Forming equipment for semiconductor element processing and use method of forming equipment
By combining a wind-powered cleaning component and a water-circulating heat dissipation component into a dual heat dissipation system, the shortcomings of wafer dicing equipment in cleaning and heat dissipation are solved, achieving efficient cleaning and heat dissipation of the wafer surface and improving the finished product quality of semiconductor components.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- CRYSTAL MICRO (JIANGSU) SEMICONDUCTOR CO LTD
- Filing Date
- 2026-01-20
- Publication Date
- 2026-05-15
AI Technical Summary
Existing wafer dicing equipment has shortcomings in cleaning and heat dissipation, leading to scratches on the wafer surface and expansion of the heat-affected zone, which affects the performance of finished semiconductor devices.
A dual heat dissipation system combining wind-powered cleaning components and water-circulating heat dissipation components is adopted. Through the synergistic effect of air ducts and water channels, the wafer surface is cleaned and cooled. Combined with the automated transfer of robotic arms and material handling components, efficient cleaning and heat dissipation of wafers are ensured during the dicing process.
It effectively removes dust and impurities from the wafer surface, improves wafer processing yield, achieves efficient heat dissipation, avoids wafer scratches and expansion of the heat-affected zone, and ensures finished product quality.
Smart Images
Figure CN122054940A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of electronic component processing technology, specifically to a forming equipment for semiconductor component processing and its usage method. Background Technology
[0002] Wafers are typically thin sheets made from high-purity semiconductor materials through processes such as crystal pulling, cutting, grinding, and polishing. The manufacturing of most semiconductor components requires wafers as a substrate for subsequent processing. Without wafers as a foundation, it is impossible to mass-produce semiconductor components.
[0003] In the wafer dicing process, conventional wafer dicing equipment typically employs a single blowing mode for cleaning, usually only cleaning debris from the wafer surface once after dicing. However, during the transfer of the wafer from the feed table to the dicing table, dust and impurities from the environment easily adhere to it. If these impurities are not removed in time, they can cause scratches on the wafer surface during dicing, affecting wafer quality. Secondly, wafer dicing equipment often uses a single water cooling method for heat dissipation. Single water cooling can only dissipate heat through heat exchange between the dicing table and the coolant, and cannot directly act on the dicing area of the wafer surface. It is difficult to quickly dissipate the localized concentrated heat generated by laser processing, leading to an expansion of the heat-affected zone of the wafer and severely reducing the performance of the finished semiconductor device. To address the above problems, the inventors propose a forming equipment for semiconductor device processing and its usage method to solve these problems. Summary of the Invention
[0004] To address the challenges of efficient heat dissipation and simultaneous debris cleaning during wafer fabrication, this invention aims to provide a forming device for semiconductor device fabrication and its usage method.
[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: a forming equipment for semiconductor component processing, comprising a frame, a substrate and a bottom plate fixedly installed in the middle and bottom of the frame respectively, an XY-axis moving worktable fixedly installed on one side of the substrate, a cutting table fixedly installed on the moving surface of the XY-axis moving worktable, a water circulation heat dissipation component and a wind-powered cleaning component respectively provided in the cutting table, a robotic arm fixedly installed on the side of the frame away from the XY-axis moving worktable, a material picking component installed at the drive end of the robotic arm, a laser cutting machine for use in conjunction with the XY-axis moving worktable fixedly installed on one side of the substrate, a material table fixedly installed on the other side of the substrate, and five equally spaced water channels opened in the cutting table, with air ducts opened between adjacent water channels.
