LED packaging device and backlight module
By using a mixture of nitride-based and fluoride-based red phosphors and a multi-optical cavity design in LED packaging devices, the problems of low blue light absorption efficiency and color crosstalk are solved, achieving a high color gamut red display effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-02-03
- Publication Date
- 2026-05-15
AI Technical Summary
In existing technologies, the KSF phosphor solution has limited blue light absorption efficiency and color crosstalk issues, resulting in impure red display and difficulty in meeting the high color gamut BT.2020 standard.
Nitride-based red phosphor and fluoride-based red phosphor are mixed in a set ratio and combined with a multi-optical cavity design, red light, blue light and green light generating components are set up separately, and each primary color light source is physically isolated to ensure spectral purity.
It achieves high-color-purity red light conversion under high brightness, effectively isolates crosstalk of the three primary colors, meets the color requirements of the BT.2020 standard, and improves the display effect.
Smart Images
Figure CN122054785A_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of display technology, and more particularly to an LED packaging device and a backlight module. Background Technology
[0002] With the continuous development of display technology, high color gamut display has become an essential requirement for high-end display devices. This is especially true for the BT.2020 standard, which covers a wider range of colors, where high coverage has become a crucial technological challenge. Traditional LED backlights primarily use blue chips to excite yellow, red, or green phosphors in their packaging structure. However, the emission spectra of yellow and green phosphors typically have a wide full width at half maximum (FWHM), directly affecting the purity of green and thus limiting the improvement of the color gamut.
[0003] To overcome this limitation, the industry has proposed various improvement schemes. Regarding red light, KSF phosphors, due to their relatively narrow half-width at half-maximum (WHM), have become the mainstream choice for achieving a high color gamut. The technical route of adding KSF phosphor to blue LED chips to achieve red light conversion is widely adopted. However, KSF-based solutions have inherent physical limitations. First, KSF materials have limited absorption efficiency for excitation blue light, especially in Mini-LED applications where the phosphor concentration is limited, making it difficult to completely convert incident blue light into red light. For example... Figure 1 As shown, when displaying a red image, the blue light used to excite the KSF cannot be completely absorbed. The unabsorbed residual blue light mixes with the converted red light, resulting in the final emitted light not being pure red, but rather appearing pink or purplish-red, severely affecting the purity of the red display. Secondly, this solution suffers from serious color crosstalk problems.
[0004] In summary, how to completely absorb the blue light that excites red light is a technical problem that urgently needs to be solved. Summary of the Invention
[0005] In view of this, the present disclosure provides an LED packaging device and a backlight module to solve the technical problem of impure primary color light caused by leakage of excitation light in the prior art.
[0006] To achieve the above objectives, the technical solution adopted in this disclosure is: A first aspect of this disclosure provides an LED packaging device, comprising: a substrate; a red light generating component, including a first blue LED chip and a red wavelength conversion material for converting blue light emitted by the first blue LED chip into red light, disposed in a first optical cavity on the substrate, wherein the red wavelength conversion material is a mixture of nitride-based red phosphor and fluoride-based red phosphor with an emission peak wavelength of 600nm-670nm mixed in a predetermined ratio; a blue light generating component and a green light generating component, respectively for generating blue light and green light, disposed in other optical cavities outside the first optical cavity on the substrate.
[0007] In some embodiments, the ratio of nitride-based red phosphor to fluoride-based red phosphor is from 1:0.1 to 1:10.
[0008] In some embodiments, the other optical cavity includes a second optical cavity and a third optical cavity; the blue light generating component and the green light generating component are respectively disposed separately in the second optical cavity and the third optical cavity; or, the blue light generating component and the green light generating component are disposed in the same other optical cavity.
[0009] In some embodiments, a fourth optical cavity is further provided on the substrate, and a fourth primary color generating component is disposed in the fourth optical cavity. The fourth primary color generating component includes a fourth primary color chip.
