Display panel and display device

Abstract

The embodiment of the invention provides a display panel and a display device, the display panel comprises an array substrate, a functional layer and a protective layer, the array substrate comprises a substrate and a back wire located on the back surface of the substrate, the functional layer is located on the back surface of the substrate, and the protective layer is located on the back surface of the substrate; wherein the back wiring comprises a first wiring section, the first wiring section is located in a first area, and the first area is an area close to the edge of the array substrate or an area not overlapped with the functional layer; at least part of the first wiring section is overlapped with the first protection layer. According to the technical scheme provided by the invention, at least part of the first wiring section exposed by the functional layer is protected by the protective layer through the arrangement of the protective layer, so that the abrasion of the first wiring section in the subsequent preparation process is reduced, and the problem that the first wiring section is eroded by water and oxygen is solved; and the risk that water and oxygen spread to other parts of the back wiring through the first wiring section to cause erosion of the back wiring is reduced.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display panel and display device. Background Technology

[0002] With the development of display technology, display panels are becoming increasingly diverse in form. To meet users' demands for visual effects, narrow bezel or borderless designs are gradually becoming a trend. However, in narrow bezel or borderless display panels, the reliability of signal lines at the edges is relatively poor. Summary of the Invention

[0003] In view of this, embodiments of this application provide a display panel and a display device to solve the above problems.

[0004] In a first aspect, this application provides a display panel, comprising: an array substrate, a functional layer, and a protective layer. The array substrate includes a substrate and back traces located on the back side of the substrate. The functional layer is located on the back side of the substrate, and the protective layer is located on the back side of the substrate. The back traces include a first trace segment located in a first region, which is a region near the edge of the array substrate or a region that does not overlap with the functional layer. At least a portion of the first trace segment overlaps with the protective layer.

[0005] In one implementation of the first aspect, the back-side routing also includes a second routing segment that overlaps with the functional layer.

[0006] In one implementation of the first aspect, the functional layer is a heat sink.

[0007] In one implementation of the first aspect, the display panel further includes a second region; in a plane parallel to the display panel, the first region is located outside the second region and adjacent to the edge of the display panel; a heat sink is located in the second region.

[0008] In one implementation of the first aspect, the back-side routing also includes a second routing segment, which does not overlap with the protective layer.

[0009] In one implementation of the first aspect, a protective layer is located on the side of the back trace away from the substrate; the protective layer includes a first sub-protective layer extending from a second region to a first region; the second region overlaps with the functional layer.

[0010] In one implementation of the first aspect, the first sub-protective layer is an ink layer.

[0011] In one implementation of the first aspect, the protective layer is located on the side of the back trace away from the substrate; the protective layer includes a second sub-protective layer, the second sub-protective layer does not overlap with the second region, and the second region overlaps with the functional layer.

[0012] In one implementation of the first aspect, the second sub-protective layer overlaps with the edge of at least one sub-film layer exposed by the functional layer.

[0013] In one implementation of the first aspect, the protective layer includes a first sub-protective layer extending from the second region to the first region, and the second sub-protective layer overlaps with the edge of the first sub-protective layer.

[0014] In one implementation of the first aspect, the first trace segment is attached to the protective layer on the side of the first region away from the substrate.

[0015] In one implementation of the first aspect, the portion of the protective layer located in the first region includes at least a stacked first sub-film layer, a second sub-film layer, and a third sub-film layer.

[0016] In one implementation of the first aspect, the third sub-film layer is located on the side of the first and second sub-film layers away from the array substrate; the water vapor transmission rate of the third sub-film layer is less than that of the first sub-film layer, and / or the water vapor transmission rate of the third sub-film layer is less than that of the second sub-film layer.

[0017] In one implementation of the first aspect, the third sub-film layer is located on the side of the first and second sub-film layers away from the array substrate; the thickness of the third sub-film layer is greater than the thickness of the first sub-film layer and greater than the thickness of the second sub-film layer.

[0018] In one implementation of the first aspect, the first sub-film layer is located on the side of the third sub-film layer facing the array substrate; the array substrate further includes side traces, the substrate further includes a first side surface, and the side traces are located on the first side surface; the display panel further includes a side trace encapsulation layer; the side trace encapsulation layer is attached to the side of the side trace facing away from the substrate; wherein the first sub-film layer and the side trace encapsulation layer are an integral structure.

