Display device

Abstract

The invention discloses a display device which comprises a substrate, a driving circuit layer, an insulating layer, a first auxiliary layer, at least one electrode connecting pad and a light-emitting element. The driving circuit layer is arranged on the substrate. The insulating layer is arranged on the driving circuit layer and comprises at least one opening. The first auxiliary layer is arranged in the at least one opening and partially covers the driving circuit layer. The at least one electrode pad is disposed on the first auxiliary layer in the at least one opening. The light-emitting element is arranged on the at least one electrode connecting pad and is electrically connected with the driving circuit layer.

Description

Technical Field

[0001] This invention relates to a display device. Background Technology

[0002] Current display devices utilize lasers to remove electrode pads from the surface of the driving circuit layer during repair, followed by the reinstallation of new electrode pads and light-emitting elements. However, during electrode pad removal, since there is no significant morphological difference between the electrode pad surface and the driving circuit layer surface, the laser often damages the driving circuit layer simultaneously. Therefore, it is crucial to avoid damaging the driving circuit layer during laser removal of electrode pads. Summary of the Invention

[0003] This invention provides a display device, including a substrate, a driving circuit layer, an insulating layer, a first auxiliary layer, at least one electrode pad, and a light-emitting element. The driving circuit layer is disposed on the substrate. The insulating layer is disposed on the driving circuit layer and includes at least one opening. The first auxiliary layer is disposed within the at least one opening and partially covers the driving circuit layer. At least one electrode pad is disposed on the first auxiliary layer within the at least one opening. The light-emitting element is disposed on the at least one electrode pad and is electrically connected to the driving circuit layer.

[0004] Based on the above, the first auxiliary layer of the display device is disposed in the opening and partially covers the driving circuit layer, and the electrode pads are disposed on the first auxiliary layer in the opening. Thus, when the display device is repaired, the driving circuit layer can be avoided from being damaged during the removal of the electrode pads because the electrode pads are disposed on the first auxiliary layer. Attached Figure Description

[0005] Figure 1 This is a cross-sectional schematic diagram of a display device according to an embodiment of the present invention.

[0006] Figures 2A to 2E This is a flow cross-sectional diagram of a method for manufacturing a display device according to an embodiment of the present invention.

[0007] Figure 3 This is a cross-sectional schematic diagram of a display device according to another embodiment of the present invention.

[0008] In the attached figures, the following labels are used:

[0009] 100A, 100B: Display devices

[0010] 110:Substrate

[0011] 120: Drive circuit layer

[0012] 130: Insulation layer

[0013] 140: Auxiliary Layer

[0014] 140a: First auxiliary layer

[0015] 140b: Second auxiliary layer

[0016] 150: Electrode pad

[0017] 160: Light-emitting element

[0018] E1, E2: Electrodes

[0019] L: Laser

[0020] O: Opening Detailed Implementation

[0021] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention.

[0022] Figure 1 This is a cross-sectional schematic diagram of a display device according to an embodiment of the present invention.

[0023] A display device 100A includes a substrate 110, a driving circuit layer 120, an insulating layer 130, a first auxiliary layer 140a, at least one electrode pad 150, and a light-emitting element 160. The driving circuit layer 120 is disposed on the substrate 110. The insulating layer 130 is disposed on the driving circuit layer 120 and partially covers it. The insulating layer 130 includes at least one opening O. The first auxiliary layer 140a is disposed within at least one opening O of the insulating layer 130 and partially covers the driving circuit layer 120. At least one electrode pad 150 is disposed on the first auxiliary layer 140a within the at least one opening O. The light-emitting element 160 is disposed on at least one electrode pad 150 and electrically connected to the driving circuit layer 120.