[0006] Preferably, the water circulation heat dissipation assembly includes a drive chamber, which is fixedly installed on the base plate by a support. Two symmetrically distributed drive shafts and driven shafts are rotatably installed on the drive chamber. Rotors are fixedly sleeved on the outer walls of both drive shafts and driven shafts. Driven gears and passive gears are fixedly sleeved on the top of the outer walls of the drive shafts and driven shafts, respectively, and the driven gears and passive gears are meshed together. A liquid diversion valve and a liquid confluence valve are fixedly installed in the middle of the moving table of the XY axis moving worktable. Five equidistant heat dissipation pipes are connected through the liquid outlet of the liquid diversion valve and the liquid inlet of the liquid confluence valve, and the heat dissipation pipes are located in the water channel. A chiller unit is fixedly installed on one side of the base plate. The liquid outlet of the chiller unit is connected through the liquid inlet of the drive chamber by a hose and a check valve. The liquid outlet of the drive chamber is connected through the liquid inlet of the liquid diversion valve by a hose and a check valve. The liquid outlet of the liquid confluence valve is connected through the liquid inlet of the chiller unit by a hose. Preferably, the wind-powered cleaning assembly includes a drive bracket, which is fixedly installed on the bottom plate near the drive compartment. A wind frame is fixedly installed on one side of the outer wall of the drive bracket, and a drive shaft is rotatably installed in the wind frame. An impeller is fixedly sleeved on the outer wall of the drive shaft. A gas dryer is fixedly installed on the bottom plate near the robotic arm. A guide frame is connected through the air outlet of the wind frame, and the other end of the guide frame is connected through the air inlet of the gas dryer. A filter is connected through the air outlet of the gas dryer. A diversion frame is fixedly installed at the top of the bottom plate near the gas dryer. The diversion frame has two exhaust chambers and one inlet chamber. The middle of the two exhaust chambers is connected through the inlet chamber. A guide rod runs horizontally through the diversion frame. Two symmetrically distributed pistons are fixedly sleeved on the outer wall of the guide rod, and the two pistons slide in a sealed manner in their respective exhaust chambers. An electric cylinder is fixedly installed on one side of the diversion frame, and the drive end of the electric cylinder is fixedly connected to one end of the guide rod. A support plate is fixedly installed on the outer wall of the fixed frame. A first exhaust frame is fixedly installed at the end of the first support plate. A second support plate is fixedly installed on one side of the outer wall of the cutting table. A second exhaust frame is fixedly installed on the second support plate. The two exhaust ends of the splitter frame are respectively connected to the first air guide pipe and the second air guide pipe. The other end of the first air guide pipe is connected to the air inlet end of the first exhaust frame through a duct. Side frames are fixedly installed on both ends of the air duct on the outer wall of the cutting table. A gas splitter and a gas combiner are fixedly installed on both sides of the moving table surface of the XY axis moving worktable. The exhaust end of the gas splitter and the air inlet end of the gas combiner are respectively connected to the corresponding side frames through ducts. The second air guide pipe is connected to the air inlet end of the gas splitter through a duct. The exhaust end of the gas combiner is connected to the air inlet end of the second exhaust frame through a duct. The drive bracket is fixedly installed with a drive motor through a support. The drive end of the drive motor is connected to the drive shaft through a belt pulley transmission group. A drive gear is fixedly sleeved at the bottom of the drive shaft. The drive gear is meshed with the driven gear.
[0007] Preferably, the material handling component includes a fixed frame, which is fixedly installed on the drive end of the robotic arm via a support. A lead screw is laterally rotatably installed in the middle of the fixed frame, and a movable plate is threaded onto the outer wall of the lead screw. A servo motor is fixedly installed in the middle of the outer wall of the fixed frame via a support, and the servo motor is connected to the lead screw via a coupling. Fixed rods are slidably installed on both sides of the movable plate, and the fixed rods are fixedly installed on the inner wall of the fixed frame. A feeding rack is fixedly installed on the top of the movable plate.
[0008] A method using a forming apparatus for processing semiconductor devices includes the following steps: S1. Control the robotic arm to move the fixed frame of the picking component to the corresponding station on the material platform. Drive the loading rack to move to the bottom of the wafer positioning metal ring through the picking component. Use the suction cup at the end of the loading rack to adsorb and fix the metal ring. S2. Start the wind-powered cleaning component. The internal impeller rotates to generate airflow. The airflow passes through the air guide frame, is dried by the gas dryer, and is filtered by the filter. It is then distributed unidirectionally to the No. 1 air guide pipe through the diversion frame and delivered to the No. 1 exhaust frame. S3. The robotic arm moves the wafer positioning metal ring to the cutting table through the material picking component. The material picking component first drives the loading rack to reset, and then controls its extension and reciprocates once. During the process of the wafer positioning metal ring resetting with the loading rack, the airflow discharged from the No. 1 exhaust frame pre-cleans the wafer surface. S4. After the robotic arm places the wafer positioning metal ring at the corresponding position on the top of the dicing table, the blue film is adsorbed and fixed by the vacuum adsorption component of the dicing table. The material picking component drives the loading rack to reset. The wind cleaning component adjusts the position of the piston to switch the airflow in the diversion frame to the second air guide pipe in one direction. The airflow is delivered to the air duct through the gas distributor to perform secondary cleaning of residual debris on the wafer surface and simultaneously assist in heat dissipation. S5. When the wind-powered cleaning component is running, the drive shaft drives the water circulation heat dissipation component to run synchronously through the drive gear. The coolant output by the chiller unit is diverted through the drive chamber and the liquid diversion valve, and then circulates in the water channel through the heat dissipation pipe. It works in conjunction with the airflow in the air duct to achieve dual heat dissipation of the wafer. S6. Control the start of the XY axis moving worktable, which moves the cutting table to the processing station of the laser cutting machine. Simultaneously start the laser cutting machine. The XY axis moving worktable moves the wafer along the preset trajectory to complete the laser cutting process. After the processing is completed, the robotic arm drives the material handling component to transfer the processed wafer to the unloading area of the material table, completing a single processing cycle.