[0019] In one implementation of the first aspect, the second sub-film layer is located on the side of the third sub-film layer facing the array substrate, and the second sub-film layer is a black insulating layer; the array substrate further includes side traces, and the substrate further includes a first side surface, with the side traces located on the first side surface; the display panel further includes a side blackening layer, which is located on the side of the side traces away from the substrate, and the side blackening layer is a semi-insulating layer or a conductive layer; wherein the second sub-film layer is connected to the side blackening layer.

[0020] In one implementation of the first aspect, the display panel further includes a reinforcement structure located on the side of the side blackening layer away from the array substrate and integrally formed with the third sub-film layer.

[0021] In one implementation of the first aspect, the height of the reinforcement structure is less than the thickness of the array substrate.

[0022] Secondly, based on the same inventive concept, this application also provides a display device, including the display panel provided in the first aspect.

[0023] The technical solution provided in this application protects at least a portion of the first trace exposed by the functional layer by setting a protective layer, thereby reducing wear on the first trace during subsequent fabrication, improving the problem of water and oxygen erosion of the first trace, and reducing the risk of water and oxygen spreading through the first trace to other parts of the back trace, causing the back trace to be eroded. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 A schematic diagram of a display panel provided in an embodiment of this application; Figure 2 A schematic diagram of another display panel provided in an embodiment of this application; Figure 3 A schematic diagram of another display panel provided in an embodiment of this application; Figure 4 A schematic diagram of another display panel provided in an embodiment of this application; Figure 5 A schematic diagram of another display panel provided in an embodiment of this application; Figure 6 A schematic diagram of another display panel provided in an embodiment of this application; Figure 7 A schematic diagram of another display panel provided in an embodiment of this application; Figure 8 A schematic diagram of another display panel provided in an embodiment of this application; Figure 9 A schematic diagram of a display device provided in an embodiment of this application; Figure 10 This is a schematic diagram of another display device provided in an embodiment of this application. Detailed Implementation

[0026] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0027] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0028] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms "a" and "the" as used in the embodiments of this application and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise.

[0029] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0030] In the description of this specification, it should be understood that the terms "substantially", "approximately", "about", "about", "roughly", "generally" and "generally" used in the claims and embodiments of this application refer to values ​​that can be generally agreed upon within a reasonable range of process operations or tolerances, rather than a precise value.

[0031] It should be understood that although terms such as "first," "second," etc., may be used to describe regions, wiring segments, etc., in the embodiments of this application, these should not be limited to these terms. These terms are only used to distinguish regions, wiring segments, etc., from one another. For example, without departing from the scope of the embodiments of this application, a first region may also be referred to as a second region, and similarly, a second region may also be referred to as a first region. Through meticulous and in-depth research, the applicant of this case has provided a solution to the problems existing in the prior art.

[0032] Figure 1 This is a schematic diagram of a display panel provided in an embodiment of this application, such as... Figure 1As shown, this application embodiment provides a display panel 01, which includes an array substrate 10, a functional layer 20, and a protective layer 30. The array substrate 10 includes a substrate 11, the functional layer 20 is located on the back side of the substrate 11, and the protective layer 30 is located on the back side of the substrate 11. The array substrate 10 may also include a driving layer 12 located on the front side of the substrate 11. The driving layer 12 may include transistors and / or pixel circuits, signal lines, etc. The display panel 01 may also include a light-emitting device 40, which is disposed on the side of the driving layer 12 away from the substrate 11, and the driving layer 12 can drive the light-emitting device 40 to emit light. The side of the substrate 11 facing the driving layer 12 and / or the light-emitting device 40 is called the front side, and the side of the substrate 11 away from the driving layer 12 and / or the light-emitting device 40 is called the back side; or, the side of the substrate 11 facing the light-emitting surface of the display panel 01 is called the front side, and the side of the substrate 11 away from the light-emitting surface of the display panel 01 is called the back side.

