Display panel and display device

Abstract

The invention provides a display panel and a display device, and relates to the technical field of display, the display panel comprises a substrate, a plurality of light-emitting units and a first packaging layer, the light-emitting units are located on one side of the substrate in the thickness direction, and the first packaging layer is located on one side, away from the substrate, of each light-emitting unit and is adjacent to the light-emitting unit; the first packaging layer comprises a plurality of packaging parts, the orthographic projection of the light-emitting units on the substrate is located in the orthographic projection of the corresponding packaging parts on the substrate, and the thicknesses of the packaging parts corresponding to at least part of different light-emitting units in the plurality of light-emitting units are different. According to the display panel provided by the invention, the use performance / process performance of the display device can be improved.

Description

Technical Field

[0001] This application belongs to the field of display technology, and more specifically, relates to a display panel and a display device. Background Technology

[0002] Currently, flat panel displays have advantages such as high image quality, energy saving, small thickness and wide application range, and are used in various consumer electronic products such as mobile phones, televisions, laptops, and desktop computers.

[0003] However, the performance and manufacturing process of current display products need to be improved. Summary of the Invention

[0004] The purpose of this application is to provide a display panel and a display device to improve the performance / process performance of the display device.

[0005] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0006] In a first aspect, a display panel is provided, including a substrate, a plurality of light-emitting units and a first encapsulation layer. The light-emitting units are located on one side of the substrate along the thickness direction, and the first encapsulation layer is located on the side of the light-emitting units away from the substrate and adjacent to the light-emitting units. The first encapsulation layer includes a plurality of encapsulation portions. The orthographic projection of the light-emitting units on the substrate is located within the orthographic projection of the corresponding encapsulation portion on the substrate. At least some of the different light-emitting units have encapsulation portions with different thicknesses.

[0007] Through the above technical solution, the display panel provided by this application allows for different thicknesses of the encapsulation portions corresponding to different light-emitting units. Encapsulation portions of varying thicknesses can be designed according to the different process characteristics of different light-emitting units, which is beneficial for improving encapsulation reliability. For example, in cases where subsequent etching processes may damage the encapsulation portion, light-emitting units processed earlier can have a thicker encapsulation portion, while light-emitting units processed later can have a thinner encapsulation portion. This allows the encapsulation portion processed earlier to resist damage from subsequent etching processes, thereby improving encapsulation reliability and ensuring good compatibility between the first encapsulation layer and the light-emitting unit.

[0008] Therefore, the display panel provided in this application can improve the performance / process performance of the display device.

[0009] The display panel also includes an isolation structure located on one side of the substrate along the thickness direction and defining multiple isolation openings. The orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the corresponding isolation opening on the substrate, and the orthographic projection of the isolation opening on the substrate is located within the orthographic projection of the corresponding encapsulation part on the substrate.

[0010] In some embodiments, the encapsulation portion includes a first encapsulation film, or the encapsulation portion includes a first encapsulation film and a second encapsulation film sequentially stacked in a direction away from the substrate.

[0011] Optionally, the density of the first encapsulation film is greater than that of the second encapsulation film.

[0012] In some embodiments, the encapsulation portion further includes a first encapsulation film, a second encapsulation film, and a third encapsulation film that are sequentially stacked in a direction away from the substrate.

[0013] Optionally, the thickness ratio of the first encapsulation film to the second encapsulation film is in the range of 1-1.5.

[0014] Optionally, the thickness ratio of the first encapsulation film to the third encapsulation film is in the range of 2-10.

[0015] In some embodiments, the plurality of light-emitting units include a first light-emitting unit and a second light-emitting unit, and the plurality of encapsulation portions include a first encapsulation portion and a second encapsulation portion. The orthographic projection of the first light-emitting unit onto the substrate is located within the orthographic projection of the first encapsulation portion onto the substrate, and the orthographic projection of the second light-emitting unit onto the substrate is located within the orthographic projection of the second encapsulation portion onto the substrate. The thickness of the first encapsulation portion is greater than the thickness of the second encapsulation portion.

[0016] In some embodiments, the plurality of light-emitting units further includes a third light-emitting unit, and the plurality of encapsulation portions further includes a third encapsulation portion. The orthographic projection of the third light-emitting unit onto the substrate is located within the orthographic projection of the third encapsulation portion onto the substrate, and the thickness of the third encapsulation portion is less than or equal to the thickness of the second encapsulation portion.

[0017] In some embodiments, the first encapsulation portion includes a first encapsulation film, a second encapsulation film, and a third encapsulation film stacked sequentially in a direction away from the substrate; the second encapsulation portion includes a first encapsulation film and a second encapsulation film stacked sequentially in a direction away from the substrate; and the third encapsulation portion includes the first encapsulation film.

[0018] Optionally, the density of the first encapsulation film, the second encapsulation film, and the third encapsulation film decreases sequentially.

[0019] In some embodiments, the first encapsulation portion includes a first encapsulation film and a second encapsulation film stacked sequentially in a direction away from the substrate, the second encapsulation portion includes the first encapsulation film, and the third encapsulation portion includes the first encapsulation film.

[0020] Optionally, the density of the first encapsulation film is greater than that of the second encapsulation film.

[0021] Optionally, the first encapsulation portion further includes a third encapsulation film, which is located on the side of the second encapsulation film away from the substrate, and the density of the third encapsulation film is less than that of the second encapsulation film.

[0022] In some embodiments, the first encapsulation portion includes a first encapsulation film and a second encapsulation film stacked sequentially in a direction away from the substrate, the second encapsulation portion includes a first encapsulation film and a second encapsulation film stacked sequentially in a direction away from the substrate, the thickness of the second encapsulation film in the first encapsulation portion is greater than the thickness of the second encapsulation film in the second encapsulation portion, and the third encapsulation portion includes the first encapsulation film.