[0009] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. This invention uses a wind-powered cleaning component to generate airflow by rotating an impeller. After drying and filtration, the airflow becomes dry and clean. By adjusting the piston position, the airflow delivery path can be switched. The airflow passing through the first exhaust frame can pre-clean the wafer surface, effectively removing dust and impurities adhering to the wafer during transport. The airflow passing through the second exhaust frame can simultaneously complete debris cleaning and auxiliary heat dissipation during wafer dicing, effectively improving wafer processing yield and quality. 2. This invention sets up a water circulation heat dissipation component, which drives the water circulation heat dissipation component to operate synchronously while the wind power cleaning component is running. This allows the chiller unit to provide constant temperature coolant, which is then pressure-stabilized by the drive chamber and evenly distributed to each heat dissipation pipe by the liquid distribution valve. The heat dissipation pipe is embedded in the water channel of the cutting table, forming a high-efficiency heat exchange structure with the cutting table, achieving basic constant temperature heat dissipation of the cutting table. Combined with the airflow of the air duct, a dual air-liquid heat dissipation system is constructed, which greatly improves the heat dissipation efficiency. 3. This invention sets up a material handling component, which drives the lead screw to rotate via a servo motor, causing the moving plate to move smoothly and linearly along the fixed rod, thereby achieving precise extension and retraction adjustment of the loading rack; combined with the multi-directional movement of the robotic arm, it can complete the automated transfer of wafers between the material table and the dicing table, replacing manual handling operations and effectively avoiding wafer contamination and damage caused by manual contact. Attached Figure Description
[0010] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0011] Figure 1 This is a schematic diagram of the overall front structure of the present invention; Figure 2 This is a schematic diagram of the front disassembled structure of the present invention; Figure 3 This is a schematic diagram of the base plate structure of the present invention; Figure 4 This is a schematic diagram of the structure of the robotic arm and the material handling assembly in this invention; Figure 5 This is a schematic diagram of the exploded structure of the material handling component in this invention; Figure 6 This is a schematic diagram of the overall gas-liquid circulation structure in this invention; Figure 7 This is a schematic diagram of the XY-axis moving worktable and cutting table in this invention; Figure 8 This is a schematic diagram of the longitudinal sectioning structure of the cutting table in this invention; Figure 9This is a schematic diagram of the transverse splitting structure of the cutting table in this invention; Figure 10 This is a schematic diagram of the liquid diversion valve, heat dissipation pipe, and liquid confluence valve in this invention; Figure 11 This is a schematic diagram of the disassembled structure of the water circulation heat dissipation component in this invention; Figure 12 This is a schematic diagram of the split structure of the diversion box in this invention; Figure 13 This is a schematic diagram of the drive motor transmission structure in this invention.
[0012] In the diagram: 1. Frame; 2. Base plate; 3. Base plate; 4. XY axis moving worktable; 5. Cutting table; 501. Water channel; 502. Air duct; 6. Water circulation and heat dissipation assembly; 601. Drive chamber; 602. Drive shaft; 603. Driven shaft; 604. Rotor; 605. Driven gear; 606. Passive gear; 607. Drive gear; 608. Chiller unit; 609. Liquid diversion valve; 610. Heat sink; 611. Liquid confluence valve; 7. Wind-powered cleaning assembly; 701. Drive bracket; 702. Air frame; 703. Drive shaft; 704. Impeller; 705. Air guide frame; 706. Gas drying... Dryer; 707, Filter; 708, Support plate No. 1; 709, Exhaust frame No. 1; 710, Support plate No. 2; 711, Exhaust frame No. 2; 712, Diverter frame; 713, Guide rod; 714, Piston; 715, Electric cylinder; 716, Side frame; 717, Gas distributor; 718, Gas confluencer; 719, Gas guide pipe No. 1; 720, Gas guide pipe No. 2; 721, Drive motor; 8, Robotic arm; 9, Material handling assembly; 901, Fixed frame; 902, Lead screw; 903, Moving plate; 904, Servo motor; 905, Fixed rod; 906, Loading rack; 10, Laser cutting machine; 11, Material table. Detailed Implementation