[0033] Furthermore, the array substrate 10 also includes a back trace 131 located on the back side of the substrate 11. The back trace 131 can be electrically connected to the signal line 132 located on the front side of the substrate 11 and to the pin 14 located on the back side of the substrate 11. The back trace 131 can transmit the signal received by the pin 14 from the IC to the signal line 132 located on the front side of the substrate 11. By setting the back trace 131, the pin 14 bonded to the IC or COF is moved to the back side of the array substrate 10, which is beneficial for realizing a narrow bezel design or a bezel-less design of the display panel 01. Figure 1 As shown, the array substrate 10 may also include a side trace 133, which is located on the side of the substrate 11 and is used to connect the back trace 131 to the signal line 132 disposed on the front side of the substrate 11.

[0034] The back-side trace 131 includes a first trace segment 131a, located in a first region R1. The first region R1 is either near the edge of the array substrate 10 or does not overlap with the functional layer 20. Therefore, the first trace segment 131a is the portion of the back-side trace 131 near the edge of the array substrate 10 or that does not overlap with the functional layer 20. The functional layer 20 is located on the back side of the substrate 11 and is used to implement specific functions. It can be connected to the substrate 11 by bonding. Considering process limitations such as bonding accuracy, the area of ​​the functional layer 20 is smaller than the area of ​​the substrate 11, resulting in an inward shrinkage of the functional layer 20 relative to the edge of the substrate 11. This causes the first trace segment 131a, which is near the edge of the array substrate 10 and on the same side of the substrate 11 as the functional layer 20, to lose the protection of the functional layer 20. The fact that the first trace segment 131a does not overlap with the functional layer 20 also means that the first trace segment 131a loses the protection of the functional layer 20.

[0035] The technical solution provided in this application includes: at least a portion of the first trace segment 131a overlaps with the protective layer 30. Specifically, at least a portion of the first trace segment 131a overlaps with the protective layer 30 in a direction perpendicular to the plane where the display panel 01 is located. By providing the protective layer 30, at least a portion of the first trace segment 131a exposed by the functional layer 20 is protected by the protective layer 30, reducing wear on the first trace segment 131a during subsequent manufacturing processes, improving the problem of water and oxygen erosion of the first trace segment 131a, and reducing the risk of water and oxygen spreading through the first trace segment 131a to other parts of the back trace 131, causing the back trace 131 to be eroded.

[0036] In one embodiment of this application, the functional layer 20 is a heat sink, which can be attached to the substrate 11. Heat generated by devices such as pixel circuits in the array substrate 10 can be conducted to the heat sink and dissipated through it. Furthermore, the functional layer 20 is disposed on the back side of the substrate 11, that is, on the backlight side of the array substrate 10, and will not adversely affect the light emission of the display panel 01. The heat sink can be a steel plate or a copper plate, and is attached to the substrate 11 by an adhesive layer 50. In addition, the functional layer 20 may include a cutout portion 21, which exposes the pins 14 to facilitate bonding of the pins 14 to an IC or COF.

[0037] In one implementation, such as Figure 1 As shown, the display panel 01 also includes a second region R2. In a plane parallel to the display panel 01, the first region R1 is located outside the second region R2 and adjacent to the edge of the display panel 01. That is, the first region R1 is located on the side of the second region R2 facing the edge of the display panel 01 in at least one direction parallel to the plane of the display panel 01, while the second region R2 can be located away from the edge of the display panel 01 relative to the first region R1. The heat sink is located in the second region R2, and the heat sink is positioned away from the edge of the array substrate 10. That is, the heat sink is recessed relative to the edge of the substrate 11. Considering the bonding accuracy, this arrangement can prevent the heat sink from protruding from the substrate 11, which could lead to process defects. The first trace segment 131a is located in the first region R1, that is, outside the second region R2, and is therefore unprotected by the heat sink. Therefore, this application can protect the first trace segment 131a by providing a protective layer 30.

[0038] In one embodiment of this application, such as Figure 1As shown, the back trace 131 also includes a second trace segment 131b, which can connect between the first trace segment 131a and the pin 14. Specifically, the second trace segment 131b overlaps with the functional layer 20 in a direction perpendicular to the plane of the array substrate 10. This allows a portion of the back trace 131 to be protected by the protective layer 30, while another portion is protected by the second protective layer 30, increasing the reliability of the back trace 131.