[0023] Optionally, the density of the first encapsulation film is greater than that of the second encapsulation film.

[0024] In some embodiments, the first encapsulation portion includes a first encapsulation film, a second encapsulation film, and a third encapsulation film stacked sequentially in a direction away from the substrate, the second encapsulation portion includes a first encapsulation film, a second encapsulation film, and a third encapsulation film stacked sequentially in a direction away from the substrate, the thickness of the third encapsulation film in the first encapsulation portion is greater than the thickness of the third encapsulation film in the second encapsulation portion, and the third encapsulation portion includes the first encapsulation film.

[0025] Optionally, the density of the first encapsulation film, the second encapsulation film, and the third encapsulation film decreases sequentially.

[0026] In some embodiments, the plurality of light-emitting units include a first light-emitting unit and a third light-emitting unit, and the plurality of encapsulation portions include a first encapsulation portion and a third encapsulation portion. The orthographic projection of the first light-emitting unit onto the substrate is located within the orthographic projection of the first encapsulation portion onto the substrate, and the orthographic projection of the third light-emitting unit onto the substrate is located within the orthographic projection of the third encapsulation portion onto the substrate. The thickness of the first encapsulation portion is greater than the thickness of the third encapsulation portion.

[0027] In some embodiments, the plurality of light-emitting units further includes a second light-emitting unit, and the plurality of encapsulation portions further includes a second encapsulation portion. The orthographic projection of the second light-emitting unit onto the substrate is located within the orthographic projection of the second encapsulation portion onto the substrate, and the thickness of the second encapsulation portion is equal to the thickness of the first encapsulation portion.

[0028] In some embodiments, the first encapsulation portion and the second encapsulation portion include a first encapsulation film and a second encapsulation film stacked sequentially in a direction away from the substrate, and the third encapsulation portion includes the first encapsulation film.

[0029] Optionally, the density of the first encapsulation film is greater than the density of the second encapsulation film. Optionally, the first encapsulation portion further includes a third encapsulation film, which is located on the side of the second encapsulation film facing away from the substrate, and the density of the third encapsulation film is less than the density of the second encapsulation film.

[0030] In some embodiments, the encapsulation portion includes inorganic materials.

[0031] Optionally, the inorganic material of the encapsulation portion includes one of silicon nitride, silicon oxynitride, and silicon oxide.

[0032] Optionally, the inorganic material of the encapsulation portion includes silicon nitride.

[0033] In a second aspect, a display panel is provided, comprising a substrate, an isolation structure, a plurality of light-emitting units, and a first encapsulation layer, located on one side of the substrate along the thickness direction and defining a plurality of isolation openings, the light-emitting units being located within corresponding isolation openings, the first encapsulation layer being located on the side of the light-emitting units facing away from the substrate and adjacent to the light-emitting units, the first encapsulation layer comprising a plurality of encapsulation portions, the isolation openings being located within the orthographic projection of the substrate, and the encapsulation portions corresponding to at least one of the plurality of light-emitting units having different densities than the encapsulation portions corresponding to another light-emitting unit.

[0034] Through the above technical solution, the display panel provided by this application can have different densities for the encapsulation portions corresponding to different light-emitting units. Encapsulation portions with different densities can be set according to the different process characteristics of different light-emitting units, which is beneficial to improving encapsulation reliability. For example, in cases where subsequent etching processes may damage the encapsulation portion, light-emitting units processed earlier can have encapsulation portions with higher density, while light-emitting units processed later can have encapsulation portions with lower density. This allows the encapsulation portion processed earlier to resist damage from subsequent etching processes, thereby improving encapsulation reliability and ensuring good compatibility between the first encapsulation layer and the light-emitting unit.

[0035] Therefore, the display panel provided in this application can improve the performance / process performance of the display device.

[0036] In some embodiments, at least a portion of the plurality of light-emitting units have multiple encapsulation films with different densities corresponding to the same light-emitting unit.

[0037] Thirdly, a display device is provided, which includes the display panel of any of the above embodiments. The display device provided in this application has the same technical effects as the display panel described above, and will not be repeated here. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0039] Figure 1 This is a schematic diagram of the planar structure of the display panel provided in an embodiment of this application;

[0040] Figure 2 for Figure 1 A magnified view of a portion of point A in the middle;

[0041] Figure 3 for Figure 2 One of the cross-sectional views along line BB;

[0042] Figure 4 This is one of the structural schematic diagrams of the display panel manufacturing process provided in the embodiments of this application;

[0043] Figure 5 This is the second structural schematic diagram of the display panel manufacturing process provided in the embodiments of this application;

[0044] Figure 6 This is the third structural schematic diagram of the display panel manufacturing process provided in the embodiments of this application;

[0045] Figure 7 for Figure 2 Second sectional view along line BB;

[0046] Figure 8 This is one of the schematic diagrams of the first packaging section structure provided in the embodiments of this application;

[0047] Figure 9 This is one of two schematic diagrams of the first packaging section structure or one of the schematic diagrams of the second packaging section structure provided in the embodiments of this application;

[0048] Figure 10 This is the second schematic diagram of the structure of the second packaging part provided in the embodiments of this application;

[0049] Figure 11 This is one of the three schematic diagrams of the second packaging section structure or one of the schematic diagrams of the third packaging section structure provided in the embodiments of this application;

[0050] Figure 12 This is one of the schematic flowcharts of the preparation method provided in the embodiments of this application;

[0051] Figure 13 This is a second schematic flowchart of the preparation method provided in the embodiments of this application.