[0013] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0014] Example: Figure 1-13As shown, the present invention provides a technical solution: a forming equipment for semiconductor component processing, including a frame 1, a substrate 2 and a bottom plate 3 fixedly installed in the middle and bottom of the frame 1 respectively, an XY-axis moving worktable 4 fixedly installed on one side of the substrate 2, a cutting table 5 fixedly installed on the moving surface of the XY-axis moving worktable 4, a water circulation heat dissipation component 6 and a wind-powered cleaning component 7 respectively provided in the cutting table 5, a robotic arm 8 fixedly installed on the side of the frame 1 away from the XY-axis moving worktable 4, a material picking component 9 installed at the drive end of the robotic arm 8, a laser cutting machine 10 for use in conjunction with the XY-axis moving worktable 4 fixedly installed on one side of the substrate 2, and a material table 11 fixedly installed on the other side of the substrate 2; The water circulation heat dissipation assembly 6 includes a drive chamber 601, which is fixedly mounted on the base plate 3 via a support. Two symmetrically distributed drive shafts 602 and driven shafts 603 are rotatably mounted on the drive chamber 601. Rotors 604 are fixedly sleeved on the outer walls of both drive shafts 602 and driven shafts 603. Driven gears 605 and driven gears 606 are fixedly sleeved on the top of the outer walls of drive shafts 602 and driven shafts 603, respectively, and driven gears 605 and driven gears 606 are meshed and connected. The wind-powered cleaning component 7 includes a drive bracket 701, which is fixedly installed on the side of the base plate 3 near the drive compartment 601. A wind frame 702 is fixedly installed on one side of the outer wall of the drive bracket 701. A drive shaft 703 is rotatably installed in the wind frame 702. An impeller 704 is fixedly sleeved on the outer wall of the drive shaft 703.
[0015] By adopting the above technical solution, the wind-powered cleaning component 7 drives the water circulation heat dissipation component 6 to operate in tandem. The water circulation heat dissipation component 6 completes basic heat dissipation, and at the same time, in conjunction with the airflow delivered by the wind-powered cleaning component 7, secondary heat dissipation is achieved while cleaning the wafer surface.
[0016] The material handling component 9 includes a fixed frame 901, which is fixedly installed on the drive end of the robotic arm 8 via a support. A lead screw 902 is laterally rotatably installed in the middle of the fixed frame 901. A movable plate 903 is threadedly fitted on the outer wall of the lead screw 902. A servo motor 904 is fixedly installed in the middle of the outer wall of the fixed frame 901 via a support, and the servo motor 904 is connected to the lead screw 902 via a coupling. Fixed rods 905 are slidably installed on both sides of the movable plate 903, and the fixed rods 905 are fixedly installed on the inner wall of the fixed frame 901. A feeding rack 906 is fixedly installed on the top of the movable plate 903.
[0017] By adopting the above technical solution, the lead screw rotates 902, which drives the moving plate 903 to move smoothly in a straight line along the fixed rod 905. In coordination with the robotic arm 8, the wafer can be transferred in multiple directions, meeting the needs of automated processing.
[0018] The cutting table 5 has five equally spaced water channels 501, and an air duct 502 is provided between two adjacent water channels 501.
[0019] By adopting the above technical solution, the coolant circulation in the water channel 501 and the airflow in the air channel 502 work together to achieve dual heat dissipation, effectively improving heat dissipation efficiency and temperature control uniformity.
[0020] A liquid diversion valve 609 and a liquid confluence valve 611 are fixedly installed in the middle of the moving table 4 of the XY axis. Five equidistant heat dissipation pipes 610 are connected between the liquid outlet of the liquid diversion valve 609 and the liquid inlet of the liquid confluence valve 611, and the heat dissipation pipes 610 are located in the water channel 501.
[0021] By adopting the above technical solution, the coolant is evenly distributed to each heat dissipation pipe 610 through the liquid diversion valve 609, ensuring that the coolant flow rate in each water channel 501 is consistent, thereby ensuring that the heat dissipation effect of each area of the cutting table 5 is balanced.
[0022] A chiller unit 608 is fixedly installed on one side of the base plate 3. The chiller unit 608 can provide constant temperature coolant and provide cold source support for the entire water circulation heat dissipation system. The outlet of the chiller unit 608 is connected to the inlet of the drive chamber 601 through a hose and a check valve. The outlet of the drive chamber 601 is connected to the inlet of the liquid diversion valve 609 through a hose and a check valve. The outlet of the liquid confluence valve 611 is connected to the inlet of the chiller unit 608 through a hose.
[0023] By adopting the above technical solution, a one-way valve can be set to prevent coolant backflow and ensure that the coolant flows stably in a preset direction. The hose connection is adapted to the movement requirements of the XY axis moving table.