[0039] As shown in the figure, when the back trace 131 also includes a second trace segment 131b, the second trace segment 131b does not overlap with the protective layer 30. That is, the second trace segment 131b, which overlaps with the functional layer 20, no longer overlaps with the protective layer 30. Therefore, the total thickness of the film layer overlapping with the second trace segment 131b in the film layer on the back of the array substrate 10 will not be too large, thus avoiding affecting the thin and light design of the display panel.

[0040] Figure 2 This is a schematic diagram of another display panel provided in an embodiment of this application.

[0041] In one embodiment of this application, such as Figure 2 As shown, when the display panel 01 includes a second region R2, the protective layer 30 is located on the side of the back trace 131 away from the substrate 11. The protective layer 30 includes a first sub-protective layer 30a extending from the second region R2 to the first region R1, meaning the first sub-protective layer 30a covers the area where the first region R1 and the second region R2 meet. Since the functional layer 20 terminates at the boundary between the second region R2 and the first region R1, or at a location within the second region R2 adjacent to the first region R1, the risk of water and oxygen penetrating the second trace segment 131b through the edge of the functional layer 20 can be mitigated to some extent by providing a sub-protective layer extending from the second region R2 to the first region R1.

[0042] The first sub-protective layer 30a can be an ink layer. The portion of the ink layer located in the first region R1 can serve as a sub-protective layer of the protective layer 30 (i.e., the first sub-protective layer 30a), and the portion located in the second region R2 can serve as an insulating structure 30a' between the functional layer 20 and the second trace segment 131b. The first sub-protective layer 30a and the insulating structure 30a' are an integral structure.

[0043] In some implementations, the first sub-protective layer 30a can be as follows: Figure 2 As shown, it extends to the first region R1 and covers the first trace segment 131a.

[0044] In one embodiment of this application, such as Figure 1 and Figure 2As shown, when the display panel 01 also includes a second region R2 overlapping with the functional layer 20, the protective layer 30 is located on the side of the back trace 131 away from the substrate 11. The protective layer 30 includes a second sub-protective layer 30b, which does not overlap with the second region R2. That is, the second sub-protective layer 30b is a sub-protective layer in the protective layer 30 that is located only in the second region R2.

[0045] Furthermore, in some implementations, such as Figure 3 As shown, Figure 3 This is a schematic diagram of another display panel provided in an embodiment of this application. The area of ​​the first sub-protective layer 30a can be comparable to that of the functional layer 20, and the area between the functional layer 20 and the substrate 11 is basically provided with the first sub-protective layer 30a. In some embodiments, such as Figure 2 As shown, the area of ​​the first sub-protective layer 30a can be smaller than the area of ​​the functional layer 20 and mainly overlaps with the back trace 131.

[0046] like Figures 1-3 As shown, the first trace segment 131a is located in the portion of the first region R1, on the side facing away from the substrate 11, and is attached to the protective layer 30, as shown. Figures 1-3 As shown, the lower surface of the first trace segment 131a is far from its substrate relative to its upper surface, and the lower surface of the first trace segment 131a is in contact with the protective layer 30 to obtain the protection of the protective layer 30.

[0047] Figure 4 This is a schematic diagram of another display panel provided in an embodiment of this application. In one embodiment of this application, as... Figure 4 As shown, the portion of the protective layer 30 located in the first region R1 includes at least a stacked first sub-film layer 31, a second sub-film layer 32, and a third sub-film layer 33. By setting the protective layer 30 to be formed by stacking at least three sub-film layers, the reliability of the protective layer 30 can be increased, and the protection strength of the protective layer 30 for the first trace segment 131a can be increased.

[0048] Among them, such as Figure 4 As shown, the third sub-film layer 33 is located on the side of the first sub-film layer 31 and the second sub-film layer 32 away from the array substrate 10. Therefore, the third sub-film layer 33 can be a sub-film layer near the outer edge of the protective layer 30. Specifically, the third sub-film layer 33 can be either the first sub-protective layer 30a or the second sub-protective layer 30b. Figure 4 A schematic diagram is provided with the third sub-film layer 33 serving as the first sub-protective layer 30a.