[0052] The following are the labeling elements in the figure:

[0053] 100 - Display panel; 10 - Substrate; 20 - Anode; 30 - Pixel definition layer; 40 - Isolation structure; 41 - First isolation opening; 42 - Second isolation opening; 43 - Third isolation opening; 50 - Light-emitting layer; 51 - First light-emitting layer; 52 - Second light-emitting layer; 53 - Third light-emitting layer; 60 - Cathode; 70 - First encapsulation layer; 701 - First encapsulation film; 702 - Second encapsulation film; 703 - Third encapsulation film; 71 - First encapsulation part; 72 - Second encapsulation part; 73 - Third encapsulation part; 80 - Second encapsulation layer; 90 - Third encapsulation layer. Detailed Implementation

[0054] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0055] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0056] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0057] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0058] Please refer to the following: Figure 1 , Figure 2 and Figure 3 This application provides a display panel 100, which can be an organic light-emitting diode (OLED) display panel 100, a micro light-emitting diode (Micro LED / μLED) display panel 100, or a liquid crystal display (LCD) display panel 100.

[0059] The display panel 100 includes a substrate 10, which includes a display area AA and a non-display area NA, with the non-display area NA surrounding at least a portion of the display area AA.

[0060] The display panel 100 also includes multiple light-emitting units located on one side of the substrate 10 along its thickness direction. These multiple light-emitting units can be manufactured in batches according to a process flow. For example, the multiple light-emitting units may include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit, which can emit light of different colors. For example, the first light-emitting unit can emit red light, the second light-emitting unit can emit green light, and the third light-emitting unit can emit blue light. (This is repeated four times in the original text.)

[0061] Please refer to the following: Figure 4 , Figure 5 and Figure 6 It is understood that the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit are sequentially vapor-deposited and patterned. That is, when the display panel 100 provided in this application embodiment is manufactured, the first light-emitting unit can be vapor-deposited and patterned first, the second light-emitting unit can be vapor-deposited and patterned second, and the third light-emitting unit can be vapor-deposited and patterned last.

[0062] In some embodiments, the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit can be patterned using a photomask.

[0063] In some embodiments, the display panel 100 further includes a pixel defined layer (PDL) 30 and an isolation structure 40. The isolation structure 40 and the pixel defined layer 30 are disposed on the same side of the substrate 10 along the thickness direction, and the isolation structure 40 is disposed on the side of the pixel defined layer 30 facing away from the substrate 10, defining a plurality of isolation openings. The orthographic projection of the light-emitting unit onto the substrate 10 may be located within the orthographic projection of the corresponding isolation opening onto the substrate 10. Optionally, the pixel defined layer 30 and the isolation structure 40 may be located in the display area AA. The first light-emitting unit, the second light-emitting unit, and the third light-emitting unit can be patterned using the isolation structure 40.

[0064] The multiple isolation openings may include a first isolation opening 41, a second isolation opening 42 and a third isolation opening 43, with the first light-emitting unit corresponding to the first isolation opening 41, the second light-emitting unit corresponding to the second isolation opening 42 and the third light-emitting unit corresponding to the third isolation opening 43.

[0065] It is understood that the anode 20 of the light-emitting unit is located on the side of the pixel definition layer 30 facing the substrate 10, the light-emitting layer 50 and the cathode 60 of the light-emitting unit are located in the isolation opening, and the light-emitting layer 50 is located between the anode 20 and the cathode 60.

[0066] It is understood that the light-emitting layer 50 of the first light-emitting unit is the first light-emitting layer 51, the light-emitting layer 50 of the second light-emitting unit is the second light-emitting layer 52, and the light-emitting layer 50 of the third light-emitting unit is the third light-emitting layer 53.

[0067] Optionally, the pixel definition layer 30 has a pixel opening communicating with the isolation opening, and the light-emitting layer 50 can be connected to the anode 20 through the pixel opening.

[0068] It should be noted that the composition and preparation of the isolation structure 40 are specified in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, and PCT / CN2024 / 09907. 2. Further descriptions are provided in CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A for reference.

[0069] The display panel 100 further includes a first encapsulation layer 70, which is disposed on the side of the pixel definition layer 30 opposite to the substrate 10 and located on the side of the light-emitting unit opposite to the substrate 10. The first encapsulation layer 70 is adjacent to the light-emitting unit. The first encapsulation layer 70 includes a plurality of encapsulation portions, which cover corresponding isolation openings and light-emitting units. In other words, the orthographic projection of the isolation opening onto the substrate 10 lies within the orthographic projection of the corresponding encapsulation portion onto the substrate 10, and the orthographic projection of the light-emitting unit onto the substrate 10 lies within the orthographic projection of the corresponding encapsulation portion onto the substrate 10.

[0070] The multiple encapsulation portions may include a first encapsulation portion 71, a second encapsulation portion 72, and a third encapsulation portion 73. The first encapsulation portion 71 corresponds to the first light-emitting unit and is also formed by patterning. The second encapsulation portion 72 corresponds to the second light-emitting unit and is also formed by patterning. The third encapsulation portion 73 corresponds to the third light-emitting unit and is also formed by patterning. Furthermore, the fabrication order of the first encapsulation portion 71, the second encapsulation portion 72, and the third encapsulation portion 73 is consistent with the fabrication order of the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit.

[0071] The inventors discovered that after the first encapsulation portion 71 is formed, the etching process damages the first encapsulation portion 71 during subsequent fabrication of the second light-emitting unit, the second encapsulation portion 72, the third light-emitting unit, and the third encapsulation portion 73. Similarly, after the second encapsulation portion 72 is formed, the etching process damages both the first and second encapsulation portions 71 and 72 during subsequent fabrication of the third light-emitting unit and the third encapsulation portion 73. The third encapsulation portion 73, however, is not subject to etching damage after formation as there are no other etching processes. The degree of damage to the first, second, and third encapsulation portions 71, 72, and 73 in subsequent processes differs, meaning their process performance differs, even though their thickness and density are the same. This can lead to an excessively large thickness of the first encapsulation layer 70, affecting fabrication speed, while an excessively small thickness can reduce reliability. Therefore, the first encapsulation layer 70 has poor matching with the light-emitting unit.