[0024] Specifically, electrode pads 150 are disposed on the driving circuit layer 120, and light-emitting unit 160 is disposed on the electrode pads 150 and electrically connected to the driving circuit layer 120. The driving circuit layer 120 may be, for example, a thin-film transistor structure. The driving circuit layer 120 can be fabricated using manufacturing processes such as thin-film deposition and photolithography. The driving circuit layer 120 provides an appropriate voltage to the electrode pads 150 to cause the light-emitting element 160 to emit light. The light-emitting element 160 can be coupled to the substrate 110 in the form of a chip-on-board (COB), that is, the light-emitting element 160 can be connected to the lines of the driving circuit layer 120 on the substrate 110 through the electrode pads 150. The light-emitting element is, for example, a light-emitting diode (LED). Light-emitting diodes may include, for example, organic light-emitting diodes (OLEDs), mini LEDs, micro LEDs, or quantum dot LEDs (QDs, such as QLEDs and QDLEDs), fluorescent, phosphorescent, or other suitable materials, and the materials may be arranged and combined in any way, but are not limited thereto.

[0025] In some embodiments, the substrate 110 may be a plate-like material with supporting properties that reduce bending, wrinkling, and / or deformation of the substrate 110. For example, the substrate 110 may be made of glass, quartz, or other suitable materials, or combinations thereof, but the invention is not limited thereto. The substrate 110 may be formed by curing a liquid and / or gel-like initial material. In some embodiments, the method of forming the substrate 110 includes coating a liquid and / or gel-like initial material onto the substrate 110, and then curing the liquid and / or gel-like initial material using a curing process to form the substrate 110, wherein the curing process may include thermosetting, photocuring, or a combination of the above curing processes, but the invention is not limited thereto. The substrate 110 may be a single-layer structure of one of polyimide (PI), polyethylene terephthalate (PET), or other suitable materials, or a stack or mixture of at least two of the above materials, but is not limited thereto. In other words, the substrate 110 can be a single-layer substrate or a multilayer substrate composed of multiple stacked layers.

[0026] The ratio of the projected area of ​​the first auxiliary layer 140a on the substrate 110 to the projected area of ​​at least one opening O on the substrate 110 falls within the range of 10% to 50%. The optical absorption rate of the first auxiliary layer 140a is greater than the optical absorption rate of the driving circuit layer 120.

[0027] The display device 100A further includes a second auxiliary layer 140b, which is disposed between the insulating layer 130 and the light-emitting element 160 and surrounds at least one electrode pad 150. In some embodiments, the second auxiliary layer 140b partially covers the insulating layer 130.

[0028] In some embodiments, the first auxiliary layer 140a of the display device 100A may be a plurality of first auxiliary layers 140a, and some of the plurality of first auxiliary layers 140a may be connected to the second auxiliary layer 140b, but this is not a limitation. In some embodiments, the second auxiliary layer 140b is not in direct contact with the light-emitting element 160.

[0029] In some embodiments, the light-emitting element 160 may be, for example, a red light-emitting diode, a green light-emitting diode, or a blue light-emitting diode, but is not limited thereto.

[0030] The first auxiliary layer 140a or the second auxiliary layer 140b is disposed on the driving circuit layer 120. The material of the first auxiliary layer 140a or the second auxiliary layer 140b may include black photoresist, white photoresist, photoresist of other colors, or a dark and opaque material, but is not limited thereto.

[0031] Figures 2A to 2E This is a flow cross-sectional diagram of a method for manufacturing a display device according to an embodiment of the present invention.

[0032] Please refer to Figure 2A In step S01, the electrode pad 150 is irradiated using laser L. Please refer to... Figure 2B In step S02, the electrode pad 150 is gradually removed until the first auxiliary layer 140a is exposed. Please refer to... Figure 2C In step S03, the laser L continues to irradiate until the electrode pad 150 is completely removed from the driving circuit layer 120.