[0049] In one possible implementation, the formation of some sub-film layers (e.g., first sub-film layer 31 and second sub-film layer 32) included in the protective layer 30 is performed earlier than the bonding process between the functional layer 20 and the substrate 11. Due to limitations in process precision, gaps may exist between these sub-film layers prepared earlier than the bonding process of the functional layer 20 and the functional layer 20, exposing the first trace segment 131a. Therefore, by configuring the protective layer 30 to include multiple stacked sub-film layers, the risk of gaps exposing the first trace segment 131a between the protective layer 30 and the functional layer 20 can be reduced.

[0050] In one feasible implementation, the water vapor transmission rate of the third sub-membrane layer 33 is less than that of the first sub-membrane layer 31, and / or, the water vapor transmission rate of the third sub-membrane layer 33 is less than that of the second sub-membrane layer 32. Therefore, the sub-membrane layers near the outer edge of the protective layer 30 have a lower water vapor transmission rate, effectively preventing water vapor from penetrating the protective layer 30, and thus effectively preventing water vapor from penetrating the first wiring segment 131a, achieving effective protection for the first wiring segment 131a.

[0051] In one feasible implementation, such as Figure 4 As shown, the thickness of the third sub-film layer 33 is greater than the thickness of the first sub-film layer 31 and greater than the thickness of the second sub-film layer 32. Figure 4 As shown, the thickness of the first sub-film layer 31 is d1, the thickness of the second sub-film layer 32 is d2, and the thickness of the third sub-film layer 33 is d3, where d3 > d1 and d3 > d2. The greater the thickness of the sub-film layer, the greater its rigidity. Therefore, the third sub-film layer 33, located near the outer edge of the protective layer 30, has greater rigidity, providing better mechanical protection for the first wiring segment 131a, as well as for the first and second sub-film layers 31, ensuring the integrity of the protective layer 30. Furthermore, the greater the thickness of the third sub-film layer 33, the better its effect in isolating water and oxygen, more effectively preventing water and oxygen from penetrating the first wiring segment 131a.

[0052] In one feasible implementation, such as Figures 1-4 As shown, the array substrate 10 also includes a side trace 133, which connects the back trace 131 and the signal line on the front side of the substrate 11. Figure 5 A schematic diagram of another display panel provided in an embodiment of this application, as shown below. Figure 5As shown, the display panel 01 also includes a side trace encapsulation layer 60 for encapsulating the side trace 133. The substrate 11 also includes a first side surface, on which the side trace 133 is located, and the side trace encapsulation layer 60 is attached to the side of the side trace 133 facing away from the substrate 11. After the side trace 133 is fabricated, the side trace encapsulation layer 60 covers the side trace 133 for protection. In this embodiment, the first sub-film layer 31 is located on the side of the third sub-film layer 33 facing the array substrate 10, and the first sub-film layer 31 and the side trace encapsulation layer 60 are an integral structure. Therefore, the first sub-film layer 31 can be considered as a portion of the side trace encapsulation layer 60 extending to the back side of the array substrate 10. Therefore, after the side trace 133 and the first trace segment 131a are fabricated, a side trace encapsulation layer 60 is fabricated to cover the side trace 133 and the first trace, thereby achieving encapsulation protection for the side trace 133 and the first trace segment 131a. The side trace encapsulation layer 60 and the first sub-film layer 31 can be fabricated using high-resistivity ink.

[0053] Furthermore, the side trace encapsulation layer 60 and the first sub-film layer 31 can be an integral structure prepared using screen printing technology. The thickness of the screen-printed film layer is not too large, allowing the side trace encapsulation layer 60 to adhere well to the side trace 133 without causing the edge width of the display panel 01 to be too large, thus affecting the visual effect. However, when the first sub-film layer 31 is prepared using screen printing technology, its thinness results in limited water and oxygen isolation. Therefore, the protective layer 30 formed by stacking the first sub-film layer 31 with the second sub-film layer 32 and the third sub-film layer 33 can effectively isolate water and oxygen.

[0054] Figure 6 This is a schematic diagram of another display panel provided in an embodiment of this application.