[0072] To address the technical problem discovered by the inventors, in the display panel 100 provided in this application embodiment, at least some of the different light-emitting units correspond to encapsulation portions with different thicknesses. In this way, the display panel 100 provided in this application embodiment allows for different thicknesses of the encapsulation portions corresponding to different light-emitting units. Encapsulation portions of different thicknesses can be set according to the different process characteristics of different light-emitting units, which is beneficial for improving encapsulation reliability.

[0073] For example, in cases where subsequent etching processes may damage the packaging portion, the light-emitting unit in the earlier process can have a packaging portion with a larger thickness, while the light-emitting unit in the later process can have a packaging portion with a smaller thickness (without affecting the packaging effect). This allows the packaging portion in the earlier process to resist damage from subsequent etching processes, thereby improving packaging reliability and ensuring good compatibility between the first packaging layer 70 and the light-emitting unit.

[0074] Therefore, the display panel 100 provided in this application can improve the performance / process performance of the display device.

[0075] Please refer to the following: Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 11 In some embodiments, at least one encapsulation portion includes a first encapsulation film 701, and at least one encapsulation portion includes a first encapsulation film 701 and a second encapsulation film 702 sequentially stacked along a direction away from the substrate 10.

[0076] It is understandable that some encapsulation portions include the first encapsulation film 701, while others include not only the first encapsulation film 701 but also the second encapsulation film 702. The thickness increases after the first encapsulation film 701 and the second encapsulation film 702 are stacked. This results in at least some different encapsulation portions having different thicknesses, which can improve the adaptability and reliability of the first encapsulation layer 70.

[0077] Optionally, at least one encapsulation portion includes a first encapsulation film 701, a second encapsulation film 702, and a third encapsulation film 703 sequentially stacked along a direction away from the substrate 10. That is, another encapsulation portion includes not only the first encapsulation film 701 and the second encapsulation film 702, but also the third encapsulation film 703, and the thickness is further increased after the first encapsulation film 701, the second encapsulation film 702, and the third encapsulation film 703 are stacked.

[0078] In some embodiments, the thickness ratio of the first encapsulation film 701 to the second encapsulation film 702 is greater than or equal to 1 and less than or equal to 1.5. For example, the thickness ratio of the first encapsulation film 701 to the second encapsulation film 702 is 5:4.

[0079] Optionally, the thickness ratio of the first encapsulation film 701 to the third encapsulation film 703 is greater than or equal to 2 and less than or equal to 10.

[0080] For example, the thickness ratio of the first encapsulation film 701 to the third encapsulation film 703 can be 2, 2.5, 3, 3.5, 4, 4.5, 5, 5.5, 6, 6.5, 7, 7.5, 8, 8.5, 9, 9.5, 10, etc.

[0081] For example, the thickness ratio of the first encapsulation film 701, the second encapsulation film 702, and the third encapsulation film 703 is 5:4:1.

[0082] Understandably, the first encapsulation film 701 has the largest thickness to ensure the encapsulation effect. The second encapsulation film 702 and the third encapsulation film 703 have smaller thicknesses, which decrease sequentially, making them easier to form and etch, thus reducing the time required to prepare the first encapsulation layer 70.

[0083] For example, the density of the first encapsulation film 701 is greater than the density of the second encapsulation film 702. It is understood that the second encapsulation film 702 is located on the side of the first encapsulation film 701 facing away from the substrate 10, and the second encapsulation film 702 can increase the thickness and etching resistance of the first encapsulation layer 70. The lower density of the second encapsulation film 702 is beneficial for improving the fabrication speed and also facilitates subsequent patterning.

[0084] In some embodiments, the plurality of light-emitting units include a first light-emitting unit and a second light-emitting unit, and the plurality of encapsulation portions include a first encapsulation portion 71 and a second encapsulation portion 72. The orthographic projection of the first light-emitting unit onto the substrate 10 is located within the orthographic projection of the first encapsulation portion 71 onto the substrate 10, and the orthographic projection of the second light-emitting unit onto the substrate 10 is located within the orthographic projection of the second encapsulation portion 72 onto the substrate 10. The thickness of the first encapsulation portion 71 is greater than the thickness of the second encapsulation portion 72.

[0085] In this way, after the first encapsulation part 71 is formed, the first encapsulation part 71 has good etching resistance and increased reliability when the second light-emitting unit and the second encapsulation part 72 are manufactured.

[0086] Optionally, the plurality of light-emitting units further includes a third light-emitting unit, and the plurality of encapsulation portions further includes a third encapsulation portion 73. The orthographic projection of the third light-emitting unit on the substrate 10 is located within the orthographic projection of the third encapsulation portion 73 on the substrate 10, and the thickness of the third encapsulation portion 73 is less than or equal to the thickness of the second encapsulation portion 72.

[0087] It is understandable that when the thickness of the third encapsulation part 73 is less than the thickness of the second encapsulation part 72, the third encapsulation part 73 can meet the encapsulation effect of the third light-emitting unit, and the second encapsulation part 72 has good etching resistance and increased reliability.

[0088] Furthermore, when the thickness of the third encapsulation portion 73 is equal to the thickness of the second encapsulation portion 72, the third encapsulation portion 73 can satisfy the encapsulation effect for the third light-emitting unit, and the second encapsulation portion 72 can also satisfy the encapsulation effect for the second light-emitting unit. With the first encapsulation portion 71 having good etching resistance and increased reliability, the second encapsulation portion 72 and the third encapsulation portion 73 can satisfy the encapsulation effect, and the preparation time of the first encapsulation layer 70 can be reduced.