[0010] In some embodiments, the blue light generating component includes a second blue LED chip, and the green light generating component includes a green LED chip; or, the blue light generating component includes a second blue LED chip, and the green light generating component includes a third blue LED chip and a green wavelength conversion material covering the light-emitting surface of the third blue LED chip; wherein, the green wavelength conversion material includes β-SiAlON green phosphor material with an emission peak wavelength of 520nm-550nm, or cadmium selenide or perovskite green quantum dots.
[0011] In some embodiments, the red wavelength conversion material is a mixture of nitride-based red phosphor with an emission peak wavelength of 620nm-660nm, fluoride-based red phosphor with an emission peak wavelength of 625nm-635nm, and red quantum dot material mixed in a set ratio.
[0012] In some embodiments, the first optical cavity and other optical cavities are formed by an integrally molded support cup; or, in some embodiments, the first optical cavity and other optical cavities are formed by a dam structure disposed on a substrate.
[0013] In some embodiments, the mixture of nitride-based red phosphor and fluoride-based red phosphor in the red light generating component is uniformly dispersed in the encapsulating colloid and covers the first blue LED chip; or, the mixture of nitride-based red phosphor and fluoride-based red phosphor is located in the red conversion layer in the light emission direction of the first blue LED chip.
[0014] In some embodiments, the support of the bracket cup is provided with six independent pads for providing independent three-way power connections for the first blue LED chip, the blue light generating component, and the green light generating component.
[0015] A second aspect of the present disclosure provides a backlight module that includes a plurality of LED packaging devices according to the first aspect of the present disclosure.
[0016] The beneficial effects of this disclosed embodiment compared to the prior art include: By mixing fluoride-based red phosphor and nitride-based red phosphor, the technical solution of this disclosed embodiment can fully absorb blue light. Although the half-width at half-maximum (WHM) of nitride-based red phosphor is wider, by selecting a specific wavelength range and mixing it with fluoride-based red phosphor in a set ratio, the WHM can still be reduced. Due to higher color purity, a higher color gamut can be obtained while maintaining high brightness. Simultaneously, the multi-optical cavity design can effectively isolate and eliminate crosstalk and mutual excitation between the three primary colors, ensuring the purity of the three primary colors, thereby meeting a wider range of BT.2020 standard color requirements. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a schematic diagram of the backlight spectrum when the displayed image is red, as shown in existing technology; Figure 2 This is a schematic diagram of an LED packaging device provided in an embodiment of this disclosure; Figure 3 This is a schematic diagram of another LED packaging device provided in an embodiment of this disclosure; Figure 4 This is a schematic diagram of the backlight spectrum when the display screen is red in an embodiment of this disclosure; Figure 5 This is a schematic diagram of yet another LED packaging device provided in the embodiments of this disclosure; Figure 6This is a schematic diagram of the blue light spectrum of the backlight module provided in the embodiments of this disclosure; Figure 7 This is a schematic diagram of the green light spectrum of the backlight module provided in the embodiments of this disclosure; Figure 8 This is a schematic diagram of the red light spectrum of the backlight module provided in the embodiments of this disclosure. Detailed Implementation
[0019] To make the technical problems, technical solutions, and beneficial effects to be solved by this disclosure clearer, the disclosure will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only for explaining this disclosure and are not intended to limit this disclosure.
[0020] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it may be directly or indirectly located on that other component. When a component is referred to as "connected to" another component, it may be directly or indirectly connected to that other component. The terms "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate orientations or positions based on the accompanying drawings, and are for ease of description only, and should not be construed as limiting the technical solution. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "A plurality" means two or more, unless otherwise explicitly defined.
[0021] In related technologies, display solutions using Mini LED backlight modules can improve black-and-white contrast and high dynamic range. Combined with a high color gamut LED backlight, the display color gamut can be improved simultaneously. The blue LED chip and green LED chip in this embodiment can also be Mini LED chips, where Mini LED refers to LED chips with a size on the order of 100μm or larger high-voltage flip-chip LED chips.