[0055] In one feasible implementation, such as Figure 6As shown, the array substrate 10 also includes a side trace 133, and the substrate 11 also includes a first side surface. The side trace 133 is located on the first side surface and connects the back trace 131 to the signal line on the front side of the substrate 11. The display panel 01 also includes a side blackening layer 70, which is located on the side of the side trace 133 away from the substrate 11. The side blackening layer 70 is a semi-insulating layer or a conductive layer. Since the side blackening layer 70 is not insulating, it can minimize the flow of external static electricity into the array substrate 10 from the side surface and minimize the interference of external electromagnetic interference with the normal operation of the array substrate 10 through the side surface. Furthermore, the black structure of the side blackening layer 70 can prevent light leakage from the display panel 01. Furthermore, when the display panel 01 is used in a video wall, the black side blackening layer 70 reduces the visibility of the sides of the display panel 01, thus improving the visibility of the video wall; and since the side blackening layer 70 is not insulating, it can also reduce signal interference between adjacent display panels 01 in the video wall. It is used for encapsulating the side traces 133.

[0056] Optionally, such as Figure 6 As shown, the second sub-film layer 32 is located on the side of the third sub-film layer 33 facing the array substrate 10, and the second sub-film layer 32 is connected to the side blackening layer 70. The connection between the second sub-film layer 32 and the side blackening layer 70 can be an overlapping connection, which can reduce the risk of light leakage at the edge of the display panel 01. The second sub-film layer 32 is a black insulating layer. That is, although the second sub-film layer 32 is connected to the side blackening layer 70, they have different structures; one is an insulating structure and the other is a semi-insulating or conductive structure. Setting the second sub-film layer 32 as an insulating structure can prevent the second sub-film layer 32 from being electrically connected to the first trace segment 131a, thereby preventing different first trace segments 131a from short-circuiting through the continuous conductive film layer covering them.

[0057] Furthermore, the side blackening layer 70 and the second sub-film layer 32 can also be prepared using screen printing processes. The thickness of the film layer prepared by screen printing is not too large, so that the side blackening layer 70 is relatively thin and will not cause the edge width of the display panel 01 to be too large, thus affecting the visual effect. When the second sub-film layer 32 is prepared by screen printing, its thickness is relatively thin, resulting in limited water and oxygen isolation effect. Therefore, the protective layer 30 formed by stacking the first sub-film layer 31, the second sub-film layer 32, and the third sub-film layer 33 can effectively isolate water and oxygen.

[0058] The second sub-film layer 32 can contact the first sub-film layer 31. Specifically, the second sub-film layer 32 can be fabricated on the surface of the first sub-film layer 31 away from the array substrate 10. When the first sub-film layer 31 is fabricated using a screen printing process, its thickness is relatively thin. In this case, if the second sub-film layer 32 is conductive, the risk of electrical conduction between it and the first trace segment 131a increases. Therefore, setting the second sub-film layer 32 as an insulating layer different from the side blackening layer 70 can effectively reduce this risk. Furthermore, as... Figure 6 As shown, a filler layer 80 may be included between the side blackening layer 70 and the side trace encapsulation layer 60. The filler layer 80 may be an insulating organic material to avoid short circuits between the side blackening layer 70 and the side trace layer 133.

[0059] Figure 7 This is a schematic diagram of another display panel provided in an embodiment of this application.

[0060] In one embodiment of this application, such as Figure 7 As shown, the display panel 01 also includes a reinforcement structure. This reinforcement structure is integral with the third sub-film layer 33, and is located on the side of the first substrate 11 away from the substrate 11. The reinforcement structure can be considered as a portion of the third sub-film layer 33 extending to the side of the array substrate 10. In this embodiment, the third sub-film layer 33 can be either a first sub-protective layer 30a or a second sub-protective layer 30b. Figure 7 The third sub-film layer 33 is used as the second sub-protective layer 30b for illustration.

[0061] Specifically, the reinforcement structure can be located on the side of the blackened layer 70 away from the array substrate 10. The reinforcement structure and the third sub-film layer 33 can be fabricated after the side blackened layer 70 and the second sub-film layer 32 are fabricated. Furthermore, the reinforcement structure and the third sub-film layer 33 form an integral structure that can cover the contact area between the side blackened layer 70 and the second sub-film layer 32 at the lower corner of the array substrate 10. If the side blackened layer 70 and the second sub-film layer 32 are not in complete contact, there may be gaps that allow water and oxygen to leak in. The integral structure formed by the reinforcement structure and the third sub-film layer 33 can cover the contact area between the side blackened layer 70 and the second sub-film layer 32, avoiding the risk of water and oxygen entering the first trace segment 131a through gaps.