[0089] In other embodiments, the plurality of light-emitting units include a first light-emitting unit and a third light-emitting unit, and the plurality of encapsulation portions include a first encapsulation portion 71 and a third encapsulation portion 73. The orthographic projection of the first light-emitting unit onto the substrate 10 lies within the orthographic projection of the first encapsulation portion 71 onto the substrate 10, and the orthographic projection of the third light-emitting unit onto the substrate 10 lies within the orthographic projection of the third encapsulation portion 73 onto the substrate 10. The thickness of the first encapsulation portion 71 is greater than the thickness of the third encapsulation portion 73. Thus, after the first encapsulation portion 71 is formed, it exhibits good etching resistance and increased reliability during the fabrication of the third light-emitting unit and the third encapsulation portion 73.

[0090] Optionally, the plurality of light-emitting units further include a second light-emitting unit, and the plurality of encapsulation portions further include a second encapsulation portion 72. The orthographic projection of the second light-emitting unit on the substrate 10 is located within the orthographic projection of the second encapsulation portion 72 on the substrate 10, and the thickness of the second encapsulation portion 72 is equal to the thickness of the first encapsulation portion 71.

[0091] It is understandable that when the thickness of the first encapsulation part 71 is equal to the thickness of the second encapsulation part 72, and both the thickness of the first encapsulation part 71 and the thickness of the second encapsulation part 72 are greater than the thickness of the third encapsulation part 73, the third encapsulation part 73 can meet the encapsulation effect of the third light-emitting unit, and both the first encapsulation part 71 and the second encapsulation part 72 have good etching resistance, thus increasing reliability.

[0092] Please continue reading. Figure 7 , Figure 8 , Figure 9 and Figure 11 In some embodiments, the first encapsulation portion 71 includes a first encapsulation film 701, a second encapsulation film 702, and a third encapsulation film 703 sequentially stacked along a direction away from the substrate 10; the second encapsulation portion 72 includes the first encapsulation film 701 and the second encapsulation film 702 sequentially stacked along a direction away from the substrate 10; and the third encapsulation portion 73 includes the first encapsulation film 701. In this way, the thicknesses of the first encapsulation portion 71, the second encapsulation portion 72, and the third encapsulation portion 73 decrease sequentially.

[0093] Optionally, the density of the first encapsulation film 701, the second encapsulation film 702, and the third encapsulation film 703 decreases sequentially. It is understood that the first encapsulation film 701 has the highest density, and when the third encapsulation portion 73 only includes the first encapsulation film 701, the encapsulation effect for the third light-emitting unit can be satisfied. The sequentially decreasing density of the second encapsulation film 702 and the third encapsulation film 703 makes it easier to form the second encapsulation film 702 and the third encapsulation film 703 on the first encapsulation portion 71, as well as the second encapsulation film 702 on the second encapsulation portion 72, thus reducing the time required to prepare the first encapsulation layer 70.

[0094] Please continue reading. Figure 7 , Figure 9 and Figure 11 In other embodiments, the first encapsulation portion 71 includes a first encapsulation film 701 and a second encapsulation film 702 sequentially stacked along a direction away from the substrate 10, the second encapsulation portion 72 includes the first encapsulation film 701, and the third encapsulation portion 73 includes the first encapsulation film 701. In this way, the thickness of the first encapsulation portion 71 is greater than the thickness of the second encapsulation portion 72 and the thickness of the third encapsulation portion 73, and the thickness of the second encapsulation portion 72 is equal to the thickness of the third encapsulation portion 73.

[0095] Optionally, the first encapsulation part 71 further includes a third encapsulation film 703, which is located on the side of the second encapsulation film 702 away from the substrate 10.

[0096] Similarly, as the density of the first encapsulation film 701, the second encapsulation film 702, and the third encapsulation film 703 decreases sequentially, the first encapsulation film 701 has the highest density. When the second encapsulation portion 72 includes only the first encapsulation film 701, it can satisfy the encapsulation effect for the second light-emitting unit. Similarly, when the third encapsulation portion 73 includes only the first encapsulation film 701, it can satisfy the encapsulation effect for the third light-emitting unit. The sequential decrease in density of the first encapsulation film 701, the second encapsulation film 702, and the third encapsulation film 703 makes it easier to form the second encapsulation film 702 and the third encapsulation film 703 on the first encapsulation portion 71, which helps to reduce the time required to prepare the first encapsulation layer 70.

[0097] Please continue reading. Figure 7 , Figure 9 and Figure 11 In some other embodiments, the first encapsulation portion 71 and the second encapsulation portion 72 include a first encapsulation film 701 and a second encapsulation film 702 sequentially stacked along a direction away from the substrate 10, and the third encapsulation portion 73 includes the first encapsulation film 701. In this way, the thickness of the first encapsulation portion 71 and the thickness of the second encapsulation portion 72 are greater than the thickness of the third encapsulation portion 73, and the thickness of the first encapsulation portion is equal to the thickness of the second encapsulation portion 72.

[0098] Please continue reading. Figure 8 and Figure 10 Optionally, the first encapsulation portion 71 and the second encapsulation portion 72 may include a third encapsulation film 703, which is located on the side of the second encapsulation film 702 away from the substrate 10.

[0099] Similarly, as the density of the first encapsulation film 701, the second encapsulation film 702, and the third encapsulation film 703 decreases sequentially, the first encapsulation film 701 has the highest density. When the third encapsulation portion 73 only includes the first encapsulation film 701, the encapsulation effect for the third light-emitting unit can be satisfied. The sequentially decreasing density of the second encapsulation film 702 and the third encapsulation film 703 makes it easier to form the second encapsulation film 702 and the third encapsulation film 703 on the first encapsulation portion 71 and the second encapsulation portion 72, which helps to reduce the time required to prepare the first encapsulation layer 70.