[0022] Existing technologies face fundamental challenges in achieving pure light source spectra, particularly in terms of color purity. Specifically, when displaying red images, the blue light used to excite the KSF (Knowledge Source Function) cannot be completely absorbed. The unabsorbed residual blue light mixes with the converted red light, causing the backlight to appear pink or purple, thus affecting the purity of the backlight spectrum.
[0023] To address the above technical problems, this disclosure provides an LED packaging device and a backlight module.
[0024] The LED packaging device and backlight module according to embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings.
[0025] Figure 2 This is a schematic diagram of an LED packaging device provided in an embodiment of this disclosure; Figure 3 This is a schematic diagram of another LED packaging device provided in an embodiment of this disclosure; Figure 4 This is a schematic diagram of the backlight spectrum when the display screen is red in an embodiment of this disclosure; Figure 5 This is a schematic diagram of yet another LED packaging device provided in the embodiments of this disclosure; Figure 6 This is a schematic diagram of the blue light spectrum of the backlight module provided in the embodiments of this disclosure; Figure 7 This is a schematic diagram of the green light spectrum of the backlight module provided in the embodiments of this disclosure; Figure 8 This is a schematic diagram of the red light spectrum of the backlight module provided in the embodiments of this disclosure. The following is in conjunction with... Figures 2 to 8 The LED packaging device and backlight module provided in the embodiments of this disclosure will be described together.
[0026] like Figure 2 As shown, the LED packaging device of this embodiment includes: a substrate 110; a red light generating component, including a first blue LED chip 121 and a red wavelength conversion material for converting the blue light emitted by the first blue LED chip into red light, disposed in a first optical cavity on the substrate, wherein the red wavelength conversion material may be doped into the silicone 131 filled in the first optical cavity, and the red wavelength conversion material is a mixture of nitride-based red phosphor and fluoride-based red phosphor with an emission peak wavelength of 600nm-670nm mixed in a set ratio, wherein the nitride-based red phosphor preferably includes nitride-based red phosphor with an emission peak wavelength greater than 630nm; the fluoride-based red phosphor preferably has an emission peak wavelength of 631nm; a blue light generating component and a green light generating component, respectively for generating blue light and green light, disposed in other optical cavities outside the first optical cavity on the substrate. Figure 2 In the LED packaging device shown, the blue light generating component and the green light generating component are jointly disposed in the same other optical cavity. The blue light generating component can be a second blue LED chip 122, and the green light generating component can be a third blue LED chip 123. The other optical cavity is filled with silicone 132 doped with green wavelength conversion material. In the embodiments of this disclosure, the first optical cavity and the other optical cavities are physically isolated from each other.
[0027] In the embodiments of this disclosure, the weight ratio of nitride-based red phosphor to fluoride-based red phosphor is from 1:0.1 to 1:10. Specifically, the ratio of nitride-based red phosphor to fluoride-based red phosphor can be 1:0.1, 1:0.2, 1:0.5, 1:1, 1:2, 1:3, 1:4, 1:5, 1:10, and is not limited thereto.
[0028] In one embodiment, the filling material in the first optical cavity is mixed in the following weight ratio: 30g of nitride-based red phosphor and 75g of fluoride-based red phosphor are mixed in every 100g of silicone, wherein the ratio of nitride-based red phosphor to fluoride-based red phosphor is 1:2.5.
[0029] like Figure 3 In the LED packaged device shown, the red light generating component includes a first blue LED chip 221 and a mixture of nitride-based red phosphor with an emission peak wavelength greater than 620nm and fluoride-based red phosphor with an emission peak wavelength of 631nm, used to convert the blue light emitted by the first blue LED chip into red light. The mixture is disposed in a first optical cavity on the substrate. The nitride-based red phosphor and the fluoride-based red phosphor can be mixed in a specific ratio and then doped into the silicone 231 filled in the first optical cavity. The blue light generating component and the green light generating component are used to generate blue light and green light, respectively, and are disposed in the same other optical cavity. The blue light generating component can be a second blue LED chip 223, and the green light generating component can be a green LED chip 222. The other optical cavity is filled with silicone 232.