[0062] In one embodiment, the height of the reinforcement structure is less than the thickness of the array substrate 10, such as... Figure 7 As shown, along the direction perpendicular to the plane where the display panel 01 is located, the height of the reinforcement structure is H1 and the thickness of the array substrate 10 is d4, where H1 < d4. That is, the surface of the reinforcement structure facing the light-emitting surface of the display panel 01 is lower than the surface of the array substrate 10 facing the light-emitting surface of the display panel 01, thus reducing the visibility of the reinforcement structure.

[0063] Figure 8 This is a schematic diagram of another display panel provided in an embodiment of this application.

[0064] In one embodiment of this application, such as Figure 7 and Figure 8 As shown, the second sub-protective layer 30b overlaps with the edge of at least one sub-film layer exposed by the functional layer 20. This sub-film layer exposed by the functional layer 20 can be the side of the back trace 131 away from the substrate 11. Therefore, the overlap between the edge of the second sub-protective layer 30 and this sub-film layer can more effectively cover the first trace segment 131a, preventing the first trace segment 131a from being exposed at the junction of the first region R1 and the second region R2.

[0065] For example, such as Figure 7 and Figure 8 As shown, the display panel 01 further includes a fourth sub-film layer 34. A first portion 341 and a second portion 342 of the fourth sub-film layer 34 are located in a first region R1 and a second region R2, respectively. The second portion 342 of the fourth sub-film layer 34 is covered by a functional layer 20, while the first portion 341 is exposed by the functional layer 20. The first portion 341 of the fourth sub-film layer 34 can be an edge portion of the fourth sub-film layer 34, and its width can be smaller than the width of the second portion 342 or smaller than the width of the first region R1. A second sub-protective layer 30b overlaps with the first portion 341 of the fourth sub-film layer 34. The fourth sub-film layer 34 can be an ink layer. It should be noted that in this embodiment, the overlap means that at least a portion of the edge regions of the two film layers are in contact and overlap.

[0066] In one embodiment, when the protective layer 30 includes a first sub-protective layer 30a extending from the second region R2 to the first region R1, the first sub-protective layer 30a extends only to a portion of the first region R1, for example, to a position in the first region R1 close to the second region R2. The edge of at least one sub-film layer exposed by the functional layer 20 can be the first sub-protective layer 30a, and the second sub-protective layer 30b overlaps with the first sub-protective layer 30a. Then, the protective layer 30 can more effectively protect the first trace segment 131a.

[0067] Optionally, combined Figure 7 The second sub-protective layer 30b can be the third sub-film layer 33. The third sub-film layer 33 overlaps with the fourth sub-film layer 34 in a portion extending from the second region R2 to the first region R1. That is, although the portion of the fourth sub-film layer 34 located in the first region R1 is exposed by the functional layer 20, it is covered by the second sub-protective layer 30b.

[0068] Optionally, such as Figure 8As shown, the second sub-protective layer 30b and the side wiring encapsulation layer 60 are integral structures, and the edge of the second sub-protective layer 30b near the second region R2 is covered by a portion of the fourth sub-film layer 34 extending from the second region R2 to the first region R1. That is, although the portion of the fourth sub-film layer 34 located in the first region R1 is exposed by the functional layer 20, it overlaps with the second sub-protective layer 30b.

[0069] Figure 9 This is a schematic diagram of a display device provided in an embodiment of this application. Figure 10 This is a schematic diagram of another display device provided in an embodiment of this application.

[0070] Based on the same inventive concept, embodiments of the present invention also provide a display device, such as... Figure 9 As shown, the display device includes the aforementioned display panel 01. Of course, Figure 9 The display device shown is for illustrative purposes only. The display device can be any electronic device with display function, such as a mobile phone, tablet computer, laptop computer, e-reader or television.