[0033] In some embodiments, the material of the first auxiliary layer 140a may be, for example, a dark-colored or opaque material, or a photoresist material with conductive properties, but is not limited thereto. The optical absorption rate of the laser L in the first auxiliary layer 140a may be greater than the optical absorption rate of the driving circuit layer 120. Thus, the laser operation can be terminated by observing the disappearance of the first auxiliary layer 140a after the electrode pad 150 is removed, thereby ensuring that the electrode pad 150 can be completely removed without damaging the driving circuit layer 120. In some embodiments, the wavelength of the laser L may be 266 nm, 532 nm, or 1030 nm, but is not limited thereto.

[0034] Please refer to Figure 2D In step S04, the electrode pads 150 are repositioned onto the drive circuit layer 120 within the opening O of the insulating layer 130. Please refer to... Figure 2EIn step S05, the light-emitting element 160 is placed on the electrode pad 150 and electrically connected to the driving circuit layer 120.

[0035] Figure 3 This is a cross-sectional schematic diagram of a display device according to another embodiment of the present invention.

[0036] Display device 100B includes a substrate 110, a driving circuit layer 120, an auxiliary layer 140, electrodes E1 and E2, and a light-emitting element 160. The driving circuit layer 120 is disposed on the substrate 110. Electrodes E1 and E2 are disposed on the driving circuit layer 120. The auxiliary layer 140 is disposed on the driving circuit layer 120 and surrounds electrode E1 or electrode E2. In some embodiments, the auxiliary layer 140 may contact electrode E1 or electrode E2. The light-emitting element 160 is disposed on electrode E1 and electrode E2 on the driving circuit layer 120 and is electrically connected to the driving circuit layer 120.

[0037] In some embodiments, the material of the auxiliary layer 140 may be, for example, a dark-colored or opaque material, or a non-conductive photoresist material, but is not limited thereto. The auxiliary layer 140 is disposed on the driving circuit layer 120 and surrounds electrode E1 or electrode E2. When the display device 100B malfunctions, the light-emitting element 160 can be first removed from electrodes E1 and E2 via electrode pads 150, and then the light-emitting element 160 can be repositioned on electrodes E1 and E2. Because the auxiliary layer 140 is a dark-colored or opaque material, the light-emitting element 160 can therefore be accurately positioned on electrodes E1 and E2.

[0038] In summary, the first auxiliary layer of the display device of the present invention is disposed within the opening and partially covers the driving circuit layer, and the electrode pads are disposed on the first auxiliary layer within the opening. Thus, when the display device is repaired, during the removal of the electrode pads, since the electrode pads are disposed on the first auxiliary layer, damage to the electrodes and the driving circuit layer can be avoided during the removal of the electrode pads.

[0039] Of course, the present invention may have other various embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and modifications according to the present invention, but these corresponding changes and modifications should all fall within the protection scope of the appended claims.

Claims

1. A display device, characterized in that, include: substrate; A driving circuit layer is disposed on the substrate; An insulating layer is disposed on the driving circuit layer and includes at least one opening; A first auxiliary layer is disposed within the at least one opening and partially covers the driving circuit layer; At least one electrode pad is disposed on the first auxiliary layer within the at least one opening; as well as A light-emitting element is disposed on the at least one electrode pad and electrically connected to the driving circuit layer.

2. The display device as claimed in claim 1, characterized in that, The ratio of the projected area of ​​the first auxiliary layer on the substrate to the projected area of ​​the at least one opening on the substrate falls within the range of 10% to 50%.

3. The display device as claimed in claim 1, characterized in that, The optical absorption rate of the first auxiliary layer is greater than that of the driving circuit layer.

4. The display device as claimed in claim 1, characterized in that, It also includes a second auxiliary layer, which is disposed between the insulating layer and the light-emitting element and surrounds the at least one electrode pad.

5. The display device as claimed in claim 4, characterized in that, The second auxiliary layer partially covers the insulating layer.

6. The display device as claimed in claim 4, characterized in that, The first auxiliary layer comprises multiple first auxiliary layers, and some of the multiple first auxiliary layers are connected to the second auxiliary layer.

7. The display device as claimed in claim 4, characterized in that, The second auxiliary layer is not in direct contact with the light-emitting element.

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