquid phase mode is maintained; if the difference between the micro-pump start threshold and the temperature of the heating chip (6) exceeds the hysteresis temperature difference, the mode is switched to standby mode.

8. The control method for the gas-liquid synergistic dynamic targeted cooling two-phase immersion liquid cooling system according to any one of claims 5 to 7, characterized in that, The method further includes: When the targeted cooling mode enters standby mode, the fan cluster enters low power mode, and the micro-pump nozzle array descends to the bottom of the immersion liquid pool for standby. When the targeted cooling mode enters the liquid phase mode, the micro-pump nozzle array rises to the heating chip (6) and sprays it onto the surface of the heating chip (6) in a directional manner; When the targeted cooling mode enters the gas-liquid synergy mode, the fan cluster is driven to move to the heat-generating chip (6) and adjust the pitch angle based on the liquid phase mode. The speed of the fan cluster increases linearly with the temperature of the heat-generating chip (6). When the targeted cooling mode enters the emergency mode, based on the gas-liquid synergy mode, the micro-pump nozzle array swings and sprays at full speed, the fan cluster runs at the highest speed, and the controller sends an emergency alarm signal to the server.

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