[0030] The red light generating component of this disclosure embodiment is confined within a separate first optical cavity. The red wavelength conversion material also includes a mixture of nitride-based red phosphor with an emission peak wavelength of 620nm-660nm and fluoride-based red phosphor with an emission peak wavelength of 625nm-635nm, mixed in a predetermined ratio. For example, by using both nitride-based red phosphor with an emission peak wavelength greater than 620nm and fluoride-based red phosphor with an emission peak wavelength of 631nm as red wavelength conversion materials, almost all excitation blue light can be absorbed and converted into high-purity red light. This eliminates the need for an additional blue light filtering structure to output spectrally pure red light, simplifying the design and improving reliability, thus laying a pure red primary color foundation for high color gamut displays. The nitride-based red phosphor in this disclosure embodiment can be selected from (Sr,Ca)AlSiN3:Eu2. + The system has an emission peak wavelength between 630-650nm, such as 637nm, and is not limited to this.
[0031] like Figure 1 As shown, single fluoride-based red phosphors cannot completely absorb blue light, such as... Figure 4 The material shown uses nitride-based red phosphor or a mixture of nitride-based red phosphor and fluoride-based red phosphor, which can absorb almost all blue light.
[0032] Furthermore, nitride-based red phosphors with emission peak wavelengths of 620nm-660nm are preferred, while fluoride-based red phosphors can have emission peak wavelengths of 625-635nm.
[0033] like Figure 2 and Figure 3 As shown, the volume of the other optical cavities is greater than the volume of the first optical cavity. Specifically, the volume of the other optical cavities is significantly larger than the volume of the first optical cavity, and the volume ratio can be set between 1.5:1 and 3:1. Figure 2 and Figure 3 The technical solution is a classic and efficient dual-cavity "large bowl + small bowl" layout. This layout places the red light generating component, which requires high purity and independent control, in a smaller, independent cavity, while the blue and green light generating components, which have better spectral compatibility, are placed together in a larger cavity. This layout physically isolates the red light from the blue / green light interference, ensuring the purity of the red light. Simultaneously, the shared cavity design simplifies the packaging structure of the blue and green components, reduces costs, and utilizes the cavity volume difference to adapt to the different light color requirements for light output or mixing space, achieving an optimized balance between performance and cost.
[0034] like Figure 2 In the illustrated technical solution, the green light generating component includes a third blue LED chip and a green wavelength conversion material covering the light-emitting surface of the third blue LED chip. The green wavelength conversion material is a β-SiAlON green phosphor material with an emission peak wavelength of 520nm-550nm, or cadmium selenide or perovskite green quantum dots. This solution uses a technologically mature, low-cost, and highly reliable blue LED chip as the basic light source, and flexibly adjusts the wavelength and color purity of the green light by selecting different green conversion materials. This provides greater flexibility for supply chain management and product cost control, while quantum dot materials can also provide high-purity green light.
[0035] Adopting such Figure 3 The technical solution shown uses native green LED chips to provide green light. The full width at half maximum (FWHM) of its emission spectrum is typically narrower than that of green phosphors excited by blue light, thus providing higher purity green light. Combined with high-purity red and blue light, this solution can ensure the realization of a high color gamut from the three primary color sources of red, green, and blue, which is particularly beneficial for meeting display standards with extremely high requirements for green saturation.
[0036] like Figure 5As shown, other optical cavities include a second optical cavity and a third optical cavity; the blue light generating component and the green light generating component are respectively disposed separately in the second optical cavity and the third optical cavity. Specifically, a first blue LED chip 321 is disposed in the first optical cavity, and a mixture 331 of nitride-based red phosphor with an emission peak wavelength greater than 620 nm and fluoride-based red phosphor with an emission peak wavelength of 631 nm in silicone is coated on top of the first blue LED chip 321. A second blue LED chip 322 is disposed in the second optical cavity, and a silicone 332 doped with green phosphor material or green quantum dots is coated on top of the second blue LED chip 322. A second blue LED chip 323 is disposed in the third optical cavity, and a silicone 333 is coated on top of the second blue LED chip 323.