[0100] Please continue reading. Figure 7 , Figure 9 and Figure 11 In some embodiments, the first encapsulation portion 71 includes a first encapsulation film 701 and a second encapsulation film 702 sequentially stacked along a direction away from the substrate 10, the second encapsulation portion 72 includes a first encapsulation film 701 and a second encapsulation film 702 sequentially stacked along a direction away from the substrate 10, the thickness of the second encapsulation film 702 in the first encapsulation portion 71 is greater than the thickness of the second encapsulation film 702 in the second encapsulation portion 72, and the third encapsulation portion 73 includes the first encapsulation film 701. In this way, the thicknesses of the first encapsulation portion 71, the second encapsulation portion 72, and the third encapsulation portion 73 decrease sequentially.

[0101] Similarly, the density of the first encapsulation film 701 and the second encapsulation film 702 decreases sequentially. It is understandable that the first encapsulation film 701 has the highest density, and when the third encapsulation portion 73 only includes the first encapsulation film 701, the encapsulation effect for the third light-emitting unit can be satisfied. The sequential decrease in density of the first encapsulation film 701 and the second encapsulation film 702 makes it easier to form the second encapsulation film 702 on the first encapsulation portion 71 and the second encapsulation portion 72, which helps to reduce the time required to prepare the first encapsulation layer 70.

[0102] Please continue reading. Figure 7 , Figure 8 , Figure 10 and Figure 11 In some embodiments, the first encapsulation portion 71 includes a first encapsulation film 701, a second encapsulation film 702, and a third encapsulation film 703 sequentially stacked in a direction away from the substrate 10. The second encapsulation portion 72 includes the first encapsulation film 701, the second encapsulation film 702, and the third encapsulation film 703 sequentially stacked in a direction away from the substrate 10. The thickness of the third encapsulation film 703 in the first encapsulation portion 71 is greater than the thickness of the third encapsulation film 703 in the second encapsulation portion 72. The third encapsulation portion 73 includes the first encapsulation film 701. In this way, the thicknesses of the first encapsulation portion 71, the second encapsulation portion 72, and the third encapsulation portion 73 decrease sequentially.

[0103] Similarly, the density of the first encapsulation film 701, the second encapsulation film 702, and the third encapsulation film 703 decreases sequentially. It is understandable that the first encapsulation film 701 has the highest density, and when the third encapsulation portion 73 only includes the first encapsulation film 701, the encapsulation effect for the third light-emitting unit can be satisfied. The sequentially decreasing density of the second encapsulation film 702 and the third encapsulation film 703 makes it easier to form the second encapsulation film 702 and the third encapsulation film 703 on the first encapsulation portion 71 and the second encapsulation portion 72, which helps to reduce the time required to prepare the first encapsulation layer 70.

[0104] Optionally, the encapsulation portion includes an inorganic material. Optionally, the inorganic material of the encapsulation portion includes one of silicon nitride (SiN), silicon oxynitride (SiON), and silicon oxide (SiO). Optionally, the inorganic material of the encapsulation portion includes silicon nitride. It is understood that the inorganic material of the encapsulation portion, including silicon nitride, has better density, which can reduce the thickness of the first encapsulation layer 70 to a certain extent, thus helping to reduce the preparation time of the first encapsulation layer 70.

[0105] This application embodiment also provides another display panel 100, which differs from the display panel 100 of the above embodiment in that the density of the encapsulation portions corresponding to at least some different light-emitting units is different. The display panel 100 provided in this application embodiment allows for different densities of the encapsulation portions corresponding to different light-emitting units. Encapsulation portions with different densities can be set according to the different process characteristics of different light-emitting units, which is beneficial for improving encapsulation reliability. For example, in cases where subsequent etching processes may damage the encapsulation portion, light-emitting units processed earlier can have encapsulation portions with higher density, while light-emitting units processed later can have encapsulation portions with lower density. This allows the encapsulation portions processed earlier to resist damage from subsequent etching processes, thereby improving encapsulation reliability.

[0106] Therefore, the display panel 100 provided in this application can improve the performance / process performance of the display device.

[0107] In some embodiments, at least a portion of the plurality of light-emitting units have a plurality of encapsulation films with different densities corresponding to the same light-emitting unit.

[0108] For example, at least one encapsulation portion includes a first encapsulation film 701.

[0109] For example, at least one encapsulation portion includes a first encapsulation film 701 and a second encapsulation film 702 that are sequentially stacked in a direction away from the substrate 10.

[0110] For example, at least one encapsulation portion includes a first encapsulation film 701, a second encapsulation film 702 and a third encapsulation film 703 sequentially stacked in a direction away from the substrate 10.

[0111] It is understandable that some encapsulation portions include the first encapsulation film 701, while others include not only the first encapsulation film 701 but also the second encapsulation film 702. The thickness increases after the first encapsulation film 701 and the second encapsulation film 702 are stacked. This results in at least some different encapsulation portions having different thicknesses, which can improve the adaptability and reliability of the first encapsulation layer 70.

[0112] In addition, another part of the encapsulation section includes not only the first encapsulation film 701 and the second encapsulation film 702, but also the third encapsulation film 703. After the first encapsulation film 701, the second encapsulation film 702 and the third encapsulation film 703 are stacked, the thickness is further increased.

[0113] Please continue reading. Figure 3 In some embodiments, the display panel 100 provided in this application may further include a second encapsulation layer 80 and a third encapsulation layer 90, wherein the second encapsulation layer 80 is located on the side of the first encapsulation layer 70 away from the substrate 10, and the third encapsulation layer 90 is located on the side of the second encapsulation layer 80 away from the substrate 10.