[0024] A gas dryer 706 is fixedly installed on the side of the base plate 3 near the robotic arm 8. A guide frame 705 is connected through the air outlet of the air frame 702, and the other end of the guide frame 705 is connected through the air inlet of the gas dryer 706. A filter 707 is connected through the air outlet of the gas dryer 706. Moisture and impurity particles in the airflow are filtered through the gas dryer 706 and the filter 707. A flow divider frame 712 is fixedly installed on the top of the base plate 3 near the gas dryer 706. The flow divider frame 712 has two exhaust chambers and one intake chamber. The two exhaust chambers are connected to the intake chamber in the middle. A guide rod 713 runs horizontally through the flow divider frame 712. Two symmetrically distributed pistons 714 are fixedly sleeved on the outer wall of the guide rod 713. The two pistons 714 slide in the corresponding exhaust chambers in a sealed manner. An electric cylinder 715 is fixedly installed on one side of the flow divider frame 712. The driving end of the electric cylinder 715 is fixedly connected to one end of the guide rod 713.
[0025] By adopting the above technical solution, the electric cylinder 715 drives the guide rod 713 to drive the piston 714 to slide in the exhaust chamber, which can realize the switching between the intake chamber and the two exhaust chambers, thereby controlling the distribution path of the airflow and meeting the airflow requirements of different processing steps.
[0026] A first support plate 708 is fixedly installed on the outer wall of the fixed frame 901. A first exhaust frame 709 is fixedly installed at the end of the first support plate 708. A second support plate 710 is fixedly installed on one side of the outer wall of the cutting table 5. A second exhaust frame 711 is fixedly installed on the second support plate 710. The two exhaust ends of the diversion frame 712 are respectively connected to a first air guide pipe 719 and a second air guide pipe 720. The other end of the first air guide pipe 719 is connected to the air inlet end of the first exhaust frame 709 through a duct. The outer wall of the cutting table 5 is... Side frames 716 are fixedly installed at both ends of the air duct 502. Gas splitter 717 and gas combiner 718 are fixedly installed on both sides of the moving table 4 of the XY axis. The exhaust end of gas splitter 717 and the inlet end of gas combiner 718 are respectively connected to the corresponding side frame 716 through air pipes. Second air guide pipe 720 is connected to the inlet end of gas splitter 717 through air pipe. The exhaust end of gas combiner 718 is connected to the inlet end of second exhaust frame 711 through air pipe.
[0027] By adopting the above technical solution, the airflow distributed by the distribution frame 712 can be sent to the first exhaust frame 709 through the first air guide pipe 719 to achieve pre-cleaning during the wafer transfer process. At the same time, the airflow can be sent to the gas distributor 717 through the second air guide pipe 720, and then evenly distributed to each air duct 502 of the dicing table 5 through the side frame 716 to perform synchronous cleaning and auxiliary heat dissipation of the wafer processing area.
[0028] The drive bracket 701 is fixedly mounted with the drive motor 721 via a support, and the drive end of the drive motor 721 is connected to the drive shaft 703 via a belt pulley transmission assembly.
[0029] By adopting the above technical solution, the drive motor 721 drives the drive shaft 703 to rotate stably.
[0030] A drive gear 607 is fixedly sleeved at the bottom of the drive shaft 703, and the drive gear 607 is meshed with the driven gear 605.
[0031] By adopting the above technical solution, the drive shaft 703 drives the active shaft 602 to rotate synchronously during the rotation process.