[0037] This scheme defines a specific layout where the three cavities are completely independent. The components generating red, blue, and green light are physically separated, achieving the highest degree of optical isolation. This layout completely eliminates any potential optical crosstalk between different color light sources, allowing each color to be driven and controlled most precisely and independently. This is particularly beneficial for achieving ultra-high contrast and ultra-high dimming precision in Mini LED backlight systems, enabling ultimate dynamic picture performance.
[0038] In some embodiments of this disclosure, a fourth optical cavity may also be disposed on the substrate, and a fourth primary color generating component is disposed within the fourth optical cavity. The fourth primary color generating component includes a fourth primary color chip. The fourth primary color generating component may be a cyan generating component, and the fourth primary color chip may be a cyan chip, but is not limited thereto.
[0039] Adding a fourth primary color, such as cyan, helps to expand the "color gamut polygon," fill the "cyan gap" in the LED spectrum, and further improve the BT.2020 color gamut coverage area.
[0040] In another embodiment of this disclosure, the blue light generating component can be a second blue LED chip, the green light generating component can be a green LED chip, and the other optical cavities include a second optical cavity and a third optical cavity; the blue light generating component and the green light generating component are respectively disposed separately in the second optical cavity and the third optical cavity. The green LED chip is disposed in the second optical cavity, and the second blue LED chip is disposed in the third optical cavity.
[0041] In this embodiment of the disclosure, the mixture of nitride-based red phosphor and fluoride-based red phosphor in the red light generating component can be uniformly dispersed in the encapsulating colloid and cover the first blue LED chip, or it can be located in the red conversion layer in the light emission direction of the first blue LED chip.
[0042] Among these options, the phosphor dispersion in a colloid is a simple and mature process that allows for close contact between the phosphor and the chip, resulting in high conversion efficiency. The independent red conversion layer option, on the other hand, keeps the phosphor away from the chip's heat source, improving its operating environment, enhancing luminous efficiency stability and lifespan, and potentially achieving a more uniform light-emitting surface. These two options provide choices for different application scenarios and performance requirements.
[0043] The three LED chips in the LED packaging device of this disclosure embodiment can be three blue LED chips, or two blue LED chips and one green LED chip, forming a BGB combination.
[0044] These two blue LED chips and one green LED chip can be either standard or flip-chip and can be driven and controlled independently.
[0045] The LED packaging device of this disclosure can have six independent pads on the support of the bracket cup for providing independent three-way power connections for the first blue LED chip, the blue light generating component, and the green light generating component. The six pads are asymmetrically arranged, suitable for eutectic or wire bonding of upright chips; or, the six pads are symmetrically arranged, suitable for eutectic bonding of flip chips. The aforementioned support can be a one-piece molded plastic reflective support, formed on the substrate through a molding process.
[0046] By setting up six pads to achieve three independent power supplies, the red, blue, and green light-emitting components can be driven and dimmed completely independently. This is the basis for realizing dynamic backlighting (Local Dimming) and high-precision color adjustment. It can adjust the brightness of each primary color in real time and independently according to the content of the picture, thereby significantly improving the contrast of the display, reducing halo and achieving more accurate color reproduction.
[0047] Figure 2 , Figure 3 and Figure 5 The technical solution adopts a one-piece molded bracket cup packaging form. This structure has mature technology and high reliability. The cup itself can be designed with reflective sidewalls to form a reflective cup structure, which helps to improve light extraction efficiency and reduce light loss. This structure provides a robust and reliable physical isolation barrier for each optical cavity, effectively preventing light diffusion between adjacent cavities, further enhancing the optical isolation effect, and helping to maintain the purity of each color of light.