[0071] Based on the same inventive concept, embodiments of the present invention also provide a splicing display device, such as... Figure 10 As shown, the display device is a splicing display device including the aforementioned display panel 01. The splicing display device may include multiple adjacently arranged display panels 01. This type of splicing display device can be a large-screen splicing display and can be applied in public information display (PID) scenarios such as stations and airports.

[0072] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, or mergers made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A display panel, characterized in that, include: An array substrate, the array substrate including a substrate and back traces located on the back side of the substrate; A functional layer located on the back side of the substrate; A protective layer located on the back side of the substrate; The back trace includes a first trace segment located in a first region, which is a region near the edge of the array substrate or a region that does not overlap with the functional layer; at least a portion of the first trace segment overlaps with the protective layer.

2. The display panel according to claim 1, characterized in that, The back-side routing also includes a second routing segment, which overlaps with the functional layer.

3. The display panel according to claim 1, characterized in that, The functional layer is a heat sink.

4. The display panel according to claim 3, characterized in that, The display panel further includes a second region; in a plane parallel to the display panel, the first region is located outside the second region and adjacent to the edge of the display panel; the heat sink is located in the second region.

5. The display panel according to claim 1, characterized in that, The back-side trace also includes a second trace segment, which does not overlap with the protective layer.

6. The display panel according to claim 1, characterized in that, The protective layer is located on the side of the back trace away from the substrate; the protective layer includes a first sub-protective layer extending from the second region to the first region; the second region overlaps with the functional layer.

7. The display panel according to claim 6, characterized in that, The first sub-protective layer is an ink layer.

8. The display panel according to claim 1 or 6, characterized in that, The protective layer is located on the side of the back trace away from the substrate; the protective layer includes a second sub-protective layer, which does not overlap with the second region, and the second region overlaps with the functional layer.

9. The display panel according to claim 8, characterized in that, The second sub-protective layer overlaps with the edge of at least one sub-film layer exposed by the functional layer.

10. The display panel according to claim 9, characterized in that, The protective layer includes a first sub-protective layer extending from the second region to the first region, and the second sub-protective layer overlaps with the edge of the first sub-protective layer.

11. The display panel according to claim 1, characterized in that, The first trace segment is located in the portion of the first region on the side opposite to the substrate and is attached to the protective layer.

12. The display panel according to claim 1, characterized in that, The portion of the protective layer located in the first region includes at least a stacked first sub-film layer, a second sub-film layer, and a third sub-film layer.

13. The display panel according to claim 12, characterized in that, The third sub-film layer is located on the side of the first sub-film layer and the second sub-film layer away from the array substrate; The water vapor transmission rate of the third sub-membrane layer is less than that of the first sub-membrane layer, and / or the water vapor transmission rate of the third sub-membrane layer is less than that of the second sub-membrane layer.

14. The display panel according to claim 12, characterized in that, The third sub-film layer is located on the side of the first sub-film layer and the second sub-film layer away from the array substrate; The thickness of the third sub-film layer is greater than the thickness of the first sub-film layer and greater than the thickness of the second sub-film layer.

15. The display panel according to claim 12, characterized in that, The first sub-film layer is located on the side of the third sub-film layer facing the array substrate; The array substrate further includes side traces, and the substrate further includes a first side surface, with the side traces located on the first side surface; The display panel further includes a side trace encapsulation layer; the side trace encapsulation layer is bonded to the side of the side trace that is away from the substrate; The first sub-film layer and the side wiring encapsulation layer are an integral structure.

16. The display panel according to claim 12, characterized in that, The second sub-film layer is located on the side of the third sub-film layer facing the array substrate, and the second sub-film layer is a black insulating layer; The array substrate further includes side traces, and the substrate further includes a first side surface, with the side traces located on the first side surface; The display panel further includes a side blackening layer, which is located on the side of the side trace away from the substrate, and the side blackening layer is a semi-insulating layer or a conductive layer. The second sub-film layer is connected to the side blackening layer.

17. The display panel according to claim 16, characterized in that, The display panel also includes an enhancement structure located on the side of the side blackening layer away from the array substrate and integral with the third sub-film layer.

18. The display panel according to claim 17, characterized in that, The height of the reinforcement structure is less than the thickness of the array substrate.

19. A display device, characterized in that, Includes the display panel as described in any one of claims 1-18.

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