[0032] A method using a forming apparatus for processing semiconductor devices includes the following steps: S1. Control the robotic arm 8 to move the fixed frame 901 of the picking component 9 to the corresponding station of the material platform 11. Drive the loading rack 906 to move to the bottom of the wafer positioning metal ring through the picking component 9. Use the suction cup at the end of the loading rack 906 to adsorb and fix the metal ring. S2. Start the wind-powered cleaning component 7. The internal impeller 704 rotates to generate airflow. The airflow is guided by the air guide frame 705, dried by the gas dryer 706, and filtered by the filter 707. Then, it is distributed unidirectionally to the first air guide pipe 719 through the diversion frame 712 and delivered to the first exhaust frame 709. S3. The robotic arm 8 moves the wafer positioning metal ring to the cutting table 5 through the material picking component 9. The material picking component 9 first drives the loading rack 906 to reset, and then controls its extension and reciprocates once. During the process of the wafer positioning metal ring being reset with the loading rack 906, the airflow discharged from the first exhaust frame 709 pre-cleans the wafer surface. S4. After the robotic arm 8 places the wafer positioning metal ring at the corresponding position on the top of the cutting table 5, the blue film is adsorbed and fixed by the vacuum adsorption component of the cutting table 5. The material picking component 9 drives the loading rack 906 to reset. The wind cleaning component 7 adjusts the position of the piston 714 to switch the airflow in the diversion frame 712 to the second air guide pipe 720 in one direction. The airflow is delivered to the air duct 502 through the gas distributor 717 to perform secondary cleaning of residual debris on the wafer surface and simultaneously assist in heat dissipation. S5. When the wind-powered cleaning component 7 is running, the drive shaft 703 drives the water circulation heat dissipation component 6 to run synchronously through the drive gear 607. The coolant output by the chiller unit 608 is diverted through the drive chamber 601 and the liquid diversion valve 609, and then circulates in the water channel 501 through the heat dissipation pipe 610, which works in conjunction with the airflow of the air duct 502 to achieve dual heat dissipation of the wafer. S6. Control the start of the XY axis moving worktable 4, which drives the cutting table 5 to move to the processing station of the laser cutting machine 10. Simultaneously start the laser cutting machine 10. The XY axis moving worktable 4 drives the wafer to move along the preset trajectory to complete the laser cutting process. After the processing is completed, the robotic arm 8 drives the material picking component 9 to transfer the processed wafer to the unloading area of the material table 11 to complete a single processing cycle.
[0033] Working principle: In the actual wafer dicing production process, the robotic arm 8 first moves the material picking component 9 to the corresponding station of the material table 11, and controls the start of the servo motor 904; the servo motor 904 drives the lead screw 902 to rotate, which drives the moving plate 903 to move smoothly and linearly along the fixed rod 905, thereby pushing the loading rack 906 to precisely extend to the bottom of the wafer positioning metal ring. The metal ring is then fixed by the suction cup at the end of the loading rack 906, thus completing the wafer picking. The drive motor 721 is started synchronously. The drive motor 721 drives the drive shaft 703 and impeller 704 to rotate at high speed through the belt pulley transmission group. The airflow generated by the impeller 704 is guided by the air guide frame 705 and then passes through the gas dryer 706 to remove moisture and the filter 707 to filter impurities, forming a dry and clean airflow. At this time, the electric cylinder 715 drives the guide rod 713 to drive the piston 714 to the initial position, so that the air inlet chamber of the diversion frame 712 is connected to the first exhaust chamber. The airflow is delivered to the first exhaust frame 709 through the first air guide pipe 719. The robotic arm 8 moves the adsorbed wafer to the cutting table 5. The material picking component 9 drives the loading rack 906 to reset and move back and forth once. During the reset process of the wafer with the loading rack 906, the airflow discharged from the first exhaust frame 709 evenly sweeps the wafer surface, completing the pre-cleaning in the transfer process and removing the dust and impurities attached to the surface. The robotic arm 8 places the wafer positioning metal ring at the corresponding position on the top of the cutting table 5. The vacuum adsorption component built into the cutting table 5 is activated to adsorb and fix the blue film on the bottom of the wafer, ensuring the flatness and stability of the wafer during processing. Then, the material handling component 9 drives the loading rack 906 to reset. At the same time, the electric cylinder 715 is controlled to extend and the position of the piston 714 is adjusted so that the air inlet chamber of the diverter 712 is connected to the second exhaust chamber. The airflow is switched to the second air guide pipe 720 and evenly distributed to each air duct 502 of the cutting table 5 through the gas distributor 717 and the side frame 716. Then, the side frame 716 delivers the gas to the gas confluencer 718 for confluence and then delivers it to the second exhaust frame 711 for discharge. This performs secondary cleaning of the residual debris on the wafer surface during the cutting process and removes some of the heat from the wafer surface. During the rotation of the drive shaft 703, the drive gear 607 at its bottom meshes with the driven gear 605 of the drive shaft 602, driving the drive shaft 602 and the rotor 604 to rotate synchronously. The driven gear 605 drives the driven shaft 603 to rotate synchronously in the opposite direction through the passive gear 606. The disturbance effect of the synchronous reverse rotation of the two rotors 604 causes the constant temperature coolant output by the chiller unit 608 to enter the liquid diversion valve 609 after being stabilized by the drive chamber 601. It is evenly distributed to the five heat dissipation pipes 610. The heat dissipation pipes 610 are embedded in the water channel 501 of the cutting table 5. The coolant circulates in the heat dissipation pipes 610 and performs efficient heat exchange with the cutting table 5 to complete the basic heat dissipation. At the same time, the airflow in the air channel 502 and the coolant in the water channel 501 form a dual air and liquid heat dissipation structure to ensure that the temperature of the cutting table 5 and the wafer surface is uniform and stable, avoiding wafer deformation or expansion of the heat-affected zone caused by local overheating. The XY-axis moving stage 4 is started, which drives the cutting stage 5 and the wafer to move with high precision along the preset trajectory. Simultaneously, the laser cutting machine 10 is started, and the laser beam is focused on the wafer processing area to complete the cutting operation. During the cutting process, the airflow in the air duct 502 continuously blows the cutting area to remove the molten debris generated during cutting in time, so as to avoid secondary adhesion and contamination of the wafer by the debris.