[0048] like Figure 6 , Figure 7 and Figure 8 The figures shown are as follows: Figure 5 The blue, green, and red light spectra of the LED packaged device shown indicate that the purity of each color spectrum is high.
[0049] The LED packaging device disclosed in this embodiment is not limited to the above-mentioned POB (Package on Board) packaging form of LED packaging device, but can also be a COB (Chip on Board), CSP (Chip Scale Package), and NCSP (Near Chip Scale Package) packaging form of LED packaging device.
[0050] When the LED packaging device in this embodiment is a COB packaged LED device, the optical cavity is formed by a dam structure disposed on a substrate. The substrate can be a ceramic or metal substrate. A dam structure can be formed on the substrate by applying a highly reflective white dam adhesive. This dam structure encloses at least two regions on the substrate, each serving as at least two optical cavities. In the first optical cavity, a first blue LED chip can be mounted using a eutectic or die-bonding process, and silicone doped with nitride-based red phosphor can be deposited to form a red light generating component. In the other optical cavities, a second blue LED chip and a green LED chip can be mounted side-by-side using the same process and deposited with transparent silicone to form a blue-green light emitting unit. Each chip is independently electrically connected and driven through circuit traces inside the substrate or additional bonding wires.
[0051] The nitride-based red phosphor in this embodiment cannot be placed in other optical cavities, as the green light in other optical cavities can also excite the nitride-based red phosphor, thereby affecting the emission of green light.
[0052] In this embodiment, the specific nitride-based red phosphor structure can be CASN (CaAlSiN3:Eu) and SCASN ((Sr,Ca)AlSiN3:Eu), with an emission peak wavelength of 630nm-650nm. The specific fluoride-based red phosphor structure can be KSF (K2SiF6:Mn4+) and KGF (K2GeF6:Mn4+), with an emission peak wavelength of 625nm-635nm. The nitride-based red phosphor and the fluoride-based red phosphor are mixed at a weight ratio of 1:2.5, and then mixed with silicone at a powder-to-resin weight ratio of 1:1. After being coated onto the blue light chip, it can fully absorb the blue light that KSF alone cannot completely absorb, thereby emitting pure red light.
[0053] In this embodiment, the red wavelength conversion material can be a mixture of three materials, including a nitride-based red phosphor with an emission peak wavelength of 600nm-670nm, a fluoride-based red phosphor with an emission peak wavelength of around 625nm-635nm, and cadmium selenide or perovskite red quantum dots with an emission peak wavelength of 620nm-650nm. The three materials are mixed in a specific ratio to optimize the blue light conversion rate, full width at half maximum (FWHM), light conversion efficiency, and brightness.
[0054] In this embodiment of the disclosure, the proportion of nitride-based red phosphor in all red conversion materials can be 100% or less than 100%, but not less than 10%.
[0055] In this solution, optical cavities are divided on the substrate by using dammed adhesive. This method is very suitable for manufacturing large-size, highly integrated backlight modules, enabling denser chip arrangement and more flexible shape design, while retaining the core advantages of optical isolation and red light purification, and adapting to the modern display technology's demand for thinner and higher-density designs.
[0056] In this embodiment, the blue LED chip has a dominant emission wavelength of 445nm to 465nm, and the green LED chip has a dominant emission wavelength of 520nm to 565nm. The wavelength ranges selected for these blue and green LED chips represent typical and optimized ranges for achieving high color gamut standards such as DCI-P3 and Rec.2020 in the industry, ensuring a high starting point for the color purity of the three primary colors and providing a reliable spectral basis for ultimately achieving ultra-wide color gamut display.
[0057] This disclosure provides a backlight module comprising multiple LED packaging devices described above. The backlight module, composed of multiple high-performance LED packaging devices, inherits the advantages of each device, such as high color purity and low crosstalk, thereby enabling the entire backlight module to output backlight with a wider color gamut, more accurate colors, and higher contrast, ultimately significantly improving the image quality of the terminal display device.