[0114] Optionally, the first encapsulation layer 70 may be an inorganic encapsulation layer formed by chemical vapor deposition (CVD) and patterning.

[0115] Optionally, the second encapsulation layer 80 can be an organic layer made by inkjet printing (IJP).

[0116] Alternatively, the third encapsulation layer 90 may be an inorganic encapsulation layer formed by chemical vapor deposition (CVD).

[0117] Optionally, the display panel 100 provided in this application embodiment may also include other film layers, which may include a polarizing film, optically clear adhesive (OCA), etc., located on the side of the third encapsulation layer 90 away from the substrate 10.

[0118] Please see Figure 12 This application also provides a method for manufacturing a display panel 100, which includes the following steps:

[0119] S1, providing substrate 10;

[0120] S2, a light-emitting unit is prepared on one side of the substrate 10 along the thickness direction;

[0121] S3, a first encapsulation layer 70 is prepared on the side of the light-emitting unit away from the substrate 10. The first encapsulation layer 70 includes a plurality of encapsulation portions. The orthographic projection of the light-emitting unit on the substrate 10 is located within the orthographic projection of the corresponding encapsulation portion on the substrate 10. The thickness / density of the encapsulation portions corresponding to at least some of the different light-emitting units are different.

[0122] The method for manufacturing the display panel 100 provided in this application allows for different thicknesses / densities of the encapsulation portions corresponding to different light-emitting units. Encapsulation portions with varying thicknesses / densities can be designed according to the different process characteristics of different light-emitting units, which is beneficial for improving encapsulation reliability. For example, in cases where subsequent etching processes may damage the encapsulation portion, light-emitting units processed earlier can have encapsulation portions with larger thicknesses / densities, while light-emitting units processed later can have encapsulation portions with smaller thicknesses / densities. This allows the encapsulation portions processed earlier to resist damage from subsequent etching processes, thereby improving encapsulation reliability.

[0123] Please see Figure 13 This application also provides a method for manufacturing a display panel 100, which includes the following steps:

[0124] S1, providing substrate 10;

[0125] S2, a pixel definition layer 30 is prepared on one side of the substrate 10;

[0126] S3, an isolation structure 40 is fabricated on the side of the pixel definition layer 30 away from the substrate 10, and an isolation opening is patterned to form it;

[0127] S4, the pixel definition layer 30 is patterned to form a pixel opening, and the orthographic projection of the pixel opening on the substrate 10 is located within the orthographic projection of the isolation opening on the substrate 10.

[0128] S5, Light-emitting units are prepared within the pixel opening;

[0129] S6, a first encapsulation layer 70 is prepared on the side of the light-emitting unit away from the substrate 10. The first encapsulation layer 70 includes a plurality of encapsulation portions. The orthographic projection of the light-emitting unit on the substrate 10 is located within the orthographic projection of the corresponding encapsulation portion on the substrate 10. The thickness / density of the encapsulation portions corresponding to at least some of the different light-emitting units are different.

[0130] The method for fabricating the display panel 100 provided in this application can utilize the isolation structure 40 to fabricate light-emitting units, and also allows for different thicknesses / densities of the encapsulation portions corresponding to different light-emitting units. Encapsulation portions with different thicknesses / densities can be set according to the different process characteristics of different light-emitting units, which is beneficial to improving encapsulation reliability.

[0131] Please see Figure 13 The preparation method provided in this application embodiment further includes:

[0132] S7, a second encapsulation layer 80 is prepared on the side of the first encapsulation layer 70 that is away from the substrate 10;

[0133] S8, a third encapsulation layer 90 is prepared on the side of the second encapsulation layer 80 away from the substrate 10.

[0134] Optionally, the second encapsulation layer 80 comprises an organic material, and the third encapsulation layer 90 comprises an inorganic material.

[0135] In this way, the preparation method provided in this application embodiment can use the second encapsulation layer 80 and the third encapsulation layer 90 to encapsulate the first encapsulation layer 70 and the isolation structure 40.

[0136] This application also provides a display device, which includes the display panel 100 of any of the above embodiments. The display device provided in this application has the same technical effects as the display panel 100 described above, and will not be repeated here.

[0137] Optionally, the display device provided in the embodiments of this application can be an electronic product such as a mobile phone, television, tablet computer, laptop computer, desktop computer, vehicle display terminal, wearable device, human-computer interaction terminal device, etc.

[0138] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display panel, characterized in that, include: substrate; An isolation structure is located on one side of the substrate along the thickness direction and defines a plurality of isolation openings; Multiple light-emitting units, wherein the light-emitting units are located within the corresponding isolation openings; A first encapsulation layer is located on the side of the light-emitting unit away from the substrate and adjacent to the light-emitting unit. The first encapsulation layer includes a plurality of encapsulation portions. The isolation opening is located within the orthographic projection of the corresponding encapsulation portion on the substrate. The thickness of the encapsulation portion corresponding to at least one of the plurality of light-emitting units is different from that of the encapsulation portion corresponding to another light-emitting unit.

2. The display panel as described in claim 1, characterized in that, The encapsulation portion includes a first encapsulation film, or a first encapsulation film and a second encapsulation film are sequentially stacked in a direction away from the substrate. Preferably, the density of the first encapsulation film is greater than the density of the second encapsulation film.

3. The display panel as described in claim 2, characterized in that, The encapsulation portion further includes a first encapsulation film, a second encapsulation film, and a third encapsulation film that are sequentially stacked along a direction away from the substrate; Preferably, the thickness ratio of the first encapsulation film to the second encapsulation film is in the range of 1-1.

5. Preferably, the thickness ratio of the first encapsulation film to the third encapsulation film is in the range of 2-10.