[0034] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.
Claims
1. A forming apparatus for semiconductor device processing, comprising a frame (1), characterized in that: The frame (1) is fixedly installed with a base plate (2) and a bottom plate (3) in the middle and bottom respectively. An XY axis moving worktable (4) is fixedly installed on one side of the base plate (2). A cutting table (5) is fixedly installed on the moving table surface of the XY axis moving worktable (4). A water circulation heat dissipation component (6) and a wind cleaning component (7) are respectively provided in the cutting table (5). A robotic arm (8) is fixedly installed on the side of the frame (1) away from the XY axis moving worktable (4). A material picking component (9) is installed at the drive end of the robotic arm (8). A laser cutting machine (10) that works in conjunction with the XY axis moving worktable (4) is fixedly installed on one side of the base plate (2). A material table (11) is fixedly installed on the other side of the base plate (2). The water circulation heat dissipation assembly (6) includes a drive chamber (601), which is fixedly installed on the bottom plate (3) by a support. Two symmetrically distributed drive shafts (602) and driven shafts (603) are rotatably installed on the drive chamber (601). Rotors (604) are fixedly sleeved on the outer walls of the drive shafts (602) and driven shafts (603). Driven gears (605) and passive gears (606) are fixedly sleeved on the top of the outer walls of the drive shafts (602) and driven shafts (603), respectively, and the driven gears (605) and passive gears (606) are meshed and connected. The wind-powered cleaning component (7) includes a drive bracket (701), which is fixedly installed on the side of the base plate (3) near the drive compartment (601). A wind frame (702) is fixedly installed on one side of the outer wall of the drive bracket (701), and a drive shaft (703) is rotatably installed in the wind frame (702). An impeller (704) is fixedly sleeved on the outer wall of the drive shaft (703).
2. The forming equipment for semiconductor device processing as described in claim 1, characterized in that, The material handling component (9) includes a fixed frame (901), which is fixedly installed on the drive end of the robotic arm (8) by a support. A lead screw (902) is installed laterally in the middle of the fixed frame (901). A movable plate (903) is threaded on the outer wall of the lead screw (902). A servo motor (904) is fixedly installed in the middle of the outer wall of the fixed frame (901) by a support. The servo motor (904) is connected to the lead screw (902) through a coupling. Fixed rods (905) are slidably installed on both sides of the movable plate (903). The fixed rods (905) are fixedly installed on the inner wall of the fixed frame (901). A feeding rack (906) is fixedly installed on the top of the movable plate (903).
3. The forming equipment for semiconductor device processing as described in claim 1, characterized in that, The cutting table (5) has five equally spaced water channels (501), and an air duct (502) is provided between two adjacent water channels (501).
4. The forming equipment for semiconductor device processing as described in claim 1, characterized in that, The XY-axis moving worktable (4) has a liquid diversion valve (609) and a liquid confluence valve (611) fixedly installed in the middle of the moving table surface. Five equidistant heat dissipation pipes (610) are connected between the liquid outlet of the liquid diversion valve (609) and the liquid inlet of the liquid confluence valve (611), and the heat dissipation pipes (610) are located in the water channel (501).
5. The forming equipment for semiconductor device processing as described in claim 1, characterized in that, A chiller unit (608) is fixedly installed on one side of the base plate (3). The outlet of the chiller unit (608) is connected to the inlet of the drive chamber (601) through a hose and a check valve. The outlet of the drive chamber (601) is connected to the inlet of the liquid diversion valve (609) through a hose and a check valve. The outlet of the liquid confluence valve (611) is connected to the inlet of the chiller unit (608) through a hose.
6. The forming equipment for semiconductor device processing as described in claim 1, characterized in that, A gas dryer (706) is fixedly installed on the side of the base plate (3) near the robotic arm (8). A guide frame (705) is connected through the air outlet of the air frame (702), and the other end of the guide frame (705) is connected through the air inlet of the gas dryer (706). A filter (707) is connected through the air outlet of the gas dryer (706). A flow divider frame (712) is fixedly installed on the top of the base plate (3) near the gas dryer (706). The flow divider frame (712) has two exhaust chambers and one intake chamber. The two exhaust chambers are connected to the intake chamber in the middle. A guide rod (713) runs horizontally through the flow divider frame (712). Two symmetrically distributed pistons (714) are fixedly sleeved on the outer wall of the guide rod (713). The two pistons (714) slide in the corresponding exhaust chambers in a sealed manner. An electric cylinder (715) is fixedly installed on one side of the flow divider frame (712). The driving end of the electric cylinder (715) is fixedly connected to one end of the guide rod (713).