[0058] According to the LED packaging device and backlight module provided in this disclosure, by using both a nitride-based red phosphor with an emission peak wavelength greater than 630nm and a fluoride-based red phosphor with an emission peak wavelength of 631nm as red wavelength conversion materials, blue light can be fully absorbed. Although the nitride-based red phosphor has a wider half-width at half-maximum (WHM), by selecting a specific wavelength range and mixing it with the fluoride-based red phosphor in a set ratio, the WHM can still be reduced. Due to the higher color purity, a higher color gamut can be obtained while maintaining high brightness. Simultaneously, the multi-optical cavity design effectively isolates and eliminates crosstalk and mutual excitation between the three primary colors, ensuring the purity of the three primary colors and thus meeting a wider range of BT.2020 standard color requirements.
[0059] The technical solution of the disclosed embodiment uses a nitride-based red phosphor with an emission peak wavelength greater than 620nm and a fluoride-based red phosphor with an emission peak wavelength of 631nm as red wavelength conversion materials, which can absorb almost all of the excitation blue light and convert it into high-purity red light.
[0060] The above are merely preferred embodiments of this disclosure and are not intended to limit this disclosure. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.
Claims
1. An LED packaging device, characterized in that, include: substrate; A red light generating component, including a first blue LED chip and a red wavelength conversion material for converting the blue light emitted by the first blue LED chip into red light, is disposed in a first optical cavity on the substrate. The red wavelength conversion material is a mixture of nitride-based red phosphor and fluoride-based red phosphor with emission peak wavelengths of 600nm-670nm in a set ratio. Blue light generating component and green light generating component, used to generate blue light and green light respectively, are disposed in other optical cavities other than the first optical cavity on the substrate.
2. The LED packaging device according to claim 1, characterized in that, The weight ratio of nitride-based red phosphor to fluoride-based red phosphor is 1:0.1 to 1:
10.
3. The LED packaging device according to claim 1, characterized in that, The other optical cavities include a second optical cavity and a third optical cavity; the blue light generating component and the green light generating component are respectively disposed separately in the second optical cavity and the third optical cavity; or, the blue light generating component and the green light generating component are disposed in the same other optical cavity.
4. The LED packaging device according to claim 1, characterized in that, The substrate is further provided with a fourth optical cavity, and a fourth primary color generating component is disposed in the fourth optical cavity. The fourth primary color generating component includes a fourth primary color chip.
5. The LED packaging device according to claim 1, characterized in that, The blue light generating component includes a second blue LED chip, and the green light generating component includes a green LED chip, or; the blue light generating component includes a second blue LED chip, and the green light generating component includes a third blue LED chip and a green wavelength conversion material covering the light-emitting surface of the third blue LED chip; wherein the green wavelength conversion material includes β-SiAlON green phosphor material with an emission peak wavelength of 520nm-550nm, or cadmium selenide or perovskite green quantum dots.
6. The LED packaging device according to claim 1, characterized in that, The red wavelength conversion material is a mixture of nitride-based red phosphor with an emission peak wavelength of 620nm-660nm, fluoride-based red phosphor with an emission peak wavelength of 625nm-635nm, and red quantum dot material in a set ratio.
7. The LED packaging device according to claim 1, characterized in that, The first optical cavity and the other optical cavities are formed by an integrally molded support cup, or the first optical cavity and the other optical cavities are formed by a dam structure disposed on the substrate.
8. The LED packaging device according to claim 1, characterized in that, The mixture of nitride-based red phosphor and fluoride-based red phosphor in the red light generating component is uniformly dispersed in the encapsulating colloid and covers the first blue LED chip; or, the mixture of nitride-based red phosphor and fluoride-based red phosphor is located in the red conversion layer in the light emission direction of the first blue LED chip.
9. The LED packaging device according to claim 7, characterized in that, The bracket cup has six independent solder pads on its support, which are used to provide independent three-way power connections for the first blue LED chip, the blue light generating component, and the green light generating component.
10. A backlight module, characterized in that, It includes a plurality of LED packaging devices as described in any one of claims 1 to 9.