4. The display panel as described in claim 1, characterized in that, The plurality of light-emitting units include a first light-emitting unit and a second light-emitting unit, and the plurality of encapsulation portions include a first encapsulation portion and a second encapsulation portion. The orthographic projection of the first light-emitting unit on the substrate is located within the orthographic projection of the first encapsulation portion on the substrate, and the orthographic projection of the second light-emitting unit on the substrate is located within the orthographic projection of the second encapsulation portion on the substrate. The thickness of the first encapsulation portion is greater than the thickness of the second encapsulation portion.

5. The display panel as described in claim 4, characterized in that, The plurality of light-emitting units further includes a third light-emitting unit, and the plurality of encapsulation portions further includes a third encapsulation portion. The orthographic projection of the third light-emitting unit on the substrate is located within the orthographic projection of the third encapsulation portion on the substrate, and the thickness of the third encapsulation portion is less than or equal to the thickness of the second encapsulation portion.

6. The display panel as described in claim 5, characterized in that, The first encapsulation portion includes a first encapsulation film, a second encapsulation film, and a third encapsulation film stacked sequentially in a direction away from the substrate; the second encapsulation portion includes the first encapsulation film and the second encapsulation film stacked sequentially in a direction away from the substrate; and the third encapsulation portion includes the first encapsulation film. Preferably, the density of the first encapsulation film, the second encapsulation film, and the third encapsulation film decreases sequentially.

7. The display panel as described in claim 5, characterized in that, The first encapsulation portion includes a first encapsulation film and a second encapsulation film stacked sequentially along a direction away from the substrate; the second encapsulation portion includes the first encapsulation film; and the third encapsulation portion includes the first encapsulation film. Preferably, the density of the first encapsulation film is greater than the density of the second encapsulation film; Preferably, the first encapsulation portion further includes a third encapsulation film, which is located on the side of the second encapsulation film opposite to the substrate, and the density of the third encapsulation film is less than that of the second encapsulation film.

8. The display panel as described in claim 5, characterized in that, The first encapsulation portion includes a first encapsulation film and a second encapsulation film stacked sequentially in a direction away from the substrate. The second encapsulation portion includes the first encapsulation film and the second encapsulation film stacked sequentially in a direction away from the substrate. The thickness of the second encapsulation film in the first encapsulation portion is greater than the thickness of the second encapsulation film in the second encapsulation portion. The third encapsulation portion includes the first encapsulation film. Preferably, the density of the first encapsulation film is greater than the density of the second encapsulation film.

9. The display panel as described in claim 5, characterized in that, The first encapsulation portion includes a first encapsulation film, a second encapsulation film, and a third encapsulation film stacked sequentially in a direction away from the substrate. The second encapsulation portion includes the first encapsulation film, the second encapsulation film, and the third encapsulation film stacked sequentially in a direction away from the substrate. The thickness of the third encapsulation film in the first encapsulation portion is greater than the thickness of the third encapsulation film in the second encapsulation portion. The third encapsulation portion includes the first encapsulation film. Preferably, the density of the first encapsulation film, the second encapsulation film, and the third encapsulation film decreases sequentially.

10. The display panel as claimed in claim 1, characterized in that, The plurality of light-emitting units include a first light-emitting unit and a third light-emitting unit, and the plurality of encapsulation portions include a first encapsulation portion and a third encapsulation portion. The orthographic projection of the first light-emitting unit on the substrate is located within the orthographic projection of the first encapsulation portion on the substrate, and the orthographic projection of the third light-emitting unit on the substrate is located within the orthographic projection of the third encapsulation portion on the substrate. The thickness of the first encapsulation portion is greater than the thickness of the third encapsulation portion.

11. The display panel as claimed in claim 10, characterized in that, The plurality of light-emitting units further includes a second light-emitting unit, and the plurality of encapsulation portions further includes a second encapsulation portion. The orthographic projection of the second light-emitting unit onto the substrate is located within the orthographic projection of the second encapsulation portion onto the substrate, and the thickness of the second encapsulation portion is equal to the thickness of the first encapsulation portion.

12. The display panel as claimed in claim 11, characterized in that, The first encapsulation portion and the second encapsulation portion include a first encapsulation film and a second encapsulation film stacked sequentially in a direction away from the substrate, and the third encapsulation portion includes the first encapsulation film; Preferably, the density of the first encapsulation film is greater than the density of the second encapsulation film; Preferably, the first encapsulation portion and the second encapsulation portion further include a third encapsulation film, the third encapsulation film being located on the side of the second encapsulation film opposite to the substrate, and the density of the third encapsulation film being less than the density of the second encapsulation film.

13. The display panel as claimed in claim 1, characterized in that, The encapsulation part includes inorganic materials; Preferably, the inorganic material of the encapsulation portion includes one of silicon nitride, silicon oxynitride, and silicon oxide; Preferably, the inorganic material of the encapsulation portion includes silicon nitride.

14. A display panel, characterized in that, include: substrate; An isolation structure is located on one side of the substrate along the thickness direction and defines a plurality of isolation openings; Multiple light-emitting units, wherein the light-emitting units are located within the corresponding isolation openings; A first encapsulation layer is located on the side of the light-emitting unit away from the substrate and adjacent to the light-emitting unit. The first encapsulation layer includes a plurality of encapsulation portions. The isolation opening is located in the orthographic projection of the substrate onto the corresponding encapsulation portion in the orthographic projection of the substrate. The density of the encapsulation portion corresponding to at least one of the plurality of light-emitting units is different from that of the encapsulation portion corresponding to another light-emitting unit.

15. The display panel as claimed in claim 14, characterized in that, At least some of the light-emitting units have multiple encapsulation film layers with different densities in their corresponding encapsulation portions.

16. A display device, characterized in that, Includes the display panel as described in any one of claims 1 to 15.

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