7. The forming equipment for semiconductor device processing as described in claim 2, characterized in that, A first support plate (708) is fixedly installed on the outer wall of the fixed frame (901). A first exhaust frame (709) is fixedly installed at the end of the first support plate (708). A second support plate (710) is fixedly installed on one side of the outer wall of the cutting table (5). A second exhaust frame (711) is fixedly installed on the second support plate (710). The two exhaust ends of the diversion frame (712) are respectively connected to the first air guide pipe (719) and the second air guide pipe (720). The other end of the first air guide pipe (719) is connected to the air inlet end of the first exhaust frame (709) through a duct. The cutting table (5) The outer wall is fixedly installed with side frames (716) at both ends of the air duct (502). Gas splitter (717) and gas combiner (718) are fixedly installed on both sides of the moving table (4) of the XY axis. The exhaust end of the gas splitter (717) and the inlet end of the gas combiner (718) are respectively connected to the corresponding side frame (716) through the air pipe. The second air guide pipe (720) is connected to the inlet end of the gas splitter (717) through the air pipe. The exhaust end of the gas combiner (718) is connected to the inlet end of the second exhaust frame (711) through the air pipe.
8. The forming equipment for semiconductor device processing as described in claim 1, characterized in that, The drive bracket (701) is fixedly mounted with a drive motor (721) via a support, and the drive end of the drive motor (721) is connected to the drive shaft (703) via a belt pulley transmission group.
9. The forming equipment for semiconductor device processing as described in claim 1, characterized in that, The bottom of the drive shaft (703) is fixedly fitted with a drive gear (607), and the drive gear (607) is meshed with the driven gear (605).
10. The method used in a semiconductor device forming apparatus as described in any one of claims 1-9, characterized in that, Includes the following steps: S1. Control the robotic arm (8) to move the fixed frame (901) of the picking component (9) to the corresponding station of the material platform (11), and drive the loading rack (906) to move to the bottom of the wafer positioning metal ring through the picking component (9), and use the suction cup at the end of the loading rack (906) to adsorb and fix the metal ring. S2. Start the wind cleaning component (7). The internal impeller (704) rotates to generate airflow. The airflow is guided by the air guide frame (705), dried by the gas dryer (706), and filtered by the filter (707). It is then distributed unidirectionally to the first air guide pipe (719) through the diversion frame (712) and delivered to the first exhaust frame (709). S3. The robotic arm (8) moves the wafer positioning metal ring to the cutting table (5) through the material picking component (9). The material picking component (9) first drives the loading rack (906) to reset, and then controls its extension and reciprocates once. During the process of the wafer positioning metal ring being reset with the loading rack (906), the airflow discharged from the first exhaust frame (709) pre-cleans the wafer surface. S4. After the robotic arm (8) places the wafer positioning metal ring at the corresponding position on the top of the cutting table (5), the blue film is adsorbed and fixed by the vacuum adsorption component of the cutting table (5). The material picking component (9) drives the loading rack (906) to reset. The wind cleaning component (7) adjusts the position of the piston (714) to switch the airflow in the diversion frame (712) to the second air guide pipe (720) in one direction. The airflow is delivered to the air duct (502) through the gas distributor (717) to perform secondary cleaning of residual debris on the wafer surface and simultaneously assist in heat dissipation. S5. When the wind-powered cleaning component (7) is running, the drive shaft (703) drives the water circulation heat dissipation component (6) to run synchronously through the drive gear (607). The coolant output by the chiller unit (608) is diverted through the drive chamber (601) and the liquid diversion valve (609), and then circulates in the water channel (501) through the heat dissipation pipe (610), which cooperates with the airflow of the air duct (502) to achieve dual heat dissipation of the wafer. S6. Control the start of the XY axis moving worktable (4), drive the cutting table (5) to move to the processing station of the laser cutting machine (10), and start the laser cutting machine (10) simultaneously. The XY axis moving worktable (4) drives the wafer to move along the preset trajectory to complete the laser cutting process. After the processing is completed, the robotic arm (8) drives the material picking component (9) to transfer the processed wafer to the unloading area of the material table (11) to complete a single processing